Cirrus CS5463-ISZ Single phase, bi-directional power/energy ic Datasheet

CS5463
Single Phase, Bi-directional Power/Energy IC
Features
Description
z Energy
The CS5463 is an integrated power measurement device which combines two ∆Σ
analog-to-digital converters, power calculation
engine, energy-to-frequency converter, and a
serial interface on a single chip. It is designed to
accurately measure instantaneous current and
voltage, and calculate VRMS, IRMS, instantaneous power, apparent power, active power, and
reactive power for single-phase, 2- or 3-wire
power metering applications.
Data Linearity: ±0.1% of Reading
over 1000:1 Dynamic Range
z On-chip Functions:
- Instantaneous Voltage, Current, and Power
- IRMS and VRMS, Apparent, Reactive, and Active
(Real) Power
- Active Fundamental and Harmonic Power
- Reactive Fundamental, Power Factor, and Line
Frequency
- Energy-to-pulse Conversion
- System Calibrations and Phase Compensation
- Temperature Sensor
The CS5463 is optimized to interface to shunt resistors or current transformers for current
measurement, and to resistive dividers or potential transformers for voltage measurement.
z Meets
accuracy spec for IEC, ANSI, JIS.
z Low Power Consumption
z Current Input Optimized for Sense Resistor.
z GND-referenced Signals with Single Supply
z On-chip 2.5 V Reference (25 ppm/°C typ)
z Power Supply Monitor
z Simple Three-wire Digital Serial Interface
z “Auto-boot” Mode from Serial E2PROM
z Power Supply Configurations:
The CS5463 features a bi-directional serial interface for communication with a processor and a
programmable energy-to-pulse output function.
Additional features include on-chip functionality
to facilitate system-level calibration, temperature
sensor, voltage sag detection, and phase
compensation.
ORDERING INFORMATION:
VA+ = +5 V; AGND = 0 V; VD+ = +3.3 V to +5 V
RESET
VA+
IIN+
IIN-
PGA
See Page 45.
4th Order ∆Σ
Modulator
VD+
Digital
Filter
HPF
Option
MODE
CS
VREFIN
Power
Calculation
Engine
Temperature
Sensor
x1
SDI
Serial
Interface
SDO
SCLK
INT
VIN+
VIN-
VREFOUT
x10
Voltage
Reference
AGND
http://www.cirrus.com
2nd Order ∆Σ
Modulator
Power
Monitor
PFMON
Digital
Filter
System
Clock
HPF
Option
/K
Clock
Generator
E-to-F
E1
E2
E3
Calibration
XIN XOUT CPUCLK
Copyright © Cirrus Logic, Inc. 2008
(All Rights Reserved)
DGND
APR ‘08
DS678F2
CS5463
TABLE OF CONTENTS
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Characteristics & Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1 Digital Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2 Voltage and Current Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3 Power Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.4 Linearity Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14
14
14
15
5. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.1 Analog Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.1.1 Voltage Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.1.2 Current Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.2 IIR Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3 High-pass Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4 Performing Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5 Energy Pulse Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16
16
16
17
5.5.1 Active Energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5.2 Apparent Energy Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5.3 Reactive Energy Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5.4 Voltage Channel Sign Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5.5 PFMON Output Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5.6 Design Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17
18
18
18
19
19
5.6 Sag and Fault Detect Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.7 No Load Threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.8 On-chip Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.9 Voltage Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.10 System Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.11 Power-down States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.12 Oscillator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.13 Event Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
19
19
19
20
20
20
20
21
5.13.1 Typical Interrupt Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.14 Serial Port Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.14.1 Serial Port Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.15 Register Paging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.16 Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.16.1 Start Conversions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.16.2 SYNC0 and SYNC1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.16.3 Power-up/Halt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.16.4 Power-down and Software Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.16.5 Register Read/Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.16.6 Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
22
23
23
23
23
23
24
25
6. Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6.1 Page 0 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.1 Configuration Register ( Config ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.2 Current and Voltage DC Offset Register ( IDCoff , VDCoff ) . . . . . . . . . . . .
6.1.3 Current and Voltage Gain Register ( Ign , Vgn ) . . . . . . . . . . . . . . . . . . . .
6.1.4 Cycle Count Register ( Cycle Count ) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.5 PulseRateE Register ( PulseRateE ). . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.6 Instantaneous Current, Voltage, and Power Registers ( I , V , P ) . . . . . .
2
26
26
27
27
27
27
28
DS678F2
CS5463
6.1.7 Active (Real) Power Register ( PActive ) . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.8 RMS Current & Voltage Registers ( IRMS , VRMS ) . . . . . . . . . . . . . . . . . .
6.1.9 Epsilon Register ( e ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.10 Power Offset Register ( Poff ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.11 Status Register and Mask Register ( Status , Mask ) . . . . . . . . . . . . . . .
6.1.12 Current and Voltage AC Offset Register ( VACoff , IACoff ) . . . . . . . . . . .
6.1.13 Operational Mode Register ( Mode ) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.14 Temperature Register ( T ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.15 Average and Instantaneous Reactive Power Register ( QAVG , Q ) . . . .
6.1.16 Peak Current and Peak Voltage Register ( Ipeak , Vpeak ) . . . . . . . . . . . .
6.1.17 Reactive Power Register ( QTrig ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.18 Power Factor Register ( PF ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.19 Apparent Power Register ( S ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.20 Control Register ( Ctrl ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.21 Harmonic Active Power Register ( PH ) . . . . . . . . . . . . . . . . . . . . . . . . .
6.1.22 Fundamental Active Power Register ( PF ) . . . . . . . . . . . . . . . . . . . . . .
6.1.23 Fundamental Reactive Power Register ( QH ) . . . . . . . . . . . . . . . . . . . .
6.1.24 Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.2 Page 1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.2.1 Energy Pulse Output Width ( PulseWidth ) . . . . . . . . . . . . . . . . . . . . . . . .
6.2.2 No Load Threshold ( LoadMin ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.2.3 Temperature Gain Register ( TGain ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.2.4 Temperature Offset Register ( TOff ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3 Page 3 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3.1 Voltage Sag & Current Fault Duration Registers . . . . . . . . . . . . . . . . . . .
6.3.2 Voltage Sag & Current Fault Level Registers . . . . . . . . . . . . . . . . . . . . . . .
28
28
28
29
29
30
30
31
31
31
32
32
32
33
33
33
34
34
35
35
35
35
35
36
36
36
7. System Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
7.1 Channel Offset and Gain Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
7.1.1 Calibration Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.1.1.1 Duration of Calibration Sequence . . . . . . . . . . . . . . . . . . . . .
7.1.2 Offset Calibration Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.1.2.1 DC Offset Calibration Sequence . . . . . . . . . . . . . . . . . . . . . .
7.1.2.2 AC Offset Calibration Sequence . . . . . . . . . . . . . . . . . . . . . .
7.1.3 Gain Calibration Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.1.3.1 AC Gain Calibration Sequence . . . . . . . . . . . . . . . . . . . . . . .
7.1.3.2 DC Gain Calibration Sequence . . . . . . . . . . . . . . . . . . . . . . .
7.1.4 Order of Calibration Sequences . . . . . . . . . . . . . . . . . . . . . . . . . .
37
37
37
37
38
38
38
39
39
7.2 Phase Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
7.3 Active Power Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
8. Auto-boot Mode Using E2PROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.1 Auto-boot Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.2 Auto-boot Data for E2PROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.3 Which E2PROMs Can Be Used? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
9. Basic Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10. Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12. Environmental, Manufacturing, & Handling Information . . . . . . . . . . . . . . . . .
13. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DS678F2
41
44
45
45
46
3
CS5463
LIST OF FIGURES
Figure 1. CS5463 Read and Write Timing Diagrams.................................................................. 12
Figure 2. Timing Diagram for E1, E2, and E3 ............................................................................... 13
Figure 3. Data Measurement Flow Diagram. .............................................................................. 14
Figure 4. Power Calculation Flow. .............................................................................................. 15
Figure 5. Active and Reactive Energy Pulse Outputs ................................................................. 17
Figure 6. Apparent Energy Pulse Outputs .................................................................................. 18
Figure 7. Voltage Channel Sign Pulse outputs ........................................................................... 18
Figure 8. PFMON Output to Pin E3 ............................................................................................. 19
Figure 9. Sag and Fault Detect ................................................................................................... 19
Figure 10. Oscillator Connection................................................................................................. 20
Figure 11. CS5463 Memory Map ................................................................................................ 22
Figure 12. Calibration Data Flow ................................................................................................ 37
Figure 13. System Calibration of Offset ...................................................................................... 37
Figure 14. System Calibration of Gain. ....................................................................................... 38
Figure 15. Example of AC Gain Calibration ................................................................................ 38
Figure 16. Example of AC Gain Calibration ................................................................................ 38
Figure 17. Typical Interface of E2PROM to CS5463................................................................... 40
Figure 18. Typical Connection Diagram (Single-phase, 2-wire).................................................. 41
Figure 20. Typical Connection Diagram (Single-phase, 3-wire).................................................. 42
Figure 19. Typical Connection Diagram (Single-phase, 2-wire – Isolated from Power Line)...... 42
Figure 21. Typical Connection Diagram (Single-phase, 3-wire – No Neutral Available)............. 43
LIST OF TABLES
Table 1. Current Channel PGA Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 2. E2 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 3. E3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 4. Interrupt Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4
DS678F2
CS5463
1. OVERVIEW
The CS5463 is a CMOS monolithic power measurement device with a computation engine and an energy-to-frequency pulse output. The CS5463 combines a programmable gain amplifier, two ∆Σ Analog-to-Digital Converters (ADCs), system calibration, and a computation engine on a single chip.
The CS5463 is designed for power measurement applications and is optimized to interface to a current
sense resistor or transformer for current measurement, and to a resistive divider or potential transformer
for voltage measurement. The current channel provides programmable gains to accommodate various input levels from a multitude of sensing elements. With single +5 V supply on VA+/AGND, both of the
CS5463’s input channels can accommodate common mode plus signal levels between (AGND - 0.25 V)
and VA+.
The CS5463 also is equipped with a computation engine that calculates instantaneous power, IRMS,
VRMS, apparent power, active (real) power, reactive power, harmonic active power, active and reactive
fundamental power, and power factor. The CS5463 additional features include line frequency, current and
voltage sag detection, zero-cross detection, positive-only accumulation mode, and three programmable
pulse output pins. To facilitate communication to a microprocessor, the CS5463 includes a simple
three-wire serial interface which is SPI™ and Microwire™ compatible. The CS5463 provides three outputs for energy registration. E1, E2, and E3 are designed to interface to a microprocessor.
DS678F2
5
CS5463
2. PIN DESCRIPTION
Crystal Out
XOUT
CPU Clock Output CPUCLK
Positive Digital Supply
VD+
Digital Ground
DGND
Serial Clock
SCLK
Serial Data Ouput
SDO
Chip Select
CS
Mode Select
MODE
Differential Voltage Input
VIN+
Differential Voltage Input
VINVoltage Reference Output VREFOUT
Voltage Reference Input
VREFIN
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
XIN
SDI
E2
E1
INT
RESET
E3
PFMON
IIN+
IINVA+
AGND
Crystal In
Serial Data Input
Energy Output 2
Energy Output 1
Interrupt
Reset
High Frequency Energy Output
Power Fail Monitor
Differential Current Input
Differential Current Input
Positive Analog Supply
Analog Ground
Clock Generator
Crystal Out
Crystal In
1,24
CPU Clock Output
XOUT, XIN – The output and input of an inverting amplifier. Oscillation occurs when connected to
a crystal, providing an on-chip system clock. Alternatively, an external clock can be supplied to
the XIN pin to provide the system clock for the device.
2
CPUCLK – Output of on-chip oscillator which can drive one standard CMOS load.
Serial Clock Input
5
SCLK – A Schmitt-trigger input pin. Clocks data from the SDI pin into the receive buffer and out
of the transmit buffer onto the SDO pin when CS is low.
Serial Data Output
6
SDO – Serial port data output pin.SDO is forced into a high-impedance state when CS is high.
Chip Select
7
CS – Low, activates the serial port interface.
Mode Select
8
MODE - High, enables the “auto-boot” mode. The mode pin has an internal pull-down resistor.
Control Pins and Serial Data I/O
Energy Output
18,21,22 E3, E1, E2 – Active-low pulses with an output frequency proportional to the selected power. Configurable outputs for active, apparent, and reactive power, negative energy indication, zero cross
detection, and power failure monitoring. E1, E2, E3 outputs are configured in the Operational
Modes Register.
Reset
19
RESET – A Schmitt-trigger input pin. Low activates Reset, all internal registers (some of which
drive output pins) are set to their default states.
Interrupt
20
INT - Low, indicates that an enabled event has occurred.
Serial Data Input
23
SDI - Serial port data input pin. Data will be input at a rate determined by SCLK.
Analog Inputs/Outputs
Differential Voltage Inputs
9,10
Differential Current Inputs
15,16
Voltage Reference Output
11
VREFOUT – The on-chip voltage reference output. The voltage reference has a nominal magnitude of 2.5 V and is referenced to the AGND pin on the converter.
Voltage Reference Input
12
VREFIN – The input to this pin establishes the voltage reference for the on-chip modulator.
VIN+, VIN- – Differential analog input pins for the voltage channel.
IIN+, IIN- – Differential analog input pins for the current channel.
Power Supply Connections
Positive Digital Supply
3
VD+ – The positive digital supply.
Digital Ground
4
DGND – Digital Ground.
Positive Analog Supply
14
VA+ – The positive analog supply.
Analog Ground
13
AGND – Analog ground.
Power Fail Monitor
17
PFMON – The power fail monitor pin monitors the analog supply. If the analog supply does not
meet or falls below PFMON’s voltage threshold, a Low-supply Detect (LSD) event is set in the
status register.
6
DS678F2
CS5463
3. CHARACTERISTICS & SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
Parameter
Positive Digital Power Supply
Positive Analog Power Supply
Voltage Reference
Specified Temperature Range
Symbol
VD+
VA+
VREFIN
TA
Min
3.135
4.75
-40
Typ
5.0
5.0
2.5
-
Max
5.25
5.25
+85
Unit
V
V
V
°C
ANALOG CHARACTERISTICS
•
•
•
•
Min / Max characteristics and specifications are guaranteed over all Recommended Operating Conditions.
Typical characteristics and specifications are measured at nominal supply voltages and TA = 25 °C.
VA+ = VD+ = 5 V ±5%; AGND = DGND = 0 V; VREFIN = +2.5 V. All voltages with respect to 0 V.
MCLK = 4.096 MHz.
Parameter
Symbol
Min
Typ
Max
Unit
PActive
-
±0.1
-
%
QAvg
-
±0.2
-
%
PF
-
±0.2
±0.27
-
IRMS
-
±0.2
±1.5
-
%
%
%
%
%
-
±0.1
-
%
80
-0.25
-
VA+
dB
V
-
500
100
-
mVP-P
mVP-P
94
-115
32
52
22.5
4.5
-
dB
dB
pF
pF
kΩ
µVrms
µVrms
4.0
±0.4
-
µV/°C
%
Accuracy
Active Power
(Note 1)
Average Reactive Power
(Note 1 and 2)
Power Factor
(Note 1 and 2)
Current RMS
(Note 1)
Voltage RMS
(Note 1)
All Gain Ranges
Input Range 0.1% - 100%
All Gain Ranges
Input Range 0.1% - 100%
All Gain Ranges
Input Range 1.0% - 100%
Input Range 0.1% - 1.0%
All Gain Ranges
Input Range 0.2% - 100%
Input Range 0.1% - 0.2%
All Gain Ranges
Input Range 5% - 100%
VRMS
Analog Inputs (Both Channels)
Common Mode Rejection
Common Mode + Signal
(DC, 50, 60 Hz)
All Gain Ranges
CMRR
Analog Inputs (Current Channel)
Differential Input Range
[(IIN+) - (IIN-)]
(Gain = 10)
(Gain = 50)
Total Harmonic Distortion
Crosstalk with Voltage Channel at Full Scale
Input Capacitance
(Gain = 50)
(50, 60 Hz)
(Gain = 10)
(Gain = 50)
Effective Input Impedance
Noise (Referred to Input)
IIN
THD
(Gain = 10)
(Gain = 50)
NI
80
30
-
(Note 3)
OD
GE
-
IC
EII
Offset Drift (Without the High Pass Filter)
Gain Error
Notes: 1. Applies when the HPF option is enabled.
2. Applies when the line frequency is equal to the product of the Output Word Rate (OWR) and the value
of epsilon (ε).
DS678F2
7
CS5463
ANALOG CHARACTERISTICS (Continued)
Parameter
Symbol
Min
Typ
Max
Unit
Analog Inputs (Voltage Channel)
Differential Input Range
[(VIN+) - (VIN-)]
VIN
-
500
-
mVP-P
Total Harmonic Distortion
Crosstalk with Current Channel at Full Scale (50, 60 Hz)
Input Capacitance
All Gain Ranges
Effective Input Impedance
Noise (Referred to Input)
THD
IC
EII
NV
65
2
-
75
-70
0.2
140
-
dB
dB
pF
MΩ
µVrms
Offset Drift (Without the High Pass Filter)
Gain Error
OD
GE
-
16.0
±3.0
-
µV/°C
%
T
-
±5
-
°C
Power Supply Currents (Active State)
IA+
ID+ (VA+ = VD+ = 5 V)
ID+ (VA+ = 5 V, VD+ = 3.3 V)
PSCA
PSCD
PSCD
-
1.1
2.9
1.7
-
mA
mA
mA
Power Consumption
Active State (VA+ = VD+ = 5 V)
(Note 4)
Active State (VA+ = 5 V, VD+ = 3.3 V)
Stand-by State
Sleep State
Power Supply Rejection Ratio
(50, 60 Hz)
(Note 5)
Voltage Channel
Current Channel
PFMON Low-voltage Trigger Threshold
(Note 6)
PFMON High-voltage Power-on Trip Point
(Note 7)
PC
45
70
2.3
-
29
17.5
2.7
mW
mW
mW
µW
PSRR
21
11.6
8
10
65
75
2.45
2.55
(Note 3)
Temperature Channel
Temperature Accuracy
Power Supplies
PMLO
PMHI
dB
dB
V
V
Notes: 3. Applies before system calibration.
4. All outputs unloaded. All inputs CMOS level.
5. Measurement method for PSRR: VREFIN tied to VREFOUT, VA+ = VD+ = 5 V, a 150 mV
(zero-to-peak) (60 Hz) sinewave is imposed onto the +5 V DC supply voltage at VA+ and VD+ pins. The
“+” and “-” input pins of both input channels are shorted to AGND. Then the CS5463 is commanded to
continuous conversion acquisition mode, and digital output data is collected for the channel under test.
The (zero-to-peak) value of the digital sinusoidal output signal is determined, and this value is converted
into the (zero-to-peak) value of the sinusoidal voltage (measured in mV) that would need to be applied
at the channel’s inputs, in order to cause the same digital sinusoidal output. This voltage is then defined
as Veq. PSRR is then (in dB):
150
PSRR = 20 ⋅ log ---------V eq
6. When voltage level on PFMON is sagging, and LSD bit = 0, the voltage at which LSD is set to 1.
7. If the LSD bit has been set to 1 (because PFMON voltage fell below PMLO), this is the voltage level on
PFMON at which the LSD bit can be permanently reset back to 0.
8
DS678F2
CS5463
VOLTAGE REFERENCE
Parameter
Symbol
Min
Typ
Max
Unit
VREFOUT
+2.4
+2.5
+2.6
V
Reference Output
Output Voltage
Temperature Coefficient
(Note 8)
TCVREF
-
25
60
ppm/°C
Load Regulation
(Note 9)
∆VR
-
6
10
mV
VREFIN
+2.4
+2.5
+2.6
V
Input Capacitance
-
4
-
pF
Input CVF Current
-
25
-
nA
Reference Input
Input Voltage Range
Notes: 8. The voltage at VREFOUT is measured across the temperature range. From these measurements the
following formula is used to calculate the VREFOUT Temperature Coefficient:.
(
MAX
MIN )
AVG
(T
A
MAX
1
- T AM IN
(
- VREFOUT
( (VREFOUT
VREFO UT
( 1.0 x 10
6
(
TC VREF =
9. Specified at maximum recommended output of 1 µA, source or sink.
DIGITAL CHARACTERISTICS
•
•
•
•
Min / Max characteristics and specifications are guaranteed over all Recommended Operating Conditions.
Typical characteristics and specifications are measured at nominal supply voltages and TA = 25 °C.
VA+ = VD+ = 5V ±5%; AGND = DGND = 0 V. All voltages with respect to 0 V.
MCLK = 4.096 MHz.
Parameter
Symbol
Min
Typ
Max
Unit
2.5
4.096
20
MHz
40
-
60
%
40
-
60
%
-2.8
-
+2.8
°
-
DCLK/8
-
Hz
-
DCLK/1024
-
Hz
-
0.5
-
Hz
25
-
100
%F.S.
Master Clock Characteristics
Master Clock Frequency
Internal Gate Oscillator (Note 11) MCLK
Master Clock Duty Cycle
CPUCLK Duty Cycle
(Note 12 and 13)
Filter Characteristics
Phase Compensation Range
(Voltage Channel, 60 Hz)
Input Sampling Rate
Digital Filter Output Word Rate
High-pass Filter Corner Frequency
DCLK = MCLK/K
(Both Channels)
OWR
-3 dB
Full-scale DC Calibration Range (Referred to Input) (Note 14) FSCR
Channel-to-channel Time-shift Error
(Note 15)
1.0
µs
Input/Output Characteristics
High-level Input Voltage
All Pins Except XIN and SCLK and RESET
XIN
SCLK and RESET
VIH
Low-level Input Voltage (VD = 5 V)
All Pins Except XIN and SCLK and RESET
XIN
SCLK and RESET
VIL
DS678F2
0.6 VD+
(VD+) - 0.5
0.8 VD+
-
-
V
V
V
-
-
0.8
1.5
0.2 VD+
V
V
V
9
CS5463
Parameter
Symbol
Min
Typ
Max
Unit
Low-level Input Voltage (VD = 3.3 V)
All Pins Except XIN and SCLK and RESET
XIN
SCLK and RESET
VIL
-
-
0.48
0.3
0.2 VD+
V
V
V
High-level Output Voltage
Iout = +5 mA
VOH
(VD+) - 1.0
-
-
V
Low-level Output Voltage
Iout = -5 mA
VOL
-
-
0.4
V
Iin
-
±1
±10
µA
3-state Leakage Current
IOZ
-
-
±10
µA
Digital Output Pin Capacitance
Cout
-
5
-
pF
Input Leakage Current
(Note 16)
Notes: 10. All measurements performed under static conditions.
11. If a crystal is used, then XIN frequency must remain between 2.5 MHz - 5.0 MHz. If an external
oscillator is used, XIN frequency range is 2.5 MHz - 20 MHz, but K must be set so that MCLK is between
2.5 MHz - 5.0 MHz.
12. If external MCLK is used, then the duty cycle must be between 45% and 55% to maintain this
specification.
13. The frequency of CPUCLK is equal to MCLK.
14. The minimum FSCR is limited by the maximum allowed gain register value. The maximum FSCR is
limited by the full-scale signal applied to the channel input.
15. Configuration Register bits PC[6:0] are set to “0000000”.
16. The MODE pin is pulled low by an internal resistor.
10
DS678F2
CS5463
SWITCHING CHARACTERISTICS
•
•
•
•
Min / Max characteristics and specifications are guaranteed over all Recommended Operating Conditions.
Typical characteristics and specifications are measured at nominal supply voltages and TA = 25 °C.
VA+ = 5 V ±5% VD+ = 3.3 V ±5% or 5 V ±5%; AGND = DGND = 0 V. All voltages with respect to 0 V.
Logic Levels: Logic 0 = 0 V, Logic 1 = VD+.
Parameter
Symbol
Min
Typ
Max
Unit
Rise Times
(Note 17)
Any Digital Input Except SCLK
SCLK
Any Digital Output
trise
-
50
1.0
100
-
µs
µs
ns
Fall Times
(Note 17)
Any Digital Input Except SCLK
SCLK
Any Digital Output
tfall
-
50
1.0
100
-
µs
µs
ns
XTAL = 4.096 MHz (Note 18)
tost
-
60
-
ms
SCLK
-
-
2
MHz
t1
t2
200
200
-
-
ns
ns
CS Falling to SCLK Rising
t3
50
-
-
ns
Data Set-up Time Prior to SCLK Rising
t4
50
-
-
ns
Data Hold Time After SCLK Rising
t5
100
-
-
ns
CS Falling to SDI Driving
t6
-
20
50
ns
SCLK Falling to New Data Bit (hold time)
t7
-
20
50
ns
CS Rising to SDO Hi-Z
t8
-
20
50
ns
Start-up
Oscillator Start-up Time
Serial Port Timing
Serial Clock Frequency
Serial Clock
Pulse Width High
Pulse Width Low
SDI Timing
SDO Timing
Auto-Boot Timing
Serial Clock
Pulse Width Low
Pulse Width High
t9
t10
8
8
MCLK
MCLK
MODE setup time to RESET Rising
t11
50
ns
RESET rising to CS falling
t12
48
MCLK
CS falling to SCLK rising
t13
100
SCLK falling to CS rising
t14
CS rising to driving MODE low (to end auto-boot sequence)
t15
50
ns
SDO guaranteed setup time to SCLK rising
t16
100
ns
8
MCLK
16
MCLK
Notes: 17. Specified using 10% and 90% points on waveform of interest. Output loaded with 50 pF.
18. Oscillator start-up time varies with crystal parameters. This specification does not apply when using an
external clock source.
DS678F2
11
CS5463
t3
CS
t1
t2
SC LK
H ig h B y te
LSB
MSB
MSB-1
LSB
LSB
MSB
MSB
C o m m a n d T im e 8 S C L K s
MSB-1
t5
MSB-1
LSB
SDI
MSB-1
MSB
t4
M id B y te
L o w B y te
SDI Write Timing (Not to Scale)
CS
t1
t8
LSB
MSB-1
LSB
MSB
L o w B y te
MSB-1
LSB
UNKNOW N
MSB-1
MSB
SDO
M id B y te
MSB
H ig h B y te
t6
t7
t2
LSB
MSB-1
SDI
MSB
SC LK
C o m m a n d T im e 8 S C L K s
SYN C 0 or SYN C 1
C om m and
SYN C 0 or SYN C1
C om m and
SYN C 0 or SYN C1
C om m and
SDO Read Timing (Not to Scale)
t11
t15
MODE
( IN P U T )
RESET
( IN P U T )
CS
t14
t12
t7
t13
(O U T P U T )
SCLK
(O U T P U T )
t10
SDO
t16
t9
t4
t5
STOP bit
(O U T P U T )
SDI
( IN P U T )
Last 8
B it s
D a ta fro m E E P R O M
Auto-boot Sequence Timing (Not to Scale)
Figure 1. CS5463 Read and Write Timing Diagrams
12
DS678F2
CS5463
SWITCHING CHARACTERISTICS (Continued)
Parameter
Symbol
Min
Typ
Max
Unit
tperiod
250
-
-
µs
Pulse Width
tpw
244
-
-
µs
Rising Edge to Falling Edge
t3
6
-
-
µs
E2 Setup to E1 and/or E3 Falling Edge
t4
1.5
-
-
µs
E1 Falling Edge to E3 Falling Edge
t5
248
-
-
µs
E1, E2, and E3 Timing (Note 19 and 20)
Period
Notes: 19. Pulse output timing is specified at MCLK = 4.096 MHz, E2MODE = 0, and E3MODE[1:0] = 0. Refer to
Section 5.5 Energy Pulse Output on page 17 for more information on pulse output pins.
20. Timing is proportional to the frequency of MCLK.
tperiod
tpw
E1
t3
t4
E2
t4
E3
tpw
t5
tperiod
t5
t3
Figure 2. Timing Diagram for E1, E2, and E3
ABSOLUTE MAXIMUM RATINGS
WARNING: Operation at or beyond these limits may result in permanent damage to the device.
Normal operation is not guaranteed at these extremes.
Parameter
DC Power Supplies
Input Current, Any Pin Except Supplies
Symbol
Min
Typ
Max
Unit
(Notes 21 and 22)
Positive Digital
Positive Analog
VD+
VA+
-0.3
-0.3
-
+6.0
+6.0
V
V
(Notes 23, 24, 25)
IIN
-
-
±10
mA
IOUT
-
-
100
mA
PD
-
-
500
mW
Output Current, Any Pin Except VREFOUT
Power Dissipation
(Note 26)
Analog Input Voltage
All Analog Pins
VINA
- 0.3
-
(VA+) + 0.3
V
Digital Input Voltage
All Digital Pins
VIND
-0.3
-
(VD+) + 0.3
V
Ambient Operating Temperature
TA
-40
-
85
°C
Storage Temperature
Tstg
-65
-
150
°C
Notes: 21. VA+ and AGND must satisfy [(VA+) - (AGND)] ≤ + 6.0 V.
22. VD+ and AGND must satisfy [(VD+) - (AGND)] ≤ + 6.0 V.
23. Applies to all pins including continuous over-voltage conditions at the analog input pins.
24. Transient current of up to 100 mA will not cause SCR latch-up.
25. Maximum DC input current for a power supply pin is ±50 mA.
26. Total power dissipation, including all input currents and output currents.
DS678F2
13
VDCoff* Vgn *
VOLTAGE
x10
DELAY
REG
SINC 3
X
DELAY
REG
IIR
MUX
Digital Filter
2nd Order
∆Σ
Modulator
+
APF
+
Σ
MUX
CS5463
V*
HPF
HPF
X
VQ*
X
ε*
PC6 PC5 PC4 PC3 PC2 PC1 PC0
SYSGain *
Configuration Register *
SINC 3
XVDEL XIDEL VHPF
8
6
7
IHPF
5
IIR
X
Q*
4
2π
Operational Modes Register *
DELAY
REG
X
DELAY
REG
IIR
Digital Filter
+
Σ
X
IDCoff*
P*
X
+
∫
X
3 2 1 0
HPF
APF
MUX
4th Order
∆Σ
Modulator
2322
...
MUX
PGA
Σ
+
6
CURRENT
+
I*
* DENOTES REGISTER NAME.
I gn*
Figure 3. Data Measurement Flow Diagram.
4. THEORY OF OPERATION
The CS5463 is a dual-channel analog-to-digital converter (ADC) followed by a computation engine that performs power calculations and energy-to-pulse
conversion. The data flow for the voltage and current
channel measurement and the power calculation algorithms are depicted in Figure 3 and 4, respectively.
The analog inputs are structured with two dedicated
channels, Voltage and Current, then optimized to simplify interfacing to various sensing elements.
The voltage-sensing element introduces a voltage
waveform on the voltage channel input VIN± and is subject to a gain of 10x. A second-order delta-sigma modulator samples the amplified signal for digitization.
Simultaneously, the current-sensing element introduces
a voltage waveform on the current channel input IIN±
and is subject to two selectable gains of the programmable gain amplifier (PGA). The amplified signal is
sampled by a fourth-order delta-sigma modulator for
digitization. Both converters sample at a rate of
MCLK/8, the over-sampling provides a wide dynamic
range and simplified anti-alias filter design.
4.1 Digital Filters
The decimating digital filters on both channels are Sinc3
filters followed by 4th-order IIR filters. The single-bit
data is passed to the low-pass decimation filter and output at a fixed word rate. The output word is passed to an
optional IIR filter to compensate for the magnitude roll
off of the low-pass filtering operation.
An optional digital high-pass filter (HPF in Figure 3) removes any DC component from the selected signal
path. By removing the DC component from the voltage
and/or the current channel, any DC content will also be
removed from the calculated active power as well. With
both HPFs enabled the DC component will be removed
14
from the calculated VRMS and I RMS as well as the apparent power.
When the optional HPF in either channel is disabled, an
all-pass filter (APF) is implemented. The APF has an
amplitude response that is flat within the channel bandwidth and is used for matching phase in systems where
only one HPF is engaged.
4.2 Voltage and Current Measurements
The digital filter output word is then subject to a DC offset adjustment and a gain calibration (See Section 7.
System Calibration on page 37). The calibrated measurement is available by reading the instantaneous voltage and current registers.
The Root Mean Square (RMS in Figure 4) calculations
are performed on N instantaneous voltage and current
samples, Vn and In, respectively (where N is the cycle
count), using the formula:
N–1
I RMS =
∑ In
n=0
--------------------N
and likewise for VRMS, using Vn. IRMS and VRMS are accessible by register reads, which are updated once every cycle count (referred to as a computational cycle).
4.3 Power Measurements
The instantaneous voltage and current samples are
multiplied to obtain the instantaneous power (see Figure 3). The product is then averaged over N conversions to compute active power and is used to drive
energy pulse output E1. Energy output E2 is selectable,
providing an energy sign or a pulse output that is proportional to the apparent power. Energy output E3
DS678F2
CS5463
VACoff*
Σ
N
V*
X
√
÷N
+
+
Σ
V RMS*
IACoff*
Σ
N
I*
X
Poff *
PulseRate *
X
Energy-to-pulse
+
P*
+
√
÷N
Σ
Σ
N
Σ
N
Q*
+
S*
+
X
X
Σ
I RMS*
E1
÷N
√
Σ
-
+
E2
Inverse
X
QTRIG*
PF*
E3
PACTIVE*
X
÷N
QAVG*
*DENOTES REGISTER NAME.
Figure 4. Power Calculation Flow.
provides a pulse output that is proportional to the reactive power or apparent power. Output E3 can also be set
to display the sign of the voltage applied to the voltage
channel or the PFMON comparator output.
The apparent power (S) is the combination of the active
power and reactive power, without reference to an impedance phase angle, and is calculated by the CS5463
using the following formula:
S = V RMS × I RMS
Power Factor (PF) is the active power (PActive) divided
by the apparent power (S)
P Active
PF = -----------------S
The sign of the power factor is determined by the active
power.
The CS5463 calculates the reactive power, QTrig utilizing trigonometric identities, giving the formula
Q Trig =
2
S 2 – P Active
Average reactive power, QAvg, is generated by averaging the voltage multiplied by the current with a 90° phase
shift difference between them. The 90° phase shift is realized by applying an IIR digital filter in the voltage channel to obtain quadrature voltage (see Figure 3). This
filter will give exactly -90° phase shift across all frequencies, and utilizes epsilon (ε) to achieve unity gain at the
line frequency.
The instantaneous quadrature voltage (VQ) and current
(I) samples are multiplied to obtain the instantaneous
DS678F2
quadrature power (Q). The product is then averaged
over N conversions, utilizing the formula
N
∑ Qn
n=1
Q Avg = -----------------------N
Fundamental active (PF) and reactive (QF) power is calculated by performing a discrete Fourier transform
(DFT) at the relevant frequency on the instantaneous
voltage (V) and current (I). Epsilon is used to set the frequency of the internal sine (imaginary component) and
cosine (real component) waveform generator. The harmonic active power (PH) is calculated by subtracting the
fundamental active power (PF) from the active power
(PActive).
The peak current (Ipeak) and peak voltage (Vpeak) are
the instantaneous current and voltage, respectively,
with the greatest magnitude detected during the last
computation cycle. Active, apparent, reactive, and fundamental power are updated every computation cycle.
4.4 Linearity Performance
The linearity of the VRMS, I RMS, active, reactive, and
power-factor power measurements (before calibration)
will be within ±0.1% of reading over the ranges specified, with respect to the input voltage levels required to
cause full-scale readings in the IRMS and VRMS registers. Refer to Accuracy Specifications on page 7.
Until the CS5463 is calibrated, the accuracy of the
CS5463 (with respect to a reference line-voltage and
line-current level on the power mains) is not guaranteed
to within ±0.1%. (See Section 7. System Calibration on
page 37.) The accuracy of the internal calculations can
often be improved by selecting a value for the Cycle
Count Register that will cause the time duration of one
computation cycle to be equal to (or very close to) a
whole number of power-line cycles (and N must be
greater than or equal to 4000).
15
CS5463
5. FUNCTIONAL DESCRIPTION
5.1 Analog Inputs
The CS5463 is equipped with two fully differential input
channels. The inputs VIN± and IIN± are designated as
the voltage and current channel inputs, respectively.
The full-scale differential input voltage for the current
and voltage channel is ±250 mVP.
5.1.1 Voltage Channel
The output of the line voltage resistive divider or transformer is connected to the VIN+ and VIN- input pins of
the CS5463. The voltage channel is equipped with a
10x fixed-gain amplifier. The full-scale signal level that
can be applied to the voltage channel is ±250 mV. If the
input signal is a sine wave the maximum RMS voltage
at a gain 10x is:
applied to the voltage and/or current channel, the maximum input range should be adjusted accordingly.
5.2 IIR Filters
The current and voltage channel are equipped with a
4th-order IIR filter, that is used to compensate for the
magnitude roll off of the low-pass decimation filter. Operational Mode Register bit IIR engages the IIR filters in
both the voltage and current channels.
5.3 High-pass Filters
which is approximately 70.7% of maximum peak voltage. The voltage channel is also equipped with a Voltage Gain Register, allowing for an additional
programmable gain of up to 4x.
By removing the offset from either channel, no error
component will be generated at DC when computing the
active power. By removing the offset from both channels, no error component will be generated at DC when
computing VRMS, IRMS, and apparent power. Operational Mode Register bits VHPF and IHPF activate the HPF
in the voltage and current channel respectively. When a
high-pass filter is active in only one channel, an all-pass
filter (APF) is applied to the other channel. The APF has
an amplitude response that is flat within the channel
bandwidth and is used for matching phase in systems
where only one HPF is engaged.
5.1.2 Current Channel
5.4 Performing Measurements
The output of the current-sense resistor or transformer
is connected to the IIN+ and IIN- input pins of the
CS5463. To accommodate different current sensing elements the current channel incorporates a programmable gain amplifier (PGA) with two programmable input
gains. Configuration Register bit Igain (see Table 1) defines the two gain selections and corresponding maximum input-signal level.
The CS5463 performs measurements of instantaneous
voltage (Vn) and current (In), and calculates instantaneous power (Pn) at an output word rate (OWR) of
250mV P
--------------------- ≅ 176.78mV
2
Igain
RMS
Maximum Input Range
0
±250 mV
10x
1
±50 mV
50x
Table 1. Current Channel PGA Setting
For example, if Igain=0, the current channel’s PGA gain
is set to 10x. If the input signals are pure sinusoids with
zero phase shift, the maximum peak differential signal
on the current or voltage channel is ±250 mVP. The input signal levels are approximately 70.7% of maximum
peak voltage producing a full-scale energy pulse registration equal to 50% of absolute maximum energy pulse
registration. This will be discussed further in See Section 5.5 Energy Pulse Output on page 17.
The Current Gain Register also facilitates an additional
programmable gain of up to 4x. If an additional gain is
16
( MCLK ⁄ K )
OWR = ----------------------------1024
where K is the clock divider selected in the Configuration Register.
The RMS voltage (VRMS), RMS current (IRMS), and active power (Pactive) are computed using N instantaneous
samples of Vn, In, and Pn respectively, where N is the
value in the Cycle Count Register and is referred to as
a “computation cycle”. The apparent power (S) is the
product of VRMS and IRMS. A computation cycle is derived from the master clock (MCLK), with frequency:
OWR
Computation Cycle = --------------N
Under default conditions and with K = 1, N = 4000, and
MCLK = 4.096 MHz – the OWR = 4000 Hz and the
Computation Cycle = 1 Hz.
All measurements are available as a percentage of full
scale. The format for signed registers is a two’s complement, normalized value between -1 and +1. The format
DS678F2
CS5463
for unsigned registers is a normalized value between 0
and 1. A register value of
the pulse output mode, which is controlled by bit
E2MODE in the Operational Mode Register.
23
(2 – 1)
------------------------ = 0.99999988
23
2
represents the maximum possible value.
At each instantaneous measurement, the CRDY bit will
be set in the Status Register, and the INT pin will become active if the CRDY bit is unmasked in the Mask
Register. At the end of each computation cycle, the
DRDY bit will be set in the Status Register, and the INT
pin will become active if the DRDY bit is unmasked in
the Mask Register. When these bits are asserted, they
must be cleared before they can be asserted again.
ε
= fi ⁄ fs
where fs = MCLK / (K*1024). With MCLK = 4.096 MHz
and clock divider K = 1, fs = 4000 Hz. For the two
most-common line frequencies, 50 Hz and 60 Hz
ε
= 50 Hz ⁄ 4000 Hz = 0.0125
ε
= 60 Hz ⁄ 4000 Hz = 0.015
E2 Output Mode
0
Sign of Energy
1
Apparent Energy
Table 2. E2 Pin Configuration
The E3 pin can be set to register Reactive Energy (default), PFMON, Voltage Channel Sign, or Apparent Energy. Table 3 defines the pulse output format, which is
controlled by bits E3MODE[1:0] in the Operational
Mode Register.
E3MODE1
E3MODE0
E3 OutPut Mode
0
0
Reactive Energy
0
1
PFMON
1
0
Voltage Channel Sign
1
1
Apparent Energy
If the Cycle Count Register (N) is set to 1, all output calculations are instantaneous, and DRDY, like CRDY, will
indicate when instantaneous measurements are finished. Some calculations are inhibited when the cycle
count is less than 2.
Epsilon (ε) is the ratio of the input line frequency (fi) to
the sample frequency (fs) of the ADC.
E2MODE
Table 3. E3 Pin Configuration
The pulse output frequency of E1, E2, and E3 is directly
proportional to the power calculated from the input signals. The value contained in the PulseRateE Register is
the ratio of the frequency of energy-output pulses to the
number of samples, at full scale, which defines the average frequency for the output pulses. The pulse width,
tpw in Figure 2, is programmable through the PulseWidth register, and is approximately equal to:
1
t pw ( sec ) ≅ PulseWidth • -----------------------------------------------( MCLK/K ) / 1024
and
respectively. Epsilon is used to set the frequency of the
internal sine/cosine reference for the fundamental active and reactive measurements, and the gain of the 90°
phase shift (IIR) filter for the average reactive power.
5.5 Energy Pulse Output
The CS5463 provides three output pins for energy registration. By default, E1 registers active energy, E3 registers reactive energy, and E2 indicates the sign of both
active and reactive energy. (See Figure 2. Timing Diagram for E1, E2, and E3 on page13.) The E1 pulse output is designed to register the Active Energy. The E2 pin
can be set to register Apparent Energy. Table 2 defines
If MCLK = 4.096 MHz, K = 1, and PulseWidth = 1, then
tpw ≅ 0.25 ms.
5.5.1 Active Energy
The E1 pin produces active-low pulses with an output
frequency proportional to the active power. The E2 pin
is the energy direction indicator. Positive energy is represented by E1 pin falling while the E2 is high. Negative
energy is represented by the E1 pin falling while the E2
is low. The E1 and E2 switching characteristics are
specified in Figure 2. Timing Diagram for E1, E2, and E3
on page13.
Figure 5 illustrates the pulse output format with positive
active energy and negative reactive energy.
E1
E2
E3
Figure 5. Active and Reactive energy pulse outputs
DS678F2
17
CS5463
The pulse output frequency of E1 is directly proportional
to the active power calculated from the input signals. To
calculate the output frequency of E1, the following transfer function can be utilized:
FREQ
P
VIN × VGAIN × IIN × IGAIN × PF × PulseRate
= --------------------------------------------------------------------------------------------------------------------------------2
VREFIN
FREQP = Average frequency of active energy E1 pulses [Hz]
VIN = rms voltage across VIN+ and VIN- [V]
VGAIN = Voltage channel gain
IIN = rms voltage across IIN+ and IIN- [V]
IGAIN = Current channel gain
PF = Power Factor
PulseRate = PulseRateE x (MCLK/K)/2048 [Hz]
VREFIN = Voltage at VREFIN pin [V]
With MCLK = 4.096 MHz, PF = 1, and default settings,
the pulses will have an average frequency equal to the
frequency specified by PulseRate when the input signals applied to the voltage and current channels cause
full-scale readings in the instantaneous voltage and current registers. The maximum pulse frequency from the
E1 pin is (MCLK/K)/2048.
5.5.2 Apparent Energy Mode
Pin E2 outputs apparent energy pulses when the Operational Mode Register bit E2MODE = 1. Pin E3 outputs
apparent energy pulses when the Operational Mode
Register bits E3MODE[1:0] = 3 (11b). Figure 6 illustrates the pulse output format with apparent energy on
E2 (E2MODE = 1 and E3MODE[1:0] = 0)
E1
E2
With MCLK = 4.096 MHz and default settings, the pulses will have an average frequency equal to the frequency specified by PulseRate when the input signals
applied to the voltage and current channels cause
full-scale readings in the instantaneous voltage and current registers. The maximum pulse frequency from the
E2 (and/or E3) pin is (MCLK/K)/2048. The E2 (and/or
E3) pin outputs apparent energy, but has no energy direction indicator.
5.5.3 Reactive Energy Mode
Reactive energy pulses are output on pin E3 by setting
bit E3MODE[1:0] = 0 (default) in the Operational Mode
Register. Positive reactive energy is registered by E3
falling when E2 is high. Negative reactive energy is registered by E3 falling when E2 is low. Figure 5 on
page 17 illustrates the pulse output format with negative
reactive energy output on pin E3 and the sign of the energy on E2. The E3 and E2 pulse output switching characteristics are specified in Figure 2 on page 13.
The pulse output frequency of E3 is directly proportional
to the reactive power calculated from the input signals.
To calculate the output frequency on E3, the following
transfer function can be utilized:
FREQ
Q
VIN × VGAIN × IIN × IGAIN × PQ × PulseRate
= ---------------------------------------------------------------------------------------------------------------------------------2
VREFIN
FREQQ = Average frequency of reactive energy E3 pulses [Hz]
VIN = rms voltage across VIN+ and VIN- [V]
VGAIN = Voltage channel gain
IIN = rms voltage across IIN+ and IIN- [V]
IGAIN = Current channel gain
PQ = 1 – PF2
PulseRate = PulseRateE x (MCLK/K)/2048 [Hz]
VREFIN = Voltage at VREFIN pin [V]
E3
Figure 6. Apparent energy pulse outputs
The pulse output frequency of E2 (and/or E3) is directly
proportional to the apparent power calculated from the
input signals. Since apparent power is without reference
to an impedance phase angle, the following transfer
function can be utilized to calculate the output frequency
on E2 (and/or E3).
FREQ
VIN × VGAIN × IIN × IGAIN × PulseRate
= -----------------------------------------------------------------------------------------------------------------S
2
VREFIN
FREQS = Average frequency of apparent energy E2 and/or E3 pulses [Hz]
VIN = rms voltage across VIN+ and VIN- [V]
VGAIN = Voltage channel gain
IIN = rms voltage across IIN+ and IIN- [V]
IGAIN = Current channel gain
PulseRate = PulseRateE x (MCLK/K)/2048 [Hz]
VREFIN = Voltage at VREFIN pin [V]
With MCLK = 4.096 MHz, PF = 0 and default settings,
the pulses will have an average frequency equal to the
frequency specified by PulseRate when the input signals applied to the voltage and current channels cause
full-scale readings in the instantaneous voltage and current registers. The maximum pulse frequency from the
E1 pin is (MCLK/K)/2048.
5.5.4 Voltage Channel Sign Mode
Setting bits E3MODE[1:0] = 2 (10b) in the Operational
Mode Register outputs the sign of the voltage channel
on pin E3. Figure 7 illustrates the output format with voltage channel sign on E3
E1
E2
E3
Figure 7. Voltage Channel Sign Pulse outputs
18
DS678F2
CS5463
Output pin E3 is high when the line voltage is positive
and pin E3 is low when the line voltage is negative.
5.5.5 PFMON Output Mode
Setting bit E3MODE[1:0] = 1 (01b) in the Operational
Mode Register outputs the state of the PFMON comparator on pin E3. Figure 8 illustrates the output format with
PFMON on E3
E1
E2
E3
Above PFMON Threshold
Below PFMON Threshold
Figure 8. PFMON output to pin E3
When PFMON is greater then the threshold, pin E3 is
high and when PFMON is less than the threshold pin E3
is low.
5.5.6 Design Example
EXAMPLE #1:
5.6 Sag and Fault Detect Feature
Status bit VSAG and IFAULT in the Status Register, indicates a sag occurred in the power line voltage and
current, respectively. For a sag condition to be identified, the absolute value of the instantaneous voltage or
current must be less than the sag level for more than
half of the sag duration (see Figure 9).
To activate voltage sag detection, a voltage sag level
must be specified in the Voltage Sag Level Register
(VSAGLevel), and a voltage sag duration must be specified in the Voltage Sag Duration Register (VSAGDuration). To activate current fault detection, a current sag
level must be specified in the Current Fault Level Register (ISAGLevel), and a current sag duration must be
specified in the Current Fault Duration Register (ISAGDuration). The voltage and current sag levels are specified as the average of the absolute instantaneous
voltage and current, respectively. Voltage and current
sag duration is specified in terms of ADC cycles.
The maximum rated levels for a power line meter are
250 V rms and 20 A rms. The required number of pulses-per-second on E1 is 100 pulses per second
(100 Hz), when the levels on the power line are
220 V rms and 15 A rms.
With a 10x gain on the voltage and current channel the
maximum input signal is 250 mVP. (See Section 5.1 Analog Inputs on page 16.) To prevent over-driving the
channel inputs, the maximum rated rms input levels will
register 0.6 in VRMS and IRMS by design. Therefore the
voltage level at the channel inputs will be 150 mV rms
when the maximum rated levels on the power lines are
250 V rms and 20 A rms.
Solving for PulseRate using the transfer function:
2
FREQ P × VREFIN
PulseRate = --------------------------------------------------------------------------------------------VIN × VGAIN × IIN × IGAIN × PF
Therefore with PF = 1 and:
VIN = 220V × ( ( 150mV ) ⁄ ( 250V ) ) = 132mV
IIN = 15A × ( ( 150mV ) ⁄ ( 20A ) ) = 112.5mV
the pulse rate is:
2
100 × 2.5
PulseRate = ----------------------------------------------------------------- = 420.8754Hz
0.132 × 10 × 0.1125 × 10
and the PulseRateE Register is set to:
PulseRateE =
PulseRate
---------------------------------------( MCLK ⁄ K ) ⁄ 2048
=
with MCLK = 4.096 MHz and K = 1.
DS678F2
0.2104377
Level
Duration
Figure 9. Sag and Fault Detect
5.7 No Load Threshold
The No Load Threshold register (LoadMin) is used to
disable the active energy pulse output when the magnitude of the PActive register is less than the value in the
LoadMin register.
5.8 On-chip Temperature Sensor
The on-chip temperature sensor is designed to assist in
characterizing the measurement element over a desired
temperature range. Once a temperature characterization is performed, the temperature sensor can then be
utilized to assist in compensating for temperature drift.
Temperature measurements are performed during continuous conversions and stored in the Temperature
Register. The Temperature Register (T) default is Celsius scale (°C). The Temperature Gain Register (Tgain)
and Temperature Offset Register (Toff) are constant values allowing for temperature scale conversions.
19
CS5463
The temperature update rate is a function of the number
of ADC samples. With MCLK = 4.096 MHz and K = 1
the update rate is:
2240 samples
--------------------------------------- =
( MCLK ⁄ K ) ⁄ 1024
0.56 sec
The Cycle Count Register (N) must be set to a value
greater then one. Status bit TUP in the Status Register,
indicates when the Temperature Register is updated.
The Temperature Offset Register sets the zero-degree
measurement. To improve temperature measurement
accuracy, the zero-degree offset may need to be adjusted after the CS5463 is initialized. Temperature-offset
calibration is achieved by adjusting the Temperature
Offset Register (Toff) by the differential temperature
(∆T) measured from a calibrated digital thermometer
and the CS5463 temperature sensor. A one-degree adjustment to the Temperature Register (T) is achieved by
adding 2.737649x10-4 to the Temperature Offset Register (Toff). Therefore,
T off = T off + ( ∆T × 2.737649 ⋅ 10
–4
)
if Toff = -0.0951126 and ∆T = -2.0 (°C), then
T off = [ – 0.0951126 + ( – 2.0 × 2.737649 ⋅ 10
–4
) ] = – 0.09566
or 0xF3C168 (2’s compliment notation) is stored in the
Temperature Offset Register (Toff).
To convert the Temperature Register (T) from a Celsius
scale (°C) to a Fahrenheit scale (°F) utilize the formula
o
9 o
F = --- ( C + 17.7778 )
5
Applying the above relationship to the CS5461A temperature measurement algorithm
5.10 System Initialization
Upon powering up, the digital circuitry is held in reset
until the analog voltage reaches 4.0 V. At that time, an
eight-XIN-clock-period delay is enabled to allow the oscillator to stabilize. The CS5463 will then initialize.
A hardware reset is initiated when the RESET pin is asserted with a minimum pulse width of 50 ns. The RESET signal is asynchronous, with a Schmitt-trigger
input. Once the RESET pin is de-asserted, an
eight-XIN-clock-period delay is enabled.
A software reset is initiated by writing the command
0x80. After a hardware or software reset, the internal
registers (some of which drive output pins) will be reset
to their default values. Status bit DRDY in the Status
Register, indicates the CS5463 is in its active state and
ready to receive commands.
5.11 Power-down States
The CS5463 has two power-down states, Stand-by and
Sleep. In the stand-by state all circuitry except the voltage reference and crystal oscillator is turned off. To return the device to the active state, a power-up command
is sent to the device.
In Sleep state, all circuitry except the instruction decoder is turned off. When the power-up command is sent to
the device, a system initialization is performed (See
Section 5.10 System Initialization on page 20).
5.12 Oscillator Characteristics
XIN and XOUT are the input and output of an inverting
amplifier configured as an on-chip oscillator, as shown
in Figure 10. The oscillator circuit is designed to work
with a quartz crystal. To reduce circuit cost, two load capacitors C1 and C2 are integrated in the device, from
XIN to DGND, and XOUT to DGND. PCB trace lengths
should be minimized to reduce stray capacitance. To
–4 ⎞
o
9
⎞ T 〈 o C〉 + ⎛ T
T 〈 F〉 = ⎛⎝ --- × T
⎝ off + ( 17.7778 × 2.737649 ⋅ 10 )⎠
5 gain ⎠
XOUT
C1
If Toff = -0.09566 and Tgain = 23.507 for a Celsius scale,
then the modified values are Toff = -0.09079
(0xF460E1) and Tgain = 42.3132 (0x54A05E) for a
Fahrenheit scale.
XIN
C2
5.9 Voltage Reference
The CS5463 is specified for operation with a +2.5 V reference between the VREFIN and AGND pins. To utilize
the on-chip 2.5 V reference, connect the VREFOUT pin
to the VREFIN pin of the device. The VREFIN can be
used to connect external filtering and/or references.
20
Oscillator
Circuit
DGND
C1 = C2 = 22 pF
Figure 10. Oscillator Connection
DS678F2
CS5463
drive the device from an external clock source, XOUT
should be left unconnected while XIN is driven by the
external circuitry. There is an amplifier between XIN and
the digital section which provides CMOS level signals.
This amplifier works with sinusoidal inputs so there are
no problems with slow edge times.
INTERRUPT HANDLER ROUTINE:
4) Read the Status Register.
5) Disable all interrupts.
6) Branch to the proper interrupt service routine.
7) Clear the Status Register by writing back the read
value in step 4.
The CS5463 can be driven by an external oscillator
ranging from 2.5 to 20 MHz, but the K divider value must
be set such that the internal MCLK will run somewhere
between 2.5 MHz and 5 MHz. The K divider value is set
with the K[3:0] bits in the Configuration Register. As an
example, if XIN = MCLK = 15 MHz, and K is set to 5,
DCLK will equal 3 MHz, which is a valid value for DCLK.
This handshaking procedure ensures that any new interrupts activated between steps 4 and 7 are not lost
(cleared) by step 7.
5.13 Event Handler
5.14 Serial Port Overview
The INT pin is used to indicate that an internal error or
event has taken place in the CS5463. Writing a logic 1
to any bit in the Mask Register allows the corresponding
bit in the Status Register to activate the INT pin. The interrupt condition is cleared by writing a logic 1 to the bit
that has been set in the Status Register.
The CS5463 incorporates a serial port transmit and receive buffer with a command decoder that interprets
one-byte (8-bit) commands as they are received. There
are four types of commands: instructions, synchronizing, register writes, and register reads (See Section
5.16 Commands on page 23).
The behavior of the INT pin is controlled by the IMODE
and IINV bits of the Configuration Register.
Instructions are one byte in length and will interrupt any
instruction currently executing. Instructions do not affect
register reads currently being transmitted.
IMODE
IINV
INT Pin
0
0
Active-low Level
0
1
Active-high Level
1
0
Low Pulse
1
1
High Pulse
Table 4. Interrupt Configuration
If the interrupt output signal format is set for either falling
or rising edge, the duration of the INT pulse will be at
least one DCLK cycle (DCLK = MCLK/K).
5.13.1 Typical Interrupt Handler
The steps below show how interrupts can be handled.
INITIALIZATION:
1) All Status bits are cleared by writing 0xFFFFFF to
the Status Register.
2) The condition bits which will be used to generate
interrupts are then set to logic 1 in the Mask Register.
3) Enable interrupts.
DS678F2
8) Re-enable interrupt
9) Return from interrupt service routine.
Synchronizing commands are one byte in length and
only affect the serial interface. Synchronizing commands do not affect operations currently in progress.
Register writes must be followed by three bytes of data.
Register reads can return up to four bytes of data.
Commands and data are transferred most-significant bit
(MSB) first. Figure 1 on page 12, defines the serial port
timing and required sequence necessary for writing to
and reading from the serial port receive and transmit
buffer, respectively. While reading data from the serial
port, commands and data can be written simultaneously. Starting a new register read command while data is
being read will terminate the current read in progress.
This is acceptable if the remainder of the current read
data is not needed. During data reads, the serial port requires input data. If a new command and data is not
sent, SYNC0 or SYNC1 must be sent.
5.14.1 Serial Port Interface
The serial port interface is a “4-wire” synchronous serial
communications interface. The interface is enabled to
start excepting SCLKs when CS (Chip Select) is asserted (logic 0). SCLK (Serial bit-clock) is a Schmitt-trigger
input that is used to strobe the data on SDI (Serial Data
In) into the receive buffer and out of the transmit buffer
onto SDO (Serial Data Out).
21
CS5463
If the serial port interface becomes unsynchronized with
respect to the SCLK input, any attempt to clock valid
commands into the serial interface may result in unexpected operation. Therefor, the serial port interface
must then be re-initialized by one of the following actions:
-
Drive the CS pin high, then low.
-
Hardware Reset (drive RESET pin low for at
least 10 µs).
-
Issue the Serial Port Initialization Sequence,
which is 3 (or more) SYNC1 command bytes
(0xFF) followed by one SYNC0 command byte
(0xFE).
If a re-synchronization is necessary, it is best to re-initialize the part either by hardware or software reset
(command 0x80), as the state of the part may be unknown.
5.15 Register Paging
registers in another page, the Page Register (address
0x1F) must be written with the desired page number.
0xFFF
ROM
2048 Words
Pages
0x40 - 0x7F
Hardware Registers*
32 Pages
Pages
0x20 - 0x3F
Software Register*
32 Pages
Pages
0 - 0x1F
0x800
0x7FF
0x400
0x3FF
0x000
* Accessed using register read/write commands.
Read/write commands access one of the 32 registers
within a specified page. By default, Page = 0. To access
Figure 11. CS5463 Memory Map
Example:
Reading register 6 in page 3.
1. Write 3 to page register with command and data:
0x7E 0x00 0x00 0x03
2. Read register 6 with command:
0x0C 0xFF 0xFF 0xFF
22
DS678F2
CS5463
5.16 Commands
All commands are 8 bits in length. Any command byte value that is not listed in this section is invalid. Commands
that write to registers must be followed by 3 bytes of data. Commands that read data can be chained with other commands (e.g., while reading data, a new command can be sent which can execute during the original read). All commands except register reads, register writes, and SYNC0 & SYNC1 will abort any currently executing commands.
5.16.1 Start Conversions
B7
1
B6
1
B5
1
B4
0
B3
C3
B2
0
B1
0
B0
0
Initiates acquiring measurements and calculating results. The device has two modes of acquisition.
C3
Modes of acquisition/measurement
0 = Perform a single computation cycle
1 = Perform continuous computation cycles
5.16.2 SYNC0 and SYNC1
B7
1
B6
1
B5
1
B4
1
B3
1
B2
1
B1
1
B0
SYNC
The serial port can be initialized by asserting CS or by sending three or more consecutive SYNC1 commands followed by a SYNC0 command. The SYNC0 or SYNC1 can also be sent while sending data out.
SYNC
0 = Last byte of a serial port re-initialization sequence.
1 = Used during reads and serial port initialization.
5.16.3 Power-up/Halt
B7
1
B6
0
B5
1
B4
0
B3
0
B2
0
B1
0
B0
0
If the device is powered-down, Power-Up/Halt will initiate a power on reset. If the part is already powered-on, all
computations will be halted.
5.16.4 Power-down and Software Reset
B7
1
B6
0
B5
0
B4
S1
B3
S0
B2
0
B1
0
B0
0
To conserve power the CS5463 has two power-down states. In stand-by state all circuitry, except the analog/digital
clock generators, is turned off. In the sleep state all circuitry, except the command decoder, is turned off. Bringing
the CS5463 out of sleep state requires more time than out of stand-by state, because of the extra time needed to
re-start and re-stabilize the analog oscillator.
S[1:0]
DS678F2
Power-down state
00 = Software Reset
01 = Halt and enter stand-by power saving state. This state allows quick power-on
10 = Halt and enter sleep power saving state.
11 = Reserved
23
CS5463
5.16.5 Register Read/Write
B7
0
B6
W/R
B5
RA4
B4
RA3
B3
RA2
B2
RA1
B1
RA0
B0
0
The Read/Write informs the command decoder that a register access is required. During a read operation, the addressed register is loaded into an output buffer and clocked out by SCLK. During a write operation, the data is
clocked into an input buffer and transferred to the addressed register upon completion of the 24th SCLK.
W/R
Write/Read control
0 = Read
1 = Write
RA[4:0]
Register address bits (bits 5 through 1) of the read/write command.
Register Page 0
Address
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
RA[4:0]
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
10000
10001
10010
10011
10100
10101
10110
10111
11000
11001
11010
11011
11100
11101
11110
11111
Name
Config
IDCoff
Ign
VDCoff
Vgn
Cycle Count
PulseRateE
I
V
P
PActive
IRMS
VRMS
ε (Epsilon)
Poff
Status
IACoff
VACoff
Mode
T
QAVG
Q
IPeak
VPeak
QTrig
PF
Mask
S
Ctrl
PH
PF
QF
Description
Configuration
Current DC Offset
Current Gain
Voltage DC Offset
Voltage Gain
Number of A/D conversions used in one computation cycle (N)).
Sets the E1, E2 and E3 energy-to-frequency output pulse rate.
Instantaneous Current
Instantaneous Voltage
Instantaneous Power
Active (Real) Power
RMS Current
RMS Voltage
Ratio of line frequency to output word rate (OWR)
Power Offset
Status
Current AC (RMS) Offset
Voltage AC (RMS) Offset
Operation Mode
Temperature
Average Reactive Power
Instantaneous Reactive Power
Peak Current
Peak Voltage
Reactive Power calculated from Power Triangle
Power Factor
Interrupt Mask
Apparent Power
Control
Harmonic Active Power
Fundamental Active Power
Fundamental Reactive Power / Page
Note: For proper operation, do not attempt to write to unspecified registers.
24
DS678F2
CS5463
Register Page 1
Address
0
1
2
3
RA[4:0]
00000
00001
00010
00011
Name
PulseWidth
LoadMin
TGain
Toff
Description
Energy Pulse Output Width
No Load Threshold
Temperature Sensor Gain
Temperature Sensor Offset
Name
VSAGDuration
VSAGLevel
ISAGDuration
ISAGLevel
Description
Voltage sag sample interval
Voltage sag level
Current fault sample interval
Current fault level
Register Page 3
Address
6
7
10
11
RA[4:0]
00110
00111
01010
01011
Note: For proper operation, do not attempt to write to unspecified registers.
5.16.6 Calibration
B7
1
B6
1
B5
0
B4
CAL4
B3
CAL3
B2
CAL2
B1
CAL1
B0
CAL0
The CS5463 can perform system calibrations. Proper input signals must be applied to the current and voltage channel before performing a designated calibration.
CAL[4:0]*
Designates calibration to be performed
01001 = Current channel DC offset
01010 = Current channel DC gain
01101 = Current channel AC offset
01110 = Current channel AC gain
10001 = Voltage channel DC offset
10010 = Voltage channel DC gain
10101 = Voltage channel AC offset
10110 = Voltage channel AC gain
11001 = Current and Voltage channel DC offset
11010 = Current and Voltage channel DC gain
11101 = Current and Voltage channel AC offset
11110 = Current and Voltage channel AC gain
*For proper operation, values for CAL[4:0] not specified should not be used.
DS678F2
25
CS5463
6. REGISTER DESCRIPTION
1.
“Default” = bit status after power-on or reset
2.
Any bit not labeled is Reserved. A zero should always be used when writing to one of these bits.
6.1 Page 0 Registers
6.1.1 Configuration Register ( Config )
Address: 0
23
PC6
22
PC5
21
PC4
20
PC3
19
PC2
18
PC1
17
PC0
16
Igain
15
EWA
14
-
13
-
12
IMODE
11
IINV
10
-
9
-
8
-
7
-
6
-
5
-
4
iCPU
3
K3
2
K2
1
K1
0
K0
Default = 0x000001
26
PC[6:0]
Phase compensation. A 2’s complement number which sets a delay in the voltage channel relative to the current channel. Default setting is 0000000 = 0.0215 degree phase delay at 60 Hz
(when MCLK = 4.096 MHz). See Section 7.2 Phase Compensation on page 39 for more information.
Igain
Sets the gain of the current PGA.
0 = Gain is 10 (default)
1 = Gain is 50
EWA
Allows the E1 and E2 pins to be configured as open-collector output pins.
0 = Normal outputs (default)
1 = Only the pull-down device of the E1 and E2 pins are active
IMODE, IINV
Interrupt configuration bits. Select the desired pin behavior for indication of an interrupt.
00 = Active-low level (default)
01 = Active-high level
10 = High-to-low pulse
11 = Low-to-high pulse
iCPU
Inverts the CPUCLK clock. In order to reduce the level of noise present when analog signals
are sampled, the logic driven by CPUCLK should not be active during the sample edge.
0 = Normal operation (default)
1 = Minimize noise when CPUCLK is driving rising edge logic
K[3:0]
Clock divider. A 4-bit binary number used to divide the value of MCLK to generate the internal
clock DCLK. The internal clock frequency is DCLK = MCLK/K. The value of K can range between 1 and 16. Note that a value of “0000” will set K to 16 (not zero). K = 1 at reset.
DS678F2
CS5463
6.1.2 Current and Voltage DC Offset Register ( IDCoff , VDCoff )
Address: 1 (Current DC Offset); 3 (Voltage DC Offset)
MSB
0
-(2 )
LSB
2
-1
2
-2
-3
2
-4
2
-5
2
-6
2
-7
2
.....
2-17
2
-18
2
-19
2
-20
2
-21
2
-22
2-23
Default = 0x000000
The DC Offset registers (IDCoff,VDCoff) are initialized to 0.0 on reset. When DC Offset calibration is performed, the
register is updated with the DC offset measured over a computation cycle. DRDY will be set at the end of the
calibration. This register may be read and stored for future system offset compensation. The value is represented in two's complement notation and in the range of -1.0 ≤ IDCoff, VDCoff < 1.0, with the binary point to the right of
the MSB. See Section 7.1.2.1 DC Offset Calibration Sequence on page 37 for more information.
6.1.3 Current and Voltage Gain Register ( Ign , Vgn )
Address: 2 (Current Gain); 4 (Voltage Gain)
MSB
LSB
21
20
2-1
2-2
2-3
2-4
2-5
2-6
.....
2-16
2-17
2-18
2-19
2-20
2-21
2-22
Default = 0x400000 = 1.000
The gain registers (Ign,Vgn) are initialized to 1.0 on reset. When either a AC or DC Gain calibration is performed,
the register is updated with the gain measured over a computation cycle. DRDY will be set at the end of the
calibration. This register may be read and stored for future system gain compensation. The value is in the range
0.0 ≤ Ign,Vgn < 3.9999, with the binary point to the right of the second MSB.
6.1.4 Cycle Count Register ( Cycle Count )
Address: 5
MSB
223
LSB
222
221
220
219
218
217
216
.....
26
25
24
23
22
21
20
Default = 0x000FA0 = 4000
Cycle Count, denoted as N, determines the length of one computation cycle. During continuous conversions,
the computation cycle frequency is (MCLK/K)/(1024∗N). A one second computational cycle period occurs when
MCLK = 4.096 MHz, K = 1, and N = 4000.
6.1.5 PulseRateE Register ( PulseRateE )
Address: 6
MSB
-(20)
LSB
2-1
2-2
2-3
2-4
2-5
2-6
2-7
.....
2-17
2-18
2-19
2-20
2-21
2-22
2-23
Default = 0x800000 = 1.00 (2 kHz @ 4.096 MHz MCLK)
PulseRateE sets the frequency of E1, E2, & E3 pulses. E1, E2, E3 frequency = (MCLK x PulseRateE) / 2048 at
full scale. For a 4 khz sample rate, the maximum pulse rate is 2 khz. The value is represented in two's complement notation and in the range is -1.0 ≤ PulseRateE < 1.0, with the binary point to the right of the MSB. Negative
values have the same effect as positive. See Section 5.5 Energy Pulse Output on page 17 for more information.
DS678F2
27
CS5463
6.1.6 Instantaneous Current, Voltage, and Power Registers ( I , V , P )
Address: 7 (Instantaneous Current); 8 (Instantaneous Voltage); 9 (Instantaneous Power)
MSB
0
-(2 )
LSB
2
-1
2
-2
-3
2
-4
2
-5
2
-6
2
-7
2
.....
2-17
2
-18
2
-19
2
-20
2
-21
2
-22
2-23
I and V contain the instantaneous measured values for current and voltage, respectively. The instantaneous
voltage and current samples are multiplied to obtain Instantaneous Power (P). The value is represented in two's
complement notation and in the range of -1.0 ≤ I, V, P < 1.0, with the binary point to the right of the MSB.
6.1.7 Active (Real) Power Register ( PActive )
Address: 10 (Active Power)
MSB
-(20)
LSB
2-1
2-2
2-3
2-4
2-5
2-6
2-7
.....
2-17
2-18
2-19
2-20
2-21
2-22
2-23
The instantaneous power is averaged over each computation cycle (N conversions) to compute Active Power
(PActive). The value will be within in the range of -1.0 ≤ PActive< 1.0. The value is represented in two's complement
notation, with the binary point to the right of the MSB.
6.1.8 RMS Current & Voltage Registers ( IRMS , VRMS )
Address: 11 (IRMS); 12 (VRMS)
MSB
2-1
LSB
2-2
2-3
2-4
2-5
2-6
2-7
2-8
.....
2-18
2-19
2-20
2-21
2-22
2-23
2-24
IRMS and VRMS contain the Root Mean Square (RMS) values of I and V, calculated each computation cycle. The
value is represented in unsigned binary notation and in the range of 0.0 ≤ IRMS, VRMS < 1.0, with the binary point
to the left of the MSB.
6.1.9 Epsilon Register ( ε )
Address: 13
MSB
-(2
0)
LSB
2-1
2-2
2-3
2-4
2-5
2-6
2-7
.....
2-17
2-18
2-19
2-20
2-21
2-22
2-23
Default = 0x01999A = 0.0125 sec
Epsilon (ε) is the ratio of the input line frequency to the sample frequency of the ADC (See Section 5.4 Performing Measurements on page 16). Epsilon is either written to the register, or measured during conversions. The
value is represented in two's complement notation and in the range of -1.0 ≤ ε < 1.0, with the binary point to the
right of the MSB. Negative values have no significance.
28
DS678F2
CS5463
6.1.10 Power Offset Register ( Poff )
Address: 14
MSB
LSB
0
-(2 )
2
-1
2
-2
-3
2
-4
-5
2
2
-6
-7
2
2
2-17
.....
2
-18
2
-19
2
-20
2
-21
2
-22
2-23
Default = 0x000000
Power Offset (Poff) is added to the instantaneous power being accumulated in the Pactive register, and can be
used to offset contributions to the energy result that are caused by undesirable sources of energy that are inherent in the system. The value is represented in two's complement notation and in the range of -1.0 ≤ Poff < 1.0,
with the binary point to the right of the MSB.
6.1.11 Status Register and Mask Register ( Status , Mask )
Address: 15 (Status Register); 26 (Mask Register)
23
DRDY
22
21
20
CRDY
19
18
17
IOR
16
VOR
15
14
IROR
13
VROR
12
EOR
11
IFAULT
10
VSAG
9
8
7
TUP
6
TOD
5
4
VOD
3
IOD
2
LSD
1
FUP
0
IC
Default =
0x800001 (Status Register), 0x000000 (Mask Register)
The Status Register indicates status within the chip. In normal operation, writing a '1' to a bit will cause the bit
to reset. Writing a '0' to a bit will not change it’s current state.
The Mask Register is used to control the activation of the INT pin. Placing a logic '1' in a Mask bit will allow the
corresponding bit in the Status Register to activate the INT pin when the status bit is asserted.
DRDY
Data Ready. During conversions, this bit will indicate the end of computation cycles. For calibrations, this bit indicates the end of a calibration sequence.
CRDY
Conversion Ready. Indicates a new conversion is ready. This will occur at the output word rate.
IOR
Current Out of Range. Set when the Instantaneous Current Register overflows.
VOR
Voltage Out of Range. Set when the Instantaneous Voltage Register overflows.
IROR
IRMS Out of Range. Set when the IRMS Register overflows.
VROR
VRMS Out of Range. Set when the VRMS Register overflows.
EOR
Energy Out of Range. Set when PACTIVE overflows.
IFAULT
Indicates a current fault has occurred. See Section 5.6 Sag and Fault Detect Feature on page
19.
VSAG
Indicates a voltage sag has occurred. See Section 5.6 Sag and Fault Detect Feature on page
19.
TUP
Temperature Updated. Indicates the Temperature Register has updated.
TOD
Modulator oscillation detected on the temperature channel. Set when the modulator oscillates
due to an input above full scale.
VOD (IOD)
Modulator oscillation detected on the voltage (current) channel. Set when the modulator oscil-
DS678F2
29
CS5463
lates due to an input above full scale. The level at which the modulator oscillates is significantly
higher than the voltage channel’s differential input voltage (current) range.
Note: The IOD and VOD bits may be ‘falsely’ triggered by very brief voltage spikes from the
power line. This event should not be confused with a DC overload situation at the inputs,
when the IOD and VOD bits will re-assert themselves even after being cleared, multiple
times.
LSD
Low Supply Detect. Set when the voltage at the PFMON pin falls below the low-voltage threshold (PMLO), with respect to AGND pin. The LSD bit cannot be reset until the voltage at PFMON
pin rises back above the high-voltage threshold (PMHI).
FUP
Epsilon Updated. Indicates completion of a line frequency measurement and update of Epsilon.
IC
Invalid Command. Normally logic 1. Set to logic 0 if an invalid command is received or the Status Register has not been successfully read.
6.1.12 Current and Voltage AC Offset Register ( VACoff , IACoff )
Address: 16 (Current AC Offset); 17 (Voltage AC Offset)
MSB
LSB
-(20)
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-17
.....
2-18
2-19
2-20
2-21
2-22
2-23
Default = 0x000000
The AC Offset Registers (VACoff, IACoff) are initialized to zero on reset, allowing for uncalibrated normal operation.
AC Offset Calibration updates these registers. This sequence lasts approximately (6N + 30) ADC cycles (where
N is the value of the Cycle Count Register). DRDY will be asserted at the end of the calibration. These values
may be read and stored for future system AC offset compensation. The value is represented in two's complement notation in the range of -1.0 ≤ VACoff, IACoff < 1.0, with the binary point to the right of the MSB
6.1.13 Operational Mode Register ( Mode )
Address: 18
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
E2MODE
8
XVDEL
7
6
5
4
3
2
1
0
XIDEL
IHPF
VHPF
IIR
E3MODE1
E3MODE0
POS
AFC
Default = 0x000000
30
E2MODE
E2 Output Mode
0 = Energy Sign (default)
1 = Apparent Power
XVDEL
Enables an extra sample of voltage channel delay. XVDEL and XIDEL can not be enabled at
the same time.
XIDEL
Enables an extra sample of current channel delay. XVDEL and XIDEL can not be enabled at
the same time.
DS678F2
CS5463
IHPF (VHPF)
Enables the high-pass filter on the current (voltage) channel.
0 = High-pass filter disabled (default)
1 = High-pass filter enabled
Note: When either IHPF or VHPF are enabled, but not both, an all-pass filter is applied to the
opposite channel for phase matching.
IIR
Enables the IIR compensation filters.
0 = IIR compensation filters enabled (default)
1 = IIR compensation filters disabled
E3MODE[1:0]
E3 Output Mode
00 = Reactive Power (default)
01 = PFMON
10 = Voltage sign
11 = Apparent Power
POS
Positive Energy Only. Negative energy pulses on E1 are suppressed. However, it will NOT suppress negative P Register results.
AFC
Enables automatic line-frequency measurement and sets the frequency of the local sine/cosine
generator used in fundamental/harmonic measurements. When AFC is enabled, the Epsilon
register will be updated periodically.
6.1.14 Temperature Register ( T )
Address: 19
MSB
LSB
-(27)
26
25
24
23
22
21
20
.....
2-10
2-11
2-12
2-13
2-14
2-15
2-16
T contains measurements from the on-chip temperature sensor. Measurements are performed during continuous conversions, with the default the Celsius scale (oC). The value is represented in two's complement notation
and in the range of -128.0 ≤ T < 128.0, with the binary point to the right of the eighth MSB.
6.1.15 Average and Instantaneous Reactive Power Register ( QAVG , Q )
Address: 20 (Average Reactive Power) and 21 (Instantaneous Reactive Power)
MSB
-(20)
LSB
2-1
2-2
2-3
2-4
2-5
2-6
2-7
.....
2-17
2-18
2-19
2-20
2-21
2-22
2-23
The Instantaneous Reactive Power (Q) is the product of the voltage, shifted 90 degrees, and the current. The
Average Reactive Power (QAVG) is Q averaged over N samples. The results are signed values with. The value
is represented in two's complement notation and in the range of -1.0 < Q, QAVG< 1.0, with the binary point to the
right of the MSB.
6.1.16 Peak Current and Peak Voltage Register ( Ipeak , Vpeak )
Address: 22 (Peak Currect) and 23 (Peak Voltage)
MSB
-(20)
LSB
2-1
2-2
2-3
2-4
2-5
2-6
2-7
.....
2-17
2-18
2-19
2-20
2-21
2-22
2-23
The Peak Current (Ipeak) and Peak Voltage (Vpeak) registers contain the instantaneous current and voltage with
the greatest magnitude detected during the last computation cycle. The value is represented in two's complement notation and in the range of -1.0 ≤ Ipeak, Vpeak < 1.0, with the binary point to the right of the MSB.
DS678F2
31
CS5463
6.1.17 Reactive Power Register ( QTrig )
Address: 24
MSB
0
LSB
2
-1
2
-2
-3
2
-4
2
-5
2
-6
2
-7
2
.....
2-17
2
-18
2
-19
2
-20
2
-21
2
-22
2-23
The Reactive Power (QTrig) is calculated using trigonometric identities. (See Section 4.3 Power Measurements
on page 14). The value is represented in unsigned notation and in the range of 0 ≤ S < 1.0, with the binary point
to the right of the MSB.
6.1.18 Power Factor Register ( PF )
Address: 25
MSB
-(20)
LSB
2-1
2-2
2-3
2-4
2-5
2-6
2-7
.....
2-17
2-18
2-19
2-20
2-21
2-22
2-23
Power Factor is calculated by dividing the Active (Real) Power by Apparent Power. The value is represented in
two's complement notation and in the range of -1.0 ≤ PF < 1.0, with the binary point to the right of the MSB.
6.1.19 Apparent Power Register ( S )
Address: 27
MSB
0
LSB
2-1
2-2
2-3
2-4
2-5
2-6
2-7
.....
2-17
2-18
2-19
2-20
2-21
2-22
2-23
Apparent power (S) is the product of the VRMS and IRMS, The value is represented in unsigned notation and in
the range of 0 ≤ S < 1.0, with the binary point to the right of the MSB.
32
DS678F2
CS5463
6.1.20 Control Register ( Ctrl )
Register Address: 28
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
STOP
7
6
5
4
INTOD
3
2
NOCPU
1
NOOSC
0
Default = 0x000000
STOP
Terminates the auto-boot sequence.
0 = Normal (default)
1 = Stop sequence
INTOD
Converts INT output pin to an open drain output.
0 = Normal (default)
1 = Open drain
NOCPU
Saves power by disabling the CPUCLK pin.
0 = Normal (default)
1 = Disables CPUCLK
NOOSC
Saves power by disabling the crystal oscillator.
0 = Normal (default)
1 = Disabling oscillator circuit
6.1.21 Harmonic Active Power Register ( PH )
Address: 29
MSB
-(20)
LSB
2-1
2-2
2-3
2-4
2-5
2-6
2-7
.....
2-17
2-18
2-19
2-20
2-21
2-22
2-23
The Harmonic Active Power (PH) is calculated by subtracting the Fundamental Active Power from the Active
(Real) Power. The value is represented in two's complement notation and in the range of -1.0 ≤ PH < 1.0, with
the binary point to the right of the MSB.
6.1.22 Fundamental Active Power Register ( PF )
Address: 30
MSB
0
-(2 )
LSB
2
-1
2
-2
-3
2
-4
2
-5
2
-6
2
-7
2
.....
2-17
2
-18
2
-19
2
-20
2
-21
2
-22
2-23
The Fundamental Active Power (PF) is calculated by performing a discrete Fourier transform (DFT) at the relevant frequency on the V and I channels. The results are multiplied to yield fundamental power. The value is represented in two's complement notation and in the range of -1.0 ≤ PH < 1.0, with the binary point to the right of
the MSB.
DS678F2
33
CS5463
6.1.23 Fundamental Reactive Power Register ( QH )
Address: 31 (read only)
MSB
0
-(2 )
LSB
2
-1
2
-2
-3
2
-4
2
-5
2
-6
2
-7
2
.....
2-17
2
-18
2
-19
2
-20
2
-21
2
-22
2-23
Fundamental Reactive Power (QH) is calculated by performing a discrete Fourier transform (DFT) at the relevant
frequency on the V and I channels. The value is represented in two's complement notation and in the range of
-1.0 ≤ QH < 1.0, with the binary point to the right of the MSB.
6.1.24 Page Register
Address: 31 (write only)
MSB
26
LSB
25
24
23
22
21
20
Default = 0x00
Determines which register page the serial port will access.
34
DS678F2
CS5463
6.2 Page 1 Registers
6.2.1 Energy Pulse Output Width ( PulseWidth )
Address: 0
MSB
LSB
222
0
221
220
219
218
217
216
.....
26
25
24
23
22
21
20
Default = 1
PulseWidth sets the duration of energy pulses (tPW). The actual pulse duration is the contents of PulseWidth
divided by the output word rate (OWR). PulseWidth is an integer in the range of 1 to 8388607.
6.2.2 No Load Threshold ( LoadMin )
Address: 1
MSB
-(20)
LSB
2-1
2-2
2-3
2-4
2-5
2-6
2-7
.....
2-17
2-18
2-19
2-20
2-21
2-22
2-23
Default = 0
LoadMin is used to set the no load threshold. When the magnitude of the PActive register is less than LoadMin,
the active energy pulse output will be disabled. LoadMin is a two's complement value in the range of
-1.0 ≤ LoadMin < 1.0, with the binary point to the right of the MSB. Negative values are not used.
6.2.3 Temperature Gain Register ( TGain )
Address: 2
MSB
LSB
26
25
24
23
22
21
20
2-1
.....
2-11
2-12
2-13
2-14
2-15
2-16
2-17
Default = 0x2F03C3 = 23.5073471
Sets the temperature channel gain. Temperature gain (TGain) is utilized to convert from one temperature scale
to another. The Celsius scale (oC) is the default. Values will be within in the range of 0 ≤ TGain < 128. The value
is represented in unsigned notation, with the binary point to the right of bit 7th MSB. See Section 5.8 On-chip
Temperature Sensor on page 19.
6.2.4 Temperature Offset Register ( TOff )
Address: 3
MSB
-(20
)
LSB
2
-1
2
-2
-3
2
-4
2
-5
2
-6
2
-7
2
.....
2-17
2
-18
2
-19
2
-20
2
-21
2
-22
2-23
Default = 0xF3D35A = -0.0951126
Temperature offset (Toff) is used to remove the temperature channel’s offset at the zero-degree reading. Values
are represented in two's complement notation and in the range of -1.0 ≤ Toff < 1.0, with the binary point to the
right of the MSB.
DS678F2
35
CS5463
6.3 Page 3 Registers
6.3.1 Voltage Sag and Current Fault Duration Registers ( VSAGDuration , ISAGDuration )
Address: 6 (Voltage Sag Duration); 10 (Current Fault Duration)
MSB
0
LSB
222
221
220
219
218
217
216
.....
26
25
24
23
22
21
20
Default = 0x000000
Voltage Sag Duration (VSAGDuration) and Current Fault Duration (ISAGDuration) defines the number of instantaneous measurements utilized to determine a sag event. Setting these register to zero will disable this feature.
The value is represented in unsigned notation. See Section 5.6 Sag and Fault Detect Feature on page 19.
6.3.2 Voltage Sag and Current Fault Level Registers ( VSAGLevel , ISAGLevel )
Address: 7 (Voltage Sag Level ); 11 (Current Fault Level )
MSB
0
LSB
2-1
2-2
2-3
2-4
2-5
2-6
2-7
.....
2-17
2-18
2-19
2-20
2-21
2-22
2-23
Default = 0x000000
Voltage Sag Level (VSAGLevel) and Current Fault Level (ISAGLevel) defines the voltage level that the magnitude
of input samples, averaged over the sag duration, must fall below in order to register a sag/fault condition. These
value are represented in unsigned notation and in the range of 0 ≤ VSAGLevel < 1.0, with the binary point to the
right of the third MSB. See Section 5.6 Sag and Fault Detect Feature on page 19.
36
DS678F2
CS5463
7. SYSTEM CALIBRATION
7.1 Channel Offset and Gain Calibration
The CS5463 provides digital DC offset and gain compensation that can be applied to the instantaneous voltage and current measurements, and AC offset
compensation to the voltage and current RMS calculations.
Since the voltage and current channels have independent offset and gain registers, system offset and/or
gain can be performed on either channel without the
calibration results from one channel affecting the other.
N + 30 conversion cycles to complete. For AC offset calibrations, the sequence takes at least 6N + 30 ADC cycles to complete, (about 6 computation cycles). As N is
increased, the accuracy of calibration results will increase.
7.1.2 Offset Calibration Sequence
For DC and AC offset calibrations, the VIN± pins of the
voltage and IIN± pins of the current channels should be
connected to their ground reference level. (see Figure
13.)
The computational flow of the calibration sequences are
illustrated in Figure 12. The flow applies to both the voltage channel and current channel.
External
Connections
+
+
AIN+
0V +-
7.1.1 Calibration Sequence
The CS5463 must be operating in its active state and
ready to accept valid commands. Refer to Section 5.16
Commands on page 23. The calibration algorithms are
dependent on the value N in the Cycle Count Register
(see Figure 12). Upon completion, the results of the calibration are available in their corresponding register.
The DRDY bit in the Status Register will be set. If the
DRDY bit is to be output on the INT pin, then DRDY bit
in the Mask Register must be set. The initial values in
the AC gain and offset registers do affect the results of
the calibration results.
7.1.1.1 Duration of Calibration Sequence
The value of the Cycle Count Register (N) determines
the number of conversions performed by the CS5463
during a given calibration sequence. For DC offset and
gain calibrations, the calibration sequence takes at least
XGAIN
-
CM +-
AIN-
Figure 13. System Calibration of Offset
The AC offset registers must be set to the default
(0x000000).
7.1.2.1 DC Offset Calibration Sequence
Channel gain should be set to 1.0 when performing DC
offset calibration. Initiate a DC offset calibration. The DC
offset registers are updated with the negative of the average of the instantaneous samples collected over a
computational cycle. Upon completion of the DC offset
calibration the DC offset is stored in the corresponding
DC offset register. The DC offset value will be added to
to V*, I* Registers
In
Modulator
Filter
+
X
X
+
DC Offset*
Gain*
Inverse
-1
Σ
N
+
÷N
+
√
+
+
Σ
VRMS*, IRMS*
Registers
N
AC Offset*
÷N
-1
X
X
0.6
RMS
* Denotes readable/writable register
Figure 12. Calibration Data Flow
DS678F2
37
CS5463
each instantaneous measurement to nullify the DC
component present in the system during conversion
commands.
A typical rms calibration value which allows for reasonable over-range margin would be 0.6 or 60% of the voltage and current channel’s maximum input voltage level.
7.1.2.2 AC Offset Calibration Sequence
Two examples of AC gain calibration and the updated
digital output codes of the channel’s instantaneous data
registers are shown in Figures 15 and 16. Figure 16
Corresponding offset registers IACoff and/or VACoff
should be cleared prior to initiating AC offset calibrations. Initiate an AC offset calibration.The AC offset registers are updated with an offset value that reflects the
RMS output level. Upon completion of the AC offset calibration the AC offset is stored in the corresponding AC
offset register. The AC offset register value is subtracted from each successive VRMS and IRMS calculation.
Before AC Gain Calibration (Vgn Register = 1)
Sinewave
250 mV
0.9999...
230 mV
0.92
-250 mV
VRMS Register = 230/√2 x 1/250 ≈ 0.65054
When performing gain calibrations, a reference signal
should be applied to the VIN± pins of the voltage and
IIN± pins of the current channels that represents the desired maximum signal level. Figure 14 shows the basic
setup for gain calibration.
+
-
Sinewave
+
+
250 mV
0.92231
230 mV
0.84853
IN-
Instantaneous Voltage
Register Values
-230 mV
-0.84853
-250 mV
-0.92231
VRMS Register = 0.600000
XG AIN
CM
After AC Gain Calibration (Vgn Register changed to approx. 0.9223)
INPUT
0V
SIGNAL
External
Connections
IN+
-0.92
-1.0000...
-230 mV
7.1.3 Gain Calibration Sequence
R eference
+
Signal
-
Instantaneous Voltage
Register Values
INPUT
0V
SIGNAL
-
Figure 15. Example of AC Gain Calibration
Before AC Gain Calibration (Vgain Register = 1)
Figure 14. System Calibration of Gain.
For gain calibrations, there is an absolute limit on the
RMS voltage levels that are selected for the gain calibration input signals. The maximum value that the gain
registers can attain is 4. Therefore, if the signal level of
the applied input is low enough that it causes the
CS5463 to attempt to set either gain register higher than
4, the gain calibration result will be invalid and all
CS5463 results obtained while performing measurements will be invalid.
If the channel gain registers are initially set to a gain other then 1.0, AC gain calibration should be used.
7.1.3.1 AC Gain Calibration Sequence
The corresponding gain register should be set to 1.0,
unless a different initial gain value is desired. Initiate an
AC gain calibration. The AC gain calibration algorithm
computes the RMS value of the reference signal applied
to the channel inputs. The RMS register value is then divided into 0.6 and the quotient is stored in the corresponding
gain
register.
Each
instantaneous
measurement will be multiplied by its corresponding AC
gain value.
38
250 mV
0.9999...
230 mV
0.92
DC Signal
Instantaneous Voltage
Register Values
INPUT 0 V
SIGNAL
-1.0000...
-250 mV
230
VRMS Register = 250
= 0.92
After AC Gain Calibration (Vgain Register changed to approx. 0.65217)
250 mV
0.65217
230 mV
0.6000
DC Signal
INPUT
0V
SIGNAL
Instantaneous Voltage
Register Values
-0.65217
-250 mV
VRMS Register = 0.600000
Figure 16. Example of AC Gain Calibration
shows that a positive (or negative) DC-level signal can
be used even though an AC gain calibration is being executed.
DS678F2
CS5463
However, an AC signal cannot be used for DC gain calibration.
culated in step 2 by the gain calculated in step 3 and
updating the AC offset register with the product.
7.1.3.2 DC Gain Calibration Sequence
7.2 Phase Compensation
Initiate a DC gain calibration. The corresponding gain
register is restored to default (1.0). The DC gain calibration averages the channel’s instantaneous measurements over one computation cycle (N samples). The
average is then divided into 1.0 and the quotient is
stored in the corresponding gain register
The CS5463 is equipped with phase compensation to
cancel out phase shifts introduced by the measurement
element. Phase Compensation is set by bits PC[6:0] in
the Configuration Register and bits XVDEL and XIDEL
in the Operational Mode Register
After the DC gain calibration, the instantaneous register
will read at full-scale whenever the DC level of the input
signal is equal to the level of the DC calibration signal
applied to the inputs during the DC gain calibration.The
HPF option should not be enabled if DC gain calibration
is utilized.
7.1.4 Order of Calibration Sequences
1. If the HPF option is enabled, then any DC component
that may be present in the selected signal path will be
removed and a DC offset calibration is not required.
However, if the HPF option is disabled the DC offset
calibration sequence should be performed.
When using high-pass filters, it is recommended that
the DC Offset register for the corresponding channel
be set to zero. When performing DC offset calibration, the corresponding gain channel should be set to
one.
2. If there is an AC offset in the VRMS or IRMS calculation, then the AC offset calibration sequence should
be performed.
The default value of PC[6:0], XVDEL, and XIDEL is zero. With MCLK = 4.096 MHz and K = 1, the phase compensation has a range of ±8.1 degrees when the input
signals are 60 Hz. Under these conditions, each step of
the phase compensation register (value of one LSB) is
approximately 0.04 degrees. For values of MCLK other
than 4.096 MHz, the range and step size should be
scaled by 4.096 MHz/(MCLK/K). For power line frequencies other than 60Hz, the values of the range and
step size of the PC[6:0] bits can be determined by converting the above values from angular measurement
into the time domain (seconds), and then computing the
new range and step size (in degrees) with respect to the
new line frequency. To calculate the phase shift induced
between the voltage and the current channel use the
equation:
Phase
o
Freq × 360 × ( PC [ 5:0 ] – ( PC [ 6 ] × 64 ) + ( XDEL × 128 ) )
= --------------------------------------------------------------------------------------------------------------------------------( MCLK ⁄ K ) ⁄ 8
Freq = Line Frequency [Hz]
XDEL = XVDEL or -XIDEL
3. Perform the gain calibration sequence.
7.3 Active Power Offset
4. Finally, if an AC offset calibration was performed
(step 2), then the AC offset may need to be adjusted
to compensate for the change in gain (step 3). This
can be accomplished by restoring zero to the AC offset register and then perform an AC offset calibration
sequence. The adjustment could also be done by
multiplying the AC offset register value that was cal-
The Power Offset Register can be used to offset system
power sources that may be resident in the system, but
do not originate from the power line signal. These sources of extra energy in the system contribute undesirable
and false offsets to the power and energy measurement
results. After determining the amount of stray power, the
Power Offset Register can be set to cancel the effects
of this unwanted energy.
DS678F2
39
CS5463
8. AUTO-BOOT MODE USING E2PROM
When the CS5463 MODE pin is asserted (logic 1), the
CS5463 auto-boot mode is enabled. In auto-boot mode,
the CS5463 downloads the required commands and
register data from an external serial E2PROM, allowing
the CS5463 to begin performing energy measurements.
8.1 Auto-boot Configuration
A typical auto-boot serial connection between the
CS5463 and a E2PROM is illustrated in Figure 17. In auto-boot mode, the CS5463’s CS and SCLK are configured as outputs. The CS5463 asserts CS (logic 0),
provides a clock on SCLK, and sends a read command
to the E2PROM on SDO. The CS5463 reads the user-specified commands and register data presented on
the SDI pin. The E2PROM’s programmed data is utilized
by the CS5463 to change the designated registers’ default values and begin registering energy.
VD+
EOUT1
EOUT2
5K
8.2 Auto-boot Data for E2PROM
Below is an example code set for an auto-boot sequence. This code is written into the E2PROM by the user. The serial data for such a sequence is shown below
in single-byte hexidecimal notation:
-64 00 00 60
Write Operation Mode Register, turn high-pass
filters on.
-44 7F C4 A9
Write value of 0x7FC4A9 to Current Gain
Register.
-48 FF B2 53
Write value of 0xFFB253 to Voltage Gain
Register.
-74 00 00 04
Unmask bit #2 (LSD) in the Mask Register.
-E8
Start continuous conversions
-78 00 01 00
Write STOP bit to Control Register, to terminate
auto-boot initialization sequence.
Mech. Counter
or
Stepper Motor
EEPROM
CS5463
SCK
SCLK
MODE
commands/data will determine the CS5463’s exact operation, when the auto-boot initialization sequence is
running. Any of the valid commands can be used.
SDI
SO
SDO
SI
5K
CS
CS
8.3 Which E2PROMs Can Be Used?
Connector to Calibrator
Figure 17. Typical Interface of E2PROM to CS5463
Figure 17 also shows the external connections that
would be made to a calibrator device, such as a PC or
custom calibration board. When the metering system is
installed, the calibrator would be used to control calibration and/or to program user-specified commands and
calibration values into the E2PROM. The user-specified
40
Several industry-standard serial E2PROMs that will successfully run auto-boot with the CS5461A are listed below:
•
•
•
Atmel AT25010, AT25020 or AT25040
National Semiconductor NM25C040M8 or NM25020M8
Xicor X25040SI
These types of serial E2PROMs expect a specific 8-bit
command (00000011) in order to perform a memory
read. The CS5461A has been hardware programmed to
transmit this 8-bit command to the E2PROM at the beginning of the auto-boot sequence.
DS678F2
CS5463
9. BASIC APPLICATION CIRCUITS
Figure 18 shows the CS5463 configured to measure
power in a single-phase, 2-wire system while operating
in a single-supply configuration. In this diagram, a shunt
resistor is used to sense the line current and a voltage
divider is used to sense the line voltage. In this type of
shunt-resistor configuration, the common-mode level of
the CS5466 must be referenced to the line side of the
power line. This means that the common-mode potential of the CS5463 will track the high-voltage levels, as
well as low-voltage levels, with respect to earth ground.
Isolation circuitry is required when an earth-ground-referenced communication interface is connected.
Figure 19 shows the same single-phase, two-wire system with complete isolation from the power lines. This
isolation is achieved using three transformers: a general
purpose transformer to supply the on-board DC power;
a high-precision, low-impedance voltage transformer,
with very little roll-off/phase-delay, to measure voltage;
and a current transformer to sense the line current.
Figure 20 shows a single-phase, 3-wire system. In
many 3-wire residential power systems within the United States, only the two line terminals are available (neutral is not available). Figure 21 shows the CS5463
configured to meter a three-wire system with no neutral
available.
10 kΩ
5 kΩ
120 VAC
N
L
500 Ω
10 Ω
500
470 µF
470 nF
0.1 µF
0.1 µF
14
VA+
3
VD+
CS5463
9
CVCVdiff
R1
R V-
10
VIN-
XIN
RESET
C Idiff
CS
SDI
C I+
16
IIN+
SDO
SCLK
INT
12
VREFIN
11
VREFOUT
E2
AGND
13
Indicates common (floating) return.
19
7
23
6
5
Serial
Data
Interface
20
22
21
E1
0.1 µF
Note:
Optional
Clock
Source
24
IIN-
C I-
R Shunt
R I+
4.096 MHz
CV+
15
R I-
17
PFMON
2
CPUCLK
1
XOUT
ISOLATION
R2
VIN+
DGND
4
Mech. Counter
or
Stepper Motor
Figure 18. Typical Connection Diagram (Single-phase, 2-wire – Direct Connect to Power Line)
DS678F2
41
CS5463
10 kΩ
5 kΩ
120 VAC
N
L
Voltage
Transformer
200 Ω
10 Ω
200 Ω
0.1 µF
0.1µF
12 VAC
14
VA+
200µF
12 VAC
3
VD+
CS5463
M:1
9
1kΩ
R V+
C Vdiff
R V-
1kΩ
PFMON
CPUCLK
XOUT
VIN+
10
Low Phase-Shift
Potential Transformer
VIN-
XIN
R I-
N:1
15
1kΩ
RESET
1kΩ
16
RI+
12
11
2
1
4.096 MHz
Optional
Clock
Source
24
19
7
CS
23
SDI
6
SDO
5
SCLK
20
INT
C Idiff
RBurden
Current
Transformer
IIN-
17
IIN+
VREFIN
VREFOUT
E2
E1
0.1 µF
Serial
Data
Interface
22
21
DGND
4
AGND
13
Mech. Counter
or
Stepper Motor
Figure 19. Typical Connection Diagram (Single-phase, 2-wire – Isolated from Power Line)
240 VAC
5 kΩ
120 VAC
L1
L2
500 Ω
500 Ω
10 Ω
470 µF
470 nF
0.1 µF
Earth
Ground
R3
0.1 µF
3
VD+
14
VA+
CS5463
9
R2
10 kΩ
120 VAC
N
17
PFMON
2
CPUCLK
1
XOUT
VIN+
CIdiff
R4
R1
10
VIN16 IIN+
1kΩ
XIN
4.095 MHz
Optional
Clock
Source
24
R I+
RESET
RBurden
C Idiff
1kΩ
15
R I-
IIN-
12
VREFIN
11
VREFOUT
19
7
CS
23
SDI
6
SDO
5
SCLK
20
INT
E2
E1
Serial
Data
Interface
22
21
0.1 µF
AGND
13
DGND
4
Mech. Counter
or
Stepper Motor
Figure 20. Typical Connection Diagram (Single-phase, 3-wire)
42
DS678F2
CS5463
5 kΩ
10 kΩ
240 VAC
L1
L2
500 Ω
1 kΩ
10 Ω
470 µF
235 nF
0.1 µF
0.1 µF
3
VD+
14
VA+
CS5463
9
CV+
R2
CI+
R V-
CVdiff
10
16
1kΩ
17
PFMON
2
CPUCLK
1
XOUT
VINIIN+
XIN
4.096 MHz
Optional
Clock
Source
24
R I+
RBurden
CIdiff
1kΩ
15
R I-
IIN-
12
VREFIN
11
VREFOUT
RESET
19
CS
SDI
SDO
SCLK
7
23
6
5
INT
E2
E1
0.1 µF
AGND
13
Note:
Indicates common (floating) return.
ISOLATION
R1
VIN+
Serial
Data
Interface
20
22
21
DGND
4
Mech. Counter
or
Stepper Motor
Figure 21. Typical Connection Diagram (Single-phase, 3-wire – No Neutral Available)
DS678F2
43
CS5463
10.PACKAGE DIMENSIONS
24L SSOP PACKAGE DRAWING
N
D
E11
A2
E
e
b2
SIDE VIEW
A
∝
A1
L
END VIEW
SEATING
PLANE
1 2 3
TOP VIEW
DIM
A
A1
A2
b
D
E
E1
e
L
∝
MIN
-0.002
0.064
0.009
0.311
0.291
0.197
0.022
0.025
0°
INCHES
NOM
-0.006
0.068
-0.323
0.307
0.209
0.026
0.03
4°
MAX
0.084
0.010
0.074
0.015
0.335
0.323
0.220
0.030
0.041
8°
MIN
-0.05
1.62
0.22
7.90
7.40
5.00
0.55
0.63
0°
MILLIMETERS
NOM
-0.13
1.73
-8.20
7.80
5.30
0.65
0.75
4°
NOTE
MAX
2.13
0.25
1.88
0.38
8.50
8.20
5.60
0.75
1.03
8°
2,3
1
1
JEDEC #: MO-150
Controlling Dimension is Millimeters.
Notes: 3. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold
mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per
side.
4. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not
reduce dimension “b” by more than 0.07 mm at least material condition.
5. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
44
DS678F2
CS5463
11. ORDERING INFORMATION
Model
CS5463-IS
CS5463-ISZ (lead free)
Temperature
Package
-40 to +85 °C
24-pin SSOP
12. ENVIRONMENTAL, MANUFACTURING, & HANDLING INFORMATION
Model Number
Peak Reflow Temp
MSL Rating*
Max Floor Life
CS5463-IS
240 °C
2
365 Days
CS5463-ISZ (lead free)
260 °C
3
7 Days
* MSL (Moisture Sensitivity Level) as specified by IPC/JEDEC J-STD-020.
DS678F2
45
CS5463
13. REVISION HISTORY
Revision
Date
Changes
A1
MAR 2005
Advance Release
PP1
AUG 2005
First preliminary release.
F1
NOV 2005
First final release, updated with most-current characterization data.
F2
APR 2008
Added PulseWidth & LoadMin Registers.
Contacting Cirrus Logic Support
For all product questions and inquiries contact a Cirrus Logic Sales Representative.
To find the one nearest to you go to www.cirrus.com
IMPORTANT NOTICE
Cirrus Logic, Inc. and its subsidiaries (“Cirrus”) believe that the information contained in this document is accurate and reliable. However, the information is subject
to change without notice and is provided “AS IS” without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant
information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale
supplied at the time of order acknowledgment, including those pertaining to warranty, indemnification, and limitation of liability. No responsibility is assumed by Cirrus
for the use of this information, including use of this information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third
parties. This document is the property of Cirrus and by furnishing this information, Cirrus grants no license, express or implied under any patents, mask work rights,
copyrights, trademarks, trade secrets or other intellectual property rights. Cirrus owns the copyrights associated with the information contained herein and gives consent for copies to be made of the information only for use within your organization with respect to Cirrus integrated circuits or other products of Cirrus. This consent
does not extend to other copying such as copying for general distribution, advertising or promotional purposes, or for creating any work for resale.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE
IN PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, AUTOMOTIVE SAFETY OR SECURITY DEVICES, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER'S RISK AND CIRRUS DISCLAIMS AND MAKES NO WARRANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND
FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY CIRRUS PRODUCT THAT IS USED IN SUCH A MANNER. IF THE CUSTOMER OR CUSTOMER'S CUSTOMER USES OR PERMITS THE USE OF CIRRUS PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY
INDEMNIFY CIRRUS, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS' FEES AND COSTS, THAT MAY RESULT FROM OR ARISE IN CONNECTION WITH THESE USES.
Cirrus Logic, Cirrus, and the Cirrus Logic logo designs are trademarks of Cirrus Logic, Inc. All other brand and product names in this document may be trademarks
or service marks of their respective owners.
SPI is a trademark of Motorola, Inc.
Microwire is a trademark of National Semiconductor Corporation.
46
DS678F2