CYStech Electronics Corp. Spec. No. : C234S6R Issued Date : 2013.10.21 Revised Date : Page No. : 1/6 NPN Epitaxial Planar Transistor HBN3101S6R (Dual Transistors) Features • Two BF422 chips in a SOT-363 package. • Mounting possible with SOT-323 automatic mounting machines. • Transistor elements are independent, eliminating interference. • Mounting cost and area can be cut in half. • High BVCEO, BVCEO≧300V • Pb-free lead plating and halogen-free package. Equivalent Circuit Outline HBN3101S6R Tr1 SOT-363 Tr2 Ordering Information Device HBN3101S6R-0-T1-G Package SOT-363 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name HBN3101S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C234S6R Issued Date : 2013.10.21 Revised Date : Page No. : 2/6 The following characteristics apply to both Tr1 and Tr2 Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC ICP Pd Tj Tstg Limits 300 300 5 100 300 (Note 1) 200 (total) (Note 2) 150 -55~+150 Unit V V V mA mA mW °C °C Note : 1.Single pulse, Pw=10ms 2.150mW per element must not be exceeded. Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. 300 300 5 100 15 60 - Typ. - Max. 100 100 300 900 250 15 Unit V V V nA nA mV mV MHz pF Test Conditions IC=100µA IC=1mA IE=10µA IE=0, VCB=300V VEB=5V, IC=0 IC=30mA, IB=3mA IC=30mA, IB=3mA VCE=5V, IC=10mA VCE=5V, IC=50mA VCE=10V, IC=10mA, f=100MHz VCB=10V, f=1MHz *Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2% HBN3101S6R CYStek Product Specification Spec. No. : C234S6R Issued Date : 2013.10.21 Revised Date : Page No. : 3/6 CYStech Electronics Corp. Typical Characteristics Saturation Voltage vs Collector Current Current Gain vs Collector Current 10000 Saturation Voltage---(mV) Current Gain---HFE 1000 VCE = 20V 100 VCE = 10V VCE = 5V 1000 VCE(SAT) @ IC = 20IB 100 VCE(SAT) @ IC = 10IB 10 10 1 10 Collector Current---IC(mA) 1 100 10 100 Collector Current---IC(mA) Saturation Voltage vs Collector Current Power Derating Curves 250 Power Dissipation---PD(mW) Saturation Voltage---(mV) 1000 VBE(SAT) @ IC =10IB 100 200 Dual 150 Single 100 50 0 1 10 100 Collector Current---IC(mA) 0 50 100 150 200 Ambient Temperature---TA(℃) Recommended Soldering Footprint HBN3101S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C234S6R Issued Date : 2013.10.21 Revised Date : Page No. : 4/6 Reel Dimension Carrier Tape Dimension HBN3101S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C234S6R Issued Date : 2013.10.21 Revised Date : Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. HBN3101S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C234S6R Issued Date : 2013.10.21 Revised Date : Page No. : 6/6 SOT-363 Dimension Marking: Date Code: Year + Month Year : 6→2006, 7→2007,…, etc Month : 1→Jan 2→Feb, …, 9→ Sep, A→Oct, B →Nov, C→Dec K4N Device Code 6-Lead SOT-363 Plastic Surface Mounted Package CYStek Package Code: S6R Style: Pin 1. Emitter1 (E1) Pin 2. Base1 (B1) Pin 3. Collector2 (C2) Pin 4. Emitter2 (E2) Pin 5. Base2 (B2) Pin 6. Collector1 (C1) Millimeters Min. Max. 0.900 1.100 0.000 0.100 0.900 1.000 0.150 0.350 0.080 0.150 2.000 2.200 1.150 1.350 DIM A A1 A2 b c D E Inches Min. Max. 0.035 0.043 0.000 0.004 0.035 0.039 0.006 0.014 0.003 0.006 0.079 0.087 0.045 0.053 DIM E1 e e1 L L1 θ Millimeters Min. Max. 2.150 2.450 0.650 TYP 1.200 1.400 0.525 REF 0.260 0.460 0° 8° Inches Min. Max. 0.085 0.096 0.026 TYP 0.047 0.055 0.021 REF 0.010 0.018 0° 8° Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. HBN3101S6R CYStek Product Specification