MC14549B, MC14559B Successive Approximation Registers The MC14549B and MC14559B successive approximation registers are 8−bit registers providing all the digital control and storage necessary for successive approximation analog−to−digital conversion systems. These parts differ in only one control input. The Master Reset (MR) on the MC14549B is required in the cascaded mode when more than 8 bits are desired. The Feed Forward (FF) of the MC14559B is used for register shortening where End−of−Conversion (EOC) is required after less than eight cycles. Applications for the MC14549B and MC14559B include analog−to−digital conversion, with serial and parallel outputs. http://onsemi.com MARKING DIAGRAMS PDIP−16 P SUFFIX CASE 648 Features • • • • • • • • • • • Totally Synchronous Operation All Outputs Buffered Single Supply Operation Serial Output Retriggerable Compatible with a Variety of Digital and Analog Systems such as the MC1408 8−Bit D/A Converter All Control Inputs Positive−Edge Triggered Supply Voltage Range = 3.0 Vdc to 18 Vdc Capable of Driving 2 Low−Power TTL Loads, 1 Low−Power Schottky TTL Load or 2 HTL Loads Over the Rated Temperature Range Chip Complexity: 488 FETs or 122 Equivalent Gates Pb−Free Packages are Available* 16 MC145x9BCP AWLYYWWG 1 1 16 1 SO−16W DW SUFFIX CASE 751G MC145x9B AWLYYWWG 1 x A WL YY WW G = = = = = = 4 or 5 Assembly Location Wafer Lot Year Work Week Pb−Free Package MAXIMUM RATINGS (Voltages Referenced to VSS) Parameter Symbol Value Unit DC Supply Voltage Range VDD −0.5 to +18.0 V Input Voltage Range, All Inputs Vin −0.5 to VDD + 0.5 V Q4 1 16 VDD DC Input Current per Pin Iin ±10 mA Q5 2 15 Q3 Power Dissipation per Package (Note 1) PD 500 mW Q6 3 14 Q2 Operating Temperature Range TA −55 to +125 °C Q7 4 13 Q1 Storage Temperature Range Tstg −65 to +150 °C Sout 5 12 Q0 D 6 11 EOC C 7 10 * VSS 8 9 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS v (Vin or Vout) v VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). PIN ASSIGNMENT SC *For MC14549B Pin 10 is MR input. For MC14559B Pin 10 is FF input. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 June, 2006 − Rev. 6 1 Publication Order Number: MC14549B/D MC14549B, MC14559B TRUTH TABLES MC14549B MC14559B SC SC(t−1) MR MR(t−1) Clock Action X X X X None X X 1 X Reset 1 0 0 0 Start Conversion 1 X 0 1 Start Conversion 1 1 0 0 Continue Conversion 0 X 0 X Continue Previous Operation X = Don’t Care SC SC(t−1) EOC Clock X 1 X 0 X 0 X 1 0 0 0 0 0 X 1 1 X 1 Action None Start Conversion Continue Conversion Continue Conversion Retain Conversion Result Start Conversion t−1 = State at Previous Clock ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) − 55_C 25_C VDD Symbol Vdc Min Max Min Typ (Note 2) Max Min Max Unit “0” Level VOL 5.0 10 15 − − − 0.05 0.05 0.05 − − − 0 0 0 0.05 0.05 0.05 − − − 0.05 0.05 0.05 Vdc “1” Level VOH 5.0 10 15 4.95 9.95 14.95 − − − 4.95 9.95 14.95 5.0 10 15 − − − 4.95 9.95 14.95 − − − Vdc “0” Level VIL 5.0 10 15 − − − 1.5 3.0 4.0 − − − 2.25 4.50 6.75 1.5 3.0 4.0 − − − 1.5 3.0 4.0 5.0 10 15 3.5 7.0 11 − − − 3.5 7.0 11 2.75 5.50 8.25 − − − 3.5 7.0 11 − − − 5.0 5.0 10 15 – 1.2 – 0.25 – 0.62 – 1.8 − − − − – 1.0 – 0.2 − 0.5 – 1.5 – 1.7 – 0.36 – 0.9 – 3.5 − − − − – 0.7 – 0.14 – 0.35 – 1.1 − − − − 5.0 10 15 1.28 3.2 8.4 − − − 1.02 2.6 6.8 1.76 4.5 17.6 − − − 0.72 1.8 4.8 − − − mAd c 5.0 10 15 0.64 1.6 4.2 − − − 0.51 1.3 3.4 0.88 2.25 8.8 − − − 0.36 0.9 2.4 − − − mAd c 15 − ± 0.1 − ± 0.00001 ± 0.1 − ± 1.0 mAdc Characteristic Output Voltage Vin = VDD or 0 Vin = 0 or VDD Input Voltage (Note 2) (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) “1” Level Vdc VIH (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) 125_C Vdc IOH Source (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Sink Q Outputs (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Sink Pin 5, 11 only Input Current IOL Iin mAd c Input Capacitance Cin − − − − 5.0 7.5 − − pF Quiescent Current (Per Package) (Clock = 0 V, Other Inputs = VDD or 0 V, Iout = 0 mA) IDD 5.0 10 15 − − − 5.0 10 20 − − − 0.005 0.010 0.015 5.0 10 20 − − − 150 300 600 mAdc IT 5.0 10 15 Total Supply Current (Note 3, 4) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) IT = (0.8 mA/kHz) f + IDD IT = (1.6 mA/kHz) f + IDD IT = (2.4 mA/kHz) f + IDD mAdc 2. Noise immunity specified for worst−case input combination. Noise Margin for both “1” and “0” level = 1.0 V min @ VDD = 5.0 V = 2.0 V min @ VDD = 10 V = 2.5 V min @ VDD = 15 V 3. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + 3.5 x 10−3 (CL = 50) VDDf where: IT is in mA (per package), CL in pF, VDD in V, and f in kHz is input frequency. 4. The formulas given are for the typical characteristics only at 25_C. http://onsemi.com 2 MC14549B, MC14559B ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C) Characteristic Symbol Output Rise Time tTLH = (3.0 ns/pF) CL + 30 ns tTLH = (1.5 ns/pF) CL + 15 ns tTLH = (1.1 ns/pF) CL + 10 ns tTLH Output Fall Time tTHL = (1.5 ns/pF) CL + 25 ns tTHL = (0.75 ns/pF) CL + 12.5 ns tTHL = (0.55 ns/pF) CL + 9.5 ns tTHL Propagation Delay Time Clock to Q tPLH, tPHL = (1.7 ns/pF) CL + 415 ns tPLH, tPHL = (0.66 ns/pF) CL + 177 ns tPLH, tPHL = (0.5 ns/pF) CL + 130 ns Clock to Sout tPLH, tPHL = (1.7 ns/pF) CL + 665 ns tPLH, tPHL = (0.66 ns/pF) CL + 277 ns tPLH, tPHL = (0.5 ns/pF) CL + 195 ns Clock to EOC tPLH, tPHL = (1.7 ns/pF) CL + 215 ns tPLH, tPHL = (0.66 ns/pF) CL + 97 ns tPLH, tPHL = (0.5 ns/pF) CL + 75 ns tPLH, tPHL VDD Min Typ Max 5.0 10 15 − − − 180 90 65 360 180 130 5.0 10 15 − − − 100 50 40 200 100 80 Unit ns ns ns 5.0 10 15 − − − 500 210 155 1000 420 310 5.0 10 15 − − 750 310 220 1500 620 440 5.0 10 15 − − − 300 130 100 600 260 200 tsu 5.0 10 15 250 100 80 125 50 40 − − − ns tWH(cl) 5.0 10 15 700 270 200 350 135 100 − − − ns Pulse Width — D, SC, FF or MR tWH 5.0 10 15 500 200 160 250 100 80 − − − ns Clock Rise and Fall Time tTLH, tTHL 5.0 10 15 − − − ms − 15 1.0 0.5 5.0 10 15 − − − 1.5 3.0 4.0 0.8 1.5 2.0 MHz SC, D, FF or MR Setup Time Clock Pulse Width Clock Pulse Frequency fcl 5. The formulas given are for the typical characteristics only. ORDERING INFORMATION Device Package MC14549BCP PDIP−16 MC14549BCPG PDIP−16 (Pb−Free) MC14549BDWR2 SOIC−16 MC14549BDWR2G SOIC−16 (Pb−Free) MC14559BCP PDIP−16 MC14559BCPG PDIP−16 (Pb−Free) MC14559BDWR2 SOIC−16 MC14559BDWR2G SOIC−16 (Pb−Free) Shipping † 25 / Rail 1000 / Tape & Reel 25 / Rail 1000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MC14549B, MC14559B SWITCHING TIME TEST CIRCUIT AND WAVEFORMS VDD Q7 PROGRAMMABLE PULSE GENERATOR C Q6 Q5 SC Q4 Q3 FF(MR) Q2 Q1 CL CL CL CL CL CL Q0 EOC D CL CL Sout CL CL VSS 1 fcl C 50% SC D tWH(cl) tsu 50% tsu 50% tPLH Q7 50% 90% tTLH Sout tWH(D) tsu tPHL 10% tTHL 50% tPLH 90% 10% tTLH NOTE: Pin 10 = VSS TIMING DIAGRAM CLOCK SC D Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 EOC Sout ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ INH Q7 Q6 INH Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Q8* INH — Don’t care condition INH — Indicates Serial Out is inhibited low. * — Q8 is ninth−bit of serial information available from 8−bit register. NOTE: Pin 10 = VSS http://onsemi.com 4 MC14549B, MC14559B OPERATING CHARACTERISTICS Both the MC14549B and MC14559B can be operated in either the “free run” or “strobed operation” mode for conversion schemes with any number of bits. Reliable cascading and/or recirculating operation can be achieved if the End of Convert (EOC) output is used as the controlling function, since with EOC = 0 (and with SC = 1 for MC14549B but either 1 or 0 for MC14559B) no stable state exists under continual clocked operation. The MC14559B will automatically recirculate after EOC = 1 during externally strobed operation, provided SC = 1. All data and control inputs for these devices are triggered into the circuit on the positive edge of the clock pulse. Operation of the various terminals is as follows: C = Clock — A positive−going transition of the Clock is required for data on any input to be strobed into the circuit. SC = Start Convert — A conversion sequence is initiated on the positive−going transition of the SC input on succeeding clock cycles. D = Data in — Data on this input (usually from a comparator in A/D applications) is also entered into the circuit on a positive−going transition of the clock. This input is Schmitt triggered and synchronized to allow fast response and guaranteed quality of serial and parallel data. MR = Master Reset (MC14549B Only) — Resets all output to 0 on positive−going transitions of the clock. If removed while SC = 0, the circuit will remain reset until SC = 1. This allows easy cascading of circuits. FF = Feed Forward (MC14559B Only) — Provides register shortening by removing unwanted bits from a system. For operation with less than 8 bits, tie the output following the least significant bit of the circuit to EOC. E.g., for a 6−bit FROM A/D COMPARATOR C SC D conversion, tie Q1 to FF; the part will respond as shown in the timing diagram less two bit times. Not that Q1 and Q0 will still operate and must be disregarded. For 8−bit operation, FF is tied to VSS. For applications with more than 8 but less than 16 bits, use the basic connections shown in Figure 1. The FF input of the MC14559B is used to shorten the setup. Tying FF directly to the least significant bit used in the MC14559B allows EOC to provide the cascading signal, and results in smooth transition of serial information from the MC14559B to the MC14549B. The Serial Out (Sout) inhibit structure of the MC14559B remains inactive one cycle after EOC goes high, while Sout of the MC14549B remains inhibited until the second clock cycle of its operation. Qn = Data Outputs — After a conversion is initiated the Q’s on succeeding cycles go high and are then conditionally reset dependent upon the state of the D input. Once conditionally reset they remain in the proper state until the circuit is either reset or reinitiated. EOC = End of Convert — This output goes high on the negative−going transition of the clock following FF = 1 (for the MC14559B) or the conditional reset of Q0. This allows settling of the digital circuitry prior to the End of Conversion indication. Therefore either level or edge triggering can indicate complete conversion. Sout = Serial Out — Transmits conversion in serial fashion. Serial data occurs during the clock period when the corresponding parallel data bit is conditionally reset. Serial Out is inhibited on the initial period of a cycle, when the circuit is reset, and on the second cycle after EOC goes high. This provides efficient operation when cascaded. EXTERNAL CLOCK Sout MC14559B * FF Q7 Q6 Q5 Q4 •• Q0 EOC 1/4 MC14001 D C SC Sout MC14549B MR Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 EOC ** MSB { NC TO D/A AND PARALLEL DATA LSB TO D/A AND PARALLEL DATA FREE RUN MODE EXTERNAL STROBE * FF allows EOC to activate as if in 4−stage register. ** Cascading using EOC guaranteed; no stable unfunctional state. †Completion of conversion automatically re−initiates cycle in free run mode. Figure 1. 12−Bit Conversion Scheme http://onsemi.com 5 SERIAL OUT (CONTINUAL UPDATE EVERY 13 CLOCK CYCLES) MC14549B, MC14559B TYPICAL APPLICATIONS Externally Controlled 6−Bit ADC (Figure 2) • • • • Continuously Cycling 12−Bit ADC (Figure 4) Several features are shown in this application: Shortening of the register to six bits by feeding the seventh output bit into the FF input. Continuous conversion, if a continuous signal is applied to SC. Externally controlled updating (the start pulse must be shorter than the conversion cycle). The EOC output indicating that the parallel data are valid and that the serial output is complete. Because each successive approximation register (SAR) has a capability of handling only an eight−bit word, two must be cascaded to make an ADC with more than eight bits. When it is necessary to cascade two SAR’s, the second SAR must have a stable resettable state to remain in while awaiting a subsequent start signal. However, the first stage must not have a stable resettable state while recycling, because during switch−on or due to outside influences, the first stage has entered a reset state, the entire ADC will remain in a stable non−functional condition. This 12−bit ADC is continuously recycling. The serial as well as the parallel outputs are updated every thirteenth clock pulse. The EOC pulse indicates the completion of the 12−bit conversion cycle, the end of the serial output word, and the validity of the parallel data output. Continuously Cycling 8−Bit ADC (Figure 3) This ADC is running continuously because the EOC signal is fed back to the SC input, immediately initiating a new cycle on the next clock pulse. SC C Sout MC14559B Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 FF EOC TO DAC Figure 2. Externally Controlled 6−Bit ADC SC C Sout MC14559B Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 FF EOC TO DAC Figure 3. Continuously Cycling 8−Bit ADC http://onsemi.com 6 MC14549B, MC14559B Sout C SC Sout C SC MC14559B Sout MC14549B MR Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 EOC Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 FF EOC TO DAC TO DAC EOC Figure 4. Continuously Cycling 12−Bit ADC Externally Controlled 12−Bit ADC (Figure 5) Additional Motorola Parts for Successive Approximation ADC In this circuit the external pulse starts the first SAR and simultaneously resets the cascaded second SAR. When Q4 of the first SAR goes high, the second SAR starts conversion, and the first one stops conversion. EOC indicates that the parallel data are valid and that the serial output is complete. Updating the output data is started with every external control pulse. C SC Monolithic digital−to−analog converters — The MC1408/1508 converter has eight−bit resolution and is available with 6, 7, and 8−bit accuracy. The amplifier−comparator block — The MC1407/1507 contains a high speed operational amplifier and a high speed comparator with adjustable window. With these two linear parts it is possible to construct SA−ADCs with an accuracy of up to eight bits, using as the register one MC14549B or one MC14559B. An additional CMOS block will be necessary to generate the clock frequency. Additional information on successive approximation ADC is found in Motorola Application Note AN−716. Sout SC MC14559B C MC14549B Sout MR Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 EOC Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 FF EOC TO DAC TO DAC EOC Figure 5. Externally Controlled 12−Bit ADC http://onsemi.com 7 Sout MC14549B, MC14559B PACKAGE DIMENSIONS PDIP−16 CASE 648−08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. −A− 16 9 1 8 B F C L S −T− SEATING PLANE K H D M J G 16 PL 0.25 (0.010) T A M M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 SO−16 WB CASE 751G−03 ISSUE C A D 9 h X 45 _ E 0.25 1 MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0_ 7_ 8 16X M 14X e T A S B S L A 0.25 B B A1 H 8X M B M 16 q NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. SEATING PLANE T C http://onsemi.com 8 MC14549B, MC14559B ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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