TI ONET8501PRGTRG4 11.3-gbps rate-selectable limiting amplifier Datasheet

ONET8501P
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SLLS885 – FEBRUARY 2008
11.3-Gbps RATE-SELECTABLE LIMITING AMPLIFIER
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
Up to 11.3-Gbps Operation
2-Wire Digital Interface
Digitally Selectable Input Bandwidth
Adjustable LOS Threshold
Digitally Selectable Output Voltage
Digitally Selectable Output Pre-Emphasis
Adjustable Input Threshold Voltage
Low Power Consumption
Input Offset Cancellation
CML Data Outputs with On-Chip 50-Ω
Back-Termination to VCC
Single +3.3-V Supply
•
•
Output Disable
Surface Mount Small Footprint 3 mm × 3 mm
16-Pin RoHS compliant QFN Package
APPLICATIONS
•
•
•
•
•
•
10-Gigabit Ethernet Optical Receivers
8x and 10x Fiber Channel Optical Receivers
SONET OC-192/SDH-64 Optical Receivers
SFP+ and XFP Transceiver Modules
XENPAK, XPAK, X2 and 300-pin MSA
Transponder Modules
Cable Driver and Receiver
DESCRIPTION
The ONET8501P is a high-speed, 3.3-V limiting amplifier for multiple fiber optic and copper cable applications
with data rates from 2 Gbps up to 11.3 Gbps.
The device provides a two-wire serial interface which allows digital control of the bandwidth, output amplitude,
output pre-emphasis, input threshold voltage (slice level) and the loss of signal assert level. Predetermined
settings for bandwidth and LOS assert levels can also be selected with external rate selection pins.
The ONET8501P provides a gain of about 40dB which ensures a fully differential output swing for input signals
as low as 10 mVpp. The output amplitude can be adjusted to 300 mVpp, 600 mVpp, or 900 mVpp. To compensate
for frequency dependent loss of microstrips or striplines connected to the output of the device, programmable
pre-emphasis is included in the output stage. A settable loss of signal detection and output disable are also
provided.
The part, available in RoHS compliant small footprint 3 mm × 3 mm 16-pin QFN package, typically dissipates
less than 160 mW and is characterized for operation from –40°C to 100°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
ONET8501P
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
BLOCK DIAGRAM
A simplified block diagram of the ONET8501P is shown in Figure 1.
This compact, low power 11.3 Gbps limiting amplifier consists of a high-speed data path with offset cancellation
block (DC feedback) combined with an analog settable input threshold adjust, a loss of signal detection block
using 2 peak detectors, a two-wire interface with a control-logic block and a bandgap voltage reference and bias
current generation block.
COC1
COC2
VCC
GND
Offset
Cancellation
Input Buffer
with
Selectable
Bandwidth
VCC
Gain Stage
Gain Stage
Output
Buffer
50 W 50 W
DOUT+
DIN+
100 W
DOUT-
DIN-
LOS
LOS
Detection
SDA
SDA
SCK
SCK
DIS
DIS
RATE0
RATE0
RATE1
RATE1
4 Bit
8 Bit Register
4 Bit
2 Bit
4 Bit+ Select
4 Bit+ Select
4 Bit+ Select
4 Bit+ Select
7 Bit+ Select
7 Bit+ Select
7 Bit+ Select
7 Bit+ Select
4 Bit
7 Bit
Settings
Input Threshold
Pre-Emphasis
Amplitude
RSA
RSB
RSC
RSD
LOSA
LOSB
LOSC
LOSD
SELRATE
SELLOS
Bandgap Voltage
Reference and
Bias Current
Generation
Power-On
Reset
2-Wire Interface&
Control Logic
Figure 1. Simplified Block Diagram of the ONET8501P
2
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PACKAGE
SDA
SCK
RA TE0
RA TE1
The ONET8501P is available in a small footprint 3 mm × 3 mm 16-pin RoHS compliant QFN package with a lead
pitch of 0,5 mm. The pin out is shown in Figure 2.
16
15
14
13
12 VCC
GND 1
ONET
8501P
DIN + 2
11 DOUT +
10 DOUT -
DIN - 3
16 Pin QFN
GND 4
5
6
7
8
COC1
COC2
DIS
L OS
9
VCC
Figure 2. Pinout of ONET8501P in a 3mm × 3mm 16-Pin QFN package (top view)
PIN DESCRIPTION
NO.
NAME
TYPE
DESCRIPTION
1,4, EP
GND
Supply
Circuit ground. Exposed die pad (EP) must be grounded.
2
DIN+
Analog-input
Non-inverted data input. Differentially 100 Ω terminated to DIN–.
3
DIN–
Analog-input
Inverted data input. Differentially 100 Ω terminated to DIN+.
5
COC1
Analog
Offset cancellation filter capacitor plus terminal. An external capacitor can be connected
between this pin and COC2 to reduce the low frequency cutoff. To disable the offset
cancellation loop, connect COC1 and COC2 together.
6
COC2
Analog
Offset cancellation filter capacitor minus terminal. An external capacitor can be connected
between this pin and COC1 to reduce the low frequency cutoff. To disable the offset
cancellation loop, connect COC1 and COC2 together.
7
DIS
Digital-input
Disables the output stage when set to a high level.
8
LOS
Open drain MOS
High level indicates that the input signal amplitude is below the programmed threshold
level. Open drain output. Requires an external 10-kΩ pull-up resistor to VCC for proper
operation.
9, 12
VCC
Supply
3.3-V ± 10% supply voltage.
10
DOUT–
CML-out
Inverted data output. On-chip 50 Ω back-terminated to VCC.
11
DOUT+
CML-out
Non-inverted data output. On-chip 50 Ω back-terminated to VCC.
13
RATE1
Digital-input
Bandwidth selection for noise suppression.
14
RATE0
Digital-input
Bandwidth selection for noise suppression.
15
SCK
Digital-input
Serial interface clock input. Connect a pull-up resistor (10 kΩ typical) to VCC.
16
SDA
Digital-input
Serial interface data input. Connect a pull-up resistor (10 kΩ typical) to VCC.
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ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
VCC
Supply voltage (2)
–0.3 to 4.0
V
VDIN+, VDIN–
Voltage at DIN+, DIN– (2)
0.5 to 4.0
V
VLOS, VCOC1, VCOC2, VDOUT+, VDOUT–, VDIS,
VRATE0, VRATE1, VSDA, VSCK
Voltage at LOS, COC1, COC2, DOUT+, DOUT–, DIS,
RATE0, RATE1, SDA, SCK (2)
–0.3 to 4.0
V
VDIN,DIFF
Differential voltage between DIN+ and DIN–
±2.5
V
IDIN+, IDIN–, IDOUT+, IDOUT–
Continuous current at inputs and outputs
25
mA
ESD
ESD rating at all pins
2
kV (HBM)
TJ,max
Maximum junction temperature
125
°C
TA
Characterized free-air operating temperature range
–40 to 100
°C
TSTG
Storage temperature range
–65 to 150
°C
TLEAD
Lead temperature 1.6mm (1/16 inch) from case for 10
seconds
260
°C
(1)
(2)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Device exposure to conditions outside the Absolute Maximum Ratings ranges for an extended duration can
affect device reliability.
All voltage values are with respect to network ground terminal.
RECOMMENDED OPERATING CONDITIONS
MIN
TYP
MAX
VCC
Supply voltage
2.95
3.3
3.6
UNIT
V
TA
Operating free-air temperature
–40
100
°C
DIGITAL input high voltage
2.0
V
DIGITAL input low voltage
0.8
V
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions, outputs connected to a 50-Ω load, AMP1 = 0, AMP0 = 1 (Register 3) unless
otherwise noted. Typical operating condition is at VCC = 3.3 V and TA = 25°C
PARAMETER
TEST CONDITIONS
VCC
Supply voltage
IVCC
Supply current
DIS = 0, CML currents included
RIN
Data input resistance
Differential
ROUT
Data output resistance
Single-ended, referenced to VCC
LOS HIGH voltage
ISOURCE = 50 µA with 10 kΩ pull-up to VCC
LOS LOW voltage
ISINK = 10 mA with 10 kΩ pull-up to VCC
4
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MIN
TYP
MAX
2.95
3.3
3.6
UNIT
V
48
61
mA
100
Ω
50
Ω
2.4
0.4
V
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AC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions, outputs connected to a 50-Ω load, AMP1 = 0, AMP0 = 1 (Register 3) and maximum
bandwidth unless otherwise noted. Typical operating condition is at VCC = 3.3 V and TA = +25°C
PARAMETER
f3dB-H
High frequency -3dB bandwidth
f3dB-H
–3dB bandwidth default settings
TEST CONDITION
MIN
TYP
8.5
12.0
GHz
RATE1 = 1, RATE0 = 0
11.0
GHz
RATE1 = 1, RATE0 = 1
6.5
RATE1 = 0, RATE0 = 1
4.0
RATE1 = 0, RATE0 = 0
2.2
20
45
kHz
6
9
mVpp
8
20
f3dB-L
Low frequency –3dB bandwidth
With 330-pF COC capacitor
vIN,MIN
Data input sensitivity
K28.5 pattern at 11.3 Gbps, BER < 10–12
VOD-min ≥ 0.95 * VOD (output limited)
K28.5 pattern at 8.5 Gbps, BER < 10–12, RATE1 = 1, RATE0 = 0
K28.5 pattern at 2.125 Gbps, BER < 10
SDD11
Differential input return gain
5
5
, RATE1 = 0, RATE0 = 1
0.01 GHz < f < 3.9 GHz
-16
3.9 GHz < f < 12.1 GHz
SDD22
Differential output return gain
UNIT
5.5
K28.5 pattern at 4.25 Gbps, BER < 10–12, RATE1 = 1, RATE0 = 1
–12
MAX
See
dB
(1)
0.01 GHz < f < 3.9 GHz
–16
3.9 GHz < f < 12.1 GHz
See (1)
dB
SCD11
Differential to common mode
conversion gain
0.01 GHz < f < 12.1 GHz
–40
dB
SCC22
Common mode output return gain
0.01 GHz < f < 7.5 GHz
–13
dB
7.5 GHz < f < 12.1 GHz
–9
A
Small signal gain
vIN,MAX
Data input overload
DJ
Deterministic jitter at 11.3 Gbps
35
40
dB
2000
mVpp
vIN = 5 mVpp, K28.5 pattern
5
10
vIN = 20 mVpp, K28.5 pattern
4
10
vIN = 2000 mVpp, K28.5 pattern
5
15
Deterministic jitter at 8.5 Gbps
vIN = 20 mVpp, K28.5 pattern, RATE1 = 1, RATE0 = 0
5
pspp
Deterministic jitter at 4.25 Gbps
vIN = 20 mVpp, K28.5 pattern, RATE1 = 1, RATE0 = 1
6
pspp
Deterministic jitter at 2.125 Gbps
vIN = 20 mVpp, K28.5 pattern, RATE1 = 0, RATE0 = 1
10
pspp
RJ
Random jitter
vIN = 20 mVpp
1
psrms
VOD
Differential data output voltage
vIN > 20 mVpp, DIS = 0, AMP1 = 0, AMP0 = 0
250
300
350
vIN > 20 mVpp, DIS = 0, AMP1 = 0, AMP0 = 1
500
600
700
vIN > 20 mVpp, DIS = 0, AMP1 = 1, AMP0 = 1
700
900
1100
DIS = 1
5
mVpp
mVrms
VPREEM
Output pre-emphasis step size
tR
Output rise time
20% to 80%, vIN > 20mVpp
25
35
tF
Output fall time
20% to 80%, vIN > 20mVpp
25
35
VTH
LOW LOS assert threshold range
min
K28.5 pattern at 11.3 Gbps, LOSRNG = 0
15
LOW LOS assert threshold range
max
K28.5 pattern at 11.3 Gbps, LOSRNG = 0
35
HIGH LOS assert threshold range
min
K28.5 pattern at 11.3 Gbps, LOSRNG = 1
35
HIGH LOS assert threshold range
max
K28.5 pattern at 11.3 Gbps, LOSRNG = 1
80
LOS threshold variation
Versus temperature at 11.3 Gbps
1.5
dB
1
dB
VTH
1
pspp
Versus supply voltage VCC at 11.3 Gbps
Versus data rate
LOS hysteresis (electrical)
dB
ps
mVpp
mVpp
1.5
K28.5 pattern at 11.3 Gbps
ps
dB
2
4
6
dB
TLOS_AST
LOS assert time
2.5
10
80
us
TLOS_DEA
LOS deassert time
2.5
10
80
us
(1)
Differential return gain given by SDD11, SDD22 = –11.6 + 13.33 log10(f/8.25), f expressed in GHz.
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AC ELECTRICAL CHARACTERISTICS (continued)
Over recommended operating conditions, outputs connected to a 50-Ω load, AMP1 = 0, AMP0 = 1 (Register 3) and maximum
bandwidth unless otherwise noted. Typical operating condition is at VCC = 3.3 V and TA = +25°C
PARAMETER
TDIS
TEST CONDITION
MIN
TYP
Disable response time
MAX
UNIT
20
ns
DETAILED DESCRIPTION
HIGH-SPEED DATA PATH
The high-speed data signal is applied to the data path by means of input signal pins DIN+/DIN–. The data path
consists of a 100-Ω differential on-chip line termination resistor followed by a digitally controlled bandwidth switch
input buffer for rate select. The RATE1 and RATE0 pins can be used to control the bandwidth of the filter.
Default bandwidth settings are used; however, these can be changed using registers 4 through 7 via the serial
interface. For details regarding the rate selection, see Table 19. A gain stage and an output buffer stage follow
the input buffer, which together provide a gain of 40dB. The device can accept input amplitude levels from 5
mVpp up to 2000 mVpp. The amplified data output signal is available at the output pins DOUT+/DOUT– which
include on-chip 2 × 50-Ω back-termination to VCC.
Offset cancellation compensates for internal offset voltages and thus ensures proper operation even for very
small input data signals. The offset cancellation can be disabled so that the input threshold voltage can be
adjusted to optimize the bit error rate or change the eye crossing to compensate for input signal pulse width
distortion. The offset cancellation can be disabled by setting OCDIS = 1 (bit 1 of register 0). The input threshold
level can be adjusted using register settings THADJ[0..7] (register 1). For details regarding input threshold adjust,
see Table 19.
The low frequency cutoff is as low as 80 kHz with the built-in filter capacitor. For applications, which require even
lower cutoff frequencies, an additional external filter capacitor may be connected to the COC1 and COC2 pins. A
value of 330 pF results in a low frequency cutoff of 20 kHz.
BANDGAP VOLTAGE AND BIAS GENERATION
The ONET8501P limiting amplifier is supplied by a single +3.3-V supply voltage connected to the VCC pins. This
voltage is referred to ground (GND).
On-chip bandgap voltage circuitry generates a reference voltage, independent of supply voltage, from which all
other internally required voltages and bias currents are derived.
HIGH-SPEED OUTPUT BUFFER
The output amplitude of the buffer can be set to 300 mVpp, 600 mVpp or 900 mVpp using register settings
AMP[0..1] (register 3) via the serial interface. To compensate for frequency dependant losses of transmission
lines connected to the output, the ONET8501P has adjustable pre-emphasis of the output stage. The
pre-emphasis can be set from 0 to 8 dB in 1 dB steps using register settings PEADJ[0..3] (register 2).
RATE SELECT
There are 16 possible internal filter settings (4 bit) to adjust the small signal bandwidth to the data rate. For fast
rate selection, 4 default values can be selected with the RATE1 and RATE0 pins. Using the serial interface, the
bandwidth settings can be customized instead of using the default values. The default bandwidths and the
registers used to change the bandwidth settings are shown in Table 1.
Table 1. Rate Selection Default Settings and Registers Used for Adjustment
6
RATE1
RATE0
DEFAULT BANDWIDTH
(GHz)
REGISTER USED FOR ADJUSTMENT
0
0
2.2
RSA (Register 4)
0
1
4.0
RSB (Register 5)
1
1
6.5
RSC (Register 6)
1
0
11.0
RSD (Register 7)
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If the rate select register selection bit is set LOW, for example RSASEL = 0 (bit 7 of register 4), then the default
bandwidth for that register is used. If the register selection bit is set HIGH, for example RSASEL = 1 (bit 7 of
register 4), then the content of RSA[0..3] (register 4) is used to set the input filter bandwidth when RATE0 = 0
and RATE1 = 0. The settings of the rate selection registers RSA, RSB, RSC and RSD and the corresponding
filter bandwidths are shown in Table 2.
Table 2. Available Bandwidth Settings
RSX3
RSX2
RSX1
RSX0
TYPICAL
BANDWIDTH
(GHz)
0
0
0
0
12.0
0
0
0
1
11.5
0
0
1
0
11.0
0
0
1
1
10.0
0
1
0
0
8.6
0
1
0
1
6.5
0
1
1
0
5.2
0
1
1
1
4.3
1
0
0
0
4.0
1
0
0
1
3.7
1
0
1
0
3.3
1
0
1
1
2.9
1
1
0
0
2.7
1
1
0
1
2.5
1
1
1
0
2.3
1
1
1
1
2.2
The RATE1 and RATE0 pins do not have to be used if the serial interface is being used. If RATE1 is not
connected it is internally pulled HIGH and if RATE0 is not connected it is internally pulled LOW, thus selecting
register 7. Therefore, changing the contents of RSD[0..3] (register 7) through the serial interface can be used to
adjust the bandwidth.
LOSS OF SIGNAL DETECTION
The loss of signal detection is done by 2 separate level detectors to cover a wide dynamic range. The peak
values of the input signal and the output signal of the gain stage are monitored by the peak detectors. The peak
values are compared to a pre-defined loss of signal threshold voltage inside the loss of signal detection block. As
a result of the comparison, the LOS signal, which indicates that the input signal amplitude is below the defined
threshold level, is generated. The LOS assert level is settable through the serial interface. There are 2 LOS
ranges settable with the LOSRNG bit (bit 2, register 0) via the serial interface. By setting the bit LOSRNG = 1,
the high range of the LOS assert values are used (35 mVpp to 80 mVpp) and by setting the bit LOSRNG = 0, the
low range of the LOS assert values are used (15 mVpp to 35 mVpp).
There are 128 possible internal LOS settings (7 bit) for each LOS range to adjust the LOS assert level. For fast
LOS selection, 4 default values can be selected with the RATE1 and RATE0 pins; however, the LOS settings
can be customized instead of using the default values. The default LOS assert levels and the registers used to
change the LOS settings are shown in Table 3.
Table 3. LOS Assert Level Default Settings and Registers Used for Adjustment
RATE1
RATE0
DEFAULT LOS ASSERT LEVEL
(mVpp)
REGISTER USED FOR
ADJUSTMENT
0
0
15
LOSA (Register 8)
0
1
18
LOSB (Register 9)
1
1
26
LOSC (Register 10)
1
0
26
LOSD (Register 11)
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If the LOS register selection bit is set LOW, for example LOSASEL = 0 (bit 7, register 8), then the default LOS
assert level for that register is used. If the register selection bit is set HIGH, for example LOSASEL = 1 (bit 7,
register 8), then the content of LOSA[0..6] (register 8) is used to set the LOS assert level when RATE1 = 0 and
RATE0 = 0. The RATE1 and RATE0 pins do not have to be used if the serial interface is being used. If RATE1 is
not connected it is internally pulled HIGH and if RATE0 is not connected it is internally pulled LOW, thus
selecting register 11. Therefore, changing the contents of LOSD[0..6] (register 11) through the serial interface
can be used to adjust the LOS assert level.
2-WIRE INTERFACE AND CONTROL LOGIC
The ONET8501P uses a 2-wire serial interface for digital control. The two circuit inputs, SDA and SCK, are
driven, respectively, by the serial data and serial clock from a microcontroller, for example. Both inputs include
100-kΩ pull-up resistors to VCC. For driving these inputs, an open drain output is recommended.
The 2-wire interface allows write access to the internal memory map to modify control registers and read access
to read out control and status signals. The ONET8501P is a slave device only which means that it can not initiate
a transmission itself; it always relies on the availability of the SCK signal for the duration of the transmission. The
master device provides the clock signal as well as the START and STOP commands. The protocol for a data
transmission is as follows:
1. START command
2. 7-bit slave address (1000100) followed by an eighth bit which is the data direction bit (R/W). A zero indicates
a WRITE and a 1 indicates a READ.
3. 8-bit register address
4. 8-bit register data word
5. STOP command
Regarding timing, the ONET8501P is I2C compatible. The typical timing is shown in Figure 3 and a complete
data transfer is shown in Figure 4. Parameters for Figure 3 are defined in Table 4.
Bus Idle: Both SDA and SCK lines remain HIGH
Start Data Transfer: A change in the state of the SDA line, from HIGH to LOW, while the SCK line is HIGH,
defines a START condition (S). Each data transfer begins with a START condition.
Stop Data Transfer: A change in the state of the SDA line from LOW to HIGH while the SCK line is HIGH
defines a STOP condition (P). Each data transfer ends with a STOP condition; however, if the master still wishes
to communicate on the bus, it can generate a repeated START condition and address another slave without first
generating a STOP condition.
Data Transfer: Only one data byte can be transferred between a START and a STOP condition. The receiver
acknowledges the transfer of data.
Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledgment bit. The
transmitter releases the SDA line and a device that acknowledges, must pull down the SDA line during the
acknowledge clock pulse simultaneously so the SDA line is stable LOW during the HIGH period of the
acknowledge clock pulse. Set-up and hold times must be taken into account. When a slave-receiver fails to
acknowledge the slave address, the data line must be left HIGH by the slave. The master can generate a STOP
condition to prevent the transfer. If the slave-receiver does acknowledge the slave address but some time later in
the transfer cannot receive any more data bytes, the master must cancel the transfer. This is indicated by the
slave generating the not acknowledge on the first following byte. The slave leaves the data line HIGH and the
master generates the STOP condition.
8
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SDA
tBUF
tLOW
tr
tHIGH
tf
tHDSTA
SCK
tHDSTA
tSUDAT
tHDSTA
P
tSUSTO
tSUSTA
S
S
P
T0295-01
2
Figure 3. I C Timing Diagram
Table 4. Timing Diagram Definitions
PARAMETER
MIN
MAX
UNIT
400
kHz
fSCK
SCK clock frequency
tBUF
Bus free time between START and STOP conditions
1.3
µs
tHDSTA
Hold time after repeated START condition. After this period, the first clock pulse is generated
0.6
µs
tLOW
Low period of the SCK clock
1.3
µs
tHIGH
High period of the SCK clock
0.6
µs
tSUSTA
Setup time for a repeated START condition
0.6
µs
tHDDAT
Data HOLD time
0
µs
tSUDAT
Data setup time
tR
Rise time of both SDA and SCK signals
300
ns
tF
Fall time of both SDA and SCK signals
300
ns
tSUSTO
Setup time for STOP condition
100
ns
µs
0.6
SDA
SCK
S
1–7
8
9
SLAVE
ADDRESS
R/W
ACK
8
1–7
REGISTER
ADDRESS
9
ACK
1–7
8
REGISTER
FUNCTION
9
ACK
P
T0296-01
2
Figure 4. I C Data Transfer
REGISTER MAPPING
The register mapping for read/write register addresses 0 (0x00) through 11 (0x0B) are shown in Table 5 through
Table 16. The register mapping for the read only register addresses 14 (0x0E) and 15 (0x0F) are shown in
Table 17 and Table 18.
Table 19 describes the circuit functionality based on the register settings.
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Table 5. Register 0 (0x00) Mapping – Control Settings
register address 0 (0x00)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
–
–
–
–
DIS
LOSRNG
OCDIS
I2CDIS
Table 6. Register 1 (0x01) Mapping – Input Threshold Adjust
register address 1 (0x01)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
THADJ7
THADJ6
THADJ5
THADJ4
THADJ3
THADJ2
THADJ1
THADJ0
Table 7. Register 2 (0x02) Mapping – Pre-emphasis Adjust
register address 2 (0x02)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
–
–
–
–
PEADJ3
PEADJ2
PEADJ1
PEADJ0
Table 8. Register 3 (0x03) Mapping – Output Amplitude Adjust
register address 3 (0x03)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
–
–
–
–
–
–
AMP1
AMP0
Table 9. Register 4 (0x04) Mapping – Rate Selection Register A
register address 4 (0x04)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
RSASEL
–
–
–
RSA3
RSA2
RSA1
RSA0
Table 10. Register 5 (0x05) Mapping – Rate Selection Register B
register address 5 (0x05)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
RSBSEL
–
–
–
RSB3
RSB2
RSB1
RSB0
Table 11. Register 6 (0x06) Mapping – Rate Selection Register C
register address 6 (0x06)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
RSCSEL
–
–
–
RSC3
RSC2
RSC1
RSC0
Table 12. Register 7 (0x07) Mapping – Rate Selection Register D
register address 7 (0x07)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
RSDSEL
–
–
–
RSD3
RSD2
RSD1
RSD0
Table 13. Register 8 (0x08) Mapping – LOS Assert Level Register A
register address 8 (0x08)
10
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
LOSASEL
LOSA6
LOSA5
LOSA4
LOSA3
LOSA2
LOSA1
LOSA0
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Table 14. Register 9 (0x09) Mapping – LOS Assert Level Register B
register address 9 (0x09)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
LOSBSEL
LOSB6
LOSB5
LOSB4
LOSB3
LOSB2
LOSB1
LOSB0
Table 15. Register 10 (0x0A) Mapping – LOS Assert Level Register C
register address 10 (0x0A)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
LOSCSEL
LOSC6
LOSC5
LOSC4
LOSC3
LOSC2
LOSC1
LOSC0
Table 16. Register 11 (0x0B) Mapping – LOS Assert Level Register D
register address 11 (0x0B)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
LOSDSEL
LOSD6
LOSD5
LOSD4
LOSD3
LOSD2
LOSD1
LOSD0
Table 17. Register 14 (0x0E) Mapping – Selected Rate Setting (Read Only)
register address 14 (0x0E)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
–
–
–
–
SELRATE3
SELRATE2
SELRATE1
SELRATE0
Table 18. Register 15 (0x0F) Mapping – Selected LOS Level (Read Only)
register address 15 (0x0F)
bit 7
bit 6
bit 5
bit4
bit 3
bit 2
bit 1
bit 0
–
SELLOS6
SELLOS5
SELLOS4
SELLOS3
SELLOS2
SELLOS1
SELLOS0
Table 19. Register Functionality
SYMBOL
REGISTER BIT
FUNCTION
DIS
Output disable bit 3
Output disable bit:
1 = output disabled
0 = output enabled
LOSRNG
LOS Range bit 2
LOS range bit:
1 = high LOS assert voltage range
0 = low LOS assert voltage range
OCDIS
Offset cancellation disable bit 1
Offset cancellation disable bit:
1 = offset cancellation is disabled
0 = offset cancellation is enabled
I2CDIS
I2C disable bit 0
I2C disable bit:
1 = I2C is disabled.
0 = I2C is enabled. This is the default setting.
THADJ7
Input threshold adjust bit 7 (MSB)
Input threshold adjustment setting:
THADJ6
Input threshold adjust bit 6
Maximum positive sift for 00000001 (1)
THADJ5
Input threshold adjust bit 5
Minimum positive shift for 01111111 (127)
THADJ4
Input threshold adjust bit 4
Zero shift for 10000000 (128)
THADJ3
Input threshold adjust bit 3
Minimum negative shift for 10000001 (129)
THADJ2
Input threshold adjust bit 2
Maximum negative shift for 11111111 (255)
THADJ1
Input threshold adjust bit 1
THADJ0
Input threshold adjust bit 0 (LSB)
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Table 19. Register Functionality (continued)
SYMBOL
REGISTER BIT
FUNCTION
PEADJ3
Pre-emphasis adjust bit 3 (MSB)
PEADJ2
Pre-emphasis adjust bit 2
Pre-emphasis setting:
Pre-emphasis (dB)
Register Setting
PEADJ1
Pre-emphasis adjust bit 1
0
0000
PEADJ0
Pre-emphasis adjust bit 0 (LSB)
1
0001
2
0011
3
0100
4
0101
5
0111
6
1100
7
1101
8
1111
AMP1
Output amplitude adjustment bit 1
Output amplitude adjustment:
AMP0
Output amplitude adjustment bit 0
00 = 300 mVpp
01 = 600 mVpp
10 = 600 mVpp
11 = 900 mVpp
RSASEL
Register RSA select bit 7 (MSB)
–
RSASEL = 1
–
Content of register A bits 3 to 0 is used to select the input filter BW
–
RSASEL = 0
RSA3
Rate select register A bit 3
RSA2
Rate select register A bit 2
RSA1
Rate select register A bit 1
RSA0
Rate select register A bit 0 (LSB)
RSBSEL
Register RSA select bit 7 (MSB)
–
Default BW of 2.2 GHz is used
Register RSA is used when RATE1 = 0 and RATE0 = 0
Rate selection register B
RSBSEL = 1
–
Content of register B bits 3 to 0 is used to select the input filter BW
–
RSBSEL = 0
RSB3
Rate select register B bit 3
RSB2
Rate select register B bit 2
RSB1
Rate select register B bit 1
RSB0
Rate select register B bit 0 (LSB)
RSCSEL
Register RSA select bit 7 (MSB)
–
Default BW of 4.0 GHz is used
Register RSB is used when RATE1 = 0 and RATE0 = 1
Rate selection register C
RSCSEL = 1
–
Content of register C bits 3 to 0 is used to select the input filter BW
–
RSCSEL = 0
RSC3
Rate select register C bit 3
RSC2
Rate select register C bit 2
RSC1
Rate select register C bit 1
RSC0
Rate select register C bit 0 (LSB)
12
Rate selection register A
Default BW of 6.5GHz is used
Register RSC is used when RATE1 = 1 and RATE0 = 1
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Table 19. Register Functionality (continued)
SYMBOL
RSDSEL
REGISTER BIT
FUNCTION
Register RSD select bit 7 (MSB)
Rate selection register D
–
RSDSEL = 1
–
Content of register D bits 3 to 0 is used to select the input filter BW
–
RSDSEL = 0
RSD3
Rate select register D bit 3
RSD2
Rate select register D bit 2
Default BW of 11.0 GHz is used
RSD1
Rate select register D bit 1
RSD0
Rate select register D bit 0 (LSB)
LOSASEL
Register LOSA select bit 7 (MSB)
LOS assert level register A
LOSA6
LOS assert level register A bit 6
LOSASEL = 1
LOSA5
LOS assert level register A bit 5
Content of register A bits 6 to 0 is used to select the LOS assert level
LOSA4
LOS assert level register A bit 4
Minimum LOS assert level for 0000000
LOSA3
LOS assert level register A bit 3
Maximum LOS assert level for 1111111
LOSA2
LOS assert level register A bit 2
LOSA1
LOS assert level register A bit 1
LOSA0
LOS assert level register A bit 0 (LSB)
Register LOSA is used when RATE1 = 0 and RATE0 = 0
LOSBSEL
Register LOSB select bit 7 (MSB)
LOS assert level register B
LOSB6
LOS assert level register B bit 6
LOSBSEL = 1
LOSB5
LOS assert level register B bit 5
Content of register B bits 6 to 0 is used to select the LOS assert level
LOSB4
LOS assert level register B bit 4
Minimum LOS assert level for 0000000
LOSB3
LOS assert level register B bit 3
LOSB2
LOS assert level register B bit 2
LOSB1
LOS assert level register B bit 1
LOSB0
LOS assert level register B bit 0 (LSB)
Register LOSB is used when RATE1 = 0 and RATE0 = 1
LOSCSEL
Register LOSC select bit 7 (MSB)
LOS assert level register C
LOSC6
LOS assert level register C bit 6
LOSCSEL = 1
LOSC5
LOS assert level register C bit 5
Content of register C bits 6 to 0 is used to select the LOS assert level
LOSC4
LOS assert level register C bit 4
Minimum LOS assert level for 0000000
LOSC3
LOS assert level register C bit 3
Maximum LOS assert level for 1111111
LOSC2
LOS assert level register C bit 2
LOSC1
LOS assert level register C bit 1
LOSC0
LOS assert level register C bit 0 (LSB)
Register LOSC is used when RATE1 = 1 and RATE0 = 1
LOSDSEL
Register LOSD select bit 7 (MSB)
LOS assert level register D
LOSD6
LOS assert level register D bit 6
LOSDSEL = 1
LOSD5
LOS assert level register D bit 5
Content of register D bits 6 to 0 is used to select the LOS assert level
LOSD4
LOS assert level register D bit 4
Minimum LOS assert level for 0000000
LOSD3
LOS assert level register D bit 3
LOSD2
LOS assert level register D bit 2
LOSD1
LOS assert level register D bit 1
LOSD0
LOS assert level register D bit 0 (LSB)
Register LOSD is used when RATE1 = 1 and RATE0 = 0 or RATE1 and RATE0
are not connected
SELRATE3
Selected rate setting bit 3
Selected rate setting (read only)
SELRATE2
Selected rate setting bit 2
SELRATE1
Selected rate setting bit 1
SELRATE0
Selected rate setting bit 0
Register RSD is used when RATE1 = 1 and RATE0 = 0 or RATE1 and RATE0 are
not connected
LOSASEL = 0
Default LOS assert level of 15 mVpp is used
Maximum LOS assert level for 1111111
LOSBSEL = 0
Default LOS assert level of 18 mVpp is used
LOSCSEL = 0
Default LOS assert level of 26 mVpp is used
Maximum LOS assert level for 1111111
LOSDSEL = 0
Default LOS assert level of 26 mVpp is used
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Table 19. Register Functionality (continued)
SYMBOL
REGISTER BIT
FUNCTION
SELLOS6
Selected LOS assert level bit 6 (MSB)
SELLOS5
Selected LOS assert level bit 5
SELLOS4
Selected LOS assert level bit 4
SELLOS3
Selected LOS assert level bit 3
SELLOS2
Selected LOS assert level bit 2
SELLOS1
Selected LOS assert level bit 1
SELLOS0
Selected LOS assert level bit 0 (LSB)
Selected LOS assert level (read only)
TYPICAL OPERATION CHARACTERISTICS
Typical operating condition is at VCC = 3.3 V, TA = 25°C, AMP1 = 0, AMP0 = 1 (Register 3) and maximum bandwidth unless
otherwise noted.
BANDWIDTH
vs
REGISTER SETTING
FREQUENCY RESPONSE
15
50
14
45
13
40
12
11
Bandwidth - GHz
SDD21 - dB
35
30
25
20
15
10
9
8
7
6
5
4
10
3
2
5
1
0
0
1
10
f - Frequency - GHz
100
0
0
1
2
Figure 5.
14
3
4 5 6 7 8 9 10 11 12 13 14 15
Register Setting - Decimal
Figure 6.
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TYPICAL OPERATION CHARACTERISTICS (continued)
Typical operating condition is at VCC = 3.3 V, TA = 25°C, AMP1 = 0, AMP0 = 1 (Register 3) and maximum bandwidth unless
otherwise noted.
DIFFERENTIAL INPUT RETURN GAIN
vs
FREQUENCY
TRANSFER FUNCTION
0
800
-5
-10
600
-15
500
SDD11 - dB
VOD - Output Voltage - mVPP
700
400
300
-20
-25
-30
-35
200
-40
100
0
0
-45
20
40
60
80
VIN - Input Voltage - mVPP
-50
0.1
100
1
10
f - Frequency - GHz
Figure 7.
Figure 8.
DIFFERENTIAL OUTPUT RETURN GAIN
vs
FREQUENCY
BIT-ERROR RATIO
vs
INPUT VOLTAGE (11.3GBPS)
100
0
-5
1E-4
-10
Bit-Error Ratio
SDD22 - dB
-15
-20
-25
-30
-35
1E-7
1E-10
-40
-45
-50
0.1
1E-13
1
10
f - Frequency - GHz
100
0
Figure 9.
1
2
3
4
VIN - Input Voltage - mVPP
5
Figure 10.
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TYPICAL OPERATION CHARACTERISTICS (continued)
Typical operating condition is at VCC = 3.3 V, TA = 25°C, AMP1 = 0, AMP0 = 1 (Register 3) and maximum bandwidth unless
otherwise noted.
DETERMINISTIC JITTER
vs
INPUT VOLTAGE
RANDOM JITTER
vs
INPUT VOLTAGE
10
3.2
9
2.8
2.4
Random Jitter - psRMS
Deterministic Jitter - psPP
8
7
6
5
4
3
2
1.6
1.2
0.8
2
0.4
1
0
0
0
200 400 600 800 10001200 1400 16001800 2000
VIN - Input Voltage - mVPP
0
10
20
30 40 50 60 70 80
VIN - Input Voltage - mVPP
Figure 11.
Figure 12.
LOS ASSERT/DEASSERT VOLTAGE
vs
REGISTER SETTING LOSRNG = 0
LOS ASSERT/DEASSERT VOLTAGE
vs
REGISTER SETTING LOSRNG = 1
90
100
300
90
280
LOS Assert/Deassert Voltage - mVPP
LOS Assert/Deassert Voltage - mVPP
80
70
60
LOS Deassert Voltage
50
40
LOS Assert Voltage
30
20
10
260
240
LOS Deassert Voltage
220
200
180
160
LOS Assert Voltage
140
120
100
80
60
40
20
0
128
148
168
188
208
228
Register Setting - Decimal
248 258
0
158 168 178 188 198 208 218 228 238 248 258
Register Setting - Decimal
Figure 13.
16
Figure 14.
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TYPICAL OPERATION CHARACTERISTICS (continued)
Typical operating condition is at VCC = 3.3 V, TA = 25°C, AMP1 = 0, AMP0 = 1 (Register 3) and maximum bandwidth unless
otherwise noted.
LOS HYSTERESIS
vs
REGISTER SETTING LOSRNG = 1
8
8
7
7
6
6
LOS Hysteresis - dB
LOS Hysteresis - dB
LOS HYSTERESIS
vs
REGISTER SETTING LOSRNG = 0
5
4
3
5
4
3
2
2
1
1
0
128
148
168
188
208
228
248 258
Register Setting - Decimal
0
158 168 178 188 198 208 218 228 238 248 258
Register Setting - Decimal
Figure 15.
Figure 16.
OUTPUT EYE-DIAGRAM AT 10.3 GBPS
AND MINIMUM INPUT VOLTAGE (10 mVPP)
OUTPUT EYE-DIAGRAM AT 10.3 GBPS
AND MAXIMUM INPUT VOLTAGE (2000 mVPP)
100 mV/div
20 ps/div
100 mV/div
Figure 17.
20 ps/div
Figure 18.
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TYPICAL OPERATION CHARACTERISTICS (continued)
Typical operating condition is at VCC = 3.3 V, TA = 25°C, AMP1 = 0, AMP0 = 1 (Register 3) and maximum bandwidth unless
otherwise noted.
OUTPUT EYE-DIAGRAM AT 8.5 GBPS
AND MINIMUM INPUT VOLTAGE (10 mVPP)
100 mV/div
20 ps/div
OUTPUT EYE-DIAGRAM AT 8.5 GBPS
AND MAXIMUM INPUT VOLTAGE (2000 mVPP)
100 mV/div
Figure 19.
18
20 ps/div
Figure 20.
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APPLICATION INFORMATION
RATE1
RATE0
SCK
SDA
Figure 21 shows a typical application circuit using the ONET8501P.
L1
BLM15HD102SN1
C1
0.1 mF
RATE1
RATE0
SCK
SDA
VCC
GND
DIN+
VCC
DIN+
DIN-
DOUT+
ONET
8501P
16 Pin QFN
DINC2
0.1 mF
VCC
DOUTC4
0.1 mF
LOS
DIS
COC2
DOUT+
DOUT-
GND
COC1
C3
0.1 mF
C6
0.1 mF
C5
330 pF
LOS
DISABLE
Figure 21. AC Coupled Differential Drive
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PACKAGE OPTION ADDENDUM
www.ti.com
20-Mar-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ONET8501PRGTR
ACTIVE
QFN
RGT
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ONET8501PRGTRG4
ACTIVE
QFN
RGT
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ONET8501PRGTT
ACTIVE
QFN
RGT
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ONET8501PRGTTG4
ACTIVE
QFN
RGT
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Apr-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ONET8501PRGTR
QFN
RGT
16
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
ONET8501PRGTT
QFN
RGT
16
250
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Apr-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ONET8501PRGTR
QFN
RGT
16
3000
340.5
333.0
20.6
ONET8501PRGTT
QFN
RGT
16
250
340.5
333.0
20.6
Pack Materials-Page 2
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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