Anpec APA4863KI-TU Stereo 2.2w audio power amplifier Datasheet

APA4863
Stereo 2.2W Audio Power Amplifier
Features
General Description
•
•
•
The APA4863 is a stereo bridge-tied audio power amplifier in various power packages , including SOP ,
TSSOP and TSSOP-P . When connecting to a 5V voltage supply , the APA4863 is capable of delivering
2.2W/1.8W/1.2W of continuous RMS power per channel into 3Ω/4Ω/8Ω bridge-tied loads with less than
1% THD+N respectively . When APA4863 operates
in the single-ended load , it is capable of delivering
90mW of continuous RMS power per channel into
32Ω load . The APA4863 simplifies design and frees
up board space for other features .
Depop Circuitry Integrated
Thermal Shutdown Circuitry Integrated
Bridge-Tied Load (BTL) or Single-Ended
(SE) Modes Operation
•
Output Power at 1% THD+N, VDD=5V
- 2.2W/Ch (typ) into a 3 Ω Load
- 1.8W/Ch (typ) into a 4 Ω Load
- 1.2 W/Ch (typ) into a 8 Ω Load
•
•
Shutdown Control Mode, ISD= 0.5 µA
The APA4863 also served well in low-voltage applications , which provides 750mW (1% THD+N) per
channel into 4Ω loads with a 3.3V supply voltage .
Both of the depop circuitry and the thermal shutdown
protection circuitry are integrated in the APA4863 ,
that reduces pops and clicks noise during power up
and when using the shutdown mode and protects the
chip from being destroyed by over-temperature failure . To simplify the audio system design in notebook computer applications , the APA4863 combines
a stereo bridge-tied loads mode for speaker drive and
a stereo single-end mode for headphone drive into a
single chip , where both modes are easily switched
by the HP-IN input control pin signal . For power sensitive applications , the APA4863 also features a shutdown function which keeps the supply current only
0.5 µA (typ.) .
Output Power (SE) at 0.5% THD+N, VDD=5V
- 90mW/Ch (typ.) into a 32Ω Load
•
Various Power Packages Available
SOP, TSSOP, TSSOP-P
Applications
•
Stereo Audio Power Amplifier for Notebook
Computer
•
•
Portable Televisions
Portable and Desktop Computers
Ordering Information
Package Code
K: SOP
O: TSSOP
Temp. Range
I : -40 to 85 ° C
Handling Code
TU : Tube
TR : Tape & Reel
APA4863
Handling Code
Temp. Range
Package Code
R: TSSOP-P*
TY: Tray
* TSSOP-P is a standard TSSOP package with a thermal pad exposed on the bottom of the package.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
1
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APA4863
Block Diagram
VDD
CS
0.1µF
RF
20KΩ
6
- IN A
8
+ IN A*
- OUT A
Bypass
10
+
50ΚΩ
VDD / 2
2.2µF
100µF
1KΩ
Control
Pin
RL
8Ω
+ OUT A
Ring
To HP-IN Circuit
3
+
CB
CO
5
20KΩ
20KΩ
20KΩ
-
C1
1 µF
4, 13
20KΩ
-
R1
+
Audio
Input
50KΩ
Tip
C1
1 µF
11
- IN B
9
+ IN B*
20KΩ
RF
20KΩ
+
R1
-
Audio
Input
- OUT B
1
16
1KΩ
+ OUT B
14
+
To Control Pin on
Headphone Jack
100µF
RL
8Ω
20KΩ
VDD
100ΚΩ
+
20KΩ
20KΩ
Headphone Jack
CO
12
Sleeve
Shutdown
HP-IN
100KΩ
GND
2,7,15
* +INA and +INB pins are connected to Bypass pin inside the IC.
Absolute Maximum Ratings
(Over operating free-air temperature range unless otherwise noted.)
Symbol
VDD
Parameter
Supply Voltage
TA
Operating Ambient Temperature Range
TJ
Maximum Junction Temperature
TSTG
TS
VESD
Storage Temperature Range
Soldering Temperature,10 seconds
Electrostatic Discharge
Rating
6
Unit
V
-40 to 85
°C
150
°C
-65 to +150
°C
°C
260
-2000 to 2000
*1
V
Note: *1. Human body model : C=100pF, R=1500Ω, 3 positive pulses plus 3 negative pulses
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
2
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APA4863
Recommended Operating Conditions
Min.
Typ.
Max.
Unit
3
5
5.5
V
°C
Supply Voltage, VDD
Operating free-air VDD=5V,
temperature, TA
250mW/Ch average
power
VDD=5V,
1.8 W/Ch average
power
4-Ω stereo BTL drive, with
proper PCB design
-20
85
4-Ω stereo BTL drive, with
proper PCB design and 300
CFM forced-air cooling
-20
85
1.25
4.5
1.25
2.7
Common mode
VDD=5 V
input voltage, VICM
VDD=3.3V
V
Dissipation Rating Table
Package
Air Flow
(CFM)
SO16 +
TSSOP ++
0
0
200
0
200
TSSOP-P ++
Thermal Resistance
θ JA(°° C/W)
50
73.2
66.6
37.6
32.3
T A≤ 25°° C
T A=70°° C
2.5W
1.7W
1.8W
3.3W
3.8W
1.6W
1.1W
1.2W
2.1W
2.4W
+ : The parameter is measured with the recommended copper heat sink pattern on an 2-layer PCB, 11.7 in2 3.0×2.4 in2 in PCB,
1oz. copper, 3.0×1.5 in2 in coverage at Top-layer and Bottom-layer at 100% coverage (7.2in2).
++:The parameter is measured with the JEDEC standard test boards (multi-layer PCB).
Electical Characteristics
Electrical Characteristics for Entire IC
The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25°C
Symbol
Parameter
Test Conditions
VDD
V IN=0V, IO=0A, HP-IN=0V
V IN=0V, IO=0A, HP-IN=4V
V PIN1= VDD
ISD
Supply Voltage
Quiescent Power Supply
Current
Shutdown Current
VIH
Headphone High Input Voltage
VIL
Headphone Low Input Voltage
IDD
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
APA4863
Min.
Typ.
3
5
9
5
0.5
Max.
5.5
13.5
7.5
V
mA
µA
4
V
0.8
3
Unit
V
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APA4863
Electical Characteristics Cont.
Electrical Characteristics for BTL Mode Operation
The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25°C
Symbol
V OS
PO
THD+N
RSRR
X TALK
SNR
Parameter
Output Offset Voltage
Output Power
Test Conditions
V IN=0V
THD=1%, f=1kHz
R L=3Ω
R L=4Ω
R L=8Ω
THD=10%, f=1kHz
R L=3Ω
R L=4Ω
R L=8Ω
Total Harmonic Distortion + Noise A VD =2, f=1kHz
R L=4Ω , P O =1.8W
R L=8Ω , P O =1W
Power Supply Rejection Ratio
V DD =5V, V RIPPLE=200Mv Rms , R L=8Ω
C B=2.2µF
Channel Separation
f=1kHz , C B =2.2µF, P O =1W, R L=8Ω
Signal-to-Noise Ratio
V DD =5V, P O =1.1W, R L=8Ω
APA4863
Typ.
5
Unit
2.2
1.8
1.2
W
mV
2.7
2.3
1.5
0.3
0.15
64
%
dB
90
95
dB
dB
APA4863
Typ.
5
90
320
400
0.02
Unit
Electrical Characteristics for SE Mode Operation
The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25°C
Symbol
V OS
PO
Parameter
Test Conditions
Output Offset Voltage
Output Power
V IN=0V
THD=0.5%, f=1kHz, RL=32Ω
THD=1%,
f=1kHz, RL=8Ω
THD=10%,
f=1kHz, RL=8Ω
THD+N Total Harmonic Distortion A V= -1 , P O=75mW, f=1kHz, RL=32Ω
plus Noise
RSRR Power Supply Rejection V RIPPLE=200mV RMS , f=1kHz, CB=2.2µF, RL=8Ω
Ratio
X TALK Channel Separation
f=1kHz , CB=2.2µF, P O=32mW, RL=32Ω
SNR Signal-to-Noise Ratio
V DD=5V , PO =340mW, RL=8Ω
mV
mW
%
49
dB
85
95
dB
dB
Truth Table for Logic Inputs
Shutdown
Low
Low
High
High
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
HP-IN
Low
High
Low
High
APA4863 Mode
Bridge -Tied
Single-Ended
APA4863 Shutdown
APA4863 Shutdown
4
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APA4863
Pin Description
SHUTDOWN
GND
1
+ OUT A
VDD
3
4
- OUT A
- IN A
GND
+ IN A
5
16
2
15
14
13
12
11
6
7
10
8
9
HP-IN
GND
+ OUT B
VDD
- OUT B
- IN B
BYPASS
+ IN B
Top View
1
+ OUT A
VDD
3
4
- OUT A
- IN A
GND
+ IN A
GND
GND
5
5
16
6
7
15
14
13
- OUT B
- IN B
BYPASS
+ IN B
1
+ OUT A
VDD
- OUT A
- IN A
GND
+ IN A
NC
NC
2
8
9
12
10
11
+ OUT B
VDD
NC
NC
Top View
for SOP
SHUTDOWN
GND
HP-IN
GND
3
4
20
19
18
17
SHUTDOWN
GND
for TSSOP
20
19
18
2
6
7
8
9
10
HP-IN
GND
17
+ OUT B
VDD
16
15
14
13
- OUT B
- IN B
BYPASS
+ IN B
12
GND
GND
11
Thermal
Pad
Bottom View
Top View
for TSSOP-P
for TSSOP -P
Pin Description
Name
GND
V DD
+ INA
- INA
+ OUT A
- OUT A
+ IN B
- IN B
+ OUT B
- OUT B
BYPASS
HP-IN
SHUTDOWN
I/O
I
I
I
O
O
I
I
O
O
I
I
Description
Ground connection of circuitry
Supply voltage input
Non-inverting input of channel A, connected to bypass pin inside the IC
Input pin of channel A
A channel + output in BTL mode, high impedance in SE mode
A channel - output in BTL mode, + output in SE mode
Non-inverting input of channel B, connected to bypass pin inside the IC
Input pin of channel B
B channel + output in BTL mode, high impedance in SE mode
B channel - output in BTL mode, + output in SE mode
Connect to voltage divider for internal mid-supply bias
Headphone control pin input, hold high for single-ended mode operation
Shutdown mode control pin input, places entire IC in shutdown mode
when held high, IDD= 0.5µA
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
5
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APA4863
Typical Characteristics
THD+N vs Output Power
10
THD+N vs Frequency
10
VDD=5V, RL=4Ω
BW<80kHz
VDD=5V, PO=1.8W
RL=4Ω, BW<80kHz
20Hz
1
THD+N (%)
THD+N (%)
1
20kHz
1kHz
0.1
0.1
0.01
20
0.01
10m
100m
1
1k
10k 20k
3
Figure 1 : Output Power (W)
Figure 2 : Frequency (Hz)
Power Dissipation vs Output Power
THD+N vs Frequency
10
1.4
VDD=5V, PO=1W
RL=8Ω, BTL Mode
1.2
VDD=5V
1
1
Ω
RL=4Ω
0.8
0.6
THD+N (%)
Power Dissipation (W)
100
Ω
RL= 8Ω
AVD=10
0.1
0.4
AVD=2
0.2
0.01
0
0
0.5
1
1.5
2
20
2.5
Figure 3 : Output Power (W)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
100
1k
10k 20k
Figure 4 : Frequency (Hz)
6
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APA4863
Typical Characteristics Cont.
THD+N vs Frequency
VDD=5V, PO=150mW
RL=16Ω, SE Mode
1
THD+N (%)
THD+N (%)
1
0.1
THD+N vs Frequency
10
10
AV= -5
AV= -1
VDD=5V, PO=75mW
RL=32Ω, SE Mode
0.1
AV= -5
AV= -1
0.001
0.001
20
100
1k
10k 20k
20
THD+N vs Output Power
THD+N vs Output Power
1
f= 20Hz
THD+N (%)
THD+N (%)
10
f= 1kHz
f= 20kHz
0.1
f= 20Hz
f= 1kHz
VDD=5V, RL=8Ω
AVD=2, BW< 80kHz
BTL Mode
0.01
10k 20k
Figure 6 : Frequency (Hz)
f= 20kHz
0.1
1k
Figure 5 : Frequency (Hz)
10
1
100
10m
100m
1
0.001
10m
2
Figure 7 : Output Power (W)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
VDD=5V, RL=16Ω
AV=-1, BW< 80kHz
SE Mode
70m
200m 500m
Figure 8 : Output Power (W)
7
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APA4863
Typical Characteristics Cont.
THD+N vs Output Power
1
THD+N vs Output Power
10
10
VDD=5V, RL=32Ω
AV=-1, BW< 80kHz
SE Mode
f= 20kHz
f= 20Hz
THD+N (%)
THD+N (%)
1
f= 20kHz
0.1
f= 20Hz
f= 1kHz
0.1
f= 1kHz
0.001
10m
VDD=3.3V, RL=4Ω
AVD= 2
50m
100m
0.01
200m
10m
100m
1
Figure 9 : Output Power (W)
Figure 10 : Output Power (W)
THD+N vs Frequency
THD+N vs Output Power
2
10
10
VDD=3.3V, PO=700mW
RL=4Ω, AVD=2
f= 20kHz
1
THD+N (%)
THD+N (%)
1
0.1
f= 20Hz
f= 1kHz
0.1
VDD=3.3V, RL=8Ω,
AVD=2
0.01
0.01
20
100
1k
10k 20k
10m
Figure 11 : Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
100m
1
Figure 12 : Output Power (W)
8
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APA4863
Typical Characteristics Cont.
Output Power vs Load Resistance
THD+N vs Frequency
10
0.2
VDD=3.3V, f=1kHz
AVD=2, BW<80kHz
VDD=3.3V, PO=450mW
RL=8Ω, AVD=2
Output Power (W)
0.15
THD+N (%)
1
0.1
THD+N = 1%
0.05
0
0.01
20
100
1k
0
10k 20k
10
20
30
40
Figure 13 : Frequency (Hz)
Figure 14 : Load Resistance (Ω)
Power Dissipation vs Output Power
Output Power vs Supply Voltage
2
0.35
VDD=3.3V, SE Mode
1.75
0.3
0.25
1.5
RL=8Ω
Output Power (W)
Power Dissipation (W)
THD+N = 10%
0.1
0.2
RL=16Ω
0.15
0.1
0.05
0
1.25
VDD=5V, f=1kHz
RL=8Ω, BW<80kHz
BTL Mode
THD+N = 10%
1
0.75
0.5
THD+N = 1%
0.25
0
0.2
0.4
0.6
0
0.8
Figure 15 : Output Power (W)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
2 2.5
3
3.5
4
4.5
5
5.5
Figure 16 : Supply Voltage (V)
9
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APA4863
Typical Characteristics Cont.
Output Power vs Supply Voltage
Output Power vs Supply Voltage
150
300
VDD=5V, f=1kHz
RL=16Ω, BW<80kHz
SE Mode
110
Output Power
Output Power
250
200
THD+N = 10%
150
100
THD+N = 1%
50
0
VDD=5V, f=1kHz
RL=32Ω, BW<80kHz
SE Mode
130
90
THD+N = 10%
70
50
THD+N = 1%
30
10
2
2.5
3
3.5
4
4.5
5
-10
5.5
2
2.5
Supply Voltage (V)
4.5
5
5.5
Output Power vs Load Resistance
1
1.75
VDD=5V, f=1kHz
AVD=2, BW<80kHz
BTL Mode
1.5
VDD=5V, f=1kHz
AV=-1, BW<80kHz
SE Mode
0.8
1.25
Output Power (W)
Output Power (W)
4
Figure 18
Output Power vs Load Resistance
1
10% THD+N
0.75
0.5
1% THD+N
0.6
0.4
10% THD+N
0.2
0
8
3.5
Supply Voltage (V)
Figure 17
0.25
3
18
28
38
48
58
1% THD+N
68
0
Figure 19 : Load Resistance (Ω)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
0
10 20
30
40
50
60
70
Figure 20 : Load Resistance (Ω)
10
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APA4863
Typical Characteristics Cont.
Power Dissipation vs Output Power
Power Dissipation vs Output Power
1.4
0.18
1
0.8
RL=8Ω
VDD=5V, f=1kHz
THD+N <1%
BW<80kHz
BTL Mode
Power Dissipation
1.2
Power Dissipation
0.16
RL=4Ω
0.6
RL=16Ω
0.4
RL=32Ω
0.2
0
0
0.5
1
0.12
RL=16Ω
0.1
0.08
0.06
RL=32Ω
0.04
0.02
0
1.5
RL=8Ω
0.14
0
0.1
Output Power (W)
0.4
0.5
Figure 22
Noise Floor
Channel Separation
100
+0
VO+ + VO-
Channel Separation (dB)
Output Noise Voltage (µV)
0.3
Output Power (W)
Figure 21
VO10
VDD=5V, RL=8Ω
AVD=2, CB=1µF
1
20
0.2
VDD=5V, f=1kHz
THD+N <1%
BW<80kHz
SE Mode
100
1k
-20
-40
-60
-80
Channel A to B
-100
-120
20
10k 20k
Figure 23 : Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
VDD=5V, RL=8Ω
AVD=2, PO=1W
CB=1µF
BTL Mode
Channel B to A
100
1k
10k 20k
Figure 24 : Frequency (Hz)
11
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APA4863
Typical Characteristics Cont.
Open Loop Frequency Response
Channel Separation
-20
-40
+80
VDD=5V, RL=32Ω
AV=-1, PO=75mW
CB=1µF
SE Mode
+70
VDD=5V
SE Mode
+60
Gain (dB)
Channel Separation (dB)
+0
-60
Channel A to B
-80
Gain
+50
+40
+30
+20
-100
+10
Channel B to A
-120
20
100
1k
Phase
+0
100
10k 20k
1k
10k
100k
1M
10M
Figure 26 : Frequency (Hz)
Figure 25 : Frequency (Hz)
Supply Current vs Supply Voltage
10
VIN=0V
No Load
Supply Current (mA)
8
BTL Mode
(HP-IN=GND)
6
4
SE Mode
(HP-IN=VDD)
2
0
2
2.5
3
3.5
4
4.5
5
5.5
Figure 27 : Supply Voltage(V)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
12
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APA4863
Packaging Information
TSSOP/ TSSOP-P ( Reference JEDEC Registration MO-153)
e
N
2x E/2
E1
1
2 3
E
e/2
D
A2
A
(
2)
GAUGE
PLANE
A1
b
D1
S
R1
EXPOSED THERMAL
PAD ZONE
R
E2
0.25
L
1
(L1)
( 3)
BOTTOM VIEW
(THERMALLY ENHANCED VARIATIONDS ONLY)
Dim
Millimeters
Min.
A
A1
A2
D
D1
e
E
E1
E2
L
L1
R
R1
S
φ1
φ2
φ3
Inches
Max.
1.2
0.15
1.05
6.6 (N=20PIN)
7.9 (N=24PIN)
0.00
0.80
6.4 (N=20PIN)
7.7 (N=24PIN)
2.20 (N=20PIN)
2.70 (N=24PIN) Thermally Enhanced
0.65 BSC
6.40 BSC
4.30
4.50
1.50
0.45
0.75
1.0 REF
0.09
0.09
0.2
0°
8°
12° REF
12° REF
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
13
Min.
Max.
0.047
0.006
0.041
0.260 (N=20PIN)
0.311 (N=24PIN)
0.000
0.031
0.252 (N=20PIN)
0.303 (N=24PIN)
0.087 (N=20PIN)
0.106 (N=24PIN) Thermally Enhanced
0.026 BSC
0.252 BSC
0.169
0.177
0.059
0.018
0.030
0.039REF
0.004
0.004
0.008
0°
8°
12° REF
12° REF
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APA4863
Packaging Information
SO – 300mil ( Reference JEDEC Registration MS-013)
D
N
H
GAUGE
PLANE
E
1
2 3
A
Dim
Millimeters
Min.
Max.
1
A1
B
e
L
Variations- D
Variations Min.
Max. Dim
Inches
Min.
Max.
Variations- D
Variations Min. Max.
A
2.35
2.65
SO-16
10.10
10.50
A
0.093 0.1043
SO-16
0.398 0.413
A1
0.10
0.30
SO-18
11.35
11.76
A1
0.004 0.0120
SO-18
0.447 0.463
B
0.33
0.51
SO-20
12.60
13
B
0.013
0.020
SO-20
0.496 0.512
D
See variations
SO-24
15.20
15.60
D
See variations
SO-24
0.599 0.614
E
7.40
SO-28
17.70
18.11
E
0.2914 0.2992
SO-28
0.697 0.713
SO-14
8.80
9.20
e
0.050BSC
SO-14
0.347 0.362
e
7.60
1.27BSC
H
10
10.65
H
0.394
0.419
L
0.40
1.27
L
0.016
0.050
N
See variations
N
See variations
φ1
0°
φ1
8°
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
14
0°
8°
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APA4863
Physical Specifications
Terminal Material
Lead Solderability
Packaging
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
2000 devices per reel
Reflow Condition
(IR/Convection or VPR Reflow)
temperature
Reference JEDEC Standard J-STD-020A APRIL 1999
Peak temperature
183°C
Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/
Convection
Average ramp-up rate(183°C to Peak)
3°C/second max.
120 seconds max
Preheat temperature 125 ± 25°C)
60 – 150 seconds
Temperature maintained above 183°C
Time within 5°C of actual peak temperature 10 –20 seconds
Peak temperature range
220 +5/-0°C or 235 +5/-0°C
Ramp-down rate
6 °C /second max.
6
minutes max.
Time 25°C to peak temperature
VPR
10 °C /second max.
60 seconds
215-219°C or 235 +5/-0°C
10 °C /second max.
Package Reflow Conditions
pkg. thickness ≥ 2.5mm
and all bgas
Convection 220 +5/-0 °C
VPR 215-219 °C
IR/Convection 220 +5/-0 °C
pkg. thickness < 2.5mm and
pkg. volume ≥ 350 mm³
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
15
pkg. thickness < 2.5mm and pkg.
volume < 350mm³
Convection 235 +5/-0 °C
VPR 235 +5/-0 °C
IR/Convection 235 +5/-0 °C
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APA4863
Reliability test program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B, A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C , 5 SEC
1000 Hrs Bias @ 125 °C
168 Hrs, 100 % RH , 121°C
-65°C ~ 150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms , Itr > 100mA
Carrier Tape & Reel Dimensions
t
D
P
Po
E
P1
Bo
F
W
Ko
Ao
D1
T2
J
C
A
B
T1
Application
SOP-16W
A
330±3
Application
SOP-16W
F
7.5 ± 0.1
B
100 ± 2
C
13 + 0.5
J
2 ± 0.5
T1
T2
16.4 +0.3 2.5± 0.5
-0.2
W
16 ± 0.2
P
12± 0.1
E
1.75± 0.1
D
D1
Po
P1
Ao
Bo
Ko
t
1.5 +0.1 1.5 +0.25 4.0 ± 0.1 2.0 ± 0.1 10.9 ± 0.1 10.8± 0.1 3.0± 0.1 0.3±0.013
(mm)
Cover Tape Dimensions
16
13.3
Carrier Width
Cover Tape Width
(mm)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
16
www.anpec.com.tw
APA4863
Customer Service
Analog and Power Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
24F-1. No. 268, Sec. 2, PeiHsin Rd.
HsinDian, Taipei County, Taiwan, R. O. C.
Tel : 886-2-86658533
Fax : 886-2-86658529
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Apr., 2001
17
www.anpec.com.tw
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