Pressure Freescale Semiconductor MPX5050 Rev 10, 10/2009 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX5050 MPXV5050 MPVZ5050 Series 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 V Output The MPXx5050 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features • • • • • • 2.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated Over -40° to +125°C Patented Silicon Shear Stress Strain Gauge Durable Epoxy Unibody Element Easy-to-Use Chip Carrier Option ORDERING INFORMATION Case Device Name No. Unibody Package (MPX5050 Series) None MPX5050D 867 • MPX5050DP 867C MPX5050GP 867B MPX5050GP1 867B Small Outline Package (MPXV5050 Series) # of Ports Single Dual Gauge • • • • • Pressure Type Differential • • Absolute Device Marking MPX5050D MPX5050DP MPX5050GP MPX5050GP MPXV5050GP 1369 • MPXV5050DP 1351 • MPXV5050GC6U 482A • MPXV5050GC6T1 482A • Small Outline Package (Media Resistant Gel) (MPVZ5050 Series) • • • MPXV5050GP MPXV5050DP MPXV5050G MPXV5050G MPVZ5050GW7U • MZ5050GW 1560 • © Freescale Semiconductor, Inc., 2007-2009. All rights reserved. • Pressure UNIBODY PACKAGES MPX5050D CASE 867-08 MPX5050GP CASE 867B-04 MPX5050DP CASE 857C-05 SMALL OUTLINE PACKAGES MPVZ5050GW7U CASE 1560-02 MPXV5100GC6U CASE 482A-01 MPXV5050DP CASE 1351-01 MPXV5050GP CASE 1369-01 MPX5050 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) @ VS = 5.0 Volts (0 to 85°C) Voff 0.088 0.2 0.313 Vdc Full Scale Output(4) @ VS = 5.0 Volts (0 to 85°C) VFSO 4.587 4.7 4.813 Vdc Full Scale Span(5) @ VS = 5.0 Volts (0 to 85°C) VFSS — 4.5 — Vdc Accuracy(6) (0 to 85°C) — — — ±2.5 %VFSS V/P — 90 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm-Up Time(8) — — 20 — ms Offset Stability(9) — — ±0.5 — %VFSS Sensitivity 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2.Device is ratiometric within this specified excitation range. 3.Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5.Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6.Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. 7.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX5050 Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 200 kPa Storage Temperature Tstg -40° to +125° °C Operating Temperature TA -40° to +125° °C 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry Vout Pins 4, 5, and 6 are NO CONNECTS for Unibody Device Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device Figure 1. Fully Integrated Pressure Sensor Schematic MPX5050 4 Sensors Freescale Semiconductor Pressure On-chip Temperature Compensation and Calibration Figure 3 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5050/MPXV5050G series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0× to 85×C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. 5.0 4.5 Transfer Function: Vout = VS*(0.018*P+0.04) ± ERROR 4.0 VS = 5.0 Vdc 3.5 TEMP = 0 to 85°C TYPICAL Output (V) 3.0 2.5 MAX 2.0 MIN 1.5 1.0 0.5 0 0 5 10 15 20 25 30 35 40 45 50 55 Differential Pressure (kPa) Figure 2. Output vs. Pressure Differential Stainless Steel Metal Cover Fluorosilicone Gel Die Coat P1 Epoxy Plastic Case Differential/Gauge Element Die Bond Die Wire Bond Lead Frame P2 Figure 3. Cross-Sectional Diagram (not to scale) +5 V Vout OUTPUT Vs IPS 1.0 μF 0.01 μF GND 470 pF Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) MPX5050 Sensors Freescale Semiconductor 5 Pressure Transfer Function Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04) ± (Pressure Error x Temp. Factor x 0.018 x VS) VS = 5.0 V ± 0.25 Vdc Temperature Error Band 4.0 Temp 3.0 Temperature Error Factor –40 0 to 85 +125 2.0 Multiplier 3 1 3 1.0 0.0 –40 –20 0 20 40 60 Temperature in °C 80 100 120 140 NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 Pressure (in kPa) 0.0 0 –1.0 10 20 30 40 50 60 –2.0 –3.0 Pressure Error (Max) 0 to 50 (kPa) ±1.25 (kPa) PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX pressure Part Number MPX5050D sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type 867 Pressure (P1) Side Identifier Stainless Steel Cap MPX5050DP 867C Side with Part Marking MPX5050GP 867B Side with Port Attached MPXV5050GP 1369 Side with Port Attached MPXV5050DP 1351 Side with Part Marking MPXV5050GC6U/T1 482S Vertical Port Attached MPX5050 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS –A– D 8 PL 4 0.25 (0.010) 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. S N –B– G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 –T– SEATING PLANE PIN 1 IDENTIFIER M K CASE 482A-01 ISSUE A UNIBODY PACKAGE C R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 13.56 0.514 0.534 13.06 0.200 0.220 5.08 5.59 0.027 0.033 0.68 0.84 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 12.57 0.475 0.495 12.07 0.430 0.450 10.92 11.43 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867-08 ISSUE N UNIBODY PACKAGE MPX5050 Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5050 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5050 Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS P 0.25 (0.010) M T Q –A– M U W X R PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. L V PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) N –Q– PORT #2 VACUUM (P2) B PIN 1 1 2 3 4 5 K 6 C SEATING PLANE –T– –T– J S SEATING PLANE D 6 PL G F 0.13 (0.005) M A M DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06 VOUT GROUND VCC V1 V2 VEX CASE 867C-05 ISSUE F UNIBODY PACKAGE MPX5050 10 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5050 Sensors Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5050 12 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5050 Sensors Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5050 14 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX5050 Sensors Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 PAGE 2 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX5050 16 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX5050 Sensors Freescale Semiconductor 17 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. MPX5050 Rev. 10 10/2009