Infineon BCX68-25 For general af application Datasheet

BCX68...
NPN Silicon AF Transistors
• For general AF applications
1
2
• High collector current
3
2
• High current gain
• Low collector-emitter saturation voltage
• Complementary type: BCX69 (PNP)
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
Type
Marking
Pin Configuration
Package
BCX68-10
CB
1=B
2=C
3=E
SOT89
BCX68-16
CC
1=B
2=C
3=E
SOT89
BCX68-25
CD
1=B
2=C
3=E
SOT89
Maximum Ratings
Parameter
Symbol
Collector-emitter voltage
VCEO
20
Collector-base voltage
VCBO
25
Emitter-base voltage
VEBO
5
Collector current
IC
1
Peak collector current, tp ≤ 10 ms
ICM
2
Base current
IB
100
Peak base current
IBM
200
Total power dissipation-
Ptot
3
W
150
°C
Value
Unit
V
A
mA
TS ≤ 114 °C
Junction temperature
Tj
Storage temperature
Tstg
Thermal Resistance
Parameter
Symbol
Junction - soldering point1)
RthJS
-65 ... 150
Value
≤ 12
Unit
K/W
1For calculation of R
thJA please refer to Application Note AN077 (Thermal Resistance Calculation)
1
2011-10-06
BCX68...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
min.
typ. max.
DC Characteristics
Collector-emitter breakdown voltage
V(BR)CEO 20
Unit
V
IC = 30 mA, IB = 0
Collector-base breakdown voltage
V(BR)CBO
25
-
-
V(BR)EBO
5
-
-
IC = 10 µA, IE = 0
Emitter-base breakdown voltage
IE = 1 µA, IC = 0
Collector-base cutoff current
µA
ICBO
VCB = 25 V, IE = 0
-
-
0.1
VCB = 25 V, IE = 0 , TA = 150 °C
-
-
100
DC current gain1)
-
hFE
IC = 5 mA, VCE = 10 V
50
-
-
IC = 500 mA, VCE = 1 V, BCX68-10
85
100
160
IC = 500 mA, VCE = 1 V, BCX68-16
100
160
250
IC = 500 mA, VCE = 1 V, BCX68-25
160
250
375
IC = 1 A, VCE = 1 V
60
-
-
-
-
0.5
IC = 5 mA, VCE = 10 V
-
0.6
-
IC = 1 A, VCE = 1 V
-
-
1
-
100
-
Collector-emitter saturation voltage1)
VCEsat
V
IC = 1 A, IB = 100 mA
Base-emitter voltage1)
VBE(ON)
AC Characteristics
Transition frequency
fT
MHz
IC = 100 mA, VCE = 5 V, f = 20 MHz
1Pulse
test: t < 300µs; D < 2%
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2011-10-06
BCX68...
DC current gain hFE = ƒ(IC)
VCE = 1 V
10 3
Collector-emitter saturation voltage
IC = ƒ(VCEsat ), hFE = 10
BCX 68
EHP00464
10
4 BCX 68
EHP00465
mA
5
h FE
ΙC
100 ˚C
10
25 ˚C
10 2
3
5
-50 ˚C
100 ˚C
25 ˚C
-50 ˚C
5
10
2
5
10 1
10
5
1
5
10 0
10 0
10
5 10 2
5 10 1
5 10 3
0
mA 10 4
0
0.2
0.4
0.6
Base-emitter saturation voltage
Collector current IC = ƒ(VBE )
IC = ƒ(VBEsat), hFE = 10
VCE = 1V
BCX 68
0.8
VCE sat
ΙC
10 4
V
EHP00467
10 4
mA
BCX 68
EHP00461
mA
ΙC
ΙC
10
3
10 3
5
5
100 ˚C
25 ˚C
-50 ˚C
100 ˚C
25 ˚C
-50 ˚C
10 2
10 2
5
5
10
1
10
5
5
10 0
1
0
0.2
0.4
0.6
0.8
10 0
1.0 V 1.2
0
0.2
0.4
0.6
0.8
1.0 V 1.2
VBE
VBE sat
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2011-10-06
BCX68...
Collector cutoff current ICBO = ƒ(TA)
VCB = 25 V
BCX 68
10 5
nA
Ι CB0
Transition frequency fT = ƒ(IC)
VCE = 5 V
EHP00466
10 3
BCX 68
EHP00463
MHz
fT
max
10 4
5
5
10 3
5
10 2
typ
10 2
5
10
5
1
5
10 0
0
50
100
10 1
10 0
150
˚C
5 10 1
5
10 2
mA
10 3
ΙC
TA
Total power dissipation P tot = ƒ(TS)
Permissible Pulse Load RthJS = ƒ(tp)
10 2
3.5
W
Ptot
RthJS
2.5
10 1
2
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0
1.5
10 0
1
0.5
0
0
15
30
45
60
75
90 105 120 °C
10 -1 -6
10
150
ts
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
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2011-10-06
BCX68...
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp )
Ptotmax/PtotDC
10 3
-
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 2
10 1
10 0 -6
10
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
5
2011-10-06
Package SOT89
BCX68...
Package Outline
4.5 ±0.1
45˚
B
1.5 ±0.1
1)
1.6 ±0.2
0.2 MAX.
2
2.75 +0.1
-0.15
10˚ MAX.
1 ±0.2
1
0.15
4 ±0.25
1 ±0.1
1)
2.5 ±0.1
0.25 ±0.05
3
1.5
0.35 ±0.1
0.45 +0.2
-0.1
3
0.15
M
B x3
0.2 B
1) Ejector pin markings possible
Foot Print
1.2
1.0
2.5
2.0
0.8
0.8
0.7
Marking Layout (Example)
BAW78D
Type code
Pin 1
2005, June
Date code (YM)
Manufacturer
Standard Packing
Reel ø180 mm = 1.000 Pieces/Reel
Reel ø330 mm = 4.000 Pieces/Reel
0.2
4.6
12
8
Pin 1
4.3
6
1.6
2011-10-06
BCX68...
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
 2009 Infineon Technologies AG
All Rights Reserved.
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The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
7
2011-10-06
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