Material Content Data Sheet Sales Product Name SN7002N H6327 MA# MA000927870 Package PG-SOT23-3-5 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip noble metal non noble metal inorganic material non noble metal inorganic material non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal < 10% gold tin silicon chromium silicon titanium copper copper carbon black epoxy resin silicondioxide tin silver 7440-57-5 7440-31-5 7440-21-3 7440-47-3 7440-21-3 7440-32-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 28. August 2013 Weight [mg] 9.32 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.008 0.09 860 0.002 0.02 222 0.091 0.97 0.009 0.10 0.001 0.01 65 0.003 0.03 323 3.000 32.18 32.32 321774 323131 0.008 0.08 0.08 832 832 0.058 0.62 1.240 13.30 4.471 47.95 61.87 479461 618660 0.150 1.60 1.60 16048 16048 0.284 3.05 3.05 30502 1.08 9745 2. 3. 6187 133012 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 10827 969 Important Remarks: 1. Sum [ppm] 30502 1000000