MSR860, MSRF860 SWITCHMODEt Soft Recovery Power Rectifiers Plastic TO−220 Package These state−of−the−art devices are designed for use as free wheeling diodes in variable speed motor control applications and switching power supplies. Features • Soft Recovery with Guaranteed Low Reverse Recovery Charge • • • • • (QRR) and Peak Reverse Recovery Current (IRRM) 150°C Operating Junction Temperature Epoxy meets UL 94 V−0 @ 0.125 in Low Forward Voltage Low Leakage Current Pb−Free Package is Available http://onsemi.com SOFT RECOVERY POWER RECTIFIER 8.0 AMPERES, 600 VOLTS 1 4 3 4 Mechanical Characteristics: 4 • Case: Epoxy, Molded • Weight: 1.9 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • Leads Readily Solderable Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds MAXIMUM RATINGS Rating Symbol Value Unit VRRM VRWM VR 600 V IO 8.0 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 125°C) IFRM 16 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 100 A Tstg, TC −65 to +150 °C TJ −65 to +150 °C Parameter Symbol Value Unit MSR860 Thermal Resistance, Junction−to−Case Thermal Resistance, Junction−to−Ambient RqJC RqJA 1.6 72.8 Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR, TC = 125°C) Storage/Operating Case Temperature Operating Junction Temperature 1 1 3 TO−220AC CASE 221B STYLE 1 MARKING DIAGRAMS AY WWG MSR860 KA A Y WW G KA THERMAL CHARACTERISTICS MSRF860 Thermal Resistance, Junction−to−Case Thermal Resistance, Junction−to−Ambient RqJC RqJA °C/W 4.75 75 June, 2008 − Rev. 5 Device 1 AY WWG MSRF860 KA = Assembly Location = Year = Work Week = Pb−Free Package = Diode Polarity ORDERING INFORMATION °C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2008 3 TO−220 FULLPAK CASE 221E STYLE 1 Package Shipping MSR860 TO−220AC 50 Units/Rail MSR860G TO−220AC (Pb−Free) 50 Units/Rail MSRF860G TO−220FP (Pb−Free) 50 Units/Rail Publication Order Number: MSR860/D MSR860, MSRF860 ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (IF = 8.0 A) (Note 1) Maximum Typical VF Maximum Instantaneous Reverse Current (VR = 600 V) Maximum Typical IR Maximum Reverse Recovery Time (Note 2) (VR = 400 V, IF = 8.0 A, di/dt = 200 A/ms) trr Maximum Typical Value Unit TJ = 25°C TJ = 150°C 1.7 1.4 1.3 1.1 TJ = 25°C TJ = 150°C 10 2.0 1000 80 TJ = 25°C TJ = 125°C 120 95 190 125 V mA ns Typical Recovery Softness Factor (VR = 400 V, IF = 8.0 A, di/dt = 200 A/ms) s = tb/ta 2.5 3.0 Maximum Peak Reverse Recovery Current (VR = 400 V, IF = 8.0 A, di/dt = 200 A/ms) IRRM 5.8 8.3 A Maximum Reverse Recovery Charge (VR = 400 V, IF = 8.0 A, di/dt = 200 A/ms) QRR 350 700 nC 1. Pulse Test: Pulse Width ≤ 380 ms, Duty Cycle ≤ 2% 2. TRR measured projecting from 25% of IRRM to zero current TYPICAL ELECTRICAL CHARACTERISTICS 100 100 IR , REVERSE CURRENT ( mA) TJ = 150°C 125°C 10 100°C 1 25°C 0.1 100°C 100 200 300 400 500 600 VR, REVERSE VOLTAGE (VOLTS) 25°C 10 Figure 2. Typical Reverse Current IF(AV) , AVERAGE FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) TJ = 150°C 1 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 14 12 dc 10 SQUARE WAVE 8 6 4 RATED VR APPLIED 2 0 0 40 80 120 VF, FORWARD VOLTAGE DROP (VOLTS) TC, CASE TEMPERATURE (°C) Figure 1. Typical Forward Voltage Figure 3. Current Derating, Case http://onsemi.com 2 160 MSR860, MSRF860 PF(AV) , AVERAGE POWER DISSIPATION (WATTS) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) TYPICAL ELECTRICAL CHARACTERISTICS 3.0 2.5 2.0 dc 1.5 SQUARE WAVE 1.0 RATED VR APPLIED 0.5 0 0 40 80 120 TA, AMBIENT TEMPERATURE (°C) 160 16 14 12 10 SQUARE WAVE 6 4 TJ = 150°C 2 0 0 2 4 6 8 10 12 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 4. Current Derating, Ambient 250 TJ = 25°C VR = 400 V 140 120 t rr , REVERSE RECOVERY TIME (ns) t rr , REVERSE RECOVERY TIME (ns) 14 Figure 5. Power Dissipation 160 IF = 16 A 100 80 8A 60 4A 40 20 0 100 TJ = 125°C VR = 400 V 200 IF = 16 A 150 8A 100 4A 50 0 200 300 400 500 100 200 dIF/dt (A/mS) IRRM, PEAK REVERSE RECOVERY CURRENT (AMPS) IF = 16 A 6 8A 4A 4 2 TJ = 25°C VR = 400 V 0 200 300 400 500 Figure 7. Typical Reverse Recovery Time 8 100 300 dIF/dt (A/mS) Figure 6. Typical Reverse Recovery Time I RRM , PEAK REVERSE RECOVERY CURRENT (AMPS) dc 8 400 500 14 12 IF = 16 A 10 8 4A 8A 6 4 TJ = 125°C VR = 400 V 2 0 100 dIF/dt (A/mS) 200 300 400 dIF/dt (A/mS) Figure 9. Typical Peak Reverse Recovery Current Figure 8. Typical Peak Reverse Recovery Current http://onsemi.com 3 500 MSR860, MSRF860 TYPICAL ELECTRICAL CHARACTERISTICS 900 Q RR , REVERSE RECOVERY CHARGE (nC) Q RR , REVERSE RECOVERY CHARGE (nC) 350 300 250 IF = 16 A 200 8A 150 4A 100 TJ = 25°C VR = 400 V 50 0 100 200 300 400 800 IF = 16 A 700 600 8A 500 400 4A 300 200 TJ = 125°C VR = 400 V 100 0 500 100 200 dIF/dt (A/mS) 400 500 Figure 11. Typical Reverse Recovery Charge Figure 10. Typical Reverse Recovery Charge 250 90 IF = 16 A 80 E OFF , SWITCHING OFF LOSSES ( m J) E OFF , SWITCHING OFF LOSSES ( m J) 300 dIF/dt (A/mS) 70 60 50 8A 40 30 4A 20 TJ = 25°C VR = 400 V 10 IF = 16 A 200 150 8A 100 4A 50 TJ = 125°C VR = 400 V 0 0 100 200 300 dlF/dt (A/mS) 400 500 100 200 300 dIF/dt (A/mS) 400 500 Figure 13. Typical Switching Off Losses Figure 12. Typical Switching Off Losses r(t), TRANSIENT THERMAL RESPONSE (NORMALIZED) 1.0 D = 0.5 0.1 0.1 0.05 P(pk) 0.01 t1 SINGLE PULSE t2 DUTY CYCLE, D = t1/t2 ZqJC(t) = r(t) RqJC RqJC = 1.6°C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) ZqJC(t) 0.01 0.01 0.1 1.0 10 t, TIME (ms) Figure 14. Thermal Response (MSR860) http://onsemi.com 4 100 1000 MSR860, MSRF860 r(t), TRANSIENT THERMAL RESPONSE (NORMALIZED) (°C/W) 10 D = 0.5 1.0 0.1 0.2 0.1 0.05 0.02 P(pk) 0.01 0.01 t1 SINGLE PULSE 0.001 0.000001 0.00001 t2 DUTY CYCLE, D = t1/t2 0.0001 0.001 0.01 t, TIME (s) 0.1 1.0 ZqJC(t) = r(t) RqJC RqJC = 1.6°C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) ZqJC(t) 10 100 1000 Figure 15. Thermal Response, (MSRF860) Junction−to−Case (RqJC) r(t), TRANSIENT THERMAL RESPONSE (NORMALIZED) (°C/W) 100 10 D = 0.5 0.2 0.1 0.05 0.02 1.0 0.01 P(pk) 0.1 0.01 0.001 0.000001 t1 SINGLE PULSE 0.00001 t2 DUTY CYCLE, D = t1/t2 0.0001 0.001 0.01 t, TIME (s) 0.1 1.0 ZqJC(t) = r(t) RqJC RqJC = 1.6°C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) ZqJC(t) 10 Figure 16. Thermal Response, (MSRF860) Junction−to−Ambient (RqJA) http://onsemi.com 5 100 1000 MSR860, MSRF860 PACKAGE DIMENSIONS TO−220 TWO−LEAD CASE 221B−04 ISSUE E C B Q F T S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L Q R S T U 4 A 1 U 3 H K L R D J G INCHES MIN MAX 0.595 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.161 0.190 0.210 0.110 0.130 0.014 0.025 0.500 0.562 0.045 0.060 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 MILLIMETERS MIN MAX 15.11 15.75 9.65 10.29 4.06 4.82 0.64 0.89 3.61 4.09 4.83 5.33 2.79 3.30 0.36 0.64 12.70 14.27 1.14 1.52 2.54 3.04 2.04 2.79 1.14 1.39 5.97 6.48 0.000 1.27 STYLE 1: PIN 1. 2. 3. 4. CATHODE N/A ANODE CATHODE TO−220 FULLPAK, 2−LEAD CASE 221E−01 ISSUE A SEATING PLANE −T− −B− F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. C DIM A B C D F G H J K L N Q R S U S Q U A 1 2 3 H −Y− K G N L J R M B M MILLIMETERS MIN MAX 15.67 16.07 9.96 10.36 4.50 4.90 0.60 1.00 3.08 3.28 2.54 BSC 2.98 3.38 0.45 0.64 12.68 14.27 1.14 1.52 5.08 BSC 3.10 3.50 2.56 2.96 2.34 2.74 6.48 6.88 STYLE 1: PIN 1. CATHODE 2. N/A 3. ANODE D 2 PL 0.25 (0.010) INCHES MIN MAX 0.617 0.633 0.392 0.408 0.177 0.193 0.024 0.039 0.121 0.129 0.100 BSC 0.117 0.133 0.018 0.025 0.499 0.562 0.045 0.060 0.200 BSC 0.122 0.138 0.101 0.117 0.092 0.108 0.255 0.271 Y SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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