LCD EMI Filter Array with ESD Protection CM1405 Features Product Description • • California Micro Device's CM1405 is an EMI filter array with ESD protection, which integrates eight Pifilters (C-R-C). The CM1405 has component values of 25pF-100W-25pF. The parts include avalanchetype ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of •30kV, exceeding the maximum requirement of the IEC61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than •30kV. • • • • • • Eight channels of EMI filtering 30kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) 30kV ESD protection on each channel (HBM) Better than 35dB of attenuation at 800-2700MHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package OptiGuard™ coated version available for improved reliability at assembly RoHS-compliant, lead-free finishing Applications • • • • • • • LCD data lines in mobile handsets EMI filtering & ESD protection for high-speed I/O ports EMI filtering for high-speed data lines Wireless handsets Cell phones Notebook computers PDAs / Handheld PCs This device is particularly well-suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easyto-use pin assignments. In particular, the CM1405 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in mobile handsets. The CM1405-03 incorporates OptiGuardä coating which results in improved reliability at assembly and is available in space-saving, low-profile chip-scale packages with RoHS-compliant, lead-free finishing. The CM1400-03 incorporates OptiGuard™ coating which results in improved reliability at assembly. The CM1400-03 is available in a space-saving, low-profile chip scale package with RoHS compliant lead-free finishing. ©2010 SCILLC. All rights reserved. April 2010 Rev.2 Publication Order Number: CM1405/D CM1405 Block Diagram Rev. 2 | Page 2 of 14 | www.onsemi.com CM1405 PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION PIN(s) NAME DESCRIPTION A1 FILTER1 Filter Channel 1 C1 FILTER1 Filter Channel 1 A2 FILTER2 Filter Channel 2 C2 FILTER2 Filter Channel 2 A3 FILTER3 Filter Channel 3 C3 FILTER3 Filter Channel 3 A4 FILTER4 Filter Channel 4 C4 FILTER4 Filter Channel 4 A5 FILTER5 Filter Channel 5 C5 FILTER5 Filter Channel 5 A6 FILTER6 Filter Channel 6 C6 FILTER6 Filter Channel 6 A7 FILTER7 Filter Channel 7 C7 FILTER7 Filter Channel 7 A8 FILTER8 Filter Channel 8 C8 FILTER8 Filter Channel 8 B1-B4 GND Device Ground Ordering Information PART NUMBERING INFORMATION 2 Standard Finish Lead-free Finish TM No Coating Optiguard Coated TM -No Coating Optiguard Coated Bumps PKG Ordering Part 1 Number Part Marking Ordering Part 1 Number Part Marking Ordering Part 1 Number Part Marking Ordering Part 1 Number Part Marking 20 CSP CM1405-01CS N051 CM1405-03CS N053 CM1405-01CP N051 CM1405-03CP N053 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW Storage Temperature Range Rev. 2 | Page 3 of 14 | www.onsemi.com CM1405 STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING UNITS -40 to +85 °C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS 80 100 120 Ω 20 25 30 pF R Resistance C Capacitance At 2.5V DC, 1MHz, 30mV AC Diode Standoff Voltage IDIODE = 10μA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE = +3.3V 0.1 1 μA VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -0.8 9.0 -0.4 V V VDIODE VESD RDYN f C In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Note 2 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω 5.6 -1.5 V 30 kV 30 kV 1.5 0.9 Ω Ω 70 MHz R = 100Ω, C = 25pF Note 1: TA = 25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Rev. 2 | Page 4 of 14 | www.onsemi.com CM1405 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. A1-C1 EMI Filter Performance Figure 2. A2-C2 EMI Filter Performance Rev. 2 | Page 5 of 14 | www.onsemi.com CM1405 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. A3-C3 EMI Filter Performance Figure 4. A4-C4 EMI Filter Performance Rev. 2 | Page 6 of 14 | www.onsemi.com CM1405 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 5. A5-C5 EMI Filter Performance Figure 6. A6-C6 EMI Filter Performance Rev. 2 | Page 7 of 14 | www.onsemi.com CM1405 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 7. A7-C7 EMI Filter Performance Figure 8. A8-C8 EMI Filter Performance Rev. 2 | Page 8 of 14 | www.onsemi.com CM1405 Performance Information (cont’d) Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Figure 9. Rev. 2 | Page 9 of 14 | www.onsemi.com CM1405 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 10 of 14 | www.onsemi.com 260°C CM1405 Mechanical Details CM1405-01 Mechanical Specifications The package dimensions for the CM1405-01 are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Millimeters Inches Dim Min Nom Max Min Nom Max A1 3.955 4.000 4.045 0.1557 0.1575 0.1593 A2 1.413 1.458 1.503 0.0556 0.0574 0.0592 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.200 0.250 0.300 0.0079 0.0098 0.0118 C2 0.244 0.294 0.344 0.0096 0.0116 0.0135 D1 0.562 0.606 0.650 0.0221 0.0239 0.0256 D2 0.356 0.381 0.406 0.0140 0.0150 0.0160 # per tape and reel Package Dimensions for CM1405-01 Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 11 of 14 | www.onsemi.com CM1405 Mechanical Details (cont’d) CM1405-03 Mechanical Specifications The package dimensions for the CM1405-03 are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Millimeters Inches Dim Min Nom Max Min Nom Max A1 3.955 4.000 4.045 0.1557 0.1575 0.1593 A2 1.413 1.458 1.503 0.0556 0.0574 0.0592 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.200 0.250 0.300 0.0079 0.0098 0.0118 C2 0.244 0.294 0.344 0.0096 0.0116 0.0135 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1405-03 Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 12 of 14 | www.onsemi.com CM1405 CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 4.00 X 1.46 X 0.606 4.11 X 1.57 X 0.76 12mm 330mm (13") 3500 4mm 4mm 4.00 X 1.46 X 0.644 4.11 X 1.57 X 0.76 12mm 330mm (13") 3500 4mm 4mm PART NUMBER CHIP SIZE (mm) CM1405-01 CM1405-03 Figure 13. Tape and Reel Mechanical Data Rev. 2 | Page 13 of 14 | www.onsemi.com CM1405 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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