CEL MC-7831-HA-AZ Necs 1 ghz gaas catv 18 db push-pull amplifier Datasheet

MC-7831-HA
NEC's 1 GHz GaAs CATV
18 dB PUSH-PULL AMPLIFIER
OUTLINE DIMENSIONS (Units in mm)
FEATURES
• SPECIFIED FOR INCREASED BANDWIDTH TO 1 GHz
• GaAs ACTIVE DEVICES
PACKAGE OUTLINE H02
45.08 MAX
• LOW DISTORTION
• HIGH LINEAR GAIN:
MC-7831-HA - GL = 18 dB MIN at f = 870 MHz
• LOW RETURN LOSS
• LOW GAIN CHANGE OVER TEMPERATURE
• SPECIFIED FOR 79, 110, and 132 CHANNELS PERFORMANCE
• HIGH RELIABILITY AND RUGGEDNESS:
Withstands environmental extremes as well as Silicon
devices (Surge, ESD, Etc.)
38.1±0.25
27.5 MAX
3.2 MAX
4.25
+ 0.25
- 0.35
VDD
14.85 MAX
5
4.0±0.25
8.1 MAX
19.05±0.38
1
9
In
Out
6-32 unc 2B
25.4±0.25
2 3 7 8
2.54±0.25
0.51±0.050
Gnd
21.5 MAX
5
7 8 9
DESCRIPTION
NEC's MC-7831-HA is a GaAs Multi-Chip Module designed
for use as input stages in CATV applications up to 1 GHz. Because this unit is a GaAs device, it has low distortion, low noise
figure, and low return loss across the entire frequency band.
4.19±0.13
2.62–0.35
12.9 MAX
1 2 3
10.75±0.25
2.54±0.38
A
6.3
0.38.. A
2.5
±0.05
Like the previous generation of products, these devices survive such hazards as surge and ESD as well as their silicon
competitors, but deliver superior performance with low DC
current required.
APPLICATIONS
• CATV HEADEND SYSTEMS
• CATV OPTICAL NODES
• CATV DISTRIBUTION AMPS
All devices are assembled and tested using fully automated
equipment to maximize consistency in part to part performance, and reliability is assured by NEC's stringent quality
and process control procedures. These parts come in industry
compatible hybrid packages.
ELECTRICAL CHARACTERISTICS (TA = 30±5 °C, VDD = 24 V, ZS = ZL = 75 Ω)
PART NUMBER
SYMBOLS
UNITS
MIN
TYP
MAX
Frequency Range
Linear Gain
Gain Slope
Gain Flatness 1
Gain Flatness 2
Noise Figure 1
Noise Figure 2
MHz
dB
dB
dB
dB
dB
RLin
Input Return Loss
dB
RLout
Output Return Loss
dB
50
18.0
0.2
-0.35
-0.35
–
–
20.0
19.0
17.5
16.0
10.0
20.0
19.0
17.5
16.0
12.0
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
1000
21.0
1.0
+0.35
+0.85
6.5
7.0
–
–
–
–
–
–
–
–
–
–
BW
GL
S
Gf1
Gf2
NF
CHARACTERISTICS
MC-7831-HA
(Continued on next page)
TEST CONDITIONS
f = 870 MHz
f = 40 to 870 MHz
40 to 870 MHz
40 to 1000 MHz
f = 50 MHz
f = 870 MHz
40 to 160MHz
160 to 320 MHz
320 to 640 MHz
640 to 870 MHz
870 to 1000 MHz
40 to 160MHz
160 to 320 MHz
320 to 640 MHz
640 to 870 MHz
870 to 1000 MHz
California Eastern Laboratories
MC-7831-HA
ELECTRICAL CHARACTERISTICS (TA = 30±5 °C, VDD = 24 V, ZS = ZL = 75 Ω)
IDD
CTB
XMod
CSO
Operating Current
Composite Triple Beat
Cross Modulation
Composite Second Order
mA
dBc
dBc
dBc
180
–
–
–
ABSOLUTE MAXIMUM RATINGS1 (TCASE= 30 °C)
SYMBOLS
VDD
PARAMETERS
Supply Voltage
UNITS
RATINGS
V
30
VI
Input Voltage2
dBmV
65
TC
Operating Case Temperature
°C
-30 to +100
Storage Temperature
°C
-40 to +100
TSTG
Note:
1. Operation in excess of any one of these parameters may result in permanent damage.
2. Maximum single channel power applied to the input for 1 minute with no measurable degradation in performance.
–
–
–
–
240
-57
-50
-57
RF OFF
f = 40 to 870 MHz; 110 Channels,
VOUT = 44 dBmV, Flat
RECOMMENDED
OPERATING CONDITIONS (Zs = ZL = 75Ω)
SYMBOLS
PARAMETERS
UNITS MIN TYP MAX
VDD
Supply Voltage V
MC-7831-HA
23.5 24.0 24.5
Vi
Input Voltage1
dBmV
MC-7831-HA
– 21.0 27.5
TC
Operating Case °C
Temperature
MC-7831-HA
-30 +25 +85
Note:
1. Test Conditions: 110 Channels, Flat
ORDERING INFORMATION
PART NUMBER
Package
QUANTITY
MC-7831-HA-AZ
7-pin special with heatsink
50pcs max/ Tray
NOTES ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
1. The space between PC board and root of the lead should be kept
more than 1 mm to prevent undesired stress on the lead and also
should be kept less than 4 mm to prevent undesired parasitic
inductance.
This product should be soldered in the following recommended
conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives.
Recommended space is 2.0 to 3.0 mm typical.
2. Recommended torque strength of the screw is 59 to 78 Ncm.
3. Form the ground pattern as wide as possible to minimize ground
impedance. (to prevent undesired oscillation)
All the ground pins must be connected together with wide ground
pattern to decrease impedance difference.
Soldering
Method
Pin Part Heating
Soldering
Conditions
Condition
Symbol
Pin area temperature: less
–
than 260°C1
Hour: Within 2 sec./pin
Note.
1. The point of pin part heating must be kept at a distance of more
than 1.2 mm from the root of lead.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these prod
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
ucts can reasonably
so at their own risk and
10/03/2005
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
Not Detected
Lead (Pb)
< 1000 PPM
Mercury
< 1000 PPM
Not Detected
Cadmium
< 100 PPM
Not Detected
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
-AZ
(*)
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
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See CEL Terms and Conditions for additional clarification of warranties and liability.
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