Ferrites and accessories P 4.6 × 4.1 Core Series/Type: B65495 Date: June 2013 Data Sheet EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company. P 4.6 4.1 Core B65495 Miniature pot cores ■ The unit can be fixed to the terminal carrier by glue ■ Space requirements of the inductor 5 5.1 mm (without terminals) ■ Delivery mode: sets Magnetic characteristics (per set) l/A le Ae Ve = 2.7 mm–1 = 7.6 mm = 2.8 mm2 = 21.3 mm3 Approx. weight 0.17 g/set Ungapped e Material AL value nH M33 200 +40/–30% 430 B65495B0000Y033 N30 800 +40/–30% 1730 B65495B0000Y030 Please read Cautions and warnings and Important notes at the end of this document. 2 06/13 Ordering code -B with center hole Ferrites and accessories Cautions and warnings Cautions and warnings Mechanical stress and mounting Ferrite cores have to meet mechanical requirements during assembling and for a growing number of applications. Since ferrites are ceramic materials one has to be aware of the special behavior under mechanical load. As valid for any ceramic material, ferrite cores are brittle and sensitive to any shock, fast changing or tensile load. Especially high cooling rates under ultrasonic cleaning and high static or cyclic loads can cause cracks or failure of the ferrite cores. For detailed information see chapter “Definitions”, section 8.1. Effects of core combination on AL value Stresses in the core affect not only the mechanical but also the magnetic properties. It is apparent that the initial permeability is dependent on the stress state of the core. The higher the stresses are in the core, the lower is the value for the initial permeability. Thus the embedding medium should have the greatest possible elasticity. For detailed information see chapter “Definitions”, section 8.2. Heating up Ferrites can run hot during operation at higher flux densities and higher frequencies. NiZn-materials The magnetic properties of NiZn-materials can change irreversible in high magnetic fields. Processing notes – The start of the winding process should be soft. Else the flanges may be destroid. – To strong winding forces may blast the flanges or squeeze the tube that the cores can no more be mount. – To long soldering time at high temperature (>300 °C) may effect coplanarity or pin arrangement. – Not following the processing notes for soldering of the J-leg terminals may cause solderability problems at the transformer because of pollution with Sn oxyd of the tin bath or burned insulation of the wire. For detailed information see chapter “Processing notes”, section 8.2. – The dimensions of the hole arrangement have fixed values and should be understood as a recommendation for drilling the printed circuit board. For dimensioning the pins, the group of holes can only be seen under certain conditions, as they fit into the given hole arrangement. To avoid problems when mounting the transformer, the manufacturing tolerances for positioning the customers’ drilling process must be considered by increasing the hole diameter. 3 06/13 Ferrites and accessories Symbols and terms Symbols and terms Symbol Meaning Unit A Ae AL AL1 Amin AN AR B B B̂ B̂ BDC BR BS C0 CDF DF d Ea f fcutoff fmax fmin fr fCu g H Ĥ HDC Hc h h/i 2 I IDC Î J k k3 k3c L Cross section of coil Effective magnetic cross section Inductance factor; AL = L/N2 Minimum inductance at defined high saturation ( a) Minimum core cross section Winding cross section Resistance factor; AR = RCu /N2 RMS value of magnetic flux density Flux density deviation Peak value of magnetic flux density Peak value of flux density deviation DC magnetic flux density Remanent flux density Saturation magnetization Winding capacitance Core distortion factor Relative disaccommodation coefficient DF = d/i Disaccommodation coefficient Activation energy Frequency Cut-off frequency Upper frequency limit Lower frequency limit Resonance frequency Copper filling factor Air gap RMS value of magnetic field strength Peak value of magnetic field strength DC field strength Coercive field strength Hysteresis coefficient of material Relative hysteresis coefficient RMS value of current Direct current Peak value of current Polarization Boltzmann constant Third harmonic distortion Circuit third harmonic distortion Inductance mm2 mm2 nH nH mm2 mm2 = 10–6 Vs/m2, mT Vs/m2, mT Vs/m2, mT Vs/m2, mT Vs/m2, mT Vs/m2, mT Vs/m2, mT F = As/ V mm–4.5 J s–1, Hz s–1, Hz s–1, Hz s–1, Hz s–1, Hz mm A/m A/m A/m A/m 10–6 cm/A 10–6 cm/A A A A Vs/m2 J/K H = Vs/A 4 06/13 Ferrites and accessories Symbols and terms Symbol Meaning Unit L/L L0 LH Lp Lrev Ls le lN N PCu Ptrans PV PF Q R RCu Rh Rh Ri Rp Rs Rth RV s T T TC t tv tan tanL tanr tane tanh tan/i U Û Ve Z Zn Relative inductance change Inductance of coil without core Main inductance Parallel inductance Reversible inductance Series inductance Effective magnetic path length Average length of turn Number of turns Copper (winding) losses Transferrable power Relative core losses Performance factor Quality factor (Q = L/Rs = 1/tanL) Resistance Copper (winding) resistance (f = 0) Hysteresis loss resistance of a core Rh change Internal resistance Parallel loss resistance of a core Series loss resistance of a core Thermal resistance Effective loss resistance of a core Total air gap Temperature Temperature difference Curie temperature Time Pulse duty factor Loss factor Loss factor of coil (Residual) loss factor at H 0 Relative loss factor Hysteresis loss factor Relative loss factor of material at H 0 RMS value of voltage Peak value of voltage Effective magnetic volume Complex impedance Normalized impedance |Z|n = |Z| /N 2 (le /Ae) H H H H H H mm mm W W mW/g 5 06/13 K/W mm °C K °C s V V mm3 /mm Ferrites and accessories Symbols and terms Symbol Meaning Unit F e r B i s 0 a app e i p' p" r rev s' s" tot Temperature coefficient (TK) Relative temperature coefficient of material Temperature coefficient of effective permeability Relative permittivity Magnetic flux Efficiency of a transformer Hysteresis material constant Hysteresis core constant Magnetostriction at saturation magnetization Relative complex permeability Magnetic field constant Relative amplitude permeability Relative apparent permeability Relative effective permeability Relative initial permeability Relative real (inductive) component of (for parallel components) Relative imaginary (loss) component of (for parallel components) Relative permeability Relative reversible permeability Relative real (inductive) component of (for series components) Relative imaginary (loss) component of (for series components) Relative total permeability derived from the static magnetization curve Resistivity Magnetic form factor DC time constant Cu = L/RCu = AL/AR Angular frequency; = 2 f 1/K 1/K 1/K Vs mT-1 A–1H–1/2 Vs/Am m–1 mm–1 s s–1 l/A Cu All dimensions are given in mm. Surface-mount device 6 06/13 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. 7 06/13