AD AD9361BBCZ-REEL Rf agile transceiver Datasheet

RF Agile Transceiver
AD9361
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
RX1B_P,
RX1B_N
AD9361
RX1A_P,
RX1A_N
ADC
RX1C_P,
RX1C_N
RX2A_P,
RX2A_N
ADC
RX2C_P,
RX2C_N
RX LO
TX_MON1
TX LO
TX1A_P,
TX1A_N
DAC
DATA INTERFACE
RX2B_P,
RX2B_N
P0_[D11:D0]/
TX_[D5:D0]
P1_[D11:D0]/
RX_[D5:D0]
TX1B_P,
TX1B_N
TX_MON2
TX2A_P,
TX2A_N
SPI
CTRL
DAC
TX2B_P,
TX2B_N
DAC
DAC
ADC
CTRL
GPO
RADIO
SWITCHING
PLLs
CLK_OUT
AUXADC AUXDACx XTALP XTALN
NOTES
1. SPI, CTRL, P0_[D11:D0]/TX_[D5:D0], P1_[D11:D0]/RX_[D5:D0],
AND RADIO SWITCHING CONTAIN MULTIPLE PINS.
APPLICATIONS
Point to point communication systems
Femtocell/picocell/microcell base stations
General-purpose radio systems
10453-001
RF 2 × 2 transceiver with integrated 12-bit DACs and ADCs
Band: 70 MHz to 6.0 GHz
Supports TDD and FDD operation
Tunable channel bandwidth: <200 kHz to 56 MHz
Dual receivers: 6 differential or 12 single-ended inputs
Superior receiver sensitivity with a noise figure of 2 dB at
800 MHz local oscillator (LO)
RX gain control
Real-time monitor and control signals for manual gain
Independent automatic gain control
Dual transmitters: 4 differential outputs
Highly linear broadband transmitter
TX EVM: ≤−40 dB
TX noise: ≤−157 dBm/Hz noise floor
TX monitor: ≥66 dB dynamic range with 1 dB accuracy
Integrated fractional-N synthesizers
2.4 Hz maximum LO step size
Multichip synchronization
CMOS/LVDS digital interface
Figure 1.
GENERAL DESCRIPTION
The AD9361 is a high performance, highly integrated radio
frequency (RF) Agile Transceiver™ designed for use in 3G and 4G
base station applications. Its programmability and wideband
capability make it ideal for a broad range of transceiver applications.
The device combines a RF front end with a flexible mixed-signal
baseband section and integrated frequency synthesizers,
simplifying design-in by providing a configurable digital interface
to a processor. The AD9361 operates in the 70 MHz to 6.0 GHz
range, covering most licensed and unlicensed bands. Channel
bandwidths from less than 200 kHz to 56 MHz are supported.
The two independent direct conversion receivers have state-of-theart noise figure and linearity. Each receive (RX) subsystem includes
independent automatic gain control (AGC), dc offset correction,
quadrature correction, and digital filtering, thereby eliminating
the need for these functions in the digital baseband. The AD9361
also has flexible manual gain modes that can be externally
controlled. Two high dynamic range ADCs per channel digitize
the received I and Q signals and pass them through configurable
decimation filters and 128-tap finite impulse response (FIR) filters
to produce a 12-bit output signal at the appropriate sample rate.
Rev. D
The transmitters use a direct conversion architecture that
achieves high modulation accuracy with ultralow noise. This
transmitter design produces a best in class TX EVM of <−40 dB,
allowing significant system margin for the external PA selection.
The on-board transmit (TX) power monitor can be used as a
power detector, enabling highly accurate TX power measurements.
The fully integrated phase-locked loops (PLLs) provide low
power fractional-N frequency synthesis for all receive and
transmit channels. Channel isolation, demanded by frequency
division duplex (FDD) systems, is integrated into the design.
All VCO and loop filter components are integrated.
The core of the AD9361 can be powered directly from a 1.3 V
regulator. The IC is controlled via a standard 4-wire serial port
and four real-time I/O control pins. Comprehensive power-down
modes are included to minimize power consumption during
normal use. The AD9361 is packaged in a 10 mm × 10 mm,
144-ball chip scale package ball grid array (CSP_BGA).
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
AD9361
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Theory of Operation ...................................................................... 33
Applications ....................................................................................... 1
General......................................................................................... 33
Functional Block Diagram .............................................................. 1
Receiver........................................................................................ 33
General Description ......................................................................... 1
Transmitter .................................................................................. 33
Revision History ............................................................................... 2
Clock Input Options .................................................................. 33
Specifications..................................................................................... 3
Synthesizers ................................................................................. 34
Current Consumption—VDD_Interface .................................. 8
Digital Data Interface................................................................. 34
Current Consumption—VDDD1P3_DIG and VDDAx
(Combination of all 1.3 V Supplies)......................................... 10
Enable State Machine ................................................................. 34
Absolute Maximum Ratings ..................................................... 15
Control Pins ................................................................................ 35
Reflow Profile .............................................................................. 15
GPO Pins (GPO_3 to GPO_0) ................................................. 35
Thermal Resistance .................................................................... 15
Auxiliary Converters .................................................................. 35
ESD Caution ................................................................................ 15
Powering the AD9361................................................................ 35
Pin Configuration and Function Descriptions ........................... 16
Packaging and Ordering Information ......................................... 36
Typical Performance Characteristics ........................................... 20
Outline Dimensions ................................................................... 36
800 MHz Frequency Band......................................................... 20
Ordering Guide .......................................................................... 36
SPI Interface ................................................................................ 35
2.4 GHz Frequency Band .......................................................... 25
5.5 GHz Frequency Band .......................................................... 29
REVISION HISTORY
11/13—Rev. C to Rev. D
Changes to Ordering Guide .......................................................... 36
9/13—Revision C: Initial Version
Rev. D | Page 2 of 36
Data Sheet
AD9361
SPECIFICATIONS
Electrical characteristics at VDD_GPO = 3.3 V, VDD_INTERFACE = 1.8 V, and all other VDDx pins = 1.3 V, TA = 25°C, unless otherwise noted.
Table 1.
Parameter 1
RECEIVERS, GENERAL
Center Frequency
Gain
Minimum
Maximum
Gain Step
Received Signal Strength
Indicator
Range
Accuracy
RECEIVERS, 800 MHz
Noise Figure
Third-Order Input Intermodulation
Intercept Point
Second-Order Input
Intermodulation Intercept Point
Local Oscillator (LO) Leakage
Quadrature
Gain Error
Phase Error
Modulation Accuracy (EVM)
Input S11
RX1 to RX2 Isolation
RX1A to RX2A, RX1C to RX2C
RX1B to RX2B
RX2 to RX1 Isolation
RX2A to RX1A, RX2C to RX1C
RX2B to RX1B
RECEIVERS, 2.4 GHz
Noise Figure
Third-Order Input Intermodulation
Intercept Point
Second-Order Input
Intermodulation Intercept Point
Local Oscillator (LO) Leakage
Quadrature
Gain Error
Phase Error
Modulation Accuracy (EVM)
Input S11
RX1 to RX2 Isolation
RX1A to RX2A, RX1C to RX2C
RX1B to RX2B
RX2 to RX1 Isolation
RX2A to RX1A, RX2C to RX1C
RX2B to RX1B
Symbol
Min
Typ
70
Max
Unit
6000
MHz
Test Conditions/
Comments
0
74.5
73.0
72.0
dB
dB
dB
dB
65.5
1
dB
dB
100
±2
dB
dB
NF
IIP3
2
−18
dB
dBm
Maximum RX gain
Maximum RX gain
IIP2
40
dBm
Maximum RX gain
−122
dBm
At RX front-end input
0.2
0.2
−42
−10
%
Degrees
dB
dB
70
55
dB
dB
70
55
dB
dB
NF
IIP3
3
−14
dB
dBm
Maximum RX gain
Maximum RX gain
IIP2
45
dBm
Maximum RX gain
−110
dBm
At receiver front-end
input
0.2
0.2
−42
−10
%
Degrees
dB
dB
65
50
dB
dB
65
50
dB
dB
At 800 MHz
At 2300 MHz (RX1A, RX2A)
At 2300 MHz (RX1B,
RX1C, RX2B, RX2C)
At 5500 MHz (RX1A, RX2A)
RSSI
Rev. D | Page 3 of 36
19.2 MHz reference clock
40 MHz reference clock
AD9361
Parameter 1
RECEIVERS, 5.5 GHz
Noise Figure
Third-Order Input Intermodulation
Intercept Point
Second-Order Input
Intermodulation Intercept Point
Local Oscillator (LO) Leakage
Quadrature
Gain Error
Phase Error
Modulation Accuracy (EVM)
Input S11
RX1A to RX2A Isolation
RX2A to RX1A Isolation
TRANSMITTERS—GENERAL
Center Frequency
Power Control Range
Power Control Resolution
TRANSMITTERS, 800 MHz
Output S22
Maximum Output Power
Modulation Accuracy (EVM)
Third-Order Output
Intermodulation Intercept Point
Carrier Leakage
Noise Floor
Isolation
TX1 to TX2
TX2 to TX1
TRANSMITTERS, 2.4 GHz
Output S22
Maximum Output Power
Modulation Accuracy (EVM)
Third-Order Output Intermodulation Intercept Point
Carrier Leakage
Data Sheet
Symbol
Noise Floor
Isolation
TX1 to TX2
TX2 to TX1
Typ
Max
Unit
Test Conditions/
Comments
NF
IIP3
3.8
−17
dB
dBm
Maximum RX gain
Maximum RX gain
IIP2
42
dBm
Maximum RX gain
−95
dBm
At RX front-end input
0.2
0.2
−37
%
Degrees
dB
−10
52
52
dB
dB
dB
70
OIP3
OIP3
Noise Floor
Isolation
TX1 to TX2
TX2 to TX1
TRANSMITTERS, 5.5 GHz
Output S22
Maximum Output Power
Modulation Accuracy (EVM)
Third-Order Output
Intermodulation Intercept Point
Carrier Leakage
Min
OIP3
6000
40 MHz reference clock
(doubled internally for
RF synthesizer)
90
0.25
MHz
dB
dB
−10
8
−40
23
dB
dBm
dB
dBm
1 MHz tone into 50 Ω load
19.2 MHz reference clock
−50
−32
−157
dBc
dBc
dBm/Hz
0 dB attenuation
40 dB attenuation
90 MHz offset
50
50
dB
dB
−10
7.5
−40
19
dB
dBm
dB
dBm
1 MHz tone into 50 Ω load
40 MHz reference clock
−50
−32
−156
dBc
dBc
dBm/Hz
0 dB attenuation
40 dB attenuation
90 MHz offset
50
50
dB
dB
−10
6.5
−36
dB
dBm
dB
17
dBm
−50
−30
−151.5
dBc
dBc
dBm/Hz
50
50
dB
dB
Rev. D | Page 4 of 36
7 MHz tone into 50 Ω load
40 MHz reference clock
(doubled internally for
RF synthesizer)
0 dB attenuation
40 dB attenuation
90 MHz offset
Data Sheet
Parameter 1
TX MONITOR INPUTS (TX_MON1,
TX_MON2)
Maximum Input Level
Dynamic Range
Accuracy
LO SYNTHESIZER
LO Frequency Step
AD9361
Symbol
Min
Typ
Max
Unit
Test Conditions/
Comments
4
66
1
dBm
dB
dB
2.4
Hz
2.4 GHz, 40 MHz
reference clock
0.13
° rms
2.4 GHz
0.37
° rms
5.5 GHz
0.59
° rms
100 Hz to 100 MHz,
30.72 MHz reference clock
(doubled internally for RF
synthesizer)
100 Hz to 100 MHz,
40 MHz reference clock
100 Hz to 100 MHz,
40 MHz reference clock
(doubled internally for RF
synthesizer)
REF_CLK is either the input
to the XTALP/XTALN pins
or a line directly to the
XTALN pin
Integrated Phase Noise
800 MHz
REFERENCE CLOCK (REF_CLK)
Input
Frequency Range
19
10
50
80
Signal Level
AUXILIARY CONVERTERS
ADC
Resolution
Input Voltage
Minimum
Maximum
DAC
Resolution
Output Voltage
Minimum
Maximum
Output Current
DIGITAL SPECIFICATIONS (CMOS)
Logic Inputs
Input Voltage
High
Low
Input Current
High
Low
Logic Outputs
Output Voltage
High
Low
DIGITAL SPECIFICATIONS (LVDS)
Logic Inputs
Input Voltage Range
Input Differential Voltage
Threshold
Receiver Differential Input
Impedance
1.3
MHz
MHz
V p-p
12
Bits
0.05
VDDA1P3_BB − 0.05
V
V
10
Bits
0.5
VDD_GPO − 0.3
10
V
V
mA
VDD_INTERFACE × 0.8
0
VDD_INTERFACE
VDD_INTERFACE × 0.2
V
V
−10
−10
+10
+10
μA
μA
VDD_INTERFACE × 0.2
V
V
825
1575
mV
−100
+100
mV
VDD_INTERFACE × 0.8
100
Rev. D | Page 5 of 36
Ω
Crystal input
External oscillator
AC-coupled external
oscillator
Each differential input in
the pair
AD9361
Parameter 1
Logic Outputs
Output Voltage
High
Low
Output Differential Voltage
Output Offset Voltage
GENERAL-PURPOSE OUTPUTS
Output Voltage
High
Low
Output Current
SPI TIMING
SPI_CLK
Period
Pulse Width
SPI_ENB Setup to First SPI_CLK
Rising Edge
Last SPI_CLK Falling Edge to
SPI_ENB Hold
SPI_DI
Data Input Setup to SPI_CLK
Data Input Hold to SPI_CLK
SPI_CLK Rising Edge to Output
Data Delay
4-Wire Mode
3-Wire Mode
Bus Turnaround Time, Read
Data Sheet
Symbol
Min
Typ
Max
Unit
1375
mV
mV
mV
1025
150
1200
Test Conditions/
Comments
Programmable in 75 mV
steps
mV
VDD_GPO × 0.8
VDD_GPO × 0.2
10
V
V
mA
VDD_INTERFACE = 1.8 V
tCP
tMP
tSC
20
9
1
ns
ns
ns
tHC
0
ns
tS
tH
2
1
ns
ns
tCO
tCO
tHZM
3
3
tH
8
8
tCO (max)
ns
ns
ns
Bus Turnaround Time, Read
tHZS
0
tCO (max)
ns
DIGITAL DATA TIMING (CMOS),
VDD_INTERFACE = 1.8 V
DATA_CLK Clock Period
DATA_CLK and FB_CLK Pulse
Width
TX Data
tCP
tMP
16.276
45% of tCP
55% of tCP
ns
ns
After BBP drives the last
address bit
After AD9361 drives the
last data bit
61.44 MHz
TX_FRAME, P0_D, and
P1_D
Setup to FB_CLK
Hold to FB_CLK
DATA_CLK to Data Bus Output
Delay
DATA_CLK to RX_FRAME Delay
Pulse Width
ENABLE
TXNRX
tSTX
tHTX
tDDRX
1
0
0
1.5
ns
ns
ns
tDDDV
0
1.0
ns
tENPW
tTXNRXPW
tCP
tCP
ns
ns
TXNRX Setup to ENABLE
Bus Turnaround Time
Before RX
After RX
Capacitive Load
Capacitive Input
tTXNRXSU
0
ns
tRPRE
tRPST
2 × tCP
2 × tCP
ns
ns
pF
pF
3
3
Rev. D | Page 6 of 36
FDD independent ENSM
mode
TDD ENSM mode
TDD mode
TDD mode
Data Sheet
Parameter 1
DIGITAL DATA TIMING (CMOS),
VDD_INTERFACE = 2.5 V
DATA_CLK Clock Period
DATA_CLK and FB_CLK Pulse
Width
TX Data
Setup to FB_CLK
Hold to FB_CLK
DATA_CLK to Data Bus Output
Delay
DATA_CLK to RX_FRAME Delay
Pulse Width
ENABLE
TXNRX
TXNRX Setup to ENABLE
Bus Turnaround Time
Before RX
After RX
Capacitive Load
Capacitive Input
DIGITAL DATA TIMING (LVDS)
DATA_CLK Clock Period
DATA_CLK and FB_CLK Pulse
Width
TX Data
Setup to FB_CLK
Hold to FB_CLK
DATA_CLK to Data Bus Output
Delay
DATA_CLK to RX_FRAME Delay
Pulse Width
ENABLE
TXNRX
TXNRX Setup to ENABLE
Bus Turnaround Time
Before RX
After RX
Capacitive Load
Capacitive Input
SUPPLY CHARACTERISTICS
1.3 V Main Supply Voltage
VDD_INTERFACE Supply
Nominal Settings
CMOS
LVDS
VDD_INTERFACE Tolerance
VDD_GPO Supply Nominal
Setting
VDD_GPO Tolerance
Current Consumption
VDDx, Sleep Mode
VDD_GPO
1
AD9361
Symbol
Min
tCP
tMP
16.276
45% of tCP
Typ
Max
Unit
55% of tCP
ns
ns
Test Conditions/
Comments
61.44 MHz
TX_FRAME, P0_D, and
P1_D
tSTX
tHTX
tDDRX
1
0
0
1.2
ns
ns
ns
tDDDV
0
1.0
ns
tENPW
tTXNRXPW
tCP
tCP
ns
ns
tTXNRXSU
0
ns
tRPRE
tRPST
2 × tCP
2 × tCP
ns
ns
pF
pF
TDD mode
TDD mode
ns
ns
245.76 MHz
55% of tCP
3
3
tCP
tMP
4.069
45% of tCP
tSTX
tHTX
tDDRX
1
0
0.25
1.25
ns
ns
ns
tDDDV
0.25
1.25
ns
tENPW
tTXNRXPW
tCP
tCP
ns
ns
tTXNRXSU
0
ns
tRPRE
tRPST
2 × tCP
2 × tCP
ns
ns
pF
pF
FDD independent ENSM
mode
TDD ENSM mode
TX_FRAME and TX_D
3
3
1.267
1.3
1.33
V
1.2
1.8
−5
2.5
2.5
+5
V
V
%
1.3
3.3
V
−5
+5
%
180
50
μA
μA
FDD independent ENSM
mode
TDD ENSM mode
Tolerance is applicable
to any voltage setting
When unused, must be
set to 1.3 V
Tolerance is applicable
to any voltage setting
Sum of all input currents
No load
When referencing a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the specification is listed. For full pin
names of multifunction pins, refer to the Pin Configuration and Function Descriptions section.
Rev. D | Page 7 of 36
AD9361
Data Sheet
CURRENT CONSUMPTION—VDD_INTERFACE
Table 2. VDD_INTERFACE = 1.2 V
Parameter
SLEEP MODE
1RX, 1TX, DDR
LTE10
Single Port
Dual Port
LTE20
Dual Port
2RX, 2TX, DDR
LTE3
Dual Port
LTE10
Single Port
Dual Port
LTE20
Dual Port
GSM
Dual Port
WiMAX 8.75
Dual Port
WiMAX 10
Single Port
TDD RX
TDD TX
FDD
WiMAX 20
Dual Port
FDD
Min
Typ
45
Max
Unit
µA
Test Conditions/Comments
Power applied, device disabled
2.9
2.7
mA
mA
30.72 MHz data clock, CMOS
15.36 MHz data clock, CMOS
5.2
mA
30.72 MHz data clock, CMOS
1.3
mA
7.68 MHz data clock, CMOS
4.6
5.0
mA
mA
61.44 MHz data clock, CMOS
30.72 MHz data clock, CMOS
8.2
mA
61.44 MHz data clock, CMOS
0.2
mA
1.08 MHz data clock, CMOS
3.3
mA
20 MHz data clock, CMOS
0.5
3.6
3.8
mA
mA
mA
22.4 MHz data clock, CMOS
22.4 MHz data clock, CMOS
44.8 MHz data clock, CMOS
6.7
mA
44.8 MHz data clock, CMOS
Table 3. VDD_INTERFACE = 1.8 V
Parameter
SLEEP MODE
1RX, 1TX, DDR
LTE10
Single Port
Dual Port
LTE20
Dual Port
2RX, 2TX, DDR
LTE3
Dual Port
LTE10
Single Port
Dual Port
LTE20
Dual Port
GSM
Dual Port
WiMAX 8.75
Dual Port
Min
Typ
84
Max
Unit
μA
Test Conditions/Comments
Power applied, device disabled
4.5
4.1
mA
mA
30.72 MHz data clock, CMOS
15.36 MHz data clock, CMOS
8.0
mA
30.72 MHz data clock, CMOS
2.0
mA
7.68 MHz data clock, CMOS
8.0
7.5
mA
mA
61.44 MHz data clock, CMOS
30.72 MHz data clock, CMOS
14.0
mA
61.44 MHz data clock, CMOS
0.3
mA
1.08 MHz data clock, CMOS
5.0
mA
20 MHz data clock, CMOS
Rev. D | Page 8 of 36
Data Sheet
Parameter
WiMAX 10
Single Port
TDD RX
TDD TX
FDD
WiMAX 20
Dual Port
FDD
P-P56
75 mV Differential Output
300 mV Differential Output
450 mV Differential Output
AD9361
Min
Typ
Max
Unit
Test Conditions/Comments
0.7
5.6
6.0
mA
mA
mA
22.4 MHz data clock, CMOS
22.4 MHz data clock, CMOS
44.8 MHz data clock, CMOS
10.7
mA
44.8 MHz data clock, CMOS
14.0
35.0
47.0
mA
mA
mA
240 MHz data clock, LVDS
240 MHz data clock, LVDS
240 MHz data clock, LVDS
Unit
μA
Test Conditions/Comments
Power applied, device disabled
6.5
6.0
mA
mA
30.72 MHz data clock, CMOS
15.36 MHz data clock, CMOS
11.5
mA
30.72 MHz data clock, CMOS
3.0
mA
7.68 MHz data clock, CMOS
11.5
10.0
mA
mA
61.44 MHz data clock, CMOS
30.72 MHz data clock, CMOS
20.0
mA
61.44 MHz data clock, CMOS
0.5
mA
1.08 MHz data clock, CMOS
7.3
mA
20 MHz data clock, CMOS
1.3
8.0
8.7
mA
mA
mA
22.4 MHz data clock, CMOS
22.4 MHz data clock, CMOS
44.8 MHz data clock, CMOS
15.3
mA
44.8 MHz data clock, CMOS
26.0
45.0
58.0
mA
mA
mA
240 MHz data clock, LVDS
240 MHz data clock, LVDS
240 MHz data clock, LVDS
Table 4. VDD_INTERFACE = 2.5 V
Parameter
SLEEP MODE
1RX, 1TX, DDR
LTE10
Single Port
Dual Port
LTE20
Dual Port
2RX, 2TX, DDR
LTE3
Dual Port
LTE10
Single Port
Dual Port
LTE20
Dual Port
GSM
Dual Port
WiMAX 8.75
Dual Port
WiMAX 10
Single Port
TDD RX
TDD TX
FDD
WiMAX 20
Dual Port
FDD
P-P56
75 mV Differential Output
300 mV Differential Output
450 mV Differential Output
Min
Typ
150
Max
Rev. D | Page 9 of 36
AD9361
Data Sheet
CURRENT CONSUMPTION—VDDD1P3_DIG AND VDDAx (COMBINATION OF ALL 1.3 V SUPPLIES)
Table 5. 800 MHz, TDD Mode
Parameter
1RX
5 MHz Bandwidth
10 MHz Bandwidth
20 MHz Bandwidth
2RX
5 MHz Bandwidth
10 MHz Bandwidth
20 MHz Bandwidth
1TX
5 MHz Bandwidth
7 dBm
−27 dBm
10 MHz Bandwidth
7 dBm
−27 dBm
20 MHz Bandwidth
7 dBm
−27 dBm
2TX
5 MHz Bandwidth
7 dBm
−27 dBm
10 MHz Bandwidth
7 dBm
−27 dBm
20 MHz Bandwidth
7 dBm
−27 dBm
Min
Typ
Max
Unit
Test Conditions/Comments
180
210
260
mA
mA
mA
Continuous RX
Continuous RX
Continuous RX
265
315
405
mA
mA
mA
Continuous RX
Continuous RX
Continuous RX
340
190
mA
mA
Continuous TX
Continuous TX
360
220
mA
mA
Continuous TX
Continuous TX
400
250
mA
mA
Continuous TX
Continuous TX
550
260
mA
mA
Continuous TX
Continuous TX
600
310
mA
mA
Continuous TX
Continuous TX
660
370
mA
mA
Continuous TX
Continuous TX
Rev. D | Page 10 of 36
Data Sheet
AD9361
Table 6. TDD Mode, 2.4 GHz
Parameter
1RX
5 MHz Bandwidth
10 MHz Bandwidth
20 MHz Bandwidth
2RX
5 MHz Bandwidth
10 MHz Bandwidth
20 MHz Bandwidth
1TX
5 MHz Bandwidth
7 dBm
−27 dBm
10 MHz Bandwidth
7 dBm
−27 dBm
20 MHz Bandwidth
7 dBm
−27 dBm
2TX
5 MHz Bandwidth
7 dBm
−27 dBm
10 MHz Bandwidth
7 dBm
−27 dBm
20 MHz Bandwidth
7 dBm
−27 dBm
Min
Typ
Max
Unit
Test Conditions/Comments
175
200
240
mA
mA
mA
Continuous RX
Continuous RX
Continuous RX
260
305
390
mA
mA
mA
Continuous RX
Continuous RX
Continuous RX
350
160
mA
mA
Continuous TX
Continuous TX
380
220
mA
mA
Continuous TX
Continuous TX
410
260
mA
mA
Continuous TX
Continuous TX
580
280
mA
mA
Continuous TX
Continuous TX
635
330
mA
mA
Continuous TX
Continuous TX
690
390
mA
mA
Continuous TX
Continuous TX
Unit
Test Conditions/Comments
175
275
mA
mA
Continuous RX
Continuous RX
270
445
mA
mA
Continuous RX
Continuous RX
400
240
mA
mA
Continuous TX
Continuous TX
490
385
mA
mA
Continuous TX
Continuous TX
650
335
mA
mA
Continuous TX
Continuous TX
820
500
mA
mA
Continuous TX
Continuous TX
Table 7. TDD Mode, 5.5 GHz
Parameter
1RX
5 MHz Bandwidth
40 MHz Bandwidth
2RX
5 MHz Bandwidth
40 MHz Bandwidth
1TX
5 MHz Bandwidth
7 dBm
−27 dBm
40 MHz Bandwidth
7 dBm
−27 dBm
2TX
5 MHz Bandwidth
7 dBm
−27 dBm
40 MHz Bandwidth
7 dBm
−27 dBm
Min
Typ
Max
Rev. D | Page 11 of 36
AD9361
Data Sheet
Table 8. FDD Mode, 800 MHz
Parameter
1RX, 1TX
5 MHz Bandwidth
7 dBm
−27 dBm
10 MHz Bandwidth
7 dBm
−27 dBm
20 MHz Bandwidth
7 dBm
−27 dBm
2RX, 1TX
5 MHz Bandwidth
7 dBm
−27 dBm
10 MHz Bandwidth
7 dBm
−27 dBm
20 MHz Bandwidth
7 dBm
−27 dBm
1RX, 2TX
5 MHz Bandwidth
7 dBm
−27 dBm
10 MHz Bandwidth
7 dBm
−27 dBm
20 MHz Bandwidth
7 dBm
−27 dBm
2RX, 2TX
5 MHz Bandwidth
7 dBm
−27 dBm
10 MHz Bandwidth
7 dBm
−27 dBm
20 MHz Bandwidth
7 dBm
−27 dBm
Min
Typ
Max
Unit
490
345
mA
mA
540
395
mA
mA
615
470
mA
mA
555
410
mA
mA
625
480
mA
mA
740
600
mA
mA
685
395
mA
mA
755
465
mA
mA
850
570
mA
mA
790
495
mA
mA
885
590
mA
mA
1020
730
mA
mA
Rev. D | Page 12 of 36
Test Conditions/Comments
Data Sheet
AD9361
Table 9. FDD Mode, 2.4 GHz
Parameter
1RX, 1TX
5 MHz Bandwidth
7 dBm
−27 dBm
10 MHz Bandwidth
7 dBm
−27 dBm
20 MHz Bandwidth
7 dBm
−27 dBm
2RX, 1TX
5 MHz Bandwidth
7 dBm
−27 dBm
10 MHz Bandwidth
7 dBm
−27 dBm
20 MHz Bandwidth
7 dBm
−27 dBm
1RX, 2TX
5 MHz Bandwidth
7 dBm
−27 dBm
10 MHz Bandwidth
7 dBm
−27dBm
20 MHz Bandwidth
7 dBm
−27 dBm
2RX, 2TX
5 MHz Bandwidth
7 dBm
−27 dBm
10 MHz Bandwidth
7 dBm
−27 dBm
20 MHz Bandwidth
7 dBm
−27 dBm
Min
Typ
Max
Unit
500
350
mA
mA
540
390
mA
mA
620
475
mA
mA
590
435
mA
mA
660
510
mA
770
620
mA
mA
mA
730
425
mA
mA
800
500
mA
mA
900
600
mA
mA
mA
820
515
mA
900
595
mA
mA
1050
740
mA
mA
Rev. D | Page 13 of 36
Test Conditions/Comments
AD9361
Data Sheet
Table 10. FDD Mode, 5.5 GHz
Parameter
1RX, 1TX
5 MHz Bandwidth
7 dBm
−27 dBm
2RX, 1TX
5 MHz Bandwidth
7 dBm
−27 dBm
1RX, 2TX
5 MHz Bandwidth
7 dBm
−27 dBm
2RX, 2TX
5 MHz Bandwidth
7 dBm
−27 dBm
Min
Typ
Max
Unit
550
385
mA
mA
645
480
mA
mA
805
480
mA
mA
895
575
mA
mA
Rev. D | Page 14 of 36
Test Conditions/Comments
Data Sheet
AD9361
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 11.
Parameter
VDDx to VSSx
VDD_INTERFACE to VSSx
VDD_GPO to VSSx
Logic Inputs and Outputs to
VSSx
Input Current to Any Pin
Except Supplies
RF Inputs (Peak Power)
TX Monitor Input Power (Peak
Power)
Package Power Dissipation
Maximum Junction
Temperature (TJMAX)
Operating Temperature Range
Storage Temperature Range
Rating
−0.3 V to +1.4 V
−0.3 V to +3.0 V
−0.3 V to +3.9 V
−0.3 V to VDD_INTERFACE + 0.3 V
±10 mA
2.5 dBm
9 dBm
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 12. Thermal Resistance
Package
Type
144-Ball
CSP_BGA
Airflow
Velocity
(m/sec)
0
1.0
2.5
θJA1, 2
32.3
29.6
27.8
θJC1, 3
9.6
θJB1, 4
20.2
Per JEDEC JESD51-7, plus JEDEC JESD51-5 2S2P test board.
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-STD 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
1
2
(TJMAX − TA)/θJA
110°C
ESD CAUTION
−40°C to +85°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
REFLOW PROFILE
The AD9361 reflow profile is in accordance with the JEDEC
JESD20 criteria for Pb-free devices. The maximum reflow
temperature is 260°C.
Rev. D | Page 15 of 36
ΨJT1, 2
0.27
0.43
0.57
Unit
°C/W
°C/W
°C/W
AD9361
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
A
RX2A_N
RX2A_P
NC
VSSA
TX_MON2
VSSA
TX2A_N
TX2A_P
TX2B_N
TX2B_P
VDDA1P1_
TX_VCO
TX_EXT_
LO_IN
B
VSSA
VSSA
AUXDAC1
GPO_3
GPO_2
GPO_1
GPO_0
VDD_GPO
VDDA1P3_
TX_LO
VDDA1P3_
TX_VCO_
LDO
TX_VCO_
LDO_OUT
VSSA
AUXDAC2
TEST/
ENABLE
CTRL_IN0
CTRL_IN1
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
CTRL_IN3
CTRL_IN2
P0_D9/
TX_D4_P
P0_D7/
TX_D3_P
P0_D5/
TX_D2_P
P0_D3/
TX_D1_P
P0_D1/
TX_D0_P
VSSD
P0_D11/
TX_D5_P
P0_D8/
TX_D4_N
P0_D6/
TX_D3_N
P0_D4/
TX_D2_N
P0_D2/
TX_D1_N
P0_D0/
TX_D0_N
VSSD
P0_D10/
TX_D5_N
VSSD
FB_CLK_P
VSSD
VDDD1P3_
DIG
RX_
FRAME_N
RX_
FRAME_P
TX_
FRAME_P
FB_CLK_N
DATA_
CLK_P
VSSD
TX_
FRAME_N
VSSD
DATA_
CLK_N
VDD_
INTERFACE
C
RX2C_P
VSSA
D
RX2C_N
VDDA1P3_
RX_RF
VDDA1P3_
CTRL_OUT0
RX_TX
E
RX2B_P
VDDA1P3_
RX_LO
VDDA1P3_
TX_LO_ CTRL_OUT1 CTRL_OUT2 CTRL_OUT3
BUFFER
F
RX2B_N
VDDA1P3_
RX_VCO_
LDO
VSSA
G
RX_EXT_
LO_IN
RX_VCO_
LDO_OUT
VDDA1P1_
RX_VCO
CTRL_OUT6 CTRL_OUT5 CTRL_OUT4
CTRL_OUT7
EN_AGC
ENABLE
RX1B_P
VSSA
VSSA
TXNRX
SYNC_IN
VSSA
VSSD
J
RX1B_N
VSSA
VDDA1P3_
RX_SYNTH
SPI_DI
SPI_CLK
CLK_OUT
P1_D10/
RX_D5_N
P1_D9/
RX_D4_P
P1_D7/
RX_D3_P
P1_D5/
RX_D2_P
P1_D3/
RX_D1_P
P1_D1/
RX_D0_P
K
RX1C_P
VSSA
VDDA1P3_
TX_SYNTH
VDDA1P3_
BB
RESETB
SPI_ENB
P1_D8/
RX_D4_N
P1_D6/
RX_D3_N
P1_D4/
RX_D2_N
P1_D2/
RX_D1_N
P1_D0/
RX_D0_N
VSSD
L
RX1C_N
VSSA
VSSA
RBIAS
AUXADC
SPI_DO
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
M
RX1A_P
RX1A_N
NC
VSSA
TX_MON1
VSSA
TX1A_P
TX1A_N
TX1B_P
TX1B_N
XTALP
XTALN
ANALOG I/O
DIGITAL I/O
NO CONNECT
10453-002
H
P1_D11/
RX_D5_P
DC POWER
GROUND
Figure 2. Pin Configuration, Top View
Table 13. Pin Function Descriptions
Pin No.
A1, A2
Type 1
I
Mnemonic
RX2A_N, RX2A_P
Description
Receive Channel 2 Differential Input A. Alternatively, each pin can be used as a
single-ended input or combined to make a differential pair. Tie unused pins to
ground.
No Connect. Do not connect to these pins.
Analog Ground. Tie these pins directly to the VSSD digital ground on the printed
circuit board (one ground plane).
A3, M3
A4, A6, B1, B2,
B12, C2, C7 to
C12, F3, H2,
H3, H6, J2, K2,
L2, L3, L7 to
L12, M4, M6
A5
A7, A8
A9, A10
NC
I
NC
VSSA
I
O
O
TX_MON2
TX2A_N, TX2A_P
TX2B_N, TX2B_P
Transmit Channel 2 Power Monitor Input. If this pin is unused, tie it to ground.
Transmit Channel 2 Differential Output A. Tie unused pins to 1.3 V.
Transmit Channel 2 Differential Output B. Tie unused pins to 1.3 V.
A11
A12
B3
B4 to B7
B8
I
I
O
O
I
VDDA1P1_TX_VCO
TX_EXT_LO_IN
AUXDAC1
GPO_3 to GPO_0
VDD_GPO
B9
B10
B11
I
I
O
VDDA1P3_TX_LO
VDDA1P3_TX_VCO_LDO
TX_VCO_LDO_OUT
C1, D1
I
RX2C_P, RX2C_N
Transmit VCO Supply Input. Connect to B11.
External Transmit LO Input. If this pin is unused, tie it to ground.
Auxiliary DAC 1 Output.
3.3 V Capable General-Purpose Outputs.
2.5 V to 3.3 V Supply for the AUXDAC and General-Purpose Output Pins. When
the VDD_GPO supply is not used, this supply must be set to 1.3 V.
Transmit LO 1.3 V Supply Input.
Transmit VCO LDO 1.3 V Supply Input. Connect to B9.
Transmit VCO LDO Output. Connect to A11 and a 1 µF bypass capacitor in series
with a 1 Ω resistor to ground.
Receive Channel 2 Differential Input C. Each pin can be used as a single-ended
input or combined to make a differential pair. These inputs experience
degraded performance above 3 GHz. Tie unused pins to ground.
Rev. D | Page 16 of 36
Data Sheet
AD9361
Pin No.
C3
C4
C5, C6, D5, D6
D2
D3
D4, E4 to E6,
F4 to F6, G4
Type 1
O
I
I
I
I
O
D7
I/O
Mnemonic
AUXDAC2
TEST/ENABLE
CTRL_IN0 to CTRL_IN3
VDDA1P3_RX_RF
VDDA1P3_RX_TX
CTRL_OUT0, CTRL_OUT1 to
CTRL_OUT3, CTRL_OUT6 to
CTRL_OUT4, CTRL_OUT7
P0_D9/TX_D4_P
D8
I/O
P0_D7/TX_D3_P
D9
I/O
P0_D5/TX_D2_P
D10
I/O
P0_D3/TX_D1_P
D11
I/O
P0_D1/TX_D0_P
D12, F7, F9,
F11, G12, H7,
H10, K12
E1, F1
I
VSSD
I
RX2B_P, RX2B_N
E2
E3
E7
I
I
I/O
VDDA1P3_RX_LO
VDDA1P3_TX_LO_BUFFER
P0_D11/TX_D5_P
E8
I/O
P0_D8/TX_D4_N
E9
I/O
P0_D6/TX_D3_N
E10
I/O
P0_D4/TX_D2_N
E11
I/O
P0_D2/TX_D1_N
E12
I/O
P0_D0/TX_D0_N
Description
Auxiliary DAC 2 Output.
Test Input. Ground this pin for normal operation.
Control Inputs. Used for manual RX gain and TX attenuation control.
Receiver 1.3 V Supply Input. Connect to D3.
1.3 V Supply Input.
Control Outputs. These pins are multipurpose outputs that have programmable
functionality.
Digital Data Port P0/Transmit Differential Input Bus. This is a dual function pin.
As P0_D9, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 0. Alternatively, this pin (TX_D4_P) can function as part of the LVDS 6-bit TX
differential input bus with internal LVDS termination.
Digital Data Port P0/Transmit Differential Input Bus. This is a dual function pin.
As P0_D7, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 0. Alternatively, this pin (TX_D3_P) can function as part of the LVDS 6-bit TX
differential input bus with internal LVDS termination.
Digital Data Port P0/Transmit Differential Input Bus. This is a dual function pin.
As P0_D5, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 0. Alternatively, this pin (TX_D2_P) can function as part of the LVDS 6-bit TX
differential input bus with internal LVDS termination.
Digital Data Port P0/Transmit Differential Input Bus. This is a dual function pin.
As P0_D3, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 0. Alternatively, this pin (TX_D1_P) can function as part of the LVDS 6-bit TX
differential input bus with internal LVDS termination.
Digital Data Port P0/Transmit Differential Input Bus. This is a dual function pin.
As P0_D1, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 0. Alternatively, this pin (TX_D0_P) can function as part of the LVDS 6-bit TX
differential input bus with internal LVDS termination.
Digital Ground. Tie these pins directly to the VSSA analog ground on the printed
circuit board (one ground plane).
Receive Channel 2 Differential Input B. Each pin can be used as a single-ended
input or combined to make a differential pair. These inputs experience
degraded performance above 3 GHz. Tie unused pins to ground.
Receive LO 1.3 V Supply Input.
1.3 V Supply Input.
Digital Data Port P0/Transmit Differential Input Bus. This is a dual function pin.
As P0_D11, it functions as part of the 12-bit bidirectional parallel CMOS level
Data Port 0. Alternatively, this pin (TX_D5_P) can function as part of the LVDS
6-bit TX differential input bus with internal LVDS termination.
Digital Data Port P0/Transmit Differential Input Bus. This is a dual function pin.
As P0_D8, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 0. Alternatively, this pin (TX_D4_N) can function as part of the LVDS 6-bit TX
differential input bus with internal LVDS termination.
Digital Data Port P0/Transmit Differential Input Bus. This is a dual function pin.
As P0_D6, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 0. Alternatively, this pin (TX_D3_N) can function as part of the LVDS 6-bit TX
differential input bus with internal LVDS termination.
Digital Data Port P0/Transmit Differential Input Bus. This is a dual function pin.
As P0_D4, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 0. Alternatively, this pin (TX_D2_N) can function as part of the LVDS 6-bit TX
differential input bus with internal LVDS termination.
Digital Data Port P0/Transmit Differential Input Bus. This is a dual function pin.
As P0_D2, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 0. Alternatively, this pin (TX_D1_N) can function as part of the LVDS 6-bit TX
differential input bus with internal LVDS termination.
Digital Data Port P0/Transmit Differential Input Bus. This is a dual function pin.
As P0_D0, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 0. Alternatively, this pin (TX_D0_N) can function as part of the LVDS 6-bit TX
differential input bus with internal LVDS termination.
Rev. D | Page 17 of 36
AD9361
Data Sheet
Pin No.
F2
F8
Type 1
I
I/O
Mnemonic
VDDA1P3_RX_VCO_LDO
P0_D10/TX_D5_N
F10, G10
I
FB_CLK_P, FB_CLK_N
F12
G1
G2
I
I
O
VDDD1P3_DIG
RX_EXT_LO_IN
RX_VCO_LDO_OUT
G3
G5
G6
G7, G8
I
I
I
O
VDDA1P1_RX_VCO
EN_AGC
ENABLE
RX_FRAME_N, RX_FRAME_P
G9, H9
I
TX_FRAME_P, TX_FRAME_N
G11, H11
O
DATA_CLK_P, DATA_CLK_N
H1, J1
I
RX1B_P, RX1B_N
H4
I
TXNRX
H5
I
SYNC_IN
H8
I/O
P1_D11/RX_D5_P
H12
J3
J4
J5
J6
I
I
I
I
O
VDD_INTERFACE
VDDA1P3_RX_SYNTH
SPI_DI
SPI_CLK
CLK_OUT
J7
I/O
P1_D10/RX_D5_N
J8
I/O
P1_D9/RX_D4_P
J9
I/O
P1_D7/RX_D3_P
J10
I/O
P1_D5/RX_D2_P
Description
Receive VCO LDO 1.3 V Supply Input. Connect to E2.
Digital Data Port P0/Transmit Differential Input Bus. This is a dual function pin.
As P0_D10, it functions as part of the 12-bit bidirectional parallel CMOS level
Data Port 0. Alternatively, this pin (TX_D5_N) can function as part of the LVDS
6-bit TX differential input bus with internal LVDS termination.
Feedback Clock. These pins receive the FB_CLK signal that clocks in TX data.
In CMOS mode, use FB_CLK_P as the input and tie FB_CLK_N to ground.
1.3 V Digital Supply Input.
External Receive LO Input. If this pin is unused, tie it to ground.
Receive VCO LDO Output. Connect this pin directly to G3 and a 1 µF bypass
capacitor in series with a 1 Ω resistor to ground.
Receive VCO Supply Input. Connect this pin directly to G2 only.
Manual Control Input for Automatic Gain Control (AGC).
Control Input. This pin moves the device through various operational states.
Receive Digital Data Framing Output Signal. These pins transmit the RX_FRAME
signal that indicates whether the RX output data is valid. In CMOS mode, use
RX_FRAME_P as the output and leave RX_FRAME_N unconnected.
Transmit Digital Data Framing Input Signal. These pins receive the TX_FRAME
signal that indicates when TX data is valid. In CMOS mode, use TX_FRAME_P as
the input and tie TX_FRAME_N to ground.
Receive Data Clock Output. These pins transmit the DATA_CLK signal that is used
by the BBP to clock RX data. In CMOS mode, use DATA_CLK_P as the output and
leave DATA_CLK_N unconnected.
Receive Channel 1 Differential Input B. Alternatively, each pin can be used as a
single-ended input. These inputs experience degraded performance above
3 GHz. Tie unused pins to ground.
Enable State Machine Control Signal. This pin controls the data port bus direction.
Logic low selects the RX direction, and logic high selects the TX direction.
Input to Synchronize Digital Clocks Between Multiple AD9361 Devices. If this pin
is unused, tied it to ground.
Digital Data Port P1/Receive Differential Output Bus. This is a dual function pin.
As P1_D11, it functions as part of the 12-bit bidirectional parallel CMOS level
Data Port 1. Alternatively, this pin (RX_D5_P) can function as part of the LVDS
6-bit RX differential output bus with internal LVDS termination.
1.2 V to 2.5 V Supply for Digital I/O Pins (1.8 V to 2.5 V in LVDS Mode).
1.3 V Supply Input.
SPI Serial Data Input.
SPI Clock Input.
Output Clock. This pin can be configured to output either a buffered version of the
external input clock, the DCXO, or a divided-down version of the internal ADC_CLK.
Digital Data Port P1/Receive Differential Output Bus. This is a dual function pin.
As P1_D10, it functions as part of the 12-bit bidirectional parallel CMOS level
Data Port 1. Alternatively, this pin (RX_D5_N) can function as part of the LVDS
6-bit RX differential output bus with internal LVDS termination.
Digital Data Port P1/Receive Differential Output Bus. This is a dual function pin.
As P1_D9, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 1. Alternatively, this pin (RX_D4_P) can function as part of the LVDS 6-bit RX
differential output bus with internal LVDS termination.
Digital Data Port P1/Receive Differential Output Bus. This is a dual function pin.
As P1_D7, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 1. Alternatively, this pin (RX_D3_P) can function as part of the LVDS 6-bit RX
differential output bus with internal LVDS termination.
Digital Data Port P1/Receive Differential Output Bus. This is a dual function pin.
As P1_D5, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 1. Alternatively, this pin (RX_D2_P) can function as part of the LVDS 6-bit RX
differential output bus with internal LVDS termination.
Rev. D | Page 18 of 36
Data Sheet
AD9361
Pin No.
J11
Type 1
I/O
Mnemonic
P1_D3/RX_D1_P
J12
I/O
P1_D1/RX_D0_P
K1, L1
I
RX1C_P, RX1C_N
K3
K4
K5
K6
K7
I
I
I
I
I/O
VDDA1P3_TX_SYNTH
VDDA1P3_BB
RESETB
SPI_ENB
P1_D8/RX_D4_N
K8
I/O
P1_D6/RX_D3_N
K9
I/O
P1_D4/RX_D2_N
K10
I/O
P1_D2/RX_D1_N
K11
I/O
P1_D0/RX_D0_N
L4
I
RBIAS
L5
L6
M1, M2
I
O
I
AUXADC
SPI_DO
RX1A_P, RX1A_N
M5
M7, M8
M9, M10
M11, M12
I
O
O
I
TX_MON1
TX1A_P, TX1A_N
TX1B_P, TX1B_N
XTALP, XTALN
1
Description
Digital Data Port P1/Receive Differential Output Bus. This is a dual function pin.
As P1_D3, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 1. Alternatively, this pin (RX_D1_P) can function as part of the LVDS 6-bit RX
differential output bus with internal LVDS termination.
Digital Data Port P1/Receive Differential Output Bus. This is a dual function pin.
As P1_D1, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 1. Alternatively, this pin (RX_D0_P) can function as part of the LVDS 6-bit RX
differential output bus with internal LVDS termination.
Receive Channel 1 Differential Input C. Alternatively, each pin can be used as a
single-ended input. These inputs experience degraded performance above
3 GHz. Tie unused pins to ground.
1.3 V Supply Input.
1.3 V Supply Input.
Asynchronous Reset. Logic low resets the device.
SPI Enable Input. Set this pin to logic low to enable the SPI bus.
Digital Data Port P1/Receive Differential Output Bus. This is a dual function pin.
As P1_D8, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 1. Alternatively, this pin (RX_D4_N) can function as part of the LVDS 6-bit RX
differential output bus with internal LVDS termination.
Digital Data Port P1/Receive Differential Output Bus. This is a dual function pin.
As P1_D6, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 1. Alternatively, this pin (RX_D3_N) can function as part of the LVDS 6-bit RX
differential output bus with internal LVDS termination.
Digital Data Port P1/Receive Differential Output Bus. This is a dual function pin.
As P1_D4, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 1. Alternatively, this pin (RX_D2_N) can function as part of the LVDS 6-bit RX
differential output bus with internal LVDS termination.
Digital Data Port P1/Receive Differential Output Bus. This is a dual function pin.
As P1_D2, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 1. Alternatively, this pin (RX_D1_N) can function as part of the LVDS 6-bit RX
differential output bus with internal LVDS termination.
Digital Data Port P1/Receive Differential Output Bus. This is a dual function pin.
As P1_D0, it functions as part of the 12-bit bidirectional parallel CMOS level Data
Port 1. Alternatively, this pin (RX_D0_N) can function as part of the LVDS 6-bit RX
differential output bus with internal LVDS termination.
Bias Input Reference. Connect this pin through a 14.3 kΩ (1% tolerance) resistor
to ground.
Auxiliary ADC Input. If this pin is unused, tie it to ground.
SPI Serial Data Output in 4-Wire Mode, or High-Z in 3-Wire Mode.
Receive Channel 1 Differential Input A. Alternatively, each pin can be used as a
single-ended input. Tie unused pins to ground.
Transmit Channel 1 Power Monitor Input. When this pin is unused, tie it to ground.
Transmit Channel 1 Differential Output A. Tie unused pins to 1.3 V.
Transmit Channel 1 Differential Output B. Tie unused pins to 1.3 V.
Reference Frequency Crystal Connections. When a crystal is used, connect it
between these two pins. When an external clock source is used, connect it to
XTALN and leave XTALP unconnected.
I is input, O is output, I/O is input/output, or NC is not connected.
Rev. D | Page 19 of 36
AD9361
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
800 MHz FREQUENCY BAND
0
4.0
–40°C
+25°C
+85°C
RX EVM (dB)
–15
2.5
2.0
1.5
–25
–35
0.5
–40
750
800
850
900
RF FREQUENCY (MHz)
–45
–75
5
–60
–65
–55
–50
–45
–40
–35
–30
–25
RX INPUT POWER (dBm)
Figure 6. RX EVM vs. RX Input Power, 64 QAM LTE 10 MHz Mode,
19.2 MHz REF_CLK
0
–40°C
+25°C
+85°C
4
–70
10453-006
–30
Figure 3. RX Noise Figure vs. RF Frequency
–5
–40°C
+25°C
+85°C
–10
3
–15
2
RX EVM (dB)
1
0
–20
–25
–30
–1
–35
–2
–80
–70
–60
–50
–40
–30
–20
–10
RX INPUT POWER (dBm)
0
–5
1
–10
RX EVM (dB)
2
0
–20
–2
–25
–70
–60
–50
–40
–30
–20
–10
RX INPUT POWER (dBm)
Figure 5. RSSI Error vs. RX Input Power, Edge Modulation
(Referenced to −50 dBm Input Power at 800 MHz)
–30
–72
10453-005
–80
–60
–50
–30
–40
–20
–10
–40°C
+25°C
+85°C
–15
–1
–90
–70
RX INPUT POWER (dBm)
–40°C
+25°C
+85°C
–3
–110 –100
–80
Figure 7. RX EVM vs. RX Input Power, GSM Mode, 30.72 MHz REF_CLK
(Doubled Internally for RF Synthesizer)
Figure 4. RSSI Error vs. RX Input Power, LTE 10 MHz Modulation
(Referenced to −50 dBm Input Power at 800 MHz)
3
–45
–90
10453-004
–90
10453-007
–40
–3
–100
–68
–64
–60
–56
–52
–48
–44
–40
INTERFERER POWER LEVEL (dBm)
–36
–32
10453-008
RSSI ERROR (dB)
–20
1.0
0
700
RSSI ERROR (dB)
–40°C
+25°C
+85°C
–10
3.0
10453-003
RX NOISE FIGURE (dB)
3.5
–5
Figure 8. RX EVM vs. Interferer Power Level, LTE 10 MHz Signal of Interest with
PIN = −82 dBm, 5 MHz OFDM Blocker at 7.5 MHz Offset
Rev. D | Page 20 of 36
Data Sheet
0
AD9361
20
–40°C
+25°C
+85°C
15
10
–4
IIP3 (dBm)
RX EVM (dB)
5
–8
0
–5
–40°C
+25°C
+85°C
–10
–12
–15
–54
–52
–50
–48
–46
–44
–42
–40
–38
–25
10453-009
–16
–56
–36
INTERFERER POWER LEVEL (dBm)
20
14
52
44
RX GAIN INDEX
60
68
76
100
90
–40°C
+25°C
+85°C
80
10
70
IIP2 (dBm)
RX NOISE FIGURE (dB)
36
Figure 12. Third-Order Input Intercept Point (IIP3) vs. RX Gain Index,
f1 = 1.45 MHz, f2 = 2.89 MHz, GSM Mode
Figure 9. RX EVM vs. Interferer Power Level, LTE 10 MHz Signal of Interest with
PIN = −90 dBm, 5 MHz OFDM Blocker at 17.5 MHz Offset
12
28
10453-012
–20
8
6
–40°C
+25°C
+85°C
60
50
40
30
4
20
2
–39
–35
–31
–27
–23
INTERFERER POWER LEVEL (dBm)
0
–100
RX LO LEAKAGE (dBm)
52
60
68
76
–40°C
+25°C
+85°C
74
72
70
–110
–115
–120
–125
750
800
RX LO FREQUENCY (MHz)
850
900
10453-011
68
Figure 11. RX Gain vs. RX LO Frequency, Gain Index = 76 (Maximum Setting)
Rev. D | Page 21 of 36
–130
700
750
800
850
900
RX LO FREQUENCY (MHz)
Figure 14. RX Local Oscillator (LO) Leakage vs. RX LO Frequency
10453-014
RX GAIN (dB)
44
–105
76
66
700
36
Figure 13. Second-Order Input Intercept Point (IIP2) vs. RX Gain Index,
f1 = 2.00 MHz, f2 = 2.01 MHz, GSM Mode
–40°C
+25°C
+85°C
78
28
RX GAIN INDEX
Figure 10. RX Noise Figure vs. Interferer Power Level, Edge Signal of Interest
with PIN = −90 dBm, CW Blocker at 3 MHz Offset, Gain Index = 64
80
20
10453-013
–43
10453-010
0
–47
10
AD9361
Data Sheet
–20
–40
–60
–80
–100
2000
6000
4000
10000
8000
12000
FREQUENCY (MHz)
Figure 15. RX Emission at LNA Input, DC to 12 GHz, fLO_RX = 800 MHz,
LTE 10 MHz, fLO_TX = 860 MHz
10
5
0
–5
15
FREQUENCY OFFSET (MHz)
Figure 18. TX Spectrum vs. Frequency Offset from Carrier Frequency, fLO_TX =
800 MHz, LTE 10 MHz Downlink (Digital Attenuation Variations Shown)
Figure 16. TX Output Power vs. TX LO Frequency, Attenuation Setting = 0 dB,
Single Tone Output
–80
1.6
1.4
1.2
1.0
0.8
0.6
–100
FREQUENCY OFFSET (MHz)
10453-019
TX LO FREQUENCY (MHz)
–60
0.4
900
–40
0
850
–20
0.2
800
ATT 0dB
ATT 3dB
ATT 6dB
0
–0.2
750
10453-016
6.5
Figure 19. TX Spectrum vs. Frequency Offset from Carrier Frequency, fLO_TX =
800 MHz, GSM Downlink (Digital Attenuation Variations Shown), 3 MHz Range
20
0.3
0.2
0.1
0
–0.1
–0.2
–0.3
10
20
30
40
50
ATTENUATION SETTING (dB)
Figure 17. TX Power Control Linearity Error vs. Attenuation Setting
ATT 0dB
ATT 3dB
ATT 6dB
–20
–40
–60
–80
–100
–120
–6
10453-017
–0.4
0
–4
–2
0
2
FREQUENCY OFFSET (MHz)
4
6
10453-020
–40°C
+25°C
+85°C
TRANSMITTER OUTPUT POWER (dBm/30kHz)
STEP LINEARITY ERROR (dB)
–10
–0.4
7.0
0
–90
–0.6
7.5
–0.5
–80
–0.8
8.0
0.4
–70
–1.0
8.5
0.5
–60
–100
–15
TRANSMITTER OUTPUT POWER (dBm/30kHz)
TX OUTPUT POWER (dBm)
9.0
6.0
700
–50
20
–40°C
+25°C
+85°C
9.5
–40
–1.2
10.0
–30
–1.4
0
–20
–1.6
–120
ATT 0dB
ATT 3dB
ATT 6dB
–10
10453-018
TRANSMITTER OUTPUT POWER (dBm/100kHz)
0
10453-015
POWER AT LNA INPUT (dBm/750kHz)
0
Figure 20. TX Spectrum vs. Frequency Offset from Carrier Frequency, fLO_TX =
800 MHz, GSM Downlink (Digital Attenuation Variations Shown), 12 MHz Range
Rev. D | Page 22 of 36
Data Sheet
0.30
–40°C
+25°C
+85°C
INTEGRATED PHASE NOISE (°rms)
–25
–35
–40
–50
0
5
10
15
20
25
30
35
40
TX ATTENUATION SETTING (dB)
Figure 21. TX EVM vs. TX Attenuation Setting, fLO_TX = 800 MHz,
LTE 10 MHz, 64 QAM Modulation, 19.2 MHz REF_CLK
0.10
0.05
–35
TX CARRIER AMPLITUDE (dBc)
–40°C
+25°C
+85°C
–30
–35
–40
–45
800
850
900
ATT 0, –40°C
ATT 25, –40°C
ATT 50, –40°C
ATT 0, +25°C
ATT 25, +25°C
ATT 50, +25°C
ATT 0, +85°C
ATT 25, +85°C
ATT 50, +85°C
–40
–45
–50
–55
–60
10
20
30
40
50
–70
700
10453-022
0
0.4
0.3
0.2
0
700
750
800
FREQUENCY (MHz)
850
900
10453-023
0.1
Figure 23. Integrated TX LO Phase Noise vs. Frequency, 19.2 MHz REF_CLK
850
900
Figure 25. TX Carrier Rejection vs. Frequency
TX SECOND-ORDER HARMONIC DISTORTION (dBc)
–40°C
+25°C
+85°C
800
FREQUENCY (MHz)
Figure 22. TX EVM vs. TX Attenuation Setting, fLO_TX = 800 MHz, GSM
Modulation, 30.72 MHz REF_CLK (Doubled Internally for RF Synthesizer)
0.5
750
10453-025
–65
TX ATTENUATION SETTING (dB)
INTEGRATED PHASE NOISE (°RMS)
750
Figure 24. Integrated TX LO Phase Noise vs. Frequency, 30.72 MHz REF_CLK
(Doubled Internally for RF Synthesizer)
–30
–25
TX EVM (dB)
0.15
FREQUENCY (MHz)
–20
–50
0.20
0
700
10453-021
–45
–40°C
+25°C
+85°C
–50
ATT 0, –40°C
ATT 25, –40°C
ATT 50, –40°C
ATT 0, +25°C
ATT 25, +25°C
ATT 50, +25°C
ATT 0, +85°C
ATT 25, +85°C
ATT 50, +85°C
–55
–60
–65
–70
–75
–80
700
750
800
FREQUENCY (MHz)
850
900
10453-026
TX EVM (dB)
–30
0.25
10453-024
–20
AD9361
Figure 26. TX Second-Order Harmonic Distortion (HD2) vs. Frequency
Rev. D | Page 23 of 36
Data Sheet
–20
ATT 0, –40°C
ATT 25, –40°C
ATT 50, –40°C
–25
170
ATT 0, +85°C
ATT 25, +85°C
ATT 50, +85°C
ATT 0, +25°C
ATT 25, +25°C
ATT 50, +25°C
165
TX SNR (dB/Hz)
–30
–35
–40
–45
145
750
800
850
900
30
15
10
12
16
20
TX ATTENUATION SETTING (dB)
10453-028
5
8
Figure 28. TX Third-Order Output Intercept Point (OIP3) vs.
TX Attenuation Setting
170
–40°C
+25°C
+85°C
160
155
150
3
6
9
TX ATTENUATION SETTING (dB)
12
15
10453-029
145
0
12
16
20
–35
ATT 0, –40°C
ATT 25, –40°C
ATT 50, –40°C
ATT 0, +25°C
ATT 25, +25°C
ATT 50, +25°C
ATT 0, +85°C
ATT 25, +85°C
ATT 50, +85°C
–40
–45
–50
–55
–60
–65
–70
700
750
800
850
900
FREQUENCY (MHz)
Figure 31. TX Single Sideband (SSB) Rejection vs. Frequency,
1.5375 MHz Offset
165
140
8
TX ATTENUATION SETTING (dB)
TX SINGLE SIDEBAND AMPLITUDE (dBc)
20
4
4
–30
–40°C
+25°C
+85°C
0
0
Figure 30. TX Signal-to-Noise Ratio (SNR) vs. TX Attenuation Setting,
GSM Signal of Interest with Noise Measured at 20 MHz Offset
25
0
140
Figure 29. TX Signal-to-Noise Ratio (SNR) vs. TX Attenuation Setting,
LTE 10 MHz Signal of Interest with Noise Measured at 90 MHz Offset
Rev. D | Page 24 of 36
10453-031
–60
700
10453-030
–55
Figure 27. TX Third-Order Harmonic Distortion (HD3) vs. Frequency
TX OIP3 (dBm)
–40°C
+25°C
+85°C
155
150
FREQUENCY (MHz)
TX SNR (dB/Hz)
160
–50
10453-027
TX THIRD-ORDER HARMONIC DISTORTION (dBc)
AD9361
Data Sheet
AD9361
2.4 GHz FREQUENCY BAND
0
4.0
–40°C
+25°C
+85°C
–5
3.0
–10
2.5
RX EVM (dB)
RX NOISE FIGURE (dB)
3.5
2.0
1.5
–15
–20
1.0
1900
2000
2100
2200
2300
2400
2500
2600
2700
RF FREQUENCY (MHz)
Figure 32. RX Noise Figure vs. RF Frequency
5
4
–30
–72
10453-032
0
1800
–40°C
+25°C
+85°C
–68
–64
–60
–56
–52
–48
–44
–40
–36
–32
–28
INTERFERER POWER LEVEL (dBm)
10453-035
–25
0.5
Figure 35. RX EVM vs. Interferer Power Level, LTE 20 MHz Signal of Interest
with PIN = −75 dBm, LTE 20 MHz Blocker at 20 MHz Offset
0
–40°C
+25°C
+85°C
–40°C
+25°C
+85°C
–5
–10
2
RX EVM (dB)
RSSI ERROR (dB)
3
1
0
–15
–20
–1
–25
–90
–80
–70
–60
–50
–40
–30
–20
–10
RX INPUT POWER (dBm)
Figure 33. RSSI Error vs. RX Input Power, Referenced to −50 dBm Input Power
at 2.4 GHz
0
–5
–30
–60
10453-033
–3
–100
–55
–50
–45
–40
–35
–30
–25
–20
INTERFERER POWER LEVEL (dBm)
10453-036
–2
Figure 36. RX EVM vs. Interferer Power Level, LTE 20 MHz Signal of Interest
with PIN = −75 dBm, LTE 20 MHz Blocker at 40 MHz Offset
80
–40°C
+25°C
+85°C
78
–40°C
+25°C
+85°C
–10
76
RX GAIN (dB)
–20
–25
74
72
–30
70
–35
–45
–75
–70
–65
–60
–55
–50
–45
–40
–35
–30
–25
INPUT POWER (dBm)
Figure 34. RX EVM vs. Input Power, 64 QAM LTE 20 MHz Mode,
40 MHz REF_CLK
66
1800
1900
2000
2100
2200
2300
2400
RX LO FREQUENCY (MHz)
2500
2600
2700
10453-037
68
–40
10453-034
RX EVM (dB)
–15
Figure 37. RX Gain vs. RX LO Frequency, Gain Index = 76 (Maximum Setting)
Rev. D | Page 25 of 36
AD9361
15
0
–40°C
+25°C
+85°C
POWER AT LNA INPUT (dBm/750kHz)
20
Data Sheet
10
IIP3 (dBm)
5
0
–5
–10
–15
–20
–40
–60
–80
–100
28
36
44
52
60
76
68
RX GAIN INDEX
–120
10453-038
–25
20
6000
4000
8000
10000
12000
Figure 41. RX Emission at LNA Input, DC to 12 GHz, fLO_RX = 2.4 GHz,
LTE 20 MHz, fLO_TX = 2.46 GHz
10.0
–40°C
+25°C
+85°C
–40°C
+25°C
+85°C
9.5
TX OUTPUT POWER (dBm)
70
60
IIP2 (dBm)
2000
FREQUENCY (MHz)
Figure 38. Third-Order Input Intercept Point (IIP3) vs. RX Gain Index,
f1 = 30 MHz, f2 = 61 MHz
80
0
10453-041
–20
50
40
9.0
8.5
8.0
7.5
7.0
30
36
28
44
60
52
68
76
RX GAIN INDEX
Figure 39. Second-Order Input Intercept Point (IIP2) vs. RX Gain Index,
f1 = 60 MHz, f2 = 61 MHz
–100
6.0
1800
10453-039
20
20
STEP LINEARITY ERROR (dB)
–105
2300
2400
2500
2600
2700
0.3
0.2
0.1
0
–0.1
–0.2
–0.3
–125
–130
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
RX LO FREQUENCY (MHz)
–0.5
0
10
20
30
ATTENUATION SETTING (dB)
40
50
10453-043
–0.4
10453-040
RX LO LEAKAGE (dBm)
2200
–40°C
+25°C
+85°C
0.4
–120
2100
Figure 42. TX Output Power vs. TX LO Frequency, Attenuation Setting = 0 dB,
Single Tone Output
0.5
–115
2000
TX LO FREQUENCY (MHz)
–40°C
+25°C
+85°C
–110
1900
10453-042
6.5
Figure 43. TX Power Control Linearity Error vs. Attenuation Setting
Figure 40. RX Local Oscillator (LO) Leakage vs. RX LO Frequency
Rev. D | Page 26 of 36
Data Sheet
–30
ATT 0dB
ATT 3dB
ATT6dB
–35
TX CARRIER AMPLITUDE (dBc)
–20
–40
–60
–80
–100
–40
–45
–50
–55
–60
–10
–5
0
5
10
15
20
25
–70
1800
–25
TX EVM (dB)
–30
–35
–40
0
5
10
15
20
25
30
35
40
ATTENUATION SETTING (dB)
10453-045
–45
0.5
–40°C
+25°C
+85°C
0.4
0.3
0.2
0
1800
1900
2000
2100
2200
2300
2400
FREQUENCY (MHz)
2500
2600
2700
2300
2400
2500
2600
2700
–50
ATT 0, –40°C
ATT 25, –40°C
ATT 50, –40°C
ATT 0, +25°C
ATT 25, +25°C
ATT 50, +25°C
ATT 0, +85°C
ATT 25, +85°C
ATT 50, +85°C
–55
–60
–65
–70
–75
–80
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
Figure 48. TX Second-Order Harmonic Distortion (HD2) vs. Frequency
10453-046
0.1
2200
FREQUENCY (MHz)
TX THIRD-ORDER HARMONIC DISTORTION (dBc)
Figure 45. TX EVM vs. Transmitter Attenuation Setting, 40 MHz REF_CLK,
LTE 20 MHz, 64 QAM Modulation
2100
Figure 47. TX Carrier Rejection vs. Frequency
TX SECOND-ORDER HARMONIC DISTORTION (dBc)
–40°C
+25°C
+85°C
2000
FREQUENCY (MHz)
Figure 44. TX Spectrum vs. Frequency Offset from Carrier Frequency, fLO_TX =
2.3 GHz, LTE 20 MHz Downlink (Digital Attenuation Variations Shown)
–20
1900
10453-047
–15
10453-048
–20
FREQUENCY OFFSET (MHz)
INTEGRATED PHASE NOISE (°rms)
ATT 0, +85°C
ATT 25, +85°C
ATT 50, +85°C
Figure 46. Integrated TX LO Phase Noise vs. Frequency, 40 MHz REF_CLK
Rev. D | Page 27 of 36
–20
–25
ATT 0, –40°C
ATT 25, –40°C
ATT 50, –40°C
ATT 0, +85°C
ATT 25, +85°C
ATT 50, +85°C
ATT 0, +25°C
ATT 25, +25°C
ATT 50, +25°C
–30
–35
–40
–45
–50
–55
–60
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
FREQUENCY (MHz)
Figure 49. TX Third-Order Harmonic Distortion (HD3) vs. Frequency
10453-049
–120
–25
–50
ATT 0, +25°C
ATT 25, +25°C
ATT 50, +25°C
ATT 0, –40°C
ATT 25, –40°C
ATT 50, –40°C
–65
10453-044
TRANSMITTER OUTPUT POWER (dBm/100kHz)
0
AD9361
AD9361
–30
TX SINGLE SIDEBAND AMPLITUDE (dBc)
–40°C
+25°C
+85°C
TX OIP3 (dBm)
25
20
15
10
0
0
4
8
12
16
20
TX ATTENUATION SETTING (dB)
10453-050
5
Figure 50. TX Third-Order Output Intercept Point (OIP3) vs.
TX Attenuation Setting
160
156
TX SNR (dB/Hz)
154
152
150
148
146
144
0
3
6
9
TX ATTENUATION SETTING (dB)
12
15
10453-051
142
140
ATT 0, +25°C
ATT 25, +25°C
ATT 50, +25°C
ATT 0, +85°C
ATT 25, +85°C
ATT 50, +85°C
–40
–45
–50
–55
–60
–65
–70
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
FREQUENCY (MHz)
Figure 52. TX Single Sideband (SSB) Rejection vs. Frequency,
3.075 MHz Offset
–40°C
+25°C
+85°C
158
–35
ATT 0, –40°C
ATT 25, –40°C
ATT 50, –40°C
Figure 51. TX Signal-to-Noise Ratio (SNR) vs. TX Attenuation Setting,
LTE 20 MHz Signal of Interest with Noise Measured at 90 MHz Offset
Rev. D | Page 28 of 36
10453-052
30
Data Sheet
Data Sheet
AD9361
6
5
5
0
4
–5
RX EVM (dB)
3
–40°C
+25°C
+85°C
2
–10
–40°C
+25°C
+85°C
–15
–20
1
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
6.0
RF FREQUENCY (GHz)
–25
–72
10453-053
0
5.0
Figure 53. RX Noise Figure vs. RF Frequency
–67
–62
–57
–52
–47
–42
–37
–32
INTERFERER POWER LEVEL (dBm)
10453-056
RX NOISE FIGURE (dB)
5.5 GHz FREQUENCY BAND
Figure 56. RX EVM vs. Interferer Power Level, WiMAX 40 MHz Signal of
Interest with PIN = −74 dBm, WiMAX 40 MHz Blocker at 40 MHz Offset
5
5
4
0
2
–40°C
+25°C
+85°C
–5
RX EVM (dB)
RSSI ERROR (dB)
3
1
0
–10
–40°C
+25°C
+85°C
–15
–1
–20
–80
–70
–60
–50
–40
–30
–20
–10
RX INPUT POWER (dBm)
–25
–60
10453-054
–3
–90
–55
–50
–45
–40
–35
–30
–25
INTERFERER POWER LEVEL (dBm)
Figure 54. RSSI Error vs. RX Input Power, Referenced to −50 dBm Input Power
at 5.8 GHz
10453-057
–2
Figure 57. RX EVM vs. Interferer Power Level, WiMAX 40 MHz Signal of
Interest with PIN = −74 dBm, WiMAX 40 MHz Blocker at 80 MHz Offset
0
70
–5
–20
–25
66
64
–30
–40°C
+25°C
+85°C
62
–35
–68
–62
–56
–50
–44
–38
RX INPUT POWER (dBm)
–32
–26
–20
60
5.0
10453-055
–40
–74
Figure 55. RX EVM vs. RX Input Power, 64 QAM WiMAX 40 MHz Mode,
40 MHz REF_CLK (Doubled Internally for RF Synthesizer)
5.1
5.2
5.3
5.4
5.5
5.6
FREQUENCY (GHz)
5.7
5.8
5.9
6.0
10453-058
–15
RX GAIN (dB)
RX EVM (dB)
68
–40°C
+25°C
+85°C
–10
Figure 58. RX Gain vs. Frequency, Gain Index = 76 (Maximum Setting)
Rev. D | Page 29 of 36
AD9361
Data Sheet
20
0
5
–40°C
+25°C
+85°C
0
–5
–10
–20
6
16
26
36
46
56
66
76
RX GAIN INDEX
–80
–100
15
30
25
20
FREQUENCY (GHz)
10
70
9
TX OUTPUT POWER (dBm)
80
–40°C
+25°C
+85°C
50
10
5
Figure 62. RX Emission at LNA Input, DC to 26 GHz, fLO_RX = 5.8 GHz,
WiMAX 40 MHz
60
40
30
–40°C
+25°C
+85°C
8
7
6
5
20
28
36
44
52
60
68
76
RX GAIN INDEX
4
5.0
10453-060
20
Figure 60. Second-Order Input Intercept Point (IIP2) vs. RX Gain Index,
f1 = 70 MHz, f2 = 71 MHz
0.4
–94
0.3
STEP LINEARITY ERROR (dB)
–92
–40°C
+25°C
+85°C
–100
–102
–104
5.5
5.6
5.7
5.8
5.9
FREQUENCY (GHz)
6.0
10453-061
5.4
5.8
5.9
6.0
0.0
–0.2
–0.4
5.3
5.7
–0.1
–108
5.2
5.6
0.1
–0.3
5.1
5.5.
5.4
0.2
–106
–110
5.0
5.3
Figure 63. TX Output Power vs. Frequency, Attenuation Setting = 0 dB,
Single Tone
0.5
–98
5.2
FREQUENCY (GHz)
–90
–96
5.1
10453-063
IIP2 (dBm)
–60
0
Figure 59. Third-Order Input Intercept Point (IIP3) vs. RX Gain Index,
f1 = 50 MHz, f2 = 101 MHz
RX LO LEAKAGE (dBm)
–40
–120
10453-059
–15
–20
Figure 61. RX Local Oscillator (LO) Leakage vs. Frequency
–40°C
+25°C
+85°C
–0.5
0
10
20
30
40
50
60
70
80
90
ATTENUATION SETTING (dB)
Figure 64. TX Power Control Linearity Error vs. Attenuation Setting
Rev. D | Page 30 of 36
10453-064
IIP3 (dBm)
10
10453-062
POWER AT LNA INPUT (dBm/150kHz)
15
Data Sheet
AD9361
0
–10
–10
–20
TX CARRIER AMPLITUDE (dBc)
ATT 0dB
ATT 3dB
ATT 6dB
–30
–40
–50
–60
–70
–20
–30
–40
–50
–20
–10
0
10
20
30
40
50
–70
5.0
–34
–36
–40°C
+25°C
+85°C
2
4
6
8
10
TX ATTENUATION SETTING (dB)
10453-066
TX EVM (dB)
–32
0
Figure 66. TX EVM vs. TX Attenuation Setting, WiMAX 40 MHz,
64 QAM Modulation, fLO_TX = 5.495 GHz, 40 MHz REF_CLK
(Doubled Internally for RF Synthesizer)
0.6
0.5
0.4
–40°C
+25°C
+85°C
0.2
5.3
5.4
5.5
5.6
FREQUENCY (GHz)
5.7
5.8
5.9
6.0
5.6
5.7
5.8
5.9
6.0
ATT 0, –40°C
ATT 25, –40°C
ATT 50, –40°C
–55
ATT 0, +25°C
ATT 25, +25°C
ATT 50, +25°C
ATT 0, +85°C
ATT 25, +85°C
ATT 50, +85°C
–60
–65
–70
–75
–80
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
6.0
FREQUENCY (GHz)
10453-067
0.1
5.2
5.5
–50
5.0
TX THIRD-ORDER HARMONIC DISTORTION (dBc)
INTEGRATED PHASE NOISE (°RMS)
0.7
5.1
5.4
Figure 69. TX Second-Order Harmonic Distortion (HD2) vs. Frequency
0.8
0.3
5.3
Figure 68. TX Carrier Rejection vs. Frequency
TX SECOND-ORDER HARMONIC DISTORTION (dBc)
–30
–40
5.2
FREQUENCY (GHz)
Figure 65. TX Spectrum vs. Frequency Offset from Carrier Frequency, fLO_TX =
5.8 GHz, WiMAX 40 MHz Downlink (Digital Attenuation Variations Shown)
–38
5.1
10453-068
–30
10453-069
–40
FREQUENCY OFFSET (MHz)
0
5.0
ATT 0, +85°C
ATT 25, +85°C
ATT 50, +85°C
Figure 67. Integrated TX LO Phase Noise vs. Frequency, 40 MHz REF_CLK
(Doubled Internally for RF Synthesizer)
Rev. D | Page 31 of 36
–10
–15
ATT 0, –40°C
ATT 25, –40°C
ATT 50, –40°C
ATT 0, +25°C
ATT 25, +25°C
ATT 50, +25°C
ATT 0, +85°C
ATT 25, +85°C
ATT 50, +85°C
–20
–25
–30
–35
–40
–45
–50
5.0
5.1
5.2
5.3
5.4
5.5
5.6
FREQUENCY (GHz)
5.7
5.8
5.9
6.0
10453-070
–90
–50
ATT 0, +25°C
ATT 25, +25°C
ATT 50, +25°C
ATT 0, –40°C
ATT 25, –40°C
ATT 50, –40°C
–60
–80
10453-065
TRANSMITTER OUTPUT POWER (dBm/1MHz)
0
Figure 70. TX Third-Order Harmonic Distortion (HD3) vs. Frequency
AD9361
Data Sheet
20
TX OIP3 (dBm)
16
12
–40°C
+25°C
+85°C
8
4
–4
0
4
8
12
16
20
TX ATTENUATION SETTING (dB)
149
TX SNR (dB/Hz)
148
147
146
–40°C
+25°C
+85°C
144
142
6
9
TX ATTENUATION SETTING (dB)
12
15
10453-072
143
3
–45
–50
–55
–60
–65
5.1
5.2
5.3
5.4
5.5
5.6
FREQUENCY (GHz)
150
0
ATT 0, +85°C
ATT 25, +85°C
ATT 50, +85°C
5.7
5.8
5.9
6.0
Figure 73. TX Single Sideband (SSB) Rejection vs. Frequency, 7 MHz Offset
Figure 71. TX Third-Order Output Intercept Point (OIP3) vs.
TX Attenuation Setting, fLO_TX = 5.8 GHz
145
ATT 0, +25°C
ATT 25, +25°C
ATT 50, +25°C
–40
–70
5.0
10453-071
0
ATT 0, –40°C
ATT 25, –40°C
ATT 50, –40°C
–35
10453-073
TX SINGLE SIDEBAND AMPLITUDE (dBc)
–30
Figure 72. TX Signal-to-Noise Ratio (SNR) vs. TX Attenuation Setting,
WiMAX 40 MHz Signal of Interest with Noise Measured at 90 MHz Offset,
fLO_TX = 5.745 GHz
Rev. D | Page 32 of 36
Data Sheet
AD9361
THEORY OF OPERATION
GENERAL
The AD9361 is a highly integrated radio frequency (RF)
transceiver capable of being configured for a wide range of
applications. The device integrates all RF, mixed signal, and
digital blocks necessary to provide all transceiver functions in a
single device. Programmability allows this broadband transceiver
to be adapted for use with multiple communication standards,
including frequency division duplex (FDD) and time division
duplex (TDD) systems. This programmability also allows the
device to be interfaced to various baseband processors (BBPs) using
a single 12-bit parallel data port, dual 12-bit parallel data ports,
or a 12-bit low voltage differential signaling (LVDS) interface.
The AD9361 also provides self-calibration and automatic gain
control (AGC) systems to maintain a high performance level
under varying temperatures and input signal conditions. In
addition, the device includes several test modes that allow system
designers to insert test tones and create internal loopback modes
that can be used by designers to debug their designs during
prototyping and optimize their radio configuration for a
specific application.
RECEIVER
The receiver section contains all blocks necessary to receive RF
signals and convert them to digital data that is usable by a BBP.
There are two independently controlled channels that can receive
signals from different sources, allowing the device to be used in
multiple input, multiple output (MIMO) systems while sharing
a common frequency synthesizer.
Each channel has three inputs that can be multiplexed to the
signal chain, making the AD9361 suitable for use in diversity
systems with multiple antenna inputs. The receiver is a direct
conversion system that contains a low noise amplifier (LNA),
followed by matched in-phase (I) and quadrature (Q) amplifiers,
mixers, and band shaping filters that down convert received
signals to baseband for digitization. External LNAs can also be
interfaced to the device, allowing designers the flexibility to
customize the receiver front end for their specific application.
Gain control is achieved by following a preprogrammed gain
index map that distributes gain among the blocks for optimal
performance at each level. This can be achieved by enabling the
internal AGC in either fast or slow mode or by using manual
gain control, allowing the BBP to make the gain adjustments as
needed. Additionally, each channel contains independent RSSI
measurement capability, dc offset tracking, and all circuitry
necessary for self-calibration.
The receivers include 12-bit, sigma-delta (Σ-Δ) ADCs and
adjustable sample rates that produce data streams from the received
signals. The digitized signals can be conditioned further by a series
of decimation filters and a fully programmable 128-tap FIR filter
with additional decimation settings. The sample rate of each
digital filter block is adjustable by changing decimation factors
to produce the desired output data rate.
TRANSMITTER
The transmitter section consists of two identical and independently
controlled channels that provide all digital processing, mixed
signal, and RF blocks necessary to implement a direct conversion
system while sharing a common frequency synthesizer. The digital
data received from the BBP passes through a fully programmable
128-tap FIR filter with interpolation options. The FIR output is
sent to a series of interpolation filters that provide additional
filtering and data rate interpolation prior to reaching the DAC.
Each 12-bit DAC has an adjustable sampling rate. Both the I
and Q channels are fed to the RF block for upconversion.
When converted to baseband analog signals, the I and Q signals are
filtered to remove sampling artifacts and fed to the upconversion
mixers. At this point, the I and Q signals are recombined and
modulated on the carrier frequency for transmission to the
output stage. The combined signal also passes through analog
filters that provide additional band shaping, and then the signal
is transmitted to the output amplifier. Each transmit channel
provides a wide attenuation adjustment range with fine granularity
to help designers optimize signal-to-noise ratio (SNR).
Self-calibration circuitry is built into each transmit channel to
provide automatic real-time adjustment. The transmitter block
also provides a TX monitor block for each channel. This block
monitors the transmitter output and routes it back through an
unused receiver channel to the BBP for signal monitoring. The
TX monitor blocks are available only in TDD mode operation
while the receiver is idle.
CLOCK INPUT OPTIONS
The AD9361 operates using a reference clock that can be provided
by two different sources. The first option is to use a dedicated
crystal with a frequency between 19 MHz and 50 MHz connected
between the XTALP and XTALN pins. The second option is to
connect an external oscillator or clock distribution device (such as
the AD9548) to the XTALN pin (with the XTALP pin remaining
unconnected). If an external oscillator is used, the frequency
can vary between 10 MHz and 80 MHz. This reference clock
is used to supply the synthesizer blocks that generate all data
clocks, sample clocks, and local oscillators inside the device.
Errors in the crystal frequency can be removed by using the
digitally programmable digitally controlled crystal oscillator
(DCXO) function to adjust the on-chip variable capacitor. This
capacitor can tune the crystal frequency variance out of the
system, resulting in a more accurate reference clock from which
all other frequency signals are generated. This function can also
be used with on-chip temperature sensing to provide oscillator
frequency temperature compensation during normal operation.
Rev. D | Page 33 of 36
AD9361
Data Sheet
SYNTHESIZERS
RX_FRAME Signal
RF PLLs
The device generates an RX_FRAME output signal whenever the
receiver outputs valid data. This signal has two modes: level
mode (RX_FRAME stays high as long as the data is valid) and
pulse mode (RX_FRAME pulses with a 50% duty cycle). Similarly,
the BBP must provide a TX_FRAME signal that indicates the
beginning of a valid data transmission with a rising edge. Similar
to the RX_FRAME, the TX_FRAME signal can remain high
throughout the burst or it can be pulsed with a 50% duty cycle.
The AD9361 contains two identical synthesizers to generate the
required LO signals for the RF signal paths:—one for the receiver
and one for the transmitter. Phase-locked loop (PLL) synthesizers
are fractional-N designs incorporating completely integrated
voltage controlled oscillators (VCOs) and loop filters. In TDD
operation, the synthesizers turn on and off as appropriate for the
RX and TX frames. In FDD mode, the TX PLL and the RX PLL
can be activated simultaneously. These PLLs require no external
components.
BB PLL
The AD9361 also contains a baseband PLL synthesizer that is
used to generate all baseband related clock signals. These include
the ADC and DAC sampling clocks, the DATA_CLK signal (see
the Digital Data Interface section), and all data framing signals.
This PLL is programmed from 700 MHz to 1400 MHz based on
the data rate and sample rate requirements of the system.
DIGITAL DATA INTERFACE
The AD9361 data interface uses parallel data ports (P0 and P1)
to transfer data between the device and the BBP. The data ports can
be configured in either single-ended CMOS format or differential
LVDS format. Both formats can be configured in multiple
arrangements to match system requirements for data ordering and
data port connections. These arrangements include single port
data bus, dual port data bus, single data rate, double data rate,
and various combinations of data ordering to transmit data
from different channels across the bus at appropriate times.
Bus transfers are controlled using simple hardware handshake
signaling. The two ports can be operated in either bidirectional
(TDD) mode or in full duplex (FDD) mode where half the bits
are used for transmitting data and half are used for receiving data.
The interface can also be configured to use only one of the data
ports for applications that do not require high data rates and
prefer to use fewer interface pins.
DATA_CLK Signal
RX data supplies the DATA_CLK signal that the BBP can use
when receiving the data. The DATA_CLK can be set to a rate that
provides single data rate (SDR) timing where data is sampled on
each rising clock edge, or it can be set to provide double data rate
(DDR) timing where data is captured on both rising and falling
edges. This timing applies to operation using either a single port
or both ports.
FB_CLK Signal
For transmit data, the interface uses the FB_CLK signal as the
timing reference. FB_CLK allows source synchronous timing
with rising edge capture for burst control signals and either
rising edge (SDR mode) or both edge capture (DDR mode) for
transmit signal bursts. The FB_CLK signal must have the same
frequency and duty cycle as DATA_CLK.
ENABLE STATE MACHINE
The AD9361 transceiver includes an enable state machine (ENSM)
that allows real-time control over the current state of the device.
The device can be placed in several different states during normal
operation, including
•
•
•
•
•
•
Wait—power save, synthesizers disabled
Sleep—wait with all clocks/BB PLL disabled
TX—TX signal chain enabled
RX—RX signal chain enabled
FDD—TX and RX signal chains enabled
Alert—synthesizers enabled
The ENSM has two possible control methods: SPI control and
pin control.
SPI Control Mode
In SPI control mode, the ENSM is controlled asynchronously
by writing SPI registers to advance the current state to the next
state. SPI control is considered asynchronous to the DATA_CLK
because the SPI_CLK can be derived from a different clock
reference and can still function properly. The SPI control
ENSM method is recommended when real-time control of the
synthesizers is not necessary. SPI control can be used for realtime control as long as the BBIC has the ability to perform
timed SPI writes accurately.
Pin Control Mode
In pin control mode, the enable function of the ENABLE pin
and the TXNRX pin allow real-time control of the current state.
The ENSM allows TDD or FDD operation depending on the
configuration of the corresponding SPI register. The ENABLE
and TXNRX pin control method is recommended if the BBIC
has extra control outputs that can be controlled in real time,
allowing a simple 2-wire interface to control the state of the
device. To advance the current state of the ENSM to the next
state, the enable function of the ENABLE pin can be driven by
either a pulse (edge detected internally) or a level.
When a pulse is used, it must have a minimum pulse width of
one FB_CLK cycle. In level mode, the ENABLE and TXNRX
pins are also edge detected by the AD9361 and must meet the
same minimum pulse width requirement of one FB_CLK cycle.
Rev. D | Page 34 of 36
Data Sheet
AD9361
In FDD mode, the ENABLE and TXNRX pins can be remapped
to serve as real-time RX and TX data transfer control signals. In
this mode, the ENABLE pin enables or disables the receive signal
path, and the TXNRX pin enables or disables the transmit signal
path. In this mode, the ENSM is removed from the system for
control of all data flow by these pins.
SPI INTERFACE
The AD9361 uses a serial peripheral interface (SPI) to
communicate with the BBP. This interface can be configured
as a 4-wire interface with dedicated receive and transmit ports,
or it can be configured as a 3-wire interface with a bidirectional
data communication port. This bus allows the BBP to set all device
control parameters using a simple address data serial bus protocol.
AUXILIARY CONVERTERS
AUXADC
The AD9361 contains an auxiliary ADC that can be used to
monitor system functions such as temperature or power output.
The converter is 12 bits wide and has an input range of 0 V to
1.25 V. When enabled, the ADC is free running. SPI reads provide
the last value latched at the ADC output. A multiplexer in front
of the ADC allows the user to select between the AUXADC input
pin and a built-in temperature sensor.
AUXDAC1 and AUXDAC2
The AD9361 contains two identical auxiliary DACs that can
provide power amplifier (PA) bias or other system functionality.
The auxiliary DACs are 10 bits wide, have an output voltage range
of 0.5 V to VDD_GPO − 0.3 V, a current drive of 10 mA, and
can be directly controlled by the internal enable state machine.
Write commands follow a 24-bit format. The first six bits are
used to set the bus direction and number of bytes to transfer.
The next 10 bits set the address where data is to be written. The
final eight bits are the data to be transferred to the specified register
address (MSB to LSB). The AD9361 also supports an LSB-first
format that allows the commands to be written in LSB to MSB
format. In this mode, the register addresses are incremented for
multibyte writes.
The AD9361 must be powered by the following three supplies:
the analog supply (VDDD1P3_DIG/VDDAx = 1.3 V), the
interface supply (VDD_INTERFACE = 1.8 V), and the GPO
supply (VDD_GPO = 3.3 V).
Read commands follow a similar format with the exception that
the first 16 bits are transferred on the SPI_DI pin and the final
eight bits are read from the AD9361, either on the SPI_DO pin
in 4-wire mode or on the SPI_DI pin in 3-wire mode.
For applications requiring optimal noise performance, it is
recommended that the 1.3 V analog supply be split and sourced
from low noise, low dropout (LDO) regulators. Figure 74 shows
the recommended method.
POWERING THE AD9361
3.3V
CONTROL PINS
ADP2164
Control Inputs (CTRL_IN[3:0])
1.8V
ADP1755
1.3V_A
ADP1755
1.3V_B
Figure 74. Low Noise Power Solution for the AD9361
For applications where board space is at a premium, and
optimal noise performance is not an absolute requirement, the
1.3 V analog rail can be provided directly from a switcher, and a
more integrated power management unit (PMU) approach can
be adopted. Figure 75 shows this approach.
The AD9361 provides four edge detected control input pins. In
manual gain mode, the BBP can use these pins to change the gain
table index in real time. In transmit mode, the BBP can use two
of the pins to change the transmit gain in real time.
GPO PINS (GPO_3 TO GPO_0)
The AD9361 provides four, 3.3 V capable general-purpose logic
output pins: GPO_3, GPO_2, GPO_1, and GPO_0. These pins
can be used to control other peripheral devices such as regulators
and switches via the AD9361 SPI bus, or they can function as
slaves for the internal AD9361 state machine.
Rev. D | Page 35 of 36
ADP5040
1.2A
BUCK
ADP1755
1.3V
LDO
VDDD1P3_DIG/VDDAx
AD9361
300mA
LDO
1.8V
300mA
LDO
3.3V
VDD_INTERFACE
VDD_GPO
Figure 75. Space-Optimized Power Solution for the AD9361
10453-075
The AD9361 provides eight simultaneous real-time output signals
for use as interrupts to the BBP. These outputs can be configured to
output a number of internal settings and measurements that the
BBP can use when monitoring transceiver performance in different
situations. The control output pointer register selects what
information is output to these pins, and the control output enable
register determines which signals are activated for monitoring by
the BBP. Signals used for manual gain mode, calibration flags,
state machine states, and the ADC output are among the outputs
that can be monitored on these pins.
10453-074
Control Outputs (CTRL_OUT[7:0])
AD9361
Data Sheet
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
A1 BALL
CORNER
10.10
10.00 SQ
9.90
A1 BALL
CORNER
12 11 10 9 8
7 6
5
4
3
2
1
A
B
C
D
8.80 SQ
E
F
G
H
0.80
J
K
L
M
0.60
REF
TOP VIEW
BOTTOM VIEW
DETAIL A
1.70 MAX
DETAIL A
1.00 MIN
0.32 MIN
0.50
COPLANARITY
0.45
0.12
0.40
BALL DIAMETER
COMPLIANT TO JEDEC STANDARDS MO-275-EEAB-1.
11-18-2011-A
SEATING
PLANE
Figure 76. 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-144-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
AD9361BBCZ
AD9361BBCZ-REEL
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Z = RoHS Compliant Part.
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10453-0-11/13(D)
Rev. D | Page 36 of 36
Package Option
BC-144-7
BC-144-7