ON MC10H116D Triple line receiver Datasheet

MC10H116
Triple Line Receiver
Description
The MC10H116 is a triple differential amplifier designed for use in
sensing differential signals over long lines and is a functional/pinout
duplication of the MC10116, with 100% improvement in propagation
delay and no increase in power supply current. For termination
information see AND8020.
http://onsemi.com
MARKING DIAGRAMS*
Features
• Propagation Delay, 1.0 ns Typical
• Power Dissipation 85 mW Typ/Pkg (same as MECL 10K™)
• Improved Noise Margin 150 mV (Over Operating Voltage and
4
2
5
3
9
6
10
7
12
14
13
15
11
VBB*
CDIP−16
L SUFFIX
CASE 620A
When input pin with
bubble goes positive
it’s respective output
pin with bubble goes
positive.
1
16
*VBB to be used to supply bias to the MC10H116 only and bypassed
(when used) with 0.01 mF to 0.1 mF capacitor to ground (0 V). VBB can
source < 1.0 mA.
The MC10H116 is designed to be used in sensing differential signals
over long lines. The bias supply (VBB) is made available to make the
device useful as a Schmitt trigger, or in other applications where a
stable reference voltage is necessary.
Active current sources provide these receivers with excellent
common−mode noise rejection. If any amplifier in a package is not
used, one input of that amplifier must be connected to VBB to prevent
unbalancing the current−source bias network.
The MC10H116 does not have internal−input pull− down resistors.
This provides high impedance to the amplifier input and facilitates
differential connections.
Applications:
• Low Level Receiver
• Voltage Level
• Schmitt Trigger
Interface
VCC1 = Pin 1
VCC2 = Pin 16
VEE = Pin 8
MC10H116L
AWLYYWW
1
Temperature Range)
Voltage Compensated
MECL 10K Compatible
Pb−Free Packages are Available*
•
•
•
16
16
MC10H116P
AWLYYWWG
16
1
PDIP−16
P SUFFIX
CASE 648
1
1 20
20 1
10H116G
AWLYYWW
PLCC−20
FN SUFFIX
CASE 775
16
Figure 1. Logic Diagram
16
10H116G
AWLYWW
1
SO−16
D SUFFIX
CASE 751B
VCC1
AOUT
AOUT
AIN
AIN
BOUT
BOUT
VEE
1
16
2
15
3
14
COUT
4
13
5
12
CIN
6
11
7
10
8
9
VCC2
16
COUT
16
CIN
VBB
BIN
BIN
Figure 2. Dip Pin Assignment
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
February, 2006 − Rev. 10
10H116
ALYWG
1
SOEIAJ−16
M, MEL SUFFIX
CASE 966
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see TND309, the Pin Conversion Tables,
page 9.
© Semiconductor Components Industries, LLC, 2006
1
1
A
WL
YY
WW
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Publication Order Number:
MC10H116/D
MC10H116
Table 1. MAXIMUM RATINGS
Symbol
Rating
Unit
VEE
Power Supply (VCC = 0)
Characteristic
−8.0 to 0
Vdc
VI
Input Voltage (VCC = 0)
0 to VEE
Vdc
Iout
Output Current
50
100
mA
TA
Operating Temperature Range
0 to +75
°C
Tstg
Storage Temperature Range − Plastic
− Ceramic
−55 to +150
−55 to +165
°C
°C
− Continuous
− Surge
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 2)
0°
Symbol
Characteristic
Min
25°
75°
Max
Min
Max
Min
Max
Unit
IE
Power Supply Current
−
23
−
21
−
23
mA
IinH
Input Current High
−
150
−
95
−
95
mA
ICBO
Input Leakage Current
−
1.5
−
1.0
−
1.0
mA
VBB
Reference Voltage
−1.38
−1.27
−1.35
−1.25
−1.31
−1.19
Vdc
VOH
High Output Voltage
−1.02
−0.84
−0.98
−0.81
−0.92
−0.735
Vdc
VOL
Low Output Voltage
−1.95
−1.63
−1.95
−1.63
−1.95
−1.60
Vdc
VIH
High Input Voltage (Note 1)
−1.17
−0.84
−1.13
−0.81
−1.07
−0.735
Vdc
VIL
Low Input Voltage (Note 1)
−1.95
−1.48
−1.95
−1.48
−1.95
−1.45
Vdc
VCMR
Common Mode
−
−
−2.85 to −0.8
−
−
Vdc
VPP
Input Sensitivity (Note 3)
−
−
150 typ
−
−
mVPP
Range (Note 4)
1. When VBB is used as the reference voltage.
2. Each MECL 10H™ series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50−ohm resistor to −2.0 V.
3. Differential input not to exceed 1.0 Vdc.
4. 150 mVp−p differential input required to obtain full logic swing on output.
Table 3. AC CHARACTERISTICS
0°
Symbol
Characteristic
25°
75°
Min
Max
Min
Max
Min
Max
Unit
tpd
Propagation Delay
0.4
1.3
0.4
1.3
0.45
1.45
ns
tr
Rise Time
0.5
1.5
0.5
1.6
0.5
1.7
ns
tf
Fall Time
0.5
1.5
0.5
1.6
0.5
1.7
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
http://onsemi.com
2
MC10H116
ORDERING INFORMATION
Package
Shipping †
SO−16
48 Units / Rail
MC10H116DG
SO−16
(Pb−Free)
48 Units / Rail
MC10H116DR2
SO−16
2500 / Tape & Reel
MC10H116DR2G
SO−16
(Pb−Free)
2500 / Tape & Reel
MC10H116FN
PLCC−20
46 Units / Rail
MC10H116FNG
PLCC−20
(Pb−Free)
46 Units/Rail
MC10H116FNR2
PLCC−20
500 / Tape & Reel
MC10H116FNR2G
PLCC−20
(Pb−Free)
500 / Tape & Reel
MC10H116L
CD1P−16
25 Units / Rail
MC10H116M
SOEIAJ−16
50 Units / Rail
MC10H116MG
SOEIAJ−16
(Pb−Free)
50 Units / Rail
MC10H116MEL
SOEIAJ−16
2000 / Tape & Reel
MC10H116MELG
SOEIAJ−16
(Pb−Free)
2000 / Tape & Reel
MC10H116P
PD1P−16
25 Units / Rail
MC10H116PG
PD1P−16
(Pb−Free)
25 Units / Rail
Device
MC10H116D
†For information on tape and reel specifications,including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
3
MC10H116
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
0.007 (0.180) M T L−M
B
Y BRK
−N−
U
N
S
0.007 (0.180) M T L−M
S
S
N
S
D
−L−
−M−
Z
W
20
D
1
V
0.007 (0.180) M T L−M
S
N
S
R
0.007 (0.180) M T L−M
S
N
S
Z
G
J
H
N
0.007 (0.180) M T L−M
PLANE
F
0.007 (0.180) M T L−M
VIEW S
N
S
S
S
N
S
K
0.004 (0.100)
−T− SEATING
VIEW S
S
T L−M
K1
E
G1
0.010 (0.250) S T L−M
S
VIEW D−D
A
C
0.010 (0.250)
G1
X
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
http://onsemi.com
4
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−− 0.020
2_
10 _
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2_
10 _
7.88
8.38
1.02
−−−
S
N
S
MC10H116
PACKAGE DIMENSIONS
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
B
A
A
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
M
B
L
16X
0.25 (0.010)
E
M
DIM
A
B
C
D
E
F
G
H
K
L
M
N
J
T B
F
C
K
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
−−−
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
SEATING
PLANE
T
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
−−− 0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
G
16X
0.25 (0.010)
M
D
T A
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
−A−
16
9
1
8
B
F
C
L
S
−T−
H
SEATING
PLANE
K
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
http://onsemi.com
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MC10H116
PACKAGE DIMENSIONS
SO−16
D SUFFIX
PLASTIC DIP PACKAGE
CASE 751B−05
ISSUE J
−A−
16
9
1
8
−B−
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
8 PL
0.25 (0.010)
M
B
S
G
R
K
DIM
A
B
C
D
F
G
J
K
M
P
R
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
SOEIAJ−16
CASE 966−01
ISSUE A
16
Q1
E HE
1
M_
L
8
Z
DETAIL P
D
e
VIEW P
A
0.13 (0.005)
c
A1
b
M
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
9
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.031
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
Literature Distribution Center for ON Semiconductor
USA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: [email protected]
http://onsemi.com
6
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MC10H116/D