TI1 DAC1282 Low distortion digital-to-analog converter for seismic Datasheet

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DAC1282, DAC1282A
SBAS490B – DECEMBER 2011 – REVISED MAY 2015
DAC1282 Low Distortion Digital-to-Analog Converter for Seismic
1 Features
3 Description
•
•
•
The DAC1282 is a fully-integrated digital-to-analog
converter (DAC) providing low distortion, digital
synthesized voltage output suitable for testing of
seismic equipment. The DAC1282 achieves very high
performance in a small package with low power.
Together, with the high-performance ADS1281 and
ADS1282 analog-to-digital converters (ADCs), these
devices create a measurement system that meets the
exacting demands of seismic data acquisition
equipment.
1
•
•
•
•
•
•
•
•
•
•
•
•
Single-Chip Test Signal Generator
Buffered Voltage Output
High Performance:
– THD: –125 dB (G = 1/1 to 1/8)
– SNR: 120 dB (413 Hz BW, G = 1/1)
Analog and Digital Gain Control
Output Frequency: 0.488 Hz to 250 Hz
Sine, Pulse, and DC Modes
Digital Data Input Mode
Low On-Resistance Signal Switch
Sync Input
Power-Down Mode
Analog Supply: 5 V or ±2.5 V
Digital Supply: 1.8 V to 3.3 V
Power: 38 mW
Package: TSSOP-24
Operating Range: –50°C to +125°C
The DAC1282 integrates a digital signal generator, a
DAC, and an output amplifier providing sine wave, dc,
and pulse output voltages.
The output frequency is programmable from 0.5 Hz to
250 Hz and the magnitude is scaled by both analog
and digital control. The analog gain is adjustable in 6dB steps and the digital gain in 0.5-dB steps. The
analog gain settings match those of the ADS1282 for
testing at all gains with high resolution.
The DAC1282 also provides pulse outputs. The pulse
amplitude is user-programmed and then selected by
the pin for precise timing. Custom output signals can
be generated by applying an external bitstream
pattern.
2 Applications
•
•
•
Energy Exploration
Seismic Monitoring Systems
High-Accuracy Instrumentation
A signal switch can be used to connect the DAC
output to sensors for THD and impulse testing. The
switch timing is controlled by pin and by command.
A SYNC pin synchronizes the DAC output to the
analog-to-digital converter (ADC) sample interval. A
power-down input disables the device, reducing
power consumption to microwatts.
DVDD
VREF
AVDD
DAC1282
CLK
SYNC
CS
DIN
DOUT
Serial
Interface
Digital
Signal
Generator
VOUTP
Voltage
Output
DAC
VOUTN
SCLK
Switch In
RESET/ PWDN
Optional Bitstream Input
SW/TD
Switch Out
DGND
AVSS
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DAC1282, DAC1282A
SBAS490B – DECEMBER 2011 – REVISED MAY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison ...............................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1 Absolute Maximum Ratings ....................................
7.2 ESD Ratings..............................................................
7.3 Thermal Information ..................................................
7.4 Electrical Characteristics...........................................
7.5 Timing Requirements: Serial Peripheral Interface
(SPI) Timing ...............................................................
7.6 Typical Characteristics ..............................................
4
4
4
5
8
9
Detailed Description ............................................ 14
8.1
8.2
8.3
8.4
8.5
9
Overview .................................................................
Feature Description.................................................
Device Functional Modes........................................
Programming...........................................................
Register Map...........................................................
14
16
30
31
33
Application and Implementation ........................ 36
9.1 Application Information............................................ 36
9.2 Typical Applications ................................................ 37
10 Device and Documentation Support ................. 39
10.1
10.2
10.3
10.4
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
39
39
39
39
11 Mechanical, Packaging, and Orderable
Information ........................................................... 39
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (September 2012) to Revision B
•
Page
Added ADS1282A device to data sheet ................................................................................................................................. 1
Changes from Original (December 2011) to Revision A
Page
•
Updated Figure 16................................................................................................................................................................ 10
•
Added last paragraph to Signal Output section.................................................................................................................... 16
•
Changed tCSHD minimum specification in Table 11............................................................................................................... 25
•
Changed min, max, and unit columns in Table 12 ............................................................................................................... 26
2
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SBAS490B – DECEMBER 2011 – REVISED MAY 2015
5 Device Comparison
DEVICE
DESCRIPTION
ADS1281
High-resolution ADC
ADS1282
High-resolution ADC with PGA
REF5050
Low-drift 5 V reference
6 Pin Configuration and Functions
PW Package
24-Pin TSSOP
Top VIew
CS
1
24
AVDD
SCLK
2
23
AVSS
DIN
3
22
CAPP
DOUT
4
21
VOUTP
DVDD
5
20
SWINP
DGND
6
19
SWOUTP
CLK
7
18
SWOUTN
SW/TD
8
17
SWINN
SYNC
9
16
VOUTN
RESET/PWDN
10
15
CAPN
DGND
11
14
AVSS
VREF
12
13
AVDD
Pin Functions
PIN
FUNCTION
DESCRIPTION
NAME
NO.
AVDD
13, 24
Analog supply
Analog positive power supply
AVSS
14
Analog supply
Analog negative power supply, reference ground
AVSS
23
Analog supply
Analog negative power supply
CAPN
15
Analog
External capacitor connected to VOUTN
CAPP
22
Analog
External capacitor connected to VOUTP
CS
1
Digital input
Serial port chip select
CLK
7
Digital input
Master clock 4.096 MHz
DGND
6
Ground
Key digital ground
DGND
11
Ground
Digital ground
DIN
3
Digital input
Serial port data input
DOUT
4
Digital output
Serial port data output
DVDD
5
Digital supply
Digital power supply: 1.65 V to 3.6 V
RESET/PWDN
10
Digital input
Reset/power-down input
SCLK
2
Digital input
Serial port shift clock
SW/TD
8
Digital input
Switch control input or bitstream input
SWINN
17
Analog I/O
Switch negative input
SWINP
20
Analog I/O
Switch positive input
SWOUTN
18
Analog I/O
Switch negative output
SWOUTP
19
Analog I/O
Switch positive output
SYNC
9
Digital input
Synchronize input
VOUTN
16
Analog output
Negative voltage output
VOUTP
21
Analog output
Positive voltage output
VREF
12
Analog input
Reference voltage input
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7 Specifications
Absolute Maximum Ratings (1)
7.1
Over operating free-air temperature range, unless otherwise noted.
MIN
MAX
UNIT
AVDD to AVSS
–0.3
+5.5
V
AVSS to DGND
–2.8
+0.3
V
DVDD to DGND
–0.3
+3.6
V
Input current continuous
–10
+10
mA
Analog input/output voltage
AVSS – 0.3
AVDD + 0.3
V
Switch current
–60
+60
mA
Digital input voltage to DGND
–0.3
DVDD + 0.3
V
Operating temperature range
–50
+125
°C
Storage temperature, Tstg
–60
+150
°C
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
7.2 ESD Ratings
VALUE
Electrostatic
discharge
V(ESD)
(1)
(2)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Thermal Information
THERMAL METRIC (1)
PW (TSSOP)
24 PINS
RθJA
Junction-to-ambient thermal resistance
78.3
RθJC(top)
Junction-to-case (top) thermal resistance
12.1
RθJB
Junction-to-board thermal resistance
33.8
ψJT
Junction-to-top characterization parameter
0.3
ψJB
Junction-to-board characterization parameter
33.5
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
(1)
4
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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SBAS490B – DECEMBER 2011 – REVISED MAY 2015
7.4 Electrical Characteristics
Minimum and maximum specifications are at TA = –40°C to +85°C. Typical specifications are at TA = +25°C, AVDD = +2.5 V,
AVSS = –2.5 V, fCLK = 4.096 MHz, VREF = 5 V, and DVDD = 3.3 V (unless otherwise noted). Refer to Figure 50. DAC1282A
supports gains = 1/1, 1/4, and 1/16 only.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ANALOG OUTPUT (VOUTP, VOUTN)
Full-scale output voltage (1)
Gain = 1/1 to 1/64
±VREF /2 × gain
Output common-mode voltage (2)
Differential output impedance
CLOAD
Capacitive load
RLOAD
Resistive load
V
–0.1
V
1.6
Ω
2
nF
Ω
100
Output current limit (3)
±60
High-Z output leakage
TA = +25°C
2
TA = +85°C
50
mA
nA
DC PERFORMANCE (Excluding Pulse Mode)
Gain error
Gain = 1/1
Gain match
Relative to gain = 1/1
Gain drift
±0.1%
±0.75%
±0.05%
±0.5%
2
Offset
Gain = 1/1 to 1/64
±(7/gain) + 50
Offset drift
ppm/°C
±(75/gain) +
300
ppm
FSR (4)
ppm
FSR/°C
1.5
AC PERFORMANCE
DAC1282
THD
Total harmonic distortion (5)
DAC1282A
Gain = 1/1
–125
Gain = 1/2, 1/4, 1/8
–125
dB
Gain = 1/16
–123
dB
Gain = 1/32
–115
dB
Gain = 1/64
–111
Gain = 1/1
–118
Gain = 1/4, 1/16
–118
dB
120
dB
Gain = 1/2
119
dB
Gain = 1/4
117
dB
Gain = 1/8
114
dB
Gain = 1/16
110
dB
Gain = 1/32
106
dB
Gain = 1/64
100
Gain = 1/1
SNR
Signal-to-noise ratio (6)
Output frequency
Digital gain
PSR
(1)
(2)
(3)
(4)
(5)
(6)
Power-supply rejection
0.5-dB steps
AVDD, AVSS
DVDD
60-Hz ac, gain = 1/8
116
–118
dB
dB
–106
dB
dB
0.4883
250
Hz
Full mute
0
dB
85
dB
120
dB
Full-scale differential output voltage: VOUT = (VOUTP – VOUTN) = ±VREF/2 × Gain. Gain is the DAC analog gain.
Output common-mode voltage scales with analog supply voltage: VCOM = 0.48 × (AVDD – AVSS) + AVSS.
Sink or source current limit of VOUTP and VOUTN.
FSR – full-scale range = VREF × gain.
THD = total harmonic distortion. THD is measured by the ADS1282, and is the sum of first nine harmonics using complementing gain.
fOUT = 31.25 Hz, VOUT – 0.5 dBFS, no load.
SNR = signal-to-noise ratio. SNR is measured by the ADS1282 over a 413-Hz bandwidth using complementing gain. fOUT = 31.25 Hz
and VOUT – 0.5 dBFS.
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Electrical Characteristics (continued)
Minimum and maximum specifications are at TA = –40°C to +85°C. Typical specifications are at TA = +25°C, AVDD = +2.5 V,
AVSS = –2.5 V, fCLK = 4.096 MHz, VREF = 5 V, and DVDD = 3.3 V (unless otherwise noted). Refer to Figure 50. DAC1282A
supports gains = 1/1, 1/4, and 1/16 only.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PULSE MODE
Output levels
31 steps, approximate 3 dB per step
±0.0195
Gain error
Gain drift
±0.5
Offset drift
Output noise (7)
Slew rate
0.1% final value
V
±0.75%
3
Offset
Settling time
±2.5
±0.1%
ppm/°C
±3
mV
3
µV/°C
1.5
µVRMS
5
V/µs
25
µs
24
Bits
DC MODE
Resolution
Step response
DC noise (8)
100
µs
Gain = 1/1
1.3
µVRMS
Gain = 1/2
1.4
µVRMS
Gain = 1/4
1.8
µVRMS
Gain = 1/8
2.7
µVRMS
Gain = 1/16
4.7
µVRMS
Gain = 1/32
8.5
µVRMS
Gain = 1/64
16
µVRMS
DIGITAL DATA MODE
Data clock rate
fCLK/16
Ones-density full-scale modulation
+FS and –FS, respectively
Signal bandwidth
–3 dB
25%
Hz
75%
8.2
kHz
REFERENCE VOLTAGE INPUT (VREF)
Reference voltage, VREF = VREF – AVSS
Reference input impedance
2.4
Operating
Power-down
5
AVDD + 0.25
V
220
kΩ
10
MΩ
SIGNAL SWITCH
Signal range
AVSS
AVDD
Continuous
Differential on-resistance
VSWIN , VSWOUT = 0 V
2.8
Ω
Differential on-resistance flatness
VSWIN, VSWOUT = AVDD to AVSS
0.7
Ω
On-resistance match between outputs
VSWIN , VSWOUT = 0 V
0.04
Ω
TA = +25°C
±0.1
TA = +85°C
±5
Off-leakage current (9)
±50
V
Current
Off-isolation (10)
mA
nA
120
dB
DIGITAL INPUT/OUTPUT (DVDD = 1.65 V to 3.6 V)
VOH
IOH = 1 mA
VOL
IOL = 1 mA
0.8 × DVDD
V
0.2 × DVDD
V
VIH
0.8 × DVDD
DVDD
V
VIL
DGND
0.2 × DVDD
V
±10
µA
Input hysteresis
0.5
Input leakage
fCLK
CLK Input
1
4.096
V
4.225
MHz
(7)
(8)
VOUT = 0 V. Pulse mode output noise is measured by the ADS1282, over a 413-Hz bandwidth using ADC gain = 1.
VOUT = 0 V. DC noise is measured by the ADS1282, over a 413-Hz bandwidth using complementing gain. DC noise is referred to a
1.77-V full-scale ADC output. Divide output-referred noise by the ADC gain to yield input-referred noise.
(9) Switch input or output voltage = AVDD – 0.5 V to AVSS + 0.5 V.
(10) f = 31.25 Hz, 1.77 VRMS. Switch output loaded 2 x 10 kΩ to mid-supply range.
6
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Electrical Characteristics (continued)
Minimum and maximum specifications are at TA = –40°C to +85°C. Typical specifications are at TA = +25°C, AVDD = +2.5 V,
AVSS = –2.5 V, fCLK = 4.096 MHz, VREF = 5 V, and DVDD = 3.3 V (unless otherwise noted). Refer to Figure 50. DAC1282A
supports gains = 1/1, 1/4, and 1/16 only.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
AVSS
–2.6
0
V
AVDD
AVSS + 4.75
AVSS + 5.25
V
DVDD
1.65
3.6
V
8.5
mA (11)
Gain = 1/1, VOUT = 0 V
AVDD, AVSS current
DVDD current
Power
7.4
Pulse mode, VOUT = 0 V
7
Shutdown
1
10
µA
Operating
180
300
µA
1
10
µA
Operating
38
44
mW
Shutdown (12)
10
85
µW
Shutdown (12)
mA
TEMPERATURE RANGE
Specified temperature range
–40
+85
°C
Operating temperature range
–50
+125
°C
Storage temperature range
–65
+150
°C
(11) Analog supply current scales with gain as follows:
IAVDD and IAVSS = 0.016 × VREF × (44 × Gain + 1) + 3.8 (mA).
(12) Digital inputs stopped and maintained at VIH or VIL level.
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7.5
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Timing Requirements: Serial Peripheral Interface (SPI) Timing
At TA = –40°C to +85°C and DVDD = 1.65 V to 3.6 V, unless otherwise noted.
MIN
tCSSC
CS low to first SCLK: setup time
tSCLK
SCLK period
tSPWH
SCLK pulse width: high
(1)
MAX
UNIT
30
ns
120
ns
50
ns
50
ns
tSPWL
SCLK pulse width: low (2)
tDIST
Valid DIN to SCLK high: setup time
40
ns
tDIHD
Valid DIN to SCLK high: hold time
20
ns
18
2
tDOPD
SCLK low to valid new DOUT: propagation delay
tDOHD
SCLK low to DOUT invalid: hold time
tCSDOD
CS low to DOUT driven: propagation delay (3)
tCSDOZ
CS high to DOUT Hi-Z: propagation delay
tCSH
CS high pulse
tSCCS
Last SCLK falling edge to CS high
(1)
(2)
(3)
(3)
tCLK
40
ns
0
ns
40
ns
20
ns
50
ns
0
ns
CS can be tied low.
Holding SCLK low longer than 218 fCLK cycles resets the SPI interface.
DOUT load = 20 pF || 100 kΩ to DGND.
t SPWH
t SCLK
t CSH
CS
t SPWL
t CSSC
t SCCS
SCLK
t DIST
DIN
B7
B6
B5
B4
B3
B2
B1
t DIHD
B0
t DOPD
B7
DOUT
t DOHD
t CSDOD
t CSDOZ
Figure 1. Serial Interface Timing
8
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7.6 Typical Characteristics
At TA = +25°C, AVDD = +2.5 V, AVSS = –2.5 V, DVDD = 3.3 V, fCLK = 4.096 MHz, and VREF = 5 V, unless otherwise noted.
DAC1282A supports gains = 1/1, 1/4, and 1/16 only.
0
0
Amplitude (dB)
−40
−60
−80
−100
−120
−140
−40
−60
−80
−100
−120
−140
−160
−160
−180
−180
−200
0
50
Gain = 1/2
4k FFT
Vo = 31.25 Hz, −0.5 dBFS
THD = −125.6 dB
SNR = 119.0 dB
−20
Amplitude (dB)
Gain = 1/1
4k FFT
Vo = 31.25 Hz, −0.5 dBFS
THD = −125.8 dB
SNR = 120.1 dB
−20
−200
100 150 200 250 300 350 400 450 500
Frequency (Hz)
G000
0
Figure 2. Output Spectrum Gain = 1/1
0
Amplitude (dB)
−40
−60
−80
−100
−120
−140
−40
−60
−80
−100
−120
−140
−160
−160
−180
−180
0
50
Gain = 1/8
4k FFT
Vo = 31.25 Hz, −0.5 dBFS
THD = −125.4 dB
SNR = 114.5 dB
−20
Amplitude (dB)
Gain = 1/4
4k FFT
Vo = 31.25 Hz, −0.5 dBFS
THD = −125.9 dB
SNR = 117.8 dB
−20
−200
100 150 200 250 300 350 400 450 500
Frequency (Hz)
G000
0
Figure 4. Output Spectrum Gain = 1/4
100 150 200 250 300 350 400 450 500
Frequency (Hz)
G000
0
−40
−60
−80
−100
−120
−140
−40
−60
−80
−100
−120
−140
−160
−160
−180
−180
0
50
100 150 200 250 300 350 400 450 500
Frequency (Hz)
G000
Gain = 1/32
8k FFT
Vo = 31.25 Hz, −0.5 dBFS
THD = −116.7 dB
SNR = 105.7 dB
−20
Amplitude (dB)
Gain = 1/16
8k FFT
Vo = 31.25 Hz, −0.5 dBFS
THD = −126.1 dB
SNR = 109.8 dB
−20
Amplitude (dB)
50
Figure 5. Output Spectrum Gain = 1/8
0
−200
100 150 200 250 300 350 400 450 500
Frequency (Hz)
G000
Figure 3. Output Spectrum Gain = 1/2
0
−200
50
−200
0
Figure 6. Output Spectrum Gain = 1/16
50
100 150 200 250 300 350 400 450 500
Frequency (Hz)
G000
Figure 7. Output Spectrum Gain = 1/32
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Typical Characteristics (continued)
At TA = +25°C, AVDD = +2.5 V, AVSS = –2.5 V, DVDD = 3.3 V, fCLK = 4.096 MHz, and VREF = 5 V, unless otherwise noted.
DAC1282A supports gains = 1/1, 1/4, and 1/16 only.
2000
0
Gain = 1/64
8k FFT
Vo = 31.25 Hz, −0.5 dBFS
THD = −112.8 dB
SNR = 100.1 dB
Amplitude (dB)
−40
−60
1750
1500
Gain Error (ppm)
−20
−80
−100
−120
−140
1000
750
500
−160
Gain = 1/1
Gain = 1/2
Gain = 1/4
250
−180
−200
1250
0
50
0
−55
100 150 200 250 300 350 400 450 500
Frequency (Hz)
G000
−35
Figure 8. Output Spectrum Gain = 1/64
25
45
65
Temperature (°C)
85
125
G000
All gains relative to gain = 1/1
30 units
15
Occurrences (%)
15
10
10
0
0
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
5
−4000
−3600
−3200
−2800
−2400
−2000
−1600
−1200
−800
−400
0
400
800
1200
1600
2000
2400
2800
3200
3600
4000
5
Gain Error (ppm)
Absolute Gain Match (ppm)
G000
Figure 10. Gain Error Histogram
25
Gain = 1/1
Gain = 1/2
Gain = 1/4
Gain = 1/8
Gain = 1/16
Gain = 1/32
250
0
−250
20
15
10
5
−35
−15
5
25
45
65
Temperature (°C)
85
105
125
G000
0
−400
−360
−320
−280
−240
−200
−160
−120
−80
−40
0
40
80
120
160
200
240
280
320
360
400
−500
−750
−55
Gain = 1/1
30 units
Gain = 1/64
Pulse Mode
Occurrences (%)
500
G000
Figure 11. Gain Match Histogram
750
Offset Error (ppm)
Figure 12. Offset vs Temperature
10
105
20
Gain = 1/1
30 units
Occurrences (%)
5
Gain = 1/64
Pulse Mode
Figure 9. Gain Error vs Temperature
20
Offset (ppm)
−15
Gain = 1/8
Gain = 1/16
Gain = 1/32
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Figure 13. Offset Histogram
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Typical Characteristics (continued)
At TA = +25°C, AVDD = +2.5 V, AVSS = –2.5 V, DVDD = 3.3 V, fCLK = 4.096 MHz, and VREF = 5 V, unless otherwise noted.
DAC1282A supports gains = 1/1, 1/4, and 1/16 only.
125
Gain = 1/1
Gain = 1/2
Gain = 1/4
Gain = 1/8
−105
Gain = 1/16
Gain = 1/32
Gain = 1/64
Signal−to−Noise Ratio (dB)
Total Harmonic Distortion (dB)
−100
−110
−115
−120
−125
−130
−55
120
115
110
105
100
95
−35
−15
5
25
45
65
Temperature (°C)
85
105
90
−55
125
±105
5
25
45
65
Temperature (°C)
85
105
125
G000
Figure 15. SNR vs Temperature
Gain = 1/16
Gain = 1/32
Gain = 1/64
±110
±115
±120
±125
125
Gain = 1/1
Gain = 1/2
Gain = 1/4
Gain = 1/8
Gain = 1/16
Gain = 1/32
Gain = 1/64
120
115
110
105
100
95
0.1
±130
0.1
1
10
100
1000
Signal Frequency (Hz)
10
100
Signal Frequency (Hz)
1000
G000
Figure 17. SNR vs Signal Frequency
0
120
−40
−60
Signal−to−Noise Ratio (dB)
Gain = 1/1
Gain = 1/2
Gain = 1/4
Gain = 1/8
Gain = 1/16
Gain = 1/32
Gain = 1/64
−20
−80
−100
−120
−140
−120
1
C001
Figure 16. THD vs Signal Frequency
Total Harmonic Distortion (dB)
−15
Gain = 1/64
130
Signal−to−Noise Ratio (dB)
Total Harmonic Distortion (dB)
Gain = 1/1
Gain = 1/2
Gain = 1/4
Gain = 1/8
−35
Gain = 1/8
Gain = 1/16
Gain = 1/32
G000
Figure 14. THD vs Temperature
±100
Gain = 1/1
Gain = 1/2
Gain = 1/4
−100
−80
−60
−40
Signal Amplitude (dB)
−20
0
100
80
60
Gain = 1/1
Gain = 1/2
Gain = 1/4
Gain = 1/8
Gain = 1/16
Gain = 1/32
Gain = 1/64
40
20
0
−120
G000
Figure 18. THD vs Signal Amplitude
−100
−80
−60
−40
Signal Amplitude (dB)
−20
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Figure 19. SNR vs Signal Amplitude
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Typical Characteristics (continued)
At TA = +25°C, AVDD = +2.5 V, AVSS = –2.5 V, DVDD = 3.3 V, fCLK = 4.096 MHz, and VREF = 5 V, unless otherwise noted.
DAC1282A supports gains = 1/1, 1/4, and 1/16 only.
135
Gain = 1/1
Gain = 1/2
Gain = 1/4
Gain = 1/8
Gain = 1/16
Gain = 1/32
Gain = 1/64
−95
−100
−105
−110
−115
−120
−125
125
1
1.5
2
2.5
3
CLK (MHz)
3.5
4
115
110
105
1
2.5
3
Clock (MHz)
3.5
4
4.5
G000
Figure 21. SNR vs Master Clock Frequency
Gain = 1/1
Gain = 1/2
Gain = 1/4
−95
−100
Gain = 1/8
Gain = 1/16
Gain = 1/32
Gain = 1/64
130
−105
−110
−115
−120
−125
125
Gain = 1/1
Gain = 1/2
Gain = 1/4
Gain = 1/8
Gain = 1/16
Gain = 1/32
Gain = 1/64
120
115
110
105
100
−130
2
2.5
3
3.5
4
4.5
Reference Voltage (V)
5
95
2.5
5.5
Figure 22. THD vs Reference Voltage
30
5
5.5
G000
Figure 23. SNR vs Reference Voltage
Gain = 1/1...1/8
Gain = 1/16
Gain = 1/32
Gain = 1/64
30 Units
7
25
20
15
10
6
5
4
3
2
1
5
0
−130
3.5
4
4.5
Reference Voltage (V)
8
Quiescent Current (mA)
35
3
G000
40
Occurrences (%)
2
135
Signal−to−Noise Ratio (dB)
Total Harmonic Distortion (dB)
1.5
G000
Figure 20. THD vs Master Clock Frequency
−125
−120
−115
−110
Total Harmonic Distortion (dB)
Figure 24. THD Histogram
12
Gain = 1/64
120
95
4.5
−90
−135
Gain = 1/8
Gain = 1/16
Gain = 1/32
100
−130
−135
Gain = 1/1
Gain = 1/2
Gain = 1/4
130
Signal−to−Noise Ratio (dB)
Total Harmonic Distortion (dB)
−90
−105
0
−55
G000
Gain = 1/1
Gain = 1/2
Gain = 1/4
−35
−15
Gain = 1/8
Gain = 1/16
Gain = 1/32
5
25
45
65
Temperature (°C)
Gain = 1/64
DVDD
85
105
125
G000
Figure 25. Power-Supply Current vs Temperature
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Typical Characteristics (continued)
At TA = +25°C, AVDD = +2.5 V, AVSS = –2.5 V, DVDD = 3.3 V, fCLK = 4.096 MHz, and VREF = 5 V, unless otherwise noted.
DAC1282A supports gains = 1/1, 1/4, and 1/16 only.
−50
Gain = 1/1
Gain = 1/2
Gain = 1/4
Gain = 1/8
−100
−105
Gain = 1/16
Gain = 1/32
Gain = 1/64
Total Harmonic Distortion (dB)
Total Harmonic Distortion (dB)
−95
−110
−115
−120
−125
−130
−135
10
100
1000
10000
Load Resistance (Ω)
100000
−70
−80
−90
−100
−110
−120
−130
1000000
Gain = 1/1
Gain = 1/2
Gain = 1/4
Gain = 1/8
Gain = 1/16
Gain = 1/32
Gain = 1/64
−60
10
Figure 26. THD vs Resistive Load
G000
Switch Differential On−Resistance (Ω)
5
0.75
Digital Gain Error (dB)
1000000
Figure 27. Switch THD vs Resistive Load
1
0.5
0.25
0
−0.25
−0.5
−0.75
−1
−120
−100
−80
−60
−40
Digital Attenuation (dB)
−20
4
3
2
TA = −40°C
TA = +25°C
TA = +85°C
1
0
−2.5
0
−2
G000
Figure 28. Digital Gain Linearity
−1.5 −1 −0.5 0
0.5
1
1.5
Switch Input/Output Voltage (V)
2
2.5
G000
Figure 29. Switch On-Resistance vs Signal Voltage
0.1
30
Switch On−Resistance Match (Ω)
30 units
25
Occurrences (%)
100
1000
10000
100000
Switch Output Load Resistance (Ω)
G000
20
15
10
5
2.75
2.76
2.77
2.78
2.79
2.8
2.81
2.82
2.83
2.84
2.85
2.86
2.87
2.88
2.89
2.9
2.91
2.92
2.93
2.94
2.95
0
Switch Differential On Resistance (Ω)
Figure 30. Switch On-Resistance Histogram
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
−55
−35
−15
5
25
45
65
Temperature (°C)
85
105
125
G000
G000
Figure 31. Switch On-Resistance Match vs Temperature
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8 Detailed Description
8.1 Overview
The DAC1282 is a single-chip, digital-to-analog converter (DAC) that self-generates low-distortion sine-wave and
pulse-output signals for the demanding testing requirements of seismic recording equipment. Figure 32 shows
the block diagram of the DAC1282.
The DAC1282A device is functionally equivalent to the DAC1282, except that the DAC1282A supports PGA
gains of 1/1, 1/4, and 1/16 only. The DAC1282A also relaxes the THD specification of these gains. See the
Electrical Characteristics section for more details.
The DAC1282 requires two supply voltages: analog and digital. The analog supply can be single 5 V or bipolar
±2.5 V. The digital supply range is 1.65 V to 3.6V. The output signal common-mode voltage is regulated to
100 mV below the midpoint of the analog power-supply voltage. An internal power-on reset (POR) circuit resets
the DAC on power-up.
An SPI™-compatible serial interface is used to access the DAC1282 registers for device configuration and
control. The configuration registers can be read back by clocking the data out on the DOUT pin. The DAC1282
voltage output is fully differential and is taken out on the VOUTP/VOUTN pins. The CAPP/CAPN pins connect to
external filter capacitors to reduce the output noise.
The reference input voltage sets the DAC1282 full-scale output. The DAC reference voltage is applied between
the VREF and AVSS pins. The DAC is optimized to operate with a 5-V reference. The sine-wave generator is
programmable by registers to set the sine frequency and amplitude. The frequency range is programmable from
0.4883 Hz to 250 Hz. The output level is controlled by both analog gain (in 6-dB steps), and digital gain (in 0.5dB steps).
DVDD
VREF
Analog Gain Control
CLK
RESET/PWDN
SYNC
CS
SCLK
DIN
Current
Generator
Synchronization
Sine Wave
Generator
AVDD
Digital
Modulator
CAPP
VOUTP
Main
DAC
Buffer
VOUTN
Serial
Interface
24-Bit
DC Register
DOUT
CAPN
Pulse
Registers
Pulse
DAC
SWINP
SYNC
Differential
Switch
Switch Control/Bitstream Input
SW/TD
DAC1282
SWINN
SWOUTN
SWOUTP
DGND
AVSS
Figure 32. DAC1282 Block Diagram
The digital modulator takes the output from the sine-wave generator or the 24-bit dc register to generate the
ones-density bitstream. The bitstream drives the main DAC. Optionally, ones-density data can be input to drive
the DAC directly, bypasses the digital signal generator. The main DAC develops a differential output current that
is converted to a differential output voltage by an internal current-to-voltage (I/V) amplifier. The output range is
set by analog gain that scales the DAC current generator. The output amplifier provides current limit protection.
The dc mode is programmed by a 24-bit register and is used to provide a dc output. The dc mode also has
programmable ranges controlled by the analog gain control.
14
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Overview (continued)
In Pulse mode, a fast-response, 5-bit pulse DAC is used to provide 31 preset dc levels. The levels span over the
available output ranges. The pulse DAC is optimized to provide fast response with short output rise times. The
pulse DAC is triggered by the SYNC pin for precision control of the pulse time.
The DAC1282 includes a low distortion differential output switch. The output switch can connect the DAC1282
output to sensors for THD and impulse testing. The switch is controlled by either pin or command, thus allowing
precise switch timing.
The SYNC input synchronizes the output signal to a known time reference. In sine mode, SYNC resets the sine
wave to the zero crossing. In Pulse mode, SYNC selects one of two user-programmed dc levels.
The RESET/PWDN pin powers down the device when low. When RESET/PWDN is released high, the DAC1282
is reset.
The SW/TD input is dual function. In digital data mode, the pin is the ones-density data input. In the other modes,
SW/TD controls the opening/closing of the switch.
Figure 33 shows the main details of the main DAC. The main DAC provides the digital-to-analog conversion by
filtering the ones-density digital data. In operation, the current generator establishes the range current that is
mirrored to a multi-tap, current-steering filter stage. The current generator is controlled by the analog gain control
register that scales the weight of the tap currents to one of seven ranges (0 dB to –36 dB).
The current-steering stage switches the tap currents to the positive or negative current summing nodes, as the
digital input is sampled. A higher ones-density directs an increasing average current to one node than the other,
thus increasing the differential current. The differential current is converted to differential voltage by the internal
I/V converter stage. The common-mode current sources balance the current at the amplifier summing node.
VREF
AVDD
Sine Wave
Table
...
Current Taps
Current
Generator
Digital
Modulator
Amplifier
Summing
Nodes
Tap
Control
Digital
Data
Mux
SW/TD
Reset
SYNC
CLK
Reset
Common-Mode
Current
Reset
D
4-Bit
Counter
CLK/16
...
D
AVSS
Figure 33. Main DAC Block Diagram
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8.2 Feature Description
8.2.1 Signal Output (VOUTP, VOUTN)
As shown in Figure 34, the DAC provides a differential voltage (VDIFF = VOUTP – VOUTN) on pins VOUTP and
VOUTN. The output common-mode voltage (VCOM) is regulated to 100 mV below the midpoint of the analog
supply (AVDD – AVSS).
Each signal output swings above and below the common-mode voltage. Best performance is realized when the
DAC output is used differentially. In power-down mode, the outputs enter a high-impedance, 3-state mode.
VOUTP
VCOM + VDIFF/2
V COM
VCOM - VDIFF/2
VCOM + VDIFF/2
DAC1282
V COM
VOUTN
VCOM - VDIFF/2
NOTE: VDIFF = VOUTP – VOUTN = ±2.5 V × Gain (VREF = 5 V).
VCOM = –0.1 V (±2.5-V supplies) or 2.4 V (5-V supply).
Figure 34. DAC Output Signal
The DAC output buffer is rated to drive up to a 2-nF capacitive load (maximum) and a 100-Ω resistive load
(minimum). However, degradation of THD performance results in resistive loads less than 1 kΩ, as shown in
Figure 26
The internal digital modulator generates the signal to drive the DAC. The modulator shapes the in-band noise to
high frequency and the frequency-shaped noise is present on the DAC output. However, the high frequency DAC
output noise is rejected by the digital filter of the ADC and does not affect system performance.
The DAC sampling update noise is also present on the signal output. The sampling noise does not affect the
ADC performance, but when testing the ADC near full-scale input, the noise can cause false indication of the
ADC modulator overrange detection. The ADS1282 overrange output signal indication should be ignored when
testing at or below the ADC full-scale input.
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Feature Description (continued)
8.2.2 DAC Modes
The DAC1282 has four operational modes of: sine, dc, pulse, and external digital data input. These modes are
programmed by the MODE[1:0] bits in the GANMOD register, as shown in Table 1.
Table 1. DAC Modes
MODE[1:0] BITS
DAC MODE
00
Sine
01
DC
10
Digital data
11
Pulse
8.2.2.1 Sine Mode
In sine mode, the DAC1282 provides a sine-wave output. An internal signal generator develops the sine-wave
signal. The M[3:0], N[7:0], and FREQ register bits program the output frequency. The frequency range is
programmable from 0.4883 Hz to 250 Hz, as shown in Equation 1.
(1)
Output Frequency (Hz)
=
250
2
FREQ
M[3:0] + 1
x
N[7:0] + 1
where:
M[3:0] ≤ N[7:0]
(1)
fCLK = 4.096 MHz. The signal frequency scales with fCLK.
(1)
Table 2 lists values of registers M and N for selected output frequencies.
Table 2. Register Output Frequencies
SIGNAL FREQUENCY (Hz)
(1)
(1)
M[3:0] REGISTER BITS
N[7:0] REGISTER BITS
FREQ BIT
0.48828125
0000
1111 1111
1
0.9765625
0000
1111 1111
0
1.953125
0000
0111 1111
0
3.90625
0000
0011 1111
0
7.8125
0000
0001 1111
0
15.625
0000
0000 1111
0
31.25
0000
0000 0111
0
50
0000
0000 0100
0
55
1010
0011 0001
0
60
0101
0001 1000
0
62.5
0000
0000 0011
0
100
1001
0001 1000
0
125
0000
0000 0001
0
250
0000
0000 0000
0
fCLK = 4.096MHz. The signal frequency scales with fCLK.
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When the M or N registers are updated, the sine wave resets to the zero-crossing point. The sine wave can also
be reset to the zero-crossing point by taking the SYNC pin high; see the SYNC section.
The amplitude of the sine-wave output is determined by analog and digital gains. The analog gain increments are
6 dB, from 0 dB to –36 dB, and are programmed by the GAIN[2:0] register bits. Table 3 lists the analog gains.
Table 3. Analog Gain
ANALOG GAIN (V/V) (1)
(1)
(2)
(3)
ANALOG GAIN (dB) (2)
DIFFERENTIAL RANGE (V) (3)
GAIN[2:0] REGISTER BITS
1/1
0
±2.5
000
1/2
–6
±1.25
001
1/4
–12
±0.625
010
1/8
–18
±0.312
011
1/16
–24
±0.156
100
1/32
–30
±0.078
101
1/64
–36
±0.039
110
The DAC1282A supports analog gains of 1/1, 1/4, and 1/16 only.
Relative to 1.77 VRMS full-scale.
VREF = 5 V, digital gain = 0 dB.
The digital gain resolution is in 0.5-dB increments, from 0 dB to full mute and is programmed by the SINEG[7:0]
register bits. Table 4 lists the digital gain setting. Equation 2 is the amplitude setting in sine mode.
Sine Amplitude (dB) = Analog Gain (dB) + Digital Gain (dB)
(2)
Best SNR, for a given signal level, is achieved by reducing the analog gain while maximizing the digital gain.
Table 4. Sine Mode Digital Gain
18
SINE MODE DIGITAL GAIN (dB)
SINEG[7:0] REGISTER BITS
0
0000 0000
–0.5
0000 0001
–1.0
0000 0010
—
—
–119.5
1110 1111
Full mute
1111 0000
Full mute
1111 xxxx
Full mute
1111 1111
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8.2.2.2 DC Mode
The DAC1282 provides a dc output mode with 24-bit available resolution. The output level is determined by the
analog gain and the 24-bit dc registers.
The GAIN[2:0] register bits set the analog gain (see Table 3). The DCG[23:0] register bits set the 24-bit level
over the selected analog range. Table 5 lists the digital gain settings in dc mode.
Table 5. DC Mode Digital Gain Settings
(1)
DIFFERENTIAL OUTPUT
VOLTAGE (V) (1)
DCG[23:0] REGISTER BITS
+2.5 x Gain
7FFFFFh
+1.25 x Gain
3FFFFFh
0
0
–1.25 x Gain
C00000h
–2.5 x Gain
800001h
VREF = 5 V. Ideal output voltage excluding gain, offset, linearity and noise errors..
8.2.2.3 Pulse Mode
In pulse mode, a fast responding, 5-bit pulse DAC is used to generate the output. The pulse DAC is designed to
approximate a linear-in-dB output function, allowing the generation of pulse test signals across all ranges. Two
registers are used to preset the DAC output. The SYNC pin is used to select one of the two registers. When
SYNC is low, the PULSA register value drives the DAC; when SYNC is high, the PULSB register value drives the
DAC. The pulse registers can be programmed to yield differential outputs from –2.5 V to +2.5 V. Note that the
pulse levels scale with VREF and are independent of the analog gain settings. Table 6 lists the programmable
range of the pulse A and pulse B registers.
Table 6. Pulse Register Values
(1)
OUTPUT (V) (1)
PULSA[4:0], PULSB[4:0]
OUTPUT (V) (1)
PULSA[4:0], PULSB[4:0]
+2.50
01111
–0.020
11111
+1.88
01110
–0.029
11110
+1.25
01101
–0.039
11101
+0.938
01100
–0.058
11100
+0.625
01011
–0.078
11011
+0.469
01010
–0.117
11010
+0.312
01001
–0.156
11001
+0.234
01000
–0.234
11000
+0.156
00111
–0.312
10111
+0.117
00110
–0.469
10110
+0.078
00101
–0.625
10101
+0.058
00100
–0.938
10100
+0.039
00011
–1.25
10011
+0.029
00010
–1.88
10010
+0.020
00001
–2.50
10001
0
00000
VREF = 5 V. Ideal pulse mode differential output, values are rounded and exclude noise, offset, gain, and linearity errors.
Note that when pulse testing the ADC, the ADC digital filter time domain response has characteristic overshoot
and ringing. As a result of the ADC filter overshoot, input levels close to ADC full scale may cause clipping of the
ADC output code.
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8.2.2.4 Digital Data Mode
In digital data mode, the DAC internal signal generator is bypassed and the DAC is driven instead by applying a
bitstream input. Arbitrary DAC output waveforms can be generated by application of custom digital data patterns.
The data format in this mode is ones-density modulated input at CLK/16 data rate (256 kHz). The input is applied
to the SW/TD input pin. The DAC1282 output in digital data mode is defined in Equation 3.
Digital Data Mode Differential Output = VOUTP – VOUTN = VREF/2 × Gain × (TD – 50%)/25%
where:
VREF is 5-V nominal,
Gain is the analog gain (1/1 to 1/64),
TD is the bitstream ones-density from 25% to 75%.
(3)
The DAC1282 filters the digital data (bitstream) input providing a voltage output proportional to the bitstream
ones-density. The GAIN[2:0] register sets the analog gain in 6-dB steps, from 0 dB to –36 dB (1/1 to 1/64); see
the SYNC section for the external timing requirements. Table 7 lists several values of the external bitstream
input.
Table 7. External Bitstream Input
ONES-DENSITY BITSTREAM (%)
(1)
20
VOUTP – VOUTN (V) (1)
25
–2.5 × Gain
37.5
–1.25 × Gain
50
0
62.5
+1.25 × Gain
75
+2.5 × Gain
VREF = 5 V. Gain is the analog gain, programmable from 1/1 to 1/64 (0 dB to –36 dB).
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8.2.3 Reference Voltage (VREF)
The DAC1282 requires an external reference for operation. Although reference voltage as low as 2.5 V can be
used, best SNR is achieved with a 5-V reference. The reference input is defined as the voltage difference
between VREF and AVSS (that is, VREF = VREF – AVSS). The DAC1282 output scales with VREF; consequently,
reference noise or drift appears on the DAC output. Excessive reference noise may lead to degraded SNR. A
low-drift and low-noise reference is recommended.
Connect the external reference ground pin directly to the AVSS pins using a star connector to AVSS pin 14. Star
connection minimizes the possibility of power-supply crosstalk. Also, connect a 0.1-µF capacitor close to the
VREF and AVSS terminals to reduce noise susceptibility. Figure 35 shows the reference connection. The
reference input impedance is 220 kΩ. In power-down the switch is off, resulting in very high input impedance. For
single-supply applications, connect AVSS to a clean analog ground point.
VREF
5V
Reference
+V
Internal
Circuitry
220 kΩ
0.1 µF
-2.5 V
(1)
Power-down
Switch
AVSS (14)
AVSS (23)
(1) Recommended bypass capacitor.
Figure 35. Reference Input Connection
8.2.4 Output Filter (CAPP, CAPN)
The CAPP and CAPN pins are the connections for two external capacitors, one capacitor connects to CAPP and
VOUTP and the other capacitor connects to CAPN and VOUTN. The capacitors are required to filter the DAC
sampling noise. The capacitor values are 1 nF; capacitors with low voltage coefficients should be used (C0G
ceramic or film).
As seen in Figure 36, the external capacitors form an analog low-pass filter with the internal feedback resistors.
After step changes to the data in the sine, dc, and digital data modes, the settling of the DAC and the analog
filter is 100-µs typical, as shown in Figure 46. In pulse mode, the filter is internally disabled, yielding shorter
settling time.
CAPP
2k
1 nF
VOUTP
Current
DAC
Output
Amplifier
VOUTN
2k
1 nF
CAPN
Figure 36. Output Filter
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8.2.5 Output Switch (SWINP, SWINN, SWOUTP, SWOUTN)
The DAC1282 has an integrated output switch. The switch can be used to route the DAC output signal to a
sensor for pulse, THD, and common-mode testing. The switch has low on-resistance and matched elements to
minimize signal distortion. The switch input voltage range extends to the analog power supply.
The switch is controlled by three register bits, SW[2:0], and is also controlled by the SW/TD input pin. The switch
integrates break-before-make operation when the register or the SW/TD input control is changed. The SW/TD
input can be used to force the switch open for precise timing control of sensor impulse testing; see the Switch
Control/DAC Data Input (SW/TD) section. Figure 37 and Table 8 describe the switch operation.
S1
SWINP
SWOUTP
S2
S5
S3
SWINN
SWOUTN
S4
Figure 37. DAC1282 Signal Switch
Note that when the DAC is in power-down mode, the switch is forced open.
As shown in Figure 29, the switch on-resistance varies with the switch signal level. When the switch is used to
route the signal and a resistive load is connected to the switch output, the switch on-resistance variations interact
with the load resistance and cause the THD to degrade. Figure 27 illustrates the dependence of THD versus
switch load resistance. The dependence of THD data was taken with a full-scale signal.
Table 8. Switch Connections
DESCRIPTION
PIN CONNECTIONS
SWITCHES CLOSED
SW[2:0] REGISTER BITS
Open
None
000
Differential
SWINP to SWOUTP and SWINN to SWOUTN
S1, S3
001
Differential reverse
SWINP to SWOUTN and SWINN to SWOUTP
S2, S4
010
Common-mode positive
SWINP to SWOUTP and SWOUTN
S1, S2
011
Common-mode negative
Open (default)
SWINN to SWOUTP and SWOUTN
S3, S4
100
Single-ended positive
SWINP to SWOUTP
S1
101
Single-ended negative
SWINN to SWOUTN
S3
110
SWOUTP to SWOUTN
S5
111
Output short
22
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8.2.6 Clock Input (CLK)
The CLK pin is the master clock input to the DAC1282, nominally 4.096 MHz. As with any high-performance data
converter, a high-quality clock source is essential. A crystal oscillator or low-jitter PLL clock source is
recommended. Make sure to avoid ringing on the input by keeping the trace short and source-terminating
(typically 50 Ω). See the CLK specifications shown in Figure 38 and Table 9.
t CLK
t CPWL
t CPWH
CLK
Figure 38. CLK Timing Requirements
Table 9. Requirements for Figure 38
SYMBOL
DESCRIPTION
tCLK
CLK period
tCPWH, L
CLK pulse width high or low
MIN
MAX
UNIT
235
1000
ns
95
900
ns
8.2.7 Switch Control/External Digital Input (SW/TD)
SW/TD is a multi-function digital input pin. The SW/TD function depends on the mode of operation.
8.2.7.1 SW Function
In sine, dc, and pulse mode, SW/TD controls the output switch. When SW/TD is low, all switches are forced
open, overriding the switch register setting (SW[2:0]). When SW/TD is high, the switch is transparent to the value
of register setting. In power-down mode, the switch is forced open.
8.2.7.2 TD Function
In digital input mode, SW/TD is the signal input used to drive the DAC. The data input are modulated by onesdensity and are clocked in by the master clock (CLK). When the ones-density is 75% (that is, on average, three
out of four bits are '1'), the differential output voltage is at the positive maximum value. When the ones-density is
25% (that is, on average, three out of four bits are '0'), the differential output voltage is at the negative maximum
value. When the ones-density is 50% (on average, an equal number of '0's and '1's), the differential output is
zero.
SW/TD is sampled by the DAC1282 at the rate of CLK/16. Therefore, the sampling can have ±8 CLK periods of
uncertainty. SYNC can be used to eliminate the uncertainty by synchronizing the phase of SW/TD to the desired
CLK cycle. Synchronizing the digital input results in a consistent phase of the output signal; see the SYNC
section.
The output range is set by the analog gain bits, GAIN[2:0]; see Table 3. Equation 3 describes the DAC output
versus the bitstream input ones-density. Make sure to avoid ringing on the input by keeping the trace short. In
some cases, source-terminating resistors may be necessary (20 Ω to 50 Ω).
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8.2.8 SYNC
SYNC is a digital input used to synchronize the DAC1282 output.
In the digital data mode, the DAC input is a ones-density bitstream. In this mode, the SYNC pin synchronizes the
sampling of SW/TD digital data to the desired master clock cycle (CLK). When SYNC is low or high, the DAC
operates normally. When SYNC is taken from low to high, the DAC output is reset to zero and the sample instant
of SW/TD is reset to the eighth rising CLK edge that follows. The SW/TD is then regularly sampled on
subsequent 16 CLK intervals. After synchronization, the DAC output is not settled and achieves full settling 400
CLK periods later, as shown in Figure 39.
t SW/TD
t TCSU
CLK
2
1
8
9
12
24
400
Next SW/TD
Sample
SW/TD
Sample
SW/TD
t SCSU
SYNC
t CTHD
t STDAT
t SYLW
(Initial Output Update)
(Output Reset)
(Output Settled)
Output
t TSOP
t SETL
Figure 39. Digital Data Mode Synchronization
Table 10. Timing Characteristics for Figure 39 (1)
SYMBOL
DESCRIPTION
MIN
TYP
UNIT
tSCSU
SYNC high to CLK high setup time
30
ns
tTCSU
SW/TD to CLK high setup time
30
ns
tCTHD
CLK high to SW/TD hold time
10
ns
tSYLW
SYNC low pulse width
2
tCLK
tSTDAT
CLK high after SYNC high to SW/TD sample time
tTSOP
SW/TD sample to output update
tSW/TD
SW/TD period
tSETL
SYNC high to fully-settled output
(1)
24
8
tCLK
4
tCLK
16
tCLK
400
tCLK
DVDD = 1.65 V to 3.6 V.
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In sine mode, the SYNC rising edge resets the DAC output to differential 0 V (sine-wave zero-crossing point).
When SYNC is high or low, the output is unaffected. When SYNC is taken from low to high, the output resets on
the following CLK rising edge. SYNC must be pulsed low for a minimum of 2 CLK cycles. The SYNC input can
be applied simultaneous to the DAC and the ADS1282 (ADC in pulse-sync mode).
To synchronize the DAC, observe SYNC to the CLK timing requirements shown in Figure 40. That is, the SYNC
rising edge should be applied before the set-up time or after the hold time specifications. If the SYNC timing
requirement is not met, the DAC may synchronize with one clock cycle timing error.
t SCSU
t CSHD
CLK
t SYLO
SYNC
Figure 40. Sine Mode Synchronization
Table 11. Timing Characteristics for Figure 40 (1)
SYMBOL
DESCRIPTION
MIN
UNIT
tSYLO
SYNC pulse width low
2
tCLK
tSCSU
SYNC rising edge to CLK rising edge setup time
30
ns
tCSHD
CLK rising edge to SYNC rising edge hold time
40
ns
(1)
DVDD = 1.65 V to 3.6 V.
In pulse mode, the SYNC pin selects one of two pre-programmed pulse levels. The pulse levels are
programmable from +2.5 V to –2.5 V in approximately 3-dB steps by pulse level registers PULSA and PULSB.
When SYNC is low, the value of the PULSA register drives the DAC; when SYNC is high, the value of the
PULSB register is the code of the DAC, as shown in Figure 41. When the SYNC pin is changed, the DAC output
updates immediately to the new code.
Output
PULSA
PULSB
PULSA
SYNC
Figure 41. Sync Operation in Pulse Mode
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8.2.9 RESET/PWDN
The RESET/PWDN is a digital input used to power-down and reset the DAC1282. To power-down the DAC, take
the pin low. In power-down mode, the power consumption is reduced to a device leakage level (see the Electrical
Characteristics table). The signal output and digital pin DOUT enters 3-state and the output switch is driven off.
Note that the digital inputs must remain defined as either logic low or logic high; do not float the inputs. Disable
the CLK input to minimize leakage. To exit the power-down state, take the pin high. The DAC1282 is reset after
power-down mode is exited.
The DAC1282 is reset by taking the RESET/PWDN pin low for a minimum of two fCLK cycles and is then taken
back high. The DAC1282 is held in reset for 2 fCLK cycles; after this time, DAC communications may begin, as
shown in Figure 42 and Table 12.
CLK
RESET/PWDN
t RSLO
Status
Operational
t RSTM
Reset
Operational
Figure 42. DAC RESET/PWDN
Table 12. Timing Characteristics for Figure 42
SYMBOL
DESCRIPTION
tRSLO
PWDN/RESET pulse width low for power-down
tRSTM
PWDN/RESET high to begin operation
MIN
MAX
500
UNIT
ns
500
ns
8.2.10 AVDD, AVSS, and DVDD Power Supplies
The DAC1282 has two power supplies: analog and digital. The analog supply (AVDD, AVSS) is 5 V and can
either be single 5 V or dual (±2.5 V). The analog supply should be clean and free from noise and ripple. The
DAC1282 regulates the output common-mode voltage to 0.1 V below the mid-point of the analog supply.
Because the analog supply pins draw signal-dependent current and AVSS (pin 14) is internally shared with the
reference input low, trace resistance between AVSS (pin 14) and the AVSS power supply should be minimized or
degraded performance may result. Therefore, connect the external reference ground terminal close to the device
AVSS terminal using a star connection. This configuration helps to minimize power-supply coupling to the
reference input.
DVDD is the digital supply used to power both the internal digital and the device I/O pins. The allowable range of
DVDD is 1.65 V to 3.6 V.
The power supplies can be sequenced on or off in any order, but the analog or digital inputs should never
exceed AVDD or AVSS, or DVDD, respectively. In such an event, the internal ESD protection diodes may begin
to conduct. The input current must always be limited as specified in the Absolute Maximum Ratings table.
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At power-on, when the latter of DVDD exceeds approximately 1.3 V, or the difference of AVDD – AVSS exceeds
approximately 1.4 V, an internal power-on reset (POR) occurs. During POR, the device is held in a reset
condition for a period of 216 fCLK periods as shown in Figure 43. During this time, the DAC1282 output is held at 0
V, differential. SPI communications are not possible during this time. After the reset time elapses, the default
settings are loaded: 31.25 Hz, 28 mVRMS amplitude, and output switch off. SPI communications can then be
started.
AVDD - AVSS
1.4 V nom
DVDD
1.3 V nom
CLK
16
2 t CLK
Status
Reset
Operational
Figure 43. Power-On Sequence
8.2.10.1 Power Consumption
The power consumed by the DAC1282 depends on the analog gain. Table 13 shows the DAC power
consumption.
Table 13. Power Consumption
(1)
ANALOG GAIN
POWER (mW) (1)
1/1
38
1/2
28
1/4
23
1/8
21
1/16
20
1/32
20
1/64
20
Typical power consumption with VREF = 5 V and VOUT = 0 V. Excludes pulse mode.
8.2.10.2 Offset and Gain Error
The DAC1282 features a low offset error ( ±7/Gain + 50 ppm FS typical) and low gain error (0.1 % typical). Offset
and gain drift are also very low for the DAC1282. Drift is calculated using the box calculation method of
Equation 4:
Drift Calculation = (Max – Min) / Temperature Range (ppm/°C)
Where:
Max and Min are, respectively, the maximum and minimum offset and gain errors (in ppm) recorded over the
specified temperature range of –40°C to +85°C.
(4)
Gain match is the gain error of Gain = 1/1 relative to all analog gains.
8.2.10.3 Signal-to-Noise Ratio (SNR)
The DAC1282 achieves excellent signal-to-noise ratio (SNR) performance. The SNR data are obtained using the
DAC circuit of Figure 50 and data captured by the ADS1282.
SNR is measured with a signal level of –0.5 dBFS and a 31.25-Hz test frequency, then taking the fast fourier
transform (FFT) of 4096 data points from the ADS1282, using complementing gains. The noise power is
calculated over the bandwidth of 413 Hz (1-ms sample period). The dc, fundamental, and harmonic bins are
removed to calculate the SNR. The SNR measurement represents the combination of the ADS1282 SNR and the
SNR of the DAC1282.
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8.2.10.4 DC Noise
DC noise data are obtained using the DAC circuit of Figure 50 with data captured by the ADS1282. The noise is
measured in dc mode with the output voltage set to 0 V differential. The ADC gain is set to the complement of
the DAC gain for each output range. The noise is the standard deviation of 4096-point ADC acquisition record
(RMS noise, referred-to-output).
8.2.10.5 Total Harmonic Distortion (THD)
The DAC1282 achieves excellent THD performance. The THD data are obtained using the DAC circuit of
Figure 50 and captured by the ADS1282. The ADC gain is set to the complement of the DAC gain for each
output range.
THD is measured with a –0.5-dBFS output signal level and a 31.25-Hz test frequency, then taking the FFT of the
4096-point ADC acquisition record. The ADC data points are increased to 16,384 for gains of 1/16, 1/32, and
1/64 for improved rendition of harmonics as a result of the higher noise floor. The THD measurement represents
the combination of the ADS1282 THD and the DAC1282 THD.
8.2.11 Step Response
The step response of the DAC depends on the mode. In pulse mode, the DAC disables the external analog filter
formed by capacitors CAPP, CAPN. Disabling the analog filter in conjunction with the fast response pulse DAC
results in noticeably faster rise time and shorter settling time. Note that additional filter components in the signal
path may also affect the response time.
Figure 44 shows the pulse mode step response after the SYNC pin transition. Figure 45 shows the pulse mode
detail settling to 0.1% of final value after the SYNC pin transition.
2
0.5
(VOUTP − VOUTN)
Pulse Mode
Full scale step
Settling to final value (%)
0.4
Amplitude (V)
1
VOUTP, VOUTN
Pulse mode
Full Scale Step
0
−1
−2
0
2
4
6
8
10
Time (µs)
12
14
0.1
0
−0.1
−0.2
−0.3
16
18
−0.5
−50
G000
Figure 44. Pulse Mode Step Response
28
0.2
−0.4
SYNC pin transition
−2
0.3
0
50
SYNC pin transition
100 150 200 250 300 350 400 450
Time (µs)
G000
Figure 45. Pulse-Mode, Step-Response Detail
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Figure 46 shows the step response time of the dc mode. The step response of sine and digital data mode have
similar settling times. Note that additional filter components in the signal path may also affect the response time.
2
Amplitude (V)
1
VOUTP, VOUTN
DC mode
Full Scale Step
0
−1
SYNC pin transition
−2
−50
0
50
100 150 200 250 300 350 400 450
Time (µs)
G000
Figure 46. DC-Mode Step Response
8.2.12 Frequency Response
The DAC internal signal generator is capable of output signal frequencies from 0.489 Hz to 250 Hz. Frequencies
outside of this range are also possible by driving the DAC directly with an external digital input (bitstream).
However, the DAC low-pass filters the digital input and results in a sinx/x frequency response. The –3 dB signal
bandwidth of the DAC filter is 8.2 kHz. Figure 47 illustrates the DAC1282 frequency response. Note that highorder noise-shaped digital inputs may limit the useable frequency range as a result of rising noise.
OUTPUT FREQUENCY RESPONSE
0
CLK = 4.096MHz
Excludes I/V Filter Rolloff
Magnitude (dB)
-10
-20
-30
-40
-50
-60
0
5
10
15
20
25
30
35
40
45
50
Output Frequency (kHz)
Figure 47. DAC Frequency Response
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8.3 Device Functional Modes
8.3.1 Serial Interface
Configuration of the DAC is by an SPI-compatible serial interface consisting of four signals: CS, SCLK, DIN, and
DOUT; or the interface can consist of three signals in which case CS may be tied low. Tying CS low permanently
selects the device and DOUT remains a driven output. The interface is used to read and write registers and also
is used to send a DAC reset command.
8.3.1.1 Serial Communications
DAC1282 communication occurs by clocking register data into the device (on DIN) and reading back register
data (on DOUT). The SCLK input is used to clock data into and out of the device. Data are input on the serial
clock (SCLK) rising edge and output on the SCLK falling edge. The communication protocol is half-duplex (that
is, data are transmitted to and from the device one direction at a time).
Communications to the device occur on 8-bit boundaries. If an unintentional SCLK transition should occur (such
as is possible from a noise spike), the DAC1282 command decoder can be out-of-sync and the serial port may
not respond properly. The serial port may reset in one of the following ways:
1. Take CS high to reset the interface
2. Hold SCLK inactive (low state) for 218 fCLK cycles to automatically reset the interface (see the SPI Timeout
section)
3. Take RESET/PWDN low then back high to reset the device and the interface
4. Cycle the power supplies for a power-on reset (POR)
8.3.1.2 Chip Select (CS)
CS (chip select) selects the DAC1282 for communication. To select the device, pull CS low. CS must remain low
for the duration of the command sequence. When CS is taken high, the serial interface is reset, input commands
are ignored, and DOUT enters a high-impedance state.
8.3.1.3 Serial Clock (SCLK)
The serial clock (SCLK) is a Schmitt-triggered input used to clock data into and out of the DAC1282. SCLK can
be idled high or low. If SCLK is idled low, the SPI timeout feature is active. If SCLK is idled high, the SPI timeout
feature is disabled.
Despite the built-in Schmitt-trigger, keep SCLK as clean as possible to prevent glitches from accidently shifting
the data. Series-terminated printed circuit board (PCB) traces often help to reduce ringing and overshoot (series
termination resistance is approximately 20 Ω to 50 Ω). If SCLK is held low for 218 fCLK periods, the serial interface
is reset. The timeout feature can be used to automatically recover the SPI port in the event of a noise glitch.
Avoid starting new commands after this time interval to prevent an unexpected serial port reset at the next
command instant.
8.3.1.4 Data Input (DIN)
DIN is the data input pin used to send data to the DAC. The DAC1282 latches DIN input data on the rising edge
of SCLK.
8.3.1.5 Data Output (DOUT)
DOUT is the data output pin used to read register data out of the DAC. The data are shifted out on the falling
edge of SCLK. DOUT enters a 3-state when CS is high.
8.3.2 SPI Timeout
The DAC has an SPI timeout feature that can be used to recover the SPI port if a possible noise pulse should
occur. The noise pulse may lead to a false SCLK detection that can render the DAC serial port unresponsive.
The port is recovered by taking CS high but, in applications where CS is tied low, holding SCLK low for 218 CLK
cycles resets the SPI port automatically. When SCLK is low, the SPI port resets on every 218 CLK cycle interval.
Holding SCLK high disables the automatic SPI reset.
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8.4 Programming
8.4.1 Commands
The commands summarized in Table 14 control and configure the DAC1282. The register read and register write
commands are two-byte command arguments plus additional data bytes while the reset command is a one-byte
command. The DAC1282 serial port chip select (CS) can be taken high or held low between commands but must
remain low for the entire command operation.
Table 14. Command Definitions
(1)
COMMAND
TYPE
DESCRIPTION
FIRST OPCODE BYTE
SECOND OPCODE BYTE
RREG
Register
Read nnnn register(s) at address rrrr (1)
0010 rrrr
0000 nnnn
WREG
Register
Write nnnn register(s) at address rrrr
0100 rrrr
0000 nnnn
RESET
Control
Reset the device
0000 011x (06 or 07h)
—
rrrr = Starting read or write register address, nnnn= number of registers to read or write minus 1.
8.4.1.1 RREG: Read From Registers
Description: These two opcode bytes read register data. The register read operation is a two-byte opcode input
followed by one or more bytes of register data as the output. The first byte of the command is the opcode and
the register address combined. The second byte of the command specifies the number of registers to read
(minus 1) in a block. Register data are output following the command input. Note that for multiple register read
operations, the register address pointer does not wrap when the last register is exceeded.
First opcode byte: 0010 rrrr, where rrrr is the starting address register address to be read.
Second opcode byte: 0000 nnnn, where nnnn is the number of registers to read – 1.
Following bytes: Register data output in MSB-first format. The 16th SCLK falling edge of the opcode clocks out
the MSB of the register data.
CS
(1)
1
9
17
25
SCLK
DIN
OPCODE 1
DOUT
(1)
Don’t Care
OPCODE 2
REG DATA 1
REG DATA 2
CS may be tied low.
Figure 48. RREG Command Example: Read Two Registers Starting from Register 00h
(Opcode 1 = 0010 0000, Opcode 2 = 0000 0001)
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8.4.1.2 WREG: Write To Registers
Description: These two opcode bytes write register data. The register write operation is a two-byte opcode
followed by one or more bytes of register data. The first byte of the command is the write opcode and the register
address combined. The second byte of the command specifies the number of registers to write (minus 1) in a
single sequence. The following bytes are the register data bytes. Note that for multiple register write operations,
the register address pointer does not wrap when the last register is exceeded.
First opcode byte: 0010 rrrr, where rrrr is the starting address register address to be written.
Second opcode byte: 0000 nnnn, where nnnn is the number of registers to write – 1.
Following bytes: Register data input in MSB-first format.
CS
(1)
1
9
17
25
SCLK
DIN
DOUT
(1)
OPCODE 1
OPCODE 2
REG DATA 1
REG DATA 2
Don’t Care
CS may be tied low.
Figure 49. WREG Command Example: Write Two Registers Starting from Register 00h
(Opcode 1 = 0100 0000, Opcode 2 = 0000 0001)
8.4.1.3 RESET: Device Reset
Description: This command resets the DAC. The registers are set to power-on default the value; see the
RESET/PWDN section.
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8.5 Register Map
DAC1282 operation is controlled through a set of 8-bit registers. Collectively, the registers contain all the
information needed to configure the DAC, such as output frequency and amplitude, output pulse levels, etc.
Table 15 shows the register map.
The default state of the device at power-up, after the RESET pin is taken high or after a RESET command is as
follows:
Sine mode, frequency = 31.25 Hz, –36-dB output range, 0-dB digital attenuation
Switch state: open
Table 15. Register Map
ADDRESS
REGISTER
DEFAULT
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
0
GANMOD
xxx11000
ID2
ID1
ID0
GAIN2
GAIN1
GAIN0
MODE1
MODE0
1
SING
00000000
SINEG7
SINEG6
SINEG5
SINEG4
SINEG3
SINEG2
SINEG1
SINEG0
2
SWM
00000000
FREQ
SW2
SW1
SW0
M3
M2
M1
M0
3
N
00000111
N7
N6
N5
N4
N3
N2
N1
N0
4
DCG0
00000000
DCG7
DCG6
DCG5
DCG4
DCG3
DCG2
DCG1
DCG0
5
DCG1
00000000
DCG15
DCG14
DCG13
DCG12
DCG11
DCG10
DCG9
DCG8
6
DCG2
00000000
DCG23
DCG22
DCG21
DCG20
DCG19
DCG18
DCG17
DCG16
7
PULSA
00000000
0
0
0
PULSA4
PULSA3
PULSA2
PULSA1
PULSA0
8
PULSB
00000000
0
0
0
PULSB4
PULSB3
PULSB2
PULSB1
PULSB0
8.5.1 Register Descriptions
Table 16. GANMOD: Range and Mode Register 0 (address = 0h)
7
6
5
4
3
2
1
0
ID2
ID1
ID0
GAIN2
GAIN1
GAIN0
MODE1
MODE0
Bits[7:5]
ID[2:0]: Factory-programmed identification bits (read-only)
These bits may change at any time without notification.
Bits[4:2]
GAIN[2:0]: Analog gain (output range)
These bits set the analog gain in the sine, dc, and bitstream modes. The output amplitude is the combination of
the selected range and the digital gain. Sine mode digital gain is programmed by the SINEG register; dc mode
digital gain are the DCG0, DCG1, and DCG2 registers. Pulse mode levels are exclusively controlled by the PULSA
and PULSB registers. Note that the DAC1282A supports analog gains of 1/1, 1/4, and 1/16 only.
GAIN[2:0]
Bits[1:0]
DEVICE GAIN
OUTPUT RANGE
(V) (1)
000
0 dB
1/1 V/V
±2.5
001 (DAC1282 only)
–6 dB
1/2 V/V
±1.25
010
–12 dB
1/4 V/V
±0.625
011 (DAC1282 only)
–18 dB
1/8 V/V
±0.312
100
–24 dB
1/16 V/V
±0.156
101 (DAC1282 only)
–30 dB
1/32 V/V
±0.078
110 (DAC1282 only, default) (2)
–36 dB
1/64 V/V
±0.039
MODE[1:0]: Mode control bits
The mode bits set the mode of operation. When the mode bits are changed, the
internal signal generator block is reset.
00
01
10
11
(1)
(2)
= Sine mode (default)
= DC mode
= Digital data mode
= Pulse mode
(Peak-to-peak) full-scale output range, VREF = 5 V. Digital gain = 0 dB.
Although both devices deafult to GAIN[2:0] = 110, the DAC1282A setting must be changed to one of the supported analog gains listed.
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Table 17. SINEG: Sine Mode Digital Gain Register (address = 01h)
7
6
5
4
3
2
1
0
SINEG7
SINEG6
SINEG5
SINEG4
SINEG3
SINEG2
SINEG1
SINEG0
Bits[7:0]
SINEG[7:0]: Sine mode digital gain
This register byte sets the sine mode digital gain from 0 dB to –119.5 dB and to full mute, in 0.5-dB steps.
The sine mode digital gain can be expressed as: –DGAIN[7:0]/2 (dB) and are listed in Table 18.
Table 18. Sine Mode Digital Gain
SINEG[7:0] REGISTER
SINE MODE DIGITAL GAIN (dB)
0000 0000 (default)
0.0
0000 0001
–0.5
0000 0010
–1.0
…
…
1110 1111
–119.5
1111 0000
Full mute
…
Full mute
1111 1111
Full mute
Table 19. SWM: Switch, Output Frequency 'M', And Range Bit Register (address = 02h)
7
6
5
4
3
2
1
0
FREQ
SW2
SW1
SW0
M3
M2
M1
M0
Bit 7
FREQ: Frequency
This bit sets the sine mode output frequency range; see Equation 1.
Bits[6:4]
SW[2:0]: Switch control bits
These bits control the switch settings when the SW/TD input is high. When SW/TD is low, the register is
ignored and the switch is forced open. In digital input mode, the switch is controlled only by the register.
Bits[3:0]
SW[2:0]
SWITCH DESCRIPTION
TERMINAL CONNECTIONS
000
Open (default)
All switches open
001
Differential
SWINP to SWOUTP and SWINN to SWOUTN
010
Differential reverse
SWINP to SWOUTN and SWINN to SWOUTP
011
Common-mode positive
SWINP to SWOUTP and SWINP to SWOUTN
100
Common-mode negative
SWINN to SWOUTP and SWINN to SWOUTN
101
Single-ended positive
SWINP to SWOUTP only
110
Single-ended negative
SWINN to SWOUTN only
111
Short
SWOUTP to SWOUTN
M[3:0]: Sine mode frequency, M bits
These bits control the sine-mode output frequency. The output frequency is given in Equation 1.
34
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Table 20. N: Sine Frequency N Register (address = 03h)
7
6
5
4
3
2
1
0
N7
N6
N5
N4
N3
N2
N1
N0
Bits[7:0]
N[7:0]: N register
These bits control the output frequency; see Equation 1.
Table 21. DCG0: DC Mode Digital Gain Byte 0, Least Significant Byte (address = 04h)
7
6
5
4
3
2
1
0
DCG7
DCG6
DCG5
DCG4
DCG3
DCG2
DCG1
DCG0
Table 22. DCG1: DC Mode Digital Gain Byte 1, Mid Byte (address = 05h)
7
6
5
4
3
2
1
0
DCG15
DCG14
DCG13
DCG12
DCG11
DCG10
DCG9
DCG8
Table 23. DCG2: DC Mode Digital Gain Byte 2, Most Significant Byte (address = 06h)
7
6
5
4
3
2
1
0
DCG23
DCG22
DCG21
DCG20
DCG19
DCG18
DCG17
DCG16
Bits[7:0]
DCG[23:0]: DC mode digital gain setting
The DCG0, DCG1, and DCG2 register bytes set the digital gain in dc mode; see Table 5.
Table 24. PULSA: Pulse Level A Byte (address = 07h)
7
6
5
4
3
2
1
0
0
0
0
PULSA4
PULSA3
PULSA2
PULSA1
PULSA0
Bits[7:5]
Reserved
Always write '0'.
Bits[4:0]
PULSA[4:0]: Pulse level A bits
These bits create pulse level A. (Selected output when SYNC is low.)
The PULSA and PULSB registers set two independent levels that can be used to provide pulse output. The
SYNC pin selects either level PULSA or level PULSB as the DAC output. The pulse amplitude resolution is
programmable in discrete steps, as shown in Table 6. Note that the pulse level value is independent of the
RANGE[2:0] setting.
Table 25. PULSB: Pulse Level B Byte (address = 08h)
7
6
5
4
3
2
1
0
0
0
0
PULSB4
PULSB3
PULSB2
PULSB1
PULSB0
Bits[7:5]
Reserved
Always write '0'.
Bits[4:0]
PULSB[4:0]: Pulse level B bits
These bits create pulse level B.
The PULSA and PULSB registers set two independent levels that can be used to provide pulse output. The
SYNC pin selects either level PULSA or level PULSB as the DAC output. The pulse amplitude resolution is
programmable in discrete steps; see Table 6. Note that the pulse level value is independent of the RANGE[2:0]
setting.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
Figure 50 shows the basic DAC1282 connection. Bipolar analog supplies are shown (±2.5 V). Single-supply
operation is also possible with AVDD = 5 V and AVSS = GND. The digital supply range is 1.65 V to 3.6 V.
A low-noise, low-drift reference is recommended for best performance, such as the REF5050 (+5 V) and
REF5045 (+4.5 V). Best signal-to-noise ratio is achieved with a 5-V reference, although a 4.5-V reference
(REF5045) can be used with 1-dB loss in SNR. The 4.5-V reference can be operated from a 5-V supply. AVSS
(pin 14) is the key reference ground point and should be connected to the reference ground terminal using a star
connection. C1 and C2 are the required 1-nF output filter capacitors. The capacitors should be of the low voltcoefficient type (such as a COG ceramic or similar) and placed close to the device pins. Output resistors, R1 and
R2, decouple the DAC to ensure best performnace when driving capacitive loads. The output is shown routed to
the signal switch, providing a second, switched DAC output.
+V
REF5050
REF5045
1 µF
NR
100 µF
4.7 µF
-2.5 V
+3.3 V
1 µF
1 µF
50 Ω
+2.5 V
0.1 µF
1 µF
4.096 MHz
DVDD
CLK
Controller
AVSS
(23)
AVDD
(24)
AVDD
(13)
AVSS
(14)
VREF
CAPP
CS
C1
1 nF C0G
50 Ω
SCLK
R1
50 Ω
VOUTP
DIN
DAC1282
DOUT
50 Ω
Output
VOUTN
SYNC
C2
1 nF C0G
50 Ω
SW/TD
R2
50 Ω
CAPN
RESET/PWDN
DGND
SWOUTN SWOUTP
SWINP SWINN
Switched Output
Figure 50. Basic Connection
36
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9.2 Typical Applications
9.2.1 Single-Channel Seismic System
Figure 51 illustrates a single-channel data acquisition concept for seismic. The DAC1282 is used to test both the
ADC and geophone. The DAC1282 connects directly to channel 1 of the ADC. Tests of the ADC include THD,
pulse, input noise, common-mode, etc. The DAC output and ADC sample timing are controlled by the SYNC
input pins.
The geophone connects to channel 2 of the ADC through input protection and optional filter networks. The DAC
connects to the geophone using the integrated signal switch. Series resistors isolate the geophone from the DAC
output. Geophone test capabilities include impulse, THD, leakage, and common-mode.
VOUTP
DAC1282
Switch Out
Geophone
Protection
Inp1
VOUTN
Switch In
ADS1282
Inp2
Filtering
Figure 51. Single-Channel Seismic System
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Typical Applications (continued)
9.2.2 Four-Channel Seismic System
Figure 52 illustrates a four-channel system. The switched DAC1282 output is routed to the ADC inputs. The
signal from the DAC switch is used to perform sensor impulse testing by opening the switch while digitizing the
response.
DAC1282
Switched Output
ADS1282
Geophone
Protection +
Filtering
Geophone
Protection +
Filtering
Geophone
Protection +
Filtering
Geophone
Protection +
Filtering
ADS1282
ADS1282
ADS1282
Figure 52. Four-Channel Seismic System
38
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SBAS490B – DECEMBER 2011 – REVISED MAY 2015
10 Device and Documentation Support
10.1 Community Resources
The following links connect to TI community resources. Linked contents are provided AS IS by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
10.2 Trademarks
E2E is a trademark of Texas Instruments.
SPI is a trademark of Motorola.
All other trademarks are the property of their respective owners.
10.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
10.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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19-May-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DAC1282AIPW
ACTIVE
TSSOP
PW
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
DAC1282A
DAC1282AIPWR
ACTIVE
TSSOP
PW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
DAC1282A
DAC1282IPW
ACTIVE
TSSOP
PW
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
DAC1282
DAC1282IPWR
ACTIVE
TSSOP
PW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
DAC1282
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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19-May-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DAC1282AIPWR
TSSOP
PW
24
2000
330.0
16.4
6.95
8.3
1.6
8.0
16.0
Q1
DAC1282IPWR
TSSOP
PW
24
2000
330.0
16.4
6.95
8.3
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC1282AIPWR
TSSOP
PW
24
2000
367.0
367.0
38.0
DAC1282IPWR
TSSOP
PW
24
2000
367.0
367.0
38.0
Pack Materials-Page 2
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