TI1 ISO7830FDWWR High-performance, 8000-vpk reinforced triple digital isolator Datasheet

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ISO7830, ISO7830F
SLLSEO2B – JULY 2015 – REVISED JUNE 2016
ISO7830x High-Performance, 8000-VPK Reinforced Triple Digital Isolators
1 Features
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1
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Signaling Rate: Up to 100 Mbps
Wide Supply Range: 2.25 V to 5.5 V
2.25 V to 5.5 V Level Translation
Wide Temperature Range: –55°C to 125°C
Low Power Consumption, Typical 1.6 mA per
Channel at 1 Mbps
Low Propagation Delay: 11 ns Typical
(5-V Supplies)
Industry leading CMTI (min): ±100 kV/μs
Robust Electromagnetic Compatibility (EMC)
System-Level ESD, EFT, and Surge Immunity
Low Emissions
Isolation Barrier Life: > 40 Years
SOIC-16 Wide Body (DW) and Extra-Wide Body
(DWW) Package Options
Safety-Related Certifications:
– 8000 VPK Reinforced Isolation per DIN V VDE
V 0884-10 (VDE V 0884-10):2006-12
– 5.7 kVRMS Isolation for 1 Minute per UL 1577
– CSA Component Acceptance Notice 5A, IEC
60950-1 and IEC 60601-1 End Equipment
Standards
– CQC Certification per GB4943.1-2011
– TUV Certification per EN 61010-1 and EN
60950-1
– All DW Package Certifications Complete;
DWW Package Certifications Complete per
UL, VDE, TUV and Planned for CSA and CQC
Each isolation channel has a logic input and output
buffer separated by silicon dioxide (SiO2) insulation
barrier. This device comes with enable pins which
can be used to put the respective outputs in high
impedance for multi-master driving applications and
to reduce power consumption. The ISO7830x device
has three forward and no reverse-direction channels.
If the input power or signal is lost, the default output
is high for the ISO7830 device and low for the
ISO7830F device. See Device Functional Modes for
further details.
Used in conjunction with isolated power supplies, this
device helps prevent noise currents on a data bus or
other circuits from entering the local ground and
interfering with or damaging sensitive circuitry.
Through innovative chip design and layout
techniques,
electromagnetic
compatibility
of
ISO7830x has been significantly enhanced to ease
system-level ESD, EFT, surge, and emissions
compliance. ISO7830x is available in a 16-pin SOIC
wide-body (DW) and extra-wide body (DWW)
packages.
Device Information(1)
PART NUMBER
PACKAGE
ISO7830
ISO7830F
BODY SIZE (NOM)
DW (16)
10.30 mm × 7.50 mm
DWW (16)
10.30 mm × 14.0 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
VCCI
Isolation
Capacitor
VCCO
INx
OUTx
2 Applications
•
•
•
•
•
•
Industrial Automation
Motor Control
Power Supplies
Solar Inverters
Medical Equipment
Hybrid Electric Vehicles
ENx
GNDI
GNDO
Copyright © 2016, Texas Instruments Incorporated
VCCI and GNDI are supply and ground
connections respectively for the input
channels.
VCCO and GNDO are supply and ground
connections respectively for the output
channels.
3 Description
The ISO7830x device is a high-performance, 3channel digital isolator with 8000-VPK isolation
voltage. This device has reinforced isolation
certifications according to VDE, CSA, TUV and CQC.
The isolator provides high electromagnetic immunity
and low emissions at low power consumption, while
isolating CMOS or LVCMOS digital I/Os.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ISO7830, ISO7830F
SLLSEO2B – JULY 2015 – REVISED JUNE 2016
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Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
6.12
6.13
6.14
6.15
6.16
6.17
6.18
1
1
1
2
4
5
Absolute Maximum Ratings ...................................... 5
ESD Ratings.............................................................. 5
Recommended Operating Conditions....................... 5
Thermal Information .................................................. 6
Power Rating............................................................. 6
Insulation Characteristics .......................................... 7
Regulatory Information.............................................. 8
Safety Limiting Values .............................................. 8
Electrical Characteristics—5-V Supply ..................... 9
Supply Current Characteristics—5-V Supply .......... 9
Electrical Characteristics—3.3-V Supply .............. 10
Supply Current Characteristics—3.3-V Supply ..... 10
Electrical Characteristics—2.5-V Supply .............. 11
Supply Current Characteristics—2.5-V Supply ..... 11
Switching Characteristics—5-V Supply................. 12
Switching Characteristics—3.3-V Supply.............. 12
Switching Characteristics—2.5-V Supply.............. 13
Insulation Characteristics Curves ......................... 14
6.19 Typical Characteristics .......................................... 15
7
8
Parameter Measurement Information ................ 16
Detailed Description ............................................ 18
8.1
8.2
8.3
8.4
9
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
18
18
19
20
Application and Implementation ........................ 21
9.1 Application Information............................................ 21
9.2 Typical Application .................................................. 21
10 Power Supply Recommendations ..................... 23
11 Layout................................................................... 24
11.1 Layout Guidelines ................................................. 24
11.2 Layout Example .................................................... 24
12 Device and Documentation Support ................. 25
12.1
12.2
12.3
12.4
12.5
12.6
12.7
Documentation Support ........................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
25
25
25
25
25
25
25
13 Mechanical, Packaging, and Orderable
Information ........................................................... 26
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (September 2015) to Revision B
Page
•
Changed Features From: Low Power Consumption, Typical 2.4 mA per Channel at 1 Mbps To: Low Power
Consumption, Typical 1.6 mA per Channel at 1 Mbps .......................................................................................................... 1
•
Changed the isolation barrier life from > 25 years to > 40 years in the Features section ..................................................... 1
•
Changed Features From: Safety and Regulatory Approvals To: Safety-Related Certifications ........................................... 1
•
Updated the status of the certifications throughout the document ........................................................................................ 1
•
Added the extra-wide body package (16 pin SOIC [DWW]) option........................................................................................ 1
•
Deleted EN1 from the pin out drawing in the Pin Configuration and Functions section. Replaced references of ENx
with EN2 ................................................................................................................................................................................. 4
•
Changed pin VCC1 description From: Power supply, VCC1 To: Power supply, side 1 in the PIN Functions table................... 4
•
Changed pin VCC2 description From: Power supply, VCC2 To: Power supply, side 2 in the PIN Functions table................... 4
•
Moved Junction temperature From Recommended Operating Conditions To Absolute Maximum Ratings .......................... 5
•
Changed the values for the DW package in the Thermal Information table ......................................................................... 6
•
Changed the maximum power dissipation values for side 1 (40 to 25) and side 2 (110 to 125) in the Power Rating table . 6
•
Moved Insulation Characteristics to the Specifications section.............................................................................................. 7
•
Changed CIO Specification From: 2 pF To: ~1 pF ................................................................................................................. 7
•
Added the climatic category parameter to the Insulation Characteristics table .................................................................... 7
•
Moved Regulatory Information to the Specifications section.................................................................................................. 8
•
Moved Safety Limiting Values to the Specifications section .................................................................................................. 8
•
Changed the test conditions and values for the DW package in the Safety Limiting Values table........................................ 8
•
Changed VCCO to VCCI in the minimum value for the input threshold voltage hysteresis parameter in the electrical
characteristics tables .............................................................................................................................................................. 9
2
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Revision History (continued)
•
Added the VCM test condition to the CMTI parameter in the electrical characteristics tables. Also updated the
minimum value from 70 to 100 and deleted the maximum value of 100................................................................................ 9
•
Changed tfs To: tDO in Switching Characteristics—5-V Supply............................................................................................. 12
•
Changed tfs To: tDO in Switching Characteristics—3.3-V Supply.......................................................................................... 12
•
Changed tfs To: tDO in Switching Characteristics—2.5-V Supply.......................................................................................... 13
•
Added the lifetime projection graphs for DW and DWW packages to the Insulation Characteristics Curves section ........ 14
•
Changed the thermal derating curves in the Safety Limiting Values section ....................................................................... 14
•
Changed 2.7 V To: 1.7 V, fs high To: default high, and fs low To: default low in Figure 15 ............................................... 17
•
Changed Figure 20 .............................................................................................................................................................. 21
Changes from Original (July 2015) to Revision A
•
Page
Changed From: 1-page Product Preview To: Production datasheet...................................................................................... 1
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5 Pin Configuration and Functions
DW and DWW Packages
16-Pin SOIC
Top View
1
16 VCC2
GND1 2
15 GND2
VCC1
3
14 OUTA
INB
4
INC
5
NC
6
11
NC
NC
7
10
EN2
ISOLATION
INA
GND1 8
13 OUTB
12 OUTC
9 GND2
Pin Functions
PIN
NAME
EN2
NO.
I/O
DESCRIPTION
Output enable 2. Output pins on side 2 are enabled when EN2 is high or open and in highimpedance state when EN2 is low.
10
I
GND1
2, 8
—
Ground connection for VCC1
GND2
Ground connection for VCC2
9, 15
—
INA
3
I
Input, channel A
INB
4
I
Input, channel B
INC
5
I
Input, channel C
OUTA
14
O
Output, channel A
OUTB
13
O
Output, channel B
OUTC
12
O
Output, channel C
6, 7, 11
—
Not connected
VCC1
1
—
Power supply, side 1
VCC2
16
—
Power supply, side 2
NC
4
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6 Specifications
6.1 Absolute Maximum Ratings
See
(1)
VCC1
VCC2
Supply voltage (2)
MIN
MAX
–0.5
6
UNIT
V
V
Voltage at INx, OUTx, or EN2x
–0.5
IO
Output current
–15
15
mA
TJ
Junction temperature
–55
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
(2)
(3)
VCCx + 0.5
(3)
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak
voltage values.
Maximum voltage must not exceed 6 V
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
UNIT
±6000
Charged device model (CDM), per JEDEC specification JESD22-C101 (2)
V
±1500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
VCC1,
VCC2
IOH
IOL
Supply voltage
High-level output current
Low-level output current
NOM
2.25
VCCO
(1)
=5V
–4
VCCO
(1)
= 3.3 V
–2
VCCO (1) = 2.5 V
–1
MAX
5.5
4
VCCO (1) = 3.3 V
2
VCCO
V
mA
VCCO (1) = 5 V
(1)
UNIT
= 2.5 V
mA
1
VIH
High-level input voltage
0.7 × VCCI (1)
VCCI (1)
V
VIL
Low-level input voltage
0
0.3 × VCCI (1)
V
DR
Signaling rate
TA
Ambient temperature
(1)
0
–55
25
100
Mbps
125
°C
VCCI = Input-side VCC; VCCO = Output-side VCC.
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6.4 Thermal Information
ISO7830
THERMAL METRIC (1)
DW (SOIC)
DWW (SOIC)
16 PINS
16 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
81.1
83.4
°C/W
RθJC(top)
Junction-to-case(top) thermal resistance
43.8
45.2
°C/W
RθJB
Junction-to-board thermal resistance
45.7
54.1
°C/W
ψJT
Junction-to-top characterization parameter
17.0
17.6
°C/W
ψJB
Junction-to-board characterization parameter
45.2
53.3
°C/W
RθJC(bottom)
Junction-to-case(bottom) thermal resistance
—
—
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Power Rating
PARAMETER
PD
Maximum power dissipation
PD1
Maximum power dissipation by side-1
PD2
Maximum power dissipation by side-2
6
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TEST CONDITIONS
MIN
VCC1 = VCC2 = 5.5 V, TJ = 150°C,
CL = 15 pF, input a 50 MHz 50% duty
cycle square wave
TYP
MAX
UNIT
150
mW
25
mW
125
mW
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6.6 Insulation Characteristics
PARAMETER
TEST CONDITIONS
SPECIFICATION
DW
DWW
UNIT
External clearance (1)
Shortest terminal-to-terminal distance through air
>8
>14.5
mm
CPG
External creepage (1)
Shortest terminal-to-terminal distance across the package
surface
>8
>14.5
mm
DTI
Distance through the insulation
Minimum internal gap (internal clearance)
>21
>21
μm
CTI
Comparative tracking index
DIN EN 60112 (VDE 0303-11); IEC 60112; UL 746A
>600
>600
V
I
I
Rated mains voltage ≤ 600 VRMS
I–IV
I–IV
Rated mains voltage ≤ 1000 VRMS
I–III
I–IV
Maximum isolation working voltage
Time dependent dielectric breakdown (TDDB) Test; see
Figure 1 and Figure 2
1500
2000
VRMS
2121
2828
VDC
VIOTM
Maximum transient isolation voltage
VTEST = VIOTM
t = 60 s (qualification)
t= 1 s (100% production)
8000
8000
VPK
VIOSM
Maximum surge isolation voltage for
reinforced insulation (3)
Test method per IEC 60065, 1.2/50 µs waveform,
VTEST = 1.6 × VIOSM = 12800 VPK (qualification)
8000
8000
VPK
VIORM
Maximum repetitive peak isolation
voltage
2121
2828
VPK
Method a, After Input/Output safety test subgroup 2/3,
VPR = VIORM × 1.2, t = 10 s,
Partial discharge < 5 pC
2545
3394
Method a, After environmental tests subgroup 1,
VPR = VIORM × 1.6, t = 10 s,
Partial Discharge < 5 pC
3394
4525
Method b1,
VPR = VIORM × 1.875, t = 1 s (100% Production test)
Partial discharge < 5 pC
3977
5303
~1
~1
CLR
Material group
Overvoltage category per IEC 60664-1
DIN V VDE V 0884–10 (VDE V 0884–10):2006-12 (2)
VIOWM
VPR
Input-to-output test voltage
Barrier capacitance, input to output (4)
CIO
RIO
Isolation resistance, input to output (4)
RS
Isolation resistance
VIO = 0.4 × sin (2πft), f = 1 MHz
VIO = 500 V, TA = 25°C
12
>10
11
VPK
pF
12
Ω
11
>10
VIO = 500 V, 100°C ≤ TA ≤ max
>10
>10
Ω
VIO = 500 V at TS
>109
>109
Ω
Pollution degree
2
2
Climatic category
55/125/21
55/125/21
5700
5700
UL 1577
VISO
(1)
(2)
(3)
(4)
Withstanding isolation voltage
VTEST = VISO = 5700 VRMS, t = 60 s (qualification),
VTEST = 1.2 × VISO = 6840 VRMS, t = 1 s (100% production)
VRMS
Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care
should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on
the printed-circuit board do not reduce this distance. Creepage and clearance on a printed-circuit board become equal in certain cases.
Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications
This coupler is suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured by
means of suitable protective circuits.
Testing is carried out in air or oil to determine the intrinsic surge immunity of the isolation barrier.
All pins on each side of the barrier tied together creating a two-terminal device.
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6.7 Regulatory Information
All DW package certifications are complete. DWW package certifications are complete for UL, VDE and TUV and planned for
CSA and CQC.
VDE
Certified according to DIN V
VDE V 0884–10 (VDE V
0884–10):2006-12 and DIN EN
60950-1 (VDE 0805 Teil
1):2011-01
Reinforced insulation
Maximum transient isolation
voltage, 8000 VPK;
Maximum repetitive peak
isolation voltage, 2121 VPK
(DW), 2828 VPK (DWW);
Maximum surge isolation
voltage, 8000 VPK
Certificate number: 40040142
CSA
UL
Approved under CSA
Component Acceptance Notice
5A, IEC 60950-1 and IEC
60601-1
Reinforced insulation per CSA
60950-1-07+A1+A2 and IEC
60950-1 2nd Ed., 800 VRMS
(DW) and 1450 VRMS (DWW)
maximum working voltage
(pollution degree 2, material
group I);
Certified according to UL
1577 Component
Recognition Program
Certified according to GB
4943.1-2011
Single protection, 5700
VRMS
Reinforced Insulation,
Altitude ≤ 5000 m, Tropical
Climate, 250 VRMS
maximum working voltage
File number: E181974
Certificate number:
CQC15001121716
2 MOPP (Means of Patient
Protection) per CSA 606011:14 and IEC 60601-1 Ed. 3.1,
250 VRMS (354 VPK) maximum
working voltage
Master contract number:
220991
CQC
TUV
Certified according to
EN 61010-1:2010 (3rd Ed) and
EN 609501:2006/A11:2009/A1:2010/
A12:2011/A2:2013
5700 VRMS Reinforced insulation
per
EN 61010-1:2010 (3rd Ed) up to
working voltage of 600 VRMS
(DW package) and 1000 VRMS
(DWW package)
5700 VRMS Reinforced insulation
per
EN 609501:2006/A11:2009/A1:2010/
A12:2011/A2:2013 up to working
voltage of 800 VRMS (DW
package) and 1450 VRMS (DWW
package)
Client ID number: 77311
6.8 Safety Limiting Values
Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of
the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat
the die and damage the isolation barrier potentially leading to secondary system failures.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DW PACKAGE
IS
Safety input, output, or
supply current
RθJA = 81.1°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 3
280
RθJA = 81.1°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 3
428
RθJA = 81.1°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 3
560
PS
Safety input, output, or total
RθJA = 81.1°C/W, TJ = 150°C, TA = 25°C, see Figure 5
power
TS
Maximum safety
temperature
mA
1541
mW
150
°C
DWW PACKAGE
IS
Safety input, output, or
supply current
RθJA = 83.4°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 4
273
RθJA = 83.4°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 4
416
RθJA = 83.4°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 4
545
PS
Safety input, output, or total
RθJA = 83.4°C/W, TJ = 150°C, TA = 25°C, see Figure 6
power
TS
Maximum safety
temperature
mA
1499
mW
150
°C
The maximum safety temperature is the maximum junction temperature specified for the device. The power
dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines
the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information is that of a
device installed on a high-K test board for leaded surface mount packages. The power is the recommended
maximum input voltage times the current. The junction temperature is then the ambient temperature plus the
power times the junction-to-air thermal resistance.
8
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6.9 Electrical Characteristics—5-V Supply
VCC1 = VCC2 = 5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
– 0.4
VCCO – 0.2
MAX
UNIT
VOH
High-level output voltage
IOH = –4 mA; see Figure 13
VOL
Low-level output voltage
IOL = 4 mA; see Figure 13
VI(HYS)
Input threshold voltage
hysteresis
IIH
High-level input current
VIH = VCCI at INx or EN2
IIL
Low-level input current
VIL = 0 V at INx or EN2
–10
μA
CMTI
Common-mode transient
immunity
VI = VCCI or 0 V, VCM = 1500 V; see
Figure 16
100
kV/μs
CI
Input capacitance
(1)
(2)
(2)
VCCO
(1)
0.2
0.1 × VCCI
V
0.4
V
(1)
V
10
VI = VCC / 2 + 0.4 × sin (2πft), f = 1 MHz, VCC
=5V
μA
2
pF
VCCI = Input-side VCC; VCCO = Output-side VCC.
Measured from input pin to ground.
6.10 Supply Current Characteristics—5-V Supply
VCC1 = VCC2 = 5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER
SUPPLY
CURRENT
TEST CONDITIONS
MAX
ICC1
1.1
1.8
ICC2
0.4
0.6
EN2 = 0 V, VI = VCCI (Devices with suffix F),
VI = 0 V (Devices without suffix F)
ICC1
4.6
6.6
ICC2
0.4
0.6
VI = 0 V (Devices with suffix F),
VI = VCCI (Devices without suffix F)
ICC1
1.1
2
ICC2
1.7
2.7
VI = VCCI (Devices with suffix F),
VI = 0 V (Devices without suffix F)
ICC1
4.6
6.8
ICC2
1.9
2.8
ICC1
2.8
4.4
ICC2
1.9
3
ICC1
2.9
4.4
ICC2
3.3
4.6
ICC1
3.9
4.9
ICC2
17.5
20.8
1 Mbps
Supply current - AC
signal
TYP
EN2 = 0 V, VI = 0 V (Devices with suffix F),
VI = VCCI (Devices without suffix F)
Supply current - disable
Supply current - DC
signal
MIN
All channels switching with square
wave clock input;
CL = 15 pF
10 Mbps
100 Mbps
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6.11 Electrical Characteristics—3.3-V Supply
VCC1 = VCC2 = 3.3 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
– 0.4
VCCO – 0.2
MAX
UNIT
VOH
High-level output voltage
IOH = –2 mA; see Figure 13
VOL
Low-level output voltage
IOL = 2 mA; see Figure 13
VI(HYS)
Input threshold voltage
hysteresis
IIH
High-level input current
VIH = VCCI at INx or EN2
IIL
Low-level input current
VIL = 0 V at INx or EN2
–10
μA
CMTI
Common-mode transient
immunity
VI = VCCI or 0 V, VCM = 1500 V; see Figure 16
100
kV/μs
(1)
VCCO
(1)
0.2
0.1 × VCCI
V
0.4
(1)
V
V
10
μA
VCCI = Input-side VCC; VCCO = Output-side VCC.
6.12 Supply Current Characteristics—3.3-V Supply
VCC1 = VCC2 = 3.3 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER
SUPPLY
CURRENT
TEST CONDITIONS
1.1
1.8
ICC2
0.3
0.6
EN2 = 0 V, VI = VCCI (Devices with suffix F),
VI = 0 V (Devices without suffix F)
ICC1
4.6
6.6
ICC2
0.3
0.6
VI = 0 V (Devices with suffix F),
VI = VCCI (Devices without suffix F)
ICC1
1.1
2
ICC2
1.7
2.6
VI = VCCI (Devices with suffix F),
VI = 0 V (Devices without suffix F)
ICC1
4.6
6.8
ICC2
1.9
2.8
ICC1
2.8
4.4
ICC2
1.9
2.9
ICC1
2.9
4.4
ICC2
2.9
4.1
ICC1
3.5
4.8
ICC2
13.2
16
All channels switching with square
wave clock input;
10 Mbps
CL = 15 pF
100 Mbps
10
MAX
ICC1
1 Mbps
Supply current - AC
signal
TYP
EN2 = 0 V, VI = 0 V (Devices with suffix F),
VI = VCCI (Devices without suffix F)
Supply current - disable
Supply current - DC
signal
MIN
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UNIT
mA
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6.13 Electrical Characteristics—2.5-V Supply
VCC1 = VCC2 = 2.5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
– 0.4
VCCO – 0.2
MAX
UNIT
VOH
High-level output voltage
IOH = –1 mA; see Figure 13
VOL
Low-level output voltage
IOL = 1 mA; see Figure 13
VI(HYS)
Input threshold voltage
hysteresis
IIH
High-level input current
VIH = VCCI at INx or EN2
IIL
Low-level input current
VIL = 0 V at INx or EN2
–10
μA
CMTI
Common-mode transient
immunity
VI = VCCI or 0 V, VCM = 1500 V; see Figure 16
100
kV/μs
(1)
VCCO
(1)
0.2
0.1 × VCCI
V
0.4
V
(1)
V
10
μA
VCCI = Input-side VCC; VCCO = Output-side VCC.
6.14 Supply Current Characteristics—2.5-V Supply
VCC1 = VCC2 = 2.5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER
SUPPLY
CURRENT
TEST CONDITIONS
MAX
ICC1
1.1
1.8
ICC2
0.3
0.6
EN2 = 0 V, VI = VCCI (Devices with suffix F),
VI = 0 V (Devices without suffix F)
ICC1
4.6
6.6
ICC2
0.3
0.6
VI = 0 V (Devices with suffix F),
VI = VCCI (Devices without suffix F)
ICC1
1.1
2
ICC2
1.7
2.6
VI = VCCI (Devices with suffix F),
VI = 0 V (Devices without suffix F)
ICC1
4.6
6.8
ICC2
1.8
2.8
ICC1
2.8
4.4
ICC2
1.8
2.9
ICC1
2.9
4.4
ICC2
2.6
3.7
ICC1
3.4
4.7
ICC2
10.3
12.7
1 Mbps
Supply current - AC
signal
TYP
EN2 = 0 V, VI = 0 V (Devices with suffix F),
VI = VCCI (Devices without suffix F)
Supply current - disable
Supply current - DC
signal
MIN
All channels switching with square
wave clock input;
CL = 15 pF
10 Mbps
100 Mbps
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UNIT
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6.15 Switching Characteristics—5-V Supply
VCC1 = VCC2 = 5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER
MIN
TYP
MAX
6
11
16
ns
0.55
4.1
ns
2.5
ns
4.5
ns
1.7
3.9
ns
1.9
3.9
ns
tPHZ
Disable propagation delay, high-to-high impedance
output
12
20
ns
tPLZ
Disable propagation delay, low-to-high impedance
output
12
20
ns
10
20
ns
2
2.5
μs
Enable propagation delay, high impedance-to-low
output for ISO7830
2
2.5
μs
Enable propagation delay, high impedance-to-low
output for ISO7830F
10
20
ns
0.2
9
μs
tPLH, tPHL
Propagation delay time
PWD
Pulse width distortion (1) |tPHL – tPLH|
tsk(o)
Channel-to-channel output skew time (2)
tsk(pp)
Part-to-part skew time (3)
tr
Output signal rise time
tf
Output signal fall time
Same-direction channels
See Figure 13
Enable propagation delay, high impedance-to-high
output for ISO7830F
tPZL
tDO
Default output delay time from input power loss
tie
(3)
See Figure 13
Enable propagation delay, high impedance-to-high
output for ISO7830
tPZH
(1)
(2)
TEST CONDITIONS
See Figure 14
Measured from the time VCC goes
below 1.7 V. See Figure 15
16
Time interval error
UNIT
2
0.90
– 1 PRBS data at 100 Mbps
ns
Also known as pulse skew.
tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same
direction while driving identical loads.
tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same
direction while operating at identical supply voltages, temperature, input signals and loads.
6.16 Switching Characteristics—3.3-V Supply
VCC1 = VCC2 = 3.3 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER
MIN
TYP
MAX
6
10.8
16
ns
0.7
4.2
ns
2.2
ns
4.5
ns
0.8
3
ns
0.8
3
ns
tPHZ
Disable propagation delay, high-to-high impedance
output
17
32
ns
tPLZ
Disable propagation delay, low-to-high impedance
output
17
32
ns
17
32
ns
2
2.5
μs
Enable propagation delay, high impedance-to-low
output for ISO7830
2
2.5
μs
Enable propagation delay, high impedance-to-low
output for ISO7830F
17
32
ns
0.2
9
μs
tPLH, tPHL
Propagation delay time
PWD
Pulse width distortion (1) |tPHL – tPLH|
tsk(o)
Channel-to-channel output skew time (2)
tsk(pp)
Part-to-part skew time (3)
tr
Output signal rise time
tf
Output signal fall time
tPZH
tPZL
tDO
tie
(1)
(2)
(3)
12
TEST CONDITIONS
See Figure 13
Same-direction channels
See Figure 13
Enable propagation delay, high impedance-to-high
output for ISO7830
Enable propagation delay, high impedance-to-high
output for ISO7830F
Default output delay time from input power loss
Time interval error
UNIT
See Figure 14
Measured from the time VCC goes
below 1.7 V. See Figure 15
16
2
– 1 PRBS data at 100 Mbps
0.91
ns
Also known as pulse skew.
tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same
direction while driving identical loads.
tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same
direction while operating at identical supply voltages, temperature, input signals and loads.
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6.17 Switching Characteristics—2.5-V Supply
VCC1 = VCC2 = 2.5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER
MIN
TYP
MAX
UNIT
7.5
11.7
17.5
ns
0.66
4.2
ns
2.2
ns
4.5
ns
1
3.5
ns
1.2
3.5
ns
tPHZ
Disable propagation delay, high-to-high impedance
output
22
45
ns
tPLZ
Disable propagation delay, low-to-high impedance
output
22
45
ns
18
45
ns
2
2.5
μs
Enable propagation delay, high impedance-to-low
output for ISO7830
2
2.5
μs
Enable propagation delay, high impedance-to-low
output for ISO7830F
18
45
ns
0.2
9
μs
tPLH, tPHL
Propagation delay time
PWD
Pulse width distortion (1) |tPHL – tPLH|
tsk(o)
Channel-to-channel output skew time (2)
tsk(pp)
Part-to-part skew time (3)
tr
Output signal rise time
tf
Output signal fall time
tPZH
tPZL
tDO
tie
(1)
(2)
(3)
TEST CONDITIONS
See Figure 13
Same-direction Channels
See Figure 13
Enable propagation delay, high impedance-to-high
output for ISO7830
Enable propagation delay, high impedance-to-high
output for ISO7830F
Default output delay time from input power loss
See Figure 14
Measured from the time VCC goes
below 1.7 V. See Figure 15
16
Time interval error
2
– 1 PRBS data at 100 Mbps
0.91
ns
Also known as pulse skew.
tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same
direction while driving identical loads.
tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same
direction while operating at identical supply voltages, temperature, input signals and loads.
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6.18 Insulation Characteristics Curves
1.E+11
87.5%
Safety Margin Zone: 2400 VRMS, 63 Years
Operating Zone: 2000 VRMS, 34 Years
TDDB Line (<1 PPM Fail Rate)
1.E+10
1.E+9
1.E+9
1.E+8
1.E+8
Time to Fail (s)
Time to Fail (s)
1.E+10
1.E+11
Safety Margin Zone: 1800 VRMS, 254 Years
Operating Zone: 1500 VRMS, 135 Years
TDDB Line (<1 PPM Fail Rate)
1.E+7
1.E+6
1.E+5
87.5%
1.E+7
1.E+6
1.E+5
1.E+4
1.E+4
1.E+3
1.E+3
20%
1.E+2
1.E+2
1.E+1
500
1.E+1
400
20%
1500 2500 3500 4500 5500 6500 7500 8500 9500
Stress Voltage (VRMS)
TA upto 150°C
Operating lifetime = 135 years
Stress-voltage frequency = 60 Hz
Isolation working voltage = 1500 VRMS
TA upto 150°C
Figure 1. Reinforced Isolation Capacitor Lifetime Projection
for Devices in DW Package
Operating lifetime = 34 years
Stress-voltage frequency = 60 Hz
Isolation working voltage = 2000 VRMS
Figure 2. Reinforced Isolation Capacitor Lifetime Projection
for Devices in DWW Package
600
600
VCC1 = VCC2 = 2.75 V
VCC1 = VCC2 = 3.6 V
VCC1 = VCC2 = 5.5 V
500
Safety Limiting Current (mA)
Safety Limiting Current (mA)
1400 2400 3400 4400 5400 6400 7400 8400 9400
Stress Voltage (VRMS)
400
300
200
100
VCC1 = VCC2 = 2.75 V
VCC1 = VCC2 = 3.6 V
VCC1 = VCC2 = 5.5 V
500
400
300
200
100
0
0
0
50
100
150
Ambient Temperature (qC)
0
200
50
D014
Figure 3. Thermal Derating Curve for Safety Limiting
Current for DW Package
100
150
Ambient Temperature (qC)
1800
Power
Power
1600
Safety Limiting Power (mW)
1600
Safety Limiting Power (mW)
D015
Figure 4. Thermal Derating Curve for Safety Limiting
Current for DWW Package
1800
1400
1200
1000
800
600
400
200
1400
1200
1000
800
600
400
200
0
0
0
50
100
150
Ambient Temperature (qC)
200
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0
50
D016
Figure 5. Thermal Derating Curve for Safety Limiting Power
for DW Package
14
200
100
150
Ambient Temperature (qC)
200
D017
Figure 6. Thermal Derating Curve for Safety Limiting Power
for DWW Package
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6.19 Typical Characteristics
28
10
ICC1 at 2.5 V
ICC2 at 2.5 V
ICC1 at 3.3 V
ICC2 at 3.3 V
ICC1 at 5 V
ICC2 at 5 V
20
ICC1 at 2.5 V
ICC2 at 2.5 V
ICC1 at 3.3 V
ICC2 at 3.3 V
ICC1 at 5 V
ICC2 at 5 V
8
Supply Current (mA)
Supply Current (mA)
24
16
12
8
6
4
2
4
0
0
0
25
50
TA = 25°C
75
100
Data Rate (Mbps)
125
150
0
CL = 15 pF
75
100
Data Rate (Mbps)
125
150
D002
CL = No Load
Figure 7. Supply Current vs Data Rate (With 15-pF Load)
Figure 8. Supply Current vs Data Rate (With No Load)
6
1
5
Low-Level Output Voltage (V)
High-Level Output Voltage (V)
50
TA = 25°C
VCC at 2.5 V
VCC at 3.3 V
VCC at 5.0 V
0.9
4
3
2
VCC at 2.5 V
VCC at 3.3 V
VCC at 5.0 V
1
0
-15
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-10
-5
High-Level Output Current (mA)
0
0
13
VCC1 Rising
VCC1 Falling
VCC2 Rising
VCC2 Falling
Propagation Delay Time (ns)
2.1
2.05
2
1.95
1.9
1.85
1.8
12
11
10
9
tPLH at 2.5 V
tPHL at 2.5 V
tPLH at 3.3 V
1.75
1.7
-50
D004
D001
Figure 10. Low-Level Output Voltage vs Low-Level Output
Current
2.25
2.15
15
TA = 25°C
Figure 9. High-Level Output Voltage vs High-level Output
Current
2.2
5
10
Low-Level Output Current (mA)
D003
TA = 25°C
Power Supply Under-Voltage Threshold (V)
25
D001
0
50
100
Free-Air Temperature (oC)
150
8
-60
-30
D005
Figure 11. Power Supply Undervoltage Threshold vs FreeAir Temperature
0
30
60
Free-Air Temperature (oC)
tPHL at 3.3 V
tPLH at 5.0 V
tPHL at 5.0 V
90
120
D006
Figure 12. Propagation Delay Time vs Free-Air Temperature
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7 Parameter Measurement Information
Isolation Barrier
IN
Input
Generator
(See Note A)
VI
VCCI
50
VI
OUT
50%
50%
0V
tPLH
tPHL
CL
See Note B
VO
VOH
90%
50%
VO
50%
10%
VOL
tf
tr
Copyright © 2016, Texas Instruments Incorporated
A.
The input pulse is supplied by a generator having the following characteristics: PRR ≤ 50 kHz, 50% duty cycle, tr ≤ 3
ns, tf ≤ 3ns, ZO = 50 Ω. At the input, 50 Ω resistor is required to terminate Input Generator signal. It is not needed in
actual application.
B.
CL = 15 pF and includes instrumentation and fixture capacitance within ±20%.
Figure 13. Switching Characteristics Test Circuit and Voltage Waveforms
VCCO
VCC
Isolation Barrier
IN
0V
VI
VO
tPZL
0V
tPLZ
VOH
EN
0.5 V
VO
50%
VOL
50
OUT
VCC
VO
VCC / 2
VCC / 2
VI
0V
tPZH
EN
CL
See Note B
VI
VCC / 2
VCC / 2
VI
CL
See Note B
IN
Input
Generator
(See Note A)
±1%
OUT
Isolation Barrier
Input
Generator
(See Note A)
3V
RL = 1 k
RL = 1 k
±1%
VOH
50%
VO
0.5 V
tPHZ
50
0V
Copyright © 2016, Texas Instruments Incorporated
A.
The input pulse is supplied by a generator having the following characteristics: PRR ≤ 10 kHz, 50% duty cycle,
tr ≤ 3 ns, tf ≤ 3 ns, ZO = 50 Ω.
B.
CL = 15 pF and includes instrumentation and fixture capacitance within ±20%.
Figure 14. Enable/Disable Propagation Delay Time Test Circuit and Waveform
16
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Parameter Measurement Information (continued)
VI
VCC
VCC
Isolation Barrier
IN = 0 V (Devices without suffix F)
IN = VCC (Devices with suffix F)
IN
1.7 V
VI
OUT
t
VO
0V
DO
default high
VOH
CL
VO
See Note A
50%
VOL
default low
Copyright © 2016, Texas Instruments Incorporated
A.
CL = 15 pF and includes instrumentation and fixture capacitance within ±20%.
Figure 15. Default Output Delay Time Test Circuit and Voltage Waveforms
VCCO
VCCI
S1
Isolation Barrier
C = 0.1 µF ±1%
IN
C = 0.1 µF ±1%
Pass-fail criteria:
The output must
remain stable.
OUT
+
EN
CL
See Note A
GNDI
+
VCM ±
VOH or VOL
±
GNDO
Copyright © 2016, Texas Instruments Incorporated
A.
CL = 15 pF and includes instrumentation and fixture capacitance within ±20%.
Figure 16. Common-Mode Transient Immunity Test Circuit
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8 Detailed Description
8.1 Overview
The ISO7830x device has an ON-OFF keying (OOK) modulation scheme to transmit the digital data across a
silicon dioxide based isolation barrier. The transmitter sends a high frequency carrier across the barrier to
represent one digital state and sends no signal to represent the other digital state. The receiver demodulates the
signal after advanced signal conditioning and produces the output through a buffer stage. If the EN pin is low
then the output goes to high impedance. The ISO7830x device also incorporates advanced circuit techniques to
maximize the CMTI performance and minimize the radiated emissions because of the high frequency carrier and
IO buffer switching. The conceptual block diagram of a digital capacitive isolator, Figure 17, shows a functional
block diagram of a typical channel.
8.2 Functional Block Diagram
Transmitter
Receiver
EN
TX IN
OOK
Modulation
TX Signal
Conditioning
Oscillator
SiO2 based
Capacitive
Isolation
Barrier
RX Signal
Conditioning
Envelope
Detection
RX OUT
Emissions
Reduction
Techniques
Copyright © 2016, Texas Instruments Incorporated
Figure 17. Conceptual Block Diagram of a Digital Capacitive Isolator
Figure 18 shows a conceptual detail of how the ON-OFF keying scheme works.
TX IN
Carrier signal through
isolation barrier
RX OUT
Figure 18. On-Off Keying (OOK) Based Modulation Scheme
18
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8.3 Feature Description
Table 1 provides an overview of the device features.
Table 1. Device Features
PART
NUMBER
CHANNEL DIRECTION
RATED ISOLATION
MAXIMUM DATA RATE
DEFAULT OUTPUT
ISO7830
3 Forward, 0 Reverse
5700 VRMS / 8000 VPK (1)
100 Mbps
High
3 Forward, 0 Reverse
(1)
100 Mbps
Low
ISO7830F
(1)
5700 VRMS / 8000 VPK
See the Regulatory Information section for detailed isolation ratings.
8.3.1 Electromagnetic Compatibility (EMC) Considerations
Many applications in harsh industrial environment are sensitive to disturbances such as electrostatic discharge
(ESD), electrical fast transient (EFT), surge and electromagnetic emissions. These electromagnetic disturbances
are regulated by international standards such as IEC 61000-4-x and CISPR 22. Although system-level
performance and reliability depends, to a large extent, on the application board design and layout, the ISO7830x
device incorporates many chip-level design improvements for overall system robustness. Some of these
improvements include:
• Robust ESD protection cells for input and output signal pins and inter-chip bond pads.
• Low-resistance connectivity of ESD cells to supply and ground pins.
• Enhanced performance of high voltage isolation capacitor for better tolerance of ESD, EFT and surge events.
• Bigger on-chip decoupling capacitors to bypass undesirable high energy signals through a low impedance
path.
• PMOS and NMOS devices isolated from each other by using guard rings to avoid triggering of parasitic
SCRs.
• Reduced common mode currents across the isolation barrier by ensuring purely differential internal operation.
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8.4 Device Functional Modes
Table 2 lists the ISO7830x functional modes.
Table 2. Function Table (1)
VCCI
PU
X
(1)
(2)
(3)
VCCO
INPUT
(INx) (2)
OUTPUT
ENABLE
(EN2)
OUTPUT
(OUTx)
H
H or open
H
L
H or open
L
Open
H or open
Default
X
L
Z
PU
PU
COMMENTS
Normal Operation:
A channel output assumes the logic state of the input.
Default mode: When INx is open, the corresponding channel output goes to its
default logic state. Default is High for ISO7830 and Low for ISO7830F
A low value of output enable causes the outputs to be high-impedance
PD
PU
X
H or open
Default
Default mode: When VCCI is unpowered, a channel output assumes the logic state
based on the selected default option. Default is High for ISO7830 and Low for
ISO7830F
When VCCI transitions from unpowered to powered-up, a channel output assumes
the logic state of the input.
When VCCI transitions from powered-up to unpowered, channel output assumes the
selected default state.
X
PD
X
X
Undetermined
When VCCO is unpowered, a channel output state is undetermined (3).
When VCCO transitions from unpowered to powered-up, a channel output assumes
the logic state of the input
VCCI = Input-side VCC; VCCO = Output-side VCC; PU = Powered up (VCC ≥ 2.25 V); PD = Powered down (VCC ≤ 1.7 V); X = Irrelevant; H
= High level; L = Low level ; Z = High Impedance
A strongly driven input signal can weakly power the floating VCC via an internal protection diode and cause undetermined output.
The outputs are in undetermined state when 1.7 V < VCCI, VCCO < 2.25 V.
8.4.1 Device I/O Schematics
Input (Devices without F suffix)
VCCI
VCCI
VCCI
Enable
VCCI
VCCO
VCCO
VCCO
1.5 M
VCCO
2M
985
1970
INx
ENx
Input (Devices with F suffix)
VCCI
VCCI
Output
VCCI
VCCO
985
~20
INx
OUTx
1.5 M
Figure 19. Device I/O Schematics
20
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SLLSEO2B – JULY 2015 – REVISED JUNE 2016
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The ISO7830x device is a high-performance, triple-channel digital isolator with 5.7-kVRMS isolation voltage. The
device comes with enable pin which can be used to put the outputs in high impedance for multi-master driving
applications and reduce power consumption. The ISO7830x device uses single-ended CMOS-logic switching
technology. The supply voltage range is from 2.25 V to 5.5 V for both supplies, VCC1 and VCC2. When designing
with digital isolators, keep in mind that because of the single-ended design structure, digital isolators do not
conform to any specific interface standard and are only intended for isolating single-ended CMOS or TTL digital
signal lines. The isolator is typically placed between the data controller (that is, μC or UART), and a data
converter or a line transceiver, regardless of the interface type or standard.
9.2 Typical Application
ISO7830F can be used with Texas Instruments' mixed signal micro-controller, gate driver, transformer driver and
voltage regulator to create an isolated MOSFET/ IGBT drive circuit. Figure 20 shows an implementation of
isolated dual channel gate driver
VIN
3.3 V
0.1 F
2
Vcc
MBR0520L
1:2.2
D2
3
1
SN6501
GND
10 F
D1
10 F
OUT
5VISO
5
TPS76350
0.1 F
3
1
4, 5
IN
EN
GND
10 F
2
MBR0520L
ISO Barrier
0.1 F
0.1 F
VCC1
DVCC
6
P3.0
XOUT
MSP430F2132 P1.2 (PWM1)
XIN
P3.7 (PWM2)
11
3
23
4
18
5
INA
OUTA
ISO7830F
14
13
INB
OUTB
INC
OUTC
GND1
GND2
12
EN2 10
2, 8
Q1
6
VCC2
DVSS
4
0.22 F
16
1
2
5
0.1 F
VDD
ENB
OUTA
7
ENA
1
UCC27528
INA
OUTB
2
5
INB
GND
4
3
8
10
Q2
10
9, 15
Copyright © 2016, Texas Instruments Incorporated
Figure 20. Isolated Dual MOSFET / IGBT Gate Drive Circuit
Copyright © 2015–2016, Texas Instruments Incorporated
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Typical Application (continued)
9.2.1 Design Requirements
For this design example, use the parameters listed in Table 3.
Table 3. Design Parameters
PARAMETER
VALUE
Supply voltage
2.25 to 5.5 V
Decoupling capacitor between VCC1 and GND1
0.1 µF
Decoupling capacitor from VCC2 and GND2
0.1 µF
9.2.2 Detailed Design Procedure
Unlike optocouplers, which require external components to improve performance, provide bias, or limit current,
ISO7830x only requires two external bypass capacitors to operate.
2 mm maximum
from VCC2
2 mm maximum
from VCC1
0.1 µF
0.1 µF
VCC2
VCC1
1
16
2
15
INA
3
14
OUTA
INB
4
13
OUTB
INC
5
12
OUTC
6
11
7
10
8
9
GND1
GND2
NC
NC
EN2
NC
GND2
GND1
Figure 21. Typical ISO7830 Circuit Hook-up
22
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9.2.3 Application Curve
The following typical eye diagram of the ISO7830x device indicates low jitter and wide open eye at the maximum
data rate of 100 Mbps.
Figure 22. Eye Diagram at 100 Mbps PRBS, 5 V and 25°C
10 Power Supply Recommendations
To help ensure reliable operation at data rates and supply voltages, a 0.1-μF bypass capacitor is recommended
at input and output supply pins (VCC1 and VCC2). The capacitors should be placed as close to the supply pins as
possible. If only a single primary-side power supply is available in an application, isolated power can be
generated for the secondary-side with the help of a transformer driver such as Texas Instruments' SN6501. For
such applications, detailed power supply design and transformer selection recommendations are available in
SN6501 data sheet (SLLSEA0).
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11 Layout
11.1 Layout Guidelines
A minimum of four layers is required to accomplish a low EMI PCB design (see Figure 23). Layer stacking should
be in the following order (top-to-bottom): high-speed signal layer, ground plane, power plane and low-frequency
signal layer.
• Routing the high-speed traces on the top layer avoids the use of vias (and the introduction of their
inductances) and allows for clean interconnects between the isolator and the transmitter and receiver circuits
of the data link.
• Placing a solid ground plane next to the high-speed signal layer establishes controlled impedance for
transmission line interconnects and provides an excellent low-inductance path for the return current flow.
• Placing the power plane next to the ground plane creates additional high-frequency bypass capacitance of
approximately 100 pF/inch2.
• Routing the slower speed control signals on the bottom layer allows for greater flexibility as these signal links
usually have margin to tolerate discontinuities such as vias.
If an additional supply voltage plane or signal layer is needed, add a second power or ground plane system to
the stack to keep it symmetrical. This makes the stack mechanically stable and prevents it from warping. Also the
power and ground plane of each power system can be placed closer together, thus increasing the high-frequency
bypass capacitance significantly.
For detailed layout recommendations, see the application note, Digital Isolator Design Guide (SLLA284).
11.1.1 PCB Material
For digital circuit boards operating at less than 150 Mbps (or rise and fall times greater than 1 ns) and trace
lengths of up to 10 inches, use standard FR-4 UL94V-0 printed circuit board. This PCB is preferred over cheaper
alternatives because of lower dielectric losses at high frequencies, less moisture absorption, greater strength and
stiffness, and the self-extinguishing flammability-characteristics.
11.2 Layout Example
High-speed traces
10 mils
Ground plane
40 mils
Keep this
space free
from planes,
traces, pads,
and vias
FR-4
0r ~ 4.5
Power plane
10 mils
Low-speed traces
Figure 23. Layout Example Schematic
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SLLSEO2B – JULY 2015 – REVISED JUNE 2016
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
• Digital Isolator Design Guide, SLLA284
• Isolation Glossary, SLLA353
• SN6501 Transformer Driver for Isolated Power Supplies, SLLSEA0
• UCC27528 Dual 5-A High-Speed Low-Side Gate Driver Based on CMOS Input Threshold LogicCMOS Input
Threshold Logic, SLUSBD0
• TPS76350 Low-Power 150-mA Low-Dropout Linear Regulators, SLVS181
• MSP430F2132 Mixed Signal Microcontroller, SLAS578
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 4. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
ISO7830
Click here
Click here
Click here
Click here
Click here
ISO7830F
Click here
Click here
Click here
Click here
Click here
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates — go to the product folder for your device on ti.com. In the
upper right-hand corner, click the Alert me button to register and receive a weekly digest of product information
that has changed (if any). For change details, check the revision history of any revised document.
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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SLLSEO2B – JULY 2015 – REVISED JUNE 2016
PACKAGE OUTLINE
DW0016B
SOIC - 2.65 mm max height
SCALE 1.500
SOIC
C
10.63
TYP
9.97
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
14X 1.27
16
1
2X
8.89
10.5
10.1
NOTE 3
8
9
0.51
0.31
0.25
C A
16X
B
7.6
7.4
NOTE 4
2.65 MAX
B
0.38
TYP
0.25
SEE DETAIL A
0.25
GAGE PLANE
0.3
0.1
0 -8
1.27
0.40
DETAIL A
(1.4)
TYPICAL
4221009/A 08/2013
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
5. Reference JEDEC registration MO-013, variation AA.
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www.ti.com
EXAMPLE BOARD LAYOUT
DW0016B
SOIC - 2.65 mm max height
SOIC
SYMM
SYMM
16X (2)
16X (1.65)
SEE
DETAILS
1
SEE
DETAILS
1
16
16
16X (0.6)
16X (0.6)
SYMM
SYMM
14X (1.27)
14X (1.27)
9
8
9
8
(9.75)
(9.3)
HV / ISOLATION OPTION
8.1 mm CLEARANCE/CREEPAGE
IPC-7351 NOMINAL
7.3 mm CLEARANCE/CREEPAGE
LAND PATTERN EXAMPLE
SCALE:4X
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4221009/A 08/2013
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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SLLSEO2B – JULY 2015 – REVISED JUNE 2016
EXAMPLE STENCIL DESIGN
DW0016B
SOIC - 2.65 mm max height
SOIC
SYMM
SYMM
16X (1.65)
16X (2)
1
1
16
16
16X (0.6)
16X (0.6)
SYMM
SYMM
14X (1.27)
14X (1.27)
9
8
9
8
(9.3)
(9.75)
IPC-7351 NOMINAL
7.3 mm CLEARANCE/CREEPAGE
HV / ISOLATION OPTION
8.1 mm CLEARANCE/CREEPAGE
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:4X
4221009/A 08/2013
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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www.ti.com
PACKAGE OUTLINE
DWW0016A
SOIC - 2.65 mm max height
SCALE 1.000
PLASTIC SMALL OUTLINE
C
17.4
17.1
A
SEATING PLANE
0.1 C
PIN 1 ID AREA
14X 1.27
16
1
10.4
10.2
NOTE 3
2X
8.89
8
9
16X
14.1
13.9
NOTE 4
B
0.25
0.51
0.31
A B
(2.286)
C
2.65 MAX
0.28
TYP
0.22
SEE DETAIL A
(1.625)
0.25
GAGE PLANE
0.3
0.1
1.1
0.6
0 -8
DETAIL A
TYPICAL
4221501/A 11/2014
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0,15 mm per side.
4. This dimension does not include interlead flash.
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SLLSEO2B – JULY 2015 – REVISED JUNE 2016
EXAMPLE BOARD LAYOUT
DWW0016A
SOIC - 2.65 mm max height
PLASTIC SMALL OUTLINE
16X (2)
16X (1.875)
(14.25)
(14.5)
16X (0.6)
16X (0.6)
1
1
16
16
SYMM
SYMM
14X
(1.27)
9
8
SYMM
14X
(1.27)
9
8
SYMM
(16.375)
(16.25)
LAND PATTERN EXAMPLE
LAND PATTERN EXAMPLE
STANDARD
SCALE:3X
PCB CLEARANCE & CREEPAGE OPTIMIZED
SCALE:3X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4221501/A 11/2014
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DWW0016A
SOIC - 2.65 mm max height
PLASTIC SMALL OUTLINE
16X (2)
SYMM
1
16
16X (0.6)
SYMM
14X (1.27)
9
8
(16.25)
SOLDER PASTE EXAMPLE
STANDARD
BASED ON 0.125 mm THICK STENCIL
SCALE:4X
16X (1.875)
SYMM
1
16
16X (0.6)
SYMM
14X (1.27)
9
8
(16.375)
SOLDER PASTE EXAMPLE
PCB CLEARANCE & CREEPAGE OPTIMIZED
BASED ON 0.125 mm THICK STENCIL
SCALE:4X
4221501/A 11/2014
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
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PACKAGE OPTION ADDENDUM
www.ti.com
14-Jun-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ISO7830DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
ISO7830
ISO7830DWR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
ISO7830
ISO7830DWW
PREVIEW
SOIC
DWW
16
45
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
ISO7830
ISO7830DWWR
PREVIEW
SOIC
DWW
16
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
ISO7830
ISO7830FDW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
ISO7830F
ISO7830FDWR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
ISO7830F
ISO7830FDWW
PREVIEW
SOIC
DWW
16
45
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
ISO7830F
ISO7830FDWWR
PREVIEW
SOIC
DWW
16
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
ISO7830F
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
14-Jun-2016
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Mar-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ISO7830DWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
ISO7830FDWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Mar-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ISO7830DWR
SOIC
DW
16
2000
367.0
367.0
38.0
ISO7830FDWR
SOIC
DW
16
2000
367.0
367.0
38.0
Pack Materials-Page 2
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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Products
Applications
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www.ti.com/audio
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www.ti.com/automotive
Amplifiers
amplifier.ti.com
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Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
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Logic
logic.ti.com
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Microcontrollers
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Video and Imaging
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RFID
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OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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