HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 1998.06.01 Revised Date : 2000.10.01 Page No. : 1/6 H1117J Series 1A LOW DROPOUT POSITIVE VOLTAGE REGULATOR Features • Low Dropout Voltage 1.2V at 1A • Adjustable or Fixed Voltage • Maximum Line Regulation 0.45% • Maximum Load Regulation 0.4% • Adjust Pin Current Less Than 90 uA • Over Current Protection • Thermal Protection Applications • High Efficiency Linear Regulators • 5V to 3.3V Voltage Converter • Battery Charger General Description The H1117J is a 1A low-dropout positive voltage regulator. It is available in fixed and adjustable output voltage versions. Over current and thermal protection are integrated onto the chip. Output current will decrease while it reaches the pre-set current or temperature limit. The dropout voltage is specified at 1.2V Maximum at full rated output current. H1117J Series provides excellent regulation over variations due to changes in line, load and temperature. H1117J is three terminal regulator and available in popular packages. Device Selection Guide Device H1117J(Adj) H1117-3.3J Output Voltage 1.3V to 4V 3.3 Package D-PAK TO-252 Absolute Maximum Ratings Parameter Input Voltage Power Dissipation Thermal Resistance Junction To Case TO-252 Thermal Resistance Junction To Ambient TO-252 Operating Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering) 10 Sec Symbol VIN PD θJC θJA Tj TSTG TLEAD Maximum 20 Internally Limited 15 156 0 To 125 -65 To 150 260 Units V W °C/W °C/W °C °C °C Typical Application H1117J + 4.75V to 20V DC 10uF TAN 10uF TAN Load GND Input Range Depends On VO Please Refer To Electrical Characteristics. HSMC Product Specification HI-SINCERITY Spec. No. : Preliminary Data Issued Date : 1998.06.01 Revised Date : 2000.10.01 Page No. : 2/6 MICROELECTRONICS CORP. Block Diagram Input Current Limiting Amplifier Thermal Protection Error AMP Output Bandcap Reference ADJ/COM Electrical Characteristics H1117J (adj version) Parameter Reference Voltage Symbol VREF Line Regulation RegLINE Load Regulation RegLOAD Dropout Voltage Current Limit Temperature Coeff. VD IS TC Adjust Pin Current Iadj Adjust Pin Current Change Temperature Stability Minimum Load Current RMS Output Noise Ripple Rejection Ratio ∆Iadj TS IO VN RA Test Conditions VIN=5V, IO=10mA, Tj=25°C VIN=5V, IO=10mA, Over Temp. VIN=4.75~20V, IO=10mA, Tj=25°C VIN=4.75~20V, IO=10mA, Over Temp. VIN=5V, IO=10mA~1A,Tj=25°C VIN=5V, IO=10mA~1A, Over Temp. IO=10mA~1A, Over Temp., ∆VO=±1% VIN=2.75~7V, Over Temp. VIN=2.75~7V, IO=10mA~1A VIN=2.75~7V, IO=10mA~1A,Tj=25°C VIN=2.75~7V, IO=10mA~1A, Over Temp. VIN=2.75~7V, IO=10mA~1A, Over Temp. VIN=5V, IO=100mA, Over Temp. VIN=5V Tj=25°C VIN=5V, IO=1A, Over Temp. Min 1.238 1.225 1 60 Typ 1.25 1.25 0.05 0.2 1 0.005 55 0.2 0.5 5 0.003 72 Max 1.262 1.275 0.3 0.45 0.3 0.4 1.2 90 5 10 - Test Conditions VIN=5V, IO=0A,Tj=25°C VIN=5V, IO=0A, Over Temp. VIN=4.75~20V, IO=0A, Tj=25°C VIN=4.75~20V, IO=0A, Over Temp. VIN=5V, IO=0A~1A,Tj=25°C VIN=5V, IO=0A~1A, Over Temp. IO=0A~1A, Over Temp., ∆VO=±1% VIN=4.75~7V, Over Temp. VIN=5V, IO=0A~1A,Over Temp. VIN=4.75~7V, IO=0A~1A VIN=5V, IO=100mA, Over Temp. Tj=25°C VIN=5V, IO=1A, Over Temp. Min 3.270 3.234 1 60 Typ 3.3 3.3 0.05 0.2 1 12 0.005 0.5 0.003 72 Max 3.333 3.366 0.3 0.45 0.3 0.4 1.2 13 - Units V % % V A %/°C uA % mA % dB H1117-3.3J Parameter Symbol Output Voltage VO Line Regulation RegLINE Load Regulation RegLOAD Dropout Voltage Current Limit Quiescent Current Temperature Coeff. Temperature Stability RMS Output Noise Ripple Rejection Ratio VD IS IQ TC TS VN RA Units V % % V A mA %/°C % % dB HSMC Product Specification HI-SINCERITY Spec. No. : Preliminary Data Issued Date : 1998.06.01 Revised Date : 2000.10.01 Page No. : 3/6 MICROELECTRONICS CORP. Characteristics Curve Load Regulation Temperature Stability 1.252 0 Reference Voltage (V) Output Voltage deviation (%) 1.25 -0.05 -0.1 -0.15 1.248 1.246 1.244 1.242 -0.2 1.24 -0.25 1.238 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 -50 -25 0 50 75 100 125 Ajust Pin Current 3.5 45 3 40 35 2.5 Adjust Pin Current (uA) Minimum Operating Current (mA) Minimum Operating Current 2 1.5 1 0.5 30 25 20 15 10 0 5 -0.5 0 0 0.1 1 1.1 1.2 2 3 5 10 15 20 25 30 35 -50 -25 0 Input /Output Differential (V) 25 50 75 100 125 Temperature (ºC) Dropout Voltage Short Circuit Current 1.4 1.4 1.2 Minmum Input/Output Differential (V) 1.6 1.2 Short Circuit Current (A) 25 Temperature (ºC) Temperature (ºC) 1 0.8 0.6 0.4 0.2 1 0.8 0.6 0.4 0.2 0 0 1.2 1.3 1.5 1.7 2 5 Input/Output Differential (V) 10 15 0.1 0.3 0.5 0.7 Output Current (A) 0.9 1 HSMC Product Specification HI-SINCERITY Spec. No. : Preliminary Data Issued Date : 1998.06.01 Revised Date : 2000.10.01 Page No. : 4/6 MICROELECTRONICS CORP. Applications Description • Output Voltage Adjustment Like most regulators, the H1117J regulates the output by comparing the output voltage to an internally generated reference voltage. On the adjustable version, the VREF is available externally as 1.25V between VOUT and ADJ. The voltage ratio formed by R1 and R2 should be set to conduct 10mA (minimum output load). The output voltage is given by the following equation : VOUT =VREF (1+R2/R1) + IADJ R2 On fixed versions of H1117J, the voltage divider is provided internally. In Out V IN V OUT ADJ V REF R1 I ADJ 10uA R2 • Thermal Protection H1117J has thermal protection which limits junction VOUT =VREF (1+R2/R1) + IADJ R2 temperature to 150°C. However, device functionality is only guaranteed to a maximum junction temperature of +125°C. The power dissipation and junction temperature for H1117J in TO-252 package given by PD=(VIN - VOUT) IOUT, TJUNCTION=TAMBIENT+(PDxθJA), Note : TJUNCTION must not exceed 125°C • Current Limit Protection H1117J is protected against overload conditions. Current protection is triggered at typically 1.5A. • Stability And Load Regulation H1117J requires a capacitor from VOUT to GND to provide RP compensation feedback to the internal gain stage. This is Parasitic to ensure stability at the output terminal. Typically, a 10uF Line Resistance In Out tantalum or 50uF aluminum electrolytic is sufficient. Adj V IN Note : It is important that the ESR for this capacitor does R1 not exceed 0.5Ω. Connect RL R1 to Case The output capacitor does not have a theoretical upper limit and increasing its value will increase stability. COUT = R2 100 uF or more is typical for high current regulator design. H1117J load regulation is limited by the resistance of the wire connecting it to the load(RP). For the adjustable Connect version, the best load regulation is accomplished when the R2 to Load top of the resistor divider(R1) is connected directly to the output pin of the H1117J. When so connected, RP is not multiplied by the divider ratio. For fixed output versions, the top of R1 is internally connected to the output and ground pin can be connected to low side of the load as a negative side sense if, so desired. • Thermal Consideration The H1117J series contain thermal limiting circuitry designed to protect itself for over-temperature conditions. Even for normal load conditions, maximum junction temperature ratings must not be exceeded. As mention in thermal protection section, we need to consider all sources of thermal resistance between junction and ambient. It contains junction-to-case, case-to-heat-sink interface and heat sink resistance itself. An additional heat sink is applied externally sometimes. It can increase the maximum power dissipation. For example, the equivalent junction temperature of 300mA output current is 115°C without external heat sink. Under the same junction temperature IC can operates 500mA with an adequate heat sink. Therefore, to attach an extra heat sink is recommended. Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. The bonding wires are appending paths. The former is the lowest resistance path. Proper mounting is required to ensure the best possible thermal flow this area of the package to the heat sink. Thermal compound at the case-to-heat-sink interface is strongly recommended. The case of all devices in this series is electrically connected to the output. Therefore, if the case of the device must be electrically isolated, a thermally conductive spacer can be used, as long its thermal resistance is considered. HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 1998.06.01 Revised Date : 2000.10.01 Page No. : 5/6 • Protection Diode (The figure is shown as Regulator with Reverse Diode Protection in advanced applications) In general operation, H1117J does not need any protection diodes. From the cross-section structure of H1117J, the output pin is connected to P+ substrate, and the input pin is connected to N- well. There is a parasitic reverse diode between them. It can handle microsecond surge currents of 5A to 10A. Even with large output capacitance, it is very difficult to get those values of surge currents in normal operation. Only with high value output capacitors, such as 1000uF. And with the input pin instantaneously shorted to ground. can damage occur. A crowbar circuit at the input of the H1117J can generate those kinds of currents, and a diode from output to input is recommended. Normal power supply cycling or even plugging and unplugging in the system will not generate currents large enough to do any damage. HSMC Product Specification HI-SINCERITY Spec. No. : Preliminary Data Issued Date : 1998.06.01 Revised Date : 2000.10.01 Page No. : 6/6 MICROELECTRONICS CORP. TO-252 Dimension Marking : C A HSMC Logo Part Number Date Code D B Rank Ink Mark G F L Product Series Style : Pin 1.COM/ADJ 2.Vout 3.Vin 3 H E K 2 I 1 J 3-Lead TO-252 Plastic Surface Mount Package HSMC Package Code : J *:Typical Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2520 0.2677 0.2125 0.2283 DIM A B C D E F Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.40 6.80 5.40 5.80 DIM G H I J K L Inches Min. Max. 0.0866 0.1102 *0.0906 0.0354 0.0315 0.2047 0.2165 0.0551 0.0630 Millimeters Min. Max. 2.20 2.80 *2.30 0.90 0.80 5.20 5.50 1.40 1.60 Notes : 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification