Material Content Data Sheet Sales Product Name IPB020NE7N3 G MA# MA001140416 Package PG-TO263-3-2 Issued 29. August 2013 Weight* 1564.73 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 12.294 0.79 0.304 0.02 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.79 7857 7857 195 0.091 0.01 304.026 19.43 19.46 194300 58 194553 10.847 0.69 0.69 6932 6932 10.068 0.64 6434 110.749 7.08 550.390 35.17 42.89 351746 428960 9.657 0.62 0.62 6171 6171 0.228 0.01 0.001 0.00 0.192 0.01 0.154 0.01 7.350 0.47 0.548 0.04 0.165 0.01 547.666 35.00 70779 146 0.01 1 98 0.49 4697 2. 3. 105 35.05 350008 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4918 350 Important Remarks: 1. 146 123 350463 1000000