IXYS LBA110LS Dual single-pole, combination optomos relay Datasheet

LBA110L
Dual Single-Pole, Combination
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
350
±120
35
Units
VP
mArms / mADC

Features
• 3750Vrms Input/Output Isolation
• Normally Open Relay is a Current-Limiting Device
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Versions Available
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket
Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Description
LBA110L is a combination device comprising one
normally open (1-Form-A) and one normally closed
(1-Form-B) solid state relays. Both relays are
independent, 350V, 120mA, 35 devices designed to
provide an ideal solution where a complementary relay
pair (1-Form-A / 1-Form-B) is required.
The normally open (1-Form-A) relay is configured as a
current-limiting device.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 004
Ordering Information
Part #
LBA110L
LBA110PL
Description
8-Pin DIP (50/Tube)
8-Pin Flatpack (50/Tube)
LBA110PLTR
8-Pin Flatpack (1000/Reel)
LBA110LS
8-Pin Surface Mount (50/Tube)
LBA110LSTR
8-Pin Surface Mount (1,000/Reel)
Pin Configuration
+ Control - Normally Closed
– Control - Normally Closed
+ Control - Normally Open
– Control - Normally Open
1
8
2
7
3
6
4
5
Switching Characteristics of
Normally Open
(Form A) Devices
Form-B
IF
IF
ILOAD
90%
ton
Pb
DS-LBA110L-R06
Normally Open Pole
Switching Characteristics of
Normally Closed
(Form B) Devices
Form-A
ILOAD
Normally Closed Pole
90%
10%
10%
toff
toff
ton
e3
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1
INTEGRATED CIRCUITS DIVISION
LBA110L
Absolute Maximum Ratings @ 25°C
Parameter
Ratings
Blocking Voltage
350
Reverse Input Voltage
5
Input Control Current
50
Peak (10ms)
1
1
Input Power Dissipation
150
800
Total Power Dissipation 2
Isolation Voltage, Input to Output
3750
Operational Temperature
-40 to +85
Storage Temperature
-40 to +125
1
2
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Derate linearly 1.33 mW / °C
Derate linearly 6.67 mW / °C
Electrical Characteristics @ 25°C
Parameter
Output Characteristics
Load Current
Continuous 1
Peak (1-Form-B Relay Only)
Load Current Limiting (1-Form-A Relay Only)
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
2
Conditions
Symbol
Min
Typ
Max
Units
t =10ms
IL=120mA
VL=350VP
IL
ILPK
ICL
RON
ILEAK
±130
-
±170
23
-
±120
±350
±210
35
1
mArms / mADC
mAP
mA

VL=50V, f=1MHz
ton
toff
COUT
-
25
3
3
-
IL=120mA
IF=5mA
VR=5V
IF
VF
IR
0.4
0.9
-
0.7
1.2
-
5
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
IF=5mA, VL=10V
A
ms
pF
If both poles operate, then the load current must be derated so as not to exceed the package power dissipation value.
Measurement taken within one (1) second of on-time.
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R06
INTEGRATED CIRCUITS DIVISION
LBA110L
Form-A/Form-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Device Count (N)
30
25
20
15
10
5
0
1.17
Typical Leakage vs. Temperature
Measured Across Pins 5&6 or 7&8
1.8
0.030
1.6
0.025
Leakage (PA)
LED Forward Voltage Drop (V)
35
Typical LED Forward Voltage Drop
vs. Temperature
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
1.4
IF=50mA
IF=30mA
IF=20mA
IF=10mA
IF=5mA
1.2
1.0
0.020
0.015
0.010
0.005
0.8
-40
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
-20
0
20
40
60
80
Temperature (ºC)
100
0
-40
120
-20
0
20
40
60
80
100
Temperature (ºC)
Form-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Form-A
Typical Turn-On Time
(N=50, IF=5mA, IL=120mADC)
25
15
10
5
0
15
10
5
0.65
20
25
15
10
5
0.08
0.13
0.18
Turn-Off Time (ms)
0.5
0.7
0.9
1.1
1.3
LED Current (mA)
1.5
15
10
15.8
0.23
Form-A
Typical IF for Switch Dropout
(N=50, IL=120mADC)
16.1
16.4 16.7 17.0 17.3
On-Resistance (:)
17.6
Form-A
Typical Blocking Voltage Distribution
(N=50)
35
30
20
15
10
5
25
20
15
10
5
0
0
20
0
0.03
Form-A
Typical IF for Switch Operation
(N=50, IL=120mADC)
25
5
Device Count (N)
0.35
0.45
0.55
Turn-On Time (ms)
Device Count (N)
Device Count (N)
0.25
Form-A
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=120mADC)
30
20
0
0.15
25
35
Device Count (N)
20
Device Count (N)
Device Count (N)
25
Form-A
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mADC)
0
0.15
0.45
0.75 1.05 1.35
LED Current (mA)
1.65
1.95
376.8 378.3 379.8 381.3 382.8 384.3 385.8
Blocking Voltage (VP)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R06
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3
INTEGRATED CIRCUITS DIVISION
LBA110L
Form-A PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
FormA
Typical Turn-On Time
vs. LED Forward Current
(IL=120mADC)
0.092
20
0.25
0.20
0.088
On-Resistance (:)
0.30
0.15
0.086
0.084
0.082
0.080
0.078
0.074
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
Form-A
Typical Turn-On Time
vs. Temperature
(IL=120mADC)
0.50
0.45
0.40
Turn-Off TIme (ms)
IF=5mA
IF=10mA
0.35
0.30
0.25
IF=20mA
0.20
0.15
-40
-20
0
20
40
60
Temperature (ºC)
80
10 15 20 25 30 35 40
LED Forward Current (mA)
45
14
12
50
-40
Form-A
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=120mADC)
-20
0
20
40
60
Temperature (ºC)
80
100
Form A
Maximum Load Current
vs. Temperature
180
160
140
120
100
IF=20mA
IF=10mA
IF=5mA
80
60
40
20
0
-40
Form-A
Typical IF for Switch Operation
vs. Temperature
(IL=120mADC)
2.5
5
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
100
16
8
0
Load Current (mA)
0
18
10
0.076
0.10
Turn-On Time (ms)
Form-A
Typical On-Resistance vs. Temperature
(IF=5mA, IL=120mADC)
0.090
0.35
Turn-Off Time (ms)
Turn-On Time (ms)
0.40
Form-A
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mADC)
-20
0
20
40
60
Temperature (ºC)
80
-40
100
Form-A
Typical IF for Switch Dropout
vs. Temperature
(IL=120mADC)
-20
0
20
40
60
80
Temperature (ºC)
100
120
80
100
Form-A
Typical Blocking Voltage
vs. Temperature
400
2.5
1.5
1.0
0.5
Blocking Voltage (VP)
LED Current (mA)
LED Current (mA)
395
2.0
2.0
1.5
1.0
0.5
390
385
380
375
370
365
360
0
355
0
-20
0
20
40
60
Temperature (ºC)
Load Current (mA)
150
80
100
-40
-20
0
20
40
60
Temperature (ºC)
100
50
0
-50
-100
-150
-2.0
80
100
-40
-20
0
20
40
60
Temperature (ºC)
Form-A
Typical Current Limiting Characteristics
vs. Temperature
(IF=5mA)
Form-A
Typical Load Current vs. Load Voltage
(IF=5mA)
250
Current Limit (mA)
-40
200
150
100
50
0
-1.5 -1.0 -0.5
0
0.5 1.0
Load Voltage (V)
1.5
2.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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R06
INTEGRATED CIRCUITS DIVISION
LBA110L
Form-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Form-B
Typical Turn-On Time
(N=50, IF=5mA, IL=120mADC)
30
30
30
15
10
5
Device Count (N)
20
20
15
10
20
15
10
5
5
0
0
0
0.14
0.18
0.22
0.26
Turn-On Time (ms)
0.30
0.25
Form-B
Typical IF for Switch Operation
(N=50, IL=120mADC)
30
Device Count (N)
20
15
10
5
27.8
0.75
Form-B
Typical IF for Switch Dropout
(N=50, IL=120mADC)
25
25
0.35
0.45
0.55
0.65
Turn-Off Time (ms)
0.7
1.1
1.3
1.5
LED Current (mA)
15
10
5
20
15
10
5
0
0.35
0.45
0.55 0.65 0.75
LED Current (mA)
0.85
0.95
386.3 388.8 391.3 393.8 396.3 398.8 401.3
Blocking Voltage (VP)
Form-B
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mADC)
0.7
0.25
Form-B
Typical On-Resistance vs. Temperature
(IF=5mA, IL=120mADC)
60
0.15
0.10
On-Resistance (:)
Turn-Off Time (ms)
Turn-On Time (ms)
0.6
0.20
0.5
0.4
0.3
0.2
0
0
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
FormB
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=120mADC)
0.35
5
10 15 20 25 30 35 40
LED Forward Current (mA)
30
20
50
45
-40
Form-B
Typical Turn-Off Time
vs. Temperature
(IL=120mADC)
0.7
-20
0
20
40
60
Temperature (ºC)
80
100
Form-B
Maximum Load Current vs. Temperature
(IF=5mA)
180
Turn-Off Time (ms)
0.25
0.20
0.15
0.10
0.6
0.5
0.4
IF=20mA
0.2
0
0.1
-20
0
20
40
60
Temperature (ºC)
80
100
IF=10mA
0.3
0.05
-40
IF=5mA
Load Current (mA)
160
0.30
Turn-On Time (ms)
40
0
0
50
50
10
0.1
0.05
32.0
25
20
1.9
Form-B
Typical Turn-On Time
vs. LED Forward Current
(IL=120mADC)
29.2 29.9 30.6 31.3
On-Resistance (:)
30
0
0
28.5
Form-B
Typical Blocking Voltage Distribution
(N=50)
Device Count (N)
0.10
Form-B
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=120mADC)
25
25
Device Count (N)
Device Count (N)
25
Device Count (N)
Form-B
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mADC)
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R06
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5
INTEGRATED CIRCUITS DIVISION
LBA110L
Form-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Form-B
Typical IF for Switch Operation
vs. Temperature
(IL=120mADC)
3.0
3.0
Form-B
Typical Blocking Voltage
vs. Temperature
2.0
1.5
1.0
0.5
Blocking Voltage (VP)
2.5
LED Current (mA)
2.5
LED Current (mA)
Form-B
Typical IF for Switch Dropout
vs. Temperature
(IL=120mADC)
2.0
1.5
1.0
0.5
0
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
Form-B
Typical Load Current vs. Load Voltage
(IF=5mA)
Load Current (A)
Load Current (mA)
100
0
-50
-100
-150
-4
-3
-2
-1
0
1
Load Voltage (V)
2
3
4
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Form-B
Energy Rating Curve
150
50
80
410
405
400
395
390
385
380
375
370
365
360
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
6
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INTEGRATED CIRCUITS DIVISION
LBA110L
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
LBA110L / LBA110LS / LBA110PL
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
LBA110L / LBA110LS
250ºC for 30 seconds
LBA110PL
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R06
e3
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7
INTEGRATED CIRCUITS DIVISION
LBA110L
MECHANICAL DIMENSIONS
LBA110L
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LBA110LS
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LBA110PL
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
2.286 MAX.
(0.090 MAX.)
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
0.203 ± 0.013
(0.008 ± 0.0005)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
8
PCB Land Pattern
Dimensions
mm
(inches)
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R06
INTEGRATED CIRCUITS DIVISION
LBA110L
MECHANICAL DIMENSIONS
LBA110LSTR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=16.00
(0.63)
Bo=10.30
(0.406)
K0 =4.90
(0.193)
Ao=10.30
(0.406)
P=12.00
(0.472)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
LBA110PLTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
P = 12.00
(0.472)
User Direction of Feed
Ao = 10.30
(0.406)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
9
Specification: DS-LBA110L-R06
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
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