CALMIRCO CM1418-02CP Praetorianâ ¢ l-c emi filter with esd protection for headset speaker application Datasheet

PRELIMINARY
CM1418
Praetorian™ L-C EMI Filter with ESD Protection
for Headset Speaker Applications
Features
Product Description
•
•
•
•
•
California Micro Devices’ CM1418 is an L-C EMI filter
array with ESD protection, which integrates two Pifilters (C-L-C) for the headset speaker. The CM1418
has component values of 117pF-3.0nH-117pF. The
parts include ESD protection diodes on all input/output
pins, which provide a very high level of protection for
sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The ESD diodes
connected to the filter ports safely dissipate ESD
strikes of ±30kV, beyond the maximum requirement of
the IEC61000-4-2 international standard. Using the
MIL-STD-883 (Method 3015) specification for Human
Body Model (HBM) ESD, the pins are protected for
contact discharges at greater than ±30kV.
•
•
•
2 channels of EMI filtering
±30kV ESD protection
(IEC 61000-4-2, contact discharge)
±30kV ESD protection (HBM)
OptiGuard™ Coating for improved reliability at
assembly
Greater than 35dB of attenuation at 1GHz
6-bump, 1.720mm x 1.220mm footprint Chip Scale
Package (CSP)
Lead-free version available
Applications
•
•
•
Headset Speaker port in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
This device is particularly well suited for portable
electronics (e.g. mobile handsets, PDAs, notebook
computers) because of its small package format and
easy-to-use pin assignments.
In particular, the
CM1418 is ideal for EMI filtering and protecting
speaker output lines from ESD for the headset speaker
in mobile handsets. Most speakers have impedance of
8Ω and in order to maximize the power output, the
resistance of an EMI filter needs to be as low as
possible and the CM1418 addresses this by having a
C-L-C based EMI filter where the inductor has less
than 0.35Ω of resistance.
The CM1418 is available either uncoated or with OptiGuard™ coating resulting in improved reliability at
assembly. The CM1418 is also available in a space
saving, low profile Chip Scale Package with optional
lead-free finishing.
Electrical Schematic
FILTER #1
3nH
A1
117pF
GND
FILTER #2
FILTER #1
A2
3nH
B1
117pF
GND
A3
117pF
B3
FILTER #2
117pF
B2
© 2005 California Micro Devices Corp. All rights reserved.
12/13/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
PRELIMINARY
CM1418
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
1
A
B
2
3
XX
Orientation
Marking
B1
B2
B3
A1
A2
A3
A1
CM1418
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN
NAME
A1
Filter #1
DESCRIPTION
Filter #1 Input
A2
GND
Device Ground
A3
Filter #1
Filter #1 Input
B1
Filter #2
Filter #2 Input
B2
GND
Device Ground
B3
Filter #2
Filter #2 Input
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
Pins
Package
OptiGuard™
Coating
Ordering Part
Number1
Part Marking
Ordering Part
Number1
Part Marking
6
CSP
Y
CM1418-02CS
CG
CM1418-02CP
CG
6
CSP
N
CM1418-0BCS
AL
CM1418-0BCP
AL
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
12/13/05
PRELIMINARY
CM1418
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Current per Inductor
30
mA
DC Package Power Rating
0.5
W
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL
PARAMETER
L
Inductance
R
DC Channel Resistance
CONDITIONS
MIN
TYP
MAX
3.0
UNITS
nH
0.28
0.35
Ω
Total Channel Capacitance
2.5V dc; 1MHz, 30mV ac
187
234
281
pF
C1
Capacitance C1
2.5V dc; 1MHz, 30mV ac
93
117
140
pF
VST
Stand-off Voltage
I = 10μA
6.0
ILEAK
Diode Leakage Current
VIN = ±3.3V
0.1
1.0
μA
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
6.8
-6.8
9.0
-5.6
V
V
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
CTOT
RDYN
fC
5.6
-9.0
V
Notes 2 and 3
Dynamic Resistance
Positive
Negative
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
L = 3nH, C = 117pF
±30
kV
±30
kV
0.95
0.90
Ω
Ω
22
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: These parameters are guaranteed by design and characterization.
© 2005 California Micro Devices Corp. All rights reserved.
12/13/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
3
PRELIMINARY
CM1418
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (Filter #1 to GND B2)
To be determined
Figure 2. Insertion Loss vs. Frequency (Filter #2 to GND B2)
© 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
12/13/05
PRELIMINARY
CM1418
Capacitance (Normalized)
1.2
1
0.8
0.6
0.4
0.2
0
-6
-5
-4
-3
-2
-1
0
1
2
3
4
5
6
Voltage
Figure 3. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC)
© 2005 California Micro Devices Corp. All rights reserved.
12/13/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
PRELIMINARY
CM1418
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste
240°C
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 4. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 5. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 6. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
12/13/05
PRELIMINARY
CM1418
Mechanical Details
CM1418 CSP Mechanical Specifications
The CM1418 is supplied in 6-bump Chip Scale Package (CSP). Dimensions are presented below.
Mechanical Package Diagrams
Non-Coated CSP
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
6
Min
Nom
Max
A1
C1
Inches
Min
Nom
B1
B2
Dim
Millimeters
BOTTOM VIEW
Max
1.175 1.220 1.265 0.0463 0.0480 0.0498
3
A2
1.675 1.720 1.765 0.0659 0.0677 0.0695
2
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
1
B2
0.495 0.500 0.505 0.0195 0.0197 0.0199
C1
0.310 0.360 0.410 0.0122 0.0142 0.0161
0.310 0.360 0.410 0.0122 0.0142 0.0161
D1
0.562 0.606 0.650 0.0221 0.0239 0.0256
D2
0.356 0.381 0.406 0.0140 0.0150 0.0160
D3
0.575 0.644 0.714 0.0226 0.0254 0.0281
D4
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
A
B
C2
C2
A2
A1
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
OptiGuard™ Coated CSP
3500 pieces
BOTTOM VIEW
OptiGuardTM
Coating
A1
C1
Controlling dimension: millimeters
SIDE
VIEW
B2
B1
3
A2
2
1
B
A
C2
D3
D4
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
NOTE: DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1418-0xCS/CP
6-bump Chip Scale Package
© 2005 California Micro Devices Corp. All rights reserved.
12/13/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
7
PRELIMINARY
CM1418
Mechanical Details (cont’d)
CSP Tape and Reel Specifications
TAPE WIDTH
W
REEL
DIA.
QTY
PER
REEL
P0
P1
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
CM1418-02CS/CP
1.72 X 1.22 X 0.67
2.08 x 1.45 x 0.71
8mm
178mm (7")
3500
4mm
4mm
CM1418-02CS/CP
1.72 X 1.22 X 0.61
2.08 x 1.45 x 0.71
8mm
178mm (7")
3500
4mm
4mm
Po
Top
Cover
Tape
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Ao
W
Bo
Ko
For tape feeder reference
only including draft.
Concentric around B.
Embossment
Center Lines
of Cavity
P1
User Direction of Feed
Figure 7. Tape and Reel Mechanical DataTape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
12/13/05
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