CL2 Simple 90V, 20mA, Temperature Compensated, Constant-Current LED Driver IC Features Description • • • • CL2 is a high voltage, temperature compensated, constant-current source. The device is trimmed to provide a constant current of 20 mA ±10% at an input voltage of 5–90V. The device can be used as a two-terminal, constant-current source or constant-current sink. 5.0 to 90V operating range (VA-B) 20 mA ±10% at 5.0 - 90V 0.01%/°C typical temperature coefficient Available in TO-243AA (SOT-89), TO-252(DPAK), & TO-92 packages • Can be paralleled for higher current A typical application for the CL2 is to drive LEDs with a constant current of 20 mA. Multiple CL2s can also be used in parallel to provide higher currents such as 40 mA, 60 mA or 80 mA. The device is available in TO243AA (SOT-89), TO-252 (D-PAK), and TO-92 packages. Applications • • • • • • • LED driver Industrial lamp indicators Signage Accent lighting Automotive Constant current source Constant current sink Package Type VB VB VB VA N/C NC TO-92 VA TO-252 (D-PAK) VA VB N/C TO-243AA (SOT-89) See Table 2-1 for pin information 2015 Microchip Technology Inc. DS20005448A-page 1 CL2 Typical Application Circuit VA Functional Circuit Diagram VA CL2 Up to 90V + VLED(total) 100nF VB + ILED <20mA Control Circuit and Temperature Compensation VLED(total) VB - DS20005448A-page 2 2015 Microchip Technology Inc. CL2 1.0 ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS† Operating voltage, VA-B ........................................................................................................................................... 100V Operating junction temperature, Tj ........................................................................................................... -40 to +125 °C Storage Temperature, Ts .......................................................................................................................... -55 to +150 °C † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC AND AC CHARACTERISTICS Electrical Specifications: Unless otherwise specified, for all specifications TA = +25°C Parameter Operating voltage Current regulation IA-B temperature coefficient Operating junction temperature Dynamic resistance Symbol Min Typ Max VA-B 5.0 - 90 Units Conditions V --- IA-B 18.0 20 22 mA ∆IA-B/∆T - 0.01 - %/°C VA-B= 5.0V - 90V Tj -40 - 125 °C --- RA-B - 300 - kΩ --- VA-B= 45V, Tj= -40°C to +100°C TEMPERATURE SPECIFICATIONS Parameter Symbol Min Typ Max Units Conditions Operating Junction Temperature Tj -40 – 125 °C Storage Temperature Ts -55 – 150 °C Thermal Resistance, TO-92 θja – 132 – °C/W Thermal Resistance, TO-252 θja – 81 – °C/W Note 1 Thermal Resistance, TO-243AA θja – 133 – °C/W Note 1 Temperature Ranges Package Thermal Resistances Note 1: Mounted on FR4 board, 25mm x 25mm x 1.57 mm TABLE 1-1: THERMAL CHARACTERISTICS Package Power Dissipation @TA = 2.5°C (W) Conditions TO-92 0.6 TO-252 2.0 Note 1 TO-243AA 1.3 Note 1 Note 1: Mounted on FR4 board, 25mm x 25mm x 1.57 mm 2015 Microchip Technology Inc. DS20005448A-page 3 CL2 2.0 PIN DESCRIPTION The locations of the pins are listed in Package Type and Packaging Information. TABLE 2-1: PIN DESCRIPTION Pin # TO-92 Pin # TO-252 Pin # To-243AA Symbol Function 1 1 1 VA Current in 2 3 3 NC No connect 3 4 2,4 VB Current out DS20005448A-page 4 2015 Microchip Technology Inc. CL2 3.0 FUNCTIONAL DESCRIPTION Figure 3-1 provides the Functional Circuit diagram and its equivalent block diagram for CL2. Performance information is available in Figure 3-2 and Figure 3-3. Figure 3-4 and Figure 3-5 provide example schematics. VA VA Control Circuit and Temperature Compensation 20mA ±10% VB VB Equivalent Block Diagram Functional Circuit Diagram FIGURE 3-1: Functional Circuit Diagram and Equivalent Block Diagram Current, normalized to 25°C 1.03 1.02 5.0V 45V 1.01 90V 1.00 0.99 0.98 -55 -35 -15 5 25 45 65 85 105 125 145 Temperature (°C) FIGURE 3-2: Temperature Characteristics 2015 Microchip Technology Inc. DS20005448A-page 5 CL2 25 IA-B (mA) 20 15 10 5 0 0 10 20 30 40 50 60 70 80 90 100 VA-B FIGURE 3-3: Output Current vs Voltage VA CL2 Up to 90V +VLED(total) VA CL2 VA VA CL2 CL2 100nF VB VB VB VB + ILED ~20mA ILED ~20mA ILED ~20mA ILED ~20mA +VLED(total) - FIGURE 3-4: DS20005448A-page 6 CL2 for Multiple LED Strings 2015 Microchip Technology Inc. CL2 VA Up to 90V +VLED(total) VA CL2 CL2 VA CL2 100nF VB VB VB + ILED ~60mA VLED(total) _ FIGURE 3-5: CL2 for Higher Current 2015 Microchip Technology Inc. DS20005448A-page 7 CL2 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 3-lead TO-92 Example XXXXXX XXXX e3 YWWNNN CL2 N3 e3 541343 Example XXXX XXXXX e3 YYWWNNN 2K4 1541343 e3 Note: DS20005448A-page 8 XXXXYWW NNN TO-252 (D-PAK) Legend: XX...X Y YY WW NNN * 3-lead TO-243AA * (SOT-89) Example CL2541 343 CL e3 Product Code or Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo. 2015 Microchip Technology Inc. CL2 Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. 2015 Microchip Technology Inc. DS20005448A-page 9 CL2 Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. DS20005448A-page 10 2015 Microchip Technology Inc. CL2 3-Lead TO-243AA (SOT-89) Package Outline (N8) D D1 C E H L 1 2 E1 3 b b1 e A e1 Side View Top View Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. Symbol Dimensions (mm) A b b1 C D D1 E E1 e e1 † MIN 1.40 0.44 0.36 0.35 4.40 1.62 2.29 2.00 NOM - - - - - - - - MAX 1.60 0.56 0.48 0.44 4.60 1.83 2.60 2.29 1.50 BSC 3.00 BSC H L 3.94 0.73† - - 4.25 1.20 JEDEC Registration TO-243, Variation AA, Issue C, July 1986. † This dimension differs from the JEDEC drawing Drawings not to scale. 2015 Microchip Technology Inc. DS20005448A-page 11 CL2 APPENDIX A: REVISION HISTORY Revision A (November 2015) • Updated file to Microchip format DS20005448A-page 12 2015 Microchip Technology Inc. CL2 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device Device: - XX X - Package Environmental Options CL2 X Media Type = Simple 90V, 20 mA, Temperature-Compensated, Constant-Current LED Driver IC Package: N3 K4 N8 = TO-92, 3-lead = TO-252 (D-PAK), 3-lead = TO-243AA (SOT-89), 3-lead Environmental G = Lead (Pb)-free/ROHS-compliant package Media Type: (blank) = = = = P002 2015 Microchip Technology Inc. Examples: a) CL2N3-G b) CL2K4-G c) CL2N8-G d) CL2N3-G-P002 TO-92 package, 1000/Bag TO-252 package, 2000/Reel TO-243AA package, 2000/Reel TO-92 package, 2000/Reel 1000/Bag for N3 packages 2000/Reel for K4 packages 2000/Reel for N8 packages 2000/Reel for N3 DS20005448A-page 13 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0014-1 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS20005448A-page 14 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2015 Microchip Technology Inc. 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