Rohm BD4732 Bipolar voltage detector ic Datasheet

Datasheet
Voltage Detector IC Series
Bipolar
Voltage Detector ICs
BD47xx series
●General Description
The BD47xx series is a Voltage Detector IC,
developed to prevent system errors at transient state,
when the power of CPU or logic circuit switches
ON/OFF or in cases of momentary shut down. These
ICs consist of three terminals (power supply, GND and
reset output) to detect power supply voltages and
outputs reset signals of various systems. These ICs
are ultra-compact and have low current consumption,
making them ideal for portable products.
●Key Specifications
„ Detection voltage range:
1.9V to 4.6V (Typ.)
0.1V steps
„ High accuracy detection voltage:
±1%
„ Low current consumption:
1.6µA (Typ.)
„ Operating temperature range:
-40°C to +75°C
●Package
SSOP5
2.90mm x 2.80mm x 1.25mm
●Applications
Circuits using microcontrollers or logic circuits that require
a reset.
●Features
„ High accuracy detection
„ Low current consumption
„ Very small package
„ Open collector “L” reset output
„ Package SSOP5 is similar to SOT-23-5 (JEDEC)
●Typical Application Circuit
VDD
VDD
RL
BD47xx series
CPU
Micro-controller
RESET
VOUT
CL
GND
●Connection Diagram
SSOP5
TOP VIEW
VDD
●Pin Descriptions
VOUT
Lot. No
Marking
N.C.
GND
SUB GND
PIN No.
Symbol
Function
1
N.C.
Unconnected Terminal
2
SUB
Substrate*
3
GND
GND
4
VOUT
Reset Output
5
VDD
Power Supply Voltage
*Substrate Pin should be connected with GND
○Product structure：Silicon monolithic integrated circuit
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18.Nov.2012 Rev.005
Datasheet
BD47xx series
●Ordering Information
B
D
4
7
x
Part
Number
x
G
-
Reset Voltage Value Package
19 : 1.9V
G : SSOP5
0.1V step
46 : 4.6V
T
R
Packaging and
forming specification
TR : Embossed tape
and reel
SSOP5 (SOT-23-5)
5
4
1
2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6°
4° −4°
2.9±0.2
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
1.25Max.
)
0.05±0.05
1.1±0.05
S
+0.05
0.42 −0.04
0.95
0.1
S
Direction of feed
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
●Lineup
Marking
B2
B1
BZ
BY
BX
BW
BV
BU
BT
BS
Detection
Voltage
4.6V
4.5V
4.4V
4.3V
4.2V
4.1V
4.0V
3.9V
3.8V
3.7V
Part Number
Marking
BD4746
BD4745
BD4744
BD4743
BD4742
BD4741
BD4740
BD4739
BD4738
BD4737
BR
BQ
BP
B4
BN
BM
BL
BK
BJ
B3
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Detection
Voltage
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2/10
Part Number
Marking
BD4736
BD4735
BD4734
BD4733
BD4732
BD4731
BD4730
BD4729
BD4728
BD4727
BH
BG
BF
BE
BD
BC
BB
BA
Detection
Voltage
2.6V
2.5V
2.4V
2.3V
2.2V
2.1V
2.0V
1.9V
Part Number
BD4726
BD4725
BD4724
BD4723
BD4722
BD4721
BD4720
BD4719
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18.Nov.2012 Rev.005
Datasheet
BD47xx series
●Absolute maximum ratings
Parameter
Power Supply Voltage
Output Voltage
Output Current
Power Dissipation *1 *2
Operation Temperature Range
Ambient Storage Temperature
Symbol
VDD
VOUT
Limit
-0.3 to +10
-0.3 to +10
Unit
V
V
Io
Pd
Topt
Tstg
60
540
-40 to +75
-55 to +125
mA
mW
°C
°C
*1 Reduced by 5.4mW/°C when used over 25°C.
*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).
●Electrical characteristics (Unless Otherwise Specified Ta=25°C)
Parameter
Symbol
Condition
VDD=HÆL
VDET=2.5V
Detection Voltage
VDET
VDET=3.0V
VDET=3.3V
VDET=4.2V
RL=4.7kΩ
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 105°C
Temperature Coefficient
VDET/∆T RL=4.7kΩTa=-20 to+75°C Designed Guarantee
Of Detection Voltage
Detection Hysteresis Voltage ∆VDET RL=4.7kΩ, VDD=LÆHÆL
Transfer Delay Time ”H”
tPLH
CL=100pF，RL=4.7kΩ *1
Transfer Delay Time ”L”
tPHL
CL=100pF，RL=4.7kΩ *2
Reset Output Voltage ”L”
VOL
VDD=VDET(min.)-0.05V, RL=4.7kΩ
Circuit Current ON
Icc1
VDD=VDET(min.)-0.05V, RL=∞
Circuit Current OFF
Icc2
VDD=VDET(typ.)/0.85V, RL=∞
Operating Voltage Range
VOPL
RL=4.7kΩ，VOL≤0.4V
Output Leak Current
Ileak
VDD=VOUT=10V
Reset Output Current ”L”
IOL
Vo=0.4V, VDD=VDET(min.)-0.05V
VDET(T):Standard Detection Voltage(1.9V to 4.6V, 0.1V step）
RＬ:Pull-up resistor to be connected between VOUT and power supply.
CL:Capacitor to be connected between VOUT and GND.
*1 tPLH:VDD=(VDET(typ.)-0.4V)Æ(VDET(typ.)+0.4V)
*2 tPHL:VDD=(VDET(typ.)+0.4V)Æ(VDET(typ.)-0.4V)
Design Guarantee. (Outgoing inspection is not done on all products)
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Limit
Min.
Typ.
Max.
VDET (T)
VDET(T)
VDET(T)
×0.99
×1.01
2.475
2.5
2.525
2.417
2.580
2.422
2.598
2.970
3.0
3.030
2.901
3.095
2.906
3.117
3.267
3.3
3.333
3.191
3.405
3.196
3.429
4.158
4.2
4.242
4.061
4.334
4.068
4.364
Unit
V
-
±0.01
-
%/°C
30
3.0
50
20
60
0.1
1.5
1.6
0.65
15.0
100
50
120
0.4
3.0
3.2
0.85
0.1
-
mV
µs
µs
V
µA
µA
V
µA
mA
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Datasheet
BD47xx series
●Block Diagram
VDD
5
4
VOUT
Vref
3
GND
Fig.1
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BD47xx series
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Datasheet
BD47xx series
●Typical Performance Curves
"LOW" OUTPUT CURRENT ： IOL [mA]
CIRCUIT CURRENT ： ICC [μA]
10
【BD4729】
【BD4729G】
9
8
7
6
5
4
3
2
Icc1=1.34μA
Icc2=1.46μA
1
0
0
1
2
3
4
5
6
7
8
800
600
500
400
IOL=12.194mA at Vo=400mV
300
200
100
0
9 10
0
VDD SUPPLY VOLTAGE ：VDD [V]
5
10
15
20
25
30
OUTPUT VOLTAGE ： VOUT[mV]
Fig.2 Circuit Current
Fig.3 “Low” Output Current
1000
OUTPUT VOLTAGE ： VOUT[mV]
6
OUTPUT VOLTAGE ： VOUT[V]
【BD4729】
【BD4729G】
700
【BD4729】
【BD4729G】
5
4
3
2
VDET=2.90V
VDET=2.95V
1
⊿VDET=50mV
0
0
1
2
3
4
5
【BD4729G】
【BD4729】
900
800
700
600
500
400
VOPL=0.675V
300
200
100
0
6
0
VDD SUPPLY VOLTAGE ：VDD [V]
0.5
1
1.5
2
2.5
VDD SUPPLY VOLTAGE ： VDD [V]
Fig.4 I/O Characteristics
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Fig.5 Operating Limit Voltage
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Datasheet
BD47xx series
●Typical Performance Curves – continued
CIRCUIT CURRENT WHEN ON ： ICC1[mA]
DETECTION VOLTAGE ： VDET[V]
3.5
BD4729G】
【
【BD4729】
3.3
3.1
-0.007%/℃
2.9
2.7
2.5
~
~
【BD4729G】
【BD4729】
2.0
1.5
1.0
0.5
0.0
-20 -10 0 10 20 30 40 50 60 70 80
TEMPERATURE ： Ta[℃]
TEMPERATURE ： Ta[℃]
Fig.6 Detection Voltage
Fig.7 Circuit Current when ON
2.5
0.9
MINIMUM OPERATION VOLTAGE ： VOPL[V]
CIRCUIT CURRENT WHEN OFF ： I CC2[mA]
2.3
-20 -10 0 10 20 30 40 50 60 70 80
2.5
【BD4729】
【BD4729G】
2.0
1.5
1.0
0.5
0.0
-20 -10 0 10 20 30 40 50 60 70 80
【BD4729】
【BD4729G】
0.8
0.7
0.6
0.5
0.4
-20 -10 0 10 20 30 40 50 60 70 80
TEMPERATURE ： Ta[℃]
TEMPERATURE ： Ta[℃]
Fig.8 Circuit Current when OFF
Fig.9 Operating Limit Voltage
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Datasheet
BD47xx series
●Typical Performance Curves – continued
OUTPUT VOLTAGE： VOUT [mV]
500
【BD4729】
BD4729G】
【
400
300
Ta=-20℃
200
100
Ta=75℃
Ta=25℃
0
0
1
2
3
4
5
"LOW" OUTPUT CURRENT ： IOL [mA]
Fig.10 Output Saturation Voltage
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Datasheet
BD47xx series
●Application Information
Explanation of Operation
BD47xx series has threshold voltages namely the detection voltage and release voltage. As the voltages applied to the
input reach their respective thresholds, the output switches from “High” to “Low” and from “Low” to “High”. The release
voltage has a hysteresis that is the value of the detection voltage +50mV (Typ.), preventing chattering in the output. When
the input is greater than the release voltage, the output is in a “High” state. When the input decreases from that state, the
output switches to “Low” upon reaching the detection voltage. When the input is less than the detection voltage, the output
is in a “Low” state. When the input increases from that state, the output switches to “High” upon reaching the release
voltage. Additionally, at least 0.85V input voltage is required for the circuit to function as expected. When the input falls
below the operating limit voltage, the output becomes unstable.
VDD
VDD
VDET+ΔVDET
VDET
⑤
VOPL
0V
VOUT
VOH
tPHL
tPLH
tPLH
tPHL
VOL
①
②
③
④
Fig.11 Timing Waveform
1
When the power supply is turned on, the output is still unstable until it reaches the operating limit voltage (VOPL) with a
given time tPHL. Therefore it is possible that the reset signal is not outputted when the rise time of VDD is faster than tPHL.
2
When VDD is greater than VOPL but less than the reset release voltage (VDET+ΔVDET), the output voltages will switch to
Low.
3
If VDD exceeds the reset release voltage (VDET+ΔVDET) then VOUT switches from L to H.
4
If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power
supply fluctuation, VOUT switches to L (with a delay of tPHL).
5
The potential difference between the detection voltage and the release voltage is known as the Hysteresis Width
(ΔVDET). The system is designed such that, the output does not toggle with power supply fluctuations within this hysteresis
width, malfunctions due to noise are prevented.
<Precautions>
Please be aware that when there is resistance on the power supply line, the detection voltage varies with voltage drops
caused by the IC current consumption.
Please connect a capacitor between VDD and GND when the power supply line has high impedance.
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Datasheet
BD47xx series
●Circuit Applications
The following is an example of an application circuit using Reset IC for normal power supply detection. BD47xx series
requires a pull up resistor on the output terminal. The pull up resistor value should be decided depending on the
application, with enough consideration of power supply level and output current capability. When a capacitor is placed at
the output terminal, to delay the output time or to remove noise, the output will become slower during starting or stopping.
Please be careful in considering the appropriate value for pull up resistors, output current, and capacitor when inserting a
bypass capacitor between input and GND. Please be aware that if an extremely large capacitor is used, the response time
will become excessively slow.
●●●●●●●●●●●●
VDD
5
microcontroller
4
●●●●●●●●●●●
VDD
Reset Pin
VOUT
●●●●●●●●●●●●
Vref
3
BD47xx series
GND
Fig.12 Circuit Applications
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Datasheet
BD47xx series
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2)
Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3)
Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4)
Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5)
Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6)
Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7)
The VDD line impedance might cause oscillation because of the detection current.
8)
A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9)
Lower than the mininum input voltage puts
condition.
the VOUT in high impedance state, and it must be VDD in pull up (VDD)
10) External parameters
The recommended parameter range for RL is 2kΩ to 1MΩ. There are many factors (board layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.
11) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
12) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
13) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
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Datasheet
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notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
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1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
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4)
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5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
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Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
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incurred by you or third parties arising from the use of such information.
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[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
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3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
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4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
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Notice - Rev.003
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Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
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Notice - Rev.003
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