Burr-Brown ADS8330IRSATG4 Low power, 16-bit, 1-mhz, single/dual unipolar input, analog-to-digital converters with serial interface Datasheet

 ADS8329
ADS8330
SLAS516 – DECEMBER 2006
LOW POWER, 16-BIT, 1-MHz, SINGLE/DUAL UNIPOLAR INPUT, ANALOG-TO-DIGITAL
CONVERTERS WITH SERIAL INTERFACE
FEATURES
APPLICATIONS
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2.7-V to 5.5-V Analog Supply, Low Power:
– 15.5 mW (1 MHz, +VA = 3 V, +VBD = 1.8 V)
1-MHz Sampling Rate 3 V ≤ +VA ≤ 5.5 V,
900-kHz Sampling Rate 2.7 V ≤ +VA ≤ 3 V
Excellent DC Performance
– ±1.0 LSB Typ, ±1.75 LSB Max INL
– ±0.5 LSB Typ, ±1 LSB Max DNL
– 16-Bit NMC Over Temperature
– ±0.5 mV Max Offset Error at 3 V
– ±1 mV Max Offset Error at 5 V
Excellent AC Performance at fi = 100 kHz with
92 dB SNR, 102 dB SFDR, –102 dB THD
Built-In Conversion Clock (CCLK)
1.65 V to 5.5 V I/O Supply
– SPI/DSP Compatible Serial
– SCLK up to 50 MHz
Comprehensive Power-Down Modes:
– Deep Powerdown
– Nap Powerdown
– Auto Nap Powerdown
Unipolar Input Range: 0 V to Vref
Software Reset
Global CONVST (Independent of CS)
Programmable Status/Polarity EOC/INT
16-Pin 4 x 4 QFN Package
Multi-Chip Daisy Chain Mode
Programmable TAG Bit Output
Auto/Manual Channel Select Mode (ADS8330)
ADS8330
ADS8329
+IN1
NC
+IN0
COM
+IN
−IN
REF+
REF−
Communications
Transducer Interface
Medical Instruments
Magnetometers
Industrial Process Control
Data Acquisition Systems
Automatic Test Equipment
DESCRIPTION
The ADS8329 is a low power, 16-bit, 1-MSPS
analog-to-digital converter with a unipolar input. The
device includes a 16-bit capacitor-based SAR A/D
converter with inherent sample and hold.
The ADS8330 is based on the same core and
includes a 2-to-1 input MUX with programmable
option of TAG bit output. Both the ADS8329 and
ADS8330 offer a high-speed, wide voltage serial
interface and are capable of chain mode operation
when multiple converters are used.
These converters are available in a 4x4 QFN
package and are fully specified for operation over the
industrial –40°C to +85°C temperature range.
Low Power, High-Speed SAR Converter Family
Type/Speed
16 Bit Pseudo-Diff
1 MHz
Single
ADS8327
ADS8329
Dual
ADS8328
ADS8330
OUTPUT
LATCH
and
3−STATE
DRIVER
SAR
+
_
500 kHz
SDO
CDAC
COMPARATOR
OSC
CONVERSION
and
CONTROL
LOGIC
FS/CS
SCLK
SDI
CONVST
EOC/INT/CDI
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
ADS8329
ADS8330
www.ti.com
SLAS516 – DECEMBER 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
MODEL
MAXIMUM
INTEGRAL
LINEARITY
(LSB)
MAXIMUM
DIFFERENTIAL
LINEARITY
(LSB)
MAXIMUM
OFFSET
ERROR
(mV)
PACKAGE
TYPE
PACKAGE
DESIGNATOR
TEMPERATURE
RANGE
ADS8329I
±2.5
–1/+2
±0.8
4X4 QFN-16
RSA
–40°C to 85°C
ADS8329IB
ADS8330I
ADS8330IB
(1)
±1.75
±2.5
±1
–1/+2
±1.75
±1
±0.5
±0.8
±0.5
4X4 QFN-16
4X4 QFN-16
4X4 QFN-16
RSA
RSA
RSA
ORDERING
INFORMATION
TRANSPORT
MEDIA
QUANTITY
ADS8329IRSAT
Small tape and
reel 250
ADS8329IRSAR
Tape and reel
3000
ADS8329IBRSAT
Small tape and
reel 250
ADS8329IBRSAR
Tape and reel
3000
ADS8330IRSAT
Small tape and
reel 250
ADS8330IRSAR
Tape and reel
3000
ADS8330IBRSAT
Small tape and
reel 250
ADS8330IBRSAR
Tape and reel
3000
–40°C to 85°C
–40°C to 85°C
–40°C to 85°C
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1)
UNIT
Voltage
Voltage
+IN to AGND
–0.3 V to +VA + 0.3 V
–IN to AGND
–0.3 V to +VA + 0.3 V
+VA to AGND
–0.3 V to 7 V
+VBD to BDGND
–0.3 V to 7 V
AGND to BDGND
–0.3 V to 0.3 V
Digital input voltage to BDGND
–0.3 V to +VBD + 0.3 V
Digital output voltage to BDGND
–0.3 V to +VBD + 0.3 V
TA
Operating free-air temperature range
–40°C to 85°C
Tstg
Storage temperature range
–65°C to 150°C
Junction temperature (TJ max)
150°C
Lead temperature, soldering
4x4 QFN-16
Package
Vapor phase (60 sec)
Infrared (15 sec)
Power dissipation
2
220°C
(TJMax - TA)/θJA
θJA thermal impedance
(1)
215°C
47°C/W
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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ADS8329
ADS8330
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SLAS516 – DECEMBER 2006
SPECIFICATIONS
TA = –40°C to 85°C, +VA = 5 V, +VBD = +5.5 V to +1.65 V, Vref = 5 V, fSAMPLE = 1 MHz (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
ANALOG INPUT
Full-scale input voltage
(1)
Absolute input voltage
+IN – (–IN) or (+INx – COM)
0
+Vref
+IN, +IN0, +IN1
AGND – 0.2
+VA + 0.2
–IN or COM
AGND – 0.2
AGND + 0.2
Input capacitance
Input leakage current
Input channel isolation, ADS8330 only
40
No ongoing conversion,
DC Input
-1
At dc
109
VI = ±1.25 Vpp at 50 kHz
101
V
45
pF
1
nA
dB
SYSTEM PERFORMANCE
Resolution
16
No missing codes
INL
Integral
linearity
ADS8329IB, ADS8330IB
DNL
Differential
linearity
ADS8329IB, ADS8330IB
EO
Offset error (3)
ADS8329I, ADS8330I
ADS8329I, ADS8330I
ADS8329IB, ADS8330IB
ADS8329I, ADS8330I
Offset error drift
EG
±1.2
1.75
-2.5
±1.5
2.5
–1
±0.4
1
–1
±0.5
2
–1
±0.27
1
–1.25
±0.8
1.25
0.4
– 0.25
Gain error drift
Common mode rejection ratio
Power supply rejection ratio
–0.04
At dc
70
VI = 0.4 Vpp at 1 MHz
50
At FFFFh output code (3)
LSB (2)
LSB (2)
mV
PPM/°C
0.25
0.75
Noise
PSRR
Bits
–1.75
FSR = 5 V
Gain error
CMRR
Bits
16
%FSR
PPM/°C
dB
33
µV RMS
78
dB
18
CCLK
SAMPLING DYNAMICS
tCONV
tSAMPLE1
tSAMPLE2
Conversion time
Acquisition time
Manual trigger
Auto trigger
3
Throughput rate
(1)
(2)
(3)
CCLK
3
1
MHz
Aperture delay
5
ns
Aperture jitter
10
ps
Step response
100
ns
Overvoltage recovery
100
ns
Ideal input span, does not include gain or offset error.
LSB means least significant bit
Measured relative to an ideal full-scale input [+IN – (–IN)] of 4.096 V when +VA = 5 V.
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ADS8330
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SLAS516 – DECEMBER 2006
SPECIFICATIONS (continued)
TA = –40°C to 85°C, +VA = 5 V, +VBD = +5.5 V to +1.65 V, Vref = 5 V, fSAMPLE = 1 MHz (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DYNAMIC CHARACTERISTICS
THD
Total harmonic distortion
SNR
Signal-to-noise ratio
(4)
VIN = 5 Vpp at 10 kHz
–102
VIN = 5 Vpp at 100 kHz
–95
VIN = 5 Vpp at 10 kHz
SINAD
Signal-to-noise + distortion
SFDR
Spurious free dynamic range
VIN = 5 Vpp at 100 kHz
dB
93
ADS8329/30IB
90
ADS8329/30I
92
dB
90
VIN = 5 Vpp at 10 kHz
92
VIN = 5 Vpp at 100 kHz
90
VIN = 5 Vpp at 10 kHz
105
VIN = 5 Vpp at 100 kHz
97
-3dB Small signal bandwidth
dB
dB
30
MHz
CLOCK
Internal conversion clock frequency
SCLK External serial clock
21
22.9
Used as I/O clock only
As I/O clock and conversion clock
24.5
50
1
42
MHz
MHz
EXTERNAL VOLTAGE REFERENCE INPUT
Vref
Input
reference
range
Resistance
Vref[REF+ – (REF–)]
5.5 V ≥ +VA ≥ 4.5 V
(REF–) – AGND
(5)
0.3
5
–0.1
Reference input
5
0.1
40
V
kΩ
DIGITAL INPUT/OUTPUT
Logic family — CMOS
VIH
High-level input voltage
5.5 V ≥ +VBD ≥ 4.5 V
0.65 × (+VBD)
+VBD + 0.3
V
0.35 ×
(+VBD)
V
50
nA
VIL
Low-level input voltage
5.5 V ≥ +VBD ≥ 4.5 V
–0.3
II
Input current
VI = +VBD or BDGND
-50
Ci
Input capacitance
5
VOH
High-level output voltage
5.5 V ≥ +VBD ≥ 4.5 V,
IO = 100 µA
VOL
Low-level output voltage
5.5 V ≥ +VBD ≥ 4.5 V,
IO = 100 µA
CO
Output capacitance
CL
Load capacitance
pF
+VBD – 0.6
+VBD
V
0
0.4
V
5
pF
30
pF
Data format — straight binary
POWER SUPPLY REQUIREMENTS
Power supply
voltage
+VBD
1.65
3.3
5.5
V
4.5
5
5.5
V
1-MHz Sample rate
7.0
7.8
Nap mode
0.3
0.5
4
50
+VA
Supply current
PD Mode
Buffer I/O supply current
Power dissipation
1 MSPS
1.7
+VA = 5 V, +VBD = 5 V
44
48
+VA = 5 V, +VBD = 1.8 V
35
39.5
mA
nA
mA
mW
TEMPERATURE RANGE
TA
(4)
(5)
4
Operating free-air temperature
–40
Calculated on the first nine harmonics of the input frequency
Can vary ±30%
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85
°C
ADS8329
ADS8330
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SLAS516 – DECEMBER 2006
SPECIFICATIONS
TA = –40°C to 85°C, +VBD = +VA × 1.5 to +1.65 V, Vref = 2.5 V, fSAMPLE = 1 MHz for 3 V ≤ +VA ≤ 3.6 V, fSAMPLE = 900 kHz for
3 V < +VA ≤ 2.7 V using external clock (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
ANALOG INPUT
Full-scale input voltage
(1)
Absolute input voltage
+IN – (–IN) or (+INx – COM)
0
+Vref
+IN, +IN0, +IN1
AGND – 0.2
+VA + 0.2
–IN or COM
AGND – 0.2
AGND + 0.2
Input capacitance
40
Input leakage current
Input channel isolation, ADS8330 only
No ongoing conversion,
DC Input
-1
At dc
108
VI = ±1.25 Vpp at 50 kHz
101
V
45
pF
1
nA
dB
SYSTEM PERFORMANCE
Resolution
16
No missing codes
INL
Integral linearity
ADS8329IB,
ADS8330IB
ADS8329I, ADS8330I
Differential
linearity
DNL
Offset error (3)
EO
ADS8329IB,
ADS8330IB
ADS8329I, ADS8330I
ADS8329IB,
ADS8330IB
ADS8329I, ADS8330I
Offset error drift
EG
±1
1.75
–2.5
±1.5
2.5
–1
±0.5
1
–1
±0.8
2
– 0.5
±0.05
0.5
–0.8
±0.2
0.8
– 0.25
–0.04
0.8
Gain error drift
Common mode rejection ratio
At dc
70
VI = 0.4 Vpp at 1 MHz
50
Power supply rejection ratio
At FFFFh output
code (3)
LSB (2)
LSB (2)
mV
PPM/°C
0.25
0.5
Noise
PSRR
Bits
–1.75
FSR = 2.5 V
Gain error
CMRR
Bits
16
%FSR
PPM/°C
dB
33
µV RMS
78
dB
18
CCLK
SAMPLING DYNAMICS
tCONV
tSAMPLE1
tSAMPLE2
Conversion time
Acquisition time
Manual trigger
Auto trigger
3
Throughput rate
(1)
(2)
(3)
CCLK
3
1
MHz
Aperture delay
5
ns
Aperture jitter
10
ps
Step response
100
ns
Overvoltage recovery
100
ns
Ideal input span, does not include gain or offset error.
LSB means least significant bit
Measured relative to an ideal full-scale input [+IN – (–IN)] of 2.5 V when +VA = 3 V.
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ADS8330
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SLAS516 – DECEMBER 2006
SPECIFICATIONS (continued)
TA = –40°C to 85°C, +VBD = +VA × 1.5 to +1.65 V, Vref = 2.5 V, fSAMPLE = 1 MHz for 3 V ≤ +VA ≤ 3.6 V, fSAMPLE = 900 kHz for
3 V < +VA ≤ 2.7 V using external clock (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DYNAMIC CHARACTERISTICS
(4)
THD
Total harmonic distortion
SNR
Signal-to-noise ratio
SINAD
Signal-to-noise + distortion
SFDR
Spurious free dynamic range
VIN = 2.5 Vpp at 10 kHz
–102
VIN = 2.5 Vpp at 100 kHz
–93
VIN = 2.5 Vpp at 10 kHz
89
VIN = 2.5 Vpp at 100 kHz
88
VIN = 2.5 Vpp at 10 kHz
dB
dB
88.5
VIN = 2.5 Vpp at 100 kHz
dB
88
VIN = 2.5 Vpp at 10 kHz
104
VIN = 2.5 Vpp at 100 kHz
94.2
-3dB Small signal bandwidth
dB
30
MHz
CLOCK
Internal conversion clock frequency
SCLK External serial clock
21
22.3
Used as I/O clock only
As I/O clock and conversion clock
23.5
42
1
42
MHz
MHz
EXTERNAL VOLTAGE REFERENCE INPUT
Vref
Input reference
range
Resistance
Vref[REF+ – (REF–)]
3.6 V ≥ +VA ≥ 2.7 V
(REF–) – AGND
(5)
2.475
3
–0.1
0.1
Reference input
40
V
kΩ
DIGITAL INPUT/OUTPUT
Logic family — CMOS
VIH
High-level input voltage
(+VA × 1.5) V ≥ +VBD ≥ 1.65 V
0.65 × (+VBD)
+VBD + 0.3
VIL
Low-level input voltage
(+VA × 1.5) V ≥ +VBD ≥ 1.65 V
–0.3
0.35 × (+VBD)
V
II
Input current
VI = +VBD or BDGND
-50
50
nA
Ci
Input capacitance
5
VOH
High-level output voltage
(+VA × 1.5) V ≥ +VBD ≥ 1.65 V,
IO = 100 µA
VOL
Low-level output voltage
(+VA × 1.5) V ≥ +VBD ≥ 1.65 V,
IO = 100 µA
CO
Output capacitance
CL
Load capacitance
V
pF
+VBD – 0.6
+VBD
V
0
0.4
V
5
pF
30
pF
1.5 × (+VA)
V
Data format — straight binary
POWER SUPPLY REQUIREMENTS
+VBD
Power supply
voltage
+VA
1.65
fs ≤ 1 MHz
fs ≤ 900 kHz
3.6
2.7
3.6
1-MHz Sample rate,
3 V ≤ +VA ≤ 3.6 V
Supply current
5.1
4.84
Nap mode
0.25
0.4
2
50
Power dissipation
1 MSPS, +VBD = 1.8 V
0.05
+VBD = 1.8 V, 3 V ≤ +VA ≤ 3.6 V
15.5
+VBD = 1.8 V, 2.7 V ≤ +VA ≤ 3 V
13.2
V
6.1
900-kHz Sample rate,
2.7 V ≤ +VA ≤ 3 V
PD Mode
Buffer I/O supply current
+VA
3
mA
nA
mA
19
mW
TEMPERATURE RANGE
TA
(4)
(5)
6
Operating free-air temperature
–40
Calculated on the first nine harmonics of the input frequency
Can vary ±30%
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85
°C
ADS8329
ADS8330
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SLAS516 – DECEMBER 2006
TIMING CHARACTERISTICS
All specifications typical at –40°C to 85°C, +VA = +VBD = 5 V
(1) (2)
PARAMETER
MIN
TYP
MAX
UNIT
21
MHz
fCCLK
Frequency, conversion clock, CCLK,
fCCLK = 1/2 fSCLK
tsu(CSF-EOC)
Setup time, falling edge of CS to EOC
1
CCLK
th(CSF-EOC)
Hold time, falling edge of CS to EOC
0
ns
twL(CONVST)
Pulse duration, CONVST low
40
ns
tsu(CSF-EOS)
Setup time, falling edge of CS to EOS
20
ns
th(CSF-EOS)
Hold time, falling edge of CS to EOS
20
ns
tsu(CSR-EOS)
Setup time, rising edge of CS to EOS
20
ns
th(CSR-EOS)
Hold time, rising edge of CS to EOS
20
tsu(CSF-SCLK1R)
Setup time, falling edge of CS to SCLK
5
tc(SCLK) - 5
ns
twL(SCLK)
Pulse duration, SCLK low
8
tc(SCLK) - 8
ns
twH(SCLK)
Pulse duration, SCLK high
8
tc(SCLK) - 8
ns
External
0.5
Internal
21
I/O Clock only
I/O and conversion clock
tc(SCLK)
Cycle time, SCLK
I/O Clock, chain mode
I/O and conversion clock,
chain mode
22.9
24.5
ns
20
23.8
2000
ns
20
23.8
2000
td(SCLKF-SDOINVALID)
Delay time, falling edge of SCLK to SDO
invalid
10-pF Load
td(SCLKF-SDOVALID)
Delay time, falling edge of SCLK to SDO
valid
10-pF Load
12
ns
td(CSF-SDOVALID)
Delay time, falling edge of CS to SDO
valid, SDO MSB output
10-pF Load
12
ns
tsu(SDI-SCLKF)
Setup time, SDI to falling edge of SCLK
8
ns
th(SDI-SCLKF)
Hold time, SDI to falling edge of SCLK
4
ns
td(CSR-SDOZ)
Delay time, rising edge of CS/FS to SDO
3-state
tsu(lastSCLKF-CSR)
Setup time, last falling edge of SCLK
before rising edge of CS/FS
td(SDO-CDI)
Delay time, CDI high to SDO high in daisy
chain mode
(1)
(2)
5
ns
5
10
10-pF Load, chain mode
ns
ns
16
ns
All input signals are specified with tr = tf = 1.5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
See timing diagrams.
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ADS8330
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SLAS516 – DECEMBER 2006
TIMING CHARACTERISTICS
All specifications typical at –40°C to 85°C, +VA = 2.7 v, +VBD = 1.8 V (unless otherwise noted)
PARAMETER
MIN
TYP
MAX
External, 3 V ≤ +VA ≤ 3.6 V
0.5
21
External, 2.7 V ≤ +VA ≤ 3 V
0.5
18.9
Internal
21
UNIT
fCCLK
Frequency, conversion clock, CCLK,
fCCLK = 1/2 fSCLK
tsu(CSF-EOC)
Setup time, falling edge of CS to EOC
1
CCLK
th(CSF-EOC)
Hold time, falling edge of CS to EOC
0
ns
twL(CONVST)
Pulse duration, CONVST low
40
ns
tsu(CSF-EOS)
Setup time, falling edge of CS to EOS
20
ns
th(CSF-EOS)
Hold time, falling edge of CS to EOS
20
ns
tsu(CSR-EOS)
Setup time, rising edge of CS to EOS
20
ns
th(CSR-EOS)
Hold time, rising edge of CS to EOS
20
tsu(CSF-SCLK1R)
Setup time, falling edge of CS to SCLK
5
tc(SCLK) - 5
ns
twL(SCLK)
Pulse duration, SCLK low
8
tc(SCLK) - 8
ns
twH(SCLK)
Pulse duration, SCLK high
8
tc(SCLK) - 8
ns
tc(SCLK)
Cycle time, SCLK
22.3
MHz
23.5
ns
I/O Clock only
23.8
I/O and conversion clock,
3 V ≤ +VA ≤ 3.6 V
23.8
2000
I/O and conversion clock,
2.7 V ≤ +VA < 3 V
26.5
2000
I/O Clock, chain mode
23.8
I/O and conversion clock,
chain mode,
3 V ≤ +VA ≤ 3.6 V
23.8
2000
I/O and conversion clock,
chain mode,
2.7 V ≤ +VA < 3 V
26.5
2000
ns
td(SCLKF-SDOINVALID)
Delay time, falling edge of SCLK to SDO
invalid
10-pF Load
td(SCLKF-SDOVALID)
Delay time, falling edge of SCLK to SDO
valid
10-pF Load
23
ns
td(CSF-SDOVALID)
Delay time, falling edge of CS to SDO
valid, SDO MSB output
10-pF Load
23
ns
tsu(SDI-SCLKF)
Setup time, SDI to falling edge of SCLK
8
ns
th(SDI-SCLKF)
Hold time, SDI to falling edge of SCLK
4
ns
td(CSR-SDOZ)
Delay time, rising edge of CS/FS to SDO
3-state
tsu(lastSCLKF-CSR)
Setup time, last falling edge of SCLK
before rising edge of CS/FS
td(SDO-CDI)
Delay time, CDI high to SDO high in
daisy chain mode
(1)
(2)
8
(1) (2)
8
ns
8
10
10-pF Load, chain mode
All input signals are specified with tr = tf = 1.5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
See timing diagrams.
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ns
ns
23
ns
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ADS8330
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SLAS516 – DECEMBER 2006
PIN ASSIGNMENTS
REF−
AGND
COM
+IN0
13
16
15
14
13
NC
2
11
+VA
CONVST
3
10
EOC/INT/CDI
4
9
7
8
1
12
+IN1
NC
2
11
+VA
+VBD
CONVST
3
10
+VBD
SCLK
EOC/INT/CDI
4
9
SCLK
5
6
7
8
BDGND
6
REF+(REFIN)
SDO
5
SDO
RESERVED
BDGND
12
SDI
1
FS/CS
REF+(REFIN)
SDI
14
FS/CS
15
−IN
16
+IN
AGND
ADS8330
RSA PACKAGE
(TOP VIEW)
REF−
ADS8329
RSA PACKAGE
(TOP VIEW)
NC − No internal connection
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ADS8329 Terminal Functions
NAME
NO.
QFN
I/O
DESCRIPTION
AGND
15
–
Analog ground
BDGND
8
–
Interface ground
CONVST
3
I
Freezes sample and hold, starts conversion with next rising edge of internal clock
4
O
Status output. If programmed as EOC, this pin is low (default) when a conversion is in
progress. If programmed as an interrupt (INT), this pin is low for a preprogrammed duration
after the end of conversion and a valid data is to be output. The polarity of EOC or INT is
programmable. This pin can also be used as a chain data input when the device is operated
in chain mode.
5
I
Frame sync signal for TMS320 DSP serial interface or chip select input for SPI interface slave
select (SS-).
+IN
13
I
Non inverting input
-IN
14
I
Inverting input, usually connected to ground
NC
2
–
No connection.
REF+
1
I
External reference input.
REF-
16
I
Connect to AGND through individual via.
RESERVED
12
I
Connect to AGND or +VA
SCLK
9
I
Clock for serial interface
SDI
6
I
Serial data in
SDO
7
O
Serial data out
+VA
11
Analog supply, +2.7 V to +5.5 VDC.
+VBD
10
Interface supply
EOC/ INT/ CDI
FS/CS
ADS8330 Terminal Functions
NAME
AGND
NO.
QFN
I/O
DESCRIPTION
15
–
Analog ground
BDGND
8
–
Interface ground
COM
14
I
Common inverting input, usually connected to ground
CONVST
3
I
Freezes sample and hold, starts conversion with next rising edge of internal clock
4
O
Status output. If programmed as EOC, this pin is low (default) when a conversion is in
progress. If programmed as an interrupt (INT), this pin is low for a preprogrammed duration
after the end of conversion and a valid data is to be output. The polarity of EOC or INT is
programmable. This pin can also be used as a chain data input when the device is operated
in chain mode.
FS/CS
5
I
Frame sync signal for TMS320 DSP serial interface or chip select input for SPI interface
+IN1
12
I
Second noninverting input.
+IN0
13
I
First noninverting input
NC
2
–
No connection.
REF+
1
I
External reference input.
REF-
16
I
Connect to AGND through individual via.
SCLK
9
I
Clock for serial interface
SDI
6
I
Serial data in (conversion start and reset possible)
SDO
7
O
Serial data out
+VA
11
Analog supply, +2.7 V to +5.5 VDC.
+VBD
10
Interface supply
EOC/ INT/ CDI
10
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MANUAL TRIGGER / READ While Sampling
(use internal CCLK, EOC and INT polarity programmed as active low)
Nth
Nth
tCONV = 18 CCLKs
tSAMPLE1 = 3 CCLKs min
INT
(active low)
tSAMPLE1 = 3 CCLKs min
th(CSR-EOS)
th(CSF-EOC)
th(CSF-EOS)
EOS
twL(CONVST)
EOC
EOC
(active low)
EOS
EOC
CONVST
th(CSF-EOC)
tsu(CSF-EOC)
tsu(CSF-EOS)
CS/FS
1
SCLK
1 . . . . . . . . . . . . . . . . . . . . 16
SDO
td(CSR-EOS) = 20 ns min
Nth
Nth−1th
SDI
1101b
1101b
READ Result
READ Result
Figure 1. Timing for Conversion and Acquisition Cycles for Manual Trigger (Read while sampling)
AUTO TRIGGER / READ While Sampling
(use internal CCLK, EOC and INT polarity programmed as active low)
tCONV = 18 CCLKs
tSAMPLE2 = 3 CCLKs
INT
(active low)
Nth
EOS
EOC
(active low)
EOC
EOS
EOS
EOC
CONVST = 1
tSAMPLE2 = 3 CCLKs
tCONV = 18 CCLKs
th(CSF-EOS)
th(CSF-EOC)
tsu(CSF-EOS)
tsu(CSF-EOS)
CS/FS
SCLK
SDO
SDI
1 . . . . . . . . . . . . . . . . . . .16
1 . . . . . . . . . . . . . . . . . . .16
N − 1th
N − 1th
1110b. . . . . . . . . . . . . .
CONFIGURE
1101b
READ Result
th(CSF-EOC)
1
Nth
1101b
READ Result
Figure 2. Timing for Conversion and Acquisition Cycles for Autotrigger (Read while sampling)
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MANUAL TRIGGER / READ While Converting
(use internal CCLK, EOC and INT polarity programmed as active low)
N − 1th
Nth
Nth
EOC
(active low)
EOS
EOC
twL(CONVST)
EOS
CONVST
tCONV = 18 CCLKs
N + 1th
tSAMPLE1 = 3 CCLKs min
INT
(active low)
th(CSF-EOS)
tsu(CSR-EOS)
tsu(CSF-EOS)
CS/FS
tsu(CSF-EOC)
th(CSF-EOC)
SCLK
1
1 . . . . . . . . . . . . . . . . . . . .16
SDO
N th
N − 1th
1101b
SDI
1101b
READ Result
READ Result
Figure 3. Timing for Conversion and Acquisition Cycles for Manual Trigger (Read while converting)
AUTO TRIGGER / READ While Converting
(use internal CCLK, EOC and INT polarity programmed as active low)
tCONV = 18 CCLKs
th(CSF-EOS)
tsu(CSF-EOS)
th(CSR-EOS)
tSAMPLE2 = 3 CCLKs min
tsu(CSR-EOS)
th(CSF-EOS)
CS/FS
1 . . . . . . . . . . . . . . . . . . 16
SCLK
1 . . . . . . . . . . . . . . . . . . .16
1 . . . . . . . . . . . . . . . . . . 16
??
SDO
N−1 th
SDI
1110b . . . . . . . . . . . . . . .
CONFIGURE
tsu(CSR-EOS)
N th
N−1 th
1101b
READ Result
1101b
READ Result
Figure 4. Timing for Conversion and Acquisition Cycles for Autotrigger (Read while converting)
12
EOS
tCONV = 18 CCLKs
tSAMPLE2 = 3 CCLKs min
Nth
INT
(active low)
N + 1th
EOC
EOC
(active low)
EOS
EOS
EOC
CONVST = 1
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1
2
3
4
5
6
15
14
7
16
SCLK
tsu(CSF−SCLK1R)
tc(SCLK)
twH(SCLK)
twL(SCLK)
CS/FS
tsu(LastSCLK−CSR)
td(SCLKF−SDOINVALID)
td(CSR−SDOZ)
td(SCLKF−SDOVALID)
td(CSF−SDOVALID)
SDO
Hi−Z
MSB
MSB−1 MSB−2 MSB−3 MSB−4
MSB−5 MSB−6
LSB+2
LSB+1
LSB
th(SDI−SCLKF)
SDI
MSB
MSB−1 MSB−2 MSB−3 MSB−4 MSB−5
MSB−6
LSB+2
LSB+1
LSB
tsu(SDI−SCLKF)
Figure 5. Detailed SPI Transfer Timing
MANUAL TRIGGER / READ While Sampling
(use internal CCLK active high, EOC and INT active low, TAG enabled, auto channel select)
Nth CH1
Nth CH0
CONVST
twL(CONVST)
EOS
EOC
(active low)
EOC
twL(CONVST)
Nth CH0
Nth CH1
tCONV = 18 CCLKs
tCONV = 18 CCLKs
tSAMPLE1 = 3 CCLKs min
INT
(active low)
tsu(CSF-EOS)
th(CSF-EOC)
CS/FS
SCLK
1 . . . . . . . . . . . . . . . . . . . . . . . 16
17
1 . . . . . . . . . . . . . . . . . . . . . . . 16
17
td(CSR-EOS) = 20 ns MIN
SDO
Hi−Z
Nth CH0
N−1th CH1
TAG = 0
TAG = 1
SDI
1101b
READ Result
Hi−Z
1101b
READ Result
Figure 6. Simplified Dual Channel Timing
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TYPICAL CHARACTERISTICS
At –40°C to 85°C, Vref [REF+ – (REF–)] = 5 V when +VA = +VBD = 5 V or Vref [REF+ – (REF–)] = 2.5 V when
+VA = +VBD = 3 V, fSCLK = 42 MHz, or Vref = 2.5 when +VA = +VBD = 2.7 V, fSCLK = 37.8 MHz, fi = DC for DC
curves, fi = 100 kHz for AC curves with 5-V supply and fi = 10 kHz for AC curves with 3-V supply (unless
otherwise noted)
CROSSTALK
vs
FREQUENCY
DIFFERENTIAL NONLINEARITY
vs
FREE-AIR TEMPERATURE
110
1
105
0.8
INTEGRAL NONLINEARITY
vs
FREE-AIR TEMPERATURE
2
+VA = 5 V
95
+VA = 5 V
INL - LSB
DNL - LSB
Crosstalk -dB
1.5
100
+VA = 3 V
0.6
+VA = 3 V
1
0.4
90
+VA = 5 V
0.5
0.2
85
+VA = 3 V
0
-40 -25
80
0
50
100
150
f - Frequency - kHz
200
-10
5
20
35
50
65
0
-40
80
TA - Free-Air Temperature - °C
-25
-10 5
20 35 50 65
TA - Free-Air Temperature - °C
80
Figure 7.
Figure 8.
Figure 9.
DIFFERENTIAL NONLINEARITY
vs
EXTERNAL CLOCK FREQUENCY
INTEGRAL NONLINEARITY
vs
EXTERNAL CLOCK FREQUENCY
DIFFERENTIAL NONLINEARITY
vs
EXTERNAL CLOCK FREQUENCY
2
1
1
+VA = 5 V
+VA = 5 V
+VA = 3 V
1.5
MAX
1
0.5
MAX
MAX
0.5
0
MIN
DNL - LSB
INL - LSB
DNL - LSB
0.5
0
-0.5
MIN
0
MIN
-1
-0.5
-0.5
-1.5
-1
0.1
1
10
External Clock Frequency - MHz
Figure 10.
14
100
-2
0.1
10
1
External Clock Frequency - MHz
Figure 11.
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100
-1
0.1
1
10
External Clock Frequency - MHz
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
INTEGRAL NONLINEARITY
vs
EXTERNAL CLOCK FREQUENCY
OFFSET VOLTAGE
vs
FREE-AIR TEMPERATURE
2
OFFSET VOLTAGE
vs
SUPPLY VOLTAGE
1
1
+VA = 3 V
1.5
0.8
MAX
Offset Voltage - mV
INL - LSB
0.5
0
-0.5
MIN
Offset Voltage - mV
0.5
1
+VA = 5 V
0
+VA = 3 V
0.6
0.4
-0.5
-1
0.2
-1.5
1
10
External Clock Frequency - MHz
-1
-40
100
-25
-10
5
20 35 50 65
TA - Free-Air Temperature - °C
GAIN ERROR
vs
FREE-AIR TEMPERATURE
GAIN ERROR
vs
SUPPLY VOLTAGE
POWER SUPPLY REJECTION
RATIO
vs
SUPPLY RIPPLE FREQUENCY
0.10
-80
Gain Error - %FSR
Gain Error - %FSR
+VA = 5 V
-0.04
+VA = 3 V
-0.06
0
-0.05
-0.08
-25 -10
5
20 35 50 65
TA - Free-Air Temperature - °C
-0.10
2.7
80
3.2
3.7
4.2
4.7
-78
-76
-74
+VA = 5 V
-72
+VA = 3 V
-70
5.2
0
20
+VA - Supply Voltage - V
40
60
f - Frequency - kHz
80
100
Figure 16.
Figure 17.
Figure 18.
SIGNAL-TO-NOISE RATIO
vs
INPUT FREQUENCY
SIGNAL-TO-NOISE AND
DISTORTION
vs
INPUT FREQUENCY
TOTALHARMONIC DISTORTION
vs
INPUT FREQUENCY
93
+VA = 5 V
91
+VA = 3 V
87
85
20
40
60
80
fi - Input Frequency - kHz
Figure 19.
100
-90
95
THD - Total Harmonic Distortion - dB
SINAD - Signal-To-Noise and Distortion - dB
95
SNR - Signal-To-Noise Ratio - dB
5.2
Figure 15.
0.05
0
3.7
4.2
4.7
+VA - Supply Voltage - V
Figure 14.
-0.02
89
3.2
Figure 13.
0
-0.10
-40
0
2.7
80
PSRR - Power Supply Rejection Ratio - dB
-2
0.1
93
+VA = 5 V
91
89
+VA = 3 V
87
+VA = 3 V
-95
+VA = 5 V
-100
-105
-110
85
0
20
40
60
80
fi - Input Frequency - kHz
Figure 20.
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100
0
20
40
60
80
fi - Input Frequency - kHz
100
Figure 21.
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TYPICAL CHARACTERISTICS (continued)
SPURIOUS FREE DYNAMIC RANGE
vs
INPUT FREQUENCY
fi = 10 kHz
106
104
102
100
+VA = 5 V
98
96
+VA = 3 V
94
95
90
+VA = 3 V
+VA = 5 V
85
80
75
92
70
90
0
20
40
60
80
fi - Input Frequency - kHz
0
100
2
3
Full Scale Range - V
4
5
fi = 10 kHz
95
90
+VA = 3 V
+VA = 5 V
85
80
75
70
0
1
3
2
Full Scale Range - V
4
5
Figure 23.
Figure 24.
TOTAL HARMONIC DISTORTION
vs
FULL SCALE RANGE
SPURIOUS FREE DYNAMIC RANGE
vs
FULL SCALE RANGE
TOTAL HARMONIC DISTORTION
vs
FREE-AIR TEMPERATURE
-85
-90
-95
+VA = 5 V
-100
+VA = 3 V
-105
-110
1
0
2
3
Full Scale Range - V
4
5
110
-90
fi = 10 kHz
THD - Total Harmonic Distortion - dB
SFDR - Spurious Free Dynamic Range - dB
fi = 10 kHz
105
+VA = 3 V
+VA = 5 V
100
95
90
85
80
0
1
2
3
Full Scale Range - V
4
+VA = 5 V
-95
-100
+VA = 3 V
-105
-110
-40 -25
5
-10 5
20
35 50 65
TA - Free-Air Temperature - °C
Figure 25.
Figure 26.
Figure 27.
SPURIOUS FREE DYNAMIC RANGE
vs
FREE-AIR TEMPERATURE
SIGNAL-TO-NOISE RATIO
vs
FREE-AIR TEMPERATURE
SIGNAL-TO-NOISE AND
DISTORTION
vs
FREE-AIR TEMPERATURE
105
+VA = 3 V
100
+VA = 5 V
95
90
-40
-25
-10
5
20
35 50 65
TA - Free-Air Temperature - °C
Figure 28.
80
93
SINAD - Signal-To-Noise and Distortion - dB
95
110
SNR - Signal-To-Noise Ratio - dB
SFDR - Spurious Free Dynamic Range - dB
1
100
Figure 22.
-80
THD - Total Harmonic Distortion - dB
SINAD - Signal-To-Noise and Distortion - dB
100
108
SNR - Signal-To-Noise Ratio - dB
SFDR - Spurious Free Dynamic Range - dB
110
16
SIGNAL-TO-NOISE AND
DISTORTION
vs
FULL SCALE RANGE
SIGNAL-TO-NOISE RATIO
vs
FULL SCALE RANGE
+VA = 5 V
91
+VA = 3 V
89
87
85
-40 -25
-10
5
20
35 50 65
TA - Free-Air Temperature - ºC
Figure 29.
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80
80
95
93
91
+VA = 5 V
89
+VA = 3 V
87
85
-40
-25
-10
5
20
35
50
65
TA - Free-Air Temperature - ºC
Figure 30.
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TYPICAL CHARACTERISTICS (continued)
EFFECTIVE NUMBER OF BITS
vs
FREE-AIR TEMPERATURE
INTERNAL CLOCK FREQUENCY
vs
SUPPLY VOLTAGE
24
15.50
+VA = 5 V
15
+VA = 3 V
14.50
14
-40
-25
-10
5
20
35
50
65
24
23.5
Internal Clock Frequency - MHz
Internal Clock Frequency - MHz
16
ENOB - Effective Number of Bits - Bits
INTERNAL CLOCK FREQUENCY
vs
FREE-AIR TEMPERATURE
23
22.5
22
21.5
21
2.7
80
3.2
22
21.5
TA - Free-Air Temperature - ºC
Figure 31.
Figure 32.
Figure 33.
ANALOG SUPPLY CURRENT
vs
SUPPLY VOLTAGE
ANALOG SUPPLY CURRENT
vs
SUPPLY VOLTAGE
ANALOG SUPPLY CURRENT
vs
SUPPLY VOLTAGE
6.5
6.0
5.5
5.0
3.2
360
320
280
240
200
2.7
3.7
4.2
4.7
5.2
+VA - Supply Voltage - V
PD Mode
Analog Supply Current - nA
7.0
80
10
NAP Mode
Analog Supply Current - mA
Analog Supply Current - mA
22.5
21
-40 -25 -10
5
20
35 50 65
TA - Free-Air Temperature - ºC
5.2
400
4.5
2.7
23
3.7
4.2
4.7
+VA - Supply Voltage - V
fs = 1 MSPS
7.5
23.5
3.2
3.7
4.2
4.7
+VA - Supply Voltage - V
8
6
4
2
0
2.7
5.2
3.2
3.7
4.2
4.7
+VA - Supply Voltage - V
5.2
Figure 34.
Figure 35.
Figure 36.
ANALOG SUPPLY CURRENT
vs
SAMPLE RATE
ANALOG SUPPLY CURRENT
vs
SAMPLE RATE
ANALOG SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
500
Auto NAP
+VA = 5 V
4
+VA = 3 V
3
2
400
300
+VA = 5 V
200
+VA = 3 V
100
1
Analog Supply Current - mA
6
5
7.5
PD Mode
Analog Supply Current - mA
Analog Supply Current - mA
7
fs = 1 MSPS
+VA = 5 V
7
6.5
6
5.5
+VA = 3 V
5
4.5
0
1
10
100
Sample Rate - kHz
Figure 37.
1000
0
1
5
4
-40
Sample Rate - kHz
-10 5
20 35 50 65
TA - Free-Air Temperature - ºC
Figure 38.
Figure 39.
9
13
17
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80
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TYPICAL CHARACTERISTICS (continued)
ANALOG SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
0.4
Analog Supply Current - mA
NAP Mode
0.36
+VA = 5 V
0.32
0.28
+VA = 3 V
0.24
0.2
-40
-25 -10
5
20 35 50 65
TA - Free-Air Temperature - ºC
80
Figure 40.
INL
1.75
1.5
+VA = 5 V
1.0
INL - Bits
0.5
0
-0.5
-1.0
-1.5
-1.75
0
10000
20000
30000
40000
50000
60000
40000
50000
60000
Code
Figure 41.
DNL
1
+VA = 5 V
DNL - Bits
0.5
0
-0.5
-1
0
10000
20000
30000
Code
Figure 42.
18
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TYPICAL CHARACTERISTICS (continued)
INL
1.75
1.5
+VA = 3 V
1.0
INL - Bits
0.5
0
-0.5
-1.0
-1.5
-1.75
0
10000
20000
30000
Code
40000
50000
60000
Figure 43.
DNL
1
+VA = 3 V
DNL - Bits
0.5
0
-0.5
-1
0
10000
20000
30000
Code
40000
50000
60000
Figure 44.
FFT
0
5 kHz Input,
+VA = 3 V,
fs = 1 MSPS,
Vref = 2.5 V
-20
Amplitude - dB
-40
-60
-80
-100
-120
-140
-160
0
100
200
300
400
500
f - Frequency - kHz
Figure 45.
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TYPICAL CHARACTERISTICS (continued)
FFT
0
10 kHz Input,
+VA = 3 V,
fs = 1 MSPS,
Vref = 2.5 V
-20
Amplitude - dB
-40
-60
-80
-100
-120
-140
-160
0
100
200
300
400
500
f - Frequency - kHz
Figure 46.
FFT
0
100 kHz Input,
+VA = 3 V,
fs = 1 MSPS,
Vref = 2.5 V
-20
Amplitude - dB
-40
-60
-80
-100
-120
-140
-160
0
100
200
300
400
500
f - Frequency - kHz
Figure 47.
FFT
0
5 kHz Input,
+VA = 5 V,
fs = 1 MSPS,
Vref = 5 V
-20
Amplitude - dB
-40
-60
-80
-100
-120
-140
-160
0
100
200
300
f - Frequency - kHz
Figure 48.
20
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400
500
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TYPICAL CHARACTERISTICS (continued)
FFT
20
0
10 kHz Input,
+VA = 5 V,
fs = 1 MSPS,
Vref = 5 V
Amplitude - dB
-20
-40
-60
-80
-100
-120
-140
-160
0
100
200
300
400
500
f - Frequency - kHz
Figure 49.
FFT
0
100 kHz Input,
+VA = 5 V,
fs = 1 MSPS,
Vref = 5 V
-20
Amplitude - dB
-40
-60
-80
-100
-120
-140
-160
0
100
200
300
400
500
f - Frequency - kHz
Figure 50.
THEORY OF OPERATION
The ADS8329/30 is a high-speed, low power, successive approximation register (SAR) analog-to-digital
converter (ADC) that uses an external reference. The architecture is based on charge redistribution, which
inherently includes a sample/hold function.
The ADS8329/30 has an internal clock that is used to run the conversion but can also be programmed to run the
conversion based on the external serial clock, SCLK.
The ADS8329 has one analog input. The analog input is provided to two input pins: +IN and –IN. When a
conversion is initiated, the differential input on these pins is sampled on the internal capacitor array. While a
conversion is in progress, both +IN and –IN inputs are disconnected from any internal function.
The ADS8330 has two inputs. Both inputs share the same common pin - COM. The negative input is the same
as the -IN pin for the ADS8329. The ADS8330 can be programmed to select a channel manually or can be
programmed into the auto channel select mode to sweep between channel 0 and 1 automatically.
ANALOG INPUT
When the converter enters hold mode, the voltage difference between the +IN and –IN inputs is captured on the
internal capacitor array. The voltage on the –IN input is limited between AGND – 0.2 V and AGND + 0.2 V,
allowing the input to reject small signals which are common to both the +IN and –IN inputs. The +IN input has a
range of –0.2 V to Vref + 0.2 V. The input span [+IN – (–IN)] is limited to 0 V to Vref.
The (peak) input current through the analog inputs depends upon a number of factors: sample rate, input
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THEORY OF OPERATION (continued)
voltage, and source impedance. The current into the ADS8329/30 charges the internal capacitor array during the
sample period. After this capacitance has been fully charged, there is no further input current. The source of the
analog input voltage must be able to charge the input capacitance (45 pF) to a 16-bit settling level within the
minimum acquisition time (120 ns). When the converter goes into hold mode, the input impedance is greater
than 1 GΩ.
Care must be taken regarding the absolute analog input voltage. To maintain linearity of the converter, the +IN
and –IN inputs and the span [+IN – (–IN)] should be within the limits specified. Outside of these ranges,
converter linearity may not meet specifications. To minimize noise, low bandwidth input signals with low-pass
filters should be used. Care should be taken to ensure that the output impedance of the sources driving the +IN
and –IN inputs are matched. If this is not observed, the two inputs could have different settling times. This may
result in an offset error, gain error, and linearity error which change with temperature and input voltage.
Device in Hold Mode
150 W
+IN
4 pF
40 pF
+VA
AGND
4 pF
150 W
−IN
40 pF
AGND
Figure 51. Input Equivalent Circuit
Driver Amplifier Choice
The analog input to the converter needs to be driven with a low noise, op-amp like the THS4031 or OPA365. An
RC filter is recommended at the input pins to low-pass filter the noise from the source. Two resistors of 20 Ω and
a capacitor of 470 pF are recommended. The input to the converter is a unipolar input voltage in the range 0 V
to Vref. The minimum -3dB bandwidth of the driving operational amplifier can be calculated to:
f3db = (ln(2) ×(n+1))/(2π × tACQ)
where n is equal to 16, the resolution of the ADC (in the case of the ADS8329/30). When tACQ = 120 ns
(minimum acquisition time), the minimum bandwidth of the driving amplifier is 15.6 MHz. The bandwidth can be
relaxed if the acquisition time is increased by the application. The OPA365, OPA827, or THS4031 from Texas
Instruments are recommended. The THS4031 used in the source follower configuration to drive the converter is
shown in the typical input drive configuration, Figure 52.
Bipolar to Unipolar Driver
In systems where the input is bipolar, the THS4031 can be used in the inverting configuration with an additional
DC bias applied to its + input so as to keep the input to the ADS8329/30 within its rated operating voltage range.
This configuration is also recommended when the ADS8329/30 is used in signal processing applications where
good SNR and THD performance is required. The DC bias can be derived from the REF3225 or the REF3240
reference voltage ICs. The input configuration shown in Figure 53 is capable of delivering better than 91 dB
SNR and –96 dB THD at an input frequency of 10 kHz. In case bandpass filters are used to filter the input, care
should be taken to ensure that the signal swing at the input of the bandpass filter is small so as to keep the
distortion introduced by the filter minimal. In such cases, the gain of the circuit shown in Figure 53 can be
increased to keep the input to the ADS8329/30 large to keep the SNR of the system high. Note that the gain of
the system from the + input to the output of the THS4031 in such a configuration is a function of the gain of the
AC signal. A resistor divider can be used to scale the output of the REF3225 or REF3240 to reduce the voltage
at the DC input to THS4031 to keep the voltage at the input of the converter within its rated operating range.
22
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THEORY OF OPERATION (continued)
Input
Signal
(0 V to 4 V)
5V
ADS8329/30
+VA
THS4031
20 W
+IN/(+IN1 or +IN0)
470 pF
−IN/COM
50 W
20 W
Figure 52. Unipolar Input Drive Configuration
5V
ADS8329
1 V DC
600 W
+VA
THS4031
20 W
+IN/(+IN1 or +IN0)
470 pF
Input
Signal
(−2V to 2 V)
−IN/COM
600 W
20 W
Figure 53. Bipolar Input Drive Configuration
REFERENCE
The ADS8329/30 can operate with an external reference with a range from 0.3 V to 5 V. A clean, low noise,
well-decoupled reference voltage on this pin is required to ensure good performance of the converter. A low
noise band-gap reference like the REF3240 can be used to drive this pin. A 22-µF ceramic decoupling capacitor
is required between the REF+ and REF- pins of the converter. These capacitors should be placed as close as
possible to the pins of the device. The REF- should be connected to its own via to the analog ground plane with
the shortest possible distance.
CONVERTER OPERATION
The ADS8329/30 has an oscillator that is used as an internal clock which controls the conversion rate. The
frequency of this clock is 21 MHz minimum. The oscillator is always on unless the device is in the deep
powerdown state or the device is programmed for using SCLK as the conversion clock (CCLK). The minimum
acquisition (sampling) time takes 3 CCLKs (this is equivalent to 120 ns at 24.5 MHz) and the conversion time
takes 18 conversion clocks (CCLK) (~780 ns) to complete one conversion.
The conversion can also be programmed to run based on the external serial clock, SCLK, if is so desired. This
allows a system designer to achieve system synchronization. The serial clock SCLK, is first reduced to 1/2 of its
frequency before it is used as the conversion clock (CCLK). For example, with a 42-MHz SCLK this provides a
21-MHz clock for conversions. If it is desired to start a conversion at a specific rising edge of the SCLK when the
external SCLK is programmed as the source of the conversion clock (CCLK) (and manual start of conversion is
selected), the setup time between CONVST and that rising SCLK edge should be observed. This ensures the
conversion is complete in 18 CCLKs (or 36 SCLKs). The minimum setup time is 20 ns to ensure synchronization
between CONVST and SCLK. In many cases the conversion can start one SCLK period (or CCLK) later which
results in a 19 CCLK (or 37 SCLK) conversion. The 20 ns setup time is not required once synchronization is
relaxed.
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THEORY OF OPERATION (continued)
The duty cycle of SCLK is not critical as long as it meets the minimum high and low time requirements of 8 ns.
Since the ADS8329/30 is designed for high-speed applications, a higher serial clock (SCLK) must be supplied to
be able to sustain the high throughput with the serial interface and so the clock period of SCLK must be at most
1 µs (when used as conversion clock (CCLK). The minimum clock frequency is also governed by the parasitic
leakage of the capacitive digital-to-analog (CDAC) capacitors internal to the ADS8329/30.
CFR_D10
Conversion Clock
(CCLK)
=1
OSC
=0
Divider
1/2
SPI Serial
Clock (SCLK)
Figure 54. Converter Clock
Manual Channel Select Mode
The conversion cycle starts with selecting an acquisition channel by writing a channel number to the command
register (CMR). This cycle time can be as short as 4 serial clocks (SCLK).
Auto Channel Select Mode
Channel selection can also be done automatically if auto channel select mode is enabled. This is the default
channel select mode. The dual channel converter, ADS8330, has a built-in 2-to-1 MUX. If the device is
programmed for auto channel select mode then signals from channel 0 and channel 1 are acquired with a fixed
order. Channel 0 is accessed first in the next cycle after the command cycle that configured CFR_D11 to 1 for
auto channel select mode. This automatic access stops the cycle after the command cycle that sets CFR_D11
to 0.
Start of a Conversion
The end of acquisition or sampling instance (EOS) is the same as the start of a conversion. This is initiated by
bringing the CONVST pin low for a minimum of 40 ns. After the minimum requirement has been met, the
CONVST pin can be brought high. CONVST acts independent of FS/CS so it is possible to use one common
CONVST for applications requiring simultaneous sample/hold with multiple converters. The ADS8329/30
switches from sample to hold mode on the falling edge of the CONVST signal. The ADS8329/30 requires 18
conversion clock (CCLK) edges to complete a conversion. The conversion time is equivalent to 1500 ns with a
12-MHz internal clock. The minimum time between two consecutive CONVST signals is 21 CCLKs.
A conversion can also be initiated without using CONVST if it is so programmed (CFR_D9 = 0). When the
converter is configured as auto trigger, the next conversion is automatically started 3 conversion clocks (CCLK)
after the end of a conversion. These 3 conversion clocks (CCLK) are used as the acquisition time. In this case
the time to complete one acquisition and conversion cycle is 21 CCLKs.
Table 1. Different Types of Conversion
MODE
SELECT CHANNEL
START CONVERSION
Auto Channel Select (1)
Auto Trigger
Automatic No need to write channel number to the CMR. Use internal sequencer for the
ADS8330.
Manual
(1)
24
Manual Channel Select
Write the channel number to the CMR.
Start a conversion based on the
conversion clock CCLK.
Manual Trigger
Start a conversion with CONVST.
Auto channel select should be used with auto trigger and also with the TAG bit enabled.
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Status Output EOC/INT
When the status pin is programmed as EOC and the polarity is set as active low, the pin works in the following
manner: The EOC output goes LOW immediately following CONVST going LOW when manual trigger is
programmed. EOC stays LOW throughout the conversion process and returns to HIGH when the conversion has
ended. The EOC output goes low for 3 conversion clocks (CCLK) after the previous rising edge of EOC, if auto
trigger is programmed.
This status pin is programmable. It can be used as an EOC output (CFR_D[7:6] = 1, 1) where the low time is
equal to the conversion time. This status pin can be used as INT. (CFR_D[7:6] = 1, 0) which is set LOW at the
end of a conversion is brought to HIGH (cleared) by the next read cycle. The polarity of this pin, used as either
function (EOC or INT), is programmable through CFR_D7.
Power-Down Modes
The ADS8329/30 has a comprehensive built-in power-down feature. There are three power-down modes: Deep
power-down mode, Nap power-down mode, and auto nap power-down mode. All three power-down modes are
enabled by setting the related CFR bits. The first two power-down modes are activated when enabled. A wakeup
command, 1011b, can resume device operation from a power-down mode. Auto nap power-down mode works
slightly different. When the converter is enabled in auto nap power-down mode, an end of conversion instance
(EOC) puts the device into auto nap powerdown. The beginning of sampling resumes operation of the converter.
The contents of the configuration register is not affected by any of the power-down modes. Any ongoing
conversion when nap or deep powerdown is activated is aborted.
+VA − Supply Current − mA
100
10
1
0.1
20
10020
20020
30020
40020
Settling Time − ns
Figure 55. Typical Analog Supply Current Drop vs Time After Powerdown
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Deep Power-Down Mode
Deep power-down mode can be activated by writing to configuration register bit CFR_D2. When the device is in
deep power-down mode, all blocks except the interface are in powerdown. The external SCLK is blocked to the
analog block. The analog blocks no longer have bias currents and the internal oscillator is turned off. In this
mode, power dissipation falls from 5 mA to 1 µA in 2 µs. The wake-up time after a powerdown is 1 µs. When bit
D2 in the configuration register is set to 0, the device is in deep powerdown. Setting this bit to 1 or sending a
wake-up command can resume the converter from the deep power-down state.
Nap Mode
In nap mode the ADS8329/230 turns off biasing of the comparator and the mid-volt buffer. In this mode power
dissipation falls from 7 mA in normal mode to about 0.3 mA in 200 ns after the configuration cycle. The wake-up
(resume) time from nap power-down mode is 3 CCLKs (120 ns with a 24.5-MHz conversion clock). As soon as
the CFR_D3 bit in the control register is set to 0, the device goes into nap power-down mode, regardless of the
conversion state. Setting this bit to 1 or sending a wake-up command can resume the converter from the nap
power-down state.
Auto Nap Mode
Auto nap mode is almost identical to nap mode. The only difference is the time when the device is actually
powered down and the method to wake up the device. Configuration register bit D4 is only used to
enable/disable auto nap mode. If auto nap mode is enabled, the device turns off biasing after the conversion has
finished, which means the end of conversion activates auto nap powerdown mode. Power dissipation falls from
7 mA in normal mode to about 0.3 mA in 200 ns. A CONVST resumes the device and turns biasing on again in
3 CCLKs (120 ns with a 24.5-MHz conversion clock). The device can also be woken up by disabling auto nap
mode when bit D4 of the configuration register is set to 1. Any channel select command 0XXXb, wake up
command or the set default mode command 1111b can also wake up the device from auto nap powerdown.
NOTE:
1. This wake-up command is the word 1011b in the command word. This command sets
bits D2 and D3 to 1 in the configuration register but not D4. But a wake-up command
does remove the device from either one of these power-down states, deep/nap/auto
nap powerdown.
2. Wake-up time is defined as the time between when the host processor tries to wake up
the converter and when a convert start can occur.
Table 2. Power-Down Mode Comparisons
TYPE OF
POWERDOWN
POWER
CONSUMPTION
Normal operation
7 mA/5.1 mA
Deep powerdown
7 nA/1 nA
Nap powerdown
Auto nap powerdown
26
0.3 mA/0.2 mA
ACTIVATED BY
ACTIVATION TIME
RESUME POWER BY
RESUME TIME
ENABLE
100 µs
Woken up by command 1011b
1 µs
Set CFR
Setting CFR
200 µs
Woken up by command 1011b to achieve 6.6 mA
since (1.3 + 12)/2 = 6.6
3 CCLKs
Set CFR
EOC (end of
conversion)
200 µs
Woken up by CONVST, any channel select
command, default command 1111b, or wake up
command 1011b.
3 CCLKs
Set CFR
Setting CFR
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EOS
EOC
EOS
Converter
State
N+1
Converter State
EOC
N
CONVST
N+1 −th Sampling
N −th Conversion
N+1 −th Conversion
Read While Converting
20 ns MIN
1 CCLK MIN
CS
(For Read Result)
Read N−1 −th Result
Read While Sampling
0 ns MIN
20 ns MIN
CS
(For Read Result)
Read N −th Result
Figure 56. Read While Converting vs Read While Sampling (Manual trigger)
Manual Trigger
Converter
State
Resume
N −th Sampling
>=3CCLK
N −th Conversion
Activation
Resume
=18 CCLK
N+1 −th Sampling
>=3CCLK
EOC
EOC
EOS
N+1
EOS
N
CONVST
N+1 −th Conversion
Activation
=18 CCLK
20 ns MIN
20 ns MIN
1 CCLK MIN
Read While Converting
Read N−1 −th
CS
Read N −th
Result
Result
20 ns MIN
20 ns MIN
Read While Sampling
Read N−1 −th
CS
20 ns MIN
0 ns MIN
20 ns MIN
Read N −th
Result
Result
20 ns MIN
20 ns MIN
Figure 57. Read While Converting vs Read While Sampling with Deep or Nap Powerdown
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40 ns MIN
Manual Trigger Case 1
N
N+1
Converter
State
Resume
N −th Sampling
EOS
POWERDOWN
N −th Conversion
>=3CCLK
Resume
=18 CCLK
EOC
EOS
EOC
(programmed
Active Low)
EOC
CONVST
N+1 −th Sampling
N+1 −th Conversion
>=3CCLK
=18 CCLK
6 CCLKs
POWERDOWN
6 CCLKs
Read While Converting
20 ns MIN
20 ns MIN
Read N −th
Result
Read N−1 −th
Result
CS
20 ns MIN
20 ns MIN
1 CCLK MIN
Read While Sampling
1 CCLK MIN
0 ns MIN
Read N −th
Result
Read N−1 −th
Result
CS
20 ns MIN
20 ns MIN
40 ns MIN
Manual Trigger Case 2 (wake up by CONVST)
N+1
Converter
State
N −th Sampling
>=3CCLK
N −th Conversion
POWER
DOWN
Resume
N+1 −th Sampling
EOC
EOS
Resume
EOS
N
EOC
(programmed
Active Low)
EOC
CONVST
N+1 −th Conversion
>=3CCLK
=18 CCLK
POWER
DOWN
=18 CCLK
Read While Converting
20 ns MIN
20 ns MIN
Read N −th
Result
Read N−1 −th
Result
CS
20 ns MIN
Read While Sampling
20 ns MIN
20 ns MIN
0 ns MIN
Read N−1 −th
Result
CS
20 ns MIN
Read N −th
Result
20 ns MIN
20 ns MIN
Figure 58. Read While Converting vs Read While Sampling with Auto Nap Powerdown
Total Acquisition + Conversion Cycle Time:
Automatic:
= 21 CCLKs
Manual:
≥ 21 CCLKs
Manual + deep powerdown: ≥ 4SCLK + 100 µs + 3 CCLK + 18 CCLK +16 SCLK + 1 µs
Manual + nap powerdown:
≥ 4 SCLK + 3 CCLK + 3 CCLK + 18 CCLK +16 SCLK
Manual + auto nap
powerdown:
≥ 4 SCLK + 3 CCLK + 3 CCLK + 18 CCLK +16 SCLK (use wakeup to resume)
Manual + auto nap
powerdown:
≥ 1 CCLK + 3 CCLK + 3 CCLK + 18 CCLK +16 SCLK (use CONVST to resume)
28
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DIGITAL INTERFACE
The serial interface is compatible with Motorola SPI. The serial clock is designed to accommodate the latest
high-speed processors with an SCLK up to 50 MHz. Each cycle is started with the falling edge of FS/CS. The
internal data register content which is made available to the output register at the EOC presented on the SDO
output pin at the falling edge of FS/CS. This is the MSB. Output data are changed at the falling edge of SCLK so
that the host processor can read it at the next rising edge. Serial data input is latched at the falling edge of
SCLK.
The complete serial I/O cycle starts with the first rising edge of SCLK after the falling edge of FS/CS and ends
16 (see NOTE) falling edges of SCLK later. The serial interface is very flexible. It works with both CPOL = 0 or
CPOL = 1. The interface ignores data if a falling edge arrives before the first rising edge. This means the falling
edge of FS/CS may fall while SCLK is high. The same relaxation applies to the rising edge of FS/CS where
SCLK may be high or low as long as the last SCLK falling edge happens before the rising edge of FS/CS.
NOTE:
There are cases where a cycle is 4 SCLKs or up to 24 SCLKs depending on the read
mode combination. See Table 3 for details.
Internal Register
The internal register consists of two parts, 4 bits for the command register (CMR) and 12 bits for configuration
data register (CFR).
Table 3. Command Set Defined by Command Register (CMR) (1)
WAKE UP FROM
AUTO NAP
MINIMUM SCLKs
REQUIRED
R/W
Don't care
Y
4
–
Don't care
Y
4
–
Reserved
Reserved
Y
4
–
3h
Reserved
Reserved
Y
4
–
0100b
4h
Reserved
Reserved
Y
4
–
0101b
5h
Reserved
Reserved
Y
4
–
0110b
6h
Reserved
Reserved
Y
4
–
0111b
7h
Reserved
Reserved
Y
4
–
1000b
8h
Reserved
Reserved
–
–
–
1001b
9h
Reserved
Reserved
–
–
–
1010b
Ah
Reserved
Reserved
–
–
–
1011b
Bh
Wake up
Don't care
Y
4
W
1100b
Ch
Read CFR
Don't care
–
16
R
1101b
Dh
Read data
Don't care
–
16
R
1110
Eh
Write CFR
CFR Value
–
16
W
1111b
Fh
Default mode (load CFR with default value)
Don't care
Y
4
W
D[15:12]
HEX
0000b
0h
Select analog input channel 0 (2)
0001b
1h
Select analog input channel 1 (2)
0010b
2h
0011b
(1)
(2)
COMMAND
D[11:0]
When SDO is not in 3-state (FS/CS low and SCLK running), the bits from SDO are always part (depending on how many SCLKs are
supplied) of the previous conversion result.
These two commands apply to the ADS8330 only.
WRITING TO THE CONVERTER
There are two different types of writes to the register, a 4-bit write to the CMR and a full 16-bit write to the CMR
plus CFR. The command set is listed in Table 3. A simple command requires only 4 SCLKs and the write takes
effect at the 4th falling edge of SCLK. A 16-bit write or read takes at least 16 SCLKs (see Table 5 for exceptions
that require more than 16 SCLKs).
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Configuring the Converter and Default Mode
The converter can be configuring with command 1110b (write to the CFR) or command 1111b (default mode). A
write to the CFR requires a 4-bit command followed by 12-bits of data. A 4-bit command takes effect at the 4th
falling edge of SCLK. A CFR write takes effect at the 16th falling edge of SCLK.
A default mode command can be achieved by simply tying SDI to +VBD. As soon as the chip is selected at least
four 1s are clocked in by SCLK. The default value of the CFR is loaded into the CFR at the 4th falling edge of
SCLK.
CFR default values are all 1s (except for CFR_D1, this bit is ignored by the ADS8329 and is always read as a
0). The same default values apply for the CFR after a power-on reset (POR) and SW reset.
READING THE CONFIGURATION REGISTER
The host processor can read back the value programmed in the CFR by issuing command 1100b. The timing is
similar to reading a conversion result except CONVST is not used and there is no activity on the EOC/INT pin.
The CFR value read back contains the first four MSBs of conversion data plus valid 12-bit CFR contents.
Table 4. Configuration Register (CFR) Map
SDI BIT
DEFINITION
CFR - D[11 - 0]
Channel select mode
D11 Default = 1
D10 Default = 1
D9 Default = 1
D8 Default = 1
D7 Default = 1
D6 Default = 1
D5 Default = 1
D4 Default = 1
D3 Default = 1
D2 Default = 1
D1 Default =
0: ADS8329
1: ADS8330
D0 Default = 1
0: Manual channel select enabled. Use channel select commands to
access a different channel.
1: Auto channel select enabled. All channels are sampled and
converted sequentially until the cycle after this bit is set to 0.
Conversion clock (CCLK) source select
0: Conversion clock (CCLK) = SCLK/2
1: Conversion clock (CCLK) = Internal OSC
Trigger (conversion start) select: start conversion at the end of sampling (EOS). If D9 = 0, the D4 setting is ignored.
0: Auto trigger automatically starts (4 internal clocks after EOC inactive)
1: Manual trigger manually started by falling edge of CONVST
Don't care
Don't care
Pin 10 polarity select when used as an output (EOC/INT)
0: EOC Active high / INT active high
1: EOC Active low / INT active low
Pin 10 function select when used as an output (EOC/INT)
0: Pin used as INT
1: Pin used as EOC
Pin 10 I/O select for chain mode operation
0: Pin 10 is used as CDI input (chain mode enabled)
1: Pin 10 is used as EOC/INT output
Auto nap powerdown enable/disable (mid voltage and comparator shut down between cycles). This bit setting is ignored if D9 = 0.
0: Auto nap powerdown enabled (not activated)
1: Auto nap powerdown disabled
Nap powerdown (mid voltage and comparator shut down between cycles). This bit is set to 1 automatically by wake-up command.
0: Enable/activate device in nap powerdown
1: Remove device from nap powerdown (resume)
Deep powerdown. This bit is set to 1 automatically by wake-up command.
0: Enable/activate device in deep powerdown
1: Remove device from deep powerdown (resume)
TAG bit enable. This bit is ignored by the ADS8329 and is alway read 0.
0: TAG bit disabled.
1: TAG bit output enabled. TAG bit appears at the 17th SCLK.
Reset
0: System reset
1: Normal operation
READING CONVERSION RESULT
The conversion result is available to the input of the output data register (ODR) at EOC and presented to the
output of the output register at the next falling edge of CS or FS. The host processor can then shift the data out
via the SDO pin any time except during the quiet zone. This is 20 ns before and 20 ns after the end of sampling
(EOS) period. End of sampling (EOS) is defined as the falling edge of CONVST when manual trigger is used or
the end of the 3rd conversion clock (CCLK) after EOC if auto trigger is used.
30
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The falling edge of FS/CS should not be placed at the precise moment (minimum of at least one conversion
clock (CCLK) delay) at the end of a conversion (by default when EOC goes high), otherwise the data is corrupt.
If FS/CS is placed before the end of a conversion, the previous conversion result is read. If FS/CS is placed
after the end of a conversion, the current conversion result is read.
The conversion result is 16-bit data in straight binary format as shown in Table 4. Generally 16 SCLKs are
necessary, but there are exceptions where more than 16 SCLKS are required (see Table 5). Data output from
the serial output (SDO) is left adjusted MSB first. The trailing bits are filled with the TAG bit first (if enabled) plus
all zeros. SDO remains low until FS/CS is brought high again.
SDO is active when FS/CS is low. The rising edge of FS/CS 3-states the SDO output.
NOTE:
Whenever SDO is not in 3-state (when FS/CS is low and SCLK is running), a portion
of the conversion result is output at the SDO pin. The number of bits depends on how
many SCLKs are supplied. For example, a manual select channel command cycle
requires 4 SCLKs, therefore 4 MSBs of the conversion result are output at SDO. The
exception is SDO outputs all 1s during the cycle immediately after any reset (POR or
software reset).
If SCLK is used as the conversion clock (CCLK) and a continuous SCLK is used, it is not possible to clock out
all 16 SDO bits during the sampling time (6 SCLKs) because of the quiet zone requirement. In this case it is
better to read the conversion result during the conversion time (36 SCLKs or 48 SCLKs in auto nap mode).
Table 5. Ideal Input Voltages and Output Codes
DESCRIPTION
ANALOG VALUE
DIGITAL OUTPUT
Full scale range
Vref
STRAIGHT BINARY
Least significant bit (LSB)
Vref/65536
Full scale
+Vref– 1 LSB
1111 1111 1111 1111
FFFF
Midscale
Vref/2
1000 0000 0000 0000
8000
Midscale – 1 LSB
Vref/2– 1 LSB
0111 1111 1111 1111
7FFF
Zero
0V
0000 0000 0000 0000
0000
BINARY CODE
HEX CODE
TAG Mode
The ADS8330 includes a feature, TAG, that can be used as a tag to indicate which channel sourced the
converted result. An address bit is added after the LSB read out from SDO indicating which channel the result
came from if TAG mode is enabled. This address bit is 0 for channel 0 and 1 for channel 1. The converter
requires more than the 16 SCLKs that are required for a 4 bit command plus 12 bit CFR or 16 data bits because
of the additional TAG bit.
Chain Mode
The ADS8329/30 can operate as a single converter or in a system with multiple converters. System designers
can take advantage of the simple high-speed SPI compatible serial interface by cascading them in a single chain
when multiple converters are used. A bit in the CFR is used to reconfigure the EOC/INT status pin as a
secondary serial data input, chain data input (CDI), for the conversion result from an upstream converter. This is
chain mode operation. A typical connection of three converters is shown in Figure 59.
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ADS8329
ADS8330
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SLAS516 – DECEMBER 2006
Micro Controller
INT
GPIO1
GPIO2
SDI SCLK CONVST
CS
ADS8329
#1
SDO
EOC/INT
SDOSCLK
GPIO3
SDI SCLK CONVST
CS
ADS8329
#3
CDI
SDO
SDI SCLK CONVST
CS
ADS8329
#2
CDI
SDO
Program device #1 CFR_D[7:5] = XX0b
SDI
Program device #2 and #3 CFR_D[7:5] = XX1b
Figure 59. Multiple Converters Connected Using Chain Mode
When multiple converters are used in chain mode, the first converter is configured in regular mode while the rest
of the converters downstream are configured in chain mode. When a converter is configured in chain mode, the
CDI input data goes straight to the output register, therefore the serial input data passes through the converter
with a 16 SCLK (if the TAG feature is disabled) or a 24 SCLK delay, as long as CS is active. See Figure 60 for
detailed timing. In this timing the conversion in each converters are done simultaneously.
INT #3
(active low)
Nth
EOS
EOC #1
(active low)
EOC
CONVST #1,
CONVST #2,
CONVST #3
EOS
Cascaded Manual Trigger/Read While Sampling
(Use internal CCLK, EOC active low, and INT active low) CS held
low during the N times 16 bits transfer cycle.
tSAMPLE1 = 3 CCLKs min
tCONV = 18 CCLKs
td(CSR-EOS) = 20 ns min
CS/FS #1
SCLK #1,
SCLK #2,
SCLK #3
SDO #1,
CDI #2
1 . . . . . . . . . . . . . . . . . . 16
1 . . . . . . . . . . . . . . . . . . 16
Hi-Z
Nth from #1
td(CSR-EOS) = 20 ns min
CS/FS #2,
CS/FS #3
SDO #2,
CDI #3
SDO #3
SDI #1,
SDI #2,
SDI #3
1 . . . . . . . . . . . . . . . . . . 16
Hi-Z
Hi-Z
td(SDO-CDI)
Hi-Z
N − 1th from #2
Hi-Z
Nth from #1
Nth from #1
td(SDO-CDI)
Hi-Z
Nth from #3
1110............
CONFIGURE
N − 1th from #2
1101b
READ Result
Nth from #1
1101b
READ Result
Figure 60. Simplified Cascade Mode Timing with Shared CONVST and Continuous CS
32
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ADS8330
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Care must be given to handle the multiple CS signals when the converters are operating in chain mode. The
different chip select signals must be low for the entire data transfer (in this example 48 bits for three converters).
The first 16-bit word after the falling chip select is always the data from the chip that received the chip select
signal.
Case 1: If chip select is not toggled (CS stays low), the next 16 bits are data from the upstream converter, and
so on. This is shown in Figure 60. If there is no upstream converter in the chain, as converter #1 in the example,
the same data from the converter is going to be shown repeatedly.
Case 2: If the chip select is toggled during a chain mode data transfer cycle, as illustrated in Figure 61, the
same data from the converter is read out again and again in all three discrete 16-bit cycles. This is not a desired
result.
Cascaded Manual Trigger/Read While Sampling
(Use internal CCLK, EOC, and INT polarity programmed as active low)
CS held low during the N times 16 bits transfer cycle.
INT #1
(active low)
EOS
Nth
EOC
EOC #1
(active low)
These SCLKs are optional.
EOS
CONVST #1,
CONVST #2,
CONVST #3
tSAMPLE1 = 3 CCLKs min
td(EOS-CSF) = 20 ns min
tCONV = 18 CCLKs
td(CSR-EOS) = 20 ns min
CS/FS #1
SCLK #1,
SCLK #2,
SCLK #3
SDO #1,
CDI #2
16
1
1
16
Nth from #1
CS/FS #2
SCLK #2,
SDO #2,
CDI #3
N − 1th from #2
CS/FS #3
1
16
Nth from #1
Nth from #1
td(EOS-CSF) =
td(CSR-EOS) =
20 ns min
20 ns min
Nth from #1
td(EOS-CSF) =
20 ns min
Nth from #1
td(CSR-EOS) =
20 ns min
SDO #3
SDI #1,
SDI #2,
SDI #3
Nth from #3
1110............
CONFIGURE
N − 1th from #2
1101b
READ Result
Nth from #1
1101b
READ Result
Figure 61. Simplified Cascade Mode Timing with Shared CONVST and Discrete CS
Figure 62 shows a slightly different scenario where CONVST is not shared by the second converter. Converters
#1 and #3 have the same CONVST signal. In this case, converter #2 simply passes previous conversion data
downstream.
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ADS8329
ADS8330
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SLAS516 – DECEMBER 2006
Cascaded Manual Trigger/Read While Sampling
(Use internal CCLK, EOC active low and INT active low)
CS held low during the N times 16 bits transfer cycle.
Note : old data shown.
INT #1
(active low)
Nth
EOS
EOC #1
(active low)
EOC
CONVST #2 = 1
EOS
CONVST #1,
CONVST #3
tSAMPLE1 = 3 CCLKs min
tCONV = 18 CCLKs
td(CSR-EOS) = 20 ns min
CS/FS #1
SCLK #1,
SCLK #2,
SCLK #3
SDO #1,
CDI #2
1 . . . . . . . . . . . . . . . . . .16
1 . . . . . . . . . . . . . . . . . .16
1 . . . . . . . . . . . . . . . . . .16
Hi-Z
Hi-Z
Nth from #1
td(CSR-EOS) = 20 ns min
CS/FS #2,
CS/FS #3
td(SDO-CDI)
SDO #2,
CDI #3
Hi-Z
SDO #3
Hi-Z
Hi-Z
Nth from #1
N − 1th from #2
SDI #1,
SDI #2,
SDI #3
td(SDO-CDI)
Hi-Z
N − 1th from #2
Nth from #3
1110............
CONFIGURE
Nth from #1
1101b
1101b
READ Result
READ Result
Figure 62. Simplified Cascade Timing (Separate CONVST)
The number of SCLKs required for a serial read cycle depends on the combination of different read modes, TAG
bit, chain mode, and the way a channel is selected, i.e., auto channel select. This is listed in Table 6.
Table 6. Required SCLKs For Different Read Out Mode Combinations
CHAIN MODE
AUTO CHANNEL
TAG ENABLED CFR.D1
ENABLED CFR.D5 SELECT CFR.D11
34
NUMBER OF SCLK PER SPI
READ
TRAILING BITS
0
0
0
16
None
0
0
1
≥17
MSB is TAG bit plus zero(s)
0
1
0
16
None
0
1
1
≥17
TAG bit plus 7 zeros
1
0
0
16
None
1
0
1
24
TAG bit plus 7 zeros
1
1
0
16
None
1
1
1
24
TAG bit plus 7 zeros
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ADS8330
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SCLK skew between converters and data path delay through the converters configured in chain mode can affect
the maximum frequency of SCLK. The delay can also be affected by supply voltage and loading. It may be
necessary to slow down the SCLK when the devices are configured in chain mode.
ADS8329 # 3
CDI
SDO
Logic
D
Delay
< = 8 .3 ns
Logic
Delay
Plus PAD
2.7 ns
Serial data
output
Logic
Delay
Plus PAD
8.3 ns
Q
CLK
ADS8329 # 2
SDO
CDI
Logic
D
Delay
< = 8 .3 ns
Logic
Delay
Plus PAD
2.7 ns
Q
CLK
Logic
Delay
Plus PAD
8.3 ns
ADS8329 # 1
CDI
Serial data
input
SDO
Logic
Delay
Plus PAD
2.7 ns
Logic
D
Delay
< = 8 .3 ns
Logic
Delay
Plus PAD
8.3 ns
Q
CLK
SCLK input
Figure 63. Typical Delay Through Converters Configured in Chain Mode
RESET
The converter has two reset mechanisms, a power-on reset (POR) and a software reset using CFR_D0. These
two mechanisms are NOR-ed internally. When a reset (software or POR) is issued, all register data are set to
the default values (all 1s) and the SDO output (during the cycle immediately after reset) is set to all 1s. The state
machine is reset to the power-on state.
SW RESET
CDI
POR
SET
SAR Shift
Register
Intermediate
Latch
Output
Register
Conversion Clock
Latched by End Of
Conversion
SDO
SCLK
Latched by Falling Edge of CS
CS
EOC
EOC
Figure 64. Digital Output Under Reset Condition
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ADS8329
ADS8330
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SLAS516 – DECEMBER 2006
APPLICATION INFORMATION
TYPICAL CONNECTION
Analog +5 V
4.7 mF
AGND
Ext Ref Input
22 mF
Analog Input
AGND
+VA REF+ REF− AGND IN+ IN−
Host
Processor
FS/CS
SDO
SDI
SCLK
Interface
Supply
+1.8 V
ADS8329
BDGND
CONVST
4.7 mF
EOC/INT
+VBD
Figure 65. Typical Circuit Configuration
36
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jan-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ADS8329IBRSAR
ACTIVE
QFN
RSA
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8329IBRSARG4
ACTIVE
QFN
RSA
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8329IBRSAT
ACTIVE
QFN
RSA
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8329IBRSATG4
ACTIVE
QFN
RSA
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8329IRSAR
ACTIVE
QFN
RSA
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8329IRSARG4
ACTIVE
QFN
RSA
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8329IRSAT
ACTIVE
QFN
RSA
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8329IRSATG4
ACTIVE
QFN
RSA
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8330IBRSAR
ACTIVE
QFN
RSA
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8330IBRSARG4
ACTIVE
QFN
RSA
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8330IBRSAT
ACTIVE
QFN
RSA
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8330IBRSATG4
ACTIVE
QFN
RSA
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8330IRSAR
ACTIVE
QFN
RSA
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8330IRSARG4
ACTIVE
QFN
RSA
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8330IRSAT
ACTIVE
QFN
RSA
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8330IRSATG4
ACTIVE
QFN
RSA
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jan-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
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