RSG CX6S0.T.CSM4 9.6 mhz to 250 mhz ultra-low profile miniature surface mount at quartz crystal Datasheet

CX6SM AT CRYSTAL
9.6 MHz to 250 MHz
Ultra-Low Profile Miniature
Surface Mount AT Quartz Crystal
™
Fundamental Mode:
DESCRIPTION
STATEK’s miniature CX6SM AT crystals in leadless ceramic
packages are designed for surface mounting on printed circuit
boards or hybrid substrates. These crystals have a small land
pattern and a low profile. They are manufactured using the
STATEK-developed photolithographic process, and were
designed utilizing the experience acquired by producing millions
of crystals for industrial, commercial, military and medical
applications.
Third Overtone Mode:
9.6 MHz - 250 MHz
48 MHz
- 160 MHz
actual size
side view
XX
X
X
S
glass lid
ceramic lid
PACKAGE DIMENSIONS
D
FEATURES
Ultra low profile (less than 1 mm available) hermetically
sealed ceramic package
Designed for surface mount applications using infrared,
vapor phase, or epoxy mount techniques.
TOP
A
BOTTOM
Excellent aging characteristics
Available with glass or ceramic lid
D
High shock and vibration resistance
C
B
Custom designs available
Full military testing available
Designed and manufactured in the USA
TYPICAL
MAXIMUM
DIM
inches
mm
inches
mm
A
0.265
6.73
0.280
7.11
APPLICATIONS
B
0.103
2.62
0.114
2.90
Medical
C
-
-
D
0.050
1.27
Monitoring Equipment
see below
0.060
1.52
Industrial, Computer & Communications
Down-hole Data Recorder
Environmental Controls
THICKNESS (DIM C) MAXIMUM
GLASS LID
Handheld Inventory Control
Telemetry
Military & Aerospace
Communications
CERAMIC LID
inches
mm
inches
mm
SM1
0.039
0.99
0.053
1.35
SM2/SM4
0.041
1.04
0.055
1.40
SM3/SM5
0.044
1.12
0.058
1.47
Smart Munitions
Timing Devices (Fuzes)
Surveillance Devices
IS O
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
YS
90
01
ERT
T E M C IFIC T
A
N
IO
S
10117 - Rev B
Pb
SPECIFICATIONS
TERMINATIONS
Specifications are typical at 25OC unless otherwise noted.
Specifications are subject to change without notice.
Designation
SM1
SM2
SM3
SM4
SM5
Fundamental Frequency
10 MHz 32 MHz 155.52 MHz
Motional Resistance R1 (Ω)
60
25
10
Motional Capacitance C1 (fF)
2.8
6.2
4.0
Quality Factor Q (k)
95
30
30
Shunt Capacitance C0 (pF)
1.4
2.3
2.3
Calibration Tolerance1
2
Load Capacitance
+
_
Termination
Gold Plated (Lead Free)
Solder Plated
Solder Dipped
Solder Plated (Lead Free)
Solder Dipped (Lead Free)
100 ppm, or tighter as required
SUGGESTED LAND PATTERN
20 pF for f ≤ 50 MHz
0.070 (1.78)
10 pF for f > 50 MHz
Drive Level
500 µW MAX for f ≤ 50 MHz
Frequency-Temperature
Stability1,3
200 µW MAX for f > 50 MHz
+
_ 50 ppm to +
_ 10 ppm (Commercial)
+
_ 100 ppm to +
_ 20 ppm (Industrial)
+
_ 100 ppm to +
_ 30 ppm (Military)
Aging, first year3
5 ppm MAX
4
260OC for 20 sec.
Max Process Temperature
0.120 (3.05)
(below 1 ppm available)
0.215 (5.46)
inches (mm)
Shock, survival
3,000 g, 0.3 ms, 1/2 sine
Vibration, survival5
20 g, 10-2,000 Hz swept sine
Operating Temp. Range
-10OC to +70OC (Commercial)
-40OC to +85OC (Industrial)
-55OC to +125OC (Military)
EQUIVALENT CIRCUIT
Storage Temp. Range
-55OC to +125OC
Max Process Temperature
260OC for 20 sec.
C0
1
L1
1. Other tolerances available. Contact factory.
R1
2
R1 Motional Resistance L1 Motional Inductance
C1 Motional Capacitance C0 Shunt Capacitance
2. Unless specified otherwise.
3. Does not include calibration tolerance. The characteristics of the frequency stability over
temperature follow that of the AT thickness-shear mode.
4. 10 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher
frequencies contact factory.
5. Higher shock version available.
6. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available.
C1
PACKAGING
• Tray Pack
• Tape and Reel
Per EIA 481 (see Tape and Reel data sheet 10109)
HOW TO ORDER CX6SM AT CRYSTALS
CX6
S
C
SM1
“S” if special or O.T. = 3rd Overtone Mode C = Ceramic Lid
custom design. Blank = Fundamental
Blank = Glass Lid
Blank if Std.
Mode
–
32.0M
Frequency
M = MHz
SM1 = Gold Plated (Lead Free)
SM2 = Solder Plated
SM3 = Solder Dipped
SM4 = Solder Plated (Lead Free)
SM5 = Solder Dipped (Lead Free)
,
100
/
100
/
—
Operating Temp. Range:
C = -10OC to +70OC
I = -40OC to +85OC
M = -55OC to +125OC
S = Customer Specified
Frequency
Stability over
Temp. Range
(in ppm)
Calibration
Tolerance
@ 25OC
(in ppm)
I
/
OR
—
/
—
/
200
Total
Frequency
Tolerance
(in ppm)
/
I
Operating Temp. Range:
C = -10OC to +70OC
I = -40OC to +85OC
M = -55OC to +125OC
S = Customer Specified
IS O
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
90
01
ERT
T E M C IFIC T
A
N
IO
S
10117 - Rev B
YS
Pb
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