CALMIRCO CM1424-01CP Multimedia card emi filter array with esd protection Datasheet

CM1424
MultiMedia Card EMI Filter Array with ESD Protection
Features
Product Description
•
The CM1424 is an EMI filter array integrating 3 pi-filters
(C-R-C) and 2 channels of ESD protection. The
CM1424 has component values of 12pF - 100Ω - 12pF.
The parts include avalanche-type ESD diodes on every
pin, which provide a very high level of protection for
sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of
±15kV, beyond the maximum requirement of the
IEC61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body
Model (HBM) ESD, the pins are protected for contact
discharges at greater than ±30kV.
•
•
•
•
•
•
•
•
•
Three channels of EMI filtering, each with ESD
protection
Two channels of ESD protection
Flow-through routing for MMC interface
±15kV ESD protection (IEC 61000-4-2, contact
discharge)
±30kV ESD protection (HBM)
Greater than 30dB of attenuation at 1GHz
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
10-bump, 1.998mm x 1.458mm footprint Chip
Scale Package (CSP)
Available with OptiGuard™ coating for improved
reliability
Lead-free version available
Applications
•
•
•
MultiMedia Card (MMC) slot in mobile handsets
and other handheld devices such as digital cameras and MP3 players
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers
The ESD diodes on pins A2 and C2 safely dissipate
ESD strikes of ±15kV, well beyond the maximum
requirement of the IEC 61000-4-2 international standard.
This device is particularly well-suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easy-to-use pin
assignments. In particular, the CM1424 is ideal for EMI
filtering and protecting data lines from ESD for the MultiMedia Card (MMC) slot in mobile handsets.
The CM1424 devices are optionally available with OptiGuard™ coating which results in improved reliability.
The CM1424 is available in space-saving, low-profile,
chip-scale packages with optional lead-free finishing.
Electrical Schematic
EMI Filter + ESD Channel 1
ESD Channel 1
DAT0
A4
100 Ω
C4
DAT0
12pF
CLK
12pF
C3
12pF
100 Ω
12pF
A3
C2
EMI Filter + ESD Channel 3
EMI Filter + ESD Channel 2
CLK
ESD Channel 2
A2
C1 CMD
12pF
100 Ω
12pF
CMD A1
© 2005 California Micro Devices Corp. All rights reserved.
09/16/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.cmd.com
1
CM1424
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
TOP VIEW
(Bumps Up View)
(Bumps Down View)
1
2
3
4
Orientation
Marking
EMI+ESD3 EMI+ESD2
A
A4
A3
A1
Orientation
Marking
(see note 2)
ESD1
A2
A1
EMI+ESD1
N241
B
B2
C
GND
GND
B1
C4
C3
C2
C1
EMI+ESD3
EMI+ESD2
ESD2
EMI+ESD1
CM1424 CSP Package (Uncoated)
BOTTOM VIEW
TOP VIEW
(Bumps Up View)
(Bumps Down View)
1
2
3
Orientation
Marking
4
EMI+ESD3 EMI+ESD2
A
A4
A3
A1
Orientation
Marking
(see note 2)
ESD1
A2
A1
EMI+ESD1
N243
B
B2
C
GND
GND
B1
C4
C3
C2
C1
EMI+ESD3
EMI+ESD2
ESD2
EMI+ESD1
CM1424 CSP Package (OptiGuard™ coated)
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s)
NAME
A1
EMI+ESD1
DESCRIPTION
A2
ESD1
A3
EMI+ESD2
A4
EMI+ESD3
B1-B2
GND
PIN(s)
NAME
CMD Filter Channel 1
C1
EMI+ESD1
DESCRIPTION
ESD Channel 1
C2
ESD2
CLK Filter Channel 2
C3
EMI+ESD2
CLK Filter Channel 2
DAT0 Filter Channel 3
C4
EMI+ESD3
DAT0 Filter Channel 3
CMD Filter Channel 1
ESD Channel 2
Device Ground
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
OptiGuard™ Coated
No Coating
Ordering Part
OptiGuard™ Coated
No Coating
Number1
Number1
Number1
Part
Marking
Ordering Part
PKG
Part
Marking
Ordering Part
Bumps
Part
Marking
Ordering Part
Number1
Part
Marking
10
CSP
CM1424-01CS
N241
CM1424-03CS
N243
CM1424-01CP
N241
CM1424-03CP
N243
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.cmd.com
09/16/05
CM1424
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
300
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
80
100
120
Ω
9
12
15
pF
R
Resistance
C
Capacitance
At 2.5V DC, 1MHz, 30mV
AC
Diode Standoff Voltage
IDIODE = 10μA
6.0
ILEAK
Diode Leakage Current (reverse bias)
VDIODE = +3.3V
100
300
nA
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
6.8
-0.8
9.0
-0.4
V
V
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2 and 3
VDIODE
RDYN
fC
5.6
-1.5
±30
kV
±15
kV
Dynamic Resistance
Positive
Negative
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
V
Channel R=100Ω,
Channel C=12pF
1.6
0.4
Ω
Ω
157
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: These parameters are guaranteed by design and characterization.
© 2005 California Micro Devices Corp. All rights reserved.
09/16/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.cmd.com
3
CM1424
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
© 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.cmd.com
09/16/05
CM1424
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss VS. Frequency (A4-C4 to GND B2)
Figure 4. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
© 2005 California Micro Devices Corp. All rights reserved.
09/16/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.cmd.com
5
CM1424
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Maximum Soldering Temperature for a Eutectic Device using Eutectic Solder Paste
240°C
Maximum Soldering Temperature for a Lead-free Device using Lead-free Solder Paste
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 6. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 7. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.cmd.com
09/16/05
CM1424
Mechanical Details (cont’d)
CM1424 devices are supplied in custom Chip Scale
Packages (CSP) and are available with optional OptiGuard™ coating.
Mechanical Package Diagrams
Non-coated CSP
CM1424 Mechanical Specifications
The package dimensions for the CM1424 are presented below.
BOTTOM VIEW
A1
C
PACKAGE DIMENSIONS
Bumps
10
Min
Nom
Max
A
1
Inches
Min
Nom
Max
2
3
4
C2
Dim
Millimeters
B
A2
Custom CSP
B4
B3
B2
B1
Package
SIDE
VIEW
C1
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
D1
D2
A1
1.953 1.998 2.043 0.0769 0.0787 0.0804
A2
1.413 1.458 1.503 0.0556 0.0574 0.0592
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
OptiGuard™ Coated CSP
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
BOTTOM VIEW
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.199 0.249 0.299 0.0078 0.0098 0.0118
C2
0.244 0.294 0.344 0.0096 0.0116 0.0135
C
D1
1
0.562 0.606 0.650 0.0221 0.0239 0.0256
B
D2
1
0.356 0.381 0.406 0.0140 0.0150 0.0160
A
D32
0.575 0.644 0.714 0.0226 0.0254 0.0281
D42
0.368 0.419 0.470 0.0145 0.0165 0.0185
C1
B2
B1
B4
B3
A2
1
2
3
4
C2
# per tape and
reel
OptiGuardTM
Coating
A1
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
3500 pieces
Controlling dimension: millimeters
Note 1: Applies to uncoated devices only.
Note 2: Applies to OptiGuard™ (coated) devices only.
D3
D4
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1424 Chip Scale Package
© 2005 California Micro Devices Corp. All rights reserved.
09/16/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.cmd.com
7
CM1424
Mechanical Details (cont’d)
CSP Tape and Reel Specifications
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1424-01
1.998x 1.458 x 0.606
2.29 x 1.6 x 0.81
8mm
178mm (7")
3500
4mm
4mm
CM1424-03
1.998 x 1.458 x 0.644
2.29 x 1.6 x 0.81
8mm
178mm (7")
3500
4mm
4mm
PART
NUMBER
Po
Top
Cover
Tape
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Ao
W
Bo
Ko
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
P1
Center Lines
of Cavity
User Direction of Feed
Figure 8. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.cmd.com
09/16/05
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