ON MT9V034C12STC-DR Wide-vga cmos digital image sensor Datasheet

MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Features
1/3-Inch Wide-VGA CMOS Digital Image Sensor
MT9V034 Datasheet, Rev. G
For the latest data sheet revision, please visit www.onsemi.com
Features
Table 1:
• Array format: Wide-VGA, active 752H x 480V
(360,960 pixels)
• Global shutter photodiode pixels; simultaneous
integration and readout
• RGB Bayer or Monochrome: NIR enhanced
performance for use with non-visible NIR
illumination
• Readout modes: progressive or interlaced
• Shutter efficiency: >99%
• Simple two-wire serial interface
• Real-time exposure context switching - dual register
set
• Register lock capability
• Window size: User programmable to any smaller
format (QVGA, CIF, QCIF). Data rate can be
maintained independent of window size
• Binning: 2 x 2 and 4 x 4 of the full resolution
• ADC: On-chip, 10-bit column-parallel (option to
operate in 12-bit to 10-bit companding mode)
• Automatic controls: Auto exposure control (AEC)
and auto gain control (AGC); variable regional and
variable weight AEC/AGC
• Support for four unique serial control register IDs to
control multiple imagers on the same bus
• Data output formats:
– Single sensor mode:
10-bit parallel/stand-alone
8-bit or 10-bit serial LVDS
– Stereo sensor mode:
Interspersed 8-bit serial LVDS
• High dynamic range (HDR) mode
Key Performance Parameters
Parameter
Value
Optical format
1/3-inch
4.51mm(H) x 2.88mm(V)
5.35mm diagonal
752H x 480V
6.0m x 6.0m
Monochrome or color RGB Bayer
Global shutter
27 Mp/s
27 MHz
752 x 480
60 fps (at full resolution)
10-bit column-parallel
4.8 V/lux-sec (550nm)
>55dB linear;
>100dB in HDR mode
3.3V +0.3Vall supplies)
<160mW at maximum data rate
(LVDS disabled); 120W standby
power at 3.3V
-30°C to +70°C ambient
48-pin CLCC
Active imager size
Active pixels
Pixel size
Color filter array
Shutter type
Maximum data rate
master clock
Full resolution
Frame rate
ADC resolution
Responsivity
Dynamic range
Supply voltage
Power consumption
Operating temperature
Packaging
Applications
•
•
•
•
•
•
•
Security
High dynamic range imaging
Unattended surveillance
Stereo vision
Video as input
Machine vision
Automation
MT9V034_DS Rev.G Pub. 4/15 EN
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©Semiconductor Components Industries, LLC,2015
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Ordering Information
Ordering Information
Table 2:
Available Part Numbers
Part Number
Product Description
Orderable Product Attribute Description
MT9V034C12STC-DP
VGA 1/3" GS CIS
Dry Pack with Protective Film
MT9V034C12STC-DR
VGA 1/3" GS CIS
Dry Pack without Protective Film
MT9V034C12STM-DP
VGA 1/3" GS CIS
Dry Pack with Protective Film
MT9V034C12STM-DR
VGA 1/3" GS CIS
Dry Pack without Protective Film
MT9V034C12STM-DR1
VGA 1/3" GS CIS
Dry Pack Single Tray without Protective Film
MT9V034C12STM-TP
VGA 1/3" GS CIS
Tape & Reel with Protective Film
MT9V034C12STM-TR
VGA 1/3" GS CIS
Tape & Reel without Protective Film
MT9V034D00STMC13CC1-200
VGA 1/3" GS CIS
Die Sales, 200ìm Thickness
MT9V034W00STMC13CC1-750
VGA 1/3" GS CIS
Wafer Sales, 750ìm Thickness
MT9V034_DS Rev.G Pub. 4/15 EN
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©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Table of Contents
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Pixel Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Color (RGB Bayer) Device Limitations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Output Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Serial Bus Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Two-Wire Serial Interface Sample Read and Write Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Feature Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Appendix A: Power-On Reset and Standby Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
Appendix B: Electrical Identification of CFA Type. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
MT9V034_DS Rev.G Pub. 4/15 EN
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©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
List of Figures
List of Figures
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Figure 49:
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
48-Pin CLCC Package Pinout Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Typical Configuration (Connection)—Parallel Output Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Pixel Array Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Pixel Color Pattern Detail RGB Bayer (Top Right Corner) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Spatial Illustration of Image Readout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Timing Example of Pixel Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Row Timing and FRAME_VALID/LINE_VALID Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Timing Diagram Showing a Write to R0x09 with the Value 0x0284 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Timing Diagram Showing a Read from R0x09; Returned Value 0x0284 . . . . . . . . . . . . . . . . . . . . . . . . .18
Timing Diagram Showing a Bytewise Write to R0x09 with the Value 0x0284 . . . . . . . . . . . . . . . . . . . .19
Timing Diagram Showing a Bytewise Read from R0x09; Returned Value 0x0284 . . . . . . . . . . . . . . . .19
Simultaneous Master Mode Synchronization Waveforms #1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Simultaneous Master Mode Synchronization Waveforms #2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Sequential Master Mode Synchronization Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Snapshot Mode Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Snapshot Mode Frame Synchronization Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Exposure and Readout Timing (Simultaneous Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Exposure and Readout Timing (Sequential Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Signal Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Latency of Exposure Register in Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Sequence of Control Voltages at the HDR Gate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Sequence of Voltages in a Piecewise Linear Pixel Response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
12- to 10-Bit Companding Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Latency of Gain Register(s) in Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Tiled Sample . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Black Level Calibration Flow Chart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Controllable and Observable AEC/AGC Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
Readout of Six Pixels in Normal and Column Flip Output Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Readout of Six Rows in Normal and Row Flip Output Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Readout of Eight Pixels in Normal and Row Bin Output Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Readout of 8 Pixels in Normal and Column Bin Output Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Spatial Illustration of Interlaced Image Readout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Different LINE_VALID Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Serial Output Format for a 6x2 Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
LVDS Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Propagation Delays for PIXCLK and Data Out Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Propagation Delays for FRAME_VALID and LINE_VALID Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Two-Wire Serial Bus Timing Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Serial Host Interface Start Condition Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Serial Host Interface Stop Condition Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Serial Host Interface Data Timing for WRITE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Serial Host Interface Data Timing for READ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
Acknowledge Signal Timing After an 8-Bit WRITE to the Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
Acknowledge Signal Timing After an 8-Bit READ from the Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
Typical Quantum Efficiency—RGB Bayer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Typical Quantum Efficiency—Monochrome . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
48-Pin CLCC Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Power-up, Reset, Clock, and Standby Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
MT9V034_DS Rev.G Pub. 4/15 EN
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©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
List of Tables
List of Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Table 15:
Table 16:
Table 17:
Table 18:
Table 19:
Key Performance Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Available Part Numbers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Frame Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Frame Time—Long Integration Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Slave Address Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Real-Time Context-Switchable Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Recommended Register Settings and Performance Impact (Reserved Registers) . . . . . . . . . . . . . . . .22
LVDS Packet Format in Stand-Alone Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
LVDS Packet Format in Stereoscopy Mode (Stereoscopy Mode Bit Asserted) . . . . . . . . . . . . . . . . . . .48
Reserved Words in the Pixel Data Stream . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
SER_DATAOUT_* state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
SHFT_CLK_* state. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
LVDS AC Timing Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
DC Electrical Characteristics Over Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
Two-Wire Serial Bus Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
MT9V034_DS Rev.G Pub. 4/15 EN
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©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
General Description
General Description
The MT9V034 is a 1/3-inch wide-VGA format CMOS active-pixel digital image sensor
with global shutter and high dynamic range (HDR) operation. The sensor has specifically been designed to support the demanding interior and exterior surveillance
imaging needs, which makes this part ideal for a wide variety of imaging applications in
real-world environments.
This wide-VGA CMOS image sensor features ON Semiconductor’s breakthrough
low-noise CMOS imaging technology that achieves CCD image quality (based on
signal-to-noise ratio and low-light sensitivity) while maintaining the inherent size, cost,
and integration advantages of CMOS.
The active imaging pixel array is 752H x 480V. It incorporates sophisticated camera functions on-chip—such as binning 2 x 2 and 4 x 4, to improve sensitivity when operating in
smaller resolutions—as well as windowing, column and row mirroring. It is programmable through a simple two-wire serial interface.
The MT9V034 can be operated in its default mode or be programmed for frame size,
exposure, gain setting, and other parameters. The default mode outputs a
wide-VGA-size image at 60 frames per second (fps).
An on-chip analog-to-digital converter (ADC) provides 10 bits per pixel. A 12-bit resolution companded for 10 bits for small signals can be alternatively enabled, allowing more
accurate digitization for darker areas in the image.
In addition to a traditional, parallel logic output the MT9V034 also features a serial lowvoltage differential signaling (LVDS) output. The sensor can be operated in a stereocamera, and the sensor, designated as a stereo-master, is able to merge the data from
itself and the stereo-slave sensor into one serial LVDS stream.
The sensor is designed to operate in a wide temperature range (–30°C to +70°C).
Figure 1:
Block Diagram
Control Register
Active-Pixel
Sensor (APS)
Array
752H x 480V
Serial
Register
I/O
Timing and Control
Analog Processing
ADCs
Digital Processing
Slave Video LVDS In
(for stereo applications only)
MT9V034_DS Rev.G Pub. 4/15 EN
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Parallel
Video
Data Out
Serial Video
LVDS Out
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
General Description
DOUT0
DOUT1
DOUT2
1
PIXCLK
2
SYSCLK
3
DGND
4
VDD
SER_DATAOUT_N
5
SHFT_CLKOUT_N
SER_DATAOUT_P
6
SHFT_CLKOUT_P
VDDLVDS
48-Pin CLCC Package Pinout Diagram
48
47
46
45
44
43
BYPASS_CLKIN_P
9
40
VAAPIX
SER_DATAIN_N
10
39
VAA
SER_DATAIN_P
11
38
AGND
LVDSGND
12
37
NC
DGND
13
36
NC
VDD
14
35
VAA
DOUT5
15
34
AGND
DOUT6
16
33
STANDBY
DOUT7
17
32
RESET_BAR
DOUT8
18
31
S_CTRL_ADR1
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23
24
SDATA
21
FRAME_VALID
20
LINE_VALID
19
7
25
26
27
28
29
30
S_CTRL_ADR0
DOUT4
RSVD
41
OE
8
LED_OUT
BYPASS_CLKIN_N
STFRM_OUT
DOUT3
SCLK
42
EXPOSURE
7
STLN_OUT
LVDSGND
DOUT9
Figure 2:
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Pin Descriptions
Pin Descriptions
Table 3:
Pin Descriptions
48-Pin CLCC
Numbers
29
Symbol
Type
Description
RSVD
Input
Connect to DGND.
10
SER_DATAIN_N
Input
Serial data in for stereoscopy (differential negative). Tie to 1K
pull-up (to 3.3V) in non-stereoscopy mode.
11
SER_DATAIN_P
Input
Serial data in for stereoscopy (differential positive). Tie to DGND in
non-stereoscopy mode.
8
BYPASS_CLKIN_N
Input
Input bypass shift-CLK (differential negative). Tie to 1K pull-up
(to 3.3V) in non-stereoscopy mode.
9
BYPASS_CLKIN_P
Input
Input bypass shift-CLK (differential positive). Tie to DGND in nonstereoscopy mode.
23
EXPOSURE
Input
Rising edge starts exposure in snapshot and slave modes.
25
SCLK
Input
Two-wire serial interface clock. Connect to VDD with 1.5K resistor
even when no other two-wire serial interface peripheral is
attached.
Note
1
28
OE
Input
DOUT enable pad, active HIGH.
30
S_CTRL_ADR0
Input
Two-wire serial interface slave address select (see Table 6 on
page 17).
31
S_CTRL_ADR1
Input
Two-wire serial interface slave address select (see Table 6 on
page 17).
32
RESET_BAR
Input
Asynchronous reset. All registers assume defaults.
33
STANDBY
Input
Shut down sensor operation for power saving.
47
SYSCLK
Input
Master clock (26.6 MHz; 13 MHz – 27 MHz).
24
SDATA
I/O
Two-wire serial interface data. Connect to VDD with 1.5K resistor
even when no other two-wire serial interface peripheral is
attached.
22
STLN_OUT
I/O
Output in master mode—start line sync to drive slave chip inphase; input in slave mode.
26
STFRM_OUT
I/O
Output in master mode—start frame sync to drive a slave chip inphase; input in slave mode.
20
LINE_VALID
Output
Asserted when DOUT data is valid.
21
FRAME_VALID
Output
Asserted when DOUT data is valid.
15
DOUT5
Output
Parallel pixel data output 5.
16
DOUT6
Output
Parallel pixel data output 6.
17
DOUT7
Output
Parallel pixel data output 7.
18
DOUT8
Output
Parallel pixel data output 8.
19
DOUT9
Output
Parallel pixel data output 9.
27
LED_OUT
Output
LED strobe output.
41
DOUT4
Output
Parallel pixel data output 4.
42
DOUT3
Output
Parallel pixel data output 3.
43
DOUT2
Output
Parallel pixel data output 2.
44
DOUT1
Output
Parallel pixel data output 1.
45
DOUT0
Output
Parallel pixel data output 0.
46
PIXCLK
Output
Pixel clock out. DOUT is valid on rising edge of this clock.
2
SHFT_CLKOUT_N
Output
Output shift CLK (differential negative).
MT9V034_DS Rev.G Pub. 4/15 EN
8
2
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Pin Descriptions
Table 3:
Pin Descriptions (continued)
48-Pin CLCC
Numbers
3
Symbol
Type
SHFT_CLKOUT_P
Output
Output shift CLK (differential positive).
4
SER_DATAOUT_N
Output
Serial data out (differential negative).
5
SER_DATAOUT_P
Output
Serial data out (differential positive).
1, 14
VDD
Supply
Digital power 3.3V.
35, 39
VAA
Supply
Analog power 3.3V.
40
VAAPIX
Supply
Pixel power 3.3V.
Description
Note
6
VDDLVDS
Supply
Dedicated power for LVDS pads.
7, 12
LVDSGND
Ground
Dedicated GND for LVDS pads.
13, 48
DGND
Ground
Digital GND.
34, 38
AGND
Ground
Analog GND.
36, 37
NC
NC
No connect.
Notes:
Figure 3:
3
1. Pin 29, (RSVD) must be tied to GND.
2. Output enable (OE) tri-states signals DOUT0–DOUT9, LINE_VALID, FRAME_VALID, and PIXCLK.
3. No connect. These pins must be left floating for proper operation.
Typical Configuration (Connection)—Parallel Output Mode
10KΩ
1.5KΩ
Master Clock
VDDLVDS
VDD
VAA
VAAPIX
VDD
VAA
VAAPIX
DOUT(9:0)
LINE_VALID
FRAME_VALID
PIXCLK
SYSCLK
OE
RESET_BAR
EXPOSURE
STANDBY
S_CTRL_ADR0
S_CTRL_ADR1
SCLK
SDATA
STANDBY from
Controller or
Digital GND
Two-Wire
Serial Interface
RSVD
LED_OUT
ERROR
LVDSGND
DGND
To Controller
To LED output
AGND
0.1μF
Note:
MT9V034_DS Rev.G Pub. 4/15 EN
LVDS signals are to be left floating.
9
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Pixel Data Format
Pixel Data Format
Pixel Array Structure
The MT9V034 pixel array is configured as 809 columns by 499 rows, shown in Figure 4.
The dark pixels are optically black and are used internally to monitor black level. Of the
left 52 columns, 36 are dark pixels used for row noise correction. Of the top 14 rows of
pixels, two of the dark rows are used for black level correction. Also, three black rows
from the top black rows can be read out by setting the show dark rows bit in the Read
Mode register; setting show dark columns will display the 36 dark columns. There are
753 columns by 481 rows of optically active pixels. While the sensor's format is 752 x 480,
one additional active column and active row are included for use when horizontal or
vertical mirrored readout is enabled, to allow readout to start on the same pixel. This one
pixel adjustment is always performed, for monochrome or color versions. The active
area is surrounded with optically transparent dummy pixels to improve image uniformity within the active area. Neither dummy pixels nor barrier pixels can be read out.
Figure 4:
Pixel Array Description
(0, 0)
active pixel
2 barrier + 8 (2 + 4 addressed + 2) dark + 2 barrier + 2 light dummy
4.92 x 3.05mm2
Pixel Array
809 x 499 (753 x 481 active)
6.0μm pixel
light dummy pixel
dark pixel
3 barrier + 38 (1 + 36 addressed + 1) dark
+ 9 barrier + 2 light dummy
2 barrier + 2 light dummy
2 barrier + 2 light dummy
MT9V034_DS Rev.G Pub. 4/15 EN
10
barrier pixel
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Pixel Data Format
Figure 5:
Pixel Color Pattern Detail RGB Bayer (Top Right Corner)
Column Readout Direction
Row Readout Direction
MT9V034_DS Rev.G Pub. 4/15 EN
Active Pixel (0,0)
Array Pixel (4,14)
G B
G
B G
B G
B
R G
R
G R
G R
G
G B
G
B G
B G
B
R G
R
G R
G R
G
G B
G
B G
B G
B
R G
R
G R
G R
G
11
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Color (RGB Bayer) Device Limitations
Color (RGB Bayer) Device Limitations
The color version of the MT9V034 does not support or offers reduced performance for
the following functionalities.
Pixel Binning
Pixel binning is done on immediate neighbor pixels only, no facility is provided to skip
pixels according to a Bayer pattern. Therefore, the result of binning combines pixels of
different colors. See “Pixel Binning” on page 41 for additional information.
Interlaced Readout
Interlaced readout yields one field consisting only of red and green pixels and another
consisting only of blue and green pixels. This is due to the Bayer pattern of the CFA.
Automatic Black Level Calibration
When the color bit is set (R0x0F[1]=1), the sensor uses black level correction values from
one green plane, which are applied to all colors. To use the calibration value based on all
dark pixels' offset values, the color bit should be cleared.
Defective Pixel Correction
For defective pixel correction to calculate replacement pixel values correctly, for color
sensors the color bit must be set (R0x0F[1] = 1). However, the color bit also applies
unequal offset to the color planes, and the results might not be acceptable for some
applications.
Other Limiting Factors
Black level correction and row-wise noise correction are applied uniformly to each color.
The row-wise noise correction algorithm does not work well in color sensors. Automatic
exposure and gain control calculations are made based on all three colors, not just the
green channel. High dynamic range does operate in color; however, ON Semiconductor
strongly recommends limiting use to linear operation where good color fidelity is
required.
MT9V034_DS Rev.G Pub. 4/15 EN
12
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Output Data Format
Output Data Format
The MT9V034 image data can be read out in a progressive scan or interlaced scan mode.
Valid image data is surrounded by horizontal and vertical blanking, as shown in Figure 6.
The amount of horizontal and vertical blanking is programmable through R0x05 and
R0x06, respectively (R0xCD and R0xCE for context B). LV is HIGH during the shaded
region of the figure. See “Output Data Timing” on page 14 for the description of FV
timing.
Figure 6:
Spatial Illustration of Image Readout
P0,0 P0,1 P0,2.....................................P0,n-1 P0,n
P1,0 P1,1 P1,2.....................................P1,n-1 P1,n
HORIZONTAL
BLANKING
VALID IMAGE
Pm-1,0 Pm-1,1.....................................Pm-1,n-1 Pm-1,n
Pm,0 Pm,1.....................................Pm,n-1 Pm,n
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
00 00 00 ..................................... 00 00 00
00 00 00 ..................................... 00 00 00
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
VERTICAL/HORIZONTAL
BLANKING
VERTICAL BLANKING
00 00 00 ..................................... 00 00 00
00 00 00 ..................................... 00 00 00
MT9V034_DS Rev.G Pub. 4/15 EN
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
13
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Output Data Format
Output Data Timing
The data output of the MT9V034 is synchronized with the PIXCLK output. When
LINE_VALID (LV) is HIGH, one 10-bit pixel datum is output every PIXCLK period.
Figure 7:
Timing Example of Pixel Data
...
LINE_VALID
...
PIXCLK
Blanking
P0
(9:0)
DOUT(9:0)
...
Valid Image Data
P1
(9:0)
P2
(9:0)
P3
(9:0)
Blanking
...
P4
(9:0)
Pn-1
(9:0)
Pn
(9:0)
The PIXCLK is a nominally inverted version of the master clock (SYSCLK). This allows
PIXCLK to be used as a clock to latch the data. However, when column bin 2 is enabled,
the PIXCLK is HIGH for one complete master clock master period and then LOW for one
complete master clock period; when column bin 4 is enabled, the PIXCLK is HIGH for
two complete master clock periods and then LOW for two complete master clock
periods. It is continuously enabled, even during the blanking period. Setting R0x72
bit[4] = 1 causes the MT9V034 to invert the polarity of the PIXCLK.
The parameters P1, A, Q, and P2 in Figure 8 are defined in Table 4.
Figure 8:
Row Timing and FRAME_VALID/LINE_VALID Signals
...
FRAME_VALID
...
LINE_VALID
...
Number of master clocks
Table 4:
P1
A
Q
A
Q
A
P2
Frame Time
Parameter
Name
Equation
Default Timing at 26.66 MHz
A
Active data time
Context A: R0x04
Context B: R0xCC
752 pixel clocks
= 752 master
= 28.20s
P1
Frame start blanking
Context A: R0x05 - 23
Context B: R0xCD - 23
71 pixel clocks
= 71master
= 2.66s
P2
Frame end blanking
23 (fixed)
23 pixel clocks
= 23 master
= 0.86s
Q
Horizontal blanking
Context A: R0x05
Context B: R0xCD
94 pixel clocks
= 94 master
= 3.52s
MT9V034_DS Rev.G Pub. 4/15 EN
14
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Output Data Format
Table 4:
Frame Time (continued)
Parameter
Name
Equation
Default Timing at 26.66 MHz
A+Q
Row time
Context A: R0x04 + R0x05
Context B: R0xCC + R0xCD
846 pixel clocks
= 846 master
= 31.72s
V
Vertical blanking
Context A: (R0x06) x (A + Q) + 4
Context B: (R0xCE) x (A + Q) + 4
38,074 pixel clocks
= 38,074 master
= 1.43ms
Nrows x (A + Q)
Frame valid time
Context A: (R0x03) × (A + Q)
Context B: (R0xCB) x (A + Q)
406,080 pixel clocks
= 406,080 master
= 15.23ms
F
Total frame time
V + (Nrows x (A + Q))
444,154 pixel clocks
= 444,154 master
= 16.66ms
Sensor timing is shown above in terms of pixel clock and master clock cycles (refer to
Figure 7 on page 14). The recommended master clock frequency is 26.66 MHz. The
vertical blanking and the total frame time equations assume that the integration time
(coarse shutter width plus fine shutter width) is less than the number of active rows plus
the blanking rows minus the overhead rows:
Window Height + Vertical Blanking – 2
(EQ 1)
If this is not the case, the number of integration rows must be used instead to determine
the frame time, as shown in Table 5. In this example, it is assumed that the coarse shutter
width control is programmed with 523 rows and the fine shutter width total is zero.
For Simultaneous mode, if the exposure time registers (coarse shutter width total plus
Fine Shutter Width Total) exceed the total readout time, then the vertical blanking time
is internally extended automatically to adjust for the additional integration time
required. This extended value is not written back to the vertical blanking registers. The
vertical blank register can be used to adjust frame-to-frame readout time. This register
does not affect the exposure time but it may extend the readout time.
Table 5:
Frame Time—Long Integration Time
Name
Equation
(Number of Master Clock Cycles)
Default Timing
at 26.66 MHz
V’
Vertical blanking (long
integration time)
Context A: (R0x0B + 2 - R0x03) × (A + Q) + R0xD5 + 4
Context B: (R0xD2 + 2 - R0xCB) x (A + Q) + R0xD8 + 4
38,074 pixel clocks
= 38,074 master
= 1.43ms
F’
Total frame time (long
integration time)
Context A: (R0x0B + 2) × (A + Q) + R0xD5 + 4
Context B: (R0xD2 + 2) x (A + Q) + R0xD8 + 4
444,154 pixel clocks
= 444,154 master
= 16.66ms
Parameter
Note:
MT9V034_DS Rev.G Pub. 4/15 EN
The MT9V034 uses column parallel analog-digital converters; thus short row timing is not possible. The minimum total row time is 704 columns (horizontal width + horizontal blanking). The
minimum horizontal blanking is 61 for normal mode, 71 for column bin 2 mode, and 91 for column bin 4 mode. When the window width is set below 643, horizontal blanking must be
increased. In binning mode, the minimum row time is R0x04+R0x05 = 704.
15
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Serial Bus Description
Serial Bus Description
Registers are written to and read from the MT9V034 through the two-wire serial interface bus. The MT9V034 is a serial interface slave with four possible IDs (0x90, 0x98, 0xB0
and 0xB8) determined by the S_CTRL_ADR0 and S_CTRL_ADR1 input pins. Data is
transferred into the MT9V034 and out through the serial data (SDATA) line. The SDATA
line is pulled up to VDD off-chip by a 1.5K resistor. Either the slave or master device can
pull the SDATA line down—the serial interface protocol determines which device is
allowed to pull the SDATA line down at any given time. The registers are 16-bit wide, and
can be accessed through 16- or 8-bit two-wire serial interface sequences.
Protocol
The two-wire serial interface defines several different transmission codes, as shown in
the following sequence:
1. a start bit
2. the slave device 8-bit address
3. a(n) (no) acknowledge bit
4. an 8-bit message
5. a stop bit
Start Bit
The start bit is defined as a HIGH-to-LOW transition of the data line while the clock line
is HIGH.
Slave Address
The 8-bit address of a two-wire serial interface device consists of 7 bits of address and
1 bit of direction. A “0” in the LSB of the address indicates write mode, and a “1” indicates read mode. As indicated above, the MT9V034 allows four possible slave addresses
determined by the two input pins, S_CTRL_ADR0 and S_CTRL_ADR1.
Acknowledge Bit
The master generates the acknowledge clock pulse. The transmitter (which is the master
when writing, or the slave when reading) releases the data line, and the receiver indicates an acknowledge bit by pulling the data line LOW during the acknowledge clock
pulse.
No-Acknowledge Bit
The no-acknowledge bit is generated when the data line is not pulled down by the
receiver during the acknowledge clock pulse. A no-acknowledge bit is used to terminate
a read sequence.
Stop Bit
The stop bit is defined as a LOW-to-HIGH transition of the data line while the clock line
is HIGH.
MT9V034_DS Rev.G Pub. 4/15 EN
16
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Serial Bus Description
Sequence
A typical READ or WRITE sequence begins by the master sending a start bit. After the
start bit, the master sends the slave device’s 8-bit address. The last bit of the address
determines if the request is a read or a write, where a “0” indicates a WRITE and a “1”
indicates a READ. The slave device acknowledges its address by sending an acknowledge
bit back to the master.
If the request was a WRITE, the master then transfers the 8-bit register address to which
a WRITE should take place. The slave sends an acknowledge bit to indicate that the
register address has been received. The master then transfers the data 8 bits at a time,
with the slave sending an acknowledge bit after each 8 bits. The MT9V034 uses 16-bit
data for its internal registers, thus requiring two 8-bit transfers to write to one register.
After 16 bits are transferred, the register address is automatically incremented, so that
the next 16 bits are written to the next register address. The master stops writing by
sending a start or stop bit.
A typical READ sequence is executed as follows. First the master sends the write mode
slave address and 8-bit register address, just as in the write request. The master then
sends a start bit and the read mode slave address. The master then clocks out the register
data 8 bits at a time. The master sends an acknowledge bit after each 8-bit transfer. The
register address is automatically incremented after every 16 bits is transferred. The data
transfer is stopped when the master sends a no-acknowledge bit. The MT9V034 allows
for 8-bit data transfers through the two-wire serial interface by writing (or reading) the
most significant 8 bits to the register and then writing (or reading) the least significant 8
bits to byte-wise address register (0x0F0).
Bus Idle State
The bus is idle when both the data and clock lines are HIGH. Control of the bus is initiated with a start bit, and the bus is released with a stop bit. Only the master can generate
the start and stop bits.
Table 6:
Slave Address Modes
{S_CTRL_ADR1, S_CTRL_ADR0}
00
01
10
11
Slave Address
Write/Read Mode
0x90
0x91
0x98
0x99
0xB0
0xB1
0xB8
0xB9
Write
Read
Write
Read
Write
Read
Write
Read
Data Bit Transfer
One data bit is transferred during each clock pulse. The two-wire serial interface clock
pulse is provided by the master. The data must be stable during the HIGH period of the
serial clock—it can only change when the two-wire serial interface clock is LOW. Data is
transferred 8 bits at a time, followed by an acknowledge bit.
MT9V034_DS Rev.G Pub. 4/15 EN
17
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Two-Wire Serial Interface Sample Read and Write Sequences
Two-Wire Serial Interface Sample Read and Write Sequences
16-Bit Write Sequence
A typical write sequence for writing 16 bits to a register is shown in Figure 9. A start bit
given by the master, followed by the write address, starts the sequence. The image sensor
then gives an acknowledge bit and expects the register address to come first, followed by
the 16-bit data. After each 8-bit the image sensor gives an acknowledge bit. All 16 bits
must be written before the register is updated. After 16 bits are transferred, the register
address is automatically incremented, so that the next 16 bits are written to the next
register. The master stops writing by sending a start or stop bit.
Figure 9:
Timing Diagram Showing a Write to R0x09 with the Value 0x0284
SCLK
SDATA
R0x09
0xB8 ADDR
START
ACK
0000 0010
ACK
1000 0100
ACK
STOP
ACK
16-Bit Read Sequence
A typical read sequence is shown in Figure 10. First the master has to write the register
address, as in a write sequence. Then a start bit and the read address specifies that a read
is about to happen from the register. The master then clocks out the register data 8 bits
at a time. The master sends an acknowledge bit after each 8-bit transfer. The register
address is auto-incremented after every 16 bits is transferred. The data transfer is
stopped when the master sends a no-acknowledge bit.
Figure 10:
Timing Diagram Showing a Read from R0x09; Returned Value 0x0284
SCLK
SDATA
0xB8 ADDR
START
MT9V034_DS Rev.G Pub. 4/15 EN
R0x09
ACK
0xB9 ADDR
ACK
ACK
18
1000 0100
0000 0010
ACK
STOP
NACK
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Two-Wire Serial Interface Sample Read and Write Sequences
8-Bit Write Sequence
To be able to write 1 byte at a time to the register a special register address is added. The
8-bit write is done by first writing the upper 8 bits to the desired register and then writing
the lower 8 bits to the Bytewise Address register (R0xF0). The register is not updated until
all 16 bits have been written. It is not possible to just update half of a register. In
Figure 11, a typical sequence for 8-bit writing is shown. The second byte is written to the
Bytewise register (R0xF0).
Figure 11:
Timing Diagram Showing a Bytewise Write to R0x09 with the Value 0x0284
SCLK
SDATA
0xB8 ADDR
0000 0010
R0x09
0xB8 ADDR
1000 0100
R0xF0
STOP
START
ACK
START
ACK
ACK
ACK
ACK
ACK
8-Bit Read Sequence
To read one byte at a time the same special register address is used for the lower byte.
The upper 8 bits are read from the desired register. By following this with a read from the
byte-wise address register (R0xF0) the lower 8 bits are accessed (Figure 12). The master
sets the no-acknowledge bits shown.
Figure 12:
Timing Diagram Showing a Bytewise Read from R0x09; Returned Value 0x0284
SCLK
SDATA
0xB8 ADDR
0xB9 ADDR
R0x09
0000 0010
START
START
ACK
ACK
NACK
ACK
SCLK
SDATA
0xB8 ADDR
0xB9 ADDR
R0xF0
1000 0100
STOP
START
START
MT9V034_DS Rev.G Pub. 4/15 EN
ACK
ACK
19
ACK
NACK
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Two-Wire Serial Interface Sample Read and Write Sequences
Register Lock
Included in the MT9V034 is a register lock (R0xFE) feature that can be used as a solution
to reduce the probability of an inadvertent noise-triggered two-wire serial interface
write to the sensor. All registers, or only the read mode registers–R0x0D and R0x0E, can
be locked. It is important to prevent an inadvertent two-wire serial interface write to the
read mode registers in automotive applications since this register controls the image
orientation and any unintended flip to an image can cause serious results.
At power-up, the register lock defaults to a value of 0xBEEF, which implies that all
registers are unlocked and any two-wire serial interface writes to the register gets
committed.
Lock All Registers
If a unique pattern (0xDEAD) to R0xFE is programmed, any subsequent two-wire serial
interface writes to registers (except R0xFE) are NOT committed. Alternatively, if the user
writes a 0xBEEF to the register lock register, all registers are unlocked and any
subsequent two-wire serial interface writes to the register are committed.
Lock Only Read Mode Registers (R0x0D and R0x0E)
If a unique pattern (0xDEAF) to R0xFE is programmed, any subsequent two-wire serial
interface writes to R0x0D or R0x0E are NOT committed. Alternatively, if the user writes a
0xBEEF to register lock register, registers R0x0D and R0x0E are unlocked and any
subsequent two-wire serial interface writes to these registers are committed.
MT9V034_DS Rev.G Pub. 4/15 EN
20
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Two-Wire Serial Interface Sample Read and Write Sequences
Real-Time Context Switching
In the MT9V034, the user may switch between two full register sets (listed in Table 7) by
writing to a context switch change bit in register 0x07. This context switch will change all
registers (no shadowing) at the frame start time and have the new values apply to the
immediate next exposure and readout time (frame n+1), except for shutter width and
V1-V4 control, which will take effect for next exposure but will show up in the n+2 image.
Table 7:
.
Real-Time Context-Switchable Registers
Register Name
Register Number (Hex) For Context A
Register Number (Hex) for Context B
Column Start
0x01
0xC9
Row Start
0x02
0xCA
Window Height
0x03
0xCB
Window Width
0x04
0xCC
Horizontal Blanking
0x05
0xCD
Vertical Blanking
0x06
0xCE
Coarse Shutter Width 1
0x08
0xCF
Coarse Shutter Width 2
0x09
0xD0
Coarse Shutter Width Control
0x0A
0xD1
Coarse Shutter Width Total
0x0B
0xD2
Fine Shutter Width 1
0xD3
0xD6
Fine Shutter Width 2
0xD4
0xD7
Fine Shutter Width Total
0xD5
0xD8
0x0D [5:0]
0x0E [5:0]
Read Mode
High Dynamic Range enable
0x0F [0]
0x0F [8]
ADC Resolution Control
0x1C [1:0]
0x1C [9:8]
V1 Control – V4 Control
0x31 – 0x34
0x39 – 0x3C
Analog Gain Control
0x35
0x36
0x70 [1:0]
0x70 [9:8]
Tiled Digital Gain
0x80 [3:0] – 0x98 [3:0]
0x80 [11:8] – 0x98 [11:8]
AEC/AGC Enable
0xAF [1:0]
0xAF [9:8]
Row Noise Correction Control 1
MT9V034_DS Rev.G Pub. 4/15 EN
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Two-Wire Serial Interface Sample Read and Write Sequences
Recommended Register Settings
Table 8 describes new suggested register settings, and descriptions of performance
improvements and conditions:
Table 8:
Recommended Register Settings and Performance Impact (Reserved Registers)
Register
Current Default
New Setting
Performance Impact
R0x20
0x01C1
0x03C7
Recommended by design to improve performance in HDR mode
and when frame rate is low. We also recommended using
R0x13=0x2D2E with this setting for better column FPN.
NOTE: When coarse integration time set to 0 and fine integration
time less than 456, R0x20 should be set to 0x01C7
R0x24
0x0010
0x001B
Corrects pixel negative dark offset when global reset in R0x20[9] is
enabled.
R0x2B
0x0004
0x0003
Improves column FPN.
R0x2F
0x0004
0x0003
Improves FPN at near-saturation.
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Feature Description
Operational Modes
The MT9V034 works in master, snapshot, or slave mode. In master mode the sensor
generates the readout timing. In snapshot mode it accepts an external trigger to start
integration, then generates the readout timing. In slave mode the sensor accepts both
external integration and readout controls. The integration time is programmed through
the two-wire serial interface during master or snapshot modes, or controlled through an
externally generated control signal during slave mode.
Master Mode
There are two possible operation methods for master mode: simultaneous and sequential. One of these operation modes must be selected through the two-wire serial interface. Additional details on this mode can be found in TN-09-224 Master Exposure Mode
Operation.
Simultaneous Master Mode
In simultaneous master mode, the exposure period occurs during readout. The frame
synchronization waveforms are shown in Figure 13 and Figure 14. The exposure and
readout happen in parallel rather than sequential, making this the fastest mode of operation.
Figure 13:
Simultaneous Master Mode Synchronization Waveforms #1
EXPOSURE TIME
LED_OUT
tLED2FV-SIM
tLED2FV-SIM
FRAME_VALID
tVBLANK
LINE_VALID
FRAME TIME
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Figure 14:
Simultaneous Master Mode Synchronization Waveforms #2
EXPOSURE TIME
LED_OUT
t
tLED2FV-SIM
LEDOFF
FRAME_VALID
t
VBLANK
LINE_VALID
FRAME TIME
When exposure time is greater than the sum of vertical blank and window height, the
number of vertical blank rows is increased automatically to accommodate the exposure
time.
Sequential Master Mode
In sequential master mode the exposure period is followed by readout. The frame
synchronization waveforms for sequential master mode are shown in Figure 15. The
frame rate changes as the integration time changes.
Figure 15:
Sequential Master Mode Synchronization Waveforms
EXPOSURE
TIME
LED_OUT
tFV2LED-SEQ
tLED2FV-SEQ
FRAME_VALID
t
VBLANK
LINE_VALID
FRAME TIME
Snapshot Mode
In snapshot mode the sensor accepts an input trigger signal which initiates exposure,
and is immediately followed by readout. Figure 16 shows the interface signals used in
snapshot mode. In snapshot mode, the start of the integration period is determined by
the externally applied EXPOSURE pulse that is input to the MT9V034. The integration
time is preprogrammed at R0x0B or R0xD2 through the two-wire serial interface. After
the frame's integration period is complete the readout process commences and the
syncs and data are output. Sensor in snapshot mode can capture a single image or a
sequence of images. The frame rate may only be controlled by changing the period of
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©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
the user supplied EXPOSURE pulse train. The frame synchronization waveforms for
snapshot mode are shown in Figure 17 on page 25. Additional details on this mode can
be found in TN-09-225 Snapshot Exposure Mode Operation.
Figure 16:
Snapshot Mode Interface Signals
EXPOSURE
SYSCLK
PIXCLK
LINE_VALID
CONTROLLER
FRAME_VALID
MT9V034
DOUT(9:0)
Figure 17:
Snapshot Mode Frame Synchronization Waveforms
TE2E
EXPOSURE
TEW
EXPOSURE
TIME
LED_OUT
TE2LED
TLED2FV
TFV2E
FRAME_VALID
TVBLANK
LINE_VALID
FRAME TIME
Slave Mode
In slave mode, the exposure and readout are controlled using the EXPOSURE,
STFRM_OUT, and STLN_OUT pins. When the slave mode is enabled, STFRM_OUT and
STLN_OUT become input pins.
The start and end of integration are controlled by EXPOSURE and STFRM_OUT pulses,
respectively. While a STFRM_OUT pulse is used to stop integration, it is also used to
enable the readout process.
After integration is stopped, the user provides STLN_OUT pulses to trigger row readout.
A full row of data is read out with each STLN_OUT pulse. The user must provide enough
time between successive STLN_OUT pulses to allow the complete readout of one row.
It is also important to provide additional STLN_OUT pulses to allow the sensors to read
the vertical blanking rows. It is recommended that the user program the vertical blank
register (R0x06) with a value of 4, and achieve additional vertical blanking between
frames by delaying the application of the STFRM_OUT pulse.
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
The elapsed time between the rising edge of STLN_OUT and the first valid pixel data is
calculated for context A by [horizontal blanking register (R0x05) + 4] clock cycles. For
context B, the time is (R0xCD + 4) clock cycles.
Additional details on this mode can be found in TN-09-283 Slave Exposure Mode Operation.
Figure 18:
Exposure and Readout Timing (Simultaneous Mode)
tEW
EXPOSURE
tSF2SF
tE2SF
tSFW
STFRM_OUT
STLN_OUT
tFV2SF
tSF2FV
FRAME_VALID
LINE_VALID
tE2LED
EXPOSURE
TIME
tSF2LED
LED_OUT
Notes:
MT9V034_DS Rev.G Pub. 4/15 EN
1. Not drawn to scale.
2. Frame readout shortened for clarity.
3. Simultaneous progressive scan readout mode shown.
26
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Figure 19:
Exposure and Readout Timing (Sequential Mode)
EXPOSURE
tEW
tE2SF
tSF2SF
tSFW
STFRM_OUT
STLN_OUT
tFV2E
tSF2FV
FRAME_VALID
LINE_VALID
tE2LED
EXPOSURE
TIME
tSF2LED
LED_OUT
Notes:
1.
2.
3.
4.
Not drawn to scale.
Frame readout shortened for clarity.
STLN_OUT pulses are optional during exposure time.
Sequential progressive scan readout mode shown.
Signal Path
The MT9V034 signal path consists of a programmable gain, a programmable analog
offset, and a 10-bit ADC. See “Black Level Calibration” on page 37 for the programmable
offset operation description.
Figure 20:
Signal Path
Gain Selection
(R0x35 or R0x36 or
result of AGC)
Pixel Output
(reset minus signal)
Offset Correction
Voltage (R0x48 or
result of BLC)
VREF
(R0x2C)
10 (12) bit ADC
Σ
ADC Data
(9:0)
C1
C2
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©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
On-Chip Biases
ADC Voltage Reference
The ADC voltage reference is programmed through R0x2C, bits 2:0. The ADC reference
ranges from 1.0V to 2.1V. The default value is 1.4V. The increment size of the voltage
reference is 0.1V from 1.0V to 1.6V (R0x2C[2:0] values 0 to 6). At R0x2C[2:0] = 7, the reference voltage jumps to 2.1V.
It is very important to preserve the correct values of the other bits in R0x2C. The default
register setting is 0x0004. This corresponds to 1.4V—at this setting 1mV input to the ADC
equals approximately 1 LSB.
V_Step Voltage Reference
This voltage is used for pixel high dynamic range operations, programmable from R0x31
through R0x34 for context A, or R0x39 through R0x3B for context B.
Chip Version
Chip version register R0x00 is read-only.
Window Control
Registers column start A/B, row start A/B, window height A/B (row size), and window
width (column size) A/B control the size and starting coordinates of the window.
The values programmed in the window height and width registers are the exact window
height and width out of the sensor. The window start value should never be set below
four.
To read out the dark rows set bit 6 of R0x0D. In addition, bit 7 of R0x0D can be used to
display the dark columns in the image. Note that there are Show Dark settings only for
context A.
Blanking Control
Horizontal blank and vertical blank registers R0x05 and R0x06 (B: 0xCD and R0xCE),
respectively, control the blanking time in a row (horizontal blanking) and between
frames (vertical blanking).
• Horizontal blanking is specified in terms of pixel clocks.
• Vertical blanking is specified in terms of numbers of rows.
The actual imager timing can be calculated using Table 4 on page 14 and Table 5 on
page 15, which describe “Row Timing and FV/LV signals.” The minimum number of
vertical blank rows is 4.
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©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Pixel Integration Control
Total Integration
Total integration time is the result of coarse shutter width and fine shutter width registers, and depends also on whether manual or automatic exposure is selected.
The actual total integration time, tINT is defined as:
tINT = tINTCoarse + tINTFint
(EQ 2)
= (number of rows of integration x row time) +
(number of pixels of integration x pixel time)
where:
– Number of Rows of Integration
(Auto Exposure Control: Enabled)
When automatic exposure control (AEC) is enabled, the number of rows of integration may vary from frame to frame, with the limits controlled by R0xAC (minimum
coarse shutter width) and R0xAD (maximum coarse shutter width).
– Number of Rows of Integration
(Auto Exposure Control: Disabled)
If AEC is disabled, the number of rows of integration equals the value in R0x0B.
or
If context B is enabled, the number of rows of integration equals the value in
R0xD2.
– Number of Pixels of Integration
The number of fine shutter width pixels is independent of AEC mode (enabled or
disabled):
• Context A: the number of pixels of integration equals the value in R0xD5.
• Context B: the number of pixels of integration equals the value in R0xD8.
Row Timing
Context A: Row time = (R0x04 + R0x05) master clock periods
(EQ 3)
Context B: Row time = (R0xCC + R0xCD) master clock periods
(EQ 4)
Typically, the value of the Coarse Shutter Width Total registers is limited to the number
of rows per frame (which includes vertical blanking rows), such that the frame rate is not
affected by the integration time. If the Coarse Shutter Width Total is increased beyond
the total number of rows per frame, the user must add additional blanking rows using
the Vertical Blanking registers as needed. See descriptions of the Vertical Blanking registers, R0x06 and R0xCE in Table 1and Table 2 of the MT9V034 register reference.
A second constraint is that tINT must be adjusted to avoid banding in the image from
light flicker. Under 60Hz flicker, this means the frame time must be a multiple of 1/120 of
a second. Under 50Hz flicker, the frame time must be a multiple of 1/100 of a second.
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Changes to Integration Time
With automatic exposure control disabled (R0xAF[0] for context A, or R0xAF[8] for context B) and if the total integration time (R0x0B or R0xD2) is changed through the two-wire serial interface while FV is asserted for frame n, the
first frame output using the new integration time is frame (n + 2). Similarly, when automatic exposure control is
enabled, any change to the integration time for frame n first appears in frame (n + 2) output. Additional details on
this latency can be found in TN-09-226 Latency of Exposure or Gain Switch.
The sequence is as follows:
1. During frame n, the new integration time is held in the R0x0B or R0D2 live register.
2. Prior to the start of frame (n + 1) readout, the new integration time is transferred to the exposure control module.
Integration for each row of frame (n + 1) has been completed using the old integration time. The earliest time
that a row can start integrating using the new integration time is immediately after that row has been read for
frame (n + 1). The actual time that rows start integrating using the new integration time is dependent on the new
value of the integration time.
3. When frame (n + 2) is read out, it is integrated using the new integration time. If the integration time is changed
(R0x0B or R0xD2 written) on successive frames, each value written is applied to a single frame; the latency
between writing a value and it affecting the frame readout remains at two frames.
Figure 21:
Latency of Exposure Register in Master Mode
frame n
Two-wire
serial Interface
(Input)
LED_OUT
(Output)
frame n+2
idle
Exp “A”
FRAME_VALID
(Output)
©Semiconductor Components Industries, LLC,2015
AEC-sample point
frame n+1
idle
Exp “A”
Readout Exp “A”
frame-start
AEC-sample writes
new exposure
value (Exp “B”)
Exp “B”
Readout Exp “A”
Exp “B”
Readout Exp “B”
frame-start
new image available
activates new
at output
exposure value (Exp “B”)
Exp “B”
Readout Exp “B”
Readout Exp “B”
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
30
write new exposure value (Exp “B”)
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Exposure Indicator
The exposure indicator is controlled by:
• R0x1B LED_OUT Control
The MT9V034 provides an output pin, LED_OUT, to indicate when the exposure takes
place. When R0x1B bit 0 is clear, LED_OUT is HIGH during exposure. By using R0x1B, bit
1, the polarity of the LED_OUT pin can be inverted.
High Dynamic Range
High dynamic range is controlled by:
Context A
Context B
R0x0F[0]
R0x0F[8]
R0x08
R0xCF
Shutter Width 2
R0x09
R0xD0
Shutter Width Control
R0x0A
R0xD1
R0x31-R0x34
R0x39-R0x3C
High Dynamic Enable
Shutter Width 1
V_Step Voltages
In the MT9V034, high dynamic range (by setting R0x0F, bit 0 or 8 to 1) is achieved by
controlling the saturation level of the pixel (HDR or high dynamic range gate) during the
exposure period. The sequence of the control voltages at the HDR gate is shown in
Figure 22. After the pixels are reset, the step voltage, V_Step, which is applied to HDR
gate, is set up at V1 for integration time t1, then to V2 for time t2, then V3 for time t3, and
finally it is parked at V4, which also serves as an antiblooming voltage for the photodetector. This sequence of voltages leads to a piecewise linear pixel response, illustrated
(approximately) in Figure 22 and in Figure 23 on page 32.
Figure 22:
Sequence of Control Voltages at the HDR Gate
Exposure
VAA (3.3V)
V1~1.4V
HDR
Voltage
MT9V034_DS Rev.G Pub. 4/15 EN
t1
V2~1.2V
V3~1.0V
V4~0.8V
t2
31
t3
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Figure 23:
Sequence of Voltages in a Piecewise Linear Pixel Response
dV3
Output
dV2
dV1
Light Intensity
1/t
1
1/t
1/t
2
3
The parameters of the step voltage V_Step, which take values V1, V2, and V3, directly
affect the position of the knee points in Figure 23.
Light intensities work approximately as a reciprocal of the partial exposure time. Typically, t1 is the longest exposure, t2 shorter, and so on. Thus the range of light intensities is
shortest for the first slope, providing the highest sensitivity.
The register settings for V_Step and partial exposures are:
V1 = R0x31, bits 5:0 (Context B: R0x39, bits 5:0)
V2 = R0x32, bits 5:0 (Context B: R0x3A, bits 5:0)
V3 = R0x33, bits 5:0 (Context B: R0x3B, bits 5:0)
V4 = R0x34, bits 5:0 (Context B: R0x3C, bits 5:0)
tINT = t1 + t2 + t3
There are two ways to specify the knee points timing, the first by manual setting and the
second by automatic knee point adjustment. Knee point auto adjust is controlled for
context A by R0x0A[8] (where default is ON), and for context B by R0xD1[8] (where
default is OFF ).
When the knee point auto adjust enabler is enabled (set HIGH), the MT9V034 calculates
the knee points automatically using the following equations:
t1 = tINT – t2 – t3
(EQ 5)
t2 = tINT x (½)R0x0A[3:0] or R0xD1[3:0]
(EQ 6)
t3 = tINT x (½)R0x0A[7:4] or R0xD1[7:4]
(EQ 7)
As a default for auto exposure, t2 is 1/16 of tINT, t3 is 1/64 of tINT.
When the auto adjust enabler is disabled (set LOW), t1, t2, and t3 may be programmed
through the two-wire serial interface:
t1 = Coarse SW1 (row-times) + Fine SW1 (pixel-times)
(EQ 8)
t2 = Coarse SW2 – Coarse SW1 + Fine SW2 - Fine SW1
(EQ 9)
t3 = Total Integration – t1 – t2
(EQ 10)
= Coarse Total Shutter Width + Fine Shutter Width Total – t1 – t2
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
For context A these become:
t1 = R0x08 + R0xD3
(EQ 11)
t2 = R0x09 - R0x08 + R0xD4 – R0xD3
(EQ 12)
t3 = R0x0B + R0xD4 – t1 – t2
(EQ 13)
For context B these are:
t1 = R0xCF + R0xD6
(EQ 14)
t2 = R0xD0 - R0xCF + R0xD7 - R0xD6
(EQ 15)
t3 = R0xD2 + R0xD8 -t1 -t2
(EQ 16)
In all cases above, the coarse component of total integration time may be based on the
result of AEC or values in R0x0B and R0xD2, depending on the settings.
Similar to Fine Shutter Width Total registers, the user must not set the Fine Shutter
Width 1 or Fine Shutter Width 2 register to exceed the row time (Horizontal Blanking +
Window Width). The absolute maximum value for the Fine Shutter Width registers is
1774 master clocks.
ADC Companding Mode
By default, ADC resolution of the sensor is 10-bit. Additionally, a companding scheme of
12-bit into 10-bit is enabled by the ADC Companding Mode register. This mode allows
higher ADC resolution, which means less quantization noise at low light, and lower resolution at high light, where good ADC quantization is not so critical because of the high
level of the photon’s shot noise.
Figure 24:
12- to 10-Bit Companding Chart
10-bit
Codes
1,024
768
8 to 1 Companding (2,048- 4095
4 to 1 Companding (512 - 2047
512
256
2 to 1 Companding (256- 511
No companding (0 -255
256 512 1,024
MT9V034_DS Rev.G Pub. 4/15 EN
384 - 767)
256- 383)
12-bit
Codes
0 -255)
2,048
768- 1023)
4,096
33
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Gain Settings
Changes to Gain Settings
When the analog gain (R0x35 for context A or R0x36 for context B) or the digital gain settings (R0x80–R0x98) are
changed, the gain is updated on the next frame start. The gain setting must be written before the frame boundary to
take effect the next frame. The frame boundary is slightly after the falling edge of Frame_Valid. In Figure 25 this is
shown by the dashed vertical line labeled Frame Start.
Both analog and digital gain change regardless of whether the integration time is also changed simultaneously.
Digital gain will change as soon as the register is written. Additional details on this latency can be found in TN-09226 Latency of Exposure or Gain Switch.
Figure 25:
Latency of Gain Register(s) in Master Mode
write new gain value (Gain “B”)
frame n
frame n+2
idle
idle
LED_OUT
(Output)
FRAME_VALID
(Output)
Readout Gain “A”
AGC-sample point
Readout Gain “A”
frame-start
Readout Gain “B”
frame-start writes
new gain value
(Gain ”B”)
Readout Gain “B”
AGC-sample
activates new gain
value (Gain ”B”)
new image available
at output
Readout Gain “B”
Readout Gain “B”
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
34
Two-wire
serial Interface
(Input)
frame n+1
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Analog Gain
Analog gain is controlled by:
• R0x35 Global Gain context A
• R0x36 Global Gain context B
The formula for gain setting is:
Gain = Bits[6:0] x 0.0625
(EQ 17)
The analog gain range supported in the MT9V034 is 1X–4X with a step size of
6.25 percent. To control gain manually with this register, the sensor must NOT be in AGC
mode. When adjusting the luminosity of an image, it is recommended to alter exposure
first and yield to gain increases only when the exposure value has reached a maximum
limit.
Analog gain = bits (6:0) x 0.0625 for values 16–31
Analog gain = bits (6:0)/2 x 0.125 for values 32–64
For values 16–31: each LSB increases analog gain 0.0625v/v. A value of 16 = 1X gain.
Range: 1X to 1.9375X.
For values 32–64: each 2 LSB increases analog gain 0.125v/v (that is, double the gain
increase for 2 LSB). Range: 2X to 4X. Odd values do not result in gain increases; the gain
increases by 0.125 for values 32, 34, 36, and so on.
Digital Gain
Digital gain is controlled by:
• R0x99-R0xA4 Tile Coordinates
• R0x80-R0x98 Tiled Digital Gain and Weight
In the MT9V034, the gain logic divides the image into 25 tiles, as shown in Figure 26 on
page 36. The size and gain of each tile can be adjusted using the above digital gain
control registers. Separate tile gains can be assigned for context A and context B.
Registers 0x99–0x9E and 0x9F–0xA4 represent the coordinates X0/5–X5/5 and Y0/5–Y5/5
in Figure 26 on page 36, respectively.
Digital gains of registers 0x80–0x98 apply to their corresponding tiles. The MT9V034
supports a digital gain of 0.25–3.75X.
When binning is enabled, the tile offsets maintain their absolute values; that is, tile coordinates do not scale with row or column bin setting. Digital gain is applied as soon as
register is written.
Note:
There is one exception, for the condition when Column Bin 4 is enabled (R0x0D[3:2]
or R0x0E[3:2] = 2). For this case, the value for Digital Tile Coordinate
X–direction must be doubled.
The formula for digital gain setting is:
Digital Gain = Bits[3:0] x 0.25
MT9V034_DS Rev.G Pub. 4/15 EN
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(EQ 18)
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Figure 26:
Tiled Sample
X0/5 X1/5
X2/5 X3/5
Y0/5
x0_y0 x1_y0
X4/5
X5/5
x4_y0
Y1/5
x0_y1
x1_y1
x4_y1
x0_y2
x1_y2
x4_y2
x0_y3
x1_y3
x4_y3
x0_y4
x1_y4
x4_y4
Y2/5
Y3/5
Y4/5
Y5/5
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Black Level Calibration
Black level calibration is controlled by:
• Frame Dark Average: R0x42
• Dark Average Thresholds: R0x46
• Black Level Calibration Control: R0x47
• Black Level Calibration Value: R0x48
• Black Level Calibration Value Step Size: R0x4C
The MT9V034 has automatic black level calibration on-chip, and if enabled, its result
may be used in the offset correction shown in Figure 27.
Figure 27:
Black Level Calibration Flow Chart
Gain Selection
(R0x35 or R0x36 or
result of AGC)
Pixel Output
(reset minus signal)
Offset Correction
Voltage (R0x48 or
result of BLC)
VREF
(R0x2C)
10 (12) bit ADC
Σ
ADC Data
(9:0)
C1
C2
The automatic black level calibration measures the average value of pixels from 2 dark
rows (1 dark row if row bin 4 is enabled) of the chip. (The pixels are averaged as if they
were light-sensitive and passed through the appropriate gain.)
This row average is then digitally low-pass filtered over many frames (R0x47, bits 7:5) to
remove temporal noise and random instabilities associated with this measurement.
Then, the new filtered average is compared to a minimum acceptable level, low
threshold, and a maximum acceptable level, high threshold.
If the average is lower than the minimum acceptable level, the offset correction voltage
is increased by a programmable offset LSB in R0x4C. (Default step size is 2 LSB Offset = 1
ADC LSB at analog gain = 1X.)
If it is above the maximum level, the offset correction voltage is decreased by 2 LSB
(default).
To avoid oscillation of the black level from below to above, the region the thresholds
should be programmed so the difference is at least two times the offset DAC step size.
In normal operation, the black level calibration value/offset correction value is calculated at the beginning of each frame and can be read through the two-wire serial interface from R0x48. This register is an 8-bit signed two’s complement value.
However, if R0x47, bit 0 is set to “1,” the calibration value in R0x48 is used rather than the
automatic black level calculation result. This feature can be used in conjunction with the
“show dark rows” feature (R0x0D[6]) if using an external black level calibration circuit.
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
The offset correction voltage is generated according to the following formulas:
Offset Correction Voltage = (8-bit signed two’s complement calibration value, – 127 to 127) × 0.25mV
(EQ 19)
ADC input voltage = (Pixel Output Voltage) * Analog Gain + Offset Correction Voltage × (Analog Gain + 1) (EQ 20)
Defective Pixel Correction
Defective pixel correction is intended to compensate for defective pixels by replacing
their value with a value based on the surrounding pixels, making the defect less noticeable to the human eye. The locations of defective pixels are stored in a ROM on chip
during the manufacturing process; the maximum number of defects stored is 32. There
is no provision for later augmenting the table of programmed defects. In the defect
correction block, bad pixels will be substituted by either the average of its neighboring
pixels, or its nearest-neighbor pixel, depending on pixel location.
Defective Pixel Correction is enabled by R0x07[9]. By default, correction is enabled, and
pixels mapped in internal ROM are replaced with corrected values. This might be unacceptable to some applications, in which case pixel correction should be disabled
(R0x07[9] = 0).
For complete details on using Defective Pixel Correction, refer to TN-09-250, “Defective
Pixel Correction - Description and Usage”.
Row-wise Noise Correction
Row-wise noise correction is controlled by the following registers:
• R0x70 Row Noise Control
• R0x72 Row Noise Constant
Row-wise noise cancellation is performed by calculating a row average from a set of optically black pixels at the start of each row and then applying each average to all the active
pixels of the row. Read Dark Columns register bit and Row Noise Correction Enable
register bit must both be set to enable row-wise noise cancellation to be performed. The
behavior when Read Dark Columns register bit = 0 and Row Noise Correction Enable
register bit = 1 is undefined.
The algorithm works as follows:
Logical columns 755-790 in the pixel array provide 36 optically black pixel values. Of the
36 values, two smallest value and two largest values are discarded. The remaining 32
values are averaged by summing them and discarding the 5 LSB of the result. The 10-bit
result is subtracted from each pixel value on the row in turn. In addition, a positive
constant will be added (Reg0x71, bits 7:0). This constant should be set to the dark level
targeted by the black level algorithm plus the noise expected on the measurements of
the averaged values from dark columns; it is meant to prevent clipping from negative
noise fluctuations.
Pixel value = ADC value – dark column average + R0x71[9:0]
(EQ 21)
Note that this algorithm does not work in color sensor.
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Automatic Gain Control and Automatic Exposure Control
The integrated AEC/AGC unit is responsible for ensuring that optimal auto settings of
exposure and (analog) gain are computed and updated every frame.
AEC and AGC can be individually enabled or disabled by R0xAF. When AEC is disabled
(R0xAF[0] = 0), the sensor uses the manual exposure value in coarse and fine shutter
width registers. When AGC is disabled (R0xAF[1] = 0), the sensor uses the manual gain
value in R0x35 or R0x36. See “Pixel Integration Control” on page 29 for more information.
Figure 28:
Controllable and Observable AEC/AGC Registers
EXP. LPF
(R0xA8)
MAX. EXPOSURE (R0xBD)
EXP. SKIP
(R0xA6)
Coarse Shutter
Width Total
AEC
UNIT
MIN EXPOSURE (R0xAC)
AEC
OUTPUT
AEC ENABLE
(R0xAF[0 or 8])
0
To exposure
timing control
1
CURRENTBIN
(current luminance)
(R0xBC)
R0xBB
DESIRED BIN
(desired luminance)
(R0xA5)
HISTOGRAM
GENERATOR
UNIT
AGC OUTPUT
16
AGC
UNIT
MIN GAIN
1
To analog
gain control
0
MAX. GAIN
(R0xAB)
R0xBA
GAIN LPF
(R0xAB)
GAIN SKIP
(R0xA9)
MANUAL GAIN
A or B
AGC ENABLE
(R0xAF[1 or 9])
The exposure is measured in row-time by reading R0xBB. The exposure range is
1 to 2047. The gain is measured in gain-units by reading R0xBA. The gain range is
16 to 63 (unity gain = 16 gain-units; multiply by 1/16 to get the true gain).
When AEC is enabled (R0xAF), the maximum auto exposure value is limited by R0xBD;
minimum auto exposure is limited by AEC Minimum Exposure, R0xAC.
Note:
AEC does not support sub-row timing; calculated exposure values are rounded down
to the nearest row-time. For smoother response, manual control is recommended for
short exposure times.
When AGC is enabled (R0xAF), the maximum auto gain value is limited by R0xAB;
minimum auto gain is fixed to 16 gain-units.
The exposure control measures current scene luminosity and desired output luminosity
by accumulating a histogram of pixel values while reading out a frame. All pixels are
used, whether in color or mono mode. The desired exposure and gain are then calculated from this for subsequent frame.
When binning is enabled, tuning of the AEC may be required. The histogram pixel count
register, R0xB0, may be adjusted to reflect reduced pixel count. Desired bin register,
R0xA5, may be adjusted as required.
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Pixel Clock Speed
The pixel clock speed is same as the master clock (SYSCLK) at 26.66 MHz by default.
However, when column binning 2 or 4 (R0x0D or R0x0E, bit 2 or 3) is enabled, the pixel
clock speed is reduced by half and one-fourth of the master clock speed respectively. See
“Read Mode Options” on page 41 and “Column Binning” on page 42 for additional information.
Hard Reset of Logic
The RC circuit for the MT9V034 uses a 10kresistor and a 0.1µF capacitor. The rise time
for the RC circuit is 1µs maximum.
Soft Reset of Logic
Soft reset of logic is controlled by:
• R0x0C Reset
Bit 0 is used to reset the digital logic of the sensor while preserving the existing two-wire
serial interface configuration. Furthermore, by asserting the soft reset, the sensor aborts
the current frame it is processing and starts a new frame. Bit 1 is a shadowed reset
control register bit to explicitly reset the automatic gain and exposure control feature.
These two bits are self-resetting bits and also return to “0” during two-wire serial interface reads.
STANDBY Control
The sensor goes into standby mode by setting STANDBY to HIGH. Once the sensor
detects that STANDBY is asserted, it completes the current frame before disabling the
digital logic, internal clocks, and analog power enable signal. To release the sensor out
from the standby mode, reset STANDBY back to LOW. The LVDS must be powered to
ensure that the device is in standby mode. See "Appendix A: Power-On Reset and
Standby Timing" on page 60 for more information on standby.
Monitor Mode Control
Monitor mode is controlled by:
• R0xD9 Monitor Mode Enable
• R0xC0 Monitor Mode Image Capture Control
The sensor goes into monitor mode when R0xD9[0] is set to HIGH. In this mode, the
sensor first captures a programmable number of frames (R0xC0), then goes into a sleep
period for five minutes. The cycle of sleeping for five minutes and waking up to capture a
number of frames continues until R0xD9[0] is cleared to return to normal operation.
In some applications when monitor mode is enabled, the purpose of capturing frames is
to calibrate the gain and exposure of the scene using automatic gain and exposure
control feature. This feature typically takes less than 10 frames to settle. In case a larger
number of frames is needed, the value of R0xC0 may be increased to capture more
frames.
During the sleep period, none of the analog circuitry and a very small fraction of digital
logic (including a five-minute timer) is powered. The master clock (SYSCLK) is therefore
always required.
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Read Mode Options
(Also see “Output Data Format” on page 13 and “Output Data Timing” on page 14.)
Column Flip
By setting bit 5 of R0x0D or R0x0E the readout order of the columns is reversed, as shown
in Figure 29 on page 41.
Row Flip
By setting bit 4 of R0x0D or R0x0E the readout order of the rows is reversed, as shown in
Figure 30.
Figure 29:
Readout of Six Pixels in Normal and Column Flip Output Mode
LINE_VALID
Normal readout
DOUT(9:0)
Reverse readout
DOUT(9:0)
Figure 30:
P4,1
(9:0)
P4,2
(9:0)
P4,3
(9:0)
P4,4
(9:0)
P4,5
(9:0)
P4,6
(9:0)
P4,n
(9:0)
P4,n-1
(9:0)
P4,n-2
(9:0)
P4,n-3
(9:0)
P4,n-4
(9:0)
P4,n-5
(9:0)
Readout of Six Rows in Normal and Row Flip Output Mode
FRAME_VALID
Normal readout
DOUT(9:0)
Reverse readout
DOUT(9:0)
Row4
(9:0)
Row5
(9:0)
Row6
(9:0)
Row7
(9:0)
Row8
7(9:0)
Row9
(9:0)
Row9
(9:0)
Row8
(9:0)
Row7
(9:0)
Row6
(9:0)
Row5
7(9:0)
Row4
(9:0)
Pixel Binning
In addition to windowing mode in which smaller resolutions (CIF, QCIF) are obtained by
selecting a smaller window from the sensor array, the MT9V034 also provides the ability
to down-sample the entire image captured by the pixel array using pixel binning.
There are two resolution options: binning 2 and binning 4, which reduce resolution by
two or by four, respectively. Row and column binning are separately selected. Image
mirroring options will work in conjunction with binning.
For column binning, either two or four columns are combined by averaging to create the
resulting column. For row binning, the binning result value depends on the difference in
pixel values: for pixel signal differences of less than 200 LSBs, the result is the average of
the pixel values. For pixel differences of greater than 200 LSBs, the result is the value of
the darker pixel value.
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Binning operation increases SNR but decreases resolution. Enabling row bin2 and row
bin4 improves frame rate by 2x and 4x respectively. Column binning does not increase
the frame rate.
Row Binning
By setting bit 0 or 1 of R0x0D or R0x0E, only half or one-fourth of the row set is read out,
as shown in Figure 31. The number of rows read out is half or one-fourth of the value set
in R0x03. The row binning result depends on the difference in pixel values: for pixel
signal differences less than 200 LSBs, the result is the average of the pixel values.
For pixel differences of 200 LSBs or more, the result is the value of the darker pixel value.
Column Binning
For column binning, either two or four columns are combined by averaging to create the
result. In setting bit 2 or 3 of R0x0D or R0x0E, the pixel data rate is slowed down by a
factor of either two or four, respectively. This is due to the overhead time in the digital
pixel data processing chain. As a result, the pixel clock speed is also reduced accordingly.
Figure 31:
Readout of Eight Pixels in Normal and Row Bin Output Mode
LINE_VALID
Normal readout
DOUT(9:0)
Row4
(9:0)
Row5
(9:0)
Row6
(9:0)
Row7
(9:0)
Row4
(9:0)
Row6
(9:0)
Row8
(9:0)
Row10
(9:0)
Row4
(9:0)
Row8
(9:0)
Row8
(9:0)
Row9
(9:0)
Row10
(9:0)
Row11
(9:0)
LINE_VALID
Row Bin 2 readout
DOUT(9:0)
LINE_VALID
Row Bin 4 readout
DOUT(9:0)
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Figure 32:
Readout of 8 Pixels in Normal and Column Bin Output Mode
LINE_VALID
Normal readout
DOUT(9:0)
D1
(9:0)
D2
(9:0)
D3
(9:0)
D4
(9:0)
D5
(9:0)
D6
(9:0)
D7
(9:0)
D8
(9:0)
PIXCLK
LINE_VALID
Column Bin 2 readout
DOUT(9:0)
D1
(9:0)
D3
(9:0)
D5
(9:0)
D7
(9:0)
PIXCLK
LINE_VALID
Column Bin 4 readout
DOUT(9:0)
D1
(9:0)
D5
(9:0)
PIXCLK
Interlaced Readout
The MT9V034 has two interlaced readout options. By setting R0x07[2:0] = 1, all the evennumbered rows are read out first, followed by a number of programmable field blanking
rows (set by R0xBF[7:0]), then the odd-numbered rows, and finally the vertical blanking
rows. By setting R0x07[2:0] = 2 only one field row is read out.
Consequently, the number of rows read out is half what is set in the window height
register. The row start register determines which field gets read out; if the row start
register is even, then the even field is read out; if row start address is odd, then the odd
field is read out.
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Figure 33:
Spatial Illustration of Interlaced Image Readout
P4,1 P4,2 P4,3.....................................P4,n-1 P4,n
P6,0 P6,1 P6,2.....................................P6,n-1 P6,n
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
VALID IMAGE - Even Field
HORIZONTAL
BLANKING
Pm-2,0 Pm-2,2.....................................Pm-2,n-2 Pm-2,n
Pm,2 Pm,2.....................................Pm,n-1 Pm,n
00 00 00 ..................................... 00 00 00
00 00 00 ..................................... 00 00 00
FIELD BLANKING
P5,1 P5,2 P5,3.....................................P5,n-1 P5,n
P7,0 P7,1 P7,2.....................................P7,n-1 P7,n
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
VALID IMAGE - Odd Field
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
Pm-3,1 Pm-3,2.....................................Pm-3,n-1 Pm-3,n
Pm,1 Pm,1.....................................Pm,n-1 Pm,n
VERTICAL BLANKING
00 00 00 ............................................................................................. 00 00 00
00 00 00 ............................................................................................. 00 00 00
When interlaced mode is enabled, the total number of blanking rows are determined by
both Field Blanking register (R0xBF) and Vertical Blanking register (R0x06 or R0xCE).
The followings are their equations.
Field Blanking = R0xBF[7:0]
(EQ 22)
Vertical Blanking = R0x06[8:0] – R0xBF[7:0] (context A) or R0xCE[8:0] – R0xBF[7:0] (context B)
(EQ 23)
with
minimum vertical blanking requirement = 4 (absolute minimum to operate; see Vertical Blanking Registers
description for VBlank minimums for valid image output)
(EQ 24)
Similar to progressive scan, FV is logic LOW during the valid image row only. Binning
should not be used in conjunction with interlaced mode.
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
LINE_VALID
By setting bit 2 and 3 of R0x72, the LV signal can get three different output formats. The
formats for reading out four rows and two vertical blanking rows are shown in Figure 34.
In the last format, the LV signal is the XOR between the continuous LV signal and the FV
signal.
Figure 34:
Different LINE_VALID Formats
Default
FRAME_VALID
LINE_VALID
Continuously
FRAME_VALID
LINE_VALID
XOR
FRAME_VALID
LINE_VALID
LVDS Serial (Stand-Alone/Stereo) Output
The LVDS interface allows for the streaming of sensor data serially to a standard off-theshelf deserializer up to eight meters away from the sensor. The pixels (and controls) are
packeted—12-bit packets for stand-alone mode and 18-bit packets for stereoscopy
mode. All serial signaling (CLK and data) is LVDS. The LVDS serial output could either be
data from a single sensor (stand-alone) or stream-merged data from two sensors (self
and its stereoscopic slave pair). The appendices describe in detail the topologies for
both stand-alone and stereoscopic modes.
There are two standard deserializers that can be used. One for a stand-alone sensor
stream and the other from a stereoscopic stream. The deserializer attached to a standalone sensor is able to reproduce the standard parallel output (8-bit pixel data, LV, FV,
and PIXCLK). The deserializer attached to a stereoscopic sensor is able to reproduce 8bit pixel data from each sensor (with embedded LV and FV) and pixel-clk. An additional
(simple) piece of logic is required to extract LV and FV from the 8-bit pixel data. Irrespective of the mode (stereoscopy/stand-alone), LV and FV are always embedded in the pixel
data.
In stereoscopic mode, the two sensors run in lock-step, implying all state machines are
in the same state at any given time. This is ensured by the sensor-pair getting their sysclks and sys-resets in the same instance. Configuration writes through the two-wire
serial interface are done in such a way that both sensors can get their configuration
updates at once. The inter-sensor serial link is designed in such a way that once the slave
PLL locks and the data-dly, shft-clk-dly and stream-latency-sel are configured, the
master sensor streams valid stereo content irrespective of any variation voltage and/or
temperature as long as it is within specification. The configuration values of data-dly,
shft-clk-dly and stream-latency-sel are either predetermined from the board-layout or
can be empirically determined by reading back the stereo-error flag. This flag is asserted
when the two sensor streams are not in sync when merged. The combo_reg is used for
out-of-sync diagnosis.
MT9V034_DS Rev.G Pub. 4/15 EN
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MT9V034_DS Rev.G Pub. 4/15 EN
Figure 35:
Serial Output Format for a 6x2 Frame
Internal
PIXCLK
Internal
Parallel
Data
P41
P42
P43
P44
P45
P46
P51
P52
P53
P54
P55
P56
Internal
Line_Valid
Internal
Frame_Valid
External
Serial
Data Out
1023
Notes:
0
1023
1
P41
P42
P43 P44
P45
P46
2
1
P51
P52
P53
P54
P55
P56 2
3
1. External pixel values of 0, 1, 2, 3, are reserved (they only convey control information). Any raw pixel of value 0, 1, 2 and 3 will be
substituted with 4.
2. The external pixel sequence 1023, 0, 1023 is a reserved sequence (conveys control information for legacy support of MT9V021
applications). Any raw pixel sequence of 1023, 0, 1023 will be substituted with an output serial stream of 1023, 4, 1023.
©Semiconductor Components Industries, LLC,2015
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
46
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
LVDS Output Format
In stand-alone mode, the packet size is 12 bits (2 frame bits and 10 payload bits); 10-bit
pixels or 8-bit pixels can be selected. In 8-bit pixel mode (R0xB6[0] = 0), the packet
consists of a start bit, 8-bit pixel data (with sync codes), the line valid bit, the frame valid
bit and the stop bit. For 10-bit pixel mode (R0xB6[0] = 1), the packet consists of a start
bit, 10-bit pixel data, and the stop bit.
Table 9:
LVDS Packet Format in Stand-Alone Mode
(Stereoscopy Mode Bit De-Asserted)
12-Bit Packet
use_10-bit_pixels Bit DeAsserted
(8-Bit Mode)
use_10-bit_pixels Bit Asserted
(10-Bit Mode)
Bit[0]
Bit[1]
Bit2]
Bit[3]
Bit4]
Bit[5]
Bit[6]
Bit[7]
Bit[8]
Bit[9]
Bit[10]
Bit[11]
1'b1 (Start bit)
PixelData[2]
PixelData[3]
PixelData[4]
PixelData[5]
PixelData[6]
PixelData[7]
PixelData[8]
PixelData[9]
Line_Valid
Frame_Valid
1'b0 (Stop bit)
1'b1 (Start bit)
PixelData[0]
PixelData[1]
PixelData[2]
PixelData[3]
PixelData[4]
PixelData[5]
PixelData[6]
PixelData[7]
PixelData[8]
PixelData[9]
1'b0 (Stop bit)
In stereoscopic mode, the packet size is 18 bits (2 frame bits and 16 payload bits). The
packet consists of a start bit, the master pixel byte (with sync codes), the slave byte (with
sync codes), and the stop bit.)
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
Table 10:
LVDS Packet Format in Stereoscopy Mode (Stereoscopy Mode Bit Asserted)
18-bit Packet
Function
Bit[0]
Bit[1]
Bit[2]
Bit[3]
Bit[4]
Bit[5]
Bit[6]
Bit[7]
Bit[8]
Bit[9]
Bit[10]
Bit[11]
Bit[12]
Bit[13]
Bit[14]
Bit[15]
Bit[16]
Bit[17]
1'b1 (Start bit)
MasterSensorPixelData[2]
MasterSensorPixelData[3]
MasterSensorPixelData[4]
MasterSensorPixelData[5]
MasterSensorPixelData[6]
MasterSensorPixelData[7]
MasterSensorPixelData[8]
MasterSensorPixelData[9]
SlaveSensorPixelData[2]
SlaveSensorPixelData[3]
SlaveSensorPixelData[4]
SlaveSensorPixelData[5]
SlaveSensorPixelData[6]
SlaveSensorPixelData[7]
SlaveSensorPixelData[8]
SlaveSensorPixelData[9]
1'b0 (Stop bit)
Control signals LV and FV can be reconstructed from their respective preceding and
succeeding flags that are always embedded within the pixel data in the form of reserved
words.
Table 11:
Reserved Words in the Pixel Data Stream
Pixel Data Reserved Word
Flag
0
1
2
3
Precedes frame valid assertion
Precedes line valid assertion
Succeeds line valid de-assertion
Succeeds frame valid de-assertion
When LVDS mode is enabled along with column binning (bin 2 or bin 4, R0x0D[3:2]), the
packet size remains the same but the serial pixel data stream repeats itself depending on
whether 2X or 4X binning is set:
• For bin 2, LVDS outputs double the expected data (post-binning pixel 0,0 is output
twice in sequence, followed by pixel 0,1 twice, . . .).
• For bin 4, LVDS outputs 4 times the expected data (pixel 0,0 is output 4 times in
sequence followed by pixel 0,1 times 4, . . .).
The receiving hardware will need to undersample the output stream,getting data either
every 2 clocks (bin 2) or every 4 (bin 4) clocks.
If the sensor provides a pixel whose value is 0,1, 2, or 3 (that is, the same as a reserved
word) then the outgoing serial pixel value is switched to 4.
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
LVDS Enable and Disable
The Table 12 and Table 13 further explain the state of the LVDS output pins depending
on LVDS control settings. When the LVDS block is not used, it may be left powered down
to reduce power consumption.
Table 12:
R0xB1[1]
LVDS power down
R0xB3[4]
LVDS data power down
SER_DATAOUT_*
0
0
1
1
0
1
0
1
Active
Active
Z
Z
R0xB1[1]
LVDS power down
R0xB2[4]
LVDS shift-clk power down
SHFT_CLKOUT_*
0
0
1
1
0
1
0
1
Active
Z
Z
Z
Table 13:
Note:
MT9V034_DS Rev.G Pub. 4/15 EN
SER_DATAOUT_* state
SHFT_CLK_* state
ERROR pin: When the sensor is not in stereo mode, the ERROR pin is at LOW.
49
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MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Feature Description
LVDS Data Bus Timing
The LVDS bus timing waveforms and timing specifications are shown in Table 14 and
Figure 36.
Figure 36:
LVDS Timing
Data Rise/Fall Time
(10% - 90%)
Data Setup Time
Data Hold Time
LVDS Data Output
(SER_DATAOUT_N/P)
LVDS Clock Output
(Shft_CLKOUT_N/P)
Clock Rise/Fall Time
(10% - 90%)
Table 14:
Clock Jitter
LVDS AC Timing Specifications
VPWR = 3.3V ±0.3V; TJ = – 30°C to +70°C; output load = 100 ; frequency 27 MHz
Parameter
Minimum
Typical
Maximum
Unit
LVDS clock rise time
–
0.22
0.30
ns
LVDS clock fall time
–
0.22
0.30
ns
LVDS data rise time
–
0.28
0.30
ns
LVDS data fall time
–
0.28
0.30
ns
LVDS data setup time
0.3
0.67
–
ns
LVDS data hold time
0.1
1.34
–
ns
92
ps
LVDS clock jitter
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–
50
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Electrical Specifications
Electrical Specifications
Table 15:
DC Electrical Characteristics Over Temperature
VPWR = 3.3V ±0.3V; TJ = – 30°C to +70°C; Output Load = 10pF; Frequency 13 MHz to 27 MHz; LVDS off
Symbol
Definition
Condition
Minimum
Maximum
Unit
VIH
Input HIGH voltage
VIL
Input LOW voltage
–
1.3
V
IIN
Input leakage current
No pull-up resistor;
VIN = VPWR or VGND
-5
–
5
A
VOH
Output HIGH voltage
IOH = –4.0mA
VPWR - 0.3
–
–
V
VOL
Output LOW voltage
IOL = 4.0mA
IOH
Output HIGH current
VOH = VDD - 0.7
–
–
0.3
V
-11
–
–
mA
IOL
Output LOW current
VOL = 0.7
–
–
11
mA
IPWRA
Analog supply current
Default settings
–
12
20
mA
VPWR - 1.4
Typical
–
V
IPIX
Pixel supply current
Default settings
–
1.1
3
mA
IPWRD
Digital supply current
Default settings, CLOAD = 10pF
–
42
60
mA
ILVDS
LVDS supply current
Default settings with LVDS on
–
13
16
mA
–
0.2
3
A
–
0.1
10
A
–
1
2
mA
Typical
Maximum
Unit
250
–
400
mV
–
–
50
mV
1.0
1.2
1.4
V
–
–
35
mV
IPWRA
Standby
Analog standby supply current
STDBY = VDD
IPWRD
Standby
Clock Off
Digital standby supply current
with clock off
STDBY = VDD, CLKIN = 0 MHz
IPWRD
Standby
Clock On
Digital standby supply current
with clock on
STDBY= VDD, CLKIN = 27 MHz
Table 16:
DC Electrical Characteristics
VPWR = 3.3V ±0.3V; TA = Ambient = 25°C
Symbol
Definition
Condition
Minimum
LVDS Driver DC Specifications
|VOD|
Output differential voltage
|DVOD|
Change in VOD between
complementary output states
VOS
Output offset voltage
DVOS
Pixel array current
IOS
Digital supply current
IOZ
Output current when driver is tristate
RLOAD = 100
  1%
10
1
mA
A
LVDS Receiver DC Specifications
VIDTH+
Input differential
Iin
Input current
MT9V034_DS Rev.G Pub. 4/15 EN
| VGPD| < 925mV
51
–100
–
100
mV
–
–
20
A
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Electrical Specifications
Table 17:
Absolute Maximum Ratings
Caution
Stresses greater than those listed may cause permanent damage to the device.
Symbol
Parameter
VSUPPLY
Power supply voltage (all supplies)
ISUPPLY
Total power supply current
IGND
Total ground current
VIN
DC input voltage
VOUT
DC output voltage
–0.3
VDD + 0.3
V
TSTG1
Storage temperature
–50
+150
°C
Notes:
Table 18:
Minimum
Maximum
Unit
–0.3
4.5
V
–
200
mA
–
200
mA
–0.3
VDD + 0.3
V
1. This is a stress rating only, and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
AC Electrical Characteristics
VPWR = 3.3V ±0.3V; TJ = –30°C to +70°C; Output Load = 10pF
Symbol
Definition
SYSCLK
tR
Condition
Minimum
Typical
Maximum
Unit
Input clock frequency
13.0
26.6
27.0
MHz
Clock duty cycle
45.0
50.0
55.0
%
–
3
5
ns
Input clock rise time
tF
Input clock fall time
–
3
5
ns
tPLHP
SYSCLK to PIXCLK propagation delay
CLOAD = 10pF
4
6
8
ns
tPD
PIXCLK to valid DOUT(9:0) propagation delay
CLOAD = 10pF
–3
0.6
3
ns
tSD
Data setup time
14
16
–
ns
tHD
Data hold time
14
16
–
tPFLR
PIXCLK to LV propagation delay
CLOAD = 10pF
5
7
9
ns
tPFLF
PIXCLK to FV propagation delay
CLOAD = 10pF
5
7
9
ns
MT9V034_DS Rev.G Pub. 4/15 EN
52
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Electrical Specifications
Propagation Delays for PIXCLK and Data Out Signals
The pixel clock is inverted and delayed relative to the master clock. The relative delay
from the master clock (SYSCLK) rising edge to both the pixel clock (PIXCLK) falling edge
and the data output transition is typically 7ns. Note that the falling edge of the pixel
clock occurs at approximately the same time as the data output transitions. See Table 18
on page 52 for data setup and hold times.
Figure 37:
Propagation Delays for PIXCLK and Data Out Signals
tF
tR
SYSCLK
tPLHP
PIXCLK
tPD
tSD
tHD
DOUT(9:0)
Propagation Delays for FRAME_VALID and LINE_VALID Signals
The LV and FV signals change on the same rising master clock edge as the data output.
The LV goes HIGH on the same rising master clock edge as the output of the first valid
pixel's data and returns LOW on the same master clock rising edge as the end of the
output of the last valid pixel's data.
As shown in the “Output Data Timing” on page 14, FV goes HIGH 143 pixel clocks before
the first LV goes HIGH. It returns LOW 23 pixel clocks after the last LV goes LOW.
Figure 38:
Propagation Delays for FRAME_VALID and LINE_VALID Signals
t
PFLR
MT9V034_DS Rev.G Pub. 4/15 EN
t
PFLF
PIXCLK
PIXCLK
FRAME_VALID
LINE_VALID
FRAME_VALID
LINE_VALID
53
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Electrical Specifications
Two-Wire Serial Bus Timing
Detailed timing waveforms and parameters for the two-wire serial interface bus are
shown in Figure 39 and Table 19.
Figure 39:
Two-Wire Serial Bus Timing Parameters
SDATA
tLOW
tf
tf
tSU;DAT
tr
tHD;STA
tr
tBUF
SCLK
tHD;STA
S
Table 19:
tHD;DAT
tSU;STA
tHIGH
tSU;STO
Sr
P
S
Two-Wire Serial Bus Characteristics
fEXTCLK = 27 MHz; VPWR = 3.3V ±0.3V; T = 25°C
A
Standard-Mode
Parameter
Symbol
SCLK Clock Frequency
Min
Max
Fast-Mode
Min
Max
Unit
fSCL
0
100
0
400
KHz
tHD;STA
4.0
-
0.6
-
s
tLOW
4.7
-
1.3
-
s
HIGH period of the SCLK clock
tHIGH
4.0
-
0.6
-
s
Set-up time for a repeated START
condition
tSU;STA
4.7
-
0.6
-
s
Data hold time:
tHD;DAT
04
3.455
06
0.95
s
-
ns
After this period, the first clock pulse is
generated
LOW period of the SCLK clock
tSU;DAT
250
-
1006
Rise time of both SDATA and SCLK signals
tr
-
1000
20 + 0.1Cb7
300
ns
Fall time of both SDATA and SCLK signals
tf
-
300
20 + 0.1Cb7
300
ns
tSU;STO
4.0
-
0.6
-
s
tBUF
4.7
-
1.3
-
s
Cb
-
400
-
400
pF
Data set-up time
Set-up time for STOP condition
Bus free time between a STOP and START
condition
Capacitive load for each bus line
Serial interface input pin capacitance
SDATA max load capacitance
SDATA pull-up resistor
Notes:
MT9V034_DS Rev.G Pub. 4/15 EN
CIN_SI
-
3.3
-
3.3
pF
CLOAD_SD
-
30
-
30
pF
RSD
1.5
4.7
1.5
4.7
K
This table is based on I2C standard (v2.1 January 2000). Philips Semiconductor.
Two-wire control is I2C-compatible.
All values referred to VIHmin = 0.9 VDD and VILmax = 0.1VDD levels. Sensor EXCLK = 27 MHz.
A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the
undefined region of the falling edge of SCLK.
5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of
the SCLK signal.
6. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement
tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch
1.
2.
3.
4.
54
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Electrical Specifications
the LOW period of the SCLK signal. If such a device does stretch the LOW period of the SCLK signal, it
must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to
the Standard-mode I2C-bus specification) before the SCLK line is released.
7. Cb = total capacitance of one bus line in pF.
Minimum Master Clock Cycles
In addition to the AC timing requirements described in Table 19 on page 54, the
two-wire serial bus operation also requires certain minimum master clock cycles
between transitions. These are specified in Figures 40 through 45, in units of master
clock cycles.
Figure 40:
Serial Host Interface Start Condition Timing
4
4
SCLK
SDATA
Figure 41:
Serial Host Interface Stop Condition Timing
4
4
SCLK
SDATA
Note:
Figure 42:
All timing are in units of master clock cycle.
Serial Host Interface Data Timing for WRITE
4
4
SCLK
SDATA
Note:
MT9V034_DS Rev.G Pub. 4/15 EN
SDATA is driven by an off-chip transmitter.
55
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Electrical Specifications
Figure 43:
Serial Host Interface Data Timing for READ
5
SCLK
SDATA
Note:
Figure 44:
SDATA is pulled LOW by the sensor, or allowed to be pulled HIGH by a pull-up resistor off-chip.
Acknowledge Signal Timing After an 8-Bit WRITE to the Sensor
3
6
SCLK
Sensor pulls down
SDATA pin
SDATA
Figure 45:
Acknowledge Signal Timing After an 8-Bit READ from the Sensor
6
7
SCLK
SDATA
Note:
MT9V034_DS Rev.G Pub. 4/15 EN
Sensor tri-states SDATA pin
(turns off pull down)
After a READ, the master receiver must pull down SDATA to acknowledge receipt of data bits. When
the read sequence is complete, the master must generate a “No Acknowledge” by leaving SDATA to
float HIGH. On the following cycle, a start or stop bit may be used.
56
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Electrical Specifications
Figure 46:
Typical Quantum Efficiency—RGB Bayer
MT9V034_DS Rev.G Pub. 4/15 EN
57
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Electrical Specifications
Figure 47:
Typical Quantum Efficiency—Monochrome
MT9V034_DS Rev.G Pub. 4/15 EN
58
©Semiconductor Components Industries, LLC,2015.
MT9V034_DS Rev.G Pub. 4/15 EN
Package Dimensions
Figure 48:
48-Pin CLCC Package Outline Drawing
2.3 ±0.2
D
1.7
Seating
plane
Substrate material: alumina ceramic 0.7 thickness
Wall material: alumina ceramic
A
Lid material: borosilicate glass 0.55 thickness
8.8
48
48X
0.40 ±0.05
48X R 0.15
0.8
TYP
4.4
47X
1.0 ±0.2
H CTR
1.75
Ø0.20 A B C
1
First
clear
pixel
5.215
4.84
Ø0.20 A B C
5.715
0.8 TYP
4X
Image
sensor die:
0.675 thickness
0.2
5.215
5.715
11.43
C
B
©Semiconductor Components Industries, LLC,2015
Lead finish:
Au plating, 0.50 microns
minimum thickness
over Ni plating, 1.27 microns
minimum thickness
Optical
area
A
0.05
1.400 ±0.125
0.90
for reference only
0.35
for reference only
0.10 A
10.9 ±0.1
CTR
Optical area:
Maximum rotation of optical area relative to package edges: 1º
Maximum tilt of optical area relative to
seating plane A : 50 microns
Maximum tilt of optical area relative to
top of cover glass D : 100 microns
Note: 1. Optical center = package center.
Notes:
1. All dimensions in millimeters.
2. Optical Center = Package center
Optical
center1
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Package Dimensions
59
4.4
10.9 ±0.1
CTR
V CTR
11.43
8.8
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Appendix A: Power-On Reset and Standby Timing
Appendix A: Power-On Reset and Standby Timing
There are no constraints concerning the order in which the various power supplies are
applied; however, the MT9V034 requires reset to operate properly at power-up. Refer to
Figure 49 for the power-up, reset, and standby sequences.
Figure 49:
Power-up, Reset, Clock, and Standby Sequence
Power
up
VDD, VDDLVDS,
VAA, VAAPIX
Active
non-Low-Power
Low-Power
non-Low-Power
Wake
up
Pre-Standby
Standby
Active
Power
down
MIN 20 SYSCLK cycles
RESET_BAR
Note 3
STANDBY
MIN 10 SYSCLK cycles
SYSCLK
MIN 10 SYSCLK cycles
SCLK, SDATA
Does not
respond to
serial
interface
when
STANDBY = 1
Two-Wire Serial I/F
DOUT[9:0]
MIN 10 SYSCLK cycles
Driven = 0
DATA OUTPUT
Notes:
MT9V034_DS Rev.G Pub. 4/15 EN
DOUT[9:0]
Driven = 0
1. All output signals are defined during initial power-up with RESET_BAR held LOW without SYSCLK
being active. To properly reset the rest of the sensor, during initial power-up, assert RESET_BAR (set
to LOW state) for at least 750ns after all power supplies have stabilized and SYSCLK is active (being
clocked). Driving RESET_BAR to LOW state does not put the part in a low power state.
2. Before using two-wire serial interface, wait for 10 SYSCLK rising edges after RESET_BAR is deasserted.
3. Once the sensor detects that STANDBY has been asserted, it completes the current frame readout
before entering standby mode. The user must supply enough SYSCLKs to allow a complete frame
readout. See Table 4, “Frame Time,” on page 14 for more information.
4. In standby, all video data and synchronization output signals are driven to a low state.
5. In standby, the two-wire serial interface is not active.
60
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Appendix B: Electrical Identification of CFA Type
Appendix B: Electrical Identification of CFA Type
In order to identify the CFA type (RGB Bayer, Monochrome) that a specific MT9V034 has
been, the following table may be used.
MT9V034_DS Rev.G Pub. 4/15 EN
CFA
R0x6B[11:9]
R0x6B[8:0]
RGB
Mono
6
0
4
4
61
©Semiconductor Components Industries, LLC,2015.
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Revision History
Revision History
Rev. G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4/16/15
• Updated “Ordering Information” on page 2
Rev. F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3/27/15
• Converted to ON Semiconductor template
• Removed Confidential marking
Rev. E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2/8/13
• Added “Defective Pixel Correction” on page 12
• Deleted “Registers” from page 21
• Added “Recommended Register Settings” on page 22
• Deleted Table 8,” Default Register Descriptions” from p. 21 and Table 9, “Register
Descriptions” from p. 22
• Added Table 8, “Recommended Register Settings and Performance Impact (Reserved
Registers),” on page 22
• Updated “Operational Modes” on page 23
• Added “Row Timing” on page 29
• Updated Figure 21: “Latency of Exposure Register in Master Mode,” on page 30
• Updated Figure 25: “Latency of Gain Register(s) in Master Mode,” on page 34
• Added “Defective Pixel Correction” on page 38
• Updated junction temperature to -30°C to +70°C in
– Table 14, “LVDS AC Timing Specifications,” on page 50
– Table 15, “DC Electrical Characteristics Over Temperature,” on page 51
– Table 18, “AC Electrical Characteristics,” on page 52
• Updated Figure 39: “Two-Wire Serial Bus Timing Parameters,” on page 54
• Updated Table 19, “Two-Wire Serial Bus Characteristics,” on page 54
• Updated Figure 46: “Typical Quantum Efficiency—RGB Bayer,” on page 57
• Updated Figure 47: “Typical Quantum Efficiency—Monochrome,” on page 58
• Updated Figure 48: “48-Pin CLCC Package Outline Drawing,” on page 59
REv. D. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5/12
• Updated trademarks
Rev. C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11/10
• Applied updated Aptina template
Rev. B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9/10
• Updated to Aptina template
Rev. A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10/08
• Initial release
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the
rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/
Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including
without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey
any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and
distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
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This literature is subject to all applicable copyright laws and is not for resale in any manner.
MT9V034_DS Rev.G Pub. 4/15 EN
62
©Semiconductor Components Industries, LLC,2015 .