Siemens C67076-S1014-A2 Simopac module (power module single switch n channel enhancement mode) Datasheet

SIMOPAC® Module
BSM 121 AR
VDS
= 200 V
ID
= 130 A
R DS(on) = 20 mΩ
●
●
●
●
●
●
Power module
Single switch
N channel
Enhancement mode
Package with insulated metal base plate
1)
Package outline/Circuit diagram: 1
Type
Ordering Code
BSM 121 AR
C67076-S1014-A2
Maximum Ratings
Parameter
Symbol
Values
Unit
Drain-source voltage
VDS
200
V
Drain-gate voltage, RGS = 20 kΩ
VDGR
200
Gate-source voltage
VGS
± 20
Continuous drain current, TC = 25 ˚C
ID
130
Pulsed drain current, TC = 25 ˚C
ID puls
390
Operating and storage temperature range
Tj, Tstg
– 55 … + 150
˚C
Power dissipation, TC = 25 ˚C
Ptot
700
W
Thermal resistance
Chip-case
Case-heat sink
Rth JC
Rth CH
≤ 0.18
≤ 0.05
Insulation test voltage2), t = 1 min.
Vis
2500
Vac
Creepage distance, drain-source
–
16
mm
Clearance, drain-source
–
11
DIN humidity category, DIN 40 040
–
F
IEC climatic category, DIN IEC 68-1
–
55/150/56
1)
2)
A
K/W
–
See chapter Package Outline and Circuit Diagrams.
Insulation test voltage between drain and base plate referred to standard climate 23/50 in acc. with
DIN 50 014, IEC 146, para. 492.1.
Semiconductor Group
31
03.96
BSM 121 AR
Electrical Characteristics
at Tj = 25 ˚C, unless otherwise specified.
Parameter
Symbol
Values
min.
typ.
Unit
max.
Static Characteristics
Drain-source breakdown voltage
VGS = 0, ID = 0.25 mA
V(BR)DSS
Gate threshold voltage
VGS = VDS, ID = 1 mA
VGS(th)
Zero gate voltage drain current
VDS = 200 V, VGS = 0
Tj = 25 ˚C
Tj = 125 ˚C
I DSS
Gate-source leakage current
VGS = 20 V, VDS = 0
IGSS
Drain-source on-state resistance
VGS = 10 V, ID = 80 A
RDS(on)
V
200
–
–
2.1
3.0
4.0
µA
–
–
50
300
250
1000
–
10
100
nA
mΩ
–
18
20
gfs
60
75
–
S
Input capacitance
VGS = 0, VDS = 25 V, f = 1 MHz
Ciss
–
10
13
nF
Output capacitance
VGS = 0, VDS = 25 V, f = 1 MHz
Coss
–
3
4.5
Reverse transfer capacitance
VGS = 0, VDS = 25 V, f = 1 MHz
Crss
–
0.7
1.0
Turn-on time ton (ton = td (on) + tr)
VCC = 100 V, VGS = 10 V
ID = 80 A, RGS = 3.3 Ω
td (on)
–
120
–
tr
–
60
–
Turn-off time toff (toff = td (off) + tf)
VCC = 100 V, VGS = 10 V
ID = 80 A, RGS = 3.3 Ω
td (off)
–
240
–
tf
–
40
–
Dynamic Characteristics
Forward transconductance
VDS ≥ 2 × ID × RDS(on)max., ID = 80 A
Semiconductor Group
32
ns
BSM 121 AR
Electrical Characteristics (cont’d)
at Tj = 25 ˚C, unless otherwise specified.
Parameter
Symbol
Values
min.
typ.
Unit
max.
Reverse diode
Continuous reverse drain current
TC = 25 ˚C
IS
Pulsed reverse drain current
TC = 25 ˚C
ISM
Diode forward on-voltage
IF = 260 A , VGS = 0
VSD
Reverse recovery time
IF = IS, diF/dt = 100 A/ µs, VR = 100 V
trr
Reverse recovery charge
IF = IS, diF/dt = 100 A/ µs, VR = 100 V
Qrr
Semiconductor Group
A
–
–
130
–
–
390
–
1.05
1.4
–
400
–
V
ns
µC
–
33
4.3
–
BSM 121 AR
Characteristics at Tj = 25 ˚C, unless otherwise specified.
Power dissipation Ptot = f (TC)
parameter: Tj = 150 ˚C
Typ. output characteristics ID = f (VDS)
parameter: = 80 µs pulse test
Safe operating area ID = f (VDS)
parameter: single pulse, TC = 25 ˚C
Tj ≤ 150 ˚C
Typ. transfer characteristic ID = f (VGS)
parameter: = 80 µs pulse test, VDS = 25 V
Semiconductor Group
34
BSM 121 AR
Continuous drain-source current
ID = f (TC)
parameter: VGS ≥ 10 V, T j = 150 ˚C
Drain-source breakdown voltage
V(BR)DSS (Tj) = b × V(BR)DSS (25 ˚ C)
Drain source on-state resistance
RDS(on) = f (Tj)
parameter: ID = 80 A; VGS = 10 V (spread)
Typical capacitances C = f (VDS)
parameter: VGS = 0, f = 1 MHz
Semiconductor Group
35
BSM 121 AR
Forward characteristics of reverse diode
IF = f (VSD)
parameter: Tj, tp = 80 µs (spread)
Transient thermal impedance ZthJC = f (tp)
parameter: D = tp/T
Semiconductor Group
36
BSM 121 AR
Typ. gate charge VGS = f (Qgate)
parameter: IDpuls = 200 A
Semiconductor Group
37
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