TI1 CC2530F256 A true system-on-chip solution for 2.4-ghz ieee 802.15.4 and zigbee application Datasheet

CC2530F32, CC2530F64
CC2530F128, CC2530F256
SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011
www.ti.com
A True System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications
Check for Samples: CC2530F32, CC2530F64, CC2530F128, CC2530F256
FEATURES
1
• RF/Layout
– 2.4-GHz IEEE 802.15.4 Compliant RF
Transceiver
– Excellent Receiver Sensitivity and
Robustness to Interference
– Programmable Output Power Up to 4.5 dBm
– Very Few External Components
– Only a Single Crystal Needed for
Asynchronous Networks
– 6-mm × 6-mm QFN40 Package
– Suitable for Systems Targeting Compliance
With Worldwide Radio-Frequency
Regulations: ETSI EN 300 328 and EN 300
440 (Europe), FCC CFR47 Part 15 (US) and
ARIB STD-T-66 (Japan)
• Low Power
– Active-Mode RX (CPU Idle): 24 mA
– Active Mode TX at 1 dBm (CPU Idle): 29 mA
– Power Mode 1 (4 μs Wake-Up): 0.2 mA
– Power Mode 2 (Sleep Timer Running): 1 μA
– Power Mode 3 (External Interrupts): 0.4 μA
– Wide Supply-Voltage Range (2 V–3.6 V)
• Microcontroller
– High-Performance and Low-Power 8051
Microcontroller Core With Code Prefetch
– 32-, 64-, 128-, or 256-KB
In-System-Programmable Flash
– 8-KB RAM With Retention in All Power
Modes
– Hardware Debug Support
2345
•
Peripherals
– Powerful Five-Channel DMA
– Integrated High-Performance Op-Amp and
Ultralow-Power Comparator
•
– IEEE 802.15.4 MAC Timer, General-Purpose
Timers (One 16-Bit, Two 8-Bit)
– IR Generation Circuitry
– 32-kHz Sleep Timer With Capture
– CSMA/CA Hardware Support
– Accurate Digital RSSI/LQI Support
– Battery Monitor and Temperature Sensor
– 12-Bit ADC With Eight Channels and
Configurable Resolution
– AES Security Coprocessor
– Two Powerful USARTs With Support for
Several Serial Protocols
– 21 General-Purpose I/O Pins
(19 × 4 mA, 2 × 20 mA)
– Watchdog Timer
Development Tools
– CC2530 Development Kit
– CC2530 ZigBee® Development Kit
– CC2530 RemoTI™ Development Kit for
RF4CE
– SmartRF™ Software
– Packet Sniffer
– IAR Embedded Workbench™ Available
APPLICATIONS
•
•
•
•
•
•
•
•
•
2.4-GHz IEEE 802.15.4 Systems
RF4CE Remote Control Systems (64-KB Flash
and Higher)
ZigBee Systems (256-KB Flash)
Home/Building Automation
Lighting Systems
Industrial Control and Monitoring
Low-Power Wireless Sensor Networks
Consumer Electronics
Health Care
1
2
3
4
5
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
RemoTI, SmartRF, Z-Stack are trademarks of Texas Instruments.
IAR Embedded Workbench is a trademark of IAR Systems AB.
ZigBee is a registered trademark of the ZigBee Alliance.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
© 2009–2011, Texas Instruments Incorporated
CC2530F32, CC2530F64
CC2530F128, CC2530F256
SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011
www.ti.com
DESCRIPTION
The CC2530 is a true system-on-chip (SoC) solution for IEEE 802.15.4, Zigbee and RF4CE applications. It
enables robust network nodes to be built with very low total bill-of-material costs. The CC2530 combines the
excellent performance of a leading RF transceiver with an industry-standard enhanced 8051 MCU, in-system
programmable flash memory, 8-KB RAM, and many other powerful features. The CC2530 comes in four different
flash versions: CC2530F32/64/128/256, with 32/64/128/256 KB of flash memory, respectively. The CC2530 has
various operating modes, making it highly suited for systems where ultralow power consumption is required.
Short transition times between operating modes further ensure low energy consumption.
Combined with the industry-leading and golden-unit-status ZigBee protocol stack ( Z-Stack™) from Texas
Instruments, the CC2530F256 provides a robust and complete ZigBee solution.
Combined with the golden-unit-status RemoTI stack from Texas Instruments, the CC2530F64 and higher provide
a robust and complete ZigBee RF4CE remote-control solution.
2
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CC2530F32, CC2530F64
CC2530F128, CC2530F256
SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011
www.ti.com
RESET
XOSC_Q2
32-MHz
CRYSTAL OSC
XOSC_Q1
P2_4
32.768-kHz
CRYSTAL OSC
P2_3
P2_2
DCOUPL
POWER-ON RESET
BROWN OUT
CLOCK MUX
and
CALIBRATION
SLEEP TIMER
HIGHSPEED
RC-OSC
DEBUG
INTERFACE
P2_1
VDD (2 V–3.6 V)
ON-CHIP VOLTAGE
REGULATOR
WATCHDOG
TIMER
RESET_N
32-kHz
RC-OSC
POWER MANAGEMENT CONTROLLER
P2_0
P1_7
P1_6
8-KB SRAM
8051 CPU
CORE
P1_5
P1_4
MEMORY
ARBITER
P1_3
32/64/128/256-KB
FLASH
P1_2
P1_1
DMA
P1_0
P0_7
IRQ CTRL
FLASH CTRL
P0_6
P0_2
P0_1
P0_0
RADIO REGISTERS
OP-AMP
12-BIT DS
ADC
CSMA/CA STROBE PROCESSOR
AES
ENCRYPTION
AND
DECRYPTION
RADIO DATA INTERFACE
USART 0
RECEIVE
CHAIN
USART 1
MODULATOR
FREQUENCY
SYNTHESIZER
DEMODULATOR
AND AGC
FIFO and FRAME CONTROL
P0_3
ANALOG
COMPARATOR
SYNTH
P0_4
I/O CONTROLLER
P0_5
TRANSMIT
CHAIN
TIMER 1 (16-Bit)
TIMER 2
(IEEE 802.15.4 MAC TIMER)
RF_P
RF_N
DIGITAL
ANALOG
TIMER 3 (8-Bit)
MIXED
TIMER 4 (8-Bit)
B0301-02
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
© 2009–2011, Texas Instruments Incorporated
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CC2530F128, CC2530F256
SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
Supply voltage
All supply pins must have the same voltage
Voltage on any digital pin
MIN
MAX
–0.3
3.9
V
–0.3
VDD + 0.3,
≤ 3.9
V
–40
125
°C
2
kV
500
V
Input RF level
10
Storage temperature range
All pads, according to human-body model, JEDEC STD 22, method A114
ESD (2)
(1)
(2)
UNIT
According to charged-device model, JEDEC STD 22, method C101
dBm
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
CAUTION: ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
UNIT
–40
125
°C
2
3.6
V
Operating ambient temperature range, TA
Operating supply voltage
ELECTRICAL CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to
2507 MHz.
PARAMETER
Icore
Core current
consumption
TEST CONDITIONS
MIN
TYP
Digital regulator on. 16-MHz RCOSC running. No radio, crystals, or peripherals active.
Medium CPU activity: normal flash access (1), no RAM access
3.4
32-MHz XOSC running. No radio or peripherals active.
Medium CPU activity: normal flash access (1), no RAM access
6.5
MAX
UNIT
mA
8.9
mA
32-MHz XOSC running, radio in RX mode, –50-dBm input power, no peripherals active, CPU
idle
20.5
32-MHz XOSC running, radio in RX mode at -100-dBm input power (waiting for signal), no
peripherals active, CPU idle
24.3
32-MHz XOSC running, radio in TX mode, 1-dBm output power, no peripherals active, CPU idle
28.7
32-MHz XOSC running, radio in TX mode, 4.5-dBm output power, no peripherals active, CPU
idle
33.5
39.6
mA
Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off;
32.768-kHz XOSC, POR, BOD and sleep timer active; RAM and register retention
0.2
0.3
mA
Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-MHz crystal oscillator off;
32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention
1
2
μA
Power mode 3. Digital regulator off; no clocks; POR active; RAM and register retention
0.4
1
μA
mA
29.6
mA
mA
Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)
Iperi
Timer 1
Timer running, 32-MHz XOSC used
90
μA
Timer 2
Timer running, 32-MHz XOSC used
90
μA
Timer 3
Timer running, 32-MHz XOSC used
60
μA
Timer 4
Timer running, 32-MHz XOSC used
70
μA
Sleep timer
Including 32.753-kHz RCOSC
0.6
μA
ADC
When converting
1.2
mA
Erase
1
mA
Burst write peak current
6
mA
Flash
(1)
Normal flash access means that the code used exceeds the cache storage, so cache misses happen frequently.
GENERAL CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
WAKE-UP AND TIMING
4
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SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011
www.ti.com
GENERAL CHARACTERISTICS (continued)
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Power mode 1 → active
Digital regulator on, 16-MHz RCOSC and 32-MHz crystal
oscillator off. Start-up of 16-MHz RCOSC
4
μs
Power mode 2 or 3 → active
Digital regulator off, 16-MHz RCOSC and 32-MHz crystal
oscillator off. Start-up of regulator and 16-MHz RCOSC
0.1
ms
Initially running on 16-MHz RCOSC, with 32-MHz XOSC
OFF
0.5
ms
Active → TX or RX
With 32-MHz XOSC initially on
RX/TX and TX/RX turnaround
192
μs
192
μs
2507
MHz
RADIO PART
RF frequency range
Programmable in 1-MHz steps, 5 MHz between channels
for compliance with [1]
Radio baud rate
As defined by [1]
250
Radio chip rate
As defined by [1]
2
2394
Flash erase cycles
kbps
MChip/s
20
Flash page size
k cycles
2
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KB
5
CC2530F32, CC2530F64
CC2530F128, CC2530F256
SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011
www.ti.com
RF RECEIVE SECTION
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V, and fc = 2440 MHz, unless
otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to
2507 MHz.
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
Receiver sensitivity
PER = 1%, as specified by [1]
[1] requires –85 dBm
Saturation (maximum input level)
PER = 1%, as specified by [1]
[1] requires –20 dBm
10
dBm
Adjacent-channel rejection, 5-MHz
channel spacing
Wanted signal –82 dBm, adjacent modulated channel at
5 MHz, PER = 1 %, as specified by [1].
[1] requires 0 dB
49
dB
Adjacent-channel rejection, –5-MHz
channel spacing
Wanted signal –82 dBm, adjacent modulated channel
at –5 MHz, PER = 1 %, as specified by [1].
[1] requires 0 dB
49
dB
Alternate-channel rejection, 10-MHz
channel spacing
Wanted signal –82 dBm, adjacent modulated channel at
10 MHz, PER = 1%, as specified by [1]
[1] requires 30 dB
57
dB
Alternate-channel rejection, –10-MHz
channel spacing
Wanted signal –82 dBm, adjacent modulated channel
at –10 MHz, PER = 1 %, as specified by [1]
[1] requires 30 dB
57
dB
Channel rejection
≥ 20 MHz
≤ –20 MHz
Wanted signal at –82 dBm. Undesired signal is an IEEE
802.15.4 modulated channel, stepped through all channels
from 2405 to 2480 MHz. Signal level for PER = 1%.
57
57
dB
Co-channel rejection
Wanted signal at –82 dBm. Undesired signal is 802.15.4
modulated at the same frequency as the desired signal. Signal
level for PER = 1%.
–3
dB
–97
–92
–88
dBm
Blocking/desensitization
5 MHz from band edge
10 MHz from band edge
20 MHz from band edge
50 MHz from band edge
–5 MHz from band edge
–10 MHz from band edge
–20 MHz from band edge
–50 MHz from band edge
Wanted signal 3 dB above the sensitivity level, CW jammer,
PER = 1%. Measured according to EN 300 440 class 2.
Spurious emission. Only largest spurious
emission stated within each band.
Conducted measurement with a 50-Ω single-ended load.
Suitable for systems targeting compliance with EN 300 328,
30 MHz–1000 MHz
EN 300 440, FCC CFR47 Part 15 and ARIB STD-T-66.
1 GHz–12.75 GHz
–33
–33
–32
–31
–35
–35
–34
–34
dBm
<
–80
–57
dBm
Frequency error tolerance (1)
[1] requires minimum 80 ppm
±150
ppm
Symbol rate error tolerance (2)
[1] requires minimum 80 ppm
±1000
ppm
(1)
(2)
6
Difference between center frequency of the received RF signal and local oscillator frequency.
Difference between incoming symbol rate and the internally generated symbol rate
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SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011
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RF TRANSMIT SECTION
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless
otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V and fc = 2394 MHz to 2507
MHz.
PARAMETER
Nominal output power
TEST CONDITIONS
Delivered to a single-ended 50-Ω load through a balun using
maximum-recommended output-power setting
[1] requires minimum –3 dBm
MIN
TYP
MAX
UNIT
0
–8
4.5
8
10
dBm
Programmable output power
range
32
Spurious emissions
Max recommended output power setting (1)
Measured conducted
according to stated
regulations. Only largest
spurious emission stated
within each band.
25 MHz–1000 MHz (outside restricted bands)
25 MHz–2400 MHz (within FCC restricted bands)
25 MHz–1000 MHz (within ETSI restricted bands)
1800–1900 MHz (ETSI restricted band)
5150–5300 MHz (ETSI restricted band)
At 2 × fc and 3 × fc (FCC restricted band)
At 2 × fc and 3 × fc (ETSI EN 300-440 and EN 300-328) (2)
1 GHz–12.75 GHz (outside restricted bands)
At 2483.5 MHz and above (FCC restricted band)
fc= 2480 MHz (3)
–60
–60
–60
–57
–55
–42
–31
–53
Error vector magnitude (EVM)
Optimum load impedance
Differential impedance as seen from the RF port (RF_P and RF_N)
towards the antenna
(2)
(3)
dBm
–42
Measured as defined by [1] using maximum-recommended
output-power setting
[1] requires maximum 35%.
(1)
dB
2%
69 + j29
Ω
Texas Instruments CC2530 EM reference design is suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC
CFR47 Part 15 and ARIB STD-T-66.
Margins for passing conducted requirements at the third harmonic can be improved by using a simple band-pass filter connected
between matching network and RF connector (1.8 pF in parallel with 1.6 nH); this filter must be connected to a good RF ground.
Margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz can be improved by using a lower
output-power setting or having less than 100% duty cycle.
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32-MHz CRYSTAL OSCILLATOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Crystal frequency
TYP
MAX
32
Crystal frequency accuracy
requirement (1)
MHz
–40
40
ppm
6
60
Ω
pF
ESR
Equivalent series resistance
C0
Crystal shunt capacitance
1
7
CL
Crystal load capacitance
10
16
Start-up time
0.3
Power-down guard time
(1)
UNIT
The crystal oscillator must be in power down for a
guard time before it is used again. This
requirement is valid for all modes of operation. The
need for power-down guard time can vary with
crystal type and load.
pF
ms
3
ms
Including aging and temperature dependency, as specified by [1]
32.768-kHz CRYSTAL OSCILLATOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Crystal frequency
TYP
MAX
32.768
Crystal frequency accuracy
requirement (1)
–40
UNIT
kHz
40
ppm
ESR
Equivalent series resistance
40
130
kΩ
C0
Crystal shunt capacitance
0.9
2
pF
CL
Crystal load capacitance
12
16
pF
Start-up time
0.4
(1)
s
Including aging and temperature dependency, as specified by [1]
32-kHz RC OSCILLATOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Calibrated frequency
TEST CONDITIONS
MIN
(1)
32.753
Temperature coefficient (2)
(3)
Calibration time (4)
(1)
(2)
(3)
(4)
8
MAX
UNIT
kHz
±0.2%
Frequency accuracy after calibration
Supply-voltage coefficient
TYP
0.4
%/°C
3
%/V
2
ms
The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977.
Frequency drift when temperature changes after calibration
Frequency drift when supply voltage changes after calibration
When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator
is performed while SLEEPCMD.OSC32K_CALDIS is 0.
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16-MHz RC OSCILLATOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Frequency
TEST CONDITIONS
MIN
TYP
(1)
MAX
16
Uncalibrated frequency accuracy
±18%
Calibrated frequency accuracy
±0.6%
MHz
±1%
Start-up time
μs
10
Initial calibration time
(1)
(2)
UNIT
(2)
μs
50
The calibrated 16-MHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 2.
When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator
is performed while SLEEPCMD.OSC_PD is set to 0.
RSSI/CCA CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
RSSI range
TYP
MAX
UNIT
100
dB
Absolute uncalibrated RSSI/CCA accuracy
±4
dB
RSSI/CCA offset (1)
73
dB
1
dB
Step size (LSB value)
(1)
Real RSSI = Register value – offset
FREQEST CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
±250
kHz
FREQEST accuracy
±40
kHz
FREQEST offset (1)
20
kHz
Step size (LSB value)
7.8
kHz
FREQEST range
(1)
Real FREQEST = Register value – offset
FREQUENCY SYNTHESIZER CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless
otherwise noted.
PARAMETER
TEST CONDITIONS
Phase noise, unmodulated carrier
MIN
TYP
At ±1-MHz offset from carrier
–110
At ±2-MHz offset from carrier
–117
At ±5-MHz offset from carrier
–122
MAX
UNIT
dBc/Hz
ANALOG TEMPERATURE SENSOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Output at 25°C
TYP
1480
Temperature coefficient
4.5
Voltage coefficient
Initial accuracy without calibration
Accuracy using 1-point calibration (entire
temperature range)
1
Measured using integrated ADC using
internal bandgap voltage reference and
maximum resolution
Current consumption when enabled (ADC
current not included)
© 2009–2011, Texas Instruments Incorporated
MAX
UNIT
12-bit ADC
/1°C
/0.1 V
±10
°C
±5
°C
0.5
mA
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OP-AMP CHARACTERISTICS
TA = 25°C, VDD = 3 V . All measurement results are obtained using the CC2530 reference designs post-calibration.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Chopping Configuration, Register APCFG = 0x07, OPAMPMC = 0x03, OPAMPC = 0x01
Output maximum voltage
VDD – 0.07
Output minimum voltage
0.07
V
Open-loop gain
108
dB
Gain-bandwidth product
Slew rate
CMRR
V
2
MHz
107
V/μs
Input maximum voltage
VDD + 0.13
Intput minimum voltage
V
–55
mV
Input offset voltage
40
μV
Common-mode rejection ratio
90
dB
0.4
mA
Supply current
Input noise voltage
f = 0.01 Hz to 1 Hz
1.1
f = 0.1 Hz to 10 Hz
1.7
nV/√(Hz)
Non-Chopping Configuration, Register APCFG = 0x07, OPAMPMC = 0x00, OPAMPC = 0x01
Output maximum voltage
VDD – 0.07
Output minimum voltage
0.07
V
Open-loop gain
108
dB
Gain-bandwidth product
Slew rate
CMRR
V
2
MHz
107
V/μs
Input maximum voltage
VDD + 0.13
Intput minimum voltage
–55
mV
Input offset voltage
0.8
mV
Common-mode rejection ratio
90
dB
Supply current
0.4
mA
Input noise voltage
f = 0.01 Hz to 1 Hz
60
f = 0.1 Hz to 10 Hz
65
V
nV/√(Hz)
COMPARATOR CHARACTERISTICS
TA = 25°C, VDD = 3 V. All measurement results are obtained using the CC2530 reference designs, post-calibration.
PARAMETER
TEST CONDITIONS
MIN
VDD
Common-mode minimum voltage
–0.3
Input offset voltage
Offset vs temperature
Offset vs operating voltage
10
TYP MAX
Common-mode maximum voltage
UNIT
V
1
mV
16
µV/°C
4
mV/V
Supply current
230
nA
Hysteresis
0.15
mV
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ADC CHARACTERISTICS
TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
ENOB (1)
MAX
UNIT
Input voltage
VDD is voltage on AVDD5 pin
0
VDD
V
External reference voltage
VDD is voltage on AVDD5 pin
0
VDD
V
External reference voltage differential
VDD is voltage on AVDD5 pin
0
VDD
Input resistance, signal
Using 4-MHz clock speed
197
kΩ
Full-scale signal (1)
Peak-to-peak, defines 0 dBFS
2.97
V
Effective number of bits
Useful power bandwidth
THD (1)
Total harmonic distortion
MIN
Single-ended input, 7-bit setting
5.7
Single-ended input, 9-bit setting
7.5
Single-ended input, 10-bit setting
9.3
Single-ended input, 12-bit setting
10.8
Differential input, 7-bit setting
bits
Differential input, 9-bit setting
8.3
Differential input, 10-bit setting
10.0
Differential input, 12-bit setting
11.5
7-bit setting, both single and differential
0–20
Single-ended input, 12-bit setting, –6 dBFS
–75.2
Differential input, 12-bit setting, –6 dBFS
–86.6
kHz
dB
70.2
Differential input, 12-bit setting
79.3
Single-ended input, 12-bit setting, –6 dBFS
78.8
Differential input, 12-bit setting, –6 dBFS
88.9
Common-mode rejection ratio
Differential input, 12-bit setting, 1-kHz sine (0 dBFS),
limited by ADC resolution
>84
dB
Crosstalk
Single-ended input, 12-bit setting, 1-kHz sine (0 dBFS),
limited by ADC resolution
>84
dB
Offset
Midscale
–3
mV
0.68
%
DNL (1)
Differential nonlinearity
INL (1)
Integral nonlinearity
12-bit setting, mean
Signal-to-noise-and-distortion
dB
0.05
12-bit setting, maximum
LSB
0.9
12-bit setting, mean
Conversion time
4.6
12-bit setting, maximum
13.3
Single-ended input, 7-bit setting
35.4
Single-ended input, 9-bit setting
46.8
Single-ended input, 10-bit setting
57.5
Single-ended input, 12-bit setting
66.6
Differential input, 7-bit setting
40.7
Differential input, 9-bit setting
51.6
Differential input, 10-bit setting
61.8
Differential input, 12-bit setting
70.8
7-bit setting
20
9-bit setting
36
10-bit setting
68
12-bit setting
132
Power consumption
LSB
dB
μs
1.2
Internal reference voltage
mA
1.15
Internal reference VDD coefficient
V
4
Internal reference temperature coefficient
(1)
V
6.5
Gain error
SINAD (1)
(–THD+N)
TYP
Single-ended input, 12-bit setting
Signal to nonharmonic ratio (1)
CMRR
TEST CONDITIONS
0.4
mV/V
mV/10°C
Measured with 300-Hz sine-wave input and VDD as reference.
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CONTROL INPUT AC CHARACTERISTICS
TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
32
MHz
System clock, fSYSCLK
tSYSCLK = 1/fSYSCLK
The undivided system clock is 32 MHz when crystal oscillator is used.
The undivided system clock is 16 MHz when calibrated 16-MHz RC
oscillator is used.
16
RESET_N low duration
See item 1, Figure 1. This is the shortest pulse that is recognized as
a complete reset pin request. Note that shorter pulses may be
recognized but might not lead to complete reset of all modules within
the chip.
1
μs
Interrupt pulse duration
See item 2, Figure 1.This is the shortest pulse that is recognized as
an interrupt request.
20
ns
RESET_N
1
2
Px.n
T0299-01
Figure 1. Control Input AC Characteristics
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SPI AC CHARACTERISTICS
TA = –40°C to 125°C, VDD = 2 V to 3.6 V
PARAMETER
t1
TEST CONDITIONS
SCK period
SCK duty cycle
MIN
Master, RX and TX
250
Slave, RX and TX
250
Master
TYP MAX
UNIT
ns
50%
Master
63
Slave
63
Master
63
Slave
63
t2
SSN low to SCK
t3
SCK to SSN high
t4
MOSI early out
Master, load = 10 pF
7
ns
t5
MOSI late out
Master, load = 10 pF
10
ns
t6
MISO setup
Master
90
t7
MISO hold
Master
10
SCK duty cycle
Slave
t10
MOSI setup
Slave
35
ns
t11
MOSI hold
Slave
10
ns
t9
MISO late out
Slave, load = 10 pF
Operating frequency
ns
ns
ns
ns
50%
ns
95
Master, TX only
8
Master, RX and TX
4
Slave, RX only
8
Slave, RX and TX
4
ns
MHz
SCK
t2
t3
SSN
t4
D0
MOSI
t6
MISO
X
D1
t7
D0
X
t5
X
T0478-01
Figure 2. SPI Master AC Characteristics
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SCK
t2
t3
SSN
t8
D0
MISO
X
t10
MOSI
D1
t11
D0
X
t9
X
T0479-01
Figure 3. SPI Slave AC Characteristics
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DEBUG INTERFACE AC CHARACTERISTICS
TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
12
MHz
fclk_dbg
Debug clock frequency (see Figure 4)
t1
Allowed high pulse on clock (see Figure 4)
35
ns
t2
Allowed low pulse on clock (see Figure 4)
35
ns
t3
EXT_RESET_N low to first falling edge on
debug clock (see Figure 5)
167
ns
t4
Falling edge on clock to EXT_RESET_N high
(see Figure 5)
83
ns
t5
EXT_RESET_N high to first debug command
(see Figure 5)
83
ns
t6
Debug data setup (see Figure 6)
2
ns
t7
Debug data hold (see Figure 6)
4
ns
t8
Clock-to-data delay (see Figure 6)
Load = 10 pF
30
ns
Time
DEBUG_ CLK
P2_2
t1
t2
1/fclk_dbg
T0436-01
Figure 4. Debug Clock – Basic Timing
Time
DEBUG_ CLK
P2_2
RESET_N
t3
t4
t5
T0437-01
Figure 5. Data Setup and Hold Timing
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Time
DEBUG_ CLK
P2_2
DEBUG_DATA
(to CC253x)
P2_1
DEBUG_DATA
(from CC253x)
P2_1
t6
t8
t7
T0438-01
Figure 6. Debug Enable Timing
TIMER INPUTS AC CHARACTERISTICS
TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER
Input capture pulse duration
16
TEST CONDITIONS
Synchronizers determine the shortest input pulse that can be
recognized. The synchronizers operate at the current system
clock rate (16 or 32 MHz).
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MIN
TYP
MAX
UNIT
tSYSCLK
1.5
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DC CHARACTERISTICS
TA = 25°C, VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
Logic-0 input voltage
Logic-1 input voltage
UNIT
0.5
V
2.5
V
Logic-0 input current
Input equals 0 V
–50
50
nA
Logic-1 input current
Input equals VDD
–50
50
nA
I/O-pin pullup and pulldown resistors
20
Logic-0 output voltage, 4-mA pins
Output load 4 mA
Logic-1 output voltage, 4-mA pins
Output load 4 mA
Logic-0 output voltage, 20-mA pins
Output load 20 mA
Logic-1 output voltage, 20-mA pins
Output load 20 mA
kΩ
0.5
2.4
V
V
0.5
2.4
V
V
DEVICE INFORMATION
PIN DESCRIPTIONS
The CC2530 pinout is shown in Figure 7 and a short description of the pins follows.
DVDD1
P1_6
P1_7
P2_0
P2_1
P2_2
P2_3/XOSC32K_Q2
P2_4/XOSC32K_Q1
40
39
38
37
36
35
34
33
32
AVDD6
DCOUPL
CC2530
RHA Package
(Top View)
31
30
RBIAS
2
29
AVDD4
1
GND
GND
3
28
AVDD1
GND
4
27
AVDD2
P1_5
5
26
RF_N
P1_4
6
25
RF_P
P1_3
7
24
AVDD3
P1_2
8
23
XOSC_Q2
9
GND
22
12
13
14
15
16
17
18
19
P0_6
P0_5
P0_4
P0_3
P0_2
P0_1
P0_0
21
20
XOSC_Q1
AVDD5
RESET_N
10
11
P0_7
DVDD2
P1_0
P1_1
GND
Ground Pad
P0076-02
NOTE: The exposed ground pad must be connected to a solid ground plane, as this is the ground connection for the chip.
Figure 7. Pinout Top View
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Table 1. Pin Descriptions
PIN NAME
PIN
PIN TYPE
DESCRIPTION
AVDD1
28
Power (analog)
2-V–3.6-V analog power-supply connection
AVDD2
27
Power (analog)
2-V–3.6-V analog power-supply connection
AVDD3
24
Power (analog)
2-V–3.6-V analog power-supply connection
AVDD4
29
Power (analog)
2-V–3.6-V analog power-supply connection
AVDD5
21
Power (analog)
2-V–3.6-V analog power-supply connection
AVDD6
31
Power (analog)
2-V–3.6-V analog power-supply connection
DCOUPL
40
Power (digital)
1.8-V digital power-supply decoupling. Do not use for supplying external circuits.
DVDD1
39
Power (digital)
2-V–3.6-V digital power-supply connection
DVDD2
10
Power (digital)
2-V–3.6-V digital power-supply connection
GND
—
Ground
The ground pad must be connected to a solid ground plane.
GND
1, 2, 3, 4
Unused pins
Connect to GND
P0_0
19
Digital I/O
Port 0.0
P0_1
18
Digital I/O
Port 0.1
P0_2
17
Digital I/O
Port 0.2
P0_3
16
Digital I/O
Port 0.3
P0_4
15
Digital I/O
Port 0.4
P0_5
14
Digital I/O
Port 0.5
P0_6
13
Digital I/O
Port 0.6
P0_7
12
Digital I/O
Port 0.7
P1_0
11
Digital I/O
Port 1.0 – 20-mA drive capability
P1_1
9
Digital I/O
Port 1.1 – 20-mA drive capability
P1_2
8
Digital I/O
Port 1.2
P1_3
7
Digital I/O
Port 1.3
P1_4
6
Digital I/O
Port 1.4
P1_5
5
Digital I/O
Port 1.5
P1_6
38
Digital I/O
Port 1.6
P1_7
37
Digital I/O
Port 1.7
P2_0
36
Digital I/O
Port 2.0
P2_1
35
Digital I/O
Port 2.1
P2_2
34
Digital I/O
Port 2.2
P2_3/
XOSC32K_Q2
33
Digital I/O,
Analog I/O
Port 2.3/32.768 kHz XOSC
P2_4/
XOSC32K_Q1
32
Digital I/O,
Analog I/O
Port 2.4/32.768 kHz XOSC
RBIAS
30
Analog I/O
External precision bias resistor for reference current
RESET_N
20
Digital input
Reset, active-low
RF_N
26
RF I/O
Negative RF input signal to LNA during RX
Negative RF output signal from PA during TX
RF I/O
Positive RF input signal to LNA during RX
Positive RF output signal from PA during TX
25
RF_P
XOSC_Q1
22
Analog I/O
32-MHz crystal oscillator pin 1 or external-clock input
XOSC_Q2
23
Analog I/O
32-MHz crystal oscillator pin 2
18
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CIRCUIT DESCRIPTION
RESET
XOSC_Q2
32-MHz
CRYSTAL OSC
XOSC_Q1
P2_4
32.768-kHz
CRYSTAL OSC
P2_3
P2_2
DCOUPL
POWER-ON RESET
BROWN OUT
CLOCK MUX
and
CALIBRATION
SLEEP TIMER
HIGHSPEED
RC-OSC
DEBUG
INTERFACE
P2_1
VDD (2 V–3.6 V)
ON-CHIP VOLTAGE
REGULATOR
WATCHDOG
TIMER
RESET_N
32-kHz
RC-OSC
POWER MANAGEMENT CONTROLLER
P2_0
P1_7
P1_6
8-KB SRAM
8051 CPU
CORE
P1_5
P1_4
MEMORY
ARBITER
P1_3
32/64/128/256-KB
FLASH
P1_2
P1_1
DMA
P1_0
P0_7
IRQ CTRL
FLASH CTRL
P0_6
P0_2
P0_1
P0_0
RADIO REGISTERS
OP-AMP
12-BIT DS
ADC
CSMA/CA STROBE PROCESSOR
AES
ENCRYPTION
AND
DECRYPTION
RADIO DATA INTERFACE
USART 0
RECEIVE
CHAIN
USART 1
MODULATOR
FREQUENCY
SYNTHESIZER
DEMODULATOR
AND AGC
FIFO and FRAME CONTROL
P0_3
ANALOG
COMPARATOR
SYNTH
P0_4
I/O CONTROLLER
P0_5
TRANSMIT
CHAIN
TIMER 1 (16-Bit)
TIMER 2
(IEEE 802.15.4 MAC TIMER)
RF_P
RF_N
DIGITAL
ANALOG
TIMER 3 (8-Bit)
MIXED
TIMER 4 (8-Bit)
B0301-02
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Figure 8. CC2530 Block Diagram
A block diagram of the CC2530 is shown in Figure 8. The modules can be roughly divided into one of three
categories: CPU- and memory-related modules; modules related to peripherals, clocks, and power management;
and radio-related modules. In the following subsections, a short description of each module that appears in
Figure 8 is given.
For more details about the modules and their usage, see the corresponding chapters in the CC253x User's
Guide (SWRU191).
CPU and Memory
The 8051 CPU core used in the CC253x device family is a single-cycle 8051-compatible core. It has three
different memory-access buses (SFR, DATA and CODE/XDATA) with single-cycle access to SFR, DATA, and
the main SRAM. It also includes a debug interface and an 18-input extended interrupt unit.
The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of which
is associated with one of four interrupt priorities. Any interrupt service request is serviced also when the device is
in idle mode by going back to active mode. Some interrupts can also wake up the device from sleep mode
(power modes 1–3).
The memory arbiter is at the heart of the system, as it connects the CPU and DMA controller with the physical
memories and all peripherals through the SFR bus. The memory arbiter has four memory access points, access
of which can map to one of three physical memories: an 8-KB SRAM, flash memory, and XREG/SFR registers. It
is responsible for performing arbitration and sequencing between simultaneous memory accesses to the same
physical memory.
The 8-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The 8-KB
SRAM is an ultralow-power SRAM that retains its contents even when the digital part is powered off (power
modes 2 and 3). This is an important feature for low-power applications.
The 32/64/128/256 KB flash block provides in-circuit programmable non-volatile program memory for the
device, and maps into the CODE and XDATA memory spaces. In addition to holding program code and
constants, the non-volatile memory allows the application to save data that must be preserved such that it is
available after restarting the device. Using this feature one can, e.g., use saved network-specific data to avoid
the need for a full start-up and network find-and-join process .
Clocks and Power Management
The digital core and peripherals are powered by a 1.8-V low-dropout voltage regulator. It provides power
management functionality that enables low power operation for long battery life using different power modes.
Five different reset sources exist to reset the device.
Peripherals
The CC2530 includes many different peripherals that allow the application designer to develop advanced
applications.
The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging.
Through this debug interface, it is possible to perform an erasure of the entire flash memory, control which
oscillators are enabled, stop and start execution of the user program, execute supplied instructions on the 8051
core, set code breakpoints, and single-step through instructions in the code. Using these techniques, it is
possible to perform in-circuit debugging and external flash programming elegantly.
The device contains flash memory for storage of program code. The flash memory is programmable from the
user software and through the debug interface. The flash controller handles writing and erasing the embedded
flash memory. The flash controller allows page-wise erasure and 4-bytewise programming.
The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral
modules control certain pins or whether they are under software control, and if so, whether each pin is configured
as an input or output and if a pullup or pulldown resistor in the pad is connected. CPU interrupts can be enabled
on each pin individually. Each peripheral that connects to the I/O pins can choose between two different I/O pin
locations to ensure flexibility in various applications.
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A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA memory
space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode, addressing
mode, source and destination pointers, and transfer count) is configured with DMA descriptors anywhere in
memory. Many of the hardware peripherals (AES core, flash controller, USARTs, timers, ADC interface) achieve
highly efficient operation by using the DMA controller for data transfers between SFR or XREG addresses and
flash/SRAM.
Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period
value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of
the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals. It
can also be configured in IR Generation Mode where it counts Timer 3 periods and the output is ANDed with
the output of Timer 3 to generate modulated consumer IR signals with minimal CPU interaction.
Timer 2 (the MAC Timer) is specially designed for supporting an IEEE 802.15.4 MAC or other time-slotted
protocol in software. The timer has a configurable timer period and a 24-bit overflow counter that can be used to
keep track of the number of periods that have transpired. A 40-bit capture register is also used to record the
exact time at which a start-of-frame delimiter is received/transmitted or the exact time at which transmission
ends, as well as two 16-bit output compare registers and two 24-bit overflow compare registers that can send
various command strobes (start RX, start TX, etc.) at specific times to the radio modules.
Timer 3 and Timer 4 are 8-bit timers with timer/counter/PWM functionality. They have a programmable
prescaler, an 8-bit period value, and one programmable counter channel with an 8-bit compare value. Each of
the counter channels can be used as a PWM output.
The sleep timer is an ultralow-power timer that counts 32-kHz crystal oscillator or 32-kHz RC oscillator periods.
The sleep timer runs continuously in all operating modes except power mode 3 (PM3). Typical applications of
this timer are as a real-time counter or as a wake-up timer to come out of power mode 1 (PM1) or 2 (PM2).
The ADC supports 7 to 12 bits of resolution in a 30 kHz to 4 kHz bandwidth, respectively. DC and audio
conversions with up to eight input channels (Port 0) are possible. The inputs can be selected as single-ended or
differential. The reference voltage can be internal, AVDD, or a single-ended or differential external signal. The
ADC also has a temperature-sensor input channel. The ADC can automate the process of periodic sampling or
conversion over a sequence of channels.
The operational amplifier is intended to provide front-end buffering and gain for the ADC. Both inputs as well as
the output are available on pins, so the feedback network is fully customizable. A chopper-stabilized mode is
available for applications that need good accuracy with high gain.
The ultralow-power analog comparator enables applications to wake up from PM2 or PM3 based on an analog
signal. Both inputs are brought out to pins; the reference voltage must be provided externally. The comparator
output is connected to the I/O controller interrupt detector and can be treated by the MCU as a regular I/O pin
interrupt.
The random-number generator uses a 16-bit LFSR to generate pseudorandom numbers, which can be read by
the CPU or used directly by the command strobe processor. It can be seeded with random data from noise in the
radio ADC.
The AES encryption/decryption core allows the user to encrypt and decrypt data using the AES algorithm with
128-bit keys. The core is able to support the AES operations required by IEEE 802.15.4 MAC security, the
ZigBee network layer, and the application layer.
A built-in watchdog timer allows the CC2530 to reset itself in case the firmware hangs. When enabled by
software, the watchdog timer must be cleared periodically; otherwise, it resets the device when it times out. It can
alternatively be configured for use as a general 32-kHz timer.
USART 0 and USART 1 are each configurable as either a SPI master/slave or a UART. They provide double
buffering on both RX and TX and hardware flow control and are thus well suited to high-throughput full-duplex
applications. Each has its own high-precision baud-rate generator, thus leaving the ordinary timers free for other
uses.
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Radio
The CC2530 features an IEEE 802.15.4-compliant radio transceiver. The RF core controls the analog radio
modules. In addition, it provides an interface between the MCU and the radio which makes it possible to issue
commands, read status, and automate and sequence radio events. The radio also includes a packet-filtering and
address-recognition module.
TYPICAL CHARACTERISTICS
RX CURRENT (–100 dBm INPUT)
vs
TEMPERATURE
TX CURRENT (TXPOWER = 0xF5)
vs
TEMPERATURE
36
28
27
26
TX Current − mA
RX Current − mA
35
25
24
34
33
23
22
−40
0
40
80
32
−40
120
0
40
80
G002
Figure 9.
Figure 10.
RX CURRENT (–100 dBm INPUT)
vs
SUPPLY VOLTAGE
TX CURRENT (TXPOWER = 0xF5)
vs
SUPPLY VOLTAGE
26.0
34.4
25.5
34.2
TX Current − mA
RX Current − mA
G001
25.0
24.5
24.0
2.0
34.0
33.8
2.4
2.8
3.2
VCC − Supply Voltage − V
Figure 11.
22
120
T − Temperature − °C
T − Temperature − °C
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3.6
G003
33.6
2.0
2.4
2.8
3.2
VCC − Supply Voltage − V
3.6
G004
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
INTERFERER REJECTION (802.15.4 INTERFERER)
vs
INTERFERER FREQUENCY (CARRIER AT –82 dBm, 2440
MHz)
75
OUTPUT POWER (TXPOWER = 0xF5)
vs
FREQUENCY
6.0
50
Interferer Rejection − dB
PO − Output Power − dBm
5.5
5.0
4.5
25
0
4.0
3.5
2394
2414
2434
2454
2474
−25
2400
2494
f − Frequency − MHz
2420
2440
2460
2480
Interferer Frequency − MHz
G005
G006
Figure 13.
Figure 14.
SENSITIVITY
vs
TEMPERATURE
OUTPUT POWER (TXPOWER = 0xF5)
vs
TEMPERATURE
−92
8
−93
PO − Output Power − dBm
6
Sensitivity − dBm
−94
−95
−96
−97
4
2
0
−98
−99
−40
0
40
80
120
T − Temperature − °C
−2
−40
0
40
80
G007
Figure 15.
© 2009–2011, Texas Instruments Incorporated
120
T − Temperature − °C
G008
Figure 16.
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TYPICAL CHARACTERISTICS (continued)
OUTPUT POWER (TXPOWER = 0xF5)
vs
SUPPLY VOLTAGE
SENSITIVITY
vs
SUPPLY VOLTAGE
5.0
−94
−95
Sensitivity − dBm
PO − Output Power − dBm
4.8
4.6
4.4
−96
−97
−98
4.2
−99
4.0
2.0
2.4
2.8
3.2
VCC − Supply Voltage − V
−100
2.0
3.6
2.4
2.8
3.2
VCC − Supply Voltage − V
G009
Figure 17.
3.6
G010
Figure 18.
Table 2. Recommended Output Power Settings (1)
(1)
24
TXPOWER Register Setting
Typical Output Power (dBm)
Typical Current Consumption (mA)
0xF5
4.5
34
0xE5
2.5
31
0xD5
1
29
0xC5
–0.5
28
0xB5
–1.5
27
0xA5
–3
27
0x95
–4
26
0x85
–6
26
0x75
–8
25
0x65
–10
25
0x55
–12
25
0x45
–14
25
0x35
–16
25
0x25
–18
24
0x15
–20
24
0x05
–22
23
0x05 and TXCTRL = 0x09
–28
23
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted.
See References, Item 1, for recommended register settings.
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www.ti.com
APPLICATION INFORMATION
Few external components are required for the operation of the CC2530. A typical application circuit is shown in
Figure 19. Typical values and description of external components are shown in Table 3.
2-V to 3.6-V
Power Supply
Optional 32-kHz Crystal
C331
XTAL2
C401
AVDD6 31
P2_4/XOSC32K_Q1 32
P2_2 34
P2_1 35
P2_0 36
P1_7 37
P1_6 38
DVDD1 39
2 GND
3 GND
P2_3/XOSC32K_Q2 33
1 GND
DCOUPL 40
C321
R301
RBIAS 30
AVDD4 29
AVDD1 28
4 GND
L252
C251
Antenna
(50 W)
C252
AVDD2 27
C253
5 P1_5
RF_N 26
CC2530
6 P1_4
RF_P 25
7 P1_3
AVDD3 24
XOSC_Q2 23
9 P1_1
XOSC_Q1 22
18 P0_1
19 P0_0
16 P0_3
17 P0_2
15 P0_4
13 P0_6
14 P0_5
11 P1_0
10 DVDD2
20 RESET_N
8 P1_2
12 P0_7
C261
L261
DIE ATTACH PAD
C262
AVDD5 21
XTAL1
Power Supply Decoupling Capacitors are Not Shown
Digital I/O Not Connected
C221
C231
S0383-01
Figure 19. CC2530 Application Circuit
Table 3. Overview of External Components (Excluding Supply Decoupling Capacitors)
Component
Description
Value
C251
Part of the RF matching network
18 pF
C261
Part of the RF matching network
18 pF
L252
Part of the RF matching network
2 nH
L261
Part of the RF matching network
2 nH
C262
Part of the RF matching network
1 pF
C252
Part of the RF matching network
1 pF
C253
Part of the RF matching network
2.2 pF
C331
32kHz xtal loading capacitor
15 pF
C321
32kHz xtal loading capacitor
15 pF
C231
32MHz xtal loading capacitor
27 pF
C221
32MHz xtal loading capacitor
27 pF
C401
Decoupling capacitor for the internal digital regulator
1 μF
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Table 3. Overview of External Components (Excluding Supply Decoupling Capacitors) (continued)
Component
R301
Description
Value
Resistor used for internal biasing
56 kΩ
Input/Output Matching
When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The
balun can be implemented using low-cost discrete inductors and capacitors. The recommended balun shown
consists of C262, L261, C252, and L252.
If a balanced antenna such as a folded dipole is used, the balun can be omitted.
Crystal
An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal
oscillator. See the 32-MHz Crystal Oscillator section for details. The load capacitance seen by the 32-MHz
crystal is given by:
1
CL =
+ Cparasitic
1
1
+
C221 C231
(1)
XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz
crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both very low sleep-current
consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is
given by:
1
CL =
+ Cparasitic
1
1
+
C321 C331
(2)
A series resistor may be used to comply with the ESR requirement.
On-Chip 1.8-V Voltage-Regulator Decoupling
The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires a decoupling capacitor
(C401) for stable operation.
Power-Supply Decoupling and Filtering
Proper power-supply decoupling must be used for optimum performance. The placement and size of the
decoupling capacitors and the power supply filtering are very important to achieve the best performance in an
application. TI provides a compact reference design that should be followed very closely.
References
1. IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications
for Low-Rate Wireless Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
2. CC253x User's Guide – CC253x System-on-Chip Solution for 2.4 GHz IEEE 802.15.4 and ZigBee
Applications (SWRU191)
Additional Information
Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and
standard-based wireless applications for use in industrial and consumer applications. Our selection includes RF
transceivers, RF transmitters, RF front ends, and System-on-Chips as well as various software solutions for the
sub-1- and 2.4-GHz frequency bands.
26
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SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011
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In addition, Texas Instruments provides a large selection of support collateral such as development tools,
technical documentation, reference designs, application expertise, customer support, third-party and university
programs.
The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance
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With a broad selection of product solutions, end application possibilities, and a range of technical support, Texas
Instruments offers the broadest low-power RF portfolio. We make RF easy!
The following subsections point to where to find more information.
Texas Instruments Low-Power RF Web Site
Texas Instruments’ Low-Power RF Web site has all our latest products, application and design notes, FAQ
section, news and events updates, and much more. Just go to www.ti.com/lprf.
Low-Power RF Online Community
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Forums, videos, and blogs
RF design help
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Join us today at www.ti.com/lprf-forum.
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Texas Instruments has launched an extensive network of low-power RF development partners to help customers
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• RF circuit, low-power RF, and ZigBee design services
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www.ti.com
REVISION HISTORY
Changes from Revision A (November 2010) to Revision B
Page
•
Changed recommendation for single-crystal implementations to asynchronous networks .................................................. 1
•
Added op-amp and comparator to peripherals list ................................................................................................................ 1
•
Revised block diagram ......................................................................................................................................................... 3
•
Added number of erase cycles and page size for flash ........................................................................................................ 5
•
Updated ESR for 32 kHz crystal ........................................................................................................................................... 8
•
Updated voltage coefficient for temperature sensor ............................................................................................................. 9
•
Added tables for op-amp and comparator to the Electrical Characteristics section ........................................................... 10
•
Changed SPI AC characteristics SSN low from SCK negative edge to SCK positive edge and split into separate
master and slave tables. ..................................................................................................................................................... 13
•
Revised block diagram ....................................................................................................................................................... 19
•
Corrected description of Timer 2 (MAC Timer) ................................................................................................................... 21
•
Improved readability of sleep timer description. ................................................................................................................. 21
•
Added the operational amplifier and the ultralow-power analog comparator paragraphs from the SWRS084 after The
ADC supports... channels paragraph .................................................................................................................................. 21
•
Removed sentence that pseudorandom data can be used for security ............................................................................. 21
28
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CC2530F128RHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 125
CC2530
F128
CC2530F128RHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 125
CC2530
F128
CC2530F256RHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 125
CC2530
F256
CC2530F256RHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 125
CC2530
F256
CC2530F32RHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 125
CC2530
F32
CC2530F32RHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 125
CC2530
F32
CC2530F64RHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 125
CC2530
F64
CC2530F64RHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 125
CC2530
F64
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
18-Oct-2013
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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