SLCS014A −OCTOBER 1977 −REVISED AUGUST 2003 D Single Supply or Dual Supplies D Wide Range of Supply Voltage D OR N PACKAGE (TOP VIEW) . . . 2 V to 28 V 1OUT 2OUT VCC 2IN− 2IN+ 1IN− 1IN+ D Low Supply-Current Drain Independent of D D D D D D D Supply Voltage . . . 0.8 mA Typ Low Input Bias Current . . . 25 nA Typ Low Input Offset Current . . . 3 nA Typ Low Input Offset Voltage . . . 3 mV Typ Common-Mode Input Voltage Range Includes Ground Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage . . . ±28 V Low Output Saturation Voltage Output Compatible With TTL, MOS, and CMOS 1 14 2 13 3 12 4 11 5 10 6 9 7 8 3OUT 4OUT GND 4IN+ 4IN− 3IN+ 3IN− description/ordering information This device consists of four independent voltage comparators that are designed to operate from a single power supply over a wide range of voltages. Operation from dual supplies also is possible as long as the difference between the two supplies is 2 V to 28 V and VCC is a least 1.5 V more positive than the input common-mode voltage. Current drain is independent of the supply voltage. The outputs can be connected to other open-collector outputs to achieve wired-AND relationships. ORDERING INFORMATION TA VIOmax AT 25°C PDIP (N) −40°C −40 C to 85 85°C C 20 mV ORDERABLE PART NUMBER PACKAGE† SOIC (D) Tube of 25 LM3302N Tube of 50 LM3302D Reel of 2500 LM3302DR TOP-SIDE MARKING LM3302N LM3302 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. symbol (each comparator) IN+ OUT IN− Copyright 2003, Texas Instruments Incorporated !" #$ # % & ## '($ # ) # "( "# ) "" $ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLCS014A −OCTOBER 1977 −REVISED AUGUST 2003 schematic VCC 80-µA Current Regulator 60 µA 80 µA 10 µA 10 µA IN+ OUT IN− GND Current values shown are nominal. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 V Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±28 V Input voltage range, VI (either input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 28 V Output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 V Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Duration of output short-circuit to ground (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited Package thermal impedance, θJA (see Notes 4 and 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or N package . . . . . . . . . . . . . . . . 260°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. There are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the recommended operating conditions section of this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to the network ground. 2. Differential voltages are at IN+ with respect to IN−. 3. Short circuits from the output to VCC can cause excessive heating and eventual destruction. 4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 5. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLCS014A −OCTOBER 1977 −REVISED AUGUST 2003 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) TEST CONDITIONS† PARAMETER VIO Input offset voltage VCC = 5 V to 28 V, VO = 1.4 V IIO Input offset voltage VO = 1.4 V IIB Input bias current VICR Common-mode input voltage range TA MIN 25°C VIC = VICRmin, TYP MAX 3 20 −40°C to 85°C 40 25°C 3 −40°C to 85°C −25 −40°C to 85°C 25°C −40°C to 85°C AVD Large-signal differential voltage amplification VCC = 15 V, RL = 15 Ω to VCC VO = 1.4 V to 11.4 V, IOH High-level output current VID = 1 V, VOH = 5 V VOL Low-level output voltage VID = −1 V, IOL = 4 mA −40°C to 85°C IOL Low-level output current VID = 1 V, VOL = 1.5 V 25°C ICC Supply current (four comparators) VO = 2.5 V, No load 25°C 25°C 0 to VCC−1.5 30 V/mV 0.1 nA −40°C to 85°C 1 25°C 150 µA 500 700 6 nA V 0 to VCC−2 25°C nA −500 −1000 2 mV 100 300 25°C UNIT mV 16 mA 0.8 mA † All characteristics are measured with zero common-mode input voltage unless otherwise specified. switching characteristics, VCC = 5 V, TA = 25°C PARAMETER Response time TEST CONDITIONS RL = 5.1 kΩ to 5 V, CL = 15 pF‡, See Note 6 TYP 100-mV input step with 5-mV overdrive 1.3 TTL-level input step 0.3 UNIT µs ‡ CL includes probe and jig capacitance. NOTE 6: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM3302D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LM3302 LM3302DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LM3302 LM3302DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LM3302 LM3302DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LM3302 LM3302DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LM3302 LM3302DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LM3302 LM3302N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 LM3302N LM3302NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 LM3302N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 24-Jan-2013 Only one of markings shown within the brackets will appear on the physical device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM3302DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM3302DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM3302DR SOIC D 14 2500 333.2 345.9 28.6 LM3302DR SOIC D 14 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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