STMicroelectronics M95320-RDW6TP 32 kbit and 64 kbit serial spi bus eeproms with high speed clock Datasheet

M95320 M95320-W M95320-R
M95640 M95640-W M95640-R
32 Kbit and 64 Kbit Serial SPI bus EEPROMs
with high speed clock
Feature summary
■
Compatible with SPI Bus Serial Interface
(Positive Clock SPI Modes)
■
Single Supply Voltage:
– 4.5 to 5.5V for M95320 and M95640
– 2.5 to 5.5V for M95320-W and M95320-W
– 1.8 to 5.5V for M95320-R and M95640-R
■
10MHz, 5MHz or 2MHz clock rates
■
5ms or 10ms Write Time
■
Status Register
■
Hardware Protection of the Status Register
■
Byte and Page Write (up to 32 Bytes)
■
Self-Timed Programming Cycle
■
Adjustable Size Read-Only EEPROM Area
■
Enhanced ESD Protection
■
More than 1 million Write cycles
■
More than 40-Year Data Retention
■
Packages
– ECOPACK® (RoHS compliant)
July 2006
SO8 (MN)
150 mil width
TSSOP8 (DW)
169 mil width
MLP8 (MB)
2x3 mm
Rev 6
1/44
www.st.com
1
Contents
M95320, M95640, M95320-x, M95640-x
Contents
1
Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
Serial Data Output (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.0.2
Serial Data Input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.0.3
Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.0.4
Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.0.5
Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.0.6
Write Protect (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Connecting to the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1
4
2.0.1
SPI modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Operating features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1
Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1.1
4.2
4.1.2
Operating supply voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1.3
Internal device Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1.4
Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Active Power and Standby Power modes . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2.1
Hold condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.4
Data protection and protocol control . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5
Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6
Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2/44
6.1
Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2
Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.3
Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.3.1
WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.3.2
WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.3.3
BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.3.4
SRWD bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
M95320, M95640, M95320-x, M95640-x
7
Contents
6.4
Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.5
Read from Memory Array (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.6
Write to Memory Array (WRITE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Power-up and delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7.1
Power-up state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7.2
Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
8
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
9
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
10
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
11
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3/44
List of tables
M95320, M95640, M95320-x, M95640-x
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
4/44
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Write-Protected block size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Status Register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Protection modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Address range bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Operating conditions (M95320 and M95640) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Operating conditions (M95320-W and M95640-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Operating conditions (M95320-R and M95640-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
DC characteristics (M95320 and M95640, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . 27
DC characteristics (M95320 and M95640, device grade 3) . . . . . . . . . . . . . . . . . . . . . . . . 27
DC characteristics (M95320-W and M95640-W, device grade 6). . . . . . . . . . . . . . . . . . . . 28
DC characteristics (M95320-W and M95640-W, device grade 3). . . . . . . . . . . . . . . . . . . . 28
DC characteristics (M95320-R and M95640-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
AC characteristics (M95320 and M95640, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . 30
AC characteristics (M95320 and M95640, device grade 3) . . . . . . . . . . . . . . . . . . . . . . . . 31
AC characteristics (M95320-W and M95640-W, device grade 6). . . . . . . . . . . . . . . . . . . . 32
AC characteristics (M95320-W and M95640-W, device grade 3). . . . . . . . . . . . . . . . . . . . 33
AC characteristics (M95320-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
AC characteristics (M95640-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
SO8N – 8 lead Plastic Small Outline, 150 mils body width, package mechanical data . . . 38
TSSOP8 – 8 lead Thin Shrink Small Outline, package mechanical data . . . . . . . . . . . . . . 39
MLP8 - 8-lead Ultra thin Fine pitch Dual Flat No Lead, package mechanical data. . . . . . . 40
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
M95320, M95640, M95320-x, M95640-x
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 pin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Bus master and memory devices on the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Hold condition activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Write Enable (WREN) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write Disable (WRDI) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Read Status Register (RDSR) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Write Status Register (WRSR) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Read from Memory Array (READ) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Byte Write (WRITE) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Page Write (WRITE) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Serial Input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Hold timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
SO8N – 8 lead Plastic Small Outline, 150 mils body width, package outline . . . . . . . . . . . 38
TSSOP8 – 8 lead Thin Shrink Small Outline, package outline . . . . . . . . . . . . . . . . . . . . . . 39
MLP8 - 8-lead Ultra thin Fine pitch Dual Flat No Lead, package outline . . . . . . . . . . . . . . 40
5/44
Summary description
1
M95320, M95640, M95320-x, M95640-x
Summary description
These electrically erasable programmable memory (EEPROM) devices are accessed by a
high speed SPI-compatible bus.
The M95320, M95320-W and M95320-R are 32Kbit devices organized as 4096 x 8 bits. The
M95640, M95640-W and M95640-R are 64Kbit devices organized as 8192 x 8 bits.
The device is accessed by a simple serial interface that is SPI-compatible. The bus signals
are C, D and Q, as shown in Table 1 and Figure 1.
The device is selected when Chip Select (S) is taken Low. Communications with the device
can be interrupted using Hold (HOLD).
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages.
ECOPACK® packages are Lead-free and RoHS compliant.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 1.
Logic diagram
VCC
D
Q
C
S
M95xxx
W
HOLD
VSS
AI01789C
Figure 2.
8 pin package connections
M95xxx
S
Q
W
VSS
1
2
3
4
8
7
6
5
VCC
HOLD
C
D
AI01790D
1. See Package mechanical section for package dimensions and how to identify pin-1.
6/44
M95320, M95640, M95320-x, M95640-x
Table 1.
Summary description
Signal names
C
Serial Clock
D
Serial data Input
Q
Serial data Output
S
Chip Select
W
Write Protect
HOLD
Hold
VCC
Supply Voltage
VSS
Ground
7/44
Signal description
2
M95320, M95640, M95320-x, M95640-x
Signal description
During all operations, VCC must be held stable and within the specified valid range:
VCC(min) to VCC(max).
All of the input and output signals must be held High or Low (according to voltages of VIH,
VOH, VIL or VOL, as specified in Table 13 to Table 17). These signals are described next.
2.0.1
Serial Data Output (Q)
This output signal is used to transfer data serially out of the device. Data is shifted out on the
falling edge of Serial Clock (C).
2.0.2
Serial Data Input (D)
This input signal is used to transfer data serially into the device. It receives instructions,
addresses, and the data to be written. Values are latched on the rising edge of Serial Clock
(C).
2.0.3
Serial Clock (C)
This input signal provides the timing of the serial interface. Instructions, addresses, or data
present at Serial Data Input (D) are latched on the rising edge of Serial Clock (C). Data on
Serial Data Output (Q) changes after the falling edge of Serial Clock (C).
2.0.4
Chip Select (S)
When this input signal is High, the device is deselected and Serial Data Output (Q) is at high
impedance. Unless an internal Write cycle is in progress, the device will be in the Standby
Power mode. Driving Chip Select (S) Low selects the device, placing it in the Active Power
mode.
After Power-up, a falling edge on Chip Select (S) is required prior to the start of any
instruction.
2.0.5
Hold (HOLD)
The Hold (HOLD) signal is used to pause any serial communications with the device without
deselecting the device.
During the Hold condition, the Serial Data Output (Q) is high impedance, and Serial Data
Input (D) and Serial Clock (C) are Don’t Care.
To start the Hold condition, the device must be selected, with Chip Select (S) driven Low.
2.0.6
Write Protect (W)
The main purpose of this input signal is to freeze the size of the area of memory that is
protected against Write instructions (as specified by the values in the BP1 and BP0 bits of
the Status Register).
This pin must be driven either High or Low, and must be stable during all write operations.
8/44
M95320, M95640, M95320-x, M95640-x
3
Connecting to the SPI bus
Connecting to the SPI bus
These devices are fully compatible with the SPI protocol.
All instructions, addresses and input data bytes are shifted in to the device, most significant
bit first. The Serial Data Input (D) is sampled on the first rising edge of the Serial Clock (C)
after Chip Select (S) goes Low.
All output data bytes are shifted out of the device, most significant bit first. The Serial Data
Output (Q) is latched on the first falling edge of the Serial Clock (C) after the instruction
(such as the Read from Memory Array and Read Status Register instructions) have been
clocked into the device.
Figure 3 shows three devices, connected to an MCU, on a SPI bus. Only one device is
selected at a time, so only one device drives the Serial Data Output (Q) line at a time, all the
others being high impedance.
Figure 3.
Bus master and memory devices on the SPI bus
VSS
VCC
R(2)
SDO
SPI Interface with
(CPOL, CPHA) =
(0, 0) or (1, 1)
SDI
SCK
VCC
C Q D
SPI Bus Master
SPI Memory
Device
R(2)
CS3
CS2
VCC
C Q D
VSS
C Q D
VCC
VSS
VSS
SPI Memory R(2)
Device
R(2)
SPI Memory
Device
CS1
S
W
HOLD
S
W
HOLD
S
W
HOLD
AI12836
1. The Write Protect (W) and Hold (HOLD) signals should be driven, High or Low as appropriate.
2. These pull-up resistors, R, ensure that the memory devices are not selected if the Bus Master leaves the S line in the highimpedance state. As the Bus Master may enter a state where all inputs/outputs are in high impedance at the same time
(e.g.: when the Bus Master is reset), the clock line (C) must be connected to an external pull-down resistor so that, when all
inputs/outputs become high impedance, S is pulled High while C is pulled Low (thus ensuring that S and C do not become
High at the same time, and so, that the tSHCH requirement is met).
9/44
Connecting to the SPI bus
3.1
M95320, M95640, M95320-x, M95640-x
SPI modes
These devices can be driven by a microcontroller with its SPI peripheral running in either of
the two following modes:
●
CPOL=0, CPHA=0
●
CPOL=1, CPHA=1
For these two modes, input data is latched in on the rising edge of Serial Clock (C), and
output data is available from the falling edge of Serial Clock (C).
The difference between the two modes, as shown in Figure 4, is the clock polarity when the
bus master is in Stand-by mode and not transferring data:
●
C remains at 0 for (CPOL=0, CPHA=0)
●
C remains at 1 for (CPOL=1, CPHA=1)
Figure 4.
SPI modes supported
CPOL CPHA
0
0
C
1
1
C
D
Q
MSB
MSB
AI01438B
10/44
M95320, M95640, M95320-x, M95640-x
4
Operating features
4.1
Supply voltage (VCC)
4.1.1
Operating supply voltage VCC
Operating features
Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage
within the specified [VCC(min), VCC(max)] range must be applied (see Table 8.). In order to
secure a stable DC supply voltage, it is recommended to decouple the VCC line with a
suitable capacitor (usually of the order of 10nF to 100nF) close to the VCC/VSS package
pins.
This voltage must remain stable and valid until the end of the transmission of the instruction
and, for a Write instruction, until the completion of the internal write cycle (tW).
4.1.2
Power-up conditions
When the power supply is turned on, VCC rises from VSS to VCC. During this time, the Chip
Select (S) is not allowed to float but must follow the VCC voltage, therefore the S line should
be connected to VCC via a suitable pull-up resistor.
In addition, the Chip Select (S) input offers a built-in safety feature, as the S input is edge
sensitive as well as level sensitive: after Power-up, the device does not become selected
until a falling edge has first been detected on Chip Select (S). This ensures that Chip Select
(S) must have been High, prior to going Low to start the first operation.
The VCC rise time must not be faster than 1V/µs.
4.1.3
Internal device Reset
In order to prevent inadvertent Write operations during Power-up, a Power On Reset (POR)
circuit is included. At Power-up (continuous rise of VCC), the device will not respond to any
instruction until VCC has reached the Power On Reset threshold voltage (this threshold is
lower than the minimum VCC operating voltage defined in Tables XX).
When VCC has passed the POR threshold, the device is reset and in the following state:
●
Standby Power mode
●
deselected (at next Power-up, a falling edge is required on Chip Select (S) before any
instructions can be started).
●
not in the Hold Condition
Status Register state:
●
the Write Enable Latch (WEL) is reset to 0
●
Write In Progress (WIP) is reset to 0. The SRWD, BP1 and BP0 bits of the Status
Register are in the same state as when the power was last removed (they are nonvolatile bits).
11/44
Operating features
4.1.4
M95320, M95640, M95320-x, M95640-x
Power-down
At Power-down (continuous decrease of VCC), as soon as VCC drops from the normal
operating voltage to below the Power On Reset threshold voltage, the device stops
responding to any instruction sent to it.
During Power-down, the device must be deselected and in Standby Power mode (that is
there should be no internal Write cycle in progress). Chip Select (S) should be allowed to
follow the voltage applied on VCC.
4.2
Active Power and Standby Power modes
When Chip Select (S) is Low, the device is selected, and in the Active Power mode. The
device consumes ICC, as specified in Table 13 to Table 17.
When Chip Select (S) is High, the device is deselected. If an Erase/Write cycle is not
currently in progress, the device then goes in to the Standby Power mode, and the device
consumption drops to ICC1.
4.2.1
Hold condition
The Hold (HOLD) signal is used to pause any serial communications with the device without
resetting the clocking sequence.
During the Hold condition, the Serial Data Output (Q) is high impedance, and Serial Data
Input (D) and Serial Clock (C) are Don’t Care.
To enter the Hold condition, the device must be selected, with Chip Select (S) Low.
Normally, the device is kept selected, for the whole duration of the Hold condition.
Deselecting the device while it is in the Hold condition, has the effect of resetting the state of
the device, and this mechanism can be used if it is required to reset any processes that had
been in progress.
The Hold condition starts when the Hold (HOLD) signal is driven Low at the same time as
Serial Clock (C) already being Low (as shown in Figure 5).
The Hold condition ends when the Hold (HOLD) signal is driven High at the same time as
Serial Clock (C) already being Low.
Figure 5 also shows what happens if the rising and falling edges are not timed to coincide
with Serial Clock (C) being Low.
Figure 5.
Hold condition activation
C
HOLD
Hold
Condition
Hold
Condition
AI02029D
12/44
M95320, M95640, M95320-x, M95640-x
4.3
Operating features
Status Register
Figure 6 shows the position of the Status Register in the control logic of the device. The
Status Register contains a number of status and control bits that can be read or set (as
appropriate) by specific instructions. See Section 6.3: Read Status Register (RDSR) for a
detailed description of the Status Register bits.
4.4
Data protection and protocol control
Non-volatile memory devices can be used in environments that are particularly noisy, and
within applications that could experience problems if memory bytes are corrupted.
Consequently, the device features the following data protection mechanisms:
●
Write and Write Status Register instructions are checked that they consist of a number
of clock pulses that is a multiple of eight, before they are accepted for execution.
●
All instructions that modify data must be preceded by a Write Enable (WREN)
instruction to set the Write Enable Latch (WEL) bit. This bit is returned to its reset state
by the following events:
–
Power-up
–
Write Disable (WRDI) instruction completion
–
Write Status Register (WRSR) instruction completion
–
Write (WRITE) instruction completion
●
The Block Protect (BP1, BP0) bits allow part of the memory to be configured as readonly. This is the Software Protected Mode (SPM).
●
The Write Protect (W) signal allows the Block Protect (BP1, BP0) bits to be protected.
This is the Hardware Protected Mode (HPM).
For any instruction to be accepted, and executed, Chip Select (S) must be driven High after
the rising edge of Serial Clock (C) for the last bit of the instruction, and before the next rising
edge of Serial Clock (C).
Two points need to be noted in the previous sentence:
●
The ‘last bit of the instruction’ can be the eighth bit of the instruction code, or the eighth
bit of a data byte, depending on the instruction (except for Read Status Register
(RDSR) and Read (READ) instructions).
●
The ‘next rising edge of Serial Clock (C)’ might (or might not) be the next bus
transaction for some other device on the SPI bus.
Table 2.
Write-Protected block size
Status Register Bits
Array Addresses Protected
Protected Block
M95640, M95640-W,
M95640-R, M95640-S
M95320, M95320-W,
M95320-R, M95320-S
none
none
none
1
Upper quarter
1800h - 1FFFh
0C00h - 0FFFh
1
0
Upper half
1000h - 1FFFh
0800h - 0FFFh
1
1
Whole memory
0000h - 1FFFh
0000h - 0FFFh
BP1
BP0
0
0
0
13/44
Memory organization
5
M95320, M95640, M95320-x, M95640-x
Memory organization
The memory is organized as shown in Figure 6.
Figure 6.
Block diagram
HOLD
W
High Voltage
Generator
Control Logic
S
C
D
I/O Shift Register
Q
Address Register
and Counter
Data
Register
Size of the
Read only
EEPROM
area
Y Decoder
Status
Register
1 Page
X Decoder
AI01272C
14/44
M95320, M95640, M95320-x, M95640-x
6
Instructions
Instructions
Each instruction starts with a single-byte code, as summarized in Table 3.
If an invalid instruction is sent (one not contained in <Blue>Table 3.), the device
automatically deselects itself.
Table 3.
Instruction set
Instruction
6.1
Description
Instruction Format
WREN
Write Enable
0000 0110
WRDI
Write Disable
0000 0100
RDSR
Read Status Register
0000 0101
WRSR
Write Status Register
0000 0001
READ
Read from Memory Array
0000 0011
WRITE
Write to Memory Array
0000 0010
Write Enable (WREN)
The Write Enable Latch (WEL) bit must be set prior to each WRITE and WRSR instruction.
The only way to do this is to send a Write Enable instruction to the device.
As shown in Figure 7, to send this instruction to the device, Chip Select (S) is driven Low,
and the bits of the instruction byte are shifted in, on Serial Data Input (D). The device then
enters a wait state. It waits for a the device to be deselected, by Chip Select (S) being driven
High.
Figure 7.
Write Enable (WREN) sequence
S
0
1
2
3
4
5
6
7
C
Instruction
D
High Impedance
Q
AI02281E
15/44
Instructions
6.2
M95320, M95640, M95320-x, M95640-x
Write Disable (WRDI)
One way of resetting the Write Enable Latch (WEL) bit is to send a Write Disable instruction
to the device.
As shown in Figure 8, to send this instruction to the device, Chip Select (S) is driven Low,
and the bits of the instruction byte are shifted in, on Serial Data Input (D).
The device then enters a wait state. It waits for a the device to be deselected, by Chip Select
(S) being driven High.
The Write Enable Latch (WEL) bit, in fact, becomes reset by any of the following events:
●
Power-up
●
WRDI instruction execution
●
WRSR instruction completion
●
WRITE instruction completion.
Figure 8.
Write Disable (WRDI) sequence
S
0
1
2
3
4
5
6
7
C
Instruction
D
High Impedance
Q
AI03750D
16/44
M95320, M95640, M95320-x, M95640-x
6.3
Instructions
Read Status Register (RDSR)
The Read Status Register (RDSR) instruction allows the Status Register to be read. The
Status Register may be read at any time, even while a Write or Write Status Register cycle
is in progress. When one of these cycles is in progress, it is recommended to check the
Write In Progress (WIP) bit before sending a new instruction to the device. It is also possible
to read the Status Register continuously, as shown in Figure 9.
The Status Register format is shown in Table 4 and the status and control bits of the Status
Register are as follows:
6.3.1
WIP bit
The Write In Progress (WIP) bit indicates whether the memory is busy with a Write or Write
Status Register cycle. When set to 1, such a cycle is in progress, when reset to 0 no such
cycle is in progress.
6.3.2
WEL bit
The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
When set to 1 the internal Write Enable Latch is set, when set to 0 the internal Write Enable
Latch is reset and no Write or Write Status Register instruction is accepted.
6.3.3
BP1, BP0 bits
The Block Protect (BP1, BP0) bits are non-volatile. They define the size of the area to be
software protected against Write instructions. These bits are written with the Write Status
Register (WRSR) instruction. When one or both of the Block Protect (BP1, BP0) bits is set to
1, the relevant memory area (as defined in Table 4) becomes protected against Write
(WRITE) instructions. The Block Protect (BP1, BP0) bits can be written provided that the
Hardware Protected mode has not been set.
6.3.4
SRWD bit
The Status Register Write Disable (SRWD) bit is operated in conjunction with the Write
Protect (W) signal. The Status Register Write Disable (SRWD) bit and Write Protect (W)
signal allow the device to be put in the Hardware Protected mode (when the Status Register
Write Disable (SRWD) bit is set to 1, and Write Protect (W) is driven Low). In this mode, the
non-volatile bits of the Status Register (SRWD, BP1, BP0) become read-only bits and the
Write Status Register (WRSR) instruction is no longer accepted for execution.
Table 4.
Status Register format
b7
SRWD
b0
0
0
0
BP1
BP0
WEL
WIP
Status Register Write Protect
Block Protect Bits
Write Enable Latch Bit
Write In Progress Bit
17/44
Instructions
M95320, M95640, M95320-x, M95640-x
Figure 9.
Read Status Register (RDSR) sequence
S
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
C
Instruction
D
Status Register Out
Status Register Out
High Impedance
Q
7
6
5
4
3
MSB
2
1
0
7
6
5
4
3
2
1
0
7
MSB
AI02031E
6.4
Write Status Register (WRSR)
The Write Status Register (WRSR) instruction allows new values to be written to the Status
Register. Before it can be accepted, a Write Enable (WREN) instruction must previously
have been executed. After the Write Enable (WREN) instruction has been decoded and
executed, the device sets the Write Enable Latch (WEL).
The Write Status Register (WRSR) instruction is entered by driving Chip Select (S) Low,
followed by the instruction code and the data byte on Serial Data Input (D).
The instruction sequence is shown in Figure 10.
The Write Status Register (WRSR) instruction has no effect on b6, b5, b4, b1 and b0 of the
Status Register. b6, b5 and b4 are always read as 0.
Chip Select (S) must be driven High after the rising edge of Serial Clock (C) that latches in
the eighth bit of the data byte, and before the next rising edge of Serial Clock (C). Otherwise,
the Write Status Register (WRSR) instruction is not executed. As soon as Chip Select (S) is
driven High, the self-timed Write Status Register cycle (whose duration is tW) is initiated.
While the Write Status Register cycle is in progress, the Status Register may still be read to
check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1
during the self-timed Write Status Register cycle, and is 0 when it is completed. When the
cycle is completed, the Write Enable Latch (WEL) is reset.
The Write Status Register (WRSR) instruction allows the user to change the values of the
Block Protect (BP1, BP0) bits, to define the size of the area that is to be treated as readonly, as defined in Table 4.
The Write Status Register (WRSR) instruction also allows the user to set or reset the Status
Register Write Disable (SRWD) bit in accordance with the Write Protect (W) signal. The
Status Register Write Disable (SRWD) bit and Write Protect (W) signal allow the device to
be put in the Hardware Protected Mode (HPM). The Write Status Register (WRSR)
instruction is not executed once the Hardware Protected Mode (HPM) is entered.
The contents of the Status Register Write Disable (SRWD) and Block Protect (BP1, BP0)
bits are frozen at their current values from just before the start of the execution of Write
Status Register (WRSR) instruction. The new, updated, values take effect at the moment of
completion of the execution of Write Status Register (WRSR) instruction.
18/44
M95320, M95640, M95320-x, M95640-x
Table 5.
Instructions
Protection modes
Memory Content
W
SRWD
Signal
Bit
1
0
0
0
1
1
0
1
Mode
Write Protection of the
Status Register
Protected Area(1)
Unprotected
Area(1)
Status Register is Writable
Software (if the WREN instruction
Protected has set the WEL bit)
Write Protected
(SPM) The values in the BP1 and
BP0 bits can be changed
Ready to accept
Write instructions
Status Register is
Hardware Hardware write protected
Protected The values in the BP1 and Write Protected
(HPM) BP0 bits cannot be
changed
Ready to accept
Write instructions
1. As defined by the values in the Block Protect (BP1, BP0) bits of the Status Register, as shown in Table 2.
The protection features of the device are summarized in Table 2.
When the Status Register Write Disable (SRWD) bit of the Status Register is 0 (its initial
delivery state), it is possible to write to the Status Register provided that the Write Enable
Latch (WEL) bit has previously been set by a Write Enable (WREN) instruction, regardless
of the whether Write Protect (W) is driven High or Low.
When the Status Register Write Disable (SRWD) bit of the Status Register is set to 1, two
cases need to be considered, depending on the state of Write Protect (W):
●
If Write Protect (W) is driven High, it is possible to write to the Status Register provided
that the Write Enable Latch (WEL) bit has previously been set by a Write Enable
(WREN) instruction.
●
If Write Protect (W) is driven Low, it is not possible to write to the Status Register even
if the Write Enable Latch (WEL) bit has previously been set by a Write Enable (WREN)
instruction. (Attempts to write to the Status Register are rejected, and are not accepted
for execution). As a consequence, all the data bytes in the memory area that are
software protected (SPM) by the Block Protect (BP1, BP0) bits of the Status Register,
are also hardware protected against data modification.
Regardless of the order of the two events, the Hardware Protected Mode (HPM) can be
entered:
●
by setting the Status Register Write Disable (SRWD) bit after driving Write Protect (W)
Low
●
or by driving Write Protect (W) Low after setting the Status Register Write Disable
(SRWD) bit.
The only way to exit the Hardware Protected Mode (HPM) once entered is to pull Write
Protect (W) High.
If Write Protect (W) is permanently tied High, the Hardware Protected Mode (HPM) can
never be activated, and only the Software Protected Mode (SPM), using the Block Protect
(BP1, BP0) bits of the Status Register, can be used.
19/44
Instructions
M95320, M95640, M95320-x, M95640-x
Address range bits(1)
Table 6.
Device
32 Kbit Devices
64 Kbit Devices
Address Bits
A12-A0
A11-A0
1. b15 to b13 are Don’t Care on the 64 Kbit devices.
b15 to b12 are Don’t Care on the 32 Kbit devices.
Figure 10. Write Status Register (WRSR) sequence
S
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
C
Instruction
Status
Register In
7
D
High Impedance
6
5
4
3
2
1
0
MSB
Q
AI02282D
20/44
M95320, M95640, M95320-x, M95640-x
6.5
Instructions
Read from Memory Array (READ)
As shown in Figure 11, to send this instruction to the device, Chip Select (S) is first driven
Low. The bits of the instruction byte and address bytes are then shifted in, on Serial Data
Input (D). The address is loaded into an internal address register, and the byte of data at
that address is shifted out, on Serial Data Output (Q).
If Chip Select (S) continues to be driven Low, the internal address register is automatically
incremented, and the byte of data at the new address is shifted out.
When the highest address is reached, the address counter rolls over to zero, allowing the
Read cycle to be continued indefinitely. The whole memory can, therefore, be read with a
single READ instruction.
The Read cycle is terminated by driving Chip Select (S) High. The rising edge of the Chip
Select (S) signal can occur at any time during the cycle.
The first byte addressed can be any byte within any page.
The instruction is not accepted, and is not executed, if a Write cycle is currently in progress.
Figure 11. Read from Memory Array (READ) sequence
S
0
1
2
3
4
5
6
7
8
9 10
20 21 22 23 24 25 26 27 28 29 30 31
C
Instruction
16-Bit Address
15 14 13
D
3
2
1
0
MSB
Data Out 1
High Impedance
Q
7
6
5
4
3
2
Data Out 2
1
0
7
MSB
AI01793D
1. Depending on the memory size, as shown in Table 6, the most significant address bits are Don’t Care.
21/44
Instructions
6.6
M95320, M95640, M95320-x, M95640-x
Write to Memory Array (WRITE)
As shown in Figure 12, to send this instruction to the device, Chip Select (S) is first driven
Low. The bits of the instruction byte, address byte, and at least one data byte are then
shifted in, on Serial Data Input (D).
The instruction is terminated by driving Chip Select (S) High at a byte boundary of the input
data. In the case of Figure 12, this occurs after the eighth bit of the data byte has been
latched in, indicating that the instruction is being used to write a single byte. The self-timed
Write cycle starts, and continues for a period tWC (as specified in Table 18 to Table 22), at
the end of which the Write in Progress (WIP) bit is reset to 0.
If, though, Chip Select (S) continues to be driven Low, as shown in Figure 13, the next byte
of input data is shifted in, so that more than a single byte, starting from the given address
towards the end of the same page, can be written in a single internal Write cycle.
Each time a new data byte is shifted in, the least significant bits of the internal address
counter are incremented. If the number of data bytes sent to the device exceeds the page
boundary, the internal address counter rolls over to the beginning of the page, and the
previous data there are overwritten with the incoming data. (The page size of these devices
is 32 bytes).
The instruction is not accepted, and is not executed, under the following conditions:
●
if the Write Enable Latch (WEL) bit has not been set to 1 (by executing a Write Enable
instruction just before)
●
if a Write cycle is already in progress
●
if the device has not been deselected, by Chip Select (S) being driven High, at a byte
boundary (after the eighth bit, b0, of the last data byte that has been latched in)
●
if the addressed page is in the region protected by the Block Protect (BP1 and BP0)
bits.
Figure 12. Byte Write (WRITE) sequence
S
0
1
2
3
4
5
6
7
8
9 10
20 21 22 23 24 25 26 27 28 29 30 31
C
Instruction
16-Bit Address
15 14 13
D
3
2
Data Byte
1
0
7
6
5
4
3
2
1
0
High Impedance
Q
AI01795D
1. Depending on the memory size, as shown in Table 6, the most significant address bits are Don’t Care.
22/44
M95320, M95640, M95320-x, M95640-x
Instructions
Figure 13. Page Write (WRITE) sequence
S
0
1
2
3
4
5
6
7
8
9 10
20 21 22 23 24 25 26 27 28 29 30 31
C
Instruction
16-Bit Address
15 14 13
D
3
2
Data Byte 1
1
0
7
6
5
4
3
2
0
1
S
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
C
Data Byte 2
D
7
6
5
4
3
2
Data Byte 3
1
0
7
6
5
4
3
2
Data Byte N
1
0
6
5
4
3
2
1
0
AI01796D
1. Depending on the memory size, as shown in Table 6, the most significant address bits are Don’t Care.
23/44
Power-up and delivery state
7
Power-up and delivery state
7.1
Power-up state
M95320, M95640, M95320-x, M95640-x
After Power-up, the device is in the following state:
●
Standby Power mode
●
deselected (after Power-up, a falling edge is required on Chip Select (S) before any
instructions can be started).
●
not in the Hold Condition
●
the Write Enable Latch (WEL) is reset to 0
●
Write In Progress (WIP) is reset to 0
The SRWD, BP1 and BP0 bits of the Status Register are unchanged from the previous
power-down (they are non-volatile bits).
7.2
Initial delivery state
The device is delivered with the memory array set at all 1s (FFh). The Status Register Write
Disable (SRWD) and Block Protect (BP1 and BP0) bits are initialized to 0.
24/44
M95320, M95640, M95320-x, M95640-x
8
Maximum rating
Maximum rating
Stressing the device outside the ratings listed in Table 7 may cause permanent damage to
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the Operating sections of this specification, is not
implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE Program and other relevant
quality documents.
Table 7.
Absolute maximum ratings
Symbol
TSTG
TA
TLEAD
Parameter
Min.
Max.
Unit
Storage Temperature
–65
150
°C
Ambient operating temperature
–40
130
°C
Lead Temperature during Soldering
See
note (1)
°C
VO
Output Voltage
–0.50
VCC+0.6
V
VI
Input Voltage
–0.50
6.5
V
VCC
Supply Voltage
–0.50
6.5
V
VESD
Electrostatic Discharge Voltage (Human Body
model)(2)
–4000
4000
V
1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU
2. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500Ω, R2=500Ω)
25/44
DC and AC parameters
9
M95320, M95640, M95320-x, M95640-x
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC Characteristic tables that
follow are derived from tests performed under the Measurement Conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.
Table 8.
Operating conditions (M95320 and M95640)
Symbol
VCC
TA
Table 9.
Parameter
Min.
Max.
Unit
Supply Voltage
4.5
5.5
V
Ambient Operating Temperature (Device Grade 6)
–40
85
°C
Ambient Operating Temperature (Device Grade 3)
–40
125
°C
Operating conditions (M95320-W and M95640-W)
Symbol
VCC
TA
Table 10.
Parameter
Min.
Max.
Unit
Supply Voltage
2.5
5.5
V
Ambient Operating Temperature (Device Grade 6)
–40
85
°C
Ambient Operating Temperature (Device Grade 3)
–40
125
°C
Min.(1)
Max. (1)
Unit
Supply Voltage
1.8
5.5
V
Ambient Operating Temperature
–40
85
°C
Operating conditions (M95320-R and M95640-R)
Symbol
VCC
TA
Parameter
1. This product is under development. For more information, please contact your nearest ST sales office.
Table 11.
AC measurement conditions(1)
Symbol
CL
Parameter
Min.
Typ.
Load Capacitance
30
Input Rise and Fall Times
Unit
pF
50
ns
Input Pulse Voltages
0.2VCC to 0.8VCC
V
Input and Output Timing Reference Voltages
0.3VCC to 0.7VCC
V
1. Output Hi-Z is defined as the point where data out is no longer driven.
Figure 14. AC measurement I/O waveform
Input Levels
0.8VCC
0.2VCC
Input and Output
Timing Reference Levels
0.7VCC
0.3VCC
AI00825B
26/44
Max.
M95320, M95640, M95320-x, M95640-x
Table 12.
Symbol
COUT
CIN
DC and AC parameters
Capacitance(1)
Parameter
Test Condition
Max.
Unit
VOUT = 0V
8
pF
Input Capacitance (D)
VIN = 0V
8
pF
Input Capacitance (other pins)
VIN = 0V
6
pF
Output Capacitance (Q)
Min.
1. Sampled only, not 100% tested, at TA=25°C and a frequency of 5MHz.
Table 13.
DC characteristics (M95320 and M95640, device grade 6)
Symbol
Parameter
Test Condition
ILI
Input Leakage Current
ILO
Min.
Max.
Unit
VIN = VSS or VCC
±2
µA
Output Leakage
Current
S = VCC, VOUT = VSS or VCC
±2
µA
ICC
Supply Current
C = 0.1VCC/0.9VCC at 10MHz,
VCC = 5V, Q = open
5
mA
ICC1
Supply Current
(Standby)
S = VCC, VCC = 5V,
VIN = VSS or VCC
2
µA
VIL
Input Low Voltage
–0.45
0.3VCC
V
VIH
Input High Voltage
0.7VCC
VCC+1
V
VOL(1)
Output Low Voltage
IOL = 2 mA, VCC = 5V
0.4
V
VOH(1)
Output High Voltage
IOH = –2 mA, VCC = 5V
0.8VCC
V
1. For all 5V range devices, the device meets the output requirements for both TTL and CMOS standards.
Table 14.
Symbol
DC characteristics (M95320 and M95640, device grade 3)
Parameter
Test Condition
Min.
Max.
Unit
VIN = VSS or VCC
±2
µA
ILI
Input Leakage Current
ILO
Output Leakage Current
S = VCC, VOUT = VSS or VCC
±2
µA
ICC
Supply Current
C = 0.1VCC/0.9VCC at 5MHz,
VCC = 5V, Q = open
4
mA
ICC1
Supply Current
(Standby)
S = VCC, VCC = 5V,
VIN = VSS or VCC
5
µA
VIL
Input Low Voltage
–0.45
0.3 VCC
V
VIH
Input High Voltage
0.7 VCC
VCC+1
V
VOL(1)
Output Low Voltage
IOL = 2mA, VCC = 5V
0.4
V
VOH(1)
Output High Voltage
IOH = –2mA, VCC = 5V
0.8 VCC
V
1. For all 5V range devices, the device meets the output requirements for both TTL and CMOS standards.
27/44
DC and AC parameters
Table 15.
Symbol
DC characteristics (M95320-W and M95640-W, device grade 6)
Parameter
Test Condition
Min.
Max.
Unit
VIN = VSS or VCC
±2
µA
ILI
Input Leakage Current
ILO
Output Leakage Current
S = VCC, VOUT = VSS or VCC
±2
µA
ICC
Supply Current
C = 0.1VCC/0.9VCC at 5MHz,
VCC = 2.5V, Q = open
3
mA
ICC1
Supply Current
(Standby)
S = VCC, VCC = 2.5V
VIN = VSS or VCC
1
µA
VIL
Input Low Voltage
–0.45
0.3VCC
V
VIH
Input High Voltage
0.7VCC
VCC+1
V
VOL
Output Low Voltage
IOL = 1.5mA, VCC = 2.5V or
IOL = 2mA, VCC = 5.5V
0.4
V
VOH
Output High Voltage
IOH = –0.4mA, VCC = 2.5V or
IOH = –2mA, VCC = 5.5V
Table 16.
Symbol
28/44
M95320, M95640, M95320-x, M95640-x
0.8VCC
V
DC characteristics (M95320-W and M95640-W, device grade 3)
Parameter
Test Condition
Min.
Max.
Unit
VIN = VSS or VCC
±2
µA
ILI
Input Leakage Current
ILO
Output Leakage Current
S = VCC, VOUT = VSS or VCC
±2
µA
ICC
Supply Current
C = 0.1VCC/0.9VCC at 5MHz,
VCC = 2.5V, Q = open
3
mA
ICC1
Supply Current (Standby) S = VCC, VCC = 2.5V, VIN = VSS or VCC
2
µA
VIL
Input Low Voltage
0.3VCC
V
VIH
Input High Voltage
0.7VCC VCC+1
V
VOL
Output Low Voltage
IOL = 1.5mA, VCC = 2.5V
VOH
Output High Voltage
IOH = –0.4mA, VCC = 2.5V
–0.45
0.4
0.8VCC
V
V
M95320, M95640, M95320-x, M95640-x
Table 17.
Symbol
DC and AC parameters
DC characteristics (M95320-R and M95640-R)
Parameter
Max.(1)
Unit
VIN = VSS or VCC
±1
µA
S = VCC, VOUT = VSS or VCC
±1
µA
C = 0.1VCC/0.9VCC at max clock
frequency, 1.8V < VCC = 2.5V,
Q = open
3
mA
S = VCC, VIN = VSS or VCC,
1.8V < VCC = 2.5V
1
µA
0.3 VCC
V
0.7 VCC VCC+1
V
Test Condition
ILI
Input Leakage Current
ILO
Output Leakage Current
ICC
Supply Current
ICC1
Supply Current (Standby)
VIL
Input Low Voltage
VIH
Input High Voltage
VOL
Output Low Voltage
IOL = 0.15 mA, VCC = 1.8 V
VOH
Output High Voltage
IOH = –0.1 mA, VCC = 1.8 V
Min.(1)
–0.45
0.3
0.8 VCC
V
V
1. This product is under qualification. For more information, please contact your nearest ST sales office.
29/44
DC and AC parameters
Table 18.
M95320, M95640, M95320-x, M95640-x
AC characteristics (M95320 and M95640, device grade 6)
Test conditions specified in Table 11 and Table 8
Symbol
Alt.
fC
fSCK
Clock Frequency
tSLCH
tCSS1
S Active Setup Time
15
ns
tSHCH
tCSS2
S Not Active Setup Time
15
ns
tSHSL
tCS
S Deselect Time
40
ns
tCHSH
tCSH
S Active Hold Time
25
ns
S Not Active Hold Time
15
ns
tCHSL
Parameter
Max.
Unit
D.C.
10
MHz
tCH(1)
tCLH
Clock High Time
40
ns
tCL(1)
tCLL
Clock Low Time
40
ns
tCLCH(2)
tRC
Clock Rise Time
1
µs
(2)
tFC
Clock Fall Time
1
µs
tCHCL
tDVCH
tDSU
Data In Setup Time
15
ns
tCHDX
tDH
Data In Hold Time
15
ns
tHHCH
Clock Low Hold Time after HOLD not Active
15
ns
tHLCH
Clock Low Hold Time after HOLD Active
20
ns
tCLHL
Clock Low Set-up Time before HOLD Active
0
ns
tCLHH
Clock Low Set-up Time before HOLD not Active
0
ns
tSHQZ(2)
tDIS
tCLQV
tV
tCLQX
tHO
Output Hold Time
tQLQH(2)
tRO
Output Rise Time
20
ns
tQHQL(2)
tFO
Output Fall Time
20
ns
tHHQV
tLZ
HOLD High to Output Valid
25
ns
tHLQZ(2)
tHZ
HOLD Low to Output High-Z
25
ns
tW
tWC
Write Time
5
ms
Output Disable Time
25
ns
Clock Low to Output Valid
25
ns
1. tCH + tCL must never be lower than the shortest possible clock period, 1/fC(max).
2. Value guaranteed by characterization, not 100% tested in production.
30/44
Min.
0
ns
M95320, M95640, M95320-x, M95640-x
Table 19.
DC and AC parameters
AC characteristics (M95320 and M95640, device grade 3)
Test conditions specified in Table 11 and Table 8
Symbol
Alt.
fC
fSCK
Clock Frequency
tSLCH
tCSS1
S Active Setup Time
90
ns
tSHCH
tCSS2
S Not Active Setup Time
90
ns
tSHSL
tCS
S Deselect Time
100
ns
tCHSH
tCSH
S Active Hold Time
90
ns
S Not Active Hold Time
90
ns
tCHSL
Parameter
Min.
Max.
Unit
D.C.
5
MHz
tCH(1)
tCLH
Clock High Time
90
ns
tCL(1)
90
ns
tCLL
Clock Low Time
tCLCH
(2)
tRC
Clock Rise Time
1
µs
tCHCL
(2)
tFC
Clock Fall Time
1
µs
tDVCH
tDSU
Data In Setup Time
20
ns
tCHDX
tDH
Data In Hold Time
30
ns
tHHCH
Clock Low Hold Time after HOLD not Active
70
ns
tHLCH
Clock Low Hold Time after HOLD Active
40
ns
tCLHL
Clock Low Set-up Time before HOLD Active
0
ns
tCLHH
Clock Low Set-up Time before HOLD not Active
0
ns
tSHQZ(2)
tDIS
tCLQV
tV
tCLQX
tHO
Output Hold Time
tQLQH(2)
tRO
Output Rise Time
50
ns
tQHQL(2)
tFO
Output Fall Time
50
ns
tHHQV
tLZ
HOLD High to Output Valid
50
ns
tHLQZ(2)
tHZ
HOLD Low to Output High-Z
100
ns
tW
tWC
Write Time
5
ms
Output Disable Time
100
ns
Clock Low to Output Valid
60
ns
0
ns
1. tCH + tCL must never be lower than the shortest possible clock period, 1/fC(max).
2. Value guaranteed by characterization, not 100% tested in production.
31/44
DC and AC parameters
Table 20.
M95320, M95640, M95320-x, M95640-x
AC characteristics (M95320-W and M95640-W, device grade 6)
Test conditions specified in Table 11 and Table 9
Symbol
Alt.
fSCK
fC
Parameter
Clock Frequency
Current
Product
Version(1)
New Product
Version(2)
Min. Max.
Min.
Max.
D.C.
D.C.
10
5
Unit
MHz
tSLCH
tCSS1 S Active Setup Time
90
30
ns
tSHCH
tCSS2 S Not Active Setup Time
90
30
ns
tSHSL
tCS
S Deselect Time
100
40
ns
tCHSH
tCSH
S Active Hold Time
90
30
ns
S Not Active Hold Time
90
30
ns
tCHSL
tCH(3)
tCLH
Clock High Time
90
42
ns
tCL(3)
tCLL
Clock Low Time
90
40
ns
tCLCH(4)
tRC
Clock Rise Time
1
2
µs
(4)
tFC
Clock Fall Time
1
2
µs
tCHCL
tDVCH
tDSU
Data In Setup Time
20
10
ns
tCHDX
tDH
Data In Hold Time
30
10
ns
tHHCH
Clock Low Hold Time after HOLD not Active
70
30
ns
tHLCH
Clock Low Hold Time after HOLD Active
40
30
ns
tCLHL
Clock Low Set-up Time before HOLD Active
0
0
ns
tCLHH
Clock Low Set-up Time before HOLD not
Active
0
0
ns
tSHQZ(4)
tDIS
tCLQV
tV
tCLQX
Output Disable Time
100
40
ns
Clock Low to Output Valid
60
40
ns
tHO
Output Hold Time
tQLQH
(4)
0
0
ns
tRO
Output Rise Time
50
40
ns
tQHQL
(4)
tFO
Output Fall Time
50
40
ns
tHHQV
tLZ
HOLD High to Output Valid
50
40
ns
tHLQZ(4)
tHZ
HOLD Low to Output High-Z
100
40
ns
tW
tWC
Write Time
5
5
ms
1. Current product version is identified by Process Identification letter ‘V’’.
2. New product version is identified by Process Identification letter ‘P’. Please contact your nearest ST sales
office for details (PCN MPG-NVM/05/1315 and PCN MPG-NVM/05/1191)
3. tCH + tCL must never be lower than the shortest possible clock period, 1/fC(max).
4. Value guaranteed by characterization, not 100% tested in production.
32/44
M95320, M95640, M95320-x, M95640-x
Table 21.
DC and AC parameters
AC characteristics (M95320-W and M95640-W, device grade 3)
Test conditions specified in Table 11 and Table 9
Symbol
Alt.
fC
fSCK
Clock Frequency
tSLCH
tCSS1
S Active Setup Time
90
ns
tSHCH
tCSS2
S Not Active Setup Time
90
ns
tSHSL
tCS
S Deselect Time
100
ns
tCHSH
tCSH
S Active Hold Time
90
ns
S Not Active Hold Time
90
ns
tCHSL
Parameter
Min.
Max.
Unit
D.C.
5
MHz
tCH(1)
tCLH
Clock High Time
90
ns
tCL(1)
90
ns
tCLL
Clock Low Time
tCLCH
(2)
tRC
Clock Rise Time
1
µs
tCHCL
(2)
tFC
Clock Fall Time
1
µs
tDVCH
tDSU
Data In Setup Time
20
ns
tCHDX
tDH
Data In Hold Time
30
ns
tHHCH
Clock Low Hold Time after HOLD not Active
70
ns
tHLCH
Clock Low Hold Time after HOLD Active
40
ns
tCLHL
Clock Low Set-up Time before HOLD Active
0
ns
tCLHH
Clock Low Set-up Time before HOLD not Active
0
ns
tSHQZ
(2)
tDIS
tCLQV
tV
tCLQX
Output Disable Time
100
ns
Clock Low to Output Valid
60
ns
tHO
Output Hold Time
tQLQH
(2)
0
ns
tRO
Output Rise Time
50
ns
tQHQL
(2)
tFO
Output Fall Time
50
ns
tHHQV
tLZ
HOLD High to Output Valid
50
ns
tHLQZ(2)
tHZ
HOLD Low to Output High-Z
100
ns
tW
tWC
Write Time
5
ms
1. tCH + tCL must never be lower than the shortest possible clock period, 1/fC(max).
2. Value guaranteed by characterization, not 100% tested in production.
33/44
DC and AC parameters
Table 22.
M95320, M95640, M95320-x, M95640-x
AC characteristics (M95320-R)
Test conditions specified in Table 11 and Table 10
Symbol
Alt.
fC
fSCK
Clock Frequency
tSLCH
tCSS1
S Active Setup Time
60
ns
tSHCH
tCSS2
S Not Active Setup Time
60
ns
tSHSL
tCS
S Deselect Time
90
ns
tCHSH
tCSH
S Active Hold Time
60
ns
S Not Active Hold Time
60
ns
tCHSL
Parameter
Min.
Max.
Unit
D.C.
5
MHz
tCH(1)
tCLH
Clock High Time
90
ns
tCL(1)
90
ns
tCLL
Clock Low Time
tCLCH
(2)
tRC
Clock Rise Time
2
µs
tCHCL
(2)
tFC
Clock Fall Time
2
µs
tDVCH
tDSU
Data In Setup Time
20
ns
tCHDX
tDH
Data In Hold Time
20
ns
tHHCH
Clock Low Hold Time after HOLD not Active
60
ns
tHLCH
Clock Low Hold Time after HOLD Active
60
ns
tCLHL
Clock Low Set-up Time before HOLD Active
0
0
tCLHH
Clock Low Set-up Time before HOLD not
Active
0
0
tSHQZ(2)
tDIS
tCLQV
tV
tCLQX
tHO
Output Hold Time
tQLQH(2)
tRO
Output Rise Time
80
ns
tQHQL(2)
tFO
Output Fall Time
80
ns
tHHQV
tLZ
HOLD High to Output Valid
80
ns
tHLQZ(2)
tHZ
HOLD Low to Output High-Z
80
ns
tW
tWC
Write Time
10
ms
Output Disable Time
80
ns
Clock Low to Output Valid
80
ns
0
1. tCH + tCL must never be lower than the shortest possible clock period, 1/fC(max).
2. Value guaranteed by characterization, not 100% tested in production.
34/44
ns
M95320, M95640, M95320-x, M95640-x
Table 23.
DC and AC parameters
AC characteristics (M95640-R)
Test conditions specified in Table 11 and Table 9
Symbol
Alt.
fC
fSCK
tSLCH
Min.
Max.
Unit
Clock Frequency
D.C.
2
MHz
tCSS1
S Active Setup Time
150
ns
tSHCH
tCSS2
S Not Active Setup Time
150
ns
tSHSL
tCS
S Deselect Time
200
ns
tCHSH
tCSH
S Active Hold Time
150
ns
S Not Active Hold Time
150
ns
tCHSL
Parameter
tCH(1)
tCLH
Clock High Time
200
ns
tCL(3)
tCLL
Clock Low Time
200
ns
tCLCH(2)
tRC
Clock Rise Time
2
µs
(4)
tFC
Clock Fall Time
2
µs
tCHCL
tDVCH
tDSU
Data In Setup Time
50
ns
tCHDX
tDH
Data In Hold Time
50
ns
tHHCH
Clock Low Hold Time after HOLD not Active
150
ns
tHLCH
Clock Low Hold Time after HOLD Active
150
ns
tCLHL
Clock Low Set-up Time before HOLD Active
0
0
tCLHH
Clock Low Set-up Time before HOLD not Active
0
0
tSHQZ(4)
tDIS
tCLQV
tV
tCLQX
Output Disable Time
200
ns
Clock Low to Output Valid
200
ns
tHO
Output Hold Time
(4)
tRO
Output Rise Time
200
ns
tQHQL(4)
tFO
Output Fall Time
200
ns
tHHQV
tLZ
HOLD High to Output Valid
200
ns
tHLQZ(4)
tHZ
HOLD Low to Output High-Z
200
ns
tW
tWC
Write Time
10
ms
tQLQH
0
ns
1. tCH + tCL must never be lower than the shortest possible clock period, 1/fC(max).
2. Value guaranteed by characterization, not 100% tested in production.
35/44
DC and AC parameters
M95320, M95640, M95320-x, M95640-x
Figure 15. Serial Input timing
tSHSL
S
tCHSL
tSLCH
tCHSH
tSHCH
C
tDVCH
tCHCL
tCHDX
LSB IN
MSB IN
D
Q
tCLCH
High Impedance
AI01447C
Figure 16. Hold timing
S
tHLCH
tCLHL
tHHCH
C
tCLHH
tHLQZ
tHHQV
Q
D
HOLD
AI01448B
36/44
M95320, M95640, M95320-x, M95640-x
DC and AC parameters
Figure 17. Output timing
S
tCH
C
tCLQV
tCLQX
tCLQV
tCL
tSHQZ
tCLQX
LSB OUT
Q
tQLQH
tQHQL
D
ADDR.
LSB IN
AI01449e
37/44
Package mechanical
10
M95320, M95640, M95320-x, M95640-x
Package mechanical
Figure 18. SO8N – 8 lead Plastic Small Outline, 150 mils body width, package outline
h x 45˚
A2
A
c
ccc
b
e
0.25 mm
GAUGE PLANE
D
k
8
E1
E
1
L
A1
L1
SO-A
1. Drawing is not to scale.
Table 24.
SO8N – 8 lead Plastic Small Outline, 150 mils body width, package
mechanical data
millimeters
inches
Symbol
Typ
Min
A
Typ
Min
1.75
Max
0.069
A1
0.10
A2
1.25
b
0.28
0.48
0.011
0.019
c
0.17
0.23
0.007
0.009
ccc
0.25
0.004
0.010
0.049
0.10
0.004
D
4.90
4.80
5.00
0.193
0.189
0.197
E
6.00
5.80
6.20
0.236
0.228
0.244
E1
3.90
3.80
4.00
0.154
0.150
0.157
e
1.27
–
–
0.050
–
–
h
0.25
0.50
0.010
0.020
k
0°
8°
0°
8°
L
0.40
1.27
0.016
0.050
L1
38/44
Max
1.04
0.041
M95320, M95640, M95320-x, M95640-x
Package mechanical
Figure 19. TSSOP8 – 8 lead Thin Shrink Small Outline, package outline
D
8
5
c
E1
1
E
4
α
A1
A
L
A2
L1
CP
b
e
TSSOP8AM
1. Drawing is not to scale.
Table 25.
TSSOP8 – 8 lead Thin Shrink Small Outline, package mechanical data
millimeters
inches
Symbol
Typ.
Min.
A
Max.
Min.
1.200
A1
0.050
0.150
0.800
1.050
b
0.190
c
0.090
A2
Typ.
1.000
CP
Max.
0.0472
0.0020
0.0059
0.0315
0.0413
0.300
0.0075
0.0118
0.200
0.0035
0.0079
0.0394
0.100
0.0039
D
3.000
2.900
3.100
0.1181
0.1142
0.1220
e
0.650
–
–
0.0256
–
–
E
6.400
6.200
6.600
0.2520
0.2441
0.2598
E1
4.400
4.300
4.500
0.1732
0.1693
0.1772
L
0.600
0.450
0.750
0.0236
0.0177
0.0295
L1
1.000
0°
8°
α
0.0394
0°
8°
39/44
Package mechanical
M95320, M95640, M95320-x, M95640-x
Figure 20. MLP8 - 8-lead Ultra thin Fine pitch Dual Flat No Lead, package outline
e
D
b
L1
L3
E
E2
L
A
D2
ddd
A1
UFDFPN-01
1. Drawing is not to scale.
Table 26.
MLP8 - 8-lead Ultra thin Fine pitch Dual Flat No Lead, package
mechanical data
millimeters
inches
Symbol
A
Typ
Min
Max
Typ
Min
Max
0.55
0.50
0.60
0.022
0.020
0.024
0.00
0.05
0.000
0.002
0.20
0.30
0.008
0.012
0.061
0.065
A1
b
0.25
D
2.00
D2
0.079
1.55
ddd
E
1.65
0.05
3.00
E2
0.002
0.118
0.15
0.25
0.006
0.010
e
0.50
–
–
0.020
–
–
L
0.45
0.40
0.50
0.018
0.016
0.020
L1
40/44
0.010
0.15
0.006
L3
0.30
0.012
N
8
8
M95320, M95640, M95320-x, M95640-x
11
Part numbering
Part numbering
Table 27.
Ordering information scheme
Example:
M95640
–
W MN 6
T
P
/B
Device Type
M95 = SPI serial access EEPROM
Device Function
640 = 64 Kbit (8192 x 8)
320 = 32 Kbit (4096 x 8)
Operating Voltage
blank = VCC = 4.5 to 5.5V
W = VCC = 2.5 to 5.5V
R = VCC = 1.8 to 5.5V
Package
MN = SO8 (150 mil width)
DW = TSSOP8 (169 mil width)
MB = MLP8 (2x3 mm)
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
3 = Device tested with High Reliability Certified Flow(1)Automotive
temperature range (–40 to 125 °C)
Option
blank = Standard Packing
T = Tape and Reel Packing
Plating Technology
blank = Standard SnPb plating
P or G = ECOPACK (RoHS compliant)
Process letter(2)
/B = DP26% Rsst
/P = DP26% Chartered
1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment.
The High Reliability Certified Flow (HRCF) is described in the quality note QNEE9801. Please ask your
nearest ST sales office for a copy.
2. The Process letter only concerns Grade-3 devices.
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST Sales Office.
The category of second-Level Interconnect is marked on the package and on the inner box
label, in compliance with JEDEC Standard JESD97. The maximum ratings related to
soldering conditions are also marked on the inner box label.
41/44
Revision history
12
Revision history
Table 28.
42/44
M95320, M95640, M95320-x, M95640-x
Document revision history
Date
Revision
Changes
13-Jul-2000
1.2
Human Body Model meets JEDEC std (Table 2). Minor adjustments on pp
1,11,15. New clause on p7. Addition of TSSOP8 package on pp 1, 2,
Ordering Info, Mechanical Data
16-Mar-2001
1.3
Test condition added ILI and ILO, and specification of tDLDH and tDHDL
removed.
tCLCH, tCHCL, tDLDH and tDHDL changed to 50ns for the -V range.
“-V” Voltage range changed to “2.7V to 3.6V” throughout.
Maximum lead soldering time and temperature conditions updated.
Instruction sequence illustrations updated.
“Bus Master and Memory Devices on the SPI bus” illustration updated.
Package Mechanical data updated
19-Jul-2001
1.4
M95160 and M95080 devices removed to their own data sheet
06-Dec-2001
1.5
Endurance increased to 1M write/erase cycles
Instruction sequence illustrations updated
18-Dec-2001
2.0
Document reformatted using the new template. No parameters changed.
08-Feb-2002
2.1
Announcement made of planned upgrade to 10MHz clock for the 5V, –40
to 85°C, range.
Endurance set to 100K write/erase cycles
18-Dec-2002
2.2
10MHz, 5MHz, 2MHz clock; 5ms, 10ms Write Time; 100K, 1M erase/write
cycles distinguished on front page, and in the DC and AC Characteristics
tables
26-Mar-2003
2.3
Process indentification letter corrected in footnote to AC Characteristics
table for temp. range 3
26-Jun-2003
2.4
-S voltage range upgraded by removing it and inserting -R voltage range
in its place
15-Oct-2003
3.0
Table of contents, and Pb-free options added. VIL(min) improved to -0.45V
21-Nov-2003
3.1
VI(min) and VO(min) corrected (improved) to -0.45V
28-Jan-2004
4.0
TSSOP8 connections added to DIP and SO connections
M95320, M95640, M95320-x, M95640-x
Table 28.
Date
24-May-2005
07-Jul-2006
Revision history
Document revision history (continued)
Revision
Changes
5.0
M95320-S and M95640-S root part numbers (1.65 to 5.5V Supply) and
related characteristics added.
20MHz Clock rate added.TSSOP14 package removed and MLP8 package
added.
Description of Power On Reset: VCC Lock-Out Write Protect updated.
Product List summary table added. Absolute Maximum Ratings for
VIO(min) and VCC(min) improved. Soldering temperature information
clarified for RoHS compliant devices. Device Grade 3 clarified, with
reference to HRCF and automotive environments. AEC-Q100-002
compliance. tCHHL(min) and tCHHH(min) is tCH for products under “S”
process. tHHQX corrected to tHHQV.
Figure 16: Hold timing updated.
6
Document converted to new ST template.
Packages are ECOPACK® compliant. PDIP package removed.
SO8N package specifications updated (see Table 24 and Figure 18).
M95640-S and M95320-S part numbers removed (DC and AC parameters
updated accordingly).
How to identify previous, current and new products by the Process
identification letter Table removed.
Figure 4: SPI modes supported updated and Note 2 added. First three
paragraphs of Section 4: Operating features replaced by Section 4.1:
Supply voltage (VCC).
TA added to Table 7: Absolute maximum ratings. ICC and ICC1 updated in
Table 13, Table 14, Table 15 and Table 17. VOL and VOH updated in
Table 15. ICC updated in Table 16. Data in Table 17 is no longer
preliminary.
tCH updated in Table 20. Table 23: AC characteristics (M95640-R) added.
Timing line of tSHQZ modified in Figure 17: Output timing.
Process letter added to Table 27: Ordering information scheme, Note 2
removed. Note 2 removed from Figure 2.
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M95320, M95640, M95320-x, M95640-x
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