TI1 MSP430F5635IPZR Mixed signal microcontroller Datasheet

MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
MIXED SIGNAL MICROCONTROLLER
FEATURES
1
•
•
2
•
•
•
•
•
Low Supply Voltage Range: 1.8 V to 3.6 V
Ultralow Power Consumption
– Active Mode (AM):
All System Clocks Active:
270 µA/MHz at 8 MHz, 3.0 V, Flash Program
Execution (Typical)
– Standby Mode (LPM3):
Watchdog With Crystal, and Supply
Supervisor Operational, Full RAM
Retention, Fast Wake-Up:
1.8 µA at 2.2 V, 2.1 µA at 3.0 V (Typical)
– Shutdown RTC Mode (LPM3.5):
Shutdown Mode, Active Real-Time Clock
With Crystal:
1.1 µA at 3.0 V (Typical)
– Shutdown Mode (LPM4.5):
0.3 µA at 3.0 V (Typical)
Wake-Up From Standby Mode in 3 µs (Typical)
16-Bit RISC Architecture, Extended Memory,
up to 20-MHz System Clock
Flexible Power Management System
– Fully Integrated LDO With Programmable
Regulated Core Supply Voltage
– Supply Voltage Supervision, Monitoring,
and Brownout
Unified Clock System
– FLL Control Loop for Frequency
Stabilization
– Low-Power/Low-Frequency Internal Clock
Source (VLO)
– Low-Frequency Trimmed Internal Reference
Source (REFO)
– 32-kHz Crystals (XT1)
– High-Frequency Crystals Up to 32 MHz
(XT2)
Four 16-Bit Timer With 3, 5, or 7
Capture/Compare Registers
•
•
•
•
•
•
•
•
•
•
•
Two Universal Serial Communication
Interfaces
– USCI_A0 and USCI_A1 Each Supporting
– Enhanced UART Supporting
Auto-Baudrate Detection
– IrDA Encoder and Decoder
– Synchronous SPI
– USCI_B0 and USCI_B1 Each Supporting
– I2CTM
– Synchronous SPI
Full-Speed Universal Serial Bus (USB)
– Integrated USB-PHY
– Integrated 3.3-V/1.8-V USB Power System
– Integrated USB-PLL
– Eight Input, Eight Output Endpoints
12-Bit Analog-to-Digital (A/D) Converter With
Internal Shared Reference, Sample-and-Hold,
and Autoscan Feature
Dual 12-Bit Digital-to-Analog (D/A) Converters
With Synchronization
Voltage Comparator
Hardware Multiplier Supporting 32-Bit
Operations
Serial Onboard Programming, No External
Programming Voltage Needed
Six-Channel Internal DMA
Real-Time Clock Module With Supply Voltage
Backup Switch
Family Members are Summarized in Table 1
For Complete Module Descriptions, See the
MSP430x5xx/MSP430x6xx Family User's Guide
(SLAU208)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
DESCRIPTION
The Texas Instruments MSP430 family of ultralow-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low power
modes is optimized to achieve extended battery life in portable measurement applications. The device features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in 3 µs (typical).
The MSP430F563x series are microcontroller configurations with a high performance 12-bit analog-to-digital
(A/D) converter, comparator, two universal serial communication interfaces (USCI), USB 2.0, hardware multiplier,
DMA, four 16-bit timers, real-time clock module with alarm capabilities, and up to 74 I/O pins.
Typical applications for this device include analog and digital sensor systems, digital motor control, remote
controls, thermostats, digital timers, hand-held meters, etc.
Family members available are summarized in Table 1.
Table 1. Family Members
USCI
Device
Flash
(KB)
SRAM
(KB) (1)
Timer_A
Timer_B
Channel A:
UART/IrDA/
SPI
(2)
(3)
Channel B:
SPI/I2C
ADC12_A
(Ch)
DAC12_A
(Ch)
Comp_B
(Ch)
I/O
Package
Type
MSP430F5638
256
16 + 2
5, 3, 3
7
2
2
12 ext /
4 int
2
12
74
100 PZ,
113 ZQW
MSP430F5637
192
16 + 2
5, 3, 3
7
2
2
12 ext /
4 int
2
12
74
100 PZ,
113 ZQW
MSP430F5636
128
16 + 2
5, 3, 3
7
2
2
12 ext /
4 int
2
12
74
100 PZ,
113 ZQW
MSP430F5635
256
16 + 2
5, 3, 3
7
2
2
12 ext /
4 int
-
12
74
100 PZ,
113 ZQW
MSP430F5634
192
16 + 2
5, 3, 3
7
2
2
12 ext /
4 int
-
12
74
100 PZ,
113 ZQW
MSP430F5633
128
16 + 2
5, 3, 3
7
2
2
12 ext /
4 int
-
12
74
100 PZ,
113 ZQW
MSP430F5632
256
16 + 2
5, 3, 3
7
2
2
-
-
12
74
100 PZ,
113 ZQW
MSP430F5631
192
16 + 2
5, 3, 3
7
2
2
-
-
12
74
100 PZ,
113 ZQW
MSP430F5630
128
16 + 2
5, 3, 3
7
2
2
-
-
12
74
100 PZ,
113 ZQW
(1)
(2)
(3)
2
The additional 2 KB USB SRAM that is listed can be used as general purpose SRAM when USB is not in use.
Each number in the sequence represents an instantiation of Timer_A with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_A, the first
instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
Each number in the sequence represents an instantiation of Timer_B with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_B, the first
instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 2. Ordering Information (1)
TA
PACKAGED DEVICES (2)
PLASTIC 100-PIN TQFP (PZ)
PLASTIC 113-BALL BGA (ZQW)
MSP430F5638IPZ
MSP430F5638IZQW
MSP430F5637IPZ
MSP430F5637IZQW
MSP430F5636IPZ
MSP430F5636IZQW
MSP430F5635IPZ
MSP430F5635IZQW
MSP430F5634IPZ
MSP430F5634IZQW
MSP430F5633IPZ
MSP430F5633IZQW
MSP430F5632IPZ
MSP430F5632IZQW
MSP430F5631IPZ
MSP430F5631IZQW
MSP430F5630IPZ
MSP430F5630IZQW
–40°C to 85°C
(1)
(2)
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI web site at www.ti.com.
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/package.
Copyright © 2010–2011, Texas Instruments Incorporated
3
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Functional Block Diagram, MSP430F5638, MSP430F5637, MSP430F5636
XIN XOUT
DVCC
DVSS
AVCC
AVSS
RST/NMI
P1.x
XT2IN
XT2OUT
Unified
Clock
System
16KB
RAM
ACLK
SMCLK
256KB
192KB
128KB
Power
Management
+2KB RAM
USB Buffer
Flash
MCLK
SYS
Watchdog
+8B Backup
RAM
LDO
SVM/SVS
Brownout
P2 Port
Mapping
Controller
PA
P2.x
P3.x
PB
P4.x
P5.x
PC
P6.x
I/O Ports
P1/P2
2×8 I/Os
Interrupt
Capability
I/O Ports
P3/P4
2×8 I/Os
Interrupt
Capability
I/O Ports
P5/P6
2×8 I/Os
PA
1×16 I/Os
PB
1×16 I/Os
PC
1×16 I/Os
P7.x
PD
P8.x
I/O Ports
P7/P8
1×6 I/Os
1×8 I/Os
PD
1×14 I/Os
P9.x
I/O Ports
P9
1×8 I/Os
PE
1×8 I/Os
USCI0,1
Ax: UART,
IrDA, SPI
USB
Full-speed
Bx: SPI, I2C
CPUXV2
and
Working
Registers
EEM
(L: 8+2)
DMA
TA0
JTAG/
SBW
Interface/
MPY32
Port PJ
Timer_A
5 CC
Registers
PJ.x
TA1 and
TA2
2 Timer_A
each with
3 CC
Registers
ADC12_A
RTC_B
TB0
Timer_B
7 CC
Registers
CRC16
Comp_B
Battery
Backup
System
12 Bit
200 KSPS
16 Channels
(12 ext/4 int)
Autoscan
DAC12_A
REF
12 bit
2 channels
voltage out
Reference
1.5V, 2.0V,
2.5V
6 Channel
Functional Block Diagram, MSP430F5635, MSP430F5634, MSP430F5633
XIN XOUT
DVCC
DVSS
AVCC
AVSS
RST/NMI
P1.x
XT2IN
XT2OUT
Unified
Clock
System
MCLK
ACLK
SMCLK
256KB
192KB
128KB
Flash
16KB
RAM
Power
Management
+2KB RAM
USB Buffer
+8B Backup
RAM
SYS
Watchdog
LDO
SVM/SVS
Brownout
P2 Port
Mapping
Controller
PA
P2.x
P3.x
PB
P4.x
P5.x
PC
P6.x
I/O Ports
P1/P2
2×8 I/Os
Interrupt
Capability
I/O Ports
P3/P4
2×8 I/Os
Interrupt
Capability
I/O Ports
P5/P6
2×8 I/Os
PA
1×16 I/Os
PB
1×16 I/Os
PC
1×16 I/Os
P7.x
PD
P8.x
I/O Ports
P7/P8
1×6 I/Os
1×8 I/Os
PD
1×14 I/Os
P9.x
I/O Ports
P9
1×8 I/Os
PE
1×8 I/Os
USCI0,1
Ax: UART,
IrDA, SPI
USB
Full-speed
Bx: SPI, I2C
CPUXV2
and
Working
Registers
EEM
(L: 8+2)
JTAG/
SBW
Interface/
Port PJ
PJ.x
4
DMA
TA0
MPY32
Timer_A
5 CC
Registers
TA1 and
TA2
2 Timer_A
each with
3 CC
Registers
ADC12_A
RTC_B
TB0
Timer_B
7 CC
Registers
CRC16
Battery
Backup
System
Comp_B
12 Bit
200 KSPS
16 Channels
(12 ext/4 int)
Autoscan
REF
6 Channel
Reference
1.5V, 2.0V,
2.5V
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Functional Block Diagram, MSP430F5632, MSP430F5631, MSP430F5630
XIN XOUT
DVCC
DVSS
AVCC
AVSS
RST/NMI
P1.x
XT2IN
XT2OUT
Unified
Clock
System
MCLK
ACLK
SMCLK
256KB
192KB
128KB
Flash
16KB
RAM
Power
Management
+2KB RAM
USB Buffer
+8B Backup
RAM
SYS
Watchdog
LDO
SVM/SVS
Brownout
P2 Port
Mapping
Controller
PA
P2.x
P3.x
PB
P4.x
P5.x
PC
P6.x
I/O Ports
P1/P2
2×8 I/Os
Interrupt
Capability
I/O Ports
P3/P4
2×8 I/Os
Interrupt
Capability
I/O Ports
P5/P6
2×8 I/Os
PA
1×16 I/Os
PB
1×16 I/Os
PC
1×16 I/Os
P7.x
PD
P8.x
I/O Ports
P7/P8
1×6 I/Os
1×8 I/Os
PD
1×14 I/Os
P9.x
I/O Ports
P9
1×8 I/Os
PE
1×8 I/Os
USCI0,1
Ax: UART,
IrDA, SPI
USB
Full-speed
Bx: SPI, I2C
CPUXV2
and
Working
Registers
EEM
(L: 8+2)
JTAG/
SBW
Interface/
Port PJ
PJ.x
DMA
TA0
MPY32
Timer_A
5 CC
Registers
TA1 and
TA2
2 Timer_A
each with
3 CC
Registers
Copyright © 2010–2011, Texas Instruments Incorporated
RTC_B
REF
TB0
Timer_B
7 CC
Registers
CRC16
Battery
Backup
System
Comp_B
6 Channel
Reference
1.5V, 2.0V,
2.5V
5
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
MSP430F5638
MSP430F5637
MSP430F5636
PZ PACKAGE
(TOP VIEW)
P9.7
P9.6
P9.5
P9.4
P9.3
P9.2
P9.1
P9.0
P8.7
P8.6/UCB1SOMI/UCB1SCL
P8.5/UCB1SIMO/UCB1SDA
DVCC2
DVSS2
P8.4/UCB1CLK/UCA1STE
P8.3/UCA1RXD/UCA1SOMI
P8.2/UCA1TXD/UCA1SIMO
P8.1/UCB1STE/UCA1CLK
P8.0/TB0CLK
P4.7/TB0OUTH/SVMOUT
P4.6/TB0.6
P4.5/TB0.5
P4.4/TB0.4
P4.3/TB0.3
P4.2/TB0.2
P4.1/TB0.1
P5.5
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA0.1
P1.7/TA0.2
P3.0/TA1CLK/CBOUT
P3.1/TA1.0
P3.2/TA1.1
P3.3/TA1.2
P3.4/TA2CLK/SMCLK
P3.5/TA2.0
P3.6/TA2.1
P3.7/TA2.2
P4.0/TB0.0
P5.2
DVSS
DNC
P5.3
P5.4
DVSS1
VCORE
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6/DAC0
P6.7/CB7/A7/DAC1
P7.4/CB8/A12
P7.5/CB9/A13
P7.6/CB10/A14/DAC0
P7.7/CB11/A15/DAC1
P5.0/VREF+/VeREF+
P5.1/VREF−/VeREF−
AVCC1
AVSS1
XIN
XOUT
AVSS2
P5.6/ADC12CLK/DMAE0
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6
P2.7/P2MAP7
DVCC1
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
P6.3/CB3/A3
P6.2/CB2/A2
P6.1/CB1/A1
P6.0/CB0/A0
RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
DVSS3
DVCC3
P5.7/RTCCLK
VBAT
VBAK
P7.3/XT2OUT
P7.2/XT2IN
AVSS3
V18
VUSB
VBUS
PU.1/DM
PUR
PU.0/DP
VSSU
Pin Designation, MSP430F5638IPZ, MSP430F5637IPZ, MSP430F5636IPZ
DNC - Do not connect
6
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
MSP430F5635
MSP430F5634
MSP430F5633
PZ PACKAGE
(TOP VIEW)
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
P9.7
P9.6
P9.5
P9.4
P9.3
P9.2
P9.1
P9.0
P8.7
P8.6/UCB1SOMI/UCB1SCL
P8.5/UCB1SIMO/UCB1SDA
DVCC2
DVSS2
P8.4/UCB1CLK/UCA1STE
P8.3/UCA1RXD/UCA1SOMI
P8.2/UCA1TXD/UCA1SIMO
P8.1/UCB1STE/UCA1CLK
P8.0/TB0CLK
P4.7/TB0OUTH/SVMOUT
P4.6/TB0.6
P4.5/TB0.5
P4.4/TB0.4
P4.3/TB0.3
P4.2/TB0.2
P4.1/TB0.1
P5.5
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA0.1
P1.7/TA0.2
P3.0/TA1CLK/CBOUT
P3.1/TA1.0
P3.2/TA1.1
P3.3/TA1.2
P3.4/TA2CLK/SMCLK
P3.5/TA2.0
P3.6/TA2.1
P3.7/TA2.2
P4.0/TB0.0
P5.2
DVSS
DNC
P5.3
P5.4
DVSS1
VCORE
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
P7.4/CB8/A12
P7.5/CB9/A13
P7.6/CB10/A14
P7.7/CB11/A15
P5.0/VREF+/VeREF+
P5.1/VREF−/VeREF−
AVCC1
AVSS1
XIN
XOUT
AVSS2
P5.6/ADC12CLK/DMAE0
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6
P2.7/P2MAP7
DVCC1
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
P6.3/CB3/A3
P6.2/CB2/A2
P6.1/CB1/A1
P6.0/CB0/A0
RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
DVSS3
DVCC3
P5.7/RTCCLK
VBAT
VBAK
P7.3/XT2OUT
P7.2/XT2IN
AVSS3
V18
VUSB
VBUS
PU.1/DM
PUR
PU.0/DP
VSSU
Pin Designation, MSP430F5635IPZ, MSP430F5634IPZ, MSP430F5633IPZ
DNC - Do not connect
Copyright © 2010–2011, Texas Instruments Incorporated
7
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
P6.0/CB0
RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
DVSS3
DVCC3
P5.7/RTCCLK
VBAT
VBAK
P7.3/XT2OUT
P7.2/XT2IN
AVSS3
V18
VUSB
VBUS
PU.1/DM
PUR
PU.0/DP
VSSU
P6.1/CB1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
MSP430F5632
MSP430F5631
MSP430F5630
PZ PACKAGE
(TOP VIEW)
P9.7
P9.6
P9.5
P9.4
P9.3
P9.2
P9.1
P9.0
P8.7
P8.6/UCB1SOMI/UCB1SCL
P8.5/UCB1SIMO/UCB1SDA
DVCC2
DVSS2
P8.4/UCB1CLK/UCA1STE
P8.3/UCA1RXD/UCA1SOMI
P8.2/UCA1TXD/UCA1SIMO
P8.1/UCB1STE/UCA1CLK
P8.0/TB0CLK
P4.7/TB0OUTH/SVMOUT
P4.6/TB0.6
P4.5/TB0.5
P4.4/TB0.4
P4.3/TB0.3
P4.2/TB0.2
P4.1/TB0.1
P5.5
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA0.1
P1.7/TA0.2
P3.0/TA1CLK/CBOUT
P3.1/TA1.0
P3.2/TA1.1
P3.3/TA1.2
P3.4/TA2CLK/SMCLK
P3.5/TA2.0
P3.6/TA2.1
P3.7/TA2.2
P4.0/TB0.0
P5.2
DVSS
DNC
P5.3
P5.4
DVSS1
VCORE
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
P6.4/CB4
P6.5/CB5
P6.6/CB6
P6.7/CB7
P7.4/CB8
P7.5/CB9
P7.6/CB10
P7.7/CB11
P5.0/VREF+/VeREF+
P5.1/VREF−/VeREF−
AVCC1
AVSS1
XIN
XOUT
AVSS2
P5.6/DMAE0
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6
P2.7/P2MAP7
DVCC1
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
P6.3/CB3
P6.2/CB2
Pin Designation, MSP430F5632IPZ, MSP430F5631IPZ, MSP430F5630IPZ
DNC - Do not connect
8
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Pin Designation, MSP430F5638IZQW, MSP430F5637IZQW, MSP430F5636IZQW,
MSP430F5635IZQW, MSP430F5634IZQW, MSP430F5633IZQW, MSP430F5632IZQW,
MSP430F5631IZQW, MSP430F5630IZQW
ZQW PACKAGE
(TOP VIEW)
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
C1
C2
C3
C11
C12
D1
D2
D4
D5
D6
D7
D8
D9
D11
D12
E1
E2
E4
E5
E6
E7
E8
E9
E11
E12
F1
F2
F4
F5
F8
F9
F11
F12
G1
G2
G4
G5
G8
G9
G11
G12
H1
H2
H4
H5
H6
H7
H8
H9
H11
H12
J1
J2
J4
J5
J6
J7
J8
J9
J11
J12
K1
K2
K11
K12
L1
L2
L3
L4
L5
L6
L7
L8
L9
L10
L11
L12
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
M11
M12
NOTE: For terminal assignments, see Table 3
Copyright © 2010–2011, Texas Instruments Incorporated
9
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 3. Terminal Functions
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
P6.4/CB4/A4
1
A1
I/O
General-purpose digital I/O
Comparator_B input CB4
Analog input A4 – ADC (not available on '5632, '5631, '5630 devices)
P6.5/CB5/A5
2
B2
I/O
General-purpose digital I/O
Comparator_B input CB5
Analog input A5 – ADC (not available on '5632, '5631, '5630 devices)
I/O
General-purpose digital I/O
Comparator_B input CB6
Analog input A6 – ADC (not available on '5632, '5631, '5630 devices)
DAC12.0 output (not available on '5635, '5634, '5633, '5632, '5631, '5630 devices)
P6.6/CB6/A6/DAC0
3
B1
P6.7/CB7/A7/DAC1
4
C2
I/O
General-purpose digital I/O
Comparator_B input CB7
Analog input A7 – ADC (not available on '5632, '5631, '5630 devices)
DAC12.1 output (not available on '5635, '5634, '5633, '5632, '5631, '5630 devices)
P7.4/CB8/A12
5
C1
I/O
General-purpose digital I/O
Comparator_B input CB8
Analog input A12 –ADC (not available on '5632, '5631, '5630 devices)
P7.5/CB9/A13
6
C3
I/O
General-purpose digital I/O
Comparator_B input CB9
Analog input A13 – ADC (not available on '5632, '5631, '5630 devices)
P7.6/CB10/A14/DAC0
7
D2
I/O
General-purpose digital I/O
Comparator_B input CB10
Analog input A14 – ADC (not available on '5632, '5631, '5630 devices)
DAC12.0 output (not available on '5635, '5634, '5633, '5632, '5631, '5630 devices)
P7.7/CB11/A15/DAC1
8
D1
I/O
General-purpose digital I/O
Comparator_B input CB11
Analog input A15 – ADC (not available on '5632, '5631, '5630 devices)
DAC12.1 output (not available on '5635, '5634, '5633, '5632, '5631, '5630 devices)
P5.0/VREF+/VeREF+
9
D4
I/O
General-purpose digital I/O
Output of reference voltage to the ADC
Input for an external reference voltage to the ADC
P5.1/VREF-/VeREF-
10
E4
I/O
General-purpose digital I/O
Negative terminal for the ADC's reference voltage for both sources, the internal
reference voltage, or an external applied reference voltage
AVCC1
11
E1,
E2
Analog power supply
AVSS1
12
F2
Analog ground supply
XIN
13
F1
I
Input terminal for crystal oscillator XT1
XOUT
14
G1
O
Output terminal of crystal oscillator XT1
AVSS2
15
G2
P5.6/ADC12CLK/DMAE0
16
H1
I/O
General-purpose digital I/O
Conversion clock output ADC (not available on '5632, '5631, '5630 devices)
DMA external trigger input
P2.0/P2MAP0
17
G4
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: USCI_B0 SPI slave transmit enable; USCI_A0 clock input/output
P2.1/P2MAP1
18
H2
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: USCI_B0 SPI slave in/master out; USCI_B0 I2C data
P2.2/P2MAP2
19
J1
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: USCI_B0 SPI slave out/master in; USCI_B0 I2C clock
P2.3/P2MAP3
20
H4
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: USCI_B0 clock input/output; USCI_A0 SPI slave transmit enable
P2.4/P2MAP4
21
J2
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: USCI_A0 UART transmit data; USCI_A0 SPI slave in/master out
P2.5/P2MAP5
22
K1
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: USCI_A0 UART receive data; USCI_A0 slave out/master in
(1)
10
Analog ground supply
I = input, O = output, N/A = not available on this package offering
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 3. Terminal Functions (continued)
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
P2.6/P2MAP6
23
K2
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: no secondary function
P2.7/P2MAP7
24
L2
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: no secondary function
DVCC1
25
L1
Digital power supply
DVSS1
26
M1
Digital ground supply
VCORE
(2)
27
M2
P5.2
28
L3
DVSS
29
M3
DNC
30
J4
I/O
Do not connect. It is strongly recommended to leave this terminal open.
P5.3
31
L4
I/O
General-purpose digital I/O
P5.4
32
M4
I/O
General-purpose digital I/O
P5.5
33
J5
I/O
General-purpose digital I/O
P1.0/TA0CLK/ACLK
34
L5
I/O
General-purpose digital I/O with port interrupt
Timer TA0 clock signal TACLK input
ACLK output (divided by 1, 2, 4, or 8)
P1.1/TA0.0
35
M5
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR0 capture: CCI0A input, compare: Out0 output
BSL transmit output
P1.2/TA0.1
36
J6
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR1 capture: CCI1A input, compare: Out1 output
BSL receive input
P1.3/TA0.2
37
H6
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR2 capture: CCI2A input, compare: Out2 output
P1.4/TA0.3
38
M6
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR3 capture: CCI3A input compare: Out3 output
P1.5/TA0.4
39
L6
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR4 capture: CCI4A input, compare: Out4 output
P1.6/TA0.1
40
J7
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR1 capture: CCI1B input, compare: Out1 output
P1.7/TA0.2
41
M7
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR2 capture: CCI2B input, compare: Out2 output
P3.0/TA1CLK/CBOUT
42
L7
I/O
General-purpose digital I/O with port interrupt
Timer TA1 clock input
Comparator_B output
P3.1/TA1.0
43
H7
I/O
General-purpose digital I/O with port interrupt
Timer TA1 capture CCR0: CCI0A/CCI0B input, compare: Out0 output
P3.2/TA1.1
44
M8
I/O
General-purpose digital I/O with port interrupt
Timer TA1 capture CCR1: CCI1A/CCI1B input, compare: Out1 output
P3.3/TA1.2
45
L8
I/O
General-purpose digital I/O with port interrupt
Timer TA1 capture CCR2: CCI2A/CCI2B input, compare: Out2 output
P3.4/TA2CLK/SMCLK
46
J8
I/O
General-purpose digital I/O with port interrupt
Timer TA2 clock input
SMCLK output
P3.5/TA2.0
47
M9
I/O
General-purpose digital I/O with port interrupt
Timer TA2 capture CCR0: CCI0A/CCI0B input, compare: Out0 output
P3.6/TA2.1
48
L9
I/O
General-purpose digital I/O with port interrupt
Timer TA2 capture CCR1: CCI1A/CCI1B input, compare: Out1 output
P3.7/TA2.2
49
M10
I/O
General-purpose digital I/O with port interrupt
Timer TA2 capture CCR2: CCI2A/CCI2B input, compare: Out2 output
(2)
Regulated core power supply (internal usage only, no external current loading)
I/O
General-purpose digital I/O
Digital ground supply
VCORE is for internal usage only. No external current loading is possible. VCORE should only be connected to the recommended
capacitor value, CVCORE.
Copyright © 2010–2011, Texas Instruments Incorporated
11
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 3. Terminal Functions (continued)
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
P4.0/TB0.0
50
J9
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR0: CCI0A/CCI0B input, compare: Out0 output
P4.1/TB0.1
51
M11
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR1: CCI1A/CCI1B input, compare: Out1 output
P4.2/TB0.2
52
L10
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR2: CCI2A/CCI2B input, compare: Out2 output
P4.3/TB0.3
53
M12
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR3: CCI3A/CCI3B input, compare: Out3 output
P4.4/TB0.4
54
L12
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR4: CCI4A/CCI4B input, compare: Out4 output
P4.5/TB0.5
55
L11
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR5: CCI5A/CCI5B input, compare: Out5 output
P4.6/TB0.6
56
K11
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR6: CCI6A/CCI6B input, compare: Out6 output
P4.7/TB0OUTH/SVMOUT
57
K12
I/O
General-purpose digital I/O with port interrupt
Timer TB0: Switch all PWM outputs high impedance
SVM output
P8.0/TB0CLK
58
J11
I/O
General-purpose digital I/O
Timer TB0 clock input
P8.1/UCB1STE/UCA1CLK
59
J12
I/O
General-purpose digital I/O
USCI_B1 SPI slave transmit enable; USCI_A1 clock input/output
P8.2/UCA1TXD/UCA1SIMO
60
H11
I/O
General-purpose digital I/O
USCI_A1 UART transmit data; USCI_A1 SPI slave in/master out
P8.3/UCA1RXD/UCA1SOMI
61
H12
I/O
General-purpose digital I/O
USCI_A1 UART receive data; USCI_A1 SPI slave out/master in
P8.4/UCB1CLK/UCA1STE
62
G11
I/O
General-purpose digital I/O
USCI_B1 clock input/output; USCI_A1 SPI slave transmit enable
DVSS2
63
G12
Digital ground supply
DVCC2
64
F12
Digital power supply
P8.5/UCB1SIMO/UCB1SDA
65
F11
I/O
General-purpose digital I/O
USCI_B1 SPI slave in/master out; USCI_B1 I2C data
P8.6/UCB1SOMI/UCB1SCL
66
G9
I/O
General-purpose digital I/O
USCI_B1 SPI slave out/master in; USCI_B1 I2C clock
P8.7
67
E12
I/O
General-purpose digital I/O
P9.0
68
E11
I/O
General-purpose digital I/O
P9.1
69
F9
I/O
General-purpose digital I/O
P9.2
70
D12
I/O
General-purpose digital I/O
P9.3
71
D11
I/O
General-purpose digital I/O
P9.4
72
E9
I/O
General-purpose digital I/O
P9.5
73
C12
I/O
General-purpose digital I/O
P9.6
74
C11
I/O
General-purpose digital I/O
P9.7
75
D9
I/O
General-purpose digital I/O
VSSU
76
B11
and
B12
PU.0/DP
77
A12
I/O
General-purpose digital I/O - controlled by USB control register
USB data terminal DP
PUR
78
B10
I/O
USB pull-up resistor pin (open drain)
PU.1/DM
79
A11
I/O
General-purpose digital I/O - controlled by USB control register
USB data terminal DM
VBUS
80
A10
USB LDO input (connect to USB power source)
VUSB
81
A9
USB LDO output
12
USB PHY ground supply
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 3. Terminal Functions (continued)
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
V18
82
B9
USB regulated power (internal usage only, no external current loading)
AVSS3
83
A8
Analog ground supply
P7.2/XT2IN
84
B8
I/O
General-purpose digital I/O
Input terminal for crystal oscillator XT2
P7.3/XT2OUT
85
B7
I/O
General-purpose digital I/O
Output terminal of crystal oscillator XT2
VBAK
86
A7
Capacitor for backup subsystem. Do not load this pin externally. For capacitor
values, see CBAK in Recommended Operating Conditions.
VBAT
87
D8
Backup/secondary supply voltage. If backup voltage is not supplied connect to
DVCC externally.
P5.7/RTCCLK
88
D7
DVCC3
89
A6
Digital power supply
DVSS3
90
A5
Digital ground supply
TEST/SBWTCK
91
B6
I
PJ.0/TDO
92
B5
I/O
General-purpose digital I/O
Test data output port
PJ.1/TDI/TCLK
93
A4
I/O
General-purpose digital I/O
Test data input or test clock input
PJ.2/TMS
94
E7
I/O
General-purpose digital I/O
Test mode select
PJ.3/TCK
95
D6
I/O
General-purpose digital I/O
Test clock
RST/NMI/SBWTDIO
96
A3
I/O
Reset input active low
Non-maskable interrupt input
Spy-bi-wire data input/output
P6.0/CB0/A0
97
B4
I/O
General-purpose digital I/O
Comparator_B input CB0
Analog input A0 – ADC (not available on '5632, '5631, '5630 devices)
P6.1/CB1/A1
98
B3
I/O
General-purpose digital I/O
Comparator_B input CB1
Analog input A1 – ADC (not available on '5632, '5631, '5630 devices)
P6.2/CB2/A2
99
A2
I/O
General-purpose digital I/O
Comparator_B input CB2
Analog input A2 – ADC (not available on '5632, '5631, '5630 devices)
P6.3/CB3/A3
100
D5
I/O
General-purpose digital I/O
Comparator_B input CB3
Analog input A3 – ADC (not available on '5632, '5631, '5630 devices)
N/A
E5
E6
E8
F4
F5
F8
G5
G8
H5
H8
H9
Reserved
Copyright © 2010–2011, Texas Instruments Incorporated
I/O
General-purpose digital I/O
RTCCLK output
Test mode pin – select digital I/O on JTAG pins
Spy-bi-wire input clock
Reserved BGA package balls. It is recommended to connect to ground
(DVSS/AVSS).
13
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
SHORT-FORM DESCRIPTION
CPU
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions, are
performed as register operations in conjunction with
seven addressing modes for source operand and four
addressing modes for destination operand.
Program Counter
PC/R0
Stack Pointer
SP/R1
Status Register
SR/CG1/R2
Constant Generator
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled with
all instructions.
General-Purpose Register
R10
General-Purpose Register
R11
Instruction Set
General-Purpose Register
R12
The instruction set consists of the original 51
instructions with three formats and seven address
modes and additional instructions for the expanded
address range. Each instruction can operate on word
and byte data. Table 4 shows examples of the three
types of instruction formats; Table 5 shows the
address modes.
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
The CPU is integrated with 16 registers that provide
reduced
instruction
execution
time.
The
register-to-register operation execution time is one
cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register, and
constant generator, respectively. The remaining
registers are general-purpose registers.
Table 4. Instruction Word Formats
INSTRUCTION WORD FORMAT
Dual operands, source-destination
EXAMPLE
ADD
Single operands, destination only
R4 + R5 → R5
R8
PC → (TOS), R8 → PC
CALL
Relative jump, un/conditional
OPERATION
R4,R5
JNE
Jump-on-equal bit = 0
Table 5. Address Mode Descriptions
(1)
14
ADDRESS MODE
S (1)
D (1)
Register
+
+
MOV Rs,Rd
MOV R10,R11
R10 → R11
Indexed
+
+
MOV X(Rn),Y(Rm)
MOV 2(R5),6(R6)
M(2+R5) → M(6+R6)
Symbolic (PC relative)
+
+
MOV EDE,TONI
Absolute
+
+
MOV &MEM, &TCDAT
Indirect
+
MOV @Rn,Y(Rm)
MOV @R10,Tab(R6)
M(R10) → M(Tab+R6)
Indirect auto-increment
+
MOV @Rn+,Rm
MOV @R10+,R11
M(R10) → R11
R10 + 2 → R10
Immediate
+
MOV #X,TONI
MOV #45,TONI
#45 → M(TONI)
SYNTAX
EXAMPLE
OPERATION
M(EDE) → M(TONI)
M(MEM) → M(TCDAT)
S = source, D = destination
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
www.ti.com
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
Operating Modes
The MSP430 has one active mode and seven software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the low-power modes, service the request, and restore back to the
low-power mode on return from the interrupt program.
The following seven operating modes can be configured by software:
• Active mode (AM)
– All clocks are active
• Low-power mode 0 (LPM0)
– CPU is disabled
– ACLK and SMCLK remain active, MCLK is disabled
– FLL loop control remains active
• Low-power mode 1 (LPM1)
– CPU is disabled
– FLL loop control is disabled
– ACLK and SMCLK remain active, MCLK is disabled
• Low-power mode 2 (LPM2)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO's dc generator remains enabled
– ACLK remains active
• Low-power mode 3 (LPM3)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO's dc generator is disabled
– ACLK remains active
• Low-power mode 4 (LPM4)
– CPU is disabled
– ACLK is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO's dc generator is disabled
– Crystal oscillator is stopped
– Complete data retention
• Low-power mode 3.5 (LPM3.5)
– Internal regulator disabled
– No data retention
– RTC enabled and clocked by low-frequency oscillator
– Wakeup from RST/NMI, RTC_B, P1, P2, P3, and P4
• Low-power mode 4.5 (LPM4.5)
– Internal regulator disabled
– No data retention
– Wakeup from RST/NMI, RTC_B, P1, P2, P3, and P4
Copyright © 2010–2011, Texas Instruments Incorporated
15
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Interrupt Vector Addresses
The interrupt vectors and the power-up start address are located in the address range 0FFFFh to 0FF80h. The
vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
Table 6. Interrupt Sources, Flags, and Vectors of MSP430F563x Configurations
INTERRUPT SOURCE
System Reset
Power-Up, External Reset
Watchdog Timeout, Key Violation
Flash Memory Key Violation
INTERRUPT FLAG
WDTIFG, KEYV (SYSRSTIV) (1)
(2)
SYSTEM
INTERRUPT
WORD
ADDRESS
PRIORITY
Reset
0FFFEh
63, highest
System NMI
PMM
Vacant Memory Access
JTAG Mailbox
SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG,
VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG,
JMBOUTIFG (SYSSNIV) (1)
(Non)maskable
0FFFCh
62
User NMI
NMI
Oscillator Fault
Flash Memory Access Violation
NMIIFG, OFIFG, ACCVIFG, BUSIFG
(SYSUNIV) (1) (2)
(Non)maskable
0FFFAh
61
Maskable
0FFF8h
60
Comp_B
Timer TB0
Timer TB0
Watchdog Interval Timer Mode
0FFF6h
59
Maskable
0FFF4h
58
WDTIFG
Maskable
0FFF2h
57
Maskable
0FFF0h
56
Maskable
0FFEEh
55
Maskable
0FFECh
54
USCI_B0 Receive/Transmit
UCB0RXIFG, UCB0TXIFG (UCAB0IV) (1)
ADC12_A (4)
ADC12IFG0 to ADC12IFG15 (ADC12IV) (1)
TA0CCR0 CCIFG0
(3)
(3)
(3)
(3)
Maskable
0FFEAh
53
Timer TA0
TA0CCR1 CCIFG1 to TA0CCR4 CCIFG4,
TA0IFG (TA0IV) (1) (3)
Maskable
0FFE8h
52
USB_UBM
USB interrupts (USBIV) (1) (3)
Maskable
0FFE6h
51
DMA
DMA0IFG, DMA1IFG, DMA2IFG, DMA3IFG,
DMA4IFG, DMA5IFG (DMAIV) (1) (3)
Maskable
0FFE4h
50
Timer TA1
TA1CCR0 CCIFG0 (3)
Maskable
0FFE2h
49
Timer TA1
TA1CCR1 CCIFG1 to TA1CCR2 CCIFG2,
TA1IFG (TA1IV) (1) (3)
Maskable
0FFE0h
48
Maskable
0FFDEh
47
Maskable
0FFDCh
46
Maskable
0FFDAh
45
Maskable
0FFD8h
44
Maskable
0FFD6h
43
Maskable
0FFD4h
42
Maskable
0FFD2h
41
P1IFG.0 to P1IFG.7 (P1IV)
(1) (3)
(1) (3)
USCI_A1 Receive/Transmit
UCA1RXIFG, UCA1TXIFG (UCA1IV)
USCI_B1 Receive/Transmit
UCB1RXIFG, UCB1TXIFG (UCB1IV) (1)
I/O Port P2
P2IFG.0 to P2IFG.7 (P2IV) (1)
Reserved
(3)
(3)
Reserved
RTC_B
RTCRDYIFG, RTCTEVIFG, RTCAIFG,
RT0PSIFG, RT1PSIFG, RTCOFIFG (RTCIV) (1)
DAC12_A (5)
DAC12_0IFG, DAC12_1IFG (1)
Timer TA2
TA2CCR0 CCIFG2
(3)
(3)
(3)
Maskable
0FFD0h
40
Timer TA2
TA2CCR1 CCIFG1 to TA2CCR2,
TA2IFG (TA2IV) (1) (3)
Maskable
0FFCEh
39
I/O Port P3
P3IFG.0 to P3IFG.7 (P3IV) (1)
(3)
Maskable
0FFCCh
38
(1) (3)
Maskable
0FFCAh
37
I/O Port P4
16
Maskable
TB0CCR1 CCIFG1 to TB0CCR6 CCIFG6,
TB0IFG (TBIV) (1) (3)
UCA0RXIFG, UCA0TXIFG (UCA0IV) (1)
I/O Port P1
(3)
(4)
(5)
TB0CCR0 CCIFG0
(3)
(3)
USCI_A0 Receive/Transmit
Timer TA0
(1)
(2)
Comparator B interrupt flags (CBIV) (1)
P4IFG.0 to P4IFG.7 (P4IV)
Multiple source flags
A reset is generated if the CPU tries to fetch instructions from within peripheral space or vacant memory space.
(Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it.
Interrupt flags are located in the module.
Only on devices with peripheral module ADC12_A, otherwise reserved.
Only on devices with peripheral module DAC12_A, otherwise reserved.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 6. Interrupt Sources, Flags, and Vectors of MSP430F563x Configurations (continued)
(6)
INTERRUPT SOURCE
INTERRUPT FLAG
Reserved
Reserved (6)
SYSTEM
INTERRUPT
WORD
ADDRESS
PRIORITY
0FFC8h
36
⋮
⋮
0FF80h
0, lowest
Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain
compatability with other devices, it is recommended to reserve these locations.
Memory Organization
Table 7. Memory Organization (1)
Memory (flash)
Main: interrupt vector
Main: code memory
RAM
USB RAM (3)
Information memory
(flash)
Bootstrap loader (BSL)
memory (flash)
Peripherals
(1)
(2)
(3)
(2)
MSP430F5636
MSP430F5633
MSP430F5630
MSP430F5637
MSP430F5634
MSP430F5631
MSP430F5637
MSP430F5634
MSP430F5631
128KB
00FFFFh–00FF80h
192KB
00FFFFh–00FF80h
256KB
00FFFFh–00FF80h
Bank 3
N/A
N/A
64 KB
047FFF-038000h
Bank 2
N/A
64 KB
037FFF-028000h
64 KB
037FFF-028000h
Bank 1
64 KB
027FFF-018000h
64 KB
027FFF-018000h
64 KB
027FFF-018000h
Bank 0
64 KB
017FFF-008000h
64 KB
017FFF-008000h
64 KB
017FFF-008000h
Sector 3
4 KB
0063FFh–005400h
4 KB
0063FFh–005400h
4 KB
0063FFh–005400h
Sector 2
4 KB
0053FFh–004400h
4 KB
0053FFh–004400h
4 KB
0053FFh–004400h
Sector 1
4 KB
0043FFh–003400h
4 KB
0043FFh–003400h
4 KB
0043FFh–003400h
Sector 0
4 KB
0033FFh–002400h
4 KB
0033FFh–002400h
4 KB
0033FFh–002400h
Size
RAM
2KB
0023FFh-001C00h
2KB
0023FFh-001C00h
2KB
0023FFh-001C00h
Info A
128 B
0019FFh–001980h
128 B
0019FFh–001980h
128 B
0019FFh–001980h
Info B
128 B
00197Fh–001900h
128 B
00197Fh–001900h
128 B
00197Fh–001900h
Info C
128 B
0018FFh–001880h
128 B
0018FFh–001880h
128 B
0018FFh–001880h
Info D
128 B
00187Fh–001800h
128 B
00187Fh–001800h
128 B
00187Fh–001800h
BSL 3
512 B
0017FFh–001600h
512 B
0017FFh–001600h
512 B
0017FFh–001600h
BSL 2
512 B
0015FFh–001400h
512 B
0015FFh–001400h
512 B
0015FFh–001400h
BSL 1
512 B
0013FFh–001200h
512 B
0013FFh–001200h
512 B
0013FFh–001200h
BSL 0
512 B
0011FFh–001000h
512 B
0011FFh–001000h
512 B
0011FFh–001000h
Size
4KB
000FFFh–000000h
4KB
000FFFh–000000h
4KB
000FFFh–000000h
Total Size
N/A = Not available.
Backup RAM is accessed via the control registers BAKMEM0, BAKMEM1, BAKMEM2, and BAKMEM3.
USB RAM can be used as general purpose RAM when not used for USB operation.
Copyright © 2010–2011, Texas Instruments Incorporated
17
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Bootstrap Loader (BSL)
The BSL enables users to program the flash memory or RAM using various serial interfaces. Access to the
device memory via the BSL is protected by an user-defined password. For complete description of the features of
the BSL and its implementation, see the MSP430 Memory Programming User's Guide (SLAU265).
USB BSL
All devices come pre-programmed with the USB BSL. Usage of the USB BSL requires external access to the six
pins shown in Table 8. In addition to these pins, the application must support external components necessary for
normal USB operation; for example, proper crystal on XT2IN and XT2OUT, proper decoupling, etc.
Table 8. USB BSL Pin Requirements and Functions
DEVICE SIGNAL
BSL FUNCTION
RST/NMI/SBWTDIO
Entry sequence signal
PU.0/DP
USB data terminal DP
PU.1/DM
USB data terminal DM
PUR
USB pullup resistor terminal
VBUS
USB bus power supply
VSSU
USB ground supply
UART BSL
A UART BSL is also available that can be programmed by the user into the BSL memory by replacing the
pre-programmed, factory supplied, USB BSL. Usage of the UART BSL requires external access to the six pins
shown in Table 9.
Table 9. UART BSL Pin Requirements and Functions
18
DEVICE SIGNAL
BSL FUNCTION
RST/NMI/SBWTDIO
Entry sequence signal
TEST/SBWTCK
Entry sequence signal
P1.1
Data transmit
P1.2
Data receive
VCC
Power supply
VSS
Ground supply
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
JTAG Operation
JTAG Standard Interface
The MSP430 family supports the standard JTAG interface which requires four signals for sending and receiving
data. The JTAG signals are shared with general-purpose I/O. The TEST/SBWTCK pin is used to enable the
JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with MSP430
development tools and device programmers. The JTAG pin requirements are shown in Table 10. For further
details on interfacing to development tools and device programmers, see the MSP430 Hardware Tools User's
Guide (SLAU278).
Table 10. JTAG Pin Requirements and Functions
DEVICE SIGNAL
DIRECTION
FUNCTION
PJ.3/TCK
IN
JTAG clock input
PJ.2/TMS
IN
JTAG state control
PJ.1/TDI/TCLK
IN
JTAG data input/TCLK input
PJ.0/TDO
OUT
JTAG data output
TEST/SBWTCK
IN
Enable JTAG pins
RST/NMI/SBWTDIO
IN
External reset
VCC
Power supply
VSS
Ground supply
Spy-Bi-Wire Interface
In addition to the standard JTAG interface, the MSP430 family supports the two wire Spy-Bi-Wire interface.
Spy-Bi-Wire can be used to interface with MSP430 development tools and device programmers. The Spy-Bi-Wire
interface pin requirements are shown in Table 11. For further details on interfacing to development tools and
device programmers, see the MSP430 Hardware Tools User's Guide (SLAU278).
Table 11. Spy-Bi-Wire Pin Requirements and Functions
DEVICE SIGNAL
DIRECTION
FUNCTION
TEST/SBWTCK
IN
Spy-Bi-Wire clock input
RST/NMI/SBWTDIO
IN, OUT
Spy-Bi-Wire data input/output
VCC
Power supply
VSS
Ground supply
Flash Memory
The flash memory can be programmed via the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in-system by the
CPU. The CPU can perform single-byte, single-word, and long-word writes to the flash memory. Features of the
flash memory include:
• Flash memory has n segments of main memory and four segments of information memory (A to D) of
128 bytes each. Each segment in main memory is 512 bytes in size.
• Segments 0 to n may be erased in one step, or each segment may be individually erased.
• Segments A to D can be erased individually, or as a group with segments 0 to n. Segments A to D are also
called information memory.
• Segment A can be locked separately.
RAM Memory
The RAM memory is made up of n sectors. Each sector can be completely powered down to save leakage,
however all data is lost. Features of the RAM memory include:
• RAM memory has n sectors. The size of a sector can be found in Memory Organization.
• Each sector 0 to n can be complete disabled, however data retention is lost.
• Each sector 0 to n automatically enters low power retention mode when possible.
• For devices that contain USB memory, the USB memory can be used as normal RAM if USB is not required.
Copyright © 2010–2011, Texas Instruments Incorporated
19
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Backup RAM Memory
The backup RAM provides a limited number of bytes of RAM that are retained during LPMx.5 and during
operation from a backup supply if the Battery Backup System module is implemented.
There are 8 bytes of Backup RAM available on MSP430F563x. It can be wordwise accessed via the control
registers BAKMEM0, BAKMEM1, BAKMEM2, and BAKMEM3.
Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, see the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU
208).
Digital I/O
There are up to nine 8-bit I/O ports implemented: P1 through P9 are complete, and port PJ contains four
individual I/O ports.
• All individual I/O bits are independently programmable.
• Any combination of input, output, and interrupt conditions is possible.
• Programmable pullup or pulldown on all ports.
• Programmable drive strength on all ports.
• Edge-selectable interrupt input capability for all the eight bits of ports P1, P2, P3, and P4.
• Read/write access to port-control registers is supported by all instructions.
• Ports can be accessed byte-wise (P1 through P9) or word-wise in pairs (PA through PD).
Port Mapping Controller
The port mapping controller allows the flexible and reconfigurable mapping of digital functions to port P2.
Table 12. Port Mapping, Mnemonics and Functions
VALUE
PxMAPy MNEMONIC
INPUT PIN FUNCTION
0
PM_NONE
None
DVSS
PM_CBOUT
-
Comparator_B output
1
PM_TB0CLK
Timer TB0 clock input
-
PM_ADC12CLK
-
ADC12CLK
PM_DMAE0
DMAE0 Input
-
PM_SVMOUT
-
SVM output
PM_TB0OUTH
Timer TB0 high impedance input
TB0OUTH
-
4
PM_TB0CCR0B
Timer TB0 CCR0 capture input CCI0B
Timer TB0: TB0.0 compare output Out0
5
PM_TB0CCR1B
Timer TB0 CCR1 capture input CCI1B
Timer TB0: TB0.1 compare output Out1
6
PM_TB0CCR2B
Timer TB0 CCR2 capture input CCI2B
Timer TB0: TB0.2 compare output Out2
7
PM_TB0CCR3B
Timer TB0 CCR3 capture input CCI3B
Timer TB0: TB0.3 compare output Out3
8
PM_TB0CCR4B
Timer TB0 CCR4 capture input CCI4B
Timer TB0: TB0.4 compare output Out4
9
PM_TB0CCR5B
Timer TB0 CCR5 capture input CCI5B
Timer TB0: TB0.5 compare output Out5
10
PM_TB0CCR6B
Timer TB0 CCR6 capture input CCI6B
Timer TB0: TB0.6 compare output Out6
2
3
11
12
13
14
20
OUTPUT PIN FUNCTION
PM_UCA0RXD
USCI_A0 UART RXD (Direction controlled by USCI - input)
PM_UCA0SOMI
USCI_A0 SPI slave out master in (direction controlled by USCI)
PM_UCA0TXD
USCI_A0 UART TXD (Direction controlled by USCI - output)
PM_UCA0SIMO
USCI_A0 SPI slave in master out (direction controlled by USCI)
PM_UCA0CLK
USCI_A0 clock input/output (direction controlled by USCI)
PM_UCB0STE
USCI_B0 SPI slave transmit enable (direction controlled by USCI - input)
PM_UCB0SOMI
USCI_B0 SPI slave out master in (direction controlled by USCI)
PM_UCB0SCL
USCI_B0 I2C clock (open drain and direction controlled by USCI)
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 12. Port Mapping, Mnemonics and Functions (continued)
VALUE
PxMAPy MNEMONIC
15
16
OUTPUT PIN FUNCTION
USCI_B0 SPI slave in master out (direction controlled by USCI)
PM_UCB0SDA
USCI_B0 I2C data (open drain and direction controlled by USCI)
PM_UCB0CLK
USCI_B0 clock input/output (direction controlled by USCI)
PM_UCA0STE
USCI_A0 SPI slave transmit enable (direction controlled by USCI - input)
17
PM_MCLK
-
18
Reserved
Reserved for test purposes. Do not use this setting.
19
Reserved
Reserved for test purposes. Do not use this setting.
20 - 30
31 (0FFh)
(1)
INPUT PIN FUNCTION
PM_UCB0SIMO
Reserved
(1)
MCLK
None
DVSS
Disables the output driver as well as the input Schmitt-trigger to prevent parasitic cross
currents when applying analog signals.
PM_ANALOG
The value of the PMPAP_ANALOG mnemonic is set to 0FFh. The port mapping registers are only 5 bits wide and the upper bits are
ignored resulting in a read out value of 31.
Table 13. Default Mapping
PIN
PxMAPy MNEMONIC
P2.0/P2MAP0
PM_UCB0STE/
PM_UCA0CLK
INPUT PIN FUNCTION
USCI_B0 SPI slave transmit enable (direction controlled by USCI - input) /
USCI_A0 clock input/output (direction controlled by USCI)
OUTPUT PIN FUNCTION
P2.1/P2MAP1
PM_UCB0SIMO/
PM_UCB0SDA
USCI_B0 SPI slave in master out (direction controlled by USCI) / USCI_B0 I2C
data (open drain and direction controlled by USCI)
P2.2/P2MAP2
PM_UCB0SOMI/
PM_UCB0SCL
USCI_B0 SPI slave out master in (direction controlled by USCI) / USCI_B0 I2C
clock (open drain and direction controlled by USCI)
P2.3/P2MAP3
PM_UCB0CLK/
PM_UCA0STE
USCI_B0 clock input/output (direction controlled by USCI) / USCI_A0 SPI slave
transmit enable (direction controlled by USCI - input)
P2.4/P2MAP4
PM_UCA0TXD/
PM_UCA0SIMO
USCI_A0 UART TXD (direction controlled by USCI - output) / USCI_A0 SPI slave
in master out (direction controlled by USCI)
P2.5/P2MAP5
PM_UCA0RXD/
PM_UCA0SOMI
USCI_A0 UART RXD (direction controlled by USCI - input) / USCI_A0 SPI slave
out master in (direction controlled by USCI)
P2.6/P2MAP6
PM_NONE
-
DVSS
P2.7/P2MAP7
PM_NONE
-
DVSS
Oscillator and System Clock
The clock system in the MSP430F563x family of devices is supported by the Unified Clock System (UCS)
module that includes support for a 32-kHz watch crystal oscillator (in XT1 LF mode; XT1 HF mode is not
supported), an internal very-low-power low-frequency oscillator (VLO), an internal trimmed low-frequency
oscillator (REFO), an integrated internal digitally-controlled oscillator (DCO), and a high-frequency crystal
oscillator XT2. The UCS module is designed to meet the requirements of both low system cost and low power
consumption. The UCS module features digital frequency locked loop (FLL) hardware that, in conjunction with a
digital modulator, stabilizes the DCO frequency to a programmable multiple of the watch crystal frequency. The
internal DCO provides a fast turn-on clock source and stabilizes in 3 µs (typical). The UCS module provides the
following clock signals:
• Auxiliary clock (ACLK), sourced from a 32-kHz watch crystal (XT1), a high-frequency crystal (XT2), the
internal low-frequency oscillator (VLO), the trimmed low-frequency oscillator (REFO), or the internal
digitally-controlled oscillator DCO.
• Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources available to
ACLK.
• Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by
same sources available to ACLK.
• ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32.
Power Management Module (PMM)
The PMM includes an integrated voltage regulator that supplies the core voltage to the device and contains
programmable output levels to provide for power optimization. The PMM also includes supply voltage supervisor
Copyright © 2010–2011, Texas Instruments Incorporated
21
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
(SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection. The brownout circuit is
implemented to provide the proper internal reset signal to the device during power-on and power-off. The
SVS/SVM circuitry detects if the supply voltage drops below a user-selectable level and supports both supply
voltage supervision (the device is automatically reset) and supply voltage monitoring (the device is not
automatically reset). SVS and SVM circuitry is available on the primary supply and core supply.
Hardware Multiplier
The multiplication operation is supported by a dedicated peripheral module. The module performs operations with
32-bit, 24-bit, 16-bit, and 8-bit operands. The module is capable of supporting signed and unsigned multiplication
as well as signed and unsigned multiply and accumulate operations.
Real-Time Clock (RTC_B)
The RTC_B module can be configured for real-time clock (RTC) and calendar mode providing seconds, minutes,
hours, day of week, day of month, month, and year. Calendar mode integrates an internal calendar which
compensates for months with less than 31 days and includes leap year correction. The RTC_B also supports
flexible alarm functions and offset-calibration hardware. The implementation on this device supports operation in
LPM3.5 mode and operation from a backup supply.
Watchdog Timer (WDT_A)
The primary function of the watchdog timer (WDT_A) module is to perform a controlled system restart after a
software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog
function is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
System Module (SYS)
The SYS module handles many of the system functions within the device. These include power-on reset and
power-up clear handling, NMI source selection and management, reset interrupt vector generators, bootstrap
loader entry mechanisms, and configuration management (device descriptors). SYS also includes a data
exchange mechanism via JTAG called a JTAG mailbox that can be used in the application.
Table 14. System Module Interrupt Vector Registers
INTERRUPT VECTOR
REGISTER
SYSRSTIV , System Reset
22
INTERRUPT EVENT
WORD ADDRESS
OFFSET
No interrupt pending
00h
Brownout (BOR)
02h
RST/NMI (BOR)
04h
DoBOR (BOR)
06h
LPM3.5 or LPM4.5 wakeup (BOR)
08h
Security violation (BOR)
0Ah
SVSL (POR)
0Ch
SVSH (POR)
0Eh
SVML_OVP (POR)
SVMH_OVP (POR)
019Eh
PRIORITY
Highest
10h
12h
DoPOR (POR)
14h
WDT timeout (PUC)
16h
WDT key violation (PUC)
18h
KEYV flash key violation (PUC)
1Ah
FLL unlock (PUC)
1Ch
Peripheral area fetch (PUC)
1Eh
PMM key violation (PUC)
20h
Reserved
22h to 3Eh
Lowest
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 14. System Module Interrupt Vector Registers (continued)
INTERRUPT VECTOR
REGISTER
INTERRUPT EVENT
WORD ADDRESS
No interrupt pending
00h
SVMLIFG
02h
SVMHIFG
04h
DLYLIFG
06h
DLYHIFG
SYSSNIV , System NMI
SYSUNIV, User NMI
SYSBERRIV, Bus Error
VMAIFG
0Ch
0Eh
VLRLIFG
10h
VLRHIFG
12h
Reserved
14h to 1Eh
No interrupt pending
00h
NMIFG
02h
OFIFG
019Ah
Highest
06h
08h
Reserved
0Ah to 1Eh
No interrupt pending
00h
0198h
Lowest
04h
BUSIFG
USB wait state timeout
Highest
0Ah
JMBINIFG
ACCVIFG
PRIORITY
08h
019Ch
JMBOUTIFG
Reserved
Copyright © 2010–2011, Texas Instruments Incorporated
OFFSET
Lowest
02h
Highest
04h to 1Eh
Lowest
23
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
DMA Controller
The DMA controller allows movement of data from one memory address to another without CPU intervention. For
example, the DMA controller can be used to move data from the ADC12_A conversion memory to RAM. Using
the DMA controller can increase the throughput of peripheral modules. The DMA controller reduces system
power consumption by allowing the CPU to remain in sleep mode, without having to awaken to move data to or
from a peripheral.
The USB timestamp generator also uses the channel 0, 1, and 2 DMA trigger assignments described in
Table 15.
Table 15. DMA Trigger Assignments (1)
Trigger
24
2
3
DMAREQ
1
TA0CCR0 CCIFG
2
TA0CCR2 CCIFG
3
TA1CCR0 CCIFG
4
TA1CCR2 CCIFG
5
TA2CCR0 CCIFG
6
TA2CCR2 CCIFG
7
TBCCR0 CCIFG
8
TBCCR2 CCIFG
9
Reserved
10
Reserved
11
Reserved
12
Reserved
13
Reserved
14
Reserved
15
Reserved
16
UCA0RXIFG
17
UCA0TXIFG
18
UCB0RXIFG
19
UCB0TXIFG
20
UCA1RXIFG
21
UCA1TXIFG
22
UCB1RXIFG
23
UCB1TXIFG
24
ADC12IFGx (2)
25
DAC12_0IFG (3)
26
DAC12_1IFG (3)
27
USB FNRXD
28
USB ready
29
MPY ready
31
(2)
(3)
1
0
30
(1)
Channel
0
DMA5IFG
DMA0IFG
DMA1IFG
DMA2IFG
4
5
DMA3IFG
DMA4IFG
DMAE0
Reserved DMA triggers may be used by other devices in the family. Reserved DMA triggers will not
cause any DMA trigger event when selected.
Only on devices with peripheral module ADC12_A. Reserved on devices without ADC.
Only on devices with peripheral module DAC12_A. Reserved on devices without DAC.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Universal Serial Communication Interface (USCI)
The USCI modules are used for serial data communication. The USCI module supports synchronous
communication protocols such as SPI (3 or 4 pin) and I2C, and asynchronous communication protocols such as
UART, enhanced UART with automatic baudrate detection, and IrDA. Each USCI module contains two portions,
A and B.
The USCI_An module provides support for SPI (3 or 4 pin), UART, enhanced UART, or IrDA.
The USCI_Bn module provides support for SPI (3 or 4 pin) or I2C.
The MSP430F563x series includes two complete USCI modules (n = 0 to 1).
Timer TA0
Timer TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. It can support multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may
be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 16. Timer TA0 Signal Connections
INPUT PIN NUMBER
PZ
ZQW
DEVICE
INPUT
SIGNAL
34-P1.0
L5-P1.0
TA0CLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
34-P1.0
L5-P1.0
TA0CLK
TACLK
35-P1.1
M5-P1.1
TA0.0
CCI0A
DVSS
CCI0B
DVSS
GND
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
TA0
OUTPUT PIN NUMBER
PZ
ZQW
35-P1.1
M5-P1.1
TA0.0
DVCC
VCC
36-P1.2
J6-P1.2
TA0.1
CCI1A
36-P1.2
J6-P1.2
40-P1.6
J7-P1.6
TA0.1
CCI1B
40-P1.6
J7-P1.6
DVSS
GND
DVCC
VCC
CCR1
TA1
TA0.1
ADC12_A (internal) (1)
ADC12SHSx = {1}
37-P1.3
H6-P1.3
TA0.2
CCI2A
37-P1.3
H6-P1.3
41-P1.7
M7-P1.7
TA0.2
CCI2B
41-P1.7
M7-P1.7
DVSS
GND
DVCC
VCC
TA0.3
CCI3A
38-P1.4
M6-P1.4
DVSS
CCI3B
DVSS
GND
39-P1.5
L6-P1.5
38-P1.4
39-P1.5
(1)
MODULE
INPUT
SIGNAL
M6-P1.4
L6-P1.5
DVCC
VCC
TA0.4
CCI4A
DVSS
CCI4B
DVSS
GND
DVCC
VCC
CCR2
CCR3
CCR4
TA2
TA3
TA4
TA0.2
TA0.3
TA0.4
Only on devices with peripheral module ADC12_A.
Copyright © 2010–2011, Texas Instruments Incorporated
25
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Timer TA1
Timer TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. It supports multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may
be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 17. Timer TA1 Signal Connections
INPUT PIN NUMBER
PZ
ZQW
DEVICE
INPUT
SIGNAL
42-P3.0
L7-P3.0
TA1CLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
42-P3.0
L7-P3.0
TA1CLK
TACLK
43-P3.1
H7-P3.1
TA1.0
CCI0A
DVSS
CCI0B
DVSS
GND
44-P3.2
45-P3.3
(1)
26
MODULE
INPUT
SIGNAL
M8-P3.2
L8-P3.3
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
TA0
OUTPUT PIN NUMBER
PZ
ZQW
43-P3.1
H7-P3.1
M8-P3.2
TA1.0
DVCC
VCC
TA1.1
CCI1A
44-P3.2
CBOUT
(internal)
CCI1B
(1)
DVSS
GND
DVCC
VCC
TA1.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
CCR1
TA1
TA1.1
DAC12_A
DAC12_0, DAC12_1
(internal)
45-P3.3
CCR2
TA2
L8-P3.3
TA1.2
Only on devices with peripheral module DAC12_A.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Timer TA2
Timer TA2 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. It supports multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may
be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 18. Timer TA2 Signal Connections
INPUT PIN NUMBER
PZ
ZQW
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
46-P3.4
J8-P3.4
TA2CLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
46-P3.4
J8-P3.4
TA2CLK
TACLK
47-P3.5
M9-P3.5
TA2.0
CCI0A
DVSS
CCI0B
DVSS
GND
48-P3.6
49-P3.7
L9-P3.6
M10-P3.7
DVCC
VCC
TA2.1
CCI1A
CBOUT
(internal)
CCI1B
DVSS
GND
DVCC
VCC
TA2.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
Copyright © 2010–2011, Texas Instruments Incorporated
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
CCR1
CCR2
TA0
TA1
TA2
OUTPUT PIN NUMBER
PZ
ZQW
47-P3.5
M9-P3.5
48-P3.6
L9-P3.6
49-P3.7
M10-P3.7
TA2.0
TA2.1
TA2.2
27
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Timer TB0
Timer TB0 is a 16-bit timer/counter (Timer_B type) with seven capture/compare registers. It supports multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may
be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 19. Timer TB0 Signal Connections
INPUT PIN NUMBER
PZ
ZQW
58-P8.0
P2MAPx (1)
J11-P8.0
P2MAPx (1)
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
TB0CLK
TB0CLK
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
OUTPUT PIN NUMBER
PZ
ZQW
ACLK
ACLK
SMCLK
SMCLK
J11-P8.0
P2MAPx (1)
TB0CLK
TB0CLK
50-P4.0
J9-P4.0
TB0.0
CCI0A
50-P4.0
J9-P4.0
P2MAPx (1)
P2MAPx (1)
TB0.0
CCI0B
P2MAPx (1)
P2MAPx (1)
DVSS
GND
58-P8.0
P2MAPx (1)
CCR0
TB0
TB0.0
ADC12 (internal) (2)
ADC12SHSx = {2}
DVCC
VCC
51-P4.1
M11-P4.1
TB0.1
CCI1A
51-P4.1
M11-P4.1
P2MAPx (1)
P2MAPx (1)
TB0.1
CCI1B
P2MAPx (1)
P2MAPx (1)
DVSS
GND
DVCC
VCC
CCR1
TB1
TB0.1
ADC12 (internal) (2)
ADC12SHSx = {3}
52-P4.2
L10-P4.2
TB0.2
CCI2A
52-P4.2
L10-P4.2
P2MAPx (1)
P2MAPx (1)
TB0.2
CCI2B
P2MAPx (1)
P2MAPx (1)
DVSS
GND
53-P4.3
P2MAPx
(1)
54-P4.4
P2MAPx
(1)
M12-P4.3
P2MAPx
(1)
L12-P4.4
P2MAPx
(1)
DVCC
VCC
TB0.3
CCI3A
TB0.3
CCI3B
DVSS
GND
DVCC
VCC
TB0.4
CCI4A
TB0.4
CCI4B
DVSS
GND
DVCC
VCC
CCR2
TB2
TB0.2
DAC12_A (3)
DAC12_0, DAC12_1
(internal)
53-P4.3
CCR3
TB3
TB0.3
P2MAPx
(1)
54-P4.4
CCR4
TB4
TB0.4
P2MAPx
(1)
M12-P4.3
P2MAPx (1)
L12-P4.4
P2MAPx (1)
55-P4.5
L11-P4.5
TB0.5
CCI5A
55-P4.5
L11-P4.5
P2MAPx (1)
P2MAPx (1)
TB0.5
CCI5B
P2MAPx (1)
P2MAPx (1)
DVSS
GND
CCR5
TB5
TB0.5
DVCC
VCC
56-P4.6
K11-P4.6
TB0.6
CCI6A
56-P4.6
K11-P4.6
P2MAPx (1)
P2MAPx (1)
TB0.6
CCI6B
P2MAPx (1)
P2MAPx (1)
DVSS
GND
DVCC
VCC
(1)
(2)
(3)
28
CCR6
TB6
TB0.6
Timer functions selectable via the port mapping controller.
Only on devices with peripheral module ADC12_A.
Only on devices with peripheral module DAC12_A.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
www.ti.com
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
Comparator_B
The primary function of the Comparator_B module is to support precision slope analog-to-digital conversions,
battery voltage supervision, and monitoring of external analog signals.
ADC12_A
The ADC12_A module supports fast 12-bit analog-to-digital conversions. The module implements a 12-bit SAR
core, sample select control, reference generator, and a 16-word conversion-and-control buffer. The
conversion-and-control buffer allows up to 16 independent ADC samples to be converted and stored without any
CPU intervention.
DAC12_A
The DAC12_A module is a 12-bit R-ladder voltage-output DAC. The DAC12_A may be used in 8-bit or 12-bit
mode, and may be used in conjunction with the DMA controller. When multiple DAC12_A modules are present,
they may be grouped together for synchronous operation.
CRC16
The CRC16 module produces a signature based on a sequence of entered data values and can be used for data
checking purposes. The CRC16 module signature is based on the CRC-CCITT standard.
REF Voltage Reference
The reference module (REF) is responsible for generation of all critical reference voltages that can be used by
the various analog peripherals in the device.
USB Universal Serial Bus
The USB module is a fully integrated USB interface that is compliant with the USB 2.0 specification. The module
supports full-speed operation of control, interrupt, and bulk transfers. The module includes an integrated LDO,
PHY, and PLL. The PLL is highly flexible and can support a wide range of input clock frequencies. USB RAM,
when not used for USB communication, can be used by the system.
Embedded Emulation Module (EEM)
The Embedded Emulation Module (EEM) supports real-time in-system debugging. The L version of the EEM
implemented on these devices has the following features:
• Eight hardware triggers/breakpoints on memory access
• Two hardware triggers/breakpoints on CPU register write access
• Up to ten hardware triggers can be combined to form complex triggers/breakpoints
• Two cycle counters
• Sequencer
• State storage
• Clock control on module level
Copyright © 2010–2011, Texas Instruments Incorporated
29
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Peripheral File Map
Table 20. Peripherals
(1)
30
MODULE NAME
BASE ADDRESS
OFFSET ADDRESS RANGE
Special Functions (see Table 21)
0100h
000h - 01Fh
PMM (see Table 22)
0120h
000h - 00Fh
Flash Control (see Table 23)
0140h
000h - 00Fh
CRC16 (see Table 24)
0150h
000h - 007h
RAM Control (see Table 25)
0158h
000h - 001h
Watchdog (see Table 26)
015Ch
000h - 001h
UCS (see Table 27)
0160h
000h - 01Fh
SYS (see Table 28)
0180h
000h - 01Fh
Shared Reference (see Table 29)
01B0h
000h - 001h
Port Mapping Control (see Table 30)
01C0h
000h - 003h
Port Mapping Port P2 (see Table 30)
01D0h
000h - 007h
Port P1/P2 (see Table 31)
0200h
000h - 01Fh
Port P3/P4 (see Table 32)
0220h
000h - 01Fh
Port P5/P6 (see Table 33)
0240h
000h - 00Bh
Port P7/P8 (see Table 34)
0260h
000h - 00Bh
Port P9 (see Table 35)
0280h
000h - 00Bh
Port PJ (see Table 36)
0320h
000h - 01Fh
Timer TA0 (see Table 37)
0340h
000h - 02Eh
Timer TA1 (see Table 38)
0380h
000h - 02Eh
Timer TB0 (see Table 39)
03C0h
000h - 02Eh
Timer TA2 (see Table 40)
0400h
000h - 02Eh
Battery Backup (see Table 41)
0480h
000h - 01Fh
RTC_B (see Table 42)
04A0h
000h - 01Fh
32-bit Hardware Multiplier (see Table 43)
04C0h
000h - 02Fh
DMA General Control (see Table 44)
0500h
000h - 00Fh
DMA Channel 0 (see Table 44)
0510h
000h - 00Ah
DMA Channel 1 (see Table 44)
0520h
000h - 00Ah
DMA Channel 2 (see Table 44)
0530h
000h - 00Ah
DMA Channel 3 (see Table 44)
0540h
000h - 00Ah
DMA Channel 4 (see Table 44)
0550h
000h - 00Ah
DMA Channel 5 (see Table 44)
0560h
000h - 00Ah
USCI_A0 (see Table 45)
05C0h
000h - 01Fh
USCI_B0 (see Table 46)
05E0h
000h - 01Fh
USCI_A1 (see Table 47)
0600h
000h - 01Fh
USCI_B1 (see Table 48)
0620h
000h - 01Fh
ADC12_A (see Table 49)
0700h
000h - 03Fh
DAC12_A (see Table 50)
0780h
000h - 01Fh
Comparator_B (see Table 51)
08C0h
000h - 00Fh
USB configuration (see Table 52)
0900h
000h - 014h
USB control (see Table 53)
0920h
000h - 01Fh
(1)
For a detailed description of the individual control register offset addresses, see the MSP430F5xx and MSP430F6xx Family User's
Guide (SLAU208).
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 21. Special Function Registers (Base Address: 0100h)
REGISTER DESCRIPTION
REGISTER
OFFSET
SFR interrupt enable
SFRIE1
00h
SFR interrupt flag
SFRIFG1
02h
SFR reset pin control
SFRRPCR
04h
Table 22. PMM Registers (Base Address: 0120h)
REGISTER DESCRIPTION
REGISTER
OFFSET
PMM Control 0
PMMCTL0
00h
PMM control 1
PMMCTL1
02h
SVS high side control
SVSMHCTL
04h
SVS low side control
SVSMLCTL
06h
PMM interrupt flags
PMMIFG
0Ch
PMM interrupt enable
PMMIE
0Eh
Table 23. Flash Control Registers (Base Address: 0140h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Flash control 1
FCTL1
00h
Flash control 3
FCTL3
04h
Flash control 4
FCTL4
06h
Table 24. CRC16 Registers (Base Address: 0150h)
REGISTER DESCRIPTION
REGISTER
OFFSET
CRC data input
CRC16DI
00h
CRC result
CRC16INIRES
04h
Table 25. RAM Control Registers (Base Address: 0158h)
REGISTER DESCRIPTION
RAM control 0
REGISTER
RCCTL0
OFFSET
00h
Table 26. Watchdog Registers (Base Address: 015Ch)
REGISTER DESCRIPTION
Watchdog timer control
REGISTER
WDTCTL
OFFSET
00h
Table 27. UCS Registers (Base Address: 0160h)
REGISTER DESCRIPTION
REGISTER
OFFSET
UCS control 0
UCSCTL0
00h
UCS control 1
UCSCTL1
02h
UCS control 2
UCSCTL2
04h
UCS control 3
UCSCTL3
06h
UCS control 4
UCSCTL4
08h
UCS control 5
UCSCTL5
0Ah
UCS control 6
UCSCTL6
0Ch
UCS control 7
UCSCTL7
0Eh
UCS control 8
UCSCTL8
10h
Copyright © 2010–2011, Texas Instruments Incorporated
31
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 28. SYS Registers (Base Address: 0180h)
REGISTER DESCRIPTION
REGISTER
OFFSET
System control
SYSCTL
00h
Bootstrap loader configuration area
SYSBSLC
02h
JTAG mailbox control
SYSJMBC
06h
JTAG mailbox input 0
SYSJMBI0
08h
JTAG mailbox input 1
SYSJMBI1
0Ah
JTAG mailbox output 0
SYSJMBO0
0Ch
JTAG mailbox output 1
SYSJMBO1
0Eh
Bus Error vector generator
SYSBERRIV
18h
User NMI vector generator
SYSUNIV
1Ah
System NMI vector generator
SYSSNIV
1Ch
Reset vector generator
SYSRSTIV
1Eh
Table 29. Shared Reference Registers (Base Address: 01B0h)
REGISTER DESCRIPTION
Shared reference control
REGISTER
REFCTL
OFFSET
00h
Table 30. Port Mapping Registers
(Base Address of Port Mapping Control: 01C0h, Port P2: 01D0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port mapping password register
PMAPPWD
00h
Port mapping control register
PMAPCTL
02h
Port P2.0 mapping register
P2MAP0
00h
Port P2.1 mapping register
P2MAP1
01h
Port P2.2 mapping register
P2MAP2
02h
Port P2.3 mapping register
P2MAP3
03h
Port P2.4 mapping register
P2MAP4
04h
Port P2.5 mapping register
P2MAP5
05h
Port P2.6 mapping register
P2MAP6
06h
Port P2.7 mapping register
P2MAP7
07h
Table 31. Port P1/P2 Registers (Base Address: 0200h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P1 input
P1IN
00h
Port P1 output
P1OUT
02h
Port P1 direction
P1DIR
04h
Port P1 pullup/pulldown enable
P1REN
06h
Port P1 drive strength
P1DS
08h
Port P1 selection
P1SEL
0Ah
Port P1 interrupt vector word
P1IV
0Eh
Port P1 interrupt edge select
P1IES
18h
Port P1 interrupt enable
P1IE
1Ah
Port P1 interrupt flag
P1IFG
1Ch
Port P2 input
P2IN
01h
Port P2 output
P2OUT
03h
Port P2 direction
P2DIR
05h
Port P2 pullup/pulldown enable
P2REN
07h
Port P2 drive strength
P2DS
09h
32
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 31. Port P1/P2 Registers (Base Address: 0200h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P2 selection
P2SEL
0Bh
Port P2 interrupt vector word
P2IV
1Eh
Port P2 interrupt edge select
P2IES
19h
Port P2 interrupt enable
P2IE
1Bh
Port P2 interrupt flag
P2IFG
1Dh
Table 32. Port P3/P4 Registers (Base Address: 0220h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P3 input
P3IN
00h
Port P3 output
P3OUT
02h
Port P3 direction
P3DIR
04h
Port P3 pullup/pulldown enable
P3REN
06h
Port P3 drive strength
P3DS
08h
Port P3 selection
P3SEL
0Ah
Port P3 interrupt vector word
P3IV
0Eh
Port P3 interrupt edge select
P3IES
18h
Port P3 interrupt enable
P3IE
1Ah
Port P3 interrupt flag
P3IFG
1Ch
Port P4 input
P4IN
01h
Port P4 output
P4OUT
03h
Port P4 direction
P4DIR
05h
Port P4 pullup/pulldown enable
P4REN
07h
Port P4 drive strength
P4DS
09h
Port P4 selection
P4SEL
0Bh
Port P4 interrupt vector word
P4IV
1Eh
Port P4 interrupt edge select
P4IES
19h
Port P4 interrupt enable
P4IE
1Bh
Port P4 interrupt flag
P4IFG
1Dh
Table 33. Port P5/P6 Registers (Base Address: 0240h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P5 input
P5IN
00h
Port P5 output
P5OUT
02h
Port P5 direction
P5DIR
04h
Port P5 pullup/pulldown enable
P5REN
06h
Port P5 drive strength
P5DS
08h
Port P5 selection
P5SEL
0Ah
Port P6 input
P6IN
01h
Port P6 output
P6OUT
03h
Port P6 direction
P6DIR
05h
Port P6 pullup/pulldown enable
P6REN
07h
Port P6 drive strength
P6DS
09h
Port P6 selection
P6SEL
0Bh
Copyright © 2010–2011, Texas Instruments Incorporated
33
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 34. Port P7/P8 Registers (Base Address: 0260h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P7 input
P7IN
00h
Port P7 output
P7OUT
02h
Port P7 direction
P7DIR
04h
Port P7 pullup/pulldown enable
P7REN
06h
Port P7 drive strength
P7DS
08h
Port P7 selection
P7SEL
0Ah
Port P8 input
P8IN
01h
Port P8 output
P8OUT
03h
Port P8 direction
P8DIR
05h
Port P8 pullup/pulldown enable
P8REN
07h
Port P8 drive strength
P8DS
09h
Port P8 selection
P8SEL
0Bh
Table 35. Port P9 Register (Base Address: 0280h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P9 input
P9IN
00h
Port P9 output
P9OUT
02h
Port P9 direction
P9DIR
04h
Port P9 pullup/pulldown enable
P9REN
06h
Port P9 drive strength
P9DS
08h
Port P9 selection
P9SEL
0Ah
Table 36. Port J Registers (Base Address: 0320h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port PJ input
PJIN
00h
Port PJ output
PJOUT
02h
Port PJ direction
PJDIR
04h
Port PJ pullup/pulldown enable
PJREN
06h
Port PJ drive strength
PJDS
08h
Table 37. TA0 Registers (Base Address: 0340h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA0 control
TA0CTL
00h
Capture/compare control 0
TA0CCTL0
02h
Capture/compare control 1
TA0CCTL1
04h
Capture/compare control 2
TA0CCTL2
06h
Capture/compare control 3
TA0CCTL3
08h
Capture/compare control 4
TA0CCTL4
0Ah
TA0 counter register
TA0R
10h
Capture/compare register 0
TA0CCR0
12h
Capture/compare register 1
TA0CCR1
14h
Capture/compare register 2
TA0CCR2
16h
Capture/compare register 3
TA0CCR3
18h
Capture/compare register 4
TA0CCR4
1Ah
TA0 expansion register 0
TA0EX0
20h
TA0 interrupt vector
TA0IV
2Eh
34
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 38. TA1 Registers (Base Address: 0380h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA1 control
TA1CTL
00h
Capture/compare control 0
TA1CCTL0
02h
Capture/compare control 1
TA1CCTL1
04h
Capture/compare control 2
TA1CCTL2
06h
TA1 counter register
TA1R
10h
Capture/compare register 0
TA1CCR0
12h
Capture/compare register 1
TA1CCR1
14h
Capture/compare register 2
TA1CCR2
16h
TA1 expansion register 0
TA1EX0
20h
TA1 interrupt vector
TA1IV
2Eh
Table 39. TB0 Registers (Base Address: 03C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TB0 control
TB0CTL
00h
Capture/compare control 0
TB0CCTL0
02h
Capture/compare control 1
TB0CCTL1
04h
Capture/compare control 2
TB0CCTL2
06h
Capture/compare control 3
TB0CCTL3
08h
Capture/compare control 4
TB0CCTL4
0Ah
Capture/compare control 5
TB0CCTL5
0Ch
Capture/compare control 6
TB0CCTL6
0Eh
TB0 register
TB0R
10h
Capture/compare register 0
TB0CCR0
12h
Capture/compare register 1
TB0CCR1
14h
Capture/compare register 2
TB0CCR2
16h
Capture/compare register 3
TB0CCR3
18h
Capture/compare register 4
TB0CCR4
1Ah
Capture/compare register 5
TB0CCR5
1Ch
Capture/compare register 6
TB0CCR6
1Eh
TB0 expansion register 0
TB0EX0
20h
TB0 interrupt vector
TB0IV
2Eh
Table 40. TA2 Registers (Base Address: 0400h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA2 control
TA2CTL
00h
Capture/compare control 0
TA2CCTL0
02h
Capture/compare control 1
TA2CCTL1
04h
Capture/compare control 2
TA2CCTL2
06h
TA2 counter register
TA2R
10h
Capture/compare register 0
TA2CCR0
12h
Capture/compare register 1
TA2CCR1
14h
Capture/compare register 2
TA2CCR2
16h
TA2 expansion register 0
TA2EX0
20h
TA2 interrupt vector
TA2IV
2Eh
Copyright © 2010–2011, Texas Instruments Incorporated
35
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 41. Battery Backup Registers (Base Address: 0480h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Battery Backup Memory 0
BAKMEM0
00h
Battery Backup Memory 1
BAKMEM1
02h
Battery Backup Memory 2
BAKMEM2
04h
Battery Backup Memory 3
BAKMEM3
06h
Battery Backup Control
BAKCTL
1Ch
Battery Charger Control
BAKCHCTL
1Eh
Table 42. Real-Time Clock Registers (Base Address: 04A0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
RTC control register 0
RTCCTL0
00h
RTC control register 1
RTCCTL1
01h
RTC control register 2
RTCCTL2
02h
RTC control register 3
RTCCTL3
03h
RTC prescaler 0 control register
RTCPS0CTL
08h
RTC prescaler 1 control register
RTCPS1CTL
0Ah
RTC prescaler 0
RTCPS0
0Ch
RTC prescaler 1
RTCPS1
0Dh
RTC interrupt vector word
RTCIV
0Eh
RTC seconds
RTCSEC
10h
RTC minutes
RTCMIN
11h
RTC hours
RTCHOUR
12h
RTC day of week
RTCDOW
13h
RTC days
RTCDAY
14h
RTC month
RTCMON
15h
RTC year low
RTCYEARL
16h
RTC year high
RTCYEARH
17h
RTC alarm minutes
RTCAMIN
18h
RTC alarm hours
RTCAHOUR
19h
RTC alarm day of week
RTCADOW
1Ah
RTC alarm days
RTCADAY
1Bh
Binary-to-BCD conversion register
BIN2BCD
1Ch
BCD-to-binary conversion register
BCD2BIN
1Eh
Table 43. 32-bit Hardware Multiplier Registers (Base Address: 04C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
16-bit operand 1 – multiply
MPY
00h
16-bit operand 1 – signed multiply
MPYS
02h
16-bit operand 1 – multiply accumulate
MAC
04h
16-bit operand 1 – signed multiply accumulate
MACS
06h
16-bit operand 2
OP2
08h
16 × 16 result low word
RESLO
0Ah
16 × 16 result high word
RESHI
0Ch
16 × 16 sum extension register
SUMEXT
0Eh
32-bit operand 1 – multiply low word
MPY32L
10h
32-bit operand 1 – multiply high word
MPY32H
12h
32-bit operand 1 – signed multiply low word
MPYS32L
14h
32-bit operand 1 – signed multiply high word
MPYS32H
16h
36
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 43. 32-bit Hardware Multiplier Registers (Base Address: 04C0h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
32-bit operand 1 – multiply accumulate low word
MAC32L
18h
32-bit operand 1 – multiply accumulate high word
MAC32H
1Ah
32-bit operand 1 – signed multiply accumulate low word
MACS32L
1Ch
32-bit operand 1 – signed multiply accumulate high word
MACS32H
1Eh
32-bit operand 2 – low word
OP2L
20h
32-bit operand 2 – high word
OP2H
22h
32 × 32 result 0 – least significant word
RES0
24h
32 × 32 result 1
RES1
26h
32 × 32 result 2
RES2
28h
32 × 32 result 3 – most significant word
RES3
2Ah
MPY32 control register 0
MPY32CTL0
2Ch
Table 44. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h, DMA Channel 3: 0540h, DMA
Channel 4: 0550h, DMA Channel 5: 0560h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA General Control: DMA module control 0
DMACTL0
00h
DMA General Control: DMA module control 1
DMACTL1
02h
DMA General Control: DMA module control 2
DMACTL2
04h
DMA General Control: DMA module control 3
DMACTL3
06h
DMA General Control: DMA module control 4
DMACTL4
08h
DMA General Control: DMA interrupt vector
DMAIV
0Ah
DMA Channel 0 control
DMA0CTL
00h
DMA Channel 0 source address low
DMA0SAL
02h
DMA Channel 0 source address high
DMA0SAH
04h
DMA Channel 0 destination address low
DMA0DAL
06h
DMA Channel 0 destination address high
DMA0DAH
08h
DMA Channel 0 transfer size
DMA0SZ
0Ah
DMA Channel 1 control
DMA1CTL
00h
DMA Channel 1 source address low
DMA1SAL
02h
DMA Channel 1 source address high
DMA1SAH
04h
DMA Channel 1 destination address low
DMA1DAL
06h
DMA Channel 1 destination address high
DMA1DAH
08h
DMA Channel 1 transfer size
DMA1SZ
0Ah
DMA Channel 2 control
DMA2CTL
00h
DMA Channel 2 source address low
DMA2SAL
02h
DMA Channel 2 source address high
DMA2SAH
04h
DMA Channel 2 destination address low
DMA2DAL
06h
DMA Channel 2 destination address high
DMA2DAH
08h
DMA Channel 2 transfer size
DMA2SZ
0Ah
DMA Channel 3 control
DMA3CTL
00h
DMA Channel 3 source address low
DMA3SAL
02h
DMA Channel 3 source address high
DMA3SAH
04h
DMA Channel 3 destination address low
DMA3DAL
06h
DMA Channel 3 destination address high
DMA3DAH
08h
DMA Channel 3 transfer size
DMA3SZ
0Ah
DMA Channel 4 control
DMA4CTL
00h
DMA Channel 4 source address low
DMA4SAL
02h
Copyright © 2010–2011, Texas Instruments Incorporated
37
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 44. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h, DMA Channel 3: 0540h, DMA
Channel 4: 0550h, DMA Channel 5: 0560h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA Channel 4 source address high
DMA4SAH
04h
DMA Channel 4 destination address low
DMA4DAL
06h
DMA Channel 4 destination address high
DMA4DAH
08h
DMA Channel 4 transfer size
DMA4SZ
0Ah
DMA Channel 5 control
DMA5CTL
00h
DMA Channel 5 source address low
DMA5SAL
02h
DMA Channel 5 source address high
DMA5SAH
04h
DMA Channel 5 destination address low
DMA5DAL
06h
DMA Channel 5 destination address high
DMA5DAH
08h
DMA Channel 5 transfer size
DMA5SZ
0Ah
Table 45. USCI_A0 Registers (Base Address: 05C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 0
UCA0CTL0
00h
USCI control 1
UCA0CTL1
01h
USCI baud rate 0
UCA0BR0
06h
USCI baud rate 1
UCA0BR1
07h
USCI modulation control
UCA0MCTL
08h
USCI status
UCA0STAT
0Ah
USCI receive buffer
UCA0RXBUF
0Ch
USCI transmit buffer
UCA0TXBUF
0Eh
USCI LIN control
UCA0ABCTL
10h
USCI IrDA transmit control
UCA0IRTCTL
12h
USCI IrDA receive control
UCA0IRRCTL
13h
USCI interrupt enable
UCA0IE
1Ch
USCI interrupt flags
UCA0IFG
1Dh
USCI interrupt vector word
UCA0IV
1Eh
Table 46. USCI_B0 Registers (Base Address: 05E0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 0
UCB0CTL0
00h
USCI synchronous control 1
UCB0CTL1
01h
USCI synchronous bit rate 0
UCB0BR0
06h
USCI synchronous bit rate 1
UCB0BR1
07h
USCI synchronous status
UCB0STAT
0Ah
USCI synchronous receive buffer
UCB0RXBUF
0Ch
USCI synchronous transmit buffer
UCB0TXBUF
0Eh
USCI I2C own address
UCB0I2COA
10h
USCI I2C slave address
UCB0I2CSA
12h
USCI interrupt enable
UCB0IE
1Ch
USCI interrupt flags
UCB0IFG
1Dh
USCI interrupt vector word
UCB0IV
1Eh
38
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 47. USCI_A1 Registers (Base Address: 0600h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 0
UCA1CTL0
00h
USCI control 1
UCA1CTL1
01h
USCI baud rate 0
UCA1BR0
06h
USCI baud rate 1
UCA1BR1
07h
USCI modulation control
UCA1MCTL
08h
USCI status
UCA1STAT
0Ah
USCI receive buffer
UCA1RXBUF
0Ch
USCI transmit buffer
UCA1TXBUF
0Eh
USCI LIN control
UCA1ABCTL
10h
USCI IrDA transmit control
UCA1IRTCTL
12h
USCI IrDA receive control
UCA1IRRCTL
13h
USCI interrupt enable
UCA1IE
1Ch
USCI interrupt flags
UCA1IFG
1Dh
USCI interrupt vector word
UCA1IV
1Eh
Table 48. USCI_B1 Registers (Base Address: 0620h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 0
UCB1CTL0
00h
USCI synchronous control 1
UCB1CTL1
01h
USCI synchronous bit rate 0
UCB1BR0
06h
USCI synchronous bit rate 1
UCB1BR1
07h
USCI synchronous status
UCB1STAT
0Ah
USCI synchronous receive buffer
UCB1RXBUF
0Ch
USCI synchronous transmit buffer
UCB1TXBUF
0Eh
USCI I2C own address
UCB1I2COA
10h
USCI I2C slave address
UCB1I2CSA
12h
USCI interrupt enable
UCB1IE
1Ch
USCI interrupt flags
UCB1IFG
1Dh
USCI interrupt vector word
UCB1IV
1Eh
Table 49. ADC12_A Registers (Base Address: 0700h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Control register 0
ADC12CTL0
00h
Control register 1
ADC12CTL1
02h
Control register 2
ADC12CTL2
04h
Interrupt-flag register
ADC12IFG
0Ah
Interrupt-enable register
ADC12IE
0Ch
Interrupt-vector-word register
ADC12IV
0Eh
ADC memory-control register 0
ADC12MCTL0
10h
ADC memory-control register 1
ADC12MCTL1
11h
ADC memory-control register 2
ADC12MCTL2
12h
ADC memory-control register 3
ADC12MCTL3
13h
ADC memory-control register 4
ADC12MCTL4
14h
ADC memory-control register 5
ADC12MCTL5
15h
ADC memory-control register 6
ADC12MCTL6
16h
ADC memory-control register 7
ADC12MCTL7
17h
ADC memory-control register 8
ADC12MCTL8
18h
Copyright © 2010–2011, Texas Instruments Incorporated
39
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 49. ADC12_A Registers (Base Address: 0700h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
ADC memory-control register 9
ADC12MCTL9
19h
ADC memory-control register 10
ADC12MCTL10
1Ah
ADC memory-control register 11
ADC12MCTL11
1Bh
ADC memory-control register 12
ADC12MCTL12
1Ch
ADC memory-control register 13
ADC12MCTL13
1Dh
ADC memory-control register 14
ADC12MCTL14
1Eh
ADC memory-control register 15
ADC12MCTL15
1Fh
Conversion memory 0
ADC12MEM0
20h
Conversion memory 1
ADC12MEM1
22h
Conversion memory 2
ADC12MEM2
24h
Conversion memory 3
ADC12MEM3
26h
Conversion memory 4
ADC12MEM4
28h
Conversion memory 5
ADC12MEM5
2Ah
Conversion memory 6
ADC12MEM6
2Ch
Conversion memory 7
ADC12MEM7
2Eh
Conversion memory 8
ADC12MEM8
30h
Conversion memory 9
ADC12MEM9
32h
Conversion memory 10
ADC12MEM10
34h
Conversion memory 11
ADC12MEM11
36h
Conversion memory 12
ADC12MEM12
38h
Conversion memory 13
ADC12MEM13
3Ah
Conversion memory 14
ADC12MEM14
3Ch
Conversion memory 15
ADC12MEM15
3Eh
Table 50. DAC12_A Registers (Base Address: 0780h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DAC12_A channel 0 control register 0
DAC12_0CTL0
00h
DAC12_A channel 0 control register 1
DAC12_0CTL1
02h
DAC12_A channel 0 data register
DAC12_0DAT
04h
DAC12_A channel 0 calibration control register
DAC12_0CALCTL
06h
DAC12_A channel 0 calibration data register
DAC12_0CALDAT
08h
DAC12_A channel 1 control register 0
DAC12_1CTL0
10h
DAC12_A channel 1 control register 1
DAC12_1CTL1
12h
DAC12_A channel 1 data register
DAC12_1DAT
14h
DAC12_A channel 1 calibration control register
DAC12_1CALCTL
16h
DAC12_A channel 1 calibration data register
DAC12_1CALDAT
18h
DAC12_A interrupt vector word
DAC12IV
1Eh
Table 51. Comparator_B Registers (Base Address: 08C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Comp_B control register 0
CBCTL0
00h
Comp_B control register 1
CBCTL1
02h
Comp_B control register 2
CBCTL2
04h
Comp_B control register 3
CBCTL3
06h
Comp_B interrupt register
CBINT
0Ch
Comp_B interrupt vector word
CBIV
0Eh
40
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 52. USB Configuration Registers (Base Address: 0900h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USB key/ID
USBKEYID
00h
USB module configuration
USBCNF
02h
USB PHY control
USBPHYCTL
04h
USB power control
USBPWRCTL
08h
USB power voltage setting
USBPWRVSR
0Ah
USB PLL control
USBPLLCTL
10h
USB PLL divider
USBPLLDIV
12h
USB PLL interrupts
USBPLLIR
14h
Table 53. USB Control Registers (Base Address: 0920h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Input endpoint#0 configuration
IEPCNF_0
00h
Input endpoint #0 byte count
IEPCNT_0
01h
Output endpoint#0 configuration
OEPCNF_0
02h
Output endpoint #0 byte count
OEPCNT_0
03h
Input endpoint interrupt enables
IEPIE
0Eh
Output endpoint interrupt enables
OEPIE
0Fh
Input endpoint interrupt flags
IEPIFG
10h
Output endpoint interrupt flags
OEPIFG
11h
USB interrupt vector
USBIV
12h
USB maintenance
MAINT
16h
Time stamp
TSREG
18h
USB frame number
USBFN
1Ah
USB control
USBCTL
1Ch
USB interrupt enables
USBIE
1Dh
USB interrupt flags
USBIFG
1Eh
Function address
FUNADR
1Fh
Copyright © 2010–2011, Texas Instruments Incorporated
41
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
–0.3 V to 4.1 V
Voltage applied at VCC to VSS
Voltage applied to any pin (excluding VCORE, VBUS, V18)
(2)
–0.3 V to VCC + 0.3 V
±2 mA
Diode current at any device pin
Storage temperature range, Tstg
(3)
–55°C to 150°C
Maximum junction temperature, TJ
(1)
(2)
(3)
95°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS. VCORE is for internal device usage only. No external dc loading or voltage should be applied.
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
Thermal Packaging Characteristics
PARAMETER
θJA
Junction-to-ambient thermal resistance, still air (1)
θJC(TOP)
Junction-to-case (top) thermal resistance (2)
θJB
Junction-to-board thermal resistance (3)
(1)
(2)
(3)
VALUE
QFP (PZ)
122
BGA (ZQW)
108
QFP (PZ)
83
BGA (ZQW)
72
QFP (PZ)
98
BGA (ZQW)
76
UNIT
°C/W
°C/W
°C/W
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard
test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
Recommended Operating Conditions
MIN
Supply voltage during program execution and flash
programming (AVCC1 = DVCC1 = DVCC2 = DVCC3
= DVCC = VCC) (1)
VCC
VCC, USB
Supply voltage during USB operation, USB PLL
disabled
USB_EN = 1, UPLLEN = 0
Supply voltage during USB operation, USB PLL
enabled (2)
USB_EN = 1, UPLLEN = 1
VSS
Supply voltage (AVSS1 = AVSS2 = AVSS3 = DVSS1 =
DVSS2 = DVSS3 = VSS)
VBAT,RTC
Backup-supply voltage with RTC operational
VBAT,MEM
TA
NOM
MAX
PMMCOREVx = 0
1.8
3.6
PMMCOREVx = 0, 1
2.0
3.6
PMMCOREVx = 0, 1, 2
2.2
3.6
PMMCOREVx = 0, 1, 2, 3
2.4
3.6
PMMCOREVx = 0
1.8
3.6
PMMCOREVx = 0, 1
2.0
3.6
PMMCOREVx = 0, 1, 2
2.2
3.6
PMMCOREVx = 0, 1, 2, 3
2.4
3.6
PMMCOREVx = 2
2.2
3.6
PMMCOREVx = 2, 3
2.4
3.6
0
UNIT
V
V
V
TA = 0°C to 85°C
1.55
3.6
TA = –40°C to 85°C
1.70
3.6
Backup-supply voltage with backup memory retained.
TA = –40°C to 85°C
1.20
3.6
V
Operating free-air temperature
I version
–40
85
°C
TJ
Operating junction temperature
I version
–40
85
°C
CBAK
Capacitance at pin VBAK
10
nF
CVCORE
Capacitor at VCORE
(1)
(2)
42
1
4.7
470
V
nF
It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
USB operation with USB PLL enabled requires PMMCOREVx ≥ 2 for proper operation.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Recommended Operating Conditions (continued)
MIN
CDVCC/CVCORE
fSYSTEM
Capacitor ratio of DVCC to VCORE
Processor frequency (maximum MCLK frequency) (3)
(see Figure 1)
fSYSTEM_USB
Minimum processor frequency for USB operation
USB_wait
Wait state cycles during USB operation
(3)
(4)
NOM
MAX
UNIT
10
(4)
PMMCOREVx = 0,
1.8 V ≤ VCC ≤ 3.6 V
(default condition)
0
8.0
PMMCOREVx = 1,
2 V ≤ VCC ≤ 3.6 V
0
12.0
PMMCOREVx = 2,
2.2 V ≤ VCC ≤ 3.6 V
0
16.0
PMMCOREVx = 3,
2.4 V ≤ VCC ≤ 3.6 V
0
20.0
1.5
MHz
MHz
16
cycles
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the
specified maximum frequency.
Modules may have a different maximum input clock specification. Refer to the specification of the respective module in this data sheet.
25
System Frequency - MHz
20
3
16
2
2, 3
1
1, 2
1, 2, 3
0, 1
0, 1, 2
0, 1, 2, 3
12
8
0
0
1.8
2.0
2.2
2.4
3.6
Supply Voltage - V
The numbers within the fields denote the supported PMMCOREVx settings.
Figure 1. Frequency vs Supply Voltage
Copyright © 2010–2011, Texas Instruments Incorporated
43
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Electrical Characteristics
Active Mode Supply Current Into VCC Excluding External Current
over recommended operating free-air temperature (unless otherwise noted) (1)
(2) (3)
FREQUENCY (fDCO = fMCLK = fSMCLK)
PARAMETER
EXECUTION
MEMORY
VCC
PMMCOREVx
1 MHz
TYP
IAM,
IAM,
(1)
(2)
(3)
44
Flash
RAM
Flash
RAM
3V
3V
8 MHz
MAX
0.36
TYP
2.1
12 MHz
MAX
TYP
0
0.32
1
0.36
2.4
3.6
2
0.37
2.5
3.8
3
0.39
0
0.18
1
0.20
1.2
1.7
2
0.22
1.3
2.0
3
0.23
1.4
2.1
1.0
MAX
TYP
UNIT
MAX
2.4
2.7
0.21
20 MHz
4.0
4.0
mA
6.6
1.2
1.9
mA
3.6
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
Characterized with program executing typical data processing. USB disabled (VUSBEN = 0, SLDOEN = 0).
fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency.
XTS = CPUOFF = SCG0 = SCG1 = OSCOFF = SMCLKOFF = 0.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Low-Power Mode Supply Currents (Into VCC) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
ILPM0,1MHz
Low-power mode 0 (3) (4)
ILPM2
Low-power mode 2 (5) (4)
VLO,WDT
ILPM4
ILPM3.5,
RTC,VCC
ILPM3.5,
RTC,VBAT
ILPM3.5,
RTC,TOT
Low-power mode 4 (8) (4)
85°C
2.2 V
0
71
75
87
81
85
99
3V
3
78
83
98
89
94
108
2.2 V
0
6.3
6.7
9.9
9.0
11
16
3V
3
6.6
7.0
11
10
12
18
0
1.6
1.8
2.4
4.7
6.5
10.5
1
1.6
1.9
4.8
6.6
2
1.7
2.0
4.9
6.7
0
1.9
2.1
5.0
6.8
1
1.9
2.1
5.1
7.0
2
2.0
2.2
5.2
7.1
3
2.0
2.2
2.9
5.4
7.3
12.6
0
0.9
1.2
1.9
4.0
5.9
10.3
1
0.9
1.2
4.1
6.0
2
1.0
1.3
4.2
6.1
3
1.0
1.3
2.2
4.3
6.3
11.3
0
0.9
1.1
1.8
3.9
5.8
10
1
0.9
1.1
4.0
5.9
2
1.0
1.2
4.1
6.1
3
1.0
1.2
4.2
6.2
11
3V
ILPM3,
60°C
PMMCOREVx
Low-power mode 3,
crystal mode (6) (4)
Low-power mode 3,
VLO mode, Watchdog
enabled (7) (4)
25°C
VCC
2.2 V
ILPM3,XT1LF
-40°C
(2)
3V
3V
TYP
MAX
TYP
MAX
2.7
2.1
TYP
MAX
TYP
MAX
10.8
UNIT
µA
µA
µA
µA
µA
Low-power mode 3.5
(LPM3.5) current with
active RTC into primary
supply pin DVCC (9)
3V
0.5
0.8
1.4
µA
Low-power mode 3.5
(LPM3.5) current with
active RTC into backup
supply pin VBAT (10)
3V
0.6
0.8
1.4
µA
Total low-power mode
3.5 (LPM3.5) current
with active RTC (11)
3V
1.6
2.8
µA
1.0
1.1
1.3
(1)
(2)
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance are chosen to closely match the required 9 pF.
(3) Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
(4) Current for brownout included. Low side supervisor and monitors disabled (SVSL, SVML). High side supervisor and monitor disabled
(SVSH, SVMH). RAM retention enabled.
(5) Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low frequency crystal operation
(XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz; DCO
setting = 1 MHz operation, DCO bias generator enabled.
USB disabled (VUSBEN = 0, SLDOEN = 0).
(6) Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low frequency crystal operation
(XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
(7) Current for watchdog timer clocked by VLO included.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
(8) CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
(9) VVBAT = VCC - 0.2 V, fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 32768 Hz, PMMREGOFF = 1, RTC in backup domain active
(10) VVBAT = VCC - 0.2 V, fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 32768 Hz, PMMREGOFF = 1, RTC in backup domain active, no
current drawn on VBAK
(11) fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 32768 Hz, PMMREGOFF = 1, RTC in backup domain active, no current drawn on VBAK
Copyright © 2010–2011, Texas Instruments Incorporated
45
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Low-Power Mode Supply Currents (Into VCC) Excluding External Current (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2)
PARAMETER
ILPM4.5
VCC
Low-power mode 4.5
(LPM4.5) (12)
PMMCOREVx
-40°C
TYP
3V
MAX
0.2
25°C
TYP
0.3
60°C
MAX
TYP
0.6
85°C
MAX
TYP
0.7
0.9
MAX
1.4
UNIT
µA
(12) Internal regulator disabled. No data retention.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF = 1 (LPM4.5); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
Schmitt-Trigger Inputs – General Purpose I/O (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ – VIT–)
RPull
Pullup/pulldown resistor
For pullup: VIN = VSS
For pulldown: VIN = VCC
CI
Input capacitance
VIN = VSS or VCC
(1)
VCC
MIN
1.8 V
0.80
1.40
3V
1.50
2.10
1.8 V
0.45
1.00
3V
0.75
1.65
1.8 V
0.3
0.8
3V
0.4
1.0
20
TYP
35
MAX
50
5
UNIT
V
V
V
kΩ
pF
Same parametrics apply to clock input pin when crystal bypass mode is used on XT1 (XIN) or XT2 (XT2IN).
Inputs – Ports P1, P2, P3, and P4 (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
t(int)
(1)
(2)
External interrupt timing
(2)
TEST CONDITIONS
VCC
Port P1, P2, P3, P4: P1.x to P4.x, External trigger pulse
width to set interrupt flag
2.2 V/3 V
MIN
MAX
20
UNIT
ns
Some devices may contain additional ports with interrupts. See the block diagram and terminal function descriptions.
An external signal sets the interrupt flag every time the minimum interrupt pulse width t(int) is met. It may be set by trigger signals shorter
than t(int).
Leakage Current – General Purpose I/O
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Ilkg(Px.x)
(1)
(2)
TEST CONDITIONS
VCC
(1) (2)
High-impedance leakage current
MIN
1.8 V/3 V
MAX
UNIT
±50
nA
The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is
disabled.
Outputs – General Purpose I/O (Full Drive Strength)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
I(OHmax) = –3 mA
VOH
High-level output voltage
I(OHmax) = –10 mA (2)
I(OHmax) = –5 mA (1)
I(OHmax) = –15 mA (2)
(1)
(2)
46
VCC
(1)
1.8 V
3V
MIN
MAX
VCC – 0.25
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
UNIT
V
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage
drop specified.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Outputs – General Purpose I/O (Full Drive Strength) (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
I(OLmax) = 3 mA
VOL
VCC
I(OLmax) = 5 mA (1)
VSS VSS + 0.60
VSS VSS + 0.25
3V
I(OLmax) = 15 mA (2)
MAX
UNIT
VSS VSS + 0.25
1.8 V
I(OLmax) = 10 mA (2)
Low-level output voltage
MIN
(1)
V
VSS VSS + 0.60
Outputs – General Purpose I/O (Reduced Drive Strength)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VCC
I(OHmax) = –1 mA (2)
VOH
1.8 V
I(OHmax) = –3 mA (3)
High-level output voltage
I(OHmax) = –2 mA (2)
3V
I(OHmax) = –6 mA (3)
I(OLmax) = 1 mA
VOL
(3)
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
1.8 V
I(OLmax) = 2 mA (2)
3V
I(OLmax) = 6 mA (3)
(1)
(2)
MAX
(2)
I(OLmax) = 3 mA (3)
Low-level output voltage
MIN
VCC – 0.25
UNIT
V
VSS VSS + 0.25
VSS VSS + 0.60
VSS VSS + 0.25
V
VSS VSS + 0.60
Selecting reduced drive strength may reduce EMI.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±100 mA to hold the maximum voltage
drop specified.
Output Frequency – Ports P1, P2 and P3
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fPx.y
fPort_CLK
(1)
(2)
(3)
TEST CONDITIONS
Port output frequency
(with load)
P3.4/TA2CLK/SMCLK/S27
CL = 20 pF, RL = 1 kΩ (1) or 3.2 kΩ (2)
Clock output frequency
P1.0/TA0CLK/ACLK/S39
P3.4/TA2CLK/SMCLK/S27
P2.0/P2MAP0 (P2MAP0 = PM_MCLK )
CL = 20 pF (3)
(3)
MIN
MAX
VCC = 1.8 V
PMMCOREVx = 0
8
VCC = 3 V
PMMCOREVx = 3
20
VCC = 1.8 V
PMMCOREVx = 0
8
VCC = 3 V
PMMCOREVx = 3
20
UNIT
MHz
MHz
Full drive strength of port: A resistive divider with 2 × 0.5 kΩ between VCC and VSS is used as load. The output is connected to the
center tap of the divider.
Reduced drive strength of port: A resistive divider with 2 × 1.6 kΩ between VCC and VSS is used as load. The output is connected to the
center tap of the divider.
The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
Copyright © 2010–2011, Texas Instruments Incorporated
47
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
8.0
VCC = 3.0 V
P3.2
IOL – Typical Low-Level Output Current – mA
IOL – Typical Low-Level Output Current – mA
25.0
TA = 25°C
20.0
TA = 85°C
15.0
10.0
5.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
7.0
4.0
3.0
2.0
1.0
0.5
1.0
1.5
Figure 2.
Figure 3.
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0.0
IOH – Typical High-Level Output Current – mA
VCC = 3.0 V
P3.2
−5.0
−10.0
−15.0
−20.0
−25.0
0.0
2.0
VOL – Low-Level Output Voltage – V
0.0
IOH – Typical High-Level Output Current – mA
TA = 85°C
5.0
VOL – Low-Level Output Voltage – V
TA = 85°C
TA = 25°C
0.5
1.0
1.5
2.0
2.5
3.0
VOH – High-Level Output Voltage – V
Figure 4.
48
TA = 25°C
6.0
0.0
0.0
3.5
VCC = 1.8 V
P3.2
3.5
−1.0
VCC = 1.8 V
P3.2
−2.0
−3.0
−4.0
−5.0
TA = 85°C
−6.0
TA = 25°C
−7.0
−8.0
0.0
0.5
1.0
1.5
VOH – High-Level Output Voltage – V
2.0
Figure 5.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
VCC = 3.0 V
P3.2
55.0
IOL – Typical Low-Level Output Current – mA
IOL – Typical Low-Level Output Current – mA
60.0
TA = 25°C
50.0
TA = 85°C
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
24
16
TA = 85°C
12
8
4
0.5
1.0
1.5
Figure 6.
Figure 7.
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
0.0
VCC = 3.0 V
P3.2
IOH – Typical High-Level Output Current – mA
−5.0
−10.0
−15.0
−20.0
−25.0
−30.0
−35.0
−40.0
−45.0
−50.0
TA = 85°C
−55.0
−60.0
0.0
2.0
VOL – Low-Level Output Voltage – V
VOL – Low-Level Output Voltage – V
IOH – Typical High-Level Output Current – mA
TA = 25°C
20
0
0.0
3.5
VCC = 1.8 V
P3.2
TA = 25°C
0.5
1.0
1.5
2.0
2.5
3.0
VOH – High-Level Output Voltage – V
Figure 8.
Copyright © 2010–2011, Texas Instruments Incorporated
3.5
VCC = 1.8 V
P3.2
−4
−8
−12
TA = 85°C
−16
TA = 25°C
−20
0.0
0.5
1.0
1.5
2.0
VOH – High-Level Output Voltage – V
Figure 9.
49
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Crystal Oscillator, XT1, Low-Frequency Mode (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
TA = 25°C
ΔIDVCC,LF
Differential XT1 oscillator crystal
current consumption from lowest
drive setting, LF mode
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 2,
TA = 25°C
fXT1,LF,SW
XT1 oscillator logic-level
square-wave input frequency,
LF mode
XTS = 0, XT1BYPASS = 1 (2)
(3)
10
fFault,LF
tSTART,LF
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
50
Integrated effective load
capacitance, LF mode (5)
32.768
XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
fXT1,LF = 32768 Hz, CL,eff = 6 pF
210
XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
fXT1,LF = 32768 Hz, CL,eff = 12 pF
300
Hz
50
kHz
kΩ
XTS = 0, XCAPx = 0 (6)
CL,eff
UNIT
µA
0.170
32768
XTS = 0, XT1BYPASS = 0
Oscillation allowance for
LF crystals (4)
3V
0.290
XT1 oscillator crystal frequency,
LF mode
MAX
0.075
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C
fXT1,LF0
OALF
TYP
2
XTS = 0, XCAPx = 1
5.5
XTS = 0, XCAPx = 2
8.5
XTS = 0, XCAPx = 3
12.0
pF
Duty cycle, LF mode
XTS = 0, Measured at ACLK,
fXT1,LF = 32768 Hz
30
70
%
Oscillator fault frequency,
LF mode (7)
XTS = 0 (8)
10
10000
Hz
Startup time, LF mode
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
TA = 25°C,
CL,eff = 6 pF
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C,
CL,eff = 12 pF
1000
3V
ms
500
To improve EMI on the XT1 oscillator, the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
When XT1BYPASS is set, XT1 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined in
the Schmitt-trigger Inputs section of this datasheet.
Maximum frequency of operation of the entire device cannot be exceeded.
Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
(a) For XT1DRIVEx = 0, CL,ef f ≤ 6 pF.
(b) For XT1DRIVEx = 1, 6 pF ≤ CL,ef f ≤ 9 pF.
(c) For XT1DRIVEx = 2, 6 pF ≤ CL,ef f ≤ 10 pF.
(d) For XT1DRIVEx = 3, CL,ef f ≥ 6 pF.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VCC
MIN
fOSC = 4 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C
IDVCC,XT2
XT2 oscillator crystal current
consumption
fOSC = 12 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 1,
TA = 25°C
fOSC = 20 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 2,
TA = 25°C
(2)
TYP
MAX
UNIT
200
260
µA
3V
325
fOSC = 32 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 3,
TA = 25°C
450
fXT2,HF0
XT2 oscillator crystal frequency,
mode 0
XT2DRIVEx = 0, XT2BYPASS = 0 (3)
4
8
MHz
fXT2,HF1
XT2 oscillator crystal frequency,
mode 1
XT2DRIVEx = 1, XT2BYPASS = 0 (3)
8
16
MHz
fXT2,HF2
XT2 oscillator crystal frequency,
mode 2
XT2DRIVEx = 2, XT2BYPASS = 0 (3)
16
24
MHz
fXT2,HF3
XT2 oscillator crystal frequency,
mode 3
XT2DRIVEx = 3, XT2BYPASS = 0 (3)
24
32
MHz
fXT2,HF,SW
XT2 oscillator logic-level
square-wave input frequency
XT2BYPASS = 1 (4)
0.7
32
MHz
OAHF
tSTART,HF
CL,eff
Oscillation allowance for
HF crystals (5)
Startup time
Integrated effective load
capacitance, HF mode (6)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
Oscillator fault frequency
XT2DRIVEx = 0, XT2BYPASS = 0,
fXT2,HF0 = 6 MHz, CL,eff = 15 pF
450
XT2DRIVEx = 1, XT2BYPASS = 0,
fXT2,HF1 = 12 MHz, CL,eff = 15 pF
320
XT2DRIVEx = 2, XT2BYPASS = 0,
fXT2,HF2 = 20 MHz, CL,eff = 15 pF
200
XT2DRIVEx = 3, XT2BYPASS = 0,
fXT2,HF3 = 32 MHz, CL,eff = 15 pF
200
fOSC = 6 MHz
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C,
CL,eff = 15 pF
0.5
fOSC = 20 MHz
XT2BYPASS = 0, XT2DRIVEx = 3,
TA = 25°C,
CL,eff = 15 pF
Ω
3V
ms
0.3
1
(1)
Duty cycle
fFault,HF
(3)
Measured at ACLK, fXT2,HF2 = 20 MHz
(7)
XT2BYPASS = 1
(8)
40
30
50
pF
60
%
300
kHz
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
To improve EMI on the XT2 oscillator the following guidelines should be observed.
(a) Keep the traces between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
(d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
Maximum frequency of operation of the entire device cannot be exceeded.
When XT2BYPASS is set, the XT2 circuit is automatically powered down.
Oscillation allowance is based on a safety factor of 5 for recommended crystals.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
Copyright © 2010–2011, Texas Instruments Incorporated
51
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
fVLO
VLO frequency
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dT
VLO frequency temperature drift
Measured at ACLK (1)
1.8 V to 3.6 V
Measured at ACLK (2)
1.8 V to 3.6 V
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dVCC VLO frequency supply voltage drift
Duty cycle
(1)
(2)
MIN
TYP
MAX
6
9.4
14
0.5
kHz
%/°C
4
40
UNIT
%/V
50
60
TYP
MAX
%
Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)
Internal Reference, Low-Frequency Oscillator (REFO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
UNIT
REFO oscillator current
consumption
TA = 25°C
1.8 V to 3.6 V
3
µA
REFO frequency calibrated
Measured at ACLK
1.8 V to 3.6 V
32768
Hz
REFO absolute tolerance
calibrated
Full temperature range
1.8 V to 3.6 V
±3.5
3V
±1.5
dfREFO/dT
REFO frequency temperature drift
Measured at ACLK (1)
1.8 V to 3.6 V
0.01
%/°C
dfREFO/dVCC
REFO frequency supply voltage
drift
Measured at ACLK (2)
1.8 V to 3.6 V
1.0
%/V
Duty cycle
Measured at ACLK
1.8 V to 3.6 V
REFO startup time
40%/60% duty cycle
1.8 V to 3.6 V
IREFO
fREFO
tSTART
(1)
(2)
52
TA = 25°C
40
50
25
60
%
%
%
µs
Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
fDCO(0,0)
DCO frequency (0, 0)
DCORSELx = 0, DCOx = 0, MODx = 0
0.07
0.20
MHz
fDCO(0,31)
DCO frequency (0, 31)
DCORSELx = 0, DCOx = 31, MODx = 0
0.70
1.70
MHz
fDCO(1,0)
DCO frequency (1, 0)
DCORSELx = 1, DCOx = 0, MODx = 0
0.15
0.36
MHz
fDCO(1,31)
DCO frequency (1, 31)
DCORSELx = 1, DCOx = 31, MODx = 0
1.47
3.45
MHz
fDCO(2,0)
DCO frequency (2, 0)
DCORSELx = 2, DCOx = 0, MODx = 0
0.32
0.75
MHz
fDCO(2,31)
DCO frequency (2, 31)
DCORSELx = 2, DCOx = 31, MODx = 0
3.17
7.38
MHz
fDCO(3,0)
DCO frequency (3, 0)
DCORSELx = 3, DCOx = 0, MODx = 0
0.64
1.51
MHz
fDCO(3,31)
DCO frequency (3, 31)
DCORSELx = 3, DCOx = 31, MODx = 0
6.07
14.0
MHz
fDCO(4,0)
DCO frequency (4, 0)
DCORSELx = 4, DCOx = 0, MODx = 0
1.3
3.2
MHz
fDCO(4,31)
DCO frequency (4, 31)
DCORSELx = 4, DCOx = 31, MODx = 0
12.3
28.2
MHz
fDCO(5,0)
DCO frequency (5, 0)
DCORSELx = 5, DCOx = 0, MODx = 0
2.5
6.0
MHz
fDCO(5,31)
DCO frequency (5, 31)
DCORSELx = 5, DCOx = 31, MODx = 0
23.7
54.1
MHz
fDCO(6,0)
DCO frequency (6, 0)
DCORSELx = 6, DCOx = 0, MODx = 0
4.6
10.7
MHz
fDCO(6,31)
DCO frequency (6, 31)
DCORSELx = 6, DCOx = 31, MODx = 0
39.0
88.0
MHz
fDCO(7,0)
DCO frequency (7, 0)
DCORSELx = 7, DCOx = 0, MODx = 0
8.5
19.6
MHz
fDCO(7,31)
DCO frequency (7, 31)
DCORSELx = 7, DCOx = 31, MODx = 0
60
135
MHz
SDCORSEL
Frequency step between range
DCORSEL and DCORSEL + 1
SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO)
1.2
2.3
ratio
SDCO
Frequency step between tap
DCO and DCO + 1
SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO)
1.02
1.12
ratio
Duty cycle
Measured at SMCLK
40
50
60
%
dfDCO/dT
DCO frequency temperature drift
fDCO = 1 MHz,
0.1
%/°C
dfDCO/dVCC
DCO frequency voltage drift
fDCO = 1 MHz
1.9
%/V
Typical DCO Frequency, VCC = 3.0 V, TA = 25°C
100
fDCO – MHz
10
DCOx = 31
1
0.1
DCOx = 0
0
1
2
3
4
5
6
7
DCORSEL
Figure 10. Typical DCO frequency
Copyright © 2010–2011, Texas Instruments Incorporated
53
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
PMM, Brown-Out Reset (BOR)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V(DVCC_BOR_IT–)
BORH on voltage,
DVCC falling level
| dDVCC/dt | < 3 V/s
V(DVCC_BOR_IT+)
BORH off voltage,
DVCC rising level
| dDVCC/dt | < 3 V/s
V(DVCC_BOR_hys)
BORH hysteresis
tRESET
Pulse length required at
RST/NMI pin to accept a
reset
MIN
0.80
TYP
1.30
60
MAX
UNIT
1.45
V
1.50
V
250
mV
µs
2
PMM, Core Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VCORE3(AM)
Core voltage, active
mode, PMMCOREV = 3
2.4 V ≤ DVCC ≤ 3.6 V, 0 mA ≤ I(VCORE) ≤ 21 mA
1.90
V
VCORE2(AM)
Core voltage, active
mode, PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V, 0 mA ≤ I(VCORE) ≤ 21 mA
1.80
V
VCORE1(AM)
Core voltage, active
mode, PMMCOREV = 1
2 V ≤ DVCC ≤ 3.6 V, 0 mA ≤ I(VCORE) ≤ 17 mA
1.60
V
VCORE0(AM)
Core voltage, active
mode, PMMCOREV = 0
1.8 V ≤ DVCC ≤ 3.6 V, 0 mA ≤ I(VCORE) ≤ 13 mA
1.40
V
VCORE3(LPM)
Core voltage, low-current
2.4 V ≤ DVCC ≤ 3.6 V, 0 µA ≤ I(VCORE) ≤ 30 µA
mode, PMMCOREV = 3
1.94
V
VCORE2(LPM)
Core voltage, low-current
2.2 V ≤ DVCC ≤ 3.6 V, 0 µA ≤ I(VCORE) ≤ 30 µA
mode, PMMCOREV = 2
1.84
V
VCORE1(LPM)
Core voltage, low-current
2 V ≤ DVCC ≤ 3.6 V, 0 µA ≤ I(VCORE) ≤ 30 µA
mode, PMMCOREV = 1
1.64
V
VCORE0(LPM)
Core voltage, low-current
1.8 V ≤ DVCC ≤ 3.6 V, 0 µA ≤ I(VCORE) ≤ 30 µA
mode, PMMCOREV = 0
1.44
V
PMM, SVS High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVSHE = 0, DVCC = 3.6 V
I(SVSH)
V(SVSH_IT–)
V(SVSH_IT+)
(1)
54
SVS current consumption
SVSH on voltage level (1)
SVSH off voltage level (1)
TYP
MAX
0
UNIT
nA
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 0
200
nA
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 1
2.0
µA
SVSHE = 1, SVSHRVL = 0
1.59
1.64
1.69
SVSHE = 1, SVSHRVL = 1
1.79
1.84
1.91
SVSHE = 1, SVSHRVL = 2
1.98
2.04
2.11
SVSHE = 1, SVSHRVL = 3
2.10
2.16
2.23
SVSHE = 1, SVSMHRRL = 0
1.62
1.74
1.81
SVSHE = 1, SVSMHRRL = 1
1.88
1.94
2.01
SVSHE = 1, SVSMHRRL = 2
2.07
2.14
2.21
SVSHE = 1, SVSMHRRL = 3
2.20
2.26
2.33
SVSHE = 1, SVSMHRRL = 4
2.32
2.40
2.48
SVSHE = 1, SVSMHRRL = 5
2.56
2.70
2.84
SVSHE = 1, SVSMHRRL = 6
2.85
3.00
3.15
SVSHE = 1, SVSMHRRL = 7
2.85
3.00
3.15
V
V
The SVSH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430F5xx/MSP430F6xx Family User's Guide (SLAU208) on recommended settings and usage.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
PMM, SVS High Side (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
tpd(SVSH)
t(SVSH)
dVDVCC/dt
TEST CONDITIONS
SVSH propagation delay
SVSH on/off delay time
MIN
TYP
SVSHE = 1, dVDVCC/dt = 10 mV/µs,
SVSHFP = 1
2.5
SVSHE = 1, dVDVCC/dt = 1 mV/µs,
SVSHFP = 0
20
MAX
UNIT
µs
SVSHE = 0→1,
SVSHFP = 1
12.5
SVSHE = 0→1,
SVSHFP = 0
100
µs
DVCC rise time
0
1000
V/s
MAX
UNIT
PMM, SVM High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVMHE = 0, DVCC = 3.6 V
I(SVMH)
V(SVMH)
SVMH current consumption
SVMH on/off voltage level
(1)
0
nA
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 0
200
nA
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 1
2.0
µA
SVMHE = 1, SVSMHRRL = 0
1.65
1.74
1.86
SVMHE = 1, SVSMHRRL = 1
1.85
1.94
2.02
SVMHE = 1, SVSMHRRL = 2
2.02
2.14
2.22
SVMHE = 1, SVSMHRRL = 3
2.18
2.26
2.35
SVMHE = 1, SVSMHRRL = 4
2.32
2.40
2.48
SVMHE = 1, SVSMHRRL = 5
2.56
2.70
2.84
SVMHE = 1, SVSMHRRL = 6
2.85
3.00
3.15
SVMHE = 1, SVSMHRRL = 7
2.85
3.00
3.15
SVMHE = 1, SVMHOVPE = 1
tpd(SVMH)
t(SVMH)
(1)
SVMH propagation delay
SVMH on/off delay time
TYP
V
3.75
SVMHE = 1, dVDVCC/dt = 10 mV/µs,
SVMHFP = 1
2.5
µs
SVMHE = 1, dVDVCC/dt = 1 mV/µs,
SVMHFP = 0
20
µs
SVMHE = 0→1,
SVSMFP = 1
12.5
µs
SVMHE = 0→1,
SVMHFP = 0
100
µs
The SVMH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430F5xx/MSP430F6xx Family User's Guide (SLAU208) on recommended settings and usage.
PMM, SVS Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
SVSLE = 0, PMMCOREV = 2
I(SVSL)
tpd(SVSL)
t(SVSL)
SVSL current consumption
SVSL propagation delay
SVSL on/off delay time
Copyright © 2010–2011, Texas Instruments Incorporated
MIN
TYP
0
MAX
UNIT
nA
SVSLE = 1, PMMCOREV = 2, SVSLFP = 0
200
nA
SVSLE = 1, PMMCOREV = 2, SVSLFP = 1
2.0
µA
SVSLE = 1, dVCORE/dt = 10 mV/µs,
SVSLFP = 1
2.5
SVSLE = 1, dVCORE/dt = 1 mV/µs,
SVSLFP = 0
20
µs
SVSLE = 0→1,
SVSLFP = 1
12.5
SVSLE = 0→1,
SVSLFP = 0
100
µs
55
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
PMM, SVM Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
SVMLE = 0, PMMCOREV = 2
I(SVML)
tpd(SVML)
t(SVML)
SVML current consumption
SVML propagation delay
SVML on/off delay time
MAX
UNIT
0
nA
SVMLE = 1, PMMCOREV = 2, SVMLFP = 0
200
nA
SVMLE = 1, PMMCOREV = 2, SVMLFP = 1
2.0
µA
SVMLE = 1, dVCORE/dt = 10 mV/µs,
SVMLFP = 1
2.5
SVMLE = 1, dVCORE/dt = 1 mV/µs,
SVMLFP = 0
20
µs
SVMLE = 0→1,
SVMLFP = 1
12.5
SVMLE = 0→1,
SVMLFP = 0
100
µs
Wake-Up From Low-Power Modes and Reset
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP
MAX
fMCLK ≥ 4 MHz
MIN
3
6.5
UNIT
1 MHz < fMCLK <
4 MHz
4
8.0
150
165
µs
tWAKE-UP-FAST
Wake-up time from LPM2,
LPM3, or LPM4 to active
mode (1)
PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3),
SVSLFP = 1
tWAKE-UP-SLOW
Wake-up time from LPM2,
LPM3 or LPM4 to active
mode (2)
PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3),
SVSLFP = 0
tWAKE-UP-LPM5
Wake-up time from LPM3.5 or
LPM4.5 to active mode (3)
2
3
ms
tWAKE-UP-RESET
Wake-up time from RST or
BOR event to active mode (3)
2
3
ms
(1)
(2)
(3)
µs
This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low side supervisor (SVSL) and low side monitor (SVML). Fastest wakeup times are possible with SVSLand SVML in full
performance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while
operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx
Family User's Guide (SLAU208).
This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low side supervisor (SVSL) and low side monitor (SVML). In this case, the SVSLand SVML are in normal mode (low current)
mode when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and
LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx Family User's Guide
(SLAU208).
This value represents the time from the wakeup event to the reset vector execution.
Timer_A, Timers TA0, TA1, and TA2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
fTA
Timer_A input clock frequency
Internal: SMCLK, ACLK
External: TACLK
Duty cycle = 50% ± 10%
1.8 V/ 3 V
tTA,cap
Timer_A capture timing
All capture inputs.
Minimum pulse width required for
capture.
1.8 V/ 3 V
MIN
TYP
MAX
UNIT
20
MHz
20
ns
Timer_B, Timer TB0
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fTB
56
Timer_B input clock frequency
TEST CONDITIONS
Internal: SMCLK, ACLK
External: TBCLK
Duty cycle = 50% ± 10%
VCC
1.8 V/ 3 V
MIN
TYP
MAX
UNIT
20
MHz
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Timer_B, Timer TB0 (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
tTB,cap
TEST CONDITIONS
All capture inputs.
Minimum pulse width required for
capture.
Timer_B capture timing
VCC
MIN
1.8 V/ 3 V
TYP
MAX
20
UNIT
ns
Battery Backup
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VBAT = 1.7 V,
DVCC not connected,
RTC running
IVBAT
Current into VBAT terminal in VBAT = 2.2 V,
case no primary battery is
DVCC not connected,
connected.
RTC running
VBAT = 3 V,
DVCC not connected,
RTC running
VCC
MIN
TYP
TA = -40°C
0.43
TA = 25°C
0.52
TA = 60°C
0.58
TA = 85°C
0.64
TA = -40°C
0.50
TA = 25°C
0.59
TA = 60°C
0.64
TA = 85°C
0.71
TA = -40°C
0.68
TA = 25°C
0.75
TA = 60°C
0.79
TA = 85°C
0.86
General
VSWITCH
Switch-over level (VCC to
VBAT)
RON_VBAT
On-resistance of switch
between VBAT and VBAK
VBAT3
VBAT to ADC:
VBAT divide,
VBAT3 ≠ VBAT /3
tSample,VBA
CVCC = 4.7 µF
µA
VSVSH_IT1.69
SVSHRL = 1
1.79
1.91
SVSHRL = 2
1.98
2.11
SVSHRL = 3
2.10
1
1.8 V
0.6
±5%
3V
1.0
±5%
3.6 V
1.2
±5%
0V
1000
VCHVx
Charger end voltage
2.65
CHVx = 2
V
2.23
0.35
VBAT to ADC: Sampling time ADC12ON = 1,
required if VBAT3 selected
Error of conversion result ≤ 1 LSB
Charge limiting resistor
µA
1.59
VBAT = 1.8 V
UNIT
µA
SVSHRL = 0
T3
RCHARGE
MAX
kΩ
V
ns
2.7
2.9
CHCx = 1
5
CHCx = 2
10
CHCx = 3
20
V
kΩ
USCI (UART Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fUSCI
USCI input clock frequency
fBITCLK
BITCLK clock frequency
(equals baud rate in MBaud)
tτ
UART receive deglitch time (1)
(1)
TEST CONDITIONS
VCC
MIN
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ± 10%
TYP
MAX
UNIT
fSYSTEM
MHz
1
MHz
2.2 V
50
600
3V
50
600
ns
Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are
correctly recognized their width should exceed the maximum specification of the deglitch time.
Copyright © 2010–2011, Texas Instruments Incorporated
57
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
USCI (SPI Master Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Note (1), Figure 11 and )
PARAMETER
fUSCI
TEST CONDITIONS
VCC
USCI input clock frequency
PMMCOREV = 0
tSU,MI
SOMI input data setup time
PMMCOREV = 3
PMMCOREV = 0
tHD,MI
SOMI input data hold time
PMMCOREV = 3
tVALID,MO
tHD,MO
(1)
(2)
(3)
SIMO output data valid time (2)
SIMO output data hold time
MIN
SMCLK, ACLK,
Duty cycle = 50% ± 10%
(3)
1.8 V
55
3V
38
2.4 V
30
3V
25
1.8 V
0
3V
0
2.4 V
0
3V
0
TYP
MAX
UNIT
fSYSTEM
MHz
ns
ns
ns
ns
UCLK edge to SIMO valid,
CL = 20 pF,
PMMCOREV = 0
1.8 V
20
3V
18
UCLK edge to SIMO valid,
CL = 20 pF,
PMMCOREV = 3
2.4 V
16
3V
15
CL = 20 pF,
PMMCOREV = 0
1.8 V
-10
3V
-8
CL = 20 pF,
PMMCOREV = 3
2.4 V
-10
3V
-8
ns
ns
ns
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)).
For the slave's parameters tSU,SI(Slave) and tVALID,SO(Slave), see the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. Refer to the timing
diagrams in Figure 11 and .
Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data
on the SIMO output can become invalid before the output changing clock edge observed on UCLK. Refer to the timing diagrams in
Figure 11 and .
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 11. SPI Master Mode, CKPH = 0
58
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 12. SPI Master Mode, CKPH = 1
Copyright © 2010–2011, Texas Instruments Incorporated
59
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
USCI (SPI Slave Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Note (1), Figure 13 and Figure 14)
PARAMETER
TEST CONDITIONS
PMMCOREV = 0
tSTE,LEAD
STE lead time, STE low to clock
PMMCOREV = 3
PMMCOREV = 0
tSTE,LAG
STE lag time, Last clock to STE high
PMMCOREV = 3
PMMCOREV = 0
tSTE,ACC
STE access time, STE low to SOMI data out
PMMCOREV = 3
PMMCOREV = 0
tSTE,DIS
STE disable time, STE high to SOMI high
impedance
PMMCOREV = 3
PMMCOREV = 0
tSU,SI
SIMO input data setup time
PMMCOREV = 3
PMMCOREV = 0
tHD,SI
SIMO input data hold time
PMMCOREV = 3
tVALID,SO
tHD,SO
(1)
(2)
(3)
60
SOMI output data valid time
(2)
SOMI output data hold time (3)
VCC
MIN
1.8 V
11
3V
8
2.4 V
7
3V
6
1.8 V
3
3V
3
2.4 V
3
3V
3
TYP
MAX
ns
ns
ns
ns
1.8 V
66
3V
50
2.4 V
36
3V
30
1.8 V
30
3V
23
2.4 V
16
3V
13
1.8 V
5
3V
5
2.4 V
2
3V
2
1.8 V
5
3V
5
2.4 V
5
3V
5
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
UCLK edge to SOMI valid,
CL = 20 pF,
PMMCOREV = 0
1.8 V
76
3V
60
UCLK edge to SOMI valid,
CL = 20 pF,
PMMCOREV = 3
2.4 V
44
3V
40
CL = 20 pF,
PMMCOREV = 0
1.8 V
18
3V
12
CL = 20 pF,
PMMCOREV = 3
2.4 V
10
3V
8
ns
ns
ns
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)).
For the master's parameters tSU,MI(Master) and tVALID,MO(Master), see the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. Refer to the timing
diagrams in Figure 13 and Figure 14.
Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. Refer to the timing diagrams in
Figure 13 and Figure 14.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
tSTE,LEAD
tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tSU,SI
tLO/HI
tHD,SI
SIMO
tHD,SO
tVALID,SO
tSTE,ACC
tSTE,DIS
SOMI
Figure 13. SPI Slave Mode, CKPH = 0
tSTE,LAG
tSTE,LEAD
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tHD,SI
tSU,SI
SIMO
tSTE,ACC
tHD,MO
tVALID,SO
tSTE,DIS
SOMI
Figure 14. SPI Slave Mode, CKPH = 1
Copyright © 2010–2011, Texas Instruments Incorporated
61
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
USCI (I2C Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 15)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ± 10%
MAX
UNIT
fSYSTEM
MHz
400
kHz
fUSCI
USCI input clock frequency
fSCL
SCL clock frequency
tHD,STA
Hold time (repeated) START
tSU,STA
Setup time for a repeated START
tHD,DAT
Data hold time
2.2 V/3 V
0
ns
tSU,DAT
Data setup time
2.2 V/3 V
250
ns
2.2 V/3 V
fSCL ≤ 100 kHz
fSCL > 100 kHz
fSCL ≤ 100 kHz
fSCL > 100 kHz
fSCL ≤ 100 kHz
tSU,STO
Setup time for STOP
tSP
Pulse width of spikes suppressed by input filter
fSCL > 100 kHz
tSU,STA
tHD,STA
2.2 V/3 V
2.2 V/3 V
2.2 V/3 V
0
4.0
µs
0.6
4.7
µs
0.6
4.0
µs
0.6
2.2 V
50
600
3V
50
600
tHD,STA
ns
tBUF
SDA
tLOW
tHIGH
tSP
SCL
tSU,DAT
tSU,STO
tHD,DAT
Figure 15. I2C Mode Timing
12-Bit ADC, Power Supply and Input Range Conditions
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
AVCC
Analog supply voltage
AVCC and DVCC are connected together,
AVSS and DVSS are connected together,
V(AVSS) = V(DVSS) = 0 V
V(Ax)
Analog input voltage range (2)
All ADC12 analog input pins Ax
IADC12_A
Operating supply current into
AVCC terminal (3)
fADC12CLK = 5.0 MHz (4)
CI
Input capacitance
Only one terminal Ax can be selected at one
time
RI
Input MUX ON resistance
0 V ≤ VIN ≤ V(AVCC)
(1)
(2)
(3)
(4)
62
VCC
MIN
TYP
2.2
0
MAX
UNIT
3.6
V
AVCC
V
2.2 V
150
200
3V
150
250
2.2 V
20
25
pF
200
1900
Ω
10
µA
The leakage current is specified by the digital I/O input leakage.
The analog input voltage range must be within the selected reference voltage range VR+ to VR– for valid conversion results. If the
reference voltage is supplied by an external source or if the internal voltage is used and REFOUT = 1, then decoupling capacitors are
required. See REF, External Reference and REF, Built-In Reference.
The internal reference supply current is not included in current consumption parameter IADC12.
ADC12ON = 1, REFON = 0, SHT0 = 0, SHT1 = 0, ADC12DIV = 0
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
12-Bit ADC, Timing Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
For specified performance of ADC12 linearity
parameters using an external reference voltage or
AVCC as reference (1)
fADC12CLK
ADC conversion clock
For specified performance of ADC12 linearity
parameters using the internal reference (2)
2.2 V/3 V
For specified performance of ADC12 linearity
parameters using the internal reference (3)
fADC12OSC
tCONVERT
tSample
(1)
(2)
(3)
(4)
(5)
(6)
Internal ADC12
oscillator (4)
Conversion time
MIN
TYP
MAX
0.45
4.8
5.0
0.45
2.4
4.0
0.45
2.4
2.7
4.8
5.4
ADC12DIV = 0, fADC12CLK = fADC12OSC
2.2 V/3 V
4.2
REFON = 0, Internal oscillator,
ADC12OSC used for ADC conversion clock
2.2 V/3 V
2.4
RS = 400 Ω, RI = 200 Ω, CI = 20 pF,
τ = [RS + RI] × CI (6)
MHz
MHz
3.1
µs
External fADC12CLK from ACLK, MCLK or SMCLK,
ADC12SSEL ≠ 0
Sampling time
UNIT
(5)
2.2 V/3 V
1000
ns
REFOUT = 0, external reference voltage: SREF2 = 0, SREF1 = 1, SREF0 = 0. AVCC as reference voltage: SREF2 = 0, SREF1 = 0,
SREF0 = 0. The specified performance of the ADC12 linearity is ensured when using the ADC12OSC. For other clock sources, the
specified performance of the ADC12 linearity is ensured with fADC12CLK maximum of 5.0 MHz.
SREF2 = 0, SREF1 = 1, SREF0 = 0, ADC12SR = 0, REFOUT = 1
SREF2 = 0, SREF1 = 1, SREF0 = 0, ADC12SR = 0, REFOUT = 0. The specified performance of the ADC12 linearity is ensured when
using the ADC12OSC divided by 2.
The ADC12OSC is sourced directly from MODOSC inside the UCS.
13 × ADC12DIV × 1/fADC12CLK
Approximately ten Tau (τ) are needed to get an error of less than ±0.5 LSB:
tSample = ln(2n+1) x (RS + RI) × CI + 800 ns, where n = ADC resolution = 12, RS = external source resistance
12-Bit ADC, Linearity Parameters Using an External Reference Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
EI
Integral
linearity error (1)
ED
Differential
linearity error (1)
EO
Offset error (3)
EG
Gain error (3)
ET
(1)
(2)
(3)
Total unadjusted
error
TEST CONDITIONS
1.4 V ≤ dVREF ≤ 1.6 V (2)
1.6 V < dVREF
VCC
MIN
TYP
±2
2.2 V/3 V
(2)
(2)
MAX
±1.7
±1
2.2 V/3 V
(2)
2.2 V/3 V
±3
±5.6
dVREF > 2.2 V (2)
2.2 V/3 V
±1.5
±3.5
(2)
2.2 V/3 V
±1
±2.5
dVREF ≤ 2.2 V (2)
2.2 V/3 V
±3.5
±7.1
dVREF > 2.2 V (2)
2.2 V/3 V
±2
±5
dVREF ≤ 2.2 V
UNIT
LSB
LSB
LSB
LSB
LSB
Parameters are derived using the histogram method.
The external reference voltage is selected by: SREF2 = 0 or 1, SREF1 = 1, SREF0 = 0. dVREF = VR+ - VR-. VR+ < AVCC. VR- > AVSS.
Unless otherwise mentioned dVREF > 1.5V. Impedance of the external reference voltage R < 100 Ohm and two decoupling capacitors,
10µF and 100nF, should be connected to VREF to decouple the dynamic current. See also the MSP430F5xx/MSP430F6xx Family
User's Guide (SLAU208).
Parameters are derived using a best fit curve.
12-Bit ADC, Linearity Parameters Using AVCC as Reference Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
EI
Integral linearity error
See
(2)
2.2 V/3 V
±1.7
LSB
ED
Differential linearity error (1)
See
(2)
2.2 V/3 V
±1
LSB
EO
Offset error (3)
See
(2)
2.2 V/3 V
±2
LSB
(1)
(2)
(3)
(1)
±1
Parameters are derived using the histogram method.
AVCC as reference voltage is selected by: SREF2 = 0, SREF1 = 0, SREF0 = 0.
Parameters are derived using a best fit curve.
Copyright © 2010–2011, Texas Instruments Incorporated
63
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
12-Bit ADC, Linearity Parameters Using AVCC as Reference Voltage (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
EG
Gain error
(3)
ET
Total unadjusted error
TEST CONDITIONS
See
(2)
See
(2)
VCC
MIN
TYP
MAX
UNIT
2.2 V/3 V
±2
±4
LSB
2.2 V/3 V
±2
±5
LSB
TYP
MAX
UNIT
12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST CONDITIONS (1)
PARAMETER
EI
Integral
linearity error (2)
ED
Differential
linearity error (2)
EO
Offset error (3)
EG
Gain error (3)
ET
Total unadjusted
error
(1)
(2)
(3)
(4)
ADC12SR = 0, REFOUT = 1
fADC12CLK ≤ 4.0 MHz
ADC12SR = 0, REFOUT = 0
fADC12CLK ≤ 2.7 MHz
ADC12SR = 0, REFOUT = 1
fADC12CLK ≤ 4.0 MHz
ADC12SR = 0, REFOUT = 1
fADC12CLK ≤ 2.7 MHz
ADC12SR = 0, REFOUT = 0
fADC12CLK ≤ 2.7 MHz
ADC12SR = 0, REFOUT = 1
fADC12CLK ≤ 4.0 MHz
ADC12SR = 0, REFOUT = 0
fADC12CLK ≤ 2.7 MHz
ADC12SR = 0, REFOUT = 1
fADC12CLK ≤ 4.0 MHz
ADC12SR = 0, REFOUT = 0
fADC12CLK ≤ 2.7 MHz
ADC12SR = 0, REFOUT = 1
fADC12CLK ≤ 4.0 MHz
ADC12SR = 0, REFOUT = 0
fADC12CLK ≤ 2.7 MHz
VCC
MIN
±1.7
2.2 V/3 V
±2.5
-1
+1.5
-1
+2.5
±1
2.2 V/3 V
2.2 V/3 V
±2
±4
±2
±4
±1
2.2 V/3 V
±2.5
LSB
LSB
LSB
LSB
±1% (4) VREF
±2
2.2 V/3 V
±5
LSB
(4)
VREF
±1%
The external reference voltage is selected by: SREF2 = 0, SREF1 = 0, SREF0 = 1. dVREF = VR+ - VR-.
Parameters are derived using the histogram method.
Parameters are derived using a best fit curve.
The gain error and the total unadjusted error are dominated by the accuracy of the integrated reference module absolute accuracy. In
this mode the reference voltage used by the ADC12_A is not available on a pin.
12-Bit ADC, Temperature Sensor and Built-In VMID (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VSENSOR
See
(2)
TCSENSOR
TEST CONDITIONS
ADC12ON = 1, INCH = 0Ah,
TA = 0°C
ADC12ON = 1, INCH = 0Ah
VCC
MIN
TYP
2.2 V
680
3V
680
2.2 V
2.25
3V
2.25
MAX
mV
mV/°C
tSENSOR(sample)
Sample time required if
channel 10 is selected (3)
ADC12ON = 1, INCH = 0Ah,
Error of conversion result ≤ 1 LSB
2.2 V
30
3V
30
VMID
AVCC divider at channel 11
ADC12ON = 1, INCH = 0Bh,
VMID is ~0.5 × VAVCC
2.2 V
1.06
1.1
1.14
3V
1.46
1.5
1.54
tVMID(sample)
Sample time required if
channel 11 is selected (4)
ADC12ON = 1, INCH = 0Bh,
Error of conversion result ≤ 1 LSB
2.2 V/3 V
1000
(1)
UNIT
µs
V
ns
(3)
(4)
The temperature sensor is provided by the REF module. Please refer to the REF module parametric, IREF+, regarding the current
consumption of the temperature sensor.
The temperature sensor offset can be as much as ±20°C. A single-point calibration is recommended in order to minimize the offset error
of the built-in temperature sensor. The TLV structure contains calibration values for 30°C ± 3°C and 85°C ± 3°C for each of the available
reference voltage levels. The sensor voltage can be computed as VSENSE = TCSENSOR * (Temperature,°C) + VSENSOR, where TCSENSOR
and VSENSOR can be computed from the calibration values for higher accuracy. See also the MSP430F5xx/MSP430F6xx Family User's
Guide (SLAU208).
The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time tSENSOR(on).
The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
64
Copyright © 2010–2011, Texas Instruments Incorporated
(2)
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Typical Temperature Sensor Voltage - mV
1000
950
900
850
800
750
700
650
600
550
500
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Ambient Temperature - ˚C
Figure 16. Typical Temperature Sensor Voltage
REF, External Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
VeREF+
Positive external
reference voltage input
VREF–/VeREF–
VeREF+ –
VREF–/VeREF–
IVeREF+,
IVREF–/VeREF–
CVREF+/(1)
(2)
(3)
(4)
(5)
TEST CONDITIONS
MAX
UNIT
1.4
AVCC
V
(3)
0
1.2
V
(4)
1.4
AVCC
V
VeREF+ > VREF–/VeREF–
(2)
Negative external
reference voltage input
VeREF+ > VREF–/VeREF–
Differential external
reference voltage input
VeREF+ > VREF–/VeREF–
Static input current
VCC
MIN
TYP
1.4 V ≤ VeREF+ ≤ VAVCC , VeREF– = 0 V,
fADC12CLK = 5 MHz, ADC12SHTx = 1h,
Conversion rate 200 ksps
2.2 V/3 V
-26
26
µA
1.4 V ≤ VeREF+ ≤ VAVCC , VeREF– = 0 V,
fADC12CLK = 5 MHZ, ADC12SHTx = 8h,
Conversion rate 20 ksps
2.2 V/3 V
-1.2
+1.2
µA
Capacitance at VREF+/terminal (5)
10
µF
The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, Ci, is also
the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the
recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy.
The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with
reduced accuracy requirements.
Two decoupling capacitors, 10µF and 100nF, should be connected to VREF to decouple the dynamic current required for an external
reference source if it is used for the ADC12_A. See also the MSP430F5xx/MSP430F6xx Family User's Guide (SLAU208).
Copyright © 2010–2011, Texas Instruments Incorporated
65
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
REF, Built-In Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
REFVSEL = {2} for 2.5 V
REFON = REFOUT = 1
IVREF+ = 0 A
VREF+
REFVSEL = {1} for 2 V
Positive built-in reference
REFON = REFOUT = 1
voltage output
IVREF+ = 0 A
REFVSEL = {0} for 1.5 V
REFON = REFOUT = 1
IVREF+ = 0 A
AVCC(min)
IREF+
VCC
TYP
MAX
3V
2.5
±1%
3V
2.0
±1%
2.2 V / 3 V
1.5
±1%
REFVSEL = {0} for 1.5 V
AVCC minimum voltage,
Positive built-in reference REFVSEL = {1} for 2 V
active
REFVSEL = {2} for 2.5 V
Operating supply current
into AVCC terminal (2) (3)
MIN
UNIT
V
2.2
2.3
V
2.8
ADC12SR = 1 (4), REFON = 1, REFOUT = 0,
REFBURST = 0
3V
70
100
µA
ADC12SR = 1 (4), REFON = 1, REFOUT = 1,
REFBURST = 0
3V
0.45
0.75
mA
ADC12SR = 0 (4), REFON = 1, REFOUT = 0,
REFBURST = 0
3V
210
310
µA
ADC12SR = 0 (4), REFON = 1, REFOUT = 1,
REFBURST = 0
3V
0.95
1.7
mA
IL(VREF+)
Load-current regulation,
VREF+ terminal (5)
REFVSEL = {0, 1, 2}
IVREF+ = +10 µA / -1000 µA
AVCC = AVCC(min) for each reference level,
REFVSEL = {0, 1, 2}, REFON = REFOUT = 1
CVREF+
Capacitance at VREF+
terminal
REFON = REFOUT = 1, (6)
0 mA ≤ IVREF+ ≤ IVREF+(max)
TCREF+
Temperature coefficient
of built-in reference (7)
IVREF+ is a constant in the range
of 0 mA ≤ IVREF+ ≤ –1 mA
REFOUT = 0
2.2 V/3 V
20
TCREF+
Temperature coefficient
of built-in reference (7)
IVREF+ is a constant in the range
of 0 mA ≤ IVREF+ ≤ –1 mA
REFOUT = 1
2.2 V/3 V
20
50
ppm/
°C
PSRR_DC
Power supply rejection
ratio (dc)
AVCC = AVCC(min) - AVCC(max),
TA = 25°C,
REFVSEL = {0, 1, 2}, REFON = 1,
REFOUT = 0 or 1
120
300
µV/V
PSRR_AC
Power supply rejection
ratio (ac)
AVCC = AVCC(min) - AVCC(max),
TA = 25°C,
REFVSEL = {0, 1, 2}, REFON = 1,
REFOUT = 0 or 1
1
(1)
1500
2.2 V/3 V
20
2500 µV/mA
100
pF
ppm/
°C
mV/V
(7)
The reference is supplied to the ADC by the REF module and is buffered locally inside the ADC. The ADC uses two internal buffers, one
smaller and one larger for driving the VREF+ terminal. When REFOUT = 1, the reference is available at the VREF+ terminal, as well as,
used as the reference for the conversion and utilizes the larger buffer. When REFOUT = 0, the reference is only used as the reference
for the conversion and utilizes the smaller buffer.
The internal reference current is supplied via terminal AVCC. Consumption is independent of the ADC12ON control bit, unless a
conversion is active. REFOUT = 0 represents the current contribution of the smaller buffer. REFOUT = 1 represents the current
contribution of the larger buffer without external load.
The temperature sensor is provided by the REF module. Its current is supplied via terminal AVCC and is equivalent to IREF+ with REFON
= 1 and REFOUT = 0.
For devices without the ADC12, the parametric with ADC12SR = 0 are applicable.
Contribution only due to the reference and buffer including package. This does not include resistance due to PCB trace, etc.
Two decoupling capacitors, 10µF and 100nF, should be connected to VREF to decouple the dynamic current required for an external
reference source if it is used for the ADC12_A. See also the MSP430F5xx/MSP430F6xx Family User's Guide (SLAU208).
Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C)/(85°C – (–40°C)).
66
Copyright © 2010–2011, Texas Instruments Incorporated
(2)
(3)
(4)
(5)
(6)
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
REF, Built-In Reference (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
VCC
MIN
AVCC = AVCC(min) - AVCC(max),
REFVSEL = {0, 1, 2}, REFOUT = 0,
REFON = 0 → 1
tSETTLE
(8)
TYP
MAX
UNIT
75
Settling time of reference
AVCC = AVCC(min) - AVCC(max),
voltage (8)
CVREF = CVREF(max),
REFVSEL = {0, 1, 2}, REFOUT = 1,
REFON = 0 → 1
µs
75
The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB. The settling time depends on the external
capacitive load when REFOUT = 1.
12-Bit DAC, Supply Specifications
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
AVCC
TEST CONDITIONS
Analog supply voltage
DAC12AMPx = 2, DAC12IR = 0,
DAC12IOG = 1
DAC12_xDAT = 0800h
VeREF+ = VREF+ = 1.5 V
Supply current, single DAC channel (1)
IDD
VCC
AVCC = DVCC, AVSS = DVSS = 0 V
(2)
MIN
3V
DAC12AMPx = 2, DAC12IR = 1,
DAC12_xDAT = 0800h,
VeREF+ = VREF+ = AVCC
DAC12AMPx = 5, DAC12IR = 1,
DAC12_xDAT = 0800h,
VeREF+ = VREF+ = AVCC
PSRR
(1)
(2)
(3)
(4)
Power supply rejection ratio
(3) (4)
DAC12_xDAT = 800h,
VeREF+ = 1.5 V or 2.5 V,
ΔAVCC = 100 mV
MAX
UNIT
3.60
V
65
110
125
165
µA
2.2 V/3 V
DAC12AMPx = 7, DAC12IR = 1,
DAC12_xDAT = 0800h,
VeREF+ = VREF+ = AVCC
DAC12_xDAT = 800h,
VeREF+ = 1.5 V, ΔAVCC = 100 mV
TYP
2.20
250
350
750
1100
2.2 V
70
3V
70
dB
No load at the output pin, DAC12_0 or DAC12_1, assuming that the control bits for the shared pins are set properly.
Current into reference terminals not included. If DAC12IR = 1 current flows through the input divider; see Reference Input specifications.
PSRR = 20 log (ΔAVCC / ΔVDAC12_xOUT)
The internal reference is not used.
12-Bit DAC, Linearity Specifications
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 17)
PARAMETER
TEST CONDITIONS
TYP
MAX
2.2 V
±2
±4 (2)
VeREF+ = 2.5 V, DAC12AMPx = 7, DAC12IR = 1
3V
±2
±4
VeREF+ = 1.5 V, DAC12AMPx = 7, DAC12IR = 1
2.2 V
±0.4
±1 (2)
VeREF+ = 2.5 V, DAC12AMPx = 7, DAC12IR = 1
3V
±0.4
±1
Resolution
12-bit monotonic
INL
Integral
nonlinearity (1)
VeREF+ = 1.5 V, DAC12AMPx = 7, DAC12IR = 1
DNL
Differential
nonlinearity (1)
(1)
(2)
VCC
MIN
12
UNIT
bits
LSB
LSB
Parameters calculated from the best-fit curve from 0x0F to 0xFFF. The best-fit curve method is used to deliver coefficients “a” and “b” of
the first-order equation: y = a + bx. VDAC12_xOUT = EO + (1 + EG) × (VeREF+/4095) × DAC12_xDAT, DAC12IR = 1.
This parameter is not production tested.
Copyright © 2010–2011, Texas Instruments Incorporated
67
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
12-Bit DAC, Linearity Specifications (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 17)
PARAMETER
TEST CONDITIONS
Without calibration (1)
EO
(3)
Offset voltage
With calibration
dE(O)/dT
Offset error
temperature
coefficient (1)
EG
Gain error
dE(G)/dT
Gain temperature
coefficient (1)
tOffset_Cal
Time for offset
calibration (4)
(1) (3)
VCC
VeREF+ = 1.5 V,
DAC12AMPx = 7,
DAC12IR = 1
2.2 V
VeREF+ = 2.5 V,
DAC12AMPx = 7,
DAC12IR = 1
3V
VeREF+ = 1.5 V,
DAC12AMPx = 7,
DAC12IR = 1
2.2 V
VeREF+ = 2.5 V,
DAC12AMPx = 7,
DAC12IR = 1
3V
MIN
TYP
UNIT
±21 (2)
±21
mV
±1.5 (2)
±1.5
±10
µV/°C
With calibration
2.2 V/3 V
VeREF+ = 1.5 V
2.2 V
±2.5
VeREF+ = 2.5 V
3V
±2.5
2.2 V/3 V
%FSR
ppm
of
FSR/ °
C
10
DAC12AMPx = 2
165
DAC12AMPx = 3, 5
2.2 V/3 V
66
DAC12AMPx = 4, 6, 7
(3)
(4)
MAX
ms
16.5
The offset calibration works on the output operational amplifier. Offset Calibration is triggered setting bit DAC12CALON
The offset calibration can be done if DAC12AMPx = {2, 3, 4, 5, 6, 7}. The output operational amplifier is switched off with DAC12AMPx =
{0, 1}. It is recommended that the DAC12 module be configured prior to initiating calibration. Port activity during calibration may effect
accuracy and is not recommended.
DAC VOUT
DAC Output
VR+
RLoad = ¥
Ideal transfer
function
AVCC
2
CLoad = 100 pF
Offset Error
Positive
Negative
Gain Error
DAC Code
Figure 17. Linearity Test Load Conditions and Gain/Offset Definition
68
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
12-Bit DAC, Output Specifications
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
No load, VeREF+ = AVCC,
DAC12_xDAT = 0h, DAC12IR = 1,
DAC12AMPx = 7
No load, VeREF+ = AVCC,
DAC12_xDAT = 0FFFh, DAC12IR = 1,
DAC12AMPx = 7
Output voltage
range (1) (see
Figure 18)
VO
TYP
MAX
0
0.005
AVCC –
0.05
AVCC
2.2 V/3 V
RLoad = 3 kΩ, VeREF+ = AVCC,
DAC12_xDAT = 0h, DAC12IR = 1,
DAC12AMPx = 7
RLoad = 3 kΩ, VeREF+ = AVCC,
DAC12_xDAT = 0FFFh, DAC12IR = 1,
DAC12AMPx = 7
CL(DAC12)
Maximum DAC12
load capacitance
2.2 V/3 V
IL(DAC12)
DAC12AMPx = 2, DAC12xDAT = 0FFFh,
Maximum DAC12 VO/P(DAC12) > AVCC – 0.3
load current
DAC12AMPx = 2, DAC12xDAT = 0h,
VO/P(DAC12) < 0.3 V
2.2 V/3 V
V
0
0.1
AVCC –
0.13
AVCC
100
pF
mA
1
Output resistance RLoad = 3 kΩ, VO/P(DAC12) > AVCC – 0.3 V,
(see Figure 18)
DAC12_xDAT = 0FFFh
2.2 V/3 V
150
250
150
250
RLoad = 3 kΩ,
0.3 V ≤ VO/P(DAC12) ≤ AVCC – 0.3 V
(1)
UNIT
–1
RLoad = 3 kΩ, VO/P(DAC12) < 0.3 V,
DAC12AMPx = 2, DAC12_xDAT = 0h
RO/P(DAC12)
MIN
Ω
6
Data is valid after the offset calibration of the output amplifier.
RO/P(DAC12_x)
ILoad
Max
RLoad
AVCC
DAC12
2
O/P(DAC12_x)
CLoad = 100 pF
Min
0.3
AVCC – 0.3 V
VOUT
AVCC
Figure 18. DAC12_x Output Resistance Tests
Copyright © 2010–2011, Texas Instruments Incorporated
69
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
12-Bit DAC, Reference Input Specifications
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
DAC12IR = 0 (1)
Reference input voltage
range
VeREF+
VCC
(2)
2.2 V/3 V
DAC12IR = 1 (3)
(4)
DAC12_0 IR = DAC12_1 IR = 0
Ri(VREF+),
Ri(VeREF+)
MIN
(6)
AVCC/
3
AVCC
+ 0.2
AVCC
AVCC
+ 0.2
UNIT
V
MΩ
48
2.2 V/3 V
DAC12_0 IR = 0, DAC12_1 IR = 1
48
DAC12_0 IR = DAC12_1 IR = 1,
DAC12_0 SREFx = DAC12_1 SREFx (6)
(1)
(2)
(3)
(4)
(5)
MAX
20
DAC12_0 IR = 1, DAC12_1 IR = 0
Reference input resistance (5)
TYP
kΩ
24
For a full-scale output, the reference input voltage can be as high as 1/3 of the maximum output voltage swing (AVCC).
The maximum voltage applied at reference input voltage terminal VeREF+ = [AVCC – VE(O)] / [3 × (1 + EG)].
For a full-scale output, the reference input voltage can be as high as the maximum output voltage swing (AVCC).
The maximum voltage applied at reference input voltage terminal VeREF+ = [AVCC – VE(O)] / (1 + EG).
This impedance depends on tradeoff in power savings. Current devices have 48 kΩ for each channel when divide is enabled. Can be
increased if performance can be maintained.
When DAC12IR = 1 and DAC12SREFx = 0 or 1 for both channels, the reference input resistive dividers for each DAC are in parallel
reducing the reference input resistance.
12-Bit DAC, Dynamic Specifications
VREF = VCC, DAC12IR = 1 (see Figure 19 and Figure 20), over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER
tON
DAC12 on time
TEST CONDITIONS
DAC12_xDAT = 800h,
ErrorV(O) < ±0.5 LSB (1)
(see Figure 19)
VCC
MIN
DAC12AMPx = 0 → {2, 3, 4}
DAC12AMPx = 0 → {5, 6}
2.2 V/3 V
DAC12AMPx = 0 → 7
DAC12AMPx = 2
tS(FS)
Settling time, full scale
DAC12_xDAT =
80h → F7Fh → 80h
DAC12AMPx = 3, 5
2.2 V/3 V
DAC12AMPx = 4, 6, 7
tS(C-C)
Settling time, code to
code
DAC12_xDAT =
3F8h → 408h → 3F8h,
BF8h → C08h → BF8h
DAC12AMPx = 2
DAC12AMPx = 3, 5
Slew rate
DAC12_xDAT =
80h → F7Fh → 80h (2)
2.2 V/3 V
Glitch energy
DAC12_xDAT =
800h → 7FFh → 800h
(1)
(2)
15
30
6
12
100
200
40
80
15
30
UNIT
µs
µs
µs
1
2.2 V/3 V
DAC12AMPx = 4, 6, 7
DAC12AMPx = 7
120
2
DAC12AMPx = 4, 6, 7
DAC12AMPx = 3, 5
MAX
60
5
DAC12AMPx = 2
SR
TYP
0.05
0.35
0.35
1.10
1.50
5.20
2.2 V/3 V
35
V/µs
nV-s
RLoad and CLoad connected to AVSS (not AVCC/2) in Figure 19.
Slew rate applies to output voltage steps ≥ 200 mV.
Conversion 1
VOUT
DAC Output
ILoad
RLoad = 3 kW
Conversion 2
Conversion 3
±1/2 LSB
Glitch
Energy
AVCC
2
RO/P(DAC12.x)
±1/2 LSB
CLoad = 100 pF
tsettleLH
tsettleHL
Figure 19. Settling Time and Glitch Energy Testing
70
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Conversion 1
Conversion 2
Conversion 3
VOUT
90%
90%
10%
10%
tSRHL
tSRLH
Figure 20. Slew Rate Testing
12-Bit DAC, Dynamic Specifications (Continued)
over recommended ranges of supply voltage and TA = 25°C (unless otherwise noted)
PARAMETER
BW–3dB
TEST CONDITIONS
3-dB bandwidth,
VDC = 1.5 V,
VAC = 0.1 VPP
(see Figure 21)
DAC12AMPx = {5, 6}, DAC12SREFx = 2,
DAC12IR = 1, DAC12_xDAT = 800h
MIN
TYP
MAX
UNIT
40
2.2 V/3 V
180
DAC12AMPx = 7, DAC12SREFx = 2,
DAC12IR = 1, DAC12_xDAT = 800h
kHz
550
DAC12_0DAT = 800h, No load,
DAC12_1DAT = 80h ↔ F7Fh, RLoad = 3 kΩ,
fDAC12_0OUT = 10 kHz at 50/50 duty cycle
Channel-to-channel
crosstalk (1) (see
Figure 22)
(1)
VCC
DAC12AMPx = {2, 3, 4}, DAC12SREFx = 2,
DAC12IR = 1, DAC12_xDAT = 800h
DAC12_0DAT = 80h ↔ F7Fh, RLoad = 3 kΩ,
DAC12_1DAT = 800h, No load,
fDAC12_0OUT = 10 kHz at 50/50 duty cycle
–80
2.2 V/3 V
dB
–80
RLoad = 3 kΩ, CLoad = 100 pF
RLoad = 3 kW
ILoad
VeREF+
AVCC
DAC12_x
2
DACx
AC
CLoad = 100 pF
DC
Figure 21. Test Conditions for 3-dB Bandwidth Specification
RLoad
ILoad
AVCC
DAC12_0
2
DAC0
DAC12_xDAT 080h
7F7h
080h
7F7h
080h
VOUT
CLoad = 100 pF
VREF+
VDAC12_yOUT
RLoad
ILoad
AVCC
DAC12_1
VDAC12_xOUT
2
DAC1
fToggle
CLoad = 100 pF
Figure 22. Crosstalk Test Conditions
Copyright © 2010–2011, Texas Instruments Incorporated
71
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Comparator_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC
TEST CONDITIONS
VCC
Supply voltage
MIN
TYP
1.8
3.6
1.8 V
IAVCC_COMP
Comparator operating supply
current into AVCC terminal,
Excludes reference resistor
ladder
IAVCC_REF
Quiescent current of local
reference voltage amplifier
into AVCC terminal
VIC
Common mode input range
VOFFSET
Input offset voltage
CIN
Input capacitance
RSIN
tPD
tPD,filter
Series input resistance
Propagation delay, response
time
Propagation delay with filter
active
CBPWRMD = 00
MAX
V
40
2.2 V
30
50
3V
40
65
CBPWRMD = 01
2.2 V / 3 V
10
30
CBPWRMD = 10
2.2 V / 3 V
0.1
0.5
CBREFACC = 1, CBREFLx = 01
0
µA
VCC - 1
V
±20
CBPWRMD = 01, 10
±10
5
ON - switch closed
3
µA
22
CBPWRMD = 00
OFF - switch opened
UNIT
mV
pF
4
50
kΩ
MΩ
CBPWRMD = 00, CBF = 0
450
ns
CBPWRMD = 01, CBF = 0
600
ns
CBPWRMD = 10, CBF = 0
50
µs
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 00
0.35
0.6
1.0
µs
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 01
0.6
1.0
1.8
µs
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 10
1.0
1.8
3.4
µs
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 11
1.8
3.4
6.5
µs
tEN_CMP
Comparator enable time,
settling time
CBON = 0 to CBON = 1
CBPWRMD = 00, 01, 10
1
2
µs
tEN_REF
Resistor reference enable
time
CBON = 0 to CBON = 1
0.3
1.5
µs
VCB_REF
Reference voltage for a given
tap
VIN = reference into resistor ladder,
n = 0 to 31
VIN ×
(n+1)
/ 32
VIN ×
(n+1.5)
/ 32
V
72
VIN ×
(n+0.5)
/ 32
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Ports PU.0 and PU.1
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VOH
High-level output voltage
VUSB = 3.3 V ± 10%, IOH = -25 mA
VOL
Low-level output voltage
VUSB = 3.3 V ± 10%, IOL = 25 mA
VIH
High-level input voltage
VUSB = 3.3 V ± 10%
VIL
Low-level input voltage
VUSB = 3.3 V ± 10%
MIN
TYP
MAX
2.4
UNIT
V
0.4
2.0
V
V
0.8
V
USB Output Ports DP and DM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
D+, D- single ended
USB 2.0 load conditions
VOL
D+, D- single ended
USB 2.0 load conditions
Z(DRV)
D+, D- impedance
Including external series resistor of 27 Ω
tRISE
Rise time
tFALL
Fall time
MIN
TYP
MAX
2.8
3.6
UNIT
V
0
0.3
V
28
44
Ω
Full speed, differential, CL = 50 pF, 10%/90%, Rpu on D+
4
20
ns
Full speed, differential, CL = 50 pF, 10%/90%, Rpu on D+
4
20
ns
MAX
UNIT
USB Input Ports DP and DM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
V(CM)
Differential input common mode range
0.8
2.5
V
Z(IN)
Input impedance
300
VCRS
Crossover voltage
1.3
VIL
Static SE input logic low level
0.8
VIH
Static SE input logic high level
2.0
V
VDI
Differential input voltage
0.2
V
kΩ
2.0
V
V
USB-PWR (USB Power System)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VLAUNCH
VBUS detection threshold
VBUS
USB bus voltage
VUSB
USB LDO output voltage
TEST CONDITIONS
Normal operation
MIN
TYP
3.76
3.3
(1)
MAX
UNIT
3.75
V
5.5
V
±9%
V
V18
Internal USB voltage
IUSB_EXT
Maximum external current from VUSB terminal (2)
IDET
USB LDO current overload detection (3)
ISUSPEND
Operating supply current into VBUS terminal. (4)
CBUS
VBUS terminal recommended capacitance
4.7
µF
CUSB
VUSB terminal recommended capacitance
220
nF
C18
V18 terminal recommended capacitance
220
nF
tENABLE
Settling time VUSB and V18
RPUR
Pullup resistance of PUR terminal
(1)
(2)
(3)
(4)
1.8
USB LDO is on
60
USB LDO is on,
USB PLL disabled
Within 2%,
recommended capacitances
70
110
V
12
mA
100
mA
250
µA
2
ms
150
Ω
This voltage is for internal use only. No external dc loading should be applied.
This represents additional current that can be supplied to the application from the VUSB terminal beyond the needs of the USB
operation.
A current overload is detected when the total current supplied from the USB LDO, including IUSB_EXT, exceeds this value.
Does not include current contribution of Rpu and Rpd as outlined in the USB specification.
Copyright © 2010–2011, Texas Instruments Incorporated
73
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
USB-PLL (USB Phase-Locked Loop)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IPLL
Operating supply current
fPLL
PLL frequency
fUPD
PLL reference frequency
tLOCK
PLL lock time
tJitter
PLL jitter
VCC
MIN
TYP
MAX
7
48
1.5
UNIT
mA
MHz
3
MHz
2
ms
1000
ps
Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
DVCC(PGM/ERASE) Program and erase supply voltage
IPGM
Average supply current from DVCC during program
IERASE
Average supply current from DVCC during erase
IMERASE, IBANK
Average supply current from DVCC during mass erase or bank erase
tCPT
Cumulative program time
MIN
TYP
1.8
3.6
3
See
(1)
UNIT
V
5
mA
2.5
mA
2
mA
16
104
Program/erase endurance
MAX
105
ms
cycles
tRetention
Data retention duration
TJ = 25°C
tWord
Word or byte program time
See
(2)
64
85
µs
tBlock,
0
Block program time for first byte or word
See
(2)
49
65
µs
tBlock,
1–(N–1)
Block program time for each additional byte or word, except for last
byte or word
See
(2)
37
49
µs
Block program time for last byte or word
See
(2)
55
73
µs
tSeg Erase
Erase time for segment, mass erase, and bank erase when
available
See
(2)
23
32
ms
fMCLK,MGR
MCLK frequency in marginal read mode
(FCTL4.MGR0 = 1 or FCTL4.MGR1 = 1)
0
1
MHz
tBlock,
(1)
(2)
N
100
years
The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word/byte write and block write modes.
These values are hardwired into the flash controller's state machine.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
MIN
TYP
MAX
UNIT
fSBW
Spy-Bi-Wire input frequency
2.2 V/3 V
0
20
MHz
tSBW,Low
Spy-Bi-Wire low clock pulse length
2.2 V/3 V
0.025
15
µs
tSBW,
Spy-Bi-Wire enable time (TEST high to acceptance of first clock
edge) (1)
2.2 V/3 V
1
µs
100
µs
En
tSBW,Rst
Spy-Bi-Wire return to normal operation time
fTCK
TCK input frequency - 4-wire JTAG (2)
Rinternal
Internal pull-down resistance on TEST
(1)
(2)
74
15
2.2 V
0
5
MHz
3V
0
10
MHz
2.2 V/3 V
45
80
kΩ
60
Tools accessing the Spy-Bi-Wire interface need to wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the
first SBWTCK clock edge.
fTCK may be restricted to meet the timing requirements of the module selected.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
INPUT/OUTPUT SCHEMATICS
Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
Pad Logic
P1REN.x
0
DVCC
1
1
Direction
0: Input
1: Output
P1DIR.x
P1OUT.x
0
Module X OUT
1
P1DS.x
0: Low drive
1: High drive
P1SEL.x
P1IN.x
EN
Module X IN
DVSS
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA0.1
P1.7/TA0.2
D
P1IE.x
EN
P1IRQ.x
Q
P1IFG.x
P1SEL.x
P1IES.x
Set
Interrupt
Edge
Select
Copyright © 2010–2011, Texas Instruments Incorporated
75
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 54. Port P1 (P1.0 to P1.7) Pin Functions
PIN NAME (P1.x)
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
x
0
1
2
3
4
FUNCTION
P1.0 (I/O)
0
0
1
ACLK
1
1
I: 0; O: 1
0
Timer TA0.CCI0A capture input
0
1
Timer TA0.0 output
1
1
I: 0; O: 1
0
Timer TA0.CCI1A capture input
0
1
Timer TA0.1 output
1
1
I: 0; O: 1
0
Timer TA0.CCI2A capture input
0
1
Timer TA0.2 output
1
1
I: 0; O: 1
0
0
1
P1.1 (I/O)
P1.2 (I/O)
P1.3 (I/O)
P1.4 (I/O)
P1.5 (I/O)
Timer TA0.CCI4A capture input
Timer TA0.4 output
P1.6/TA0.1
6
P1.6 (I/O)
Timer TA0.CCI1B capture input
Timer TA0.1 output
P1.7/TA0.2
76
7
P1SEL.x
I: 0; O: 1
Timer TA0.3 output
5
P1DIR.x
Timer TA0.TA0CLK
Timer TA0.CCI3A capture input
P1.5/TA0.4
CONTROL BITS/SIGNALS
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
Timer TA0.CCI2B capture input
0
1
Timer TA0.2 output
1
1
P1.7 (I/O)
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
Pad Logic
P2REN.x
P2DIR.x
0
From Port Mapping
1
P2OUT.x
0
From Port Mapping
1
0
DVCC
1
1
Direction
0: Input
1: Output
P2DS.x
0: Low drive
1: High drive
P2SEL.x
P2IN.x
EN
To Port Mapping
DVSS
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6
P2.7/P2MAP7
D
P2IE.x
EN
P2IRQ.x
Q
P2IFG.x
P2SEL.x
P2IES.x
Copyright © 2010–2011, Texas Instruments Incorporated
Set
Interrupt
Edge
Select
77
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 55. Port P2 (P2.0 to P2.7) Pin Functions
PIN NAME (P2.x)
P2.0/P2MAP0
x
0
FUNCTION
P2.0 (I/O)
Mapped secondary digital function
P2.1/P2MAP1
1
P2.1 (I/O)
Mapped secondary digital function
P2.2/P2MAP2
2
P2.2 (I/O)
Mapped secondary digital function
P2.3/P2MAP3
3
P2.4/P2MAP4
4
P2.3 (I/O)
Mapped secondary digital function
P2.4 (I/O)
Mapped secondary digital function
P2.5/P2MAP5
5
P2.5 (I/O
Mapped secondary digital function
P2.6/P2MAP6
6
P2.6 (I/O)
Mapped secondary digital function
P2.7/P2MAP7
7
P2.7 (I/O)
Mapped secondary digital function
(1)
78
CONTROL BITS/SIGNALS (1)
P2DIR.x
P2SEL.x
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
P2MAPx
≤ 19
≤ 19
≤ 19
≤ 19
≤ 19
≤ 19
≤ 19
≤ 19
X = Don't care
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
Pad Logic
P3REN.x
0
DVCC
1
1
Direction
0: Input
1: Output
P3DIR.x
P3OUT.x
0
Module X OUT
1
P3DS.x
0: Low drive
1: High drive
P3SEL.x
P3IN.x
EN
Module X IN
DVSS
P3.0/TA1CLK/CBOUT
P3.1/TA1.0
P3.2/TA1.1
P3.3/TA1.2
P3.4/TA2CLK/SMCLK
P3.5/TA2.0
P3.6/TA2.1
P3.7/TA2.2
D
P3IE.x
EN
P3IRQ.x
Q
P3IFG.x
P3SEL.x
P3IES.x
Set
Interrupt
Edge
Select
Copyright © 2010–2011, Texas Instruments Incorporated
79
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 56. Port P3 (P3.0 to P3.7) Pin Functions
PIN NAME (P3.x)
P3.0/TA1CLK/CBOUT
P3.1/TA1.0
P3.2/TA1.1
P3.3/TA1.2
P3.4/TA2CLK/SMCLK
x
0
1
2
3
4
FUNCTION
P3.0 (I/O)
0
0
1
CBOUT
1
1
I: 0; O: 1
0
Timer TA1.CCI0A capture input
0
1
Timer TA1.0 output
1
1
I: 0; O: 1
0
Timer TA1.CCI1A capture input
0
1
Timer TA1.1 output
1
1
I: 0; O: 1
0
Timer TA1.CCI2A capture input
0
1
Timer TA1.2 output
1
1
I: 0; O: 1
0
0
1
P3.1 (I/O)
P3.2 (I/O)
P3.3 (I/O)
P3.4 (I/O)
P3.5 (I/O)
Timer TA2.CCI0A capture input
Timer TA2.0 output
P3.6/TA2.1
6
P3.6 (I/O)
Timer TA2.CCI1A capture input
Timer TA2.1 output
P3.7/TA2.2
80
7
P3SEL.x
I: 0; O: 1
SMCLK
5
P3DIR.x
Timer TA1.TA1CLK
Timer TA2.TA2CLK
P3.5/TA2.0
CONTROL BITS/SIGNALS
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
Timer TA2.CCI2A capture input
0
1
Timer TA2.2 output
1
1
P3.7 (I/O)
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
Pad Logic
P4REN.x
0
DVCC
1
1
Direction
0: Input
1: Output
P4DIR.x
P4OUT.x
0
Module X OUT
1
P4DS.x
0: Low drive
1: High drive
P4SEL.x
P4IN.x
EN
Module X IN
DVSS
P4.0/TB0.0
P4.1/TB0.1
P4.2/TB0.2
P4.3/TB0.3
P4.4/TB0.4
P4.5/TB0.5
P4.6/TB0.6
P4.7/TB0OUTH/SVMOUT
D
P4IE.x
EN
P4IRQ.x
Q
P4IFG.x
P4SEL.x
P4IES.x
Set
Interrupt
Edge
Select
Copyright © 2010–2011, Texas Instruments Incorporated
81
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 57. Port P4 (P4.0 to P4.7) Pin Functions
PIN NAME (P4.x)
P4.0/TB0.0
P4.1/TB0.1
P4.2/TB0.2
P4.3/TB0.3
P4.4/TB0.4
x
0
1
2
3
4
FUNCTION
P4.0 (I/O)
0
0
1
Timer TB0.0 output (1)
1
1
I: 0; O: 1
0
Timer TB0.CCI1A capture input
0
1
Timer TB0.1 output (1)
1
1
I: 0; O: 1
0
Timer TB0.CCI2A capture input
0
1
Timer TB0.2 output (1)
1
1
I: 0; O: 1
0
Timer TB0.CCI3A capture input
0
1
Timer TB0.3 output (1)
1
1
I: 0; O: 1
0
0
1
P4.1 (I/O)
P4.2 (I/O)
P4.3 (I/O)
P4.4 (I/O)
(1)
P4.5 (I/O)
Timer TB0.CCI5A capture input
Timer TB0.5 output
P4.6/TB0.6
6
(1)
P4.6 (I/O)
Timer TB0.CCI6A capture input
Timer TB0.6 output
P4.7/TB0OUTH/
SVMOUT
(1)
82
7
P4SEL.x
I: 0; O: 1
Timer TB0.4 output
5
P4DIR.x
Timer TB0.CCI0A capture input
Timer TB0.CCI4A capture input
P4.5/TB0.5
CONTROL BITS/SIGNALS
(1)
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
Timer TB0.TB0OUTH
0
1
SVMOUT
1
1
P4.7 (I/O)
Setting TB0OUTH causes all Timer_B configured outputs to be set to high impedance.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
Pad Logic
To/From
Reference
P5REN.x
P5DIR.x
DVSS
0
DVCC
1
1
0
1
P5OUT.x
0
Module X OUT
1
P5.0/VREF+/VeREF+
P5.1/VREF–/VeREF–
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5IN.x
Bus
Keeper
EN
Module X IN
D
Table 58. Port P5 (P5.0 and P5.1) Pin Functions
PIN NAME (P5.x)
P5.0/VREF+/VeREF+
x
0
FUNCTION
P5DIR.x
P5SEL.x
REFOUT
I: 0; O: 1
0
X
X
1
0
X
1
1
P5.1 (I/O) (2)
I: 0; O: 1
0
X
VeREF– (5)
X
1
0
VREF– (6)
X
1
1
P5.0 (I/O) (2)
VeREF+
(3)
VREF+ (4)
P5.1/VREF–/VeREF–
(1)
(2)
(3)
(4)
(5)
(6)
1
CONTROL BITS/SIGNALS (1)
X = Don't care
Default condition
Setting the P5SEL.0 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. An external voltage can be applied to VeREF+ and used as the reference for the ADC12_A, Comparator_B, or
DAC12_A.
Setting the P5SEL.0 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. The ADC12_A, VREF+ reference is available at the pin.
Setting the P5SEL.1 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. An external voltage can be applied to VeREF- and used as the reference for the ADC12_A, Comparator_B, or
DAC12_A.
Setting the P5SEL.1 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. The ADC12_A, VREF– reference is available at the pin.
Copyright © 2010–2011, Texas Instruments Incorporated
83
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port P5, P5.2 to P5.7, Input/Output With Schmitt Trigger
Pad Logic
P5REN.x
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P5DIR.x
P5OUT.x
0
Module X OUT
1
P5.2
P5.3
P5.4
P5.5
P5.6/ADC12CLK/DMAE0
P5.7/RTCCLK
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5IN.x
EN
Module X IN
D
Table 59. Port P5 (P5.2 to P5.7) Pin Functions
PIN NAME (P5.x)
x
FUNCTION
CONTROL BITS/SIGNALS (1)
P5DIR.x
P5SEL.x
P5.2
2
P5.2 (I/O)
I: 0; O: 1
0
P5.3
3
P5.3 (I/O)
I: 0; O: 1
0
P5.4
4
P5.4 (I/O)
I: 0; O: 1
0
P5.5
5
P5.5 (I/O)
I: 0; O: 1
0
P5.6/ADC12CLK/DMAE0
6
P5.6 (I/O)
I: 0; O: 1
0
ADC12CLK
1
1
DMAE0
0
1
P5.7 (I/O)
I: 0; O: 1
0
RTCCLK
1
1
P5.7/RTCCLK
(1)
84
7
X = Don't care
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
Pad Logic
To ADC12
INCHx = y
0
Dvss
1
From DAC12_A
2
0 if DAC12AMPx=0
1 if DAC12AMPx=1
2 if DAC12AMPx>1
To Comparator_B
From Comparator_B
CBPD.x
DAC12AMPx>0
DAC12OPS
P6REN.x
DVSS
0
DVCC
1
1
P6DIR.x
P6OUT.x
P6DS.x
0: Low drive
1: High drive
P6SEL.x
P6IN.x
Bus
Keeper
Copyright © 2010–2011, Texas Instruments Incorporated
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6/DAC0
P6.7/CB7/A7/DAC1
85
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 60. Port P6 (P6.0 to P6.7) Pin Functions
PIN NAME (P6.x)
P6.0/CB0/A0
x
0
FUNCTION
P6.0 (I/O)
CB0
A0 (2)
P6.1/CB1/A1
1
(3)
P6.1 (I/O)
CB1
A1 (2)
P6.2/CB2/A2
2
(3)
P6.2 (I/O)
CB2
A2 (2)
P6.3/CB3/A3
3
(3)
P6.3 (I/O)
CB3
A3 (2)
P6.4/CB4/A4
4
(3)
P6.4 (I/O)
CB4
A4
P6.5/CB5/A5
5
(2) (3)
P6.5 (I/O)
CB5
A5
P6.6/CB6/A6/DAC0
6
(1) (2) (3)
P6.6 (I/O)
CB6
A6
(2) (3)
DAC0
P6.7/CB7/A7/DAC1
7
P6.7 (I/O)
CB7
A7
(2) (3)
DAC1
(1)
(2)
(3)
86
CONTROL BITS/SIGNALS (1)
P6DIR.x
P6SEL.x
CBPD.x
DAC12OPS
DAC12AMPx
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
X
1
X
n/a
n/a
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
X
1
X
n/a
n/a
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
X
1
X
n/a
n/a
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
X
1
X
n/a
n/a
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
X
1
X
n/a
n/a
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
X
1
X
n/a
n/a
I: 0; O: 1
0
0
X
0
X
X
1
X
0
X
1
X
X
0
X
X
X
0
>1
I: 0; O: 1
0
0
X
0
X
X
1
X
0
X
1
X
X
0
X
X
X
0
>1
X = Don't care
Setting the P6SEL.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals.
The ADC12_A channel Ax is connected internally to AVSS if not selected via the respective INCHx bits.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port P7, P7.2, Input/Output With Schmitt Trigger
Pad Logic
To XT2
P7REN.2
P7DIR.2
DVSS
0
DVCC
1
1
0
1
P7OUT.2
P7DS.2
0: Low drive
1: High drive
P7SEL.2
P7.2/XT2IN
P7IN.2
Bus
Keeper
Copyright © 2010–2011, Texas Instruments Incorporated
87
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port P7, P7.3, Input/Output With Schmitt Trigger
Pad Logic
To XT2
P7REN.3
P7DIR.3
DVSS
0
DVCC
1
1
0
1
P7OUT.3
P7.3/XT2OUT
P7DS.3
0: Low drive
1: High drive
P7SEL.3
P7IN.3
Bus
Keeper
Table 61. Port P7 (P7.2 and P7.3) Pin Functions
PIN NAME (P5.x)
P7.2/XT2IN
P7.3/XT2OUT
(1)
(2)
(3)
88
x
2
3
FUNCTION
P7.2 (I/O)
CONTROL BITS/SIGNALS (1)
P7DIR.x
P7SEL.2
P7SEL.3
XT2BYPASS
I: 0; O: 1
0
X
X
XT2IN crystal mode (2)
X
1
X
0
XT2IN bypass mode (2)
X
1
X
1
I: 0; O: 1
0
X
X
XT2OUT crystal mode (3)
X
1
X
0
P7.3 (I/O) (3)
X
1
X
1
P7.3 (I/O)
X = Don't care
Setting P7SEL.2 causes the general-purpose I/O to be disabled. Pending the setting of XT2BYPASS, P7.2 is configured for crystal
mode or bypass mode.
Setting P7SEL.2 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P7.3 can be used as
general-purpose I/O.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger
0
Dvss
1
From DAC12_A
2
Pad Logic
0 if DAC12AMPx=0
1 if DAC12AMPx=1
2 if DAC12AMPx>1
To ADC12
INCHx = y
To Comparator_B
From Comparator_B
CBPD.x
DAC12AMPx>0
DAC12OPS
P7REN.x
DVSS
0
DVCC
1
1
P7DIR.x
P7OUT.x
P7DS.x
0: Low drive
1: High drive
P7SEL.x
P7.4/CB8/A12
P7.5/CB9/A13
P7.6/CB10/A14/DAC0
P7.7/CB11/A15/DAC1
P7IN.x
Bus
Keeper
Copyright © 2010–2011, Texas Instruments Incorporated
89
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 62. Port P7 (P7.4 to P7.7) Pin Functions
PIN NAME (P7.x)
P7.4/CB8/A12
P7.5/CB9/A13
P7.6/CB10/A14/DAC0
x
4
5
6
FUNCTION
P7.4 (I/O)
7
(3)
90
P7SEL.x
CBPD.x
DAC12OPS
DAC12AMPx
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
A12 (2)
X
1
X
n/a
n/a
I: 0; O: 1
0
0
n/a
n/a
Comparator_B input CB9
X
X
1
n/a
n/a
A13 (2)
X
1
X
n/a
n/a
I: 0; O: 1
0
0
X
0
Comparator_B input CB10
X
X
1
X
0
A14 (2)
X
1
X
X
0
X
X
X
1
>1
(3)
P7.5 (I/O)
(3)
P7.6 (I/O)
(3)
P7.7 (I/O)
I: 0; O: 1
0
0
X
0
Comparator_B input CB11
X
X
1
X
0
A15 (2)
X
1
X
X
0
X
X
X
1
>1
(3)
DAC12_A output DAC1
(1)
(2)
P7DIR.x
Comparator_B input CB8
DAC12_A output DAC0
P7.7/CB11/A15/DAC1
CONTROL BITS/SIGNALS (1)
X = Don't care
Setting the P7SEL.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals.
The ADC12_A channel Ax is connected internally to AVSS if not selected via the respective INCHx bits.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port P8, P8.0 to P8.7, Input/Output With Schmitt Trigger
Pad Logic
P8REN.x
P8DIR.x
0
From module
1
P8OUT.x
0
Module X OUT
1
DVSS
0
DVCC
1
Direction
0: Input
1: Output
P8DS.x
0: Low drive
1: High drive
P8SEL.x
P8IN.x
EN
Module X IN
1
P8.0/TB0CLK
P8.1/UCB1STE/UCA1CLK
P8.2/UCA1TXD/UCA1SIMO
P8.3/UCA1RXD/UCA1SOMI
P8.4/UCB1CLK/UCA1STE
P8.5/UCB1SIMO//UCB1SDA
P8.6/UCB1SOMI/UCB1SCL
P8.7
D
Table 63. Port P8 (P8.0 to P8.7) Pin Functions
PIN NAME (P9.x)
x
P8.0/TB0CLK
0
P8.1/UCB1STE/UCA1CLK
1
FUNCTION
P8.0 (I/O)
Timer TB0.TB0CLK clock input
P8.1 (I/O)
UCB1STE/UCA1CLK
P8.2/UCA1TXD/UCA1SIMO
2
P8.2 (I/O)
UCA1TXD/UCA1SIMO
P8.3/UCA1RXD/UCA1SOMI
3
P8.4/UCB1CLK/UCA1STE
4
P8.3 (I/O)
UCA1RXD/UCA1SOMI
P8.4 (I/O)
UCB1CLK/UCA1STE
P8.5/UCB1SIMO/UCB1SDA
5
P8.6/UCB1SOMI/UCB1SCL
6
P8.5 (I/O)
UCB1SIMO/UCB1SDA
P8.6 (I/O)
UCB1SOMI/UCB1SCL
P8.7
Copyright © 2010–2011, Texas Instruments Incorporated
7
P8.7 (I/O)
CONTROL BITS/SIGNALS
P8DIR.x
P8SEL.x
I: 0; O: 1
0
0
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
91
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port P9, P9.0 to P9.7, Input/Output With Schmitt Trigger
Pad Logic
P9REN.x
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P9DIR.x
P9OUT.x
P9.0
P9.1
P9.2
P9.3
P9.4
P9.5
P9.6
P9.7
P9DS.x
0: Low drive
1: High drive
P9IN.x
Table 64. Port P9 (P9.0 to P9.7) Pin Functions
PIN NAME (P9.x)
x
FUNCTION
CONTROL BITS/SIGNALS (1)
P9DIR.x
P9SEL.x
P9.0
0
P9.0 (I/O)
I: 0; O: 1
0
P9.1
1
P9.1 (I/O)
I: 0; O: 1
0
P9.2
2
P9.2 (I/O)
I: 0; O: 1
0
P9.3
3
P9.3 (I/O)
I: 0; O: 1
0
P9.4
4
P9.4 (I/O)
I: 0; O: 1
0
P9.5
5
P9.5 (I/O)
I: 0; O: 1
0
P9.6
6
P9.6 (I/O)
I: 0; O: 1
0
P9.7
7
P9.7 (I/O)
I: 0; O: 1
0
(1)
92
X = Don't care
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port PU.0/DP, PU.1/DM, PUR USB Ports
PUSEL
PUOPE
VUSB
Pad Logic
0
USB output enable
VSSU
1
PUOUT0
0
USB DP output
PU.0/
DP
1
PUIN0
USB DP input
PUIPE
.
PUIN1
USB DM input
PUOUT1
0
USB DM output
1
PU.1/
DM
VUSB
VSSU
Pad Logic
PUREN
PUR
“1”
PUSEL
PURIN
Table 65. Port PU.0/DP, PU.1/DM Output Functions
CONTROL BITS
PIN NAME
FUNCTION
PUSEL
PUDIR
PUOUT1
PUOUT0
PU.1/DM
PU.0/DP
0
0
X
X
Hi-Z
Hi-Z
Outputs off
0
1
0
0
0
0
Outputs enabled
0
1
0
1
0
1
Outputs enabled
0
1
1
0
1
0
Outputs enabled
0
1
1
1
1
1
Outputs enabled
1
X
X
X
DM
DP
Direction set by
USB module
Copyright © 2010–2011, Texas Instruments Incorporated
93
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 66. Port PUR Input Functions
CONTROL BITS
94
FUNCTION
PUSEL
PUREN
0
0
Input disabled
Pull up disabled
0
1
Input disabled
Pull up enabled
1
0
Input enabled
Pull up disabled
1
1
Input enabled
Pull up enabled
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.0
PJDIR.0
0
DVCC
1
PJOUT.0
0
From JTAG
1
DVSS
0
DVCC
1
1
PJ.0/TDO
PJDS.0
0: Low drive
1: High drive
From JTAG
PJIN.0
EN
D
Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.x
PJDIR.x
0
DVSS
1
PJOUT.x
0
From JTAG
1
DVSS
0
DVCC
1
PJDS.x
0: Low drive
1: High drive
From JTAG
1
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
PJIN.x
EN
To JTAG
D
Copyright © 2010–2011, Texas Instruments Incorporated
95
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
Table 67. Port PJ (PJ.0 to PJ.3) Pin Functions
PIN NAME (PJ.x)
x
CONTROL BITS/
SIGNALS (1)
FUNCTION
PJDIR.x
PJ.0/TDO
0
(2)
I: 0; O: 1
PJ.1 (I/O) (2)
I: 0; O: 1
PJ.0 (I/O)
TDO (3)
PJ.1/TDI/TCLK
1
X
TDI/TCLK (3)
PJ.2/TMS
2
PJ.2 (I/O)
TMS (3)
PJ.3/TCK
3
(1)
(2)
(3)
(4)
96
X
I: 0; O: 1
(4)
PJ.3 (I/O)
TCK (3)
(4)
(2)
X
(2)
I: 0; O: 1
(4)
X
X = Don't care
Default condition
The pin direction is controlled by the JTAG module.
In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are do not care.
Copyright © 2010–2011, Texas Instruments Incorporated
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
DEVICE DESCRIPTORS
Table 68 list the complete contents of the device descriptor tag-length-value (TLV) structure for each device type.
Table 68. 'F563x Device Descriptor Table (1)
Info Block
Die Record
ADC12
Calibration
(1)
Description
Address
Size
bytes
'F5638
'F5637
'F5636
'F5635
'F5634
'F5633
'F5632
'F5631
'F5630
Value
Value
Value
Value
Value
Value
Value
Value
Value
Info length
01A00h
1
06h
06h
06h
06h
06h
06h
06h
06h
06h
CRC length
01A01h
1
06h
06h
06h
06h
06h
06h
06h
06h
06h
CRC value
01A02h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Device ID
01A04h
2
8014h
8012h
8010h
800Eh
8044h
8042h
8040h
803Eh
803Ch
Hardware revision
01A06h
1
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Firmware revision
01A07h
1
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Die Record Tag
01A08h
1
08h
08h
08h
08h
08h
08h
08h
08h
08h
Die Record length
01A09h
1
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
Lot/Wafer ID
01A0Ah
4
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Die X position
01A0Eh
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Die Y position
01A10h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Test results
01A12h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC12 Calibration Tag
01A14h
1
11h
11h
11h
11h
11h
11h
11h
11h
11h
ADC12 Calibration
length
01A15h
1
10h
10h
10h
10h
10h
10h
10h
10h
10h
ADC Gain Factor
01A16h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC Offset
01A18h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 1.5-V Reference
Temp. Sensor 30°C
01A1Ah
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 1.5-V Reference
Temp. Sensor 85°C
01A1Ch
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.0-V Reference
Temp. Sensor 30°C
01A1Eh
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.0-V Reference
Temp. Sensor 85°C
01A20h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.5-V Reference
Temp. Sensor 30°C
01A22h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.5-V Reference
Temp. Sensor 85°C
01A24h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
NA = Not applicable
Copyright © 2010–2011, Texas Instruments Incorporated
97
MSP430F563x
SLAS650B – JUNE 2010 – REVISED AUGUST 2011
www.ti.com
REVISION HISTORY
REVISION
SLAS650
98
COMMENTS
Product Preview release
SLAS650A
Updated Product Preview including electrical specifications
SLAS650B
Production Data release
Copyright © 2010–2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
19-Dec-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
(Requires Login)
MSP430F5630IPZ
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5630IPZR
ACTIVE
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5630IZQWR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
2500
Green (RoHS
& no Sb/Br)
MSP430F5631IPZ
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5631IPZR
ACTIVE
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5631IZQWR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
2500
Green (RoHS
& no Sb/Br)
MSP430F5632IPZ
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5632IPZR
ACTIVE
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5632IZQW
OBSOLETE
BGA
MICROSTAR
JUNIOR
ZQW
113
MSP430F5632IZQWR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
MSP430F5632IZQWT
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
MSP430F5633IPZ
ACTIVE
LQFP
MSP430F5633IPZR
ACTIVE
MSP430F5633IZQWR
ACTIVE
SNAGCU
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
TBD
Call TI
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
113
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
BGA
MICROSTAR
JUNIOR
ZQW
113
2500
Green (RoHS
& no Sb/Br)
Addendum-Page 1
SNAGCU
Samples
Call TI
Level-3-260C-168 HR
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
19-Dec-2011
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
MSP430F5634IPZ
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5634IPZR
ACTIVE
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5634IZQWR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
2500
Green (RoHS
& no Sb/Br)
MSP430F5635IPZ
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5635IPZR
ACTIVE
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5635IZQWR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
2500
Green (RoHS
& no Sb/Br)
MSP430F5636IPZ
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5636IPZR
ACTIVE
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5636IZQWR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
2500
Green (RoHS
& no Sb/Br)
MSP430F5637IPZ
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5637IPZR
ACTIVE
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5637IZQWR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
2500
Green (RoHS
& no Sb/Br)
MSP430F5638IPZ
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5638IPZR
ACTIVE
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F5638IZQW
PREVIEW
BGA
MICROSTAR
JUNIOR
ZQW
113
TBD
Addendum-Page 2
SNAGCU
SNAGCU
SNAGCU
SNAGCU
Call TI
Samples
(Requires Login)
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
19-Dec-2011
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
MSP430F5638IZQWR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F5638IZQWT
PREVIEW
BGA
MICROSTAR
JUNIOR
ZQW
113
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Feb-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
MSP430F5632IZQWR
BGA MI
CROSTA
R JUNI
OR
ZQW
113
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
MSP430F5632IZQWT
BGA MI
CROSTA
R JUNI
OR
ZQW
113
250
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
MSP430F5635IPZR
LQFP
PZ
100
1000
330.0
24.4
17.4
17.4
2.0
20.0
24.0
Q2
MSP430F5637IPZR
LQFP
PZ
100
1000
330.0
24.4
17.4
17.4
2.0
20.0
24.0
Q2
ZQW
113
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
MSP430F5638IZQWR
BGA MI
CROSTA
R JUNI
OR
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Feb-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MSP430F5632IZQWR
BGA MICROSTAR
JUNIOR
ZQW
113
2500
336.6
336.6
28.6
MSP430F5632IZQWT
BGA MICROSTAR
JUNIOR
ZQW
113
250
336.6
336.6
28.6
MSP430F5635IPZR
LQFP
PZ
100
1000
346.0
346.0
41.0
MSP430F5637IPZR
LQFP
PZ
100
1000
346.0
346.0
41.0
MSP430F5638IZQWR
BGA MICROSTAR
JUNIOR
ZQW
113
2500
336.6
336.6
28.6
Pack Materials-Page 2
MECHANICAL DATA
MTQF013A – OCTOBER 1994 – REVISED DECEMBER 1996
PZ (S-PQFP-G100)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
75
0,08 M
51
76
50
100
26
1
0,13 NOM
25
12,00 TYP
Gage Plane
14,20
SQ
13,80
16,20
SQ
15,80
0,05 MIN
1,45
1,35
0,25
0°– 7°
0,75
0,45
Seating Plane
0,08
1,60 MAX
4040149 /B 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated