ATMEL ATA8405-6DQY Uhf ask/fsk industrial transmitter Datasheet

Features
•
•
•
•
•
•
•
•
•
•
•
PLL Transmitter IC with Single-ended Output
High Output Power (6 dBm)
Low Current Consumption at 8.1 mA (315 MHz) and 8.5 mA (433 MHz)
Divide by 24 (ATA8404) and 32 (ATA8405) Blocks for 13 MHz Crystal Frequencies and
for Low XTO Start-up Times
ASK/FSK Modulation with Internal FSK Switch
Up to 20 kBaud Manchester Coding, Up to 40 kBaud NRZ Coding
Power-down
ENABLE Input for Parallel Usage of Controlling Pins
Supply Voltage 2.0V to 3.6V
ESD Protection at all Pins (4 kV HBM)
Small Package TSSOP10
UHF ASK/FSK
Industrial
Transmitter
Benefits
ATA8404
ATA8405
• Low Parasitic FSK Switch Integrated
• Fast Settling Time < 0.85 ms
• Small Form Factor
Applications
•
•
•
•
•
Preliminary
Remote Control Systems
Alarm, Telemetering, and Energy Metering Systems
Home Entertainment and Home Automation
Industrial/Aftermarket Remote Keyless Entry Systems
Toys
1. Description
The ATA8404/ATA8405 is a PLL transmitter IC, which has been developed for the
demands of RF low-cost transmission systems at data rates up to 20 kBaud Manchester coding and 40 kBaud NRZ coding. The transmitting frequency range is
313 MHz to 317 MHz (ATA8404) and 432 MHz to 448 MHz (ATA8405), respectively.
It can be used in both FSK and ASK systems.
Figure 1-1.
System Block Diagram
UHF ASK/FSK
TPM and Remote control
transmitter
UHF ASK/FSK
Remote control receiver
1 Li cell
ATA8201
ATA8202 Demod.
ATA8203
ATA8204
ATA8404
ATA8405
Keys
Encoder
ATARx9x
PLL
Control
1...3
µC
IF Amp
Antenna Antenna
XTO
VCO
Power
amp.
PLL
LNA
XTO
VCO
9136C–INDCO–10/09
2. Pin Configuration
Figure 2-1.
Table 2-1.
Pin
1
Pinning TSSOP10
CLK
1
10
ENABLE
ASK
2
9
GND
FSK
3
8
VS
ANT2
4
7
XTO1
ANT1
5
6
XTO2
ATA8404
ATA8405
Pin Description
Symbol
CLK
Function
Configuration
VS
Clock output signal for the
microcontroller.
The clock output frequency is set by the
crystal to fXTAL/8.
The CLK output stays Low in
power-down mode and after enabling of
the PLL.
The CLK output switches on if the
oscillation amplitude of the crystal has
reached a certain level.
100
100
200k
ASK
2
ASK
Switches on the power amplifier for
ASK modulation and enables the PLL
and XTO if the ENABLE pin is open.
50k
200k
FSK
3
2
FSK
CLK
Switches off the FSK switch (switch has
high Z if signal at pin FSK is High) and
enables the PLL and the XTO if the
ENABLE pin is open
VRef = 1.1V
20 µA
200k
VRef = 1.1V
5 µA
200k
ATA8404/ATA8405 [Preliminary]
9136C–INDCO–10/09
ATA8404/ATA8405 [Preliminary]
Table 2-1.
Pin Description (Continued)
Pin
Symbol
4
ANT2
Function
Configuration
Emitter of antenna output stage
ANT1
5
ANT1
Open collector antenna output
ANT2
(FSK < 0.25V)
AND
(ENABLE > 1.7V)
6
XTO2
Diode switch, used for FSK modulation
210 µA
XTO2
VS
1.2k
1.5k
7
XTO1
VS
Connection for crystal
XTO1
182 µA
8
VS
9
GND
Supply voltage
See ESD protection circuitry (see Figure 4-9 on page 14)
Ground
See ESD protection circuitry (see Figure 4-9 on page 14)
VS
ENABLE input
30 µA
10
ENABLE
If ENABLE is connected to GND and
the ASK or FSK pin is High, the device
stays in idle mode.
In normal operation ENABLE is left
open and ASK or FSK is used to enable
the device.
(FSK >1.7 V ) OR
(ASK > 1.7 V)
ENABLE
150k
250k
3
9136C–INDCO–10/09
Figure 2-2.
Block Diagram
ATA8405
Power up/down
CLK
EN
f
1
ENABLE
10
8
f
24/
32
ASK
GND
2
9
OR
PFD
FSK
VS
3
8
CP
Ampl. OK
XTO1
ANT2
4
XTO
7
LF
EN
XTO2
ANT1
5
VCO
PA
6
PLL
3. General Description
This fully integrated PLL transmitter allows the design of simple, low-cost RF miniature transmitters for remote control and other industrial applications. The VCO is locked to
24 × fXTAL/32 × fXTAL for ATA8404/ATA8405. Thus, a 13.125 MHz/13.56 MHz crystal is needed
for a 315 MHz/433.92 MHz transmitter. All other PLL and VCO peripheral elements are
integrated.
The XTO is a series resonance (current mode) oscillator. Only one capacitor and a crystal
connected in series to GND are needed as external elements in an ASK system. The internal
FSK switch, together with a second capacitor, can be used for FSK modulation. The crystal
oscillator needs typically 0.6 ms until the CLK output is activated if a crystal as defined in the
electrical characteristics is used (e.g., TPM crystal). For most crystals used in RKE systems, a
shorter time will result.
The CLK output is switched on if the amplitude of the current flowing through the crystal has
reached 35% to 80% of its final value. This is synchronized with the 1.64/1.69 MHz CLK output. As a result, the first period of the CLK output is always a full period. The PLL is then
locked < 250 µs after CLK output activation. This means an additional wait time of ≥ 250 µs is
necessary before the PA can be switched on and the data transmission can start. This results
in a significantly lower time of about 0.85 ms between enabling the ATA8404/ATA8405 and the
beginning of the data transmission which saves battery power.
4
ATA8404/ATA8405 [Preliminary]
9136C–INDCO–10/09
ATA8404/ATA8405 [Preliminary]
The power amplifier is an open-collector output delivering a current pulse which is nearly independent from the load impedance and can therefore be controlled via the connected load
impedance.
This output configuration enables a simple matching to any kind of antenna or to 50Ω. A high
power efficiency for the power amplifier results if an optimized load impedance of
ZLoad, opt = 380Ω + j340Ω (ATA8404) at 315 MHz and ZLoad, opt = 280Ω + j310Ω (ATA8405) at
433.92 MHz is used at the 3-V supply voltage.
4. Functional Description
If ASK = Low, FSK = Low, and ENABLE = open or Low, the circuit is in power-down mode
consuming only a very small amount of current so that a lithium cell used as power supply can
work for many years.
If the ENABLE pin is left open, ENABLE is the logical OR operation of the ASK and FSK input
pins. This means, the IC can be switched on by either the FSK of the ASK input.
If the ENABLE pin is Low and ASK or FSK are High, the IC is in idle mode where the PLL,
XTO, and power amplifier are off and the microcontroller ports controlling the ASK and FSK
inputs can be used to control other devices. This can help to save ports on the microcontroller
in systems where other devices with 3-wire interface are used.
With FSK = High, ASK = Low, and ENABLE = open or High, the PLL and the XTO are
switched on and the power amplifier is off. When the amplitude of the current through the crystal has reached 35% to 80% of its final amplitude, the CLK driver is automatically activated.
The CLK output stays Low until the CLK driver has been activated. The driver is activated synchronously with the CLK output frequency, hence, the first pulse on the CLK output is a
complete period. The PLL is then locked within < 250 µs after the CLK driver has been activated, and the transmitter is then ready for data transmission.
With ASK = High, the power amplifier is switched on. This is used to perform the ASK modulation. During ASK modulation, the IC is enabled with the FSK or the ENABLE pin.
With FSK = Low the switch at pin XTO2 is closed, with FSK = High the switch is open. To
achieve a faster start-up of the crystal oscillator, the FSK pin should be High during start-up of
the XTO because the series resistance of the resonator seen from pin XTO1 is lower if the
switch is off.
The different modes of the ATA8404/ATA8405 are listed in Table 4-1, the corresponding current consumption values can be found in the table “Electrical Characteristics” on page 15.
Table 4-1.
ATA8404/ATA8405 Modes
ASK Pin
FSK Pin
ENABLE Pin
Mode
Low
Low
Low/open
Power-down mode, FSK switch High Z
Low
Low
High
Power-up, PA off, FSK switch Low Z
Low
High
High/open
Power-up, PA off, FSK switch High Z
High
Low
High/open
Power-up, PA on, FSK switch Low Z
High
High
High/open
Power-up, PA on, FSK switch High Z
Low/High
High
Low
Idle mode, FSK switch High Z
High
Low/High
Low
Idle mode, FSK switch High Z
5
9136C–INDCO–10/09
4.1
4.1.1
Transmission with ENABLE = open
ASK Mode
The ATA8404/ATA8405 is activated by ENABLE = open, FSK = High, ASK = Low. The microcontroller is then switched to external clocking. After typically 0.6 ms, the CLK driver is
activated automatically (i.e., the microcontroller waits until the XTO and CLK are ready). After
another time period of ≤ 250 µs, the PLL is locked and ready to transmit. The output power can
then be modulated by means of pin ASK. After transmission, ASK is switched to Low and the
microcontroller returns back to internal clocking. Then, the ATA8404/ATA8405 is switched to
power-down mode with FSK = Low.
Figure 4-1.
Timing ASK Mode with ENABLE not Connected to the Microcontroller
ΔTXTO
> 250 µs
FSK
ASK
CLK
Power-down
4.1.2
Power-up,
PA off
Power-up,
PA on
(High)
Power-up,
PA off
(Low)
Power-down
FSK Mode
The ATA8404/ATA8405 is activated by FSK = High, ASK = Low. The microcontroller is then
switched to external clocking. After typically 0.6 ms, the CLK driver is activated automatically
(i.e., the microcontroller waits until the XTO and CLK are ready. After another time period of
≤ 250 µs, the PLL is locked and ready to transmit. The power amplifier is switched on with
ASK = H. The ATA8404/ATA8405 is then ready for FSK modulation. The microcontroller starts
to switch on and off the capacitor between the crystal load capacitor and GND by means of pin
FSK, thus, changing the reference frequency of the PLL. IF FSK = L the output frequency is
lower; if FSK = H the output frequency is higher. After transmission, FSK stays High and ASK
is switched to Low and the microcontroller returns back to internal clocking. Then, the
ATA8404/ATA8405 is switched to power-down mode with FSK = Low.
Figure 4-2.
Timing FSK Mode with ENABLE not Connected to the Microcontroller
ΔTXTO
> 250 µs
FSK
ASK
CLK
Power-down
6
Power-up,
PA off
Power-up, Power-up,
PA on
PA off
(fRF = High) (fRF = Low)
Power-down
ATA8404/ATA8405 [Preliminary]
9136C–INDCO–10/09
ATA8404/ATA8405 [Preliminary]
4.2
4.2.1
Transmission with ENABLE = High
FSK Mode
The ATA8404/ATA8405 is activated by ENABLE = High, FSK = High, and ASK = Low. The
microcontroller is then switched to external clocking. After typically 0.6 ms, the CLK driver is
activated automatically (i.e., the microcontroller waits until the XTO and CLK are ready). After
another time period of ≤ 250 µs, the PLL is locked and ready to transmit. The power amplifier
is switched on with ASK = H. The ATA8404/ATA8405 is then ready for FSK modulation. The
microcontroller starts to switch on and off the capacitor between the crystal load capacitor and
GND by means of pin FSK, thus, changing the reference frequency of the PLL. IF FSK = L the
output frequency is lower, if FSK = H output frequency is higher. After transmission, ASK is
switched to Low and the microcontroller returns back to internal clocking. Then, the
ATA8404/ATA8405 is switched to power-down mode with ENABLE = Low and FSK = Low.
Figure 4-3.
Timing FSK Mode with ENABLE Connected to the Microcontroller
ΔTXTO
> 250 µs
ENABLE
FSK
ASK
CLK
Power-down
4.2.2
Power-up,
PA off
Power-up, Power-up,
PA off
PA on
(fRF = High) (fRF = Low)
Power-down
ASK Mode
The ATA8404/ATA8405 is activated by ENABLE = High, FSK = High and ASK = Low. After
activation the microcontroller is switched to external clocking. After typically 0.6 ms, the CLK
driver is activated automatically (the microcontroller waits until the XTO and CLK are ready).
After another time period of ≤ 250 µs, the PLL is locked and ready to transmit. The output
power can then be modulated by means of pin ASK. After transmission, ASK is switched to
Low and the microcontroller returns back to internal clocking. Then, the ATA8404/ATA8405 is
switched to power-down mode with ENABLE = Low and FSK = Low.
7
9136C–INDCO–10/09
Figure 4-4.
Timing ASK Mode with ENABLE Connected to the Microcontroller
ΔTXTO
> 250 µs
ENABLE
FSK
ASK
CLK
Power-down
4.3
Power-up, Power-up,
PA on
PA off
(High)
(Low)
Power-up,
PA off
Power-down
Accuracy of Frequency Deviation
The accuracy of the frequency deviation using the XTAL pulling method is about ±20% if the
following tolerances are considered. One important aspect is that the values of C0 and CM of
typical crystals are strongly correlated, which reduces the tolerance of the frequency deviation.
Figure 4-5.
Tolerances of Frequency Modulation
~
VS
C Stray
XTAL
~
CM
LM
RS
C0
Crystal equivalent circuit
C4
C5
CSwitch
Using a crystal with a motional capacitance of CM = 4.37 fF ±15%, a nominal load capacitance
of C LNOM = 18 pF and a parallel capacitance of C0 = 1.30 pF correlated with C M results in
C0 = 297 × CM (the correlation has a tolerance of 10%, so C0 = 267 to 326 × CM). If using the
internal FSK switch with CSwitch = 0.9 pF ±20% and estimated parasitics of CStray = 0.7 pF
±10%, the resulting C4 and C5 values are C4 = 10 pF ±1% and C5 = 15 pF ±1% for a nominal
frequency deviation of ±19.3 kHz with worst case tolerances of ±15.8 kHz to ±23.2 kHz.
8
ATA8404/ATA8405 [Preliminary]
9136C–INDCO–10/09
ATA8404/ATA8405 [Preliminary]
4.4
Accuracy of the Center Frequency
The imaginary part of the impedance in large signal steady state oscillation IMXTO, seen into
the pin 7 (XTO1), causes some additional frequency tolerances, due to pulling of the XTO
oscillation frequency. These tolerances have to be added to the tolerances of the crystal itself
(adjustment tolerance, temperature stability and ageing) and the impact on the center frequency due to tolerances of C4, C5, CSwitch and CStray. The nominal value of IMXTO = 110Ω,
CSwitch and CStray should be absorbed into the C4 and C5 values by using a crystal with known
frequency and choosing C4 and C5, so that the XTO center frequency equals the crystal frequency, and the frequency deviation is as expected. Then, from the nominal value, the IMXTO
has ±90Ω tolerances, using the pulling formula P = –IM X T O × C M × π × f X T O with
f XTO = 13.56 MHz and C M = 4.4 fF an additional frequency tolerance of P = ±16.86 ppm
results. If using crystals with other CM the additional frequency tolerance can be calculated in
the same way. For example, a lower C M = 3.1 fF will reduce the frequency tolerance to
11.87 ppm, where a higher CM = 5.5 fF increases the tolerance to 21.07 ppm.
4.5
CLK Output
An output CLK signal of 1.64 MHz (ATA8404 operating at 315 MHz) and 1.69 MHz (ATA8405
operating at 433.92 MHz) is provided for a connected microcontroller. The delivered signal is
CMOS-compatible with a High and Low time of >125 ns if the load capacitance is lower than
20 pF. The CLK output is Low in power-down mode due to an internal pull-down resistor. After
enabling the PLL and XTO the signal stays Low until the amplitude of the crystal oscillator has
reached 35% to 80% of its amplitude. Then, the CLK output is activated synchronously with its
output signal so that the first period of the CLK output signal is a full period.
4.5.1
Clock Pulse Take-over by Microcontroller
The clock of the crystal oscillator can be used for clocking the microcontroller. Atmel’s
ATARx9x microcontroller family provides the special feature of starting with an integrated RC
oscillator to switch on the ATA8404/ATA8405’s external clocking and to wait automatically until
the CLK output of the ATA8404/ATA8405 is activated. After a time period of 250 µs the message can be sent with crystal accuracy.
4.5.2
Output Matching and Power Setting
The output power is set by the load impedance of the antenna. The maximum output power is
achieved with a load impedance of ZLoad, opt = 380Ω + j340Ω (ATA8404) at 315 MHz and
ZLoad, opt = 280Ω + j310Ω (ATA8405) at 433.92 MHz. A low resistive path to VS is required to
deliver the DC current (see Figure 4-6 on page 10).
The power amplifier delivers a current pulse and the maximum output power is delivered to a
resistive load if the 0.66 pF output capacitance of the power amplifier is compensated by the
load impedance.
At the ANT1 pin, the RF output amplitude is about VS – 0.5V.
The load impedance is defined as the impedance seen from the ATA8404’s ANT1, ANT2 into
the matching network. Do not mix up this large-signal load impedance with a small-signal input
impedance delivered as an input characteristic of RF amplifiers.
The latter is measured from the application into the IC instead of from the IC into the application for a power amplifier.
9
9136C–INDCO–10/09
The output capacitance of 0.66 pF will be absorbed into the load impedance, so a real impedance of 684Ω (ATA8404) at 315 MHz and 623Ω (ATA8405) at 433.92 MHz should be
measured with a network analyses at pin 5 (ANT1) with the ATA8404/ATA8405 soldered, an
optimized antenna connected, and the power amplifier switched off.
Less output power is achieved by lowering the real parallel part where the parallel imaginary
part should be kept constant. Lowering the real part of the load impedance also reduces the
supply voltage dependency of the output power.
Output power measurement can be done with the circuit as shown in Figure 4-6. Please note
that the component values must be changed to compensate for the individual board parasitics
until the ATA8404/ATA8405 has the right load impedance. Also, the damping of the cable used
to measure the output power must be calibrated.
Figure 4-6.
Output Power Measurement ATA8404/ATA8405
VS
C1 = 1n
~
L1 = 68 nH/ 39 nH
Power
meter
Z = 50 Ω
Z Lopt C2 = 2.2 pF/1.8 pF
ANT1
ANT2
Rin
50 Ω
~
Table 4-2 and Table 4-3 show the output power and the supply current versus temperature
and supply voltage.
Table 4-2.
Ambient
Temperature
VS = 2.0V
(dBm/mA)
VS = 3.0V
(dBm/mA)
VS = 3.6V
(dBm/mA)
Tamb = –40°C
3.1 ±1.5 / 7.2
6.1 +2/–3 / 7.7
7.1 +2/–3 / 7.9
Tamb = +25°C
3.0 ±1.5 / 7.5
6.0 ±2 / 8.1
7.4 ±2 / 8.3
Tamb = +85°C
3.0 ±1.5 / 7.5
5.8 +2/–3 / 8.2
7.2 +2/–3 / 8.5
Table 4-3.
10
Output Power and Supply Current versus Temperature and Supply
Voltage for the ATA8404 with ZLoad = 380Ω + j340Ω (Correlation Tested)
Output Power and Supply Current versus Temperature and Supply
Voltage for the ATA8405 with ZLoad = 280Ω + j310Ω (Correlation Tested)
Ambient
Temperature
VS = 2.0V
(dBm/mA)
VS = 3.0V
(dBm/mA)
VS = 3.6V
(dBm/mA)
Tamb = –40°C
3.3 ±1.5 / 7.6
6.2 +2/–3 / 8.1
7.1 +2/–3 / 8.4
Tamb = +25°C
3.0 ±1.5 / 8.0
6.0 ±2 / 8.5
7.5 ±2 / 8.8
Tamb = +85°C
2.8 ±1.5 / 8.0
5.7 +2/–3 / 8.6
6.8 +2/–3 / 8.8
ATA8404/ATA8405 [Preliminary]
9136C–INDCO–10/09
ATA8404/ATA8405 [Preliminary]
4.6
Application Circuits
For the supply voltage blocking capacitor C3, a value of 68 nF/X7R is recommended (see Figure 4-7 on page 12 and Figure 4-8 on page 13). C1 and C2 are used to match the loop antenna
to the power amplifier. For C2, two capacitors in series should be used to achieve a better tolerance value and to enable it to realize ZLoad,opt by using capacitors with standard values.
Together with the pins of ATA8404 and the PCB board wires, C1 forms a series resonance loop
that suppresses the 1st harmonic, hence the position of C1 on the PCB is important. Normally,
the best suppression is achieved when C1 is placed as close as possible to the pins ANT1 and
ANT2.
The loop antenna should not exceed a width of 1.5 mm, otherwise the Q-factor of the loop
antenna is too high.
L1 (50 nH to 100 nH) can be printed on the PCB. C4 should be selected so that the XTO runs
on the load resonance frequency of the crystal. Normally, a value of 10 pF results in a 12 pF
load-capacitance crystal due to the board parasitic capacitances and the inductive impedance
of the XTO1 pin.
11
9136C–INDCO–10/09
Figure 4-7.
ASK Application Circuit
S1
BPXY
S2
AVR® (ATtiny)
VDD
1
VS
VSS
BPXY
20
BPXY
OSC1
BPXY
7
ATA8404/ATA8405
Power up/down
CLK
1
ENABLE
EN
f
10
8
f
24/
32
ASK
GND
2
9
OR
C3
PFD
FSK
VS
3
8
CP
C2
VS
Ampl. OK
ANT2
XTO1
XTO
4
Loop
Antenna
XTAL
7
LF
C1
C4
EN
ANT1
5
L1
XTO2
VCO
PA
6
PLL
VS
12
ATA8404/ATA8405 [Preliminary]
9136C–INDCO–10/09
ATA8404/ATA8405 [Preliminary]
Figure 4-8.
FSK Application Circuit
BPXY
S1
S2
VDD
AVR (ATtiny)
1
VS
VSS
BPXY
20
BPXY
OSC1
BPXY
7
ATA8404/ATA8405
Power up/down
CLK
1
ENABLE
EN
f
10
8
f
24/
32
ASK
GND
9
2
OR
C3
PFD
FSK
VS
3
8
CP
C2
VS
Ampl. OK
XTO1
ANT2
XTO
4
Loop
Antenna
XTAL
7
LF
C1
EN
ANT1
5
L1
XTO2
VCO
PA
PLL
C5
6
C4
VS
13
9136C–INDCO–10/09
Figure 4-9.
ESD Protection Circuit
VS
ANT1
CLK
ASK
FSK
XTO2
ANT2
XTO1
ENABLE
GND
5. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters
Symbol
Minimum
Maximum
Unit
Supply voltage
VS
5
V
Power dissipation
Ptot
100
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
–55
+85
°C
Ambient temperature
Tamb1
–55
+85
°C
Ambient temperature in power-down mode for
15 minutes without damage with VS ≤ 3.2V
VENABLE < 0.25V or ENABLE is open,
VASK < 0.25V, VFSK < 0.25V
Tamb2
175
°C
(VS + 0.3)(1)
V
Input voltage
Note:
VmaxASK
–0.3
1. If VS + 0.3 is higher than 3.7V, the maximum voltage will be reduced to 3.7V.
6. Thermal Resistance
Parameters
Junction ambient
14
Symbol
Value
Unit
RthJA
170
K/W
ATA8404/ATA8405 [Preliminary]
9136C–INDCO–10/09
ATA8404/ATA8405 [Preliminary]
7. Electrical Characteristics
VS = 2.0V to 3.6V, Tamb = –40°C to +85°C unless otherwise specified.
Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 9).
CM = 4.37 fF, C0 = 1.3 pF, CLNOM = 18 pF, C4 = 10 pF, C5 = 15 pF and RS ≤ 60Ω
Parameters
Test Conditions
Supply current,
power-down mode
VENABLE < 0.25V or ENABLE is open,
VASK < 0.25V, VFSK < 0.25V
Tamb = 25°C
Tamb = –40° C to +85°C
Supply current, idle mode
VENABLE < 0.25V, VS ≤ 3.2V
ASK,FSK can be Low or High
IS_IDLE
Supply current, power-up, PA off,
FSK switch High Z
VS ≤ 3.2V, VFSK > 1.7V,
VASK < 0.25V ENABLE is open
IS
Supply current, power-up, PA on,
FSK switch High Z
VS ≤ 3.2V, CCLK ≤ 10 pF
VFSK > 1.7V, VASK > 1.7V
ENABLE is open
ATA8404
ATA8405
IS_Transmit1
Supply current, power-up, PA on,
FSK Low Z
VS ≤ 3.2V, CCLK ≤ 10 pF
VFSK< 0.25V, VASK > 1.7V
ENABLE is open
ATA8404
ATA8405
IS_Transmit2
Output power
VS = 3.0V, Tamb = 25°C,
f = 315 MHz for ATA8404,
ZLoad, opt = (380 + j340)Ω
f = 433.92 MHz for ATA8405,
ZLoad, opt = (280 + j310)Ω
POut
4
Output power for the full
temperature and supply voltage
range
Tamb = –40°C to +85°C,
VS = 2.0V to 3.2V
POut
1
Spurious emission
fCLK = fXT0/8
Load capacitance at pin CLK ≤ 20 pF
f0 ±fCLK
f0 ±fXT0
other spurious are lower
Harmonics
With 50Ω matching network according
to Figure 4-6 on page 10
2nd
3rd
Oscillator frequency XTO
(= phase comparator frequency)
fXTO = f0/24 ATA8404
fXTO = f0/32 ATA8405
fXTAL = resonant frequency of the
XTAL, CM = 4.37 fF, load capacitance
selected accordingly
Tamb = –40°C to +85°C
ΔfXTO
Since pulling P is
P = –IMXTO × CM × π × fXTO
ΔfXTO can be calculated out of IMXTO
with CM = 4.37 fF
IMXTO
Imaginary part of XTO1
Impedance in steady state
oscillation
Symbol
Min.
Typ.
Max.
Unit
100
350
nA
nA
100
µA
3.6
4.6
mA
8.1
8.5
9.8
10.5
mA
mA
8.4
8.8
10.2
11.0
mA
mA
6
8
dBm
8.2
dBm
1
IS_Off
Spour
–42
–60
dBc
–16
–15
dBc
dBc
–14.0
fXTAL
+14.0
ppm
j20
j110
j200
Ω
15
9136C–INDCO–10/09
7. Electrical Characteristics (Continued)
VS = 2.0V to 3.6V, Tamb = –40°C to +85°C unless otherwise specified.
Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 9).
CM = 4.37 fF, C0 = 1.3 pF, CLNOM = 18 pF, C4 = 10 pF, C5 = 15 pF and RS ≤ 60Ω
Parameters
Test Conditions
Symbol
Min.
Typ.
Real part of XTO1 impedance in
small signal oscillation
This value is important for crystal
oscillator start-up
REXTO
–650
–1100
Crystal oscillator start-up time
Time between ENABLE of the IC with
FSK = H and activation of the CLK
output. The CLK is activated
synchronously to the output frequency
if the current through the XTAL has
reached 35% to 80% of its maximum
amplitude. Crystal parameters:
CM = 4.37 fF, C0 = 1.3 pF,
CLNOM = 18 pF, C4 = 10 pF, C5 = 15 pF,
RS ≤ 60Ω
ΔTXTO
0.6
XTO drive current
Current flowing through the crystal in
steady state oscillation (peak-to-peak
value)
IDXTO
300
Locking time of the PLL
Time between the activation of CLK
and when the PLL is locked
(transmitter ready for data
transmission)
ΔTPLL
PLL loop bandwidth
Max.
Unit
Ω
1.4
ms
µApp
250
µs
fLoop_PLL
250
LPLL
–85
–76
dBc/Hz
Lat1M
Lat36M
–90
–121
–84
–115
dBc/Hz
dBc/Hz
317
448
MHz
MHz
kHz
In loop phase noise PLL
25 kHz distance to carrier
Phase noise VCO
at 1 MHz
at 36 MHz
Frequency range of VCO
ATA8404
ATA8405
fVCO
Clock output frequency (CMOS
microcontroller compatible)
ATA8404
ATA8405
fCLK
Clock output minimum High and
Low time
CLoad ≤ 20 pF, High = 0.8 × Vs,
Low = 0.2 × VS, fCLK < 1.7 MHz
TCLKLH
Series resonance resistance of
the resonator seen from pin
XTO1
For proper detection of the XTO
amplitude
Rs_max
150
Ω
CL_max
5
pF
20
kHz
Capacitive load at Pin XTO1
310
432
f0/192
f0/256
125
FSK modulation frequency rate
This corresponds to 20 kBaud in
Manchester coding and 40 kBaud in
NRZ coding
fMOD_FSK
0
FSK switch OFF resistance
High Z
RSWIT_OFF
50
0.75
FSK switch OFF capacitance
High Z capacitance
CSWIT_OFF
FSK switch ON resistance
Low Z
RSWIT_ON
ASK modulation frequency rate
Duty cycle of the modulation signal =
50%, this corresponds to 20 kBaud in
Manchester coding and 40 kBaud in
NRZ coding
fMOD_ASK
16
MHz
0
ns
kΩ
0.9
1.1
pF
130
175
Ω
20
kHz
ATA8404/ATA8405 [Preliminary]
9136C–INDCO–10/09
ATA8404/ATA8405 [Preliminary]
7. Electrical Characteristics (Continued)
VS = 2.0V to 3.6V, Tamb = –40°C to +85°C unless otherwise specified.
Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 9).
CM = 4.37 fF, C0 = 1.3 pF, CLNOM = 18 pF, C4 = 10 pF, C5 = 15 pF and RS ≤ 60Ω
Parameters
Test Conditions
ASK input
Low level input voltage
High level input voltage
Input current high
Symbol
VIl
VIh
IIn
FSK input
Low level input voltage
High level input voltage
Input current high
VIl
VIh
IIn
ENABLE input
Low level input voltage
High level input voltage
Input current high
Input current Low
VIl
VIh
IInh
IInl
Min.
Max.
Unit
1.7
0.25
VS
30
V
V
µA
1.7
0.25
VS
30
V
V
µA
0.25
VS
+40
+40
V
V
µA
µA
1.7
–40
–40
Typ.
17
9136C–INDCO–10/09
8. Ordering Information
Extended Type Number
Package
Remarks
ATA8404-6DQY
TSSOP10
Pb-free
ATA8405-6DQY
TSSOP10
Pb-free
9. Package Information TSSOP10
Package: TSSOP 10
(acc. to JEDEC Standard MO-187)
3±0.1
3±0.1
0.25
3.8±0.3
0.5 nom.
0.15
0.85±0.1
1.1 max
Dimensions in mm
Not indicated tolerances ± 0.05
4.9±0.1
4 x 0.5 = 2 nom.
10 9 8 7 6
technical drawings
according to DIN
specifications
Drawing-No.: 6.543-5095.01-4
1 2 3 4 5
18
Issue: 3; 16.09.05
ATA8404/ATA8405 [Preliminary]
9136C–INDCO–10/09
ATA8404/ATA8405 [Preliminary]
10. Revision History
Please note that the following page numbers referred to in this section refer to the specific revision
mentioned, not to this document.
Revision No.
History
9136C-INDCO-10/09
• Section 8 “Ordering Information” on page 18 changed
9136B-INDCO-06/09
• Figure 1-1 “System Block Diagram” on page 1 changed
• Figure 4-7 “ASK Application Circuit” on page 12 changed
• Figure 4-8 “FSK Application Circuit” on page 13 changed
19
9136C–INDCO–10/09
Headquarters
International
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Atmel Asia
Unit 1-5 & 16, 19/F
BEA Tower, Millennium City 5
418 Kwun Tong Road
Kwun Tong, Kowloon
Hong Kong
Tel: (852) 2245-6100
Fax: (852) 2722-1369
Atmel Europe
Le Krebs
8, Rue Jean-Pierre Timbaud
BP 309
78054
Saint-Quentin-en-Yvelines Cedex
France
Tel: (33) 1-30-60-70-00
Fax: (33) 1-30-60-71-11
Atmel Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Technical Support
[email protected]
Sales Contact
www.atmel.com/contacts
Product Contact
Web Site
www.atmel.com
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF
THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use
as components in applications intended to support or sustain life.
© 2009 Atmel Corporation. All rights reserved. Atmel ®, logo and combinations thereof, AVR ® and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
9136C–INDCO–10/09