Micrel MICRF010 Qwikradio low-power uhf receiver Datasheet

MICRF010
QwikRadio® Low-Power UHF Receiver
General Description
The MICRF010 is a single chip, ASK/OOK (ON-OFF
Keyed) RF receiver IC recommended for new designs
replacing the MICRF007. It provides the same function with
sensitivity enhancement, typically 6dB better than the
MICRF007. Just like all other members of the QwikRadio®
family, the MICRF010 achieves low power operation, a
very high level of integration, and it is particularly easy to
use.
All post-detection data filtering is provided on the
MICRF010, so no external baseband filters are required. In
fact, the entire receiver circuit is made of very few external
components and with the 8-pin SOIC package makes it
ideal for small printed circuit board area applications.
The MICRF010 works in fixed-mode (FIX) operation, which
functions as a conventional super-heterodyne receiver.
Fixed-mode provides better selectivity and sensitivity
performance in comparison with sweep mode used in other
Micrel receivers intended for lower cost applications.
Data sheets and support documentation can be found on
Micrel’s web site at www.micrel.com.
QwikRadio™
Features
•
•
•
•
•
•
•
•
High sensitivity (–104dBm)
300MHz to 440MHz frequency range
Data-rate up to 2.0kbps (Manchester encoding)
Low power consumption
– 2.9mA fully operational (315MHz)
– 0.15µA in shutdown
– 290µA in polled mode (10:1 duty-cycle)
Shutdown input
Automatic tuning, no manual adjustment
Very low RF re-radiation at the antenna
Highly integrated with extremely low external part count
Applications
•
•
•
•
Automotive remote keyless entry (RKE)
Long range RF identification
Remote fan and light control
Garage door and gate openers
Ordering Information
Part Number
Standard
Pb-Free
MICRF010BM
MICRF010YM
Operating Mode
Shutdown
Package
Fixed
Yes
8-pin SOIC
Typical Application
17cm 22AWG MAGNET WIRE
433.92Mhz 1000 bps Manchester Encoded On-Off Keyed Receiver
QwikRadio is a registered trademark of Micrel, Inc. The QwikRadio Ics were developed under a partnership agreement with AIT of Orlando, Florida.
June 2005
M9999-063005
(408) 955-1690
Micrel
MICRF010
Pin Configuration
Standard 8-Pin SOIC (M)
Pin Description
Pin Number
Pin Name
Pin Function
1
VSS
Ground Return (input): ground return to the power supply. See “Applications Information” for bypass
capacitor details.
2
ANT
Antenna (Input): See “Applications Information” for information on input impedance. For optimal
performance the antenna impedance should be matched to the antenna pin impedance.
3
VDD
Power Supply (Input): Positive Supply input for the RF IC. Connect a low ESL, low ESR decoupling
capacitor from this to VSS, with lead length kept as short as possible.
4
CTH
[Data Slicing] Threshold Capacitor (External Component): Capacitor extracts the DC average value
from the demodulated waveform, which becomes the reference for the internal data slicing comparator.
See “Applications Information” for selection.
5
DO
6
SHUT
Shutdown (Input): Shutdown-mode logic-level control input. Pull low to enable the receiver. This input
is pulled-up internally to VDD.
7
CAGC
AGC Capacitor (External Component): Integrating capacitor for on-chip AGC (automatic gain control).
See “Applications Information” for capacitor selection.
8
REFOSC
June 2005
Digital Output (Output): CMOS level compatible data output signal.
Reference Oscillator (External Component or Input): Timing reference for on-chip tuning and
alignment.
2
M9999-063005
(408) 955-1690
Micrel
MICRF010
Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (VDDRF, VDDBB)................................... +7V
Input/Output Voltage (VI/O) ................ VSS–0.3 to VDD+0.3
Max Input Power ................................................... +20dBm
Junction Temperature (TJ) ..................................... +150°C
Storage Temperature Range (TS)........... –65°C to +150°C
Lead Temperature (soldering, 10 sec.).................. +260°C
ESD Rating ............................................................. Note 3
Supply Voltage (VDDRF, VDDBB) ...............+4.75V to +5.5V
Max Input Power ....................................................... 0dBm
RF Frequency Range ............................300MHz to 440Hz
Data Duty-Cycle.............................................. 20% to 80%
Reference Oscillator Input Range........... 0.2VPP to 1.5VPP
Ambient Temperature (TA)........................ –40°C to +85°C
Electrical Characteristics(4)
4.75V ≤ VDD ≤ 5.5V, VSS = 0V; CAGC = 4.7µF, CTH = 0.022µF; fREFOSC = 9.794MHz (equivalent to fRF = 315MHz); data rate = 600 bps
(Manchester encoded). TA = 25°C, bold values indicate –40°C ≤ TA ≤ +85°C; current flow into device pins is positive, unless noted.
Symbol
Parameter
Condition
IOP
Operating Current
ISTBY
Standby Current
Min
Typ
Max
Units
continuous operation, fRF = 315MHz
2.9
4.5
mA
Polled with 10:1 duty cycle, fRF = 315MHz
290
Continuous operation, fRF = 433.92MHz
4.7
Polled with 10:1 duty cycle, fRF = 433.92MHz
470
VSHUT = 0.8VDD
0.15
µA
7.5
µA
µA
0.5
µA
RF Section, IF Section
Receiver Sensitivity(4)
fRF = 315MHz Note 4
–105
fRF = 433.92MHz Note 4
–103
0.86
MHz
0.6
MHz
30
µVrms
fIF
IF Center Frequency
Note 5
fBW
IF 3dB Bandwidth
Note 5
(6)
dBm
Spurious Reverse Isolation
ANT pin, RSC = 50Ω
AGC Attack to Decay Ratio
tATTACK ÷ tDECAY
AGC Leakage Current
TA = +85°
±100
nA
Reference Oscillator
Input Impedance
Note 7
290
kΩ
Reference Oscillator Source
Note 8
5.0
µA
0.1
Reference Oscillator
ZREFOSC
Demodulator
ZCTH
CTH Source Impedance
Note 9
150
kΩ
IZCTH(leak)
CTH Leakage Current
TA = +85°C
±100
nA
Demodulator Filter Bandwidth
Note 5
2000
Hz
June 2005
3
M9999-063005
(408) 955-1690
Micrel
Symbol
MICRF010
Parameter
Condition
Min
SHUT
0.8
Typ
Max
Units
Digital/Control Section
VIH
Input High Voltage
VIL
Input Low Voltage
SHUT
IOUT
Output Current
DO pin, push-pull
VOH
Output High Voltage
DO pin, IOUT = –30µA
VOL
Output Low Voltage
DO pin, IOUT = +30µA
tR, tF
Output Rise and Fall Time
DO pin, CLOAD = 15pF
VDD
VDD
0.2
45
µA
VDD
0.9
VDD
0.1
4
µs
Notes:
1. Exceeding absolute maximum ratings may damage the device.
2. The device is not guaranteed to function outside its operating ratings.
3. Devices are ESD sensitive, use appropriate ESD precautions. The device meets Class 1 ESD test requirements, (human body model HBM), in
accordance with MIL-STD-883C, method 3015. Do not operate or store near strong electrostatic fields.
4. Sensitivity is defined as the average signal level measured at the input necessary to achieve 10-2 BER (bit error rate). The RF input is assumed to
be matched to 50Ω.
5. Parameter scales linearly with reference oscillator frequency fT. For any reference oscillator frequency other than 9.794MHz, compute new
parameter value as the ratio:
fREFOSC MHZ
× (parameter value at 9.79MHz )
9.794MHz
6. Spurious reverse isolation represents the spurious components, which appear on the RF input pin (ANT) measured into 50Ω with an input RF
matching network.
7. Series resistance of the resonator (ceramic resonator or crystal) should be minimized to the extent possible. In cases where the resonator series
resistance is too great, the oscillator may oscillate at a diminished peak-to-peak level, or may fail to oscillate entirely. Micrel recommends that
series resistances for ceramic resonators and crystals not exceed 50Ω and 100Ω, respectively.
8. Crystal load capacitor is 10pF. See Figure 5 in “REFOSC” section for reference oscillator operation.
9. Parameter scales inversely with reference oscillator frequency fT. For any reference oscillator frequency other than 9.794MHz, compute new
parameter value as the ratio:
9.794MHz
× (parameter value at 9.794MHz)
fREFOSCMHZ
June 2005
4
M9999-063005
(408) 955-1690
Micrel
MICRF010
Typical Characteristics
Supply Current
vs. Frequency
4.0
6.0
f = 315 MHZ
VDD = 5V
CURRENT (mA)
CURRENT (mA)
TA = 25 o C
VDD = 5V
4.5
3.0
Fix Mode,
Continuous Operation
1.5
250
300
350
400
450
FREQUENCY (MHz)
June 2005
Supply Current
vs. Temperature
500
3.5
3.0
2.5
Fix Mode
Continuous Operation
2.0
-40 -20
0
20 40
60
80 100
TEMPERATURE ( o C)
5
M9999-063005
(408) 955-1690
Micrel
MICRF010
Functional Diagram
Figure 1. MICRF010 Block Diagram
Application Information and Function
Description
Design Steps:
The following steps are the basic design steps for using the
MICRF010 receiver:
1. Select the reference oscillator
2. Select the demodulator filter bandwidth
3. Select the CTH capacitor
4. Select the CAGC capacitor
“MICRF010 Block Diagram” above shows the IC
partitioned into three sections: 1) UHF Downconverter, 2)
OOK Demodulator, 3) Reference and Control. Also shown
in the figure are two external capacitors (CTH, CAGC) and
one timing element, which is usually a crystal. With the
exception of a supply decoupling capacitor and antenna
impedance matching network, these are the only external
components needed by the MICRF010 to assemble a
complete UHF receiver.
For optimal performance it is highly recommended that the
MICRF010 is impedance-matched to the antenna. The
matching network will add an additional two or three
components.
The “SHUT” input is the only control input of the IC. It is
used in polling operation for decreasing DC current
consumption. This input is CMOS compatible and it is
internally pulled-up.
The IF Bandpass Filter Roll-off response of the IF Filter is
5th order, and the demodulator data filter has a 2nd order
response.
June 2005
Step 1: Selecting The Reference Oscillator
All timing and tuning operations on the MICRF010 are
derived from the internal Colpitts reference oscillator.
Timing and tuning is controlled through the REFOSC pin in
one of three ways:
1. Connect a crystal.
2. Drive this pin with an external timing signal.
The specific reference frequency required is related to the
system transmit frequency.
Crystal Selection
The smaller the crystal, the longer it takes for the oscillator
to start from a shutdown operation. If shorter start-up time
6
M9999-063005
(408) 955-1690
Micrel
MICRF010
Slicing level time constant values vary somewhat with
decoder type, data pattern, and data rate, but typically
values range from 5ms to 50ms. This issue is covered in
more detail in “Application Note 22.” Optimization of the
value of CTH is required to maximize range.
is desired, use crystals with lower ESR, which normally are
bigger in size, like the HC49 package. “Application Hints
35” provides additional information and recommended
sources for crystals. If using an externally applied signal, it
should be AC-coupled and limited to the operating range of
0.2VPP to 1.5VPP.
Selecting Capacitor CTH
Selecting Reference Oscillator Frequency fT
The first step in the process is selection of a data-slicinglevel time constant. This selection is strongly dependent
upon system issues including system decode response
time and data code structure (that is, existence of data
preamble, etc.) This issue is also covered in more detail in
“Application Note 22.”
The effective resistance of RSC is listed in the electrical
characteristics table as 150kΩ at 315MHz, this value
scales inversely with frequency. RSC value at other
frequencies is given by equation (4), where fT is in MHz:
As with any super-heterodyne receiver, the difference
between the internal LO (local oscillator) frequency fLO and
the incoming transmit frequency fTX, should equal the IF
center frequency. Equation 1 may be used to compute the
appropriate fLO for a given fTX:
⎛
f ⎞
fLO = fTX ± ⎜0.86 TX ⎟
315 ⎠
⎝
(1)
Frequencies fTX and fLO are in MHz. Note that two values
of fLO exist for any given fTX, distinguished as “high-side
mixing” and “low-side mixing.” High-side mixing results in
an image frequency above the frequency of interest and
low-side mixing results in a frequency below. There is
generally no preference of one over the other.
After choosing one of the two acceptable values of fLO, use
Equation 2 to compute the reference oscillator frequency
fT:
fT = 2 ×
fLO
64.5
R SC = 150Ω
(4)
CTH can be calculated using equation (5) with the
knowledge of Rsc and τ.
C TH =
τ
(5)
R SC
(2)
Recommended τ is 5x the bit-rate.
Frequency fT is in MHz. Connect a crystal of frequency fT
to REFOSC on the MICRF010. Four-decimal-place
accuracy on the frequency is generally adequate. The
following table identifies fT for some common transmit
frequencies.
Transmit Frequency (fTX)
Reference Oscillator
Frequency (fT)
315.0 MHz
9.7941 MHz
390.0 MHz
12.1260 MHz
418.0 MHz
12.9966 MHz
A standard ±20% X7R ceramic capacitor for CTH is
generally sufficient. Refer to “Application Hint 42” for CTH
and CAGC selection examples.
Step 3: Selecting CAGC Capacitor
The signal path has AGC (automatic gain control) to
increase input dynamic range. The attack time constant of
the AGC is set externally by the value of the CAGC
capacitor connected to the CAGC pin of the device. To
maximize system range, it is important to keep the AGC
control voltage ripple low, preferably under 10mVPP once
the control voltage attains its quiescent value. For this
reason, capacitor values of at least 0.47µF are
recommended.
The AGC control voltage is carefully managed on-chip to
allow duty-cycle operation of the MICRF010. When the
device is placed into shutdown mode (SHUT pin is pulled
high), the AGC capacitor floats to retain the voltage. When
operation is resumed, only the voltage drop, due to
capacitor leakage, must be replenished. A relatively lowleakage capacitor such as a ceramic type is recommended
433.92 MHz
13.4916 MHz
Table 1. Recommended Reference Oscillator Values For
Typical Transmit Frequencies (high-side mixing)
Step 2: Selecting CTH Capacitor
Extraction of the DC value of the demodulated signal for
purposes of logic-level data slicing is accomplished using
the external threshold capacitor CTH and the on-chip
switched capacitor “resistor” RSC, as shown in the block
diagram.
June 2005
9.7941
fT
7
M9999-063005
(408) 955-1690
Micrel
MICRF010
when the devices are used in duty-cycled operation.
To further enhance duty-cycled operation, the AGC push
and pull currents are boosted for approximately 10ms
immediately after the device is taken out of shutdown. This
compensates for AGC capacitor voltage drop and reduces
the time to restore the correct AGC voltage. The current is
boosted by a factor of 45.
(that is, the attack time constant is 10 times of the decay
time constant). Generally the design value of 1:10 is
adequate for the vast majority of applications. If adjustment
is required, adding a resistor in parallel of the CAGC
capacitor may vary the ratio. The value of the resistor must
be determined on a case-by-case basis.
Selecting CAGC Capacitor in Continuous Mode
A CAGC capacitor in the range of 0.47µF to 4.7µF is
typically recommended. Caution! If the capacitor is too
large, the AGC may react too slowly to incoming signals.
AGC settling time, from a completely discharged (zero-volt)
state is given approximately by Equation 6:
∆t = 1.333 × CAGC − 0.44
(6)
where:
CAGC is in µF, and ∆t is in seconds.
Selecting CAGC Capacitor in Duty-Cycle Mode
Voltage droop across the CAGC capacitor during shutdown
should be replenished as quickly as possible after the IC is
enabled. As mentioned above, the MICRF010 boosts the
push-pull current by a factor of 45 immediately after startup. This fixed time period is based on the reference
oscillator frequency fT. The time is 10.9ms for fT =
12.00MHz, and varies inversely with fT. The value of CAGC
capacitor and the duration of the shutdown time period
should be selected such that the droop can be replenished
within this 10ms period.
Polarity of the droop is unknown, meaning the AGC voltage
could droop up or down. The worst-case from a recovery
standpoint is downward droop, since the AGC pull-up
current is 1/10th magnitude of the pull-down current. The
downward droop is replenished according to the Equation
7:
I
CAGC
=
∆V
∆t
(7)
where:
I = AGC pull-up current for the initial 10ms (67.5µA)
CAGC = AGC capacitor value
∆t = drop recovery time
∆V = drop voltage
For example, if user desires ∆t = 10ms and chooses a
4.7µF CAGC, the allowable droop is about 144mV. Using
the same equation with 200nA, the worst-case pin leakage,
and assuming 1µA of capacitor leakage in the same
direction, the maximum allowable ∆t (shutdown time) is
about 0.56s for droop recovery in 10ms.
The ratio of decay-to-attack time-constant is fixed at 1:10
June 2005
8
M9999-063005
(408) 955-1690
Micrel
MICRF010
protection diodes at all input and output pins are not
shown.
The Demodulator Filter Bandwidth
There is no external control to set the demodulator
bandwidth. The maximum bandwidth is 2000 hertz at 315
MHz. Maximum bandwidth scales linearly with operating
frequency. To minimize data pulse stretching, one must
calculate the “demodulator BW required” to be certain that
it does not exceed demodulator filter bandwidth of
MICRF010 at operating frequency. For “demodulator BW
required” calculation, one needs to identify the shortest
pulse within the data profile and use equation 8 below:
Demodulator BW Required =
CTH Pin
VDD
Demodulator
Signal
VSS
0.65
(8)
shortest pulse - width
PHI1B
TG2
TG1
PHI2
VSS
CTH
~1.6V
PHI1
Figure 2. CTH Pin
Figure 2 illustrates the CTH pin interface circuit. The CTH
pin is driven from a N-Channel MOSFET source-follower
with approximately 10µA of bias. Internal control signals
PHI1/PHI2 are related in a manner such that the
impedance across the transmission gates looks like a
“resistance” of approximately 150kΩ. The DC potential at
the CTH pin is approximately 1.6V
Refer to the “Electrical Characteristics” for the exact filter
bandwidth at a chosen frequency.
Power Supply Bypass Capacitors
Supply bypass capacitors are strongly recommended. One
example is to use 0.1uF ceramic capacitor in parallel with
100pF ceramic capacitor for VDD.
CAGC Pin
VDD
Data Squelching
During quiet periods (no signal), the data output (DO pin)
transitions randomly with noise. Most decoders can
discriminate between this random noise and actual data.
For some systems, random transition due to noise during
quiet period is a problem. There are three possible
approaches to reduce this output noise:
1. Analog squelch to raise the demodulator threshold.
2. Digital squelch to disable the output when data is not
present.
3. Output filter to filter the (high frequency) noise
glitches on the data output pin.
The simplest solution is to perform analog squelch by
inducing a small offset, or squelch voltage, on the CTH pin
so that noise does not trigger the internal comparator,
Usually 20mV to 30mV on CTH pin is sufficient. This may
be achieved by connecting a several-meg-ohm resistor
from the CTH pin to either VSSBB or VDDBB, depending
upon the desired offset polarity. Since MICRF010’s
receiver AGC noise at the internal comparator input is
always the same (set by the AGC), the squelch-offset
requirement does not change as the local noise strength
changes from installation to installation. Introducing
squelch will reduce sensitivity and range. One should
introduce minimal offset to sufficiently quiet the output.
Typical squelch resistor values range from 10MΩ to 6.8MΩ
for low to high squelch strength.
7uA
16uA
Comparator
CAGC
Timeout
85uA
160uA
VSS
Figure 3. CAGC Pin
Figure 3 illustrates the CAGC pin interface circuit. The
AGC control voltage is developed as an integrated current
into a capacitor CAGC. The attack current is nominally
1.5µA, while the decay current is a 10 times scaling of this,
approximately 15µA. Signal gain of the RF/IF strip inside
the IC diminishes as the voltage on CAGC decreases. By
simply adding a capacitor to CAGC pin, the attack/decay
time constant ratio is fixed at 10:1. Modification of the
attack/decay ratio is possible by adding resistance from the
CAGC pin to either VDDBB or VSSBB, as desired.
Both the push and pull current sources are disabled during
shutdown, which maintains the voltage across CAGC, and
improves recovery time in duty-cycled applications. To
further improve duty-cycle recovery, both push and pull
currents are increased by 45 times for approximately 10ms
after release of the SHUT pin. This allows rapid recovery of
any voltage droop on CAGC while in shutdown.
I/O Pin Interface Circuitry
Interface circuitry for the various I/O pins of the MICRF010
are diagrammed in Figures 2 through 8. The ESD
June 2005
PHI2B
9
M9999-063005
(408) 955-1690
Micrel
MICRF010
DO Pin
The output stage for the digital output (DO) is shown in
Figure 4. The output is a 45µA push and 45µA pull
switched-current stage. This output stage is capable of
driving CMOS loads. An external buffer-driver is
recommended for driving high capacitance loads.
SHUT Pin
VDD
Q1
Q2
VDD
to Interna
Circuits
VSS
45uA
SHUT
Comparator
Q3
VSS
DO
Figure 6. SHUT Pin
Control input circuitry is shown in Figure 6. The standard
input is a logic inverter constructed with minimum geometry
MOSFETs (Q2, Q3). P-Channel MOSFET Q1 is a large
channel length device, which functions essentially as a
“weak” pull-up to VDDBB. Typical pull-up current is 5µA,
leading to an impedance to the VDD supply of typically
1MΩ.
45uA
VSS
Figure 4. DO Pin
REFOSC Pin
The REFOSC input circuit is shown in Figure 5. Input
impedance is quite high (290kΩ). This is a Colpitts
oscillator, with internal 10pF capacitors.
Externally applied signals should be AC-coupled,
amplitude limited to approximately 0.5VPP. The nominal
DC bias voltage on this pin is 1.4V
VDD
Active
Bias
REFOSC
10pF
10pF
VSS
200k
250
30uA
VSS
Figure 5. REFOSC Pin
June 2005
10
M9999-063005
(408) 955-1690
Micrel
MICRF010
Additional Applications Information
In addition to the basic operation of the MICRF010, the
following enhancements can be made. In particular, it is
strongly recommended that the antenna impedance is
matched to the input of the IC.
Antenna Impedance Matching
Figure 7. Antenna Pin Input Impedance
Figure 7 and Table 2 presents the antenna pin input
impedance. The Antenna pin can be matched to 50Ω with
a high pass circuit as shown in Figure 8. That is, a shunt
inductor from the ANT Pin to ground and a series capacitor
from ANT Pin to the antenna.
C3
ANT Pin
L2
Frequency
(Mhz)
S11
Mag, angle
Z11, ohms
C3, pF
L2, nH
300
0.944,-36.65
14.45-j150
2.2
47
305
0.940,-37.499
14.84-j145
2.2
47
310
0.942,-37.579
14.28-j145
2.2
47
315
0.945, -37.66
13.48-j145
2.2
47
320
0.943,-38.237
13.58-j143
2
47
325
0.942, -38.814
13.43-j140
1.8
47
330
0.94, -39.39
13.5-j138
1.8
47
335
0.938, -39.967
13.59-j136
1.8
43
340
0.937, -40.544
13.44-j134
1.8
43
345
0.935, -41.12
13.51-j132
1.8
43
350
0.933, -41.697
13.57-j130
2
39
355
0.931, -42.274
13.62-j123
2.2
36
360
0.93, 42.85
13.48-j126
2.2
36
365
0.928, -43.427
13.52-j124
2
36
370
0.926, -44.004
13.57-j122
1.8
36
375
0.925, -44.581
13.42-j120
2.2
33
380
0.923, -45.157
13.46-j118
2
33
385
0.921, -45.734
13.49-j117
1.8
33
390
0.92, -46.311
13.35-j115
1.8
33
395
0.917, -46.729
13.6-j114
1.8
33
400
0.914, -47.148
13.89-j113
2
30
405
0.912, -47.566
14.00-j112
1.8
30
410
0.909, -47.985
14.25-j110
1.8
30
415
0.907, -48.403
14.34-j109
2.2
27
420
0.906, -48.797
14.28-j108
2
27
425
0.909, -49.152
13.63-j107
2
27
430
0.911, -49.507
13.15-j107
1.8
27
435
0.911, -49.925
12.94-j106
1.8
27
440
0.904, -50.571
13.66-j104
1.8
27
Table 2
Figure 8. Antenna with Matching Network to ANT Pin
Inductor values may be different from Table 2, depending
on PCB material, PCB thickness, ground configuration, and
how long the traces are in the layout. Values shown were
characterized for a 0.031 inch thickness, FR4 board, solid
ground plane on bottom layer, and very short traces.
MuRata and Coilcraft wire-wound 0603 or 0805 surface
mount inductors were tested, however, any wire-wound
inductor with high SRF (self-resonance frequency) should
do the job.
June 2005
Shutdown Function
Duty-cycled operation of the MICRF010 (often referred to
as polling) is achieved by turning the MICRF010 on and off
via the SHUT pin. The shutdown function is controlled by a
logic state applied to the SHUT pin. When VSHUT is high,
the device goes into low-power standby mode. This pin is
pulled high internally, and it must be externally pulled low
to enable the receiver.
11
M9999-063005
(408) 955-1690
Micrel
MICRF010
Application Example: 433.92Mhz, 1000 bps Manchester Encoded On-Off Keyed Receiver
17cm 22 AWG MAGNET WIRE
Bill of Materials
Item
Qty Reference
2
4
1
5
6
7
3
1
1
1
1
1
1
2
C3
C7
C2
C8B
C8
C9
C5,C10
8
9
1
1
J2
J1
11
12
13
14
1
1
3
1
L3
L5
L6,L7,L9
L8
15
16
1
2
R4
R5, R6
17
18
1
1
U1
Y1
June 2005
Value
5.6pF
100pF
4.7pF
NL
0.47uF
100nF
4.7uF
Description
Manufacturer
CAPACITORS
5.6pF Capacitor, 0603, 50VDC, ±5%
100pF Capacitor, 0603, 50VDC, ±5%
4.7pF Capacitor, 0603, 50VDC, ±5%
0.47uF Capacitor, 0603, 25VDC, ±10%
100nF Capacitor, 0603, 25VDC, ±10%
4.7uF Capacitor, 0805, 10VDC, +80-20%
CONNECTORS
4 Pin Header 4 Pin Header
ANTENNA 17cm 22 AWG magnet wire
INDUCTORS
30nH
30nH Inductor, 0603, ±5%
24nH
24nH Inductor, 0603, ±5%
ZCB-0603 Ferrite bead, >600 Ohm @ 100MHz
UL
Ferrite bead, >600 Ohm @ 100MHz
RESISTORS
100K
UL
SEMICONDUCTORS
MICRF010BM 300-440MHz UHF Receiver
13.4916MHz 10pF, no built-in capacitor
12
Part#
MuRata
MuRata
MuRata
GRM1885C1H5R6DZ01B
GRM1885C1H101JA01B
GRM1885C1H4R7CZ01B
MuRata
MuRata
MuRata
GRM188R61A474KA61B
GRM188R71E104KA01B
GRM21BF51A475ZA01B
Major League Electronics TSHS-148-S-06-A-GT
Consolidated
Coilcraft
Coilcraft
ACT
ACT
0603CS-30NXJB
0603CS-24NXJB
ZCB-0603
ZCB-0603
VISHAY
CRCW06031003F
MICREL
Abracon
MICRF010BM
ABl-13.4916MHz-10
M9999-063005
(408) 955-1690
Micrel
MICRF010
PCB Layout Information
and characterization data stated in this document may not
be valid. The gerber files for this board can be downloaded
from the Micrel website at www.micrel.com.
All Units for PCB shown are in mils.
The MICRF010 evaluation board was designed and
characterized using two sided 31 mils thick FR4 material
with 1 ounce copper clad. If another type of printed circuit
board material were to be substituted, impedance matching
PCB Component Side Layout
PCB Silk Screen
PCB Solder Side Layout
June 2005
13
M9999-063005
(408) 955-1690
Micrel
MICRF010
Package Information
0.026 (0.65)
MAX)
PIN 1
0.157 (3.99)
0.150 (3.81)
DIMENSIONS:
INCHES (MM)
0.050 (1.27)
TYP
0.064 (1.63)
0.045 (1.14)
0.197 (5.0)
0.189 (4.8)
0.020 (0.51)
0.013 (0.33)
45
0.0098 (0.249)
0.0040 (0.102)
0–8
SEATING
PLANE
0.010 (0.25)
0.007 (0.18)
0.050 (1.27)
0.016 (0.40)
0.244 (6.20)
0.228 (5.79)
8-Lead SOIC (M)
MICREL, INC. 2180 Fortune DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the
body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or
sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any
damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
June 2005
14
M9999-063005
(408) 955-1690