Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead) Technical Data HSMP-381B/C/E/F HSMP-386B/C/E/F HSMP-389B/C/E/F HSMP-481B, -482B, -489B Features • Diodes Optimized for: Low Current Switching Low Distortion Attenuating Ultra-Low Distortion Switching Microwave Frequency Operation • Surface Mount SOT-323 (SC-70)Package Single and Pair Versions Tape and Reel Options Available • Low Failure in Time (FIT) Rate* * For more information see the Surface Mount PIN Reliability Data Sheet. Package Lead Code Identification (Top View) SERIES SINGLE B C COMMON ANODE COMMON CATHODE E F DUAL ANODE DUAL CATHODE 482B / 489B 481B Absolute Maximum Ratings [1], TC = + 25°C Symbol Parameter If Piv TJ TSTG θjc Unit Absolute Maximum Forward Current (1 µs Pulse) Amp Peak Inverse Voltage V Junction Temperature °C Storage Temperature °C [2] Thermal Resistance °C/W 1 Same as VBR 150 -65 to 150 300 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = 25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. Description/Applications The HSMP-381B/C/E/F series is specifically designed for low distortion attenuator applications. The HSMP-386B/C/E/F series is a general purpose PIN diode designed for low current attenuators and low cost switches. The HSMP-389B/C/E/ F series is optimized for switching applications where low resistance at low current, and low capacitance are required. The HSMP-48XB series is special products featuring ultra low parasitic inductance in the SOT323 package, specifically designed for use at frequencies which are much higher than the upper limit for conventional SOT-323 PIN diodes. The HSMP-481B diode is a low distortion attenuating PIN designed for operation to 3 GHz. The HSMP-482B diode is ideal for limiting and low inductance switching applications up to 1.5 GHz. The HSMP-489B is optimized for low current switching applications up to 3 GHz. 2 Electrical Specifications, TC = +25°C, each diode PIN Attenuator Diodes Part Package Number Marking Lead HSMP- Code[1] Code Configuration 381B 381C 381E 381F E0 E2 E3 E4 B C E F Single Series Common Anode Common Cathode Test Conditions Minimum Maximum Maximum Minimum Maximum Breakdown Total Total High Low Voltage Resistance Capacitance Resistance Resistance VBR (V) RT (Ω) CT (pF) RH (Ω) RL (Ω) 100 3.0 0.35 1500 VR = VBR Measure IR ≤ 10 µA IF = 100 mA f = 100 MHz VR = 50 V f = 1 MHz 10 IR = 0.01 mA IF = 20 mA f = 100 MHz f = 100 MHz PIN General Purpose Diodes Part Number HSMP- Package Marking Code[1] Lead Code Configuration 386B 386C 386E 386F L0 L2 L3 L4 B C E F Single Series Common Anode Common Cathode Test Conditions Minimum Breakdown Voltage VBR (V) 50 Typical Total Resistance RT (Ω) 3.0 1.5* Typical Total Capacitance CT (pF) 0.20 VR = VBR Measure IR ≤ 10 µA IF = 10 mA f = 100 MHz IF = 100 mA* VR = 50 V f = 1 MHz Minimum Breakdown Voltage VBR (V) Maximum Total Resistance RT (Ω) Maximum Total Capacitance CT (pF) 100 2.5 0.30 VR = VBR Measure IR ≤ 10 µA IF = 5 mA f = 100 MHz VR = 5 V f = 1 MHz PIN Switching Diodes Part Number HSMP- Package Marking Code[1] 389B G0 389C G2 389E G3 389F G4 Test Conditions Lead Code Configuration B C E F Single Series Common Anode Common Cathode 3 Electrical Specifications, TC = +25°C, each diode, continued Typical Parameters Part Number HSMP- Total Resistance Carrier Lifetime RT (Ω) τ (ns) Reverse Recovery Time Trr (ns) Total Capacitance (pF) 381A Series 386A Series 389A Series 75 22 3.8 1500 500 200* 300 80 — 0.27 0.20 — Test Conditions IF = 1 mA f = 100 MHz IF = 50 mA TR = 250 mA IF = 10 mA* IR = 6 mA* VR = 10 V IF = 20 mA 90% Recovery 50 V Note: 1. Package marking code is laser marked. High Frequency (Low Inductance, 500 MHz – 3 GHz PIN Diodes Part Number HSMP481B 482B 489B Minimum Maximum Typical Maximum Typical Package Breakdown Series Total Total Total Marking Voltage Resistance Capacitance Capacitance Inductance Code Configuration VBR (V) R S (Ω) C T (pF) C T (pF) L T (nH) Application EB FA GA Test Conditions Dual Cathode Dual Anode Dual Anode 100 50 100 3.0 0.6* 2.5** 0.35 0.75* 0.33** 0.4 1.0 0.375* 1.0 1.0* 1.0 VR = VBR Measure IR ≤ 10 µA IF = 100 mA IF = 10 mA* IF = 5 mA** VR = 50 V f = 1 MHz VR = 20 V* VR = 5 V** VR = 50 V f = 1 MHz VR = 5 V* f =500 MHz – 3 GHz VR = 20 V* Attenuator Limiter Switch 4 Typical Performance, TC = 25°C 0.35 0.40 0.35 1 MHz 0.30 30 MHz 0.20 frequency>100 MHz 0 2 4 6 8 1 MHz 0.25 100 MHz 0.20 1 GHz 0 REVERSE VOLTAGE (V) 100 10 4 6 8 10 12 14 16 18 20 1.2 1 HSMP-482B 0.8 0.6 0.4 0 Diode Mounted as a 115 Series Switch in a 50Ω Microstrip and 110 Tested at 123 MHz 105 HSMP-3880 HSMP-389B/C/E/F 100 95 90 HSMP-386B/C/E/F 1 10 30 IF – FORWARD BIAS CURRENT (mA) Figure 7. 2nd Harmonic Input Intercept Point vs. Forward Bias Current for Switch Diodes. 10 20 30 40 90 80 70 50 40 1000 50 100 10 DIODE RF RESISTANCE (OHMS) 100 Figure 6. 2nd Harmonic Input Intercept Point vs. Diode RF Resistance for Attenuator Diodes. 1000 VR = 2V VR = 5V 10 VR = 10V 1 10 HSMP-381B/C/E/F 60 Figure 5. Capacitance vs. Reverse Voltage at 1 MHz. Trr – REVERSE RECOVERY TIME (ns) 120 0 Diode Mounted as a 110 Series Attenuator in a 50Ω Microstrip and 100 Tested at 123 MHz VR – REVERSE VOLTAGE (V) Figure 4. RF Resistance vs. Forward Bias Current for HSMP-381B/C/E/F Series and HSMP-481B. 85 Figure 3. Total RF Resistance at 25° C vs. Forward Bias Current. 120 HSMP-381B/C/E/F HSMP-386B/C/E/F HSMP-389B/C/E/F 0.2 1.0 0.01 0.1 1 10 100 IF – FORWARD BIAS CURRENT (mA) INPUT INTERCEPT POINT (dBm) 2 0.1 0.01 0.1 1 10 100 IF – FORWARD BIAS CURRENT (mA) Figure 2. RF Capacitance vs. Reverse Bias, HSMP-386B/C/E/F Series. CT – CAPACITANCE (pF) TOTAL RF RESISTANCE (OHMS) 1000 HSMP-482B 1 1.4 TA = +85°C TA = +25°C TA = –55°C HSMP386B/C/E/F 10 REVERSE VOLTAGE (V) Figure 1. RF Capacitance vs. Reverse Bias, HSMP-381B/C/E/F Series. 10000 100 HSMP-389B/C/E/F, -489B 0.15 10 12 14 16 18 20 1000 INPUT INTERCEPT POINT (dBm) 0.15 HSMP-381B/C/E/F, -481B 0.30 20 30 FORWARD CURRENT (mA) Figure 8. Reverse Recovery Time vs. Forward Current for Various Reverse Voltages. HSMP-482B. Trr - REVERSE RECOVERY TIME (nS) 0.25 10000 RF RESISTANCE (OHMS) TOTAL CAPACITANCE (pF) TOTAL CAPACITANCE (pF) 0.45 VR = 5V VR = 10V 100 VR = 20V 10 10 20 30 FORWARD CURRENT (mA) Figure 9. Reverse Recovery Time vs. Forward Current for Various Reverse Voltages. HSMP-386B/C/E/F Series. 5 200 100 160 VR = –2V 120 80 VR = –5V 40 VR = –10V 0 10 15 20 25 10 1 0.1 0.01 30 100 IF – FORWARD CURRENT (mA) IF – FORWARD CURRENT (mA) Trr – REVERSE RECOVERY TIME (nS) Typical Performance, TC = 25°C 125°C 0 FORWARD CURRENT (mA) 25°C –50°C 0.6 0.8 1.0 1.2 IF – FORWARD CURRENT (mA) 100 10 1 0.1 125°C 0 0.2 0.4 25°C –50°C 0.6 0.8 1.0 1.2 VF – FORWARD VOLTAGE (V) Figure 13. Forward Current vs. Forward Voltage. HSMP-386B/C/E/F Series. 10 1 0.1 0.01 125°C 25°C –50°C 0 0.2 0.4 0.6 0.8 1.0 1 0.1 125°C 25°C –50°C 0.01 0 0.2 0.4 0.6 0.8 1.0 VF – FORWARD VOLTAGE (mA) Figure 11. Forward Current vs. Forward Voltage. HSMP-381B/C/E/F Series and HSMP-481B. 100 IF – FORWARD CURRENT (mA) 0.4 VF – FORWARD VOLTAGE (mA) Figure 10. Typical Reverse Recovery Time vs. Reverse Voltage. HSMP-389B/C/E/F Series. 0.01 0.2 10 1.2 VF – FORWARD VOLTAGE (V) Figure 14. Forward Current vs. Forward Voltage. HSMP-389B/C/E/F Series and HSMP-489B. Figure 12. Forward Current vs. Forward Voltage. HSMP-482B. 1.2 6 Typical Applications for Multiple Diode Products RF COMMON RF COMMON RF 1 RF 2 RF 2 RF 1 BIAS 2 BIAS 1 Figure 15. Simple SPDT Switch, Using Only Positive Bias Current. BIAS BIAS Figure 16. High Isolation SPDT Switch. RF COMMON RF COMMON BIAS RF 1 RF 2 RF 2 RF 1 BIAS Figure 17. SPDT Switch Using Both Positive and Negative Bias Current. Figure 18. Very High Isolation SPDT Switch. 7 Typical Applications for Multiple Diode Products (continued) VARIABLE BIAS RF IN/OUT INPUT FIXED BIAS VOLTAGE Figure 19. Four Diode π Attenuator. BIAS Figure 20. High Isolation SPST Switch (Repeat Cells as Required). 8 Typical Applications for HSMP-48XX Low Inductance Series 3 3 Microstrip Series Connection for HSMP-48XB Series In order to take full advantage of the low inductance of the HSMP-48XB series when using them in series applications, both lead 1 and lead 2 should be connected together, as shown in Figure 21. 1 2 1 HSMP-481B 2 HSMP-489B Figure 21. Internal Connections. Figure 22. Circuit Layout. Microstrip Shunt Connections for HSMP-48XB Series In Figure 23, the center conductor of the microstrip line is interrupted and leads 1 and 2 of the HSMP-48XB series diode are placed across the resulting gap. This forces the 0.5 nH lead inductance of leads 1 and 2 to appear as part of a low pass filter, reducing the shunt parasitic inductance and increasing the maximum available attenuation. The 0.3 nH of shunt inductance external to the diode is created by the via holes, and is a good estimate for 0.032" thick material. 50 OHM MICROSTRIP LINES PAD CONNECTED TO GROUND BY TWO VIA HOLES Figure 23. Circuit Layout. 1.5 nH 1.5 nH 0.3 pF* 0.3 nH 0.3 nH *0.8 pF TYPICAL FOR HSMP-482B Figure 24. Equivalent Circuit. 9 Typical Applications for HSMP-48XX Low Inductance Series (continued) Co-Planar Waveguide Shunt Connection for HSMP-48XB Series Co-Planar waveguide, with ground on the top side of the printed circuit board, is shown in Figure 25. Since it eliminates the need for via holes to ground, it offers lower shunt parasitic inductance and higher maximum attenuation when compared to a microstrip circuit. Co-Planar Waveguide Groundplane Center Conductor Groundplane Figure 25. Circuit Layout. 0.3 pF* 0.75 nH *0.8 pF TYPICAL FOR HSMP-482B Figure 26. Equivalent Circuit. 10 SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT-323 (SC-70) package is shown in Figure 27 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair performance. 0.026 0.07 0.035 0.016 Figure 27. PCB Pad Layout (dimensions in inches). SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT-323 package, will reach solder reflow temperatures faster than those with a greater mass. HP’s SOT-323 diodes have been qualified to the time-temperature profile shown in Figure 28. This profile is representative of an IR reflow type of surface mount assembly process. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 235 °C. These parameters are typical for a surface mount assembly process for HP SOT-323 diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. 250 TMAX 200 TEMPERATURE (°C) Assembly Information 150 Reflow Zone 100 Preheat Zone Cool Down Zone 50 0 0 60 120 180 TIME (seconds) Figure 28. Surface Mount Assembly Profile. 240 300 11 Device Orientation REEL TOP VIEW END VIEW 4 mm 8 mm CARRIER TAPE USER FEED DIRECTION ## ## ## ## Note: “##” represents Package Marking Code. COVER TAPE Tape Dimensions For Outline SOT-323 (SC-70 3 Lead) P P2 D P0 E F W C D1 t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) K0 8° MAX. A0 DESCRIPTION 5° MAX. B0 SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 2.24 ± 0.10 2.34 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.088 ± 0.004 0.092 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.55 ± 0.05 4.00 ± 0.10 1.75 ± 0.10 0.061 ± 0.002 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 ± 0.30 0.255 ± 0.013 0.315 ± 0.012 0.010 ± 0.0005 COVER TAPE WIDTH TAPE THICKNESS C Tt 5.4 ± 0.10 0.062 ± 0.001 0.205 ± 0.004 0.0025 ± 0.00004 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 Package Dimensions Outline SOT-323 (SC-70) 1.30 (0.051) REF. 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 0.650 BSC (0.025) 0.425 (0.017) TYP. 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.30 REF. 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 10° 0.30 (0.012) 0.10 (0.004) 0.20 (0.008) 0.10 (0.004) DIMENSIONS ARE IN MILLIMETERS (INCHES) Package Characteristics Lead Material ........................................................................................ Copper Lead Finish............................................................................. Tin-Lead 85/15% Maximum Soldering Temperature ............................... 260°C for 5 seconds Minimum Lead Strength ........................................................... 2 pounds pull Typical Package Inductance ................................................................... 2 nH Typical Package Capacitance .............................. 0.08 pF (opposite leads) Ordering Information Specify part number followed by option. For example: HSMP- 38XA – XXX www.hp.com/go/rf Bulk or Tape and Reel Option For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Part Number Surface Mount PIN Hewlett-Packard Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Option – BLK = Bulk, 100 pcs. per antistatic bag Option – TR1 = Tape and Reel, 3000 devices per 7" reel Japan: (81 3) 3335-8152 Conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.” Standard Quantity is 3,000 Devices per Reel. Data subject to change. Copyright © 1998 Hewlett-Packard Co. Europe: Call your local HP sales office. Obsoletes 5966-2323E Printed in U.S.A. 5967-6070E (5/98)