HSMC H1117J 1a low dropout positive voltage regulator Datasheet

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 1998.06.01
Revised Date : 2000.10.01
Page No. : 1/6
H1117J Series
1A LOW DROPOUT POSITIVE VOLTAGE REGULATOR
Features
• Low Dropout Voltage 1.2V at 1A
• Adjustable or Fixed Voltage
• Maximum Line Regulation 0.45%
• Maximum Load Regulation 0.4%
• Adjust Pin Current Less Than 90 uA
• Over Current Protection
• Thermal Protection
Applications
• High Efficiency Linear Regulators
• 5V to 3.3V Voltage Converter
• Battery Charger
General Description
The H1117J is a 1A low-dropout positive voltage regulator. It is available in fixed and adjustable output voltage
versions. Over current and thermal protection are integrated onto the chip. Output current will decrease while it
reaches the pre-set current or temperature limit. The dropout voltage is specified at 1.2V Maximum at full rated
output current. H1117J Series provides excellent regulation over variations due to changes in line, load and
temperature. H1117J is three terminal regulator and available in popular packages.
Device Selection Guide
Device
H1117J(Adj)
H1117-3.3J
Output Voltage
1.3V to 4V
3.3
Package
D-PAK
TO-252
Absolute Maximum Ratings
Parameter
Input Voltage
Power Dissipation
Thermal Resistance Junction To Case TO-252
Thermal Resistance Junction To Ambient TO-252
Operating Junction Temperature Range
Storage Temperature Range
Lead Temperature (Soldering) 10 Sec
Symbol
VIN
PD
θJC
θJA
Tj
TSTG
TLEAD
Maximum
20
Internally Limited
15
156
0 To 125
-65 To 150
260
Units
V
W
°C/W
°C/W
°C
°C
°C
Typical Application
H1117J
+
4.75V
to 20V
DC
10uF
TAN
10uF
TAN
Load
GND
Input Range Depends On VO
Please Refer To Electrical Characteristics.
HSMC Product Specification
HI-SINCERITY
Spec. No. : Preliminary Data
Issued Date : 1998.06.01
Revised Date : 2000.10.01
Page No. : 2/6
MICROELECTRONICS CORP.
Block Diagram
Input
Current
Limiting
Amplifier
Thermal
Protection
Error
AMP
Output
Bandcap
Reference
ADJ/COM
Electrical Characteristics
H1117J (adj version)
Parameter
Reference Voltage
Symbol
VREF
Line Regulation
RegLINE
Load Regulation
RegLOAD
Dropout Voltage
Current Limit
Temperature Coeff.
VD
IS
TC
Adjust Pin Current
Iadj
Adjust Pin Current Change
Temperature Stability
Minimum Load Current
RMS Output Noise
Ripple Rejection Ratio
∆Iadj
TS
IO
VN
RA
Test Conditions
VIN=5V, IO=10mA, Tj=25°C
VIN=5V, IO=10mA, Over Temp.
VIN=4.75~20V, IO=10mA, Tj=25°C
VIN=4.75~20V, IO=10mA, Over Temp.
VIN=5V, IO=10mA~1A,Tj=25°C
VIN=5V, IO=10mA~1A, Over Temp.
IO=10mA~1A, Over Temp., ∆VO=±1%
VIN=2.75~7V, Over Temp.
VIN=2.75~7V, IO=10mA~1A
VIN=2.75~7V, IO=10mA~1A,Tj=25°C
VIN=2.75~7V, IO=10mA~1A, Over Temp.
VIN=2.75~7V, IO=10mA~1A, Over Temp.
VIN=5V, IO=100mA, Over Temp.
VIN=5V
Tj=25°C
VIN=5V, IO=1A, Over Temp.
Min
1.238
1.225
1
60
Typ
1.25
1.25
0.05
0.2
1
0.005
55
0.2
0.5
5
0.003
72
Max
1.262
1.275
0.3
0.45
0.3
0.4
1.2
90
5
10
-
Test Conditions
VIN=5V, IO=0A,Tj=25°C
VIN=5V, IO=0A, Over Temp.
VIN=4.75~20V, IO=0A, Tj=25°C
VIN=4.75~20V, IO=0A, Over Temp.
VIN=5V, IO=0A~1A,Tj=25°C
VIN=5V, IO=0A~1A, Over Temp.
IO=0A~1A, Over Temp., ∆VO=±1%
VIN=4.75~7V, Over Temp.
VIN=5V, IO=0A~1A,Over Temp.
VIN=4.75~7V, IO=0A~1A
VIN=5V, IO=100mA, Over Temp.
Tj=25°C
VIN=5V, IO=1A, Over Temp.
Min
3.270
3.234
1
60
Typ
3.3
3.3
0.05
0.2
1
12
0.005
0.5
0.003
72
Max
3.333
3.366
0.3
0.45
0.3
0.4
1.2
13
-
Units
V
%
%
V
A
%/°C
uA
%
mA
%
dB
H1117-3.3J
Parameter
Symbol
Output Voltage
VO
Line Regulation
RegLINE
Load Regulation
RegLOAD
Dropout Voltage
Current Limit
Quiescent Current
Temperature Coeff.
Temperature Stability
RMS Output Noise
Ripple Rejection Ratio
VD
IS
IQ
TC
TS
VN
RA
Units
V
%
%
V
A
mA
%/°C
%
%
dB
HSMC Product Specification
HI-SINCERITY
Spec. No. : Preliminary Data
Issued Date : 1998.06.01
Revised Date : 2000.10.01
Page No. : 3/6
MICROELECTRONICS CORP.
Characteristics Curve
Load Regulation
Temperature Stability
1.252
0
Reference Voltage (V)
Output Voltage deviation (%)
1.25
-0.05
-0.1
-0.15
1.248
1.246
1.244
1.242
-0.2
1.24
-0.25
1.238
-50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90 100
-50
-25
0
50
75
100
125
Ajust Pin Current
3.5
45
3
40
35
2.5
Adjust Pin Current (uA)
Minimum Operating Current (mA)
Minimum Operating Current
2
1.5
1
0.5
30
25
20
15
10
0
5
-0.5
0
0
0.1
1
1.1 1.2
2
3
5
10
15
20
25
30
35
-50
-25
0
Input /Output Differential (V)
25
50
75
100
125
Temperature (ºC)
Dropout Voltage
Short Circuit Current
1.4
1.4
1.2
Minmum Input/Output Differential (V)
1.6
1.2
Short Circuit Current (A)
25
Temperature (ºC)
Temperature (ºC)
1
0.8
0.6
0.4
0.2
1
0.8
0.6
0.4
0.2
0
0
1.2
1.3
1.5
1.7
2
5
Input/Output Differential (V)
10
15
0.1
0.3
0.5
0.7
Output Current (A)
0.9
1
HSMC Product Specification
HI-SINCERITY
Spec. No. : Preliminary Data
Issued Date : 1998.06.01
Revised Date : 2000.10.01
Page No. : 4/6
MICROELECTRONICS CORP.
Applications Description
• Output Voltage Adjustment
Like most regulators, the H1117J regulates the output by
comparing the output voltage to an internally generated
reference voltage. On the adjustable version, the VREF is
available externally as 1.25V between VOUT and ADJ. The
voltage ratio formed by R1 and R2 should be set to conduct
10mA (minimum output load). The output voltage is given
by the following equation : VOUT =VREF (1+R2/R1) + IADJ R2
On fixed versions of H1117J, the voltage divider is
provided internally.
In
Out
V IN
V OUT
ADJ
V REF
R1
I ADJ
10uA
R2
• Thermal Protection
H1117J has thermal protection which limits junction
VOUT =VREF (1+R2/R1) + IADJ R2
temperature to 150°C. However, device functionality is
only guaranteed to a maximum junction temperature of
+125°C.
The power dissipation and junction temperature for H1117J in TO-252 package given by
PD=(VIN - VOUT) IOUT, TJUNCTION=TAMBIENT+(PDxθJA), Note : TJUNCTION must not exceed 125°C
• Current Limit Protection
H1117J is protected against overload conditions. Current protection is triggered at typically 1.5A.
• Stability And Load Regulation
H1117J requires a capacitor from VOUT to GND to provide
RP
compensation feedback to the internal gain stage. This is
Parasitic
to ensure stability at the output terminal. Typically, a 10uF
Line Resistance
In
Out
tantalum or 50uF aluminum electrolytic is sufficient.
Adj
V IN
Note : It is important that the ESR for this capacitor does
R1
not exceed 0.5Ω.
Connect
RL
R1 to Case
The output capacitor does not have a theoretical upper
limit and increasing its value will increase stability. COUT =
R2
100 uF or more is typical for high current regulator design.
H1117J load regulation is limited by the resistance of the
wire connecting it to the load(RP). For the adjustable
Connect
version, the best load regulation is accomplished when the
R2 to Load
top of the resistor divider(R1) is connected directly to the
output pin of the H1117J. When so connected, RP is not
multiplied by the divider ratio. For fixed output versions,
the top of R1 is internally connected to the output and ground pin can be connected to low side of the load as a
negative side sense if, so desired.
• Thermal Consideration
The H1117J series contain thermal limiting circuitry designed to protect itself for over-temperature conditions.
Even for normal load conditions, maximum junction temperature ratings must not be exceeded. As mention in
thermal protection section, we need to consider all sources of thermal resistance between junction and ambient.
It contains junction-to-case, case-to-heat-sink interface and heat sink resistance itself. An additional heat sink is
applied externally sometimes. It can increase the maximum power dissipation. For example, the equivalent
junction temperature of 300mA output current is 115°C without external heat sink. Under the same junction
temperature IC can operates 500mA with an adequate heat sink. Therefore, to attach an extra heat sink is
recommended.
Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the
die. The bonding wires are appending paths. The former is the lowest resistance path. Proper mounting is
required to ensure the best possible thermal flow this area of the package to the heat sink. Thermal compound at
the case-to-heat-sink interface is strongly recommended. The case of all devices in this series is electrically
connected to the output. Therefore, if the case of the device must be electrically isolated, a thermally conductive
spacer can be used, as long its thermal resistance is considered.
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 1998.06.01
Revised Date : 2000.10.01
Page No. : 5/6
• Protection Diode
(The figure is shown as Regulator with Reverse Diode Protection in advanced applications)
In general operation, H1117J does not need any protection diodes. From the cross-section structure of H1117J,
the output pin is connected to P+ substrate, and the input pin is connected to N- well. There is a parasitic reverse
diode between them. It can handle microsecond surge currents of 5A to 10A. Even with large output capacitance,
it is very difficult to get those values of surge currents in normal operation. Only with high value output capacitors,
such as 1000uF. And with the input pin instantaneously shorted to ground. can damage occur. A crowbar circuit
at the input of the H1117J can generate those kinds of currents, and a diode from output to input is
recommended. Normal power supply cycling or even plugging and unplugging in the system will not generate
currents large enough to do any damage.
HSMC Product Specification
HI-SINCERITY
Spec. No. : Preliminary Data
Issued Date : 1998.06.01
Revised Date : 2000.10.01
Page No. : 6/6
MICROELECTRONICS CORP.
TO-252 Dimension
Marking :
C
A
HSMC Logo
Part Number
Date Code
D
B
Rank
Ink Mark
G
F
L
Product Series
Style : Pin 1.COM/ADJ 2.Vout 3.Vin
3
H
E
K
2
I
1
J
3-Lead TO-252 Plastic Surface Mount Package
HSMC Package Code : J
*:Typical
Inches
Min.
Max.
0.0177 0.0217
0.0650 0.0768
0.0354 0.0591
0.0177 0.0236
0.2520 0.2677
0.2125 0.2283
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
0.45
0.55
1.65
1.95
0.90
1.50
0.45
0.60
6.40
6.80
5.40
5.80
DIM
G
H
I
J
K
L
Inches
Min.
Max.
0.0866 0.1102
*0.0906
0.0354
0.0315
0.2047 0.2165
0.0551 0.0630
Millimeters
Min.
Max.
2.20
2.80
*2.30
0.90
0.80
5.20
5.50
1.40
1.60
Notes : 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
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