Altera EP1C6 Cyclone series device thermal resistance Datasheet

Cyclone Series Device
Thermal Resistance
May 2008, version 3.0
Revision
History
Data Sheet
The following table shows the revision history for this data sheet.
Date
Document Version
Changes Made
May 2008
3.0
Updated Tables 2, 4, and 5.
July 2007
2.2
Updated values for EP3C25 (E144) device in Table 2.
May 2007
2.1
Updated values for EP3C10 (E144) device in Table 2 and added
Revision History.
March 2007
2.0
Added Cyclone III information.
April 2006
1.0
Initial release.
Tables 1 through 6 in this data sheet provide θ JA (junction-to-ambient
thermal resistance) and θ JC (junction-to-case thermal resistance) values
for Altera® Cyclone® series devices available in Ball-Grid Array (BGA),
FineLine® BGA (FBGA), Micro FineLine BGA® (MBGA), Ultra FineLine
BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC),
Plastic Enhanced Quad Flat Pack (EQFP), Thin Quad Flat Pack (TQFP),
Plastic Quad Flat Pack (PQFP), and Power Quad Flat Pack (RQFP).
f
Altera Corporation
DS-CYTHRML-3.0
For additional packaging information, refer to the Altera Device Packaging
Data Sheet.
1
Altera Device Package Information Data Sheet
Cyclone III
Devices
Thermal resistance values for Cyclone III devices are provided for a board
meeting JEDEC specifications and for a typical board. The JEDEC board
specifications require two signals and two power/ground planes and are
available at www.jedec.org. The values are described in Tables 1
through 4.
Table 1. Thermal Resistance Values for Cyclone III Devices
Value
Description
θJA (C/W) Still Air
Junction-to-ambient thermal resistance (θJA) with no airflow when a heat sink
is not being used.
θJA (C/W) 100 ft./minute
Junction-to-ambient thermal resistance with 100 ft./minute airflow when a
heat sink is not being used.
θJA (C/W) 200 ft./minute
Junction-to-ambient thermal resistance with 200 ft./minute airflow when a
heat sink is not being used.
θJA (C/W) 400 ft./minute
Junction-to-ambient thermal resistance with 400 ft./minute airflow when a
heat sink is not being used.
θJC (C/W)
Junction-to-case thermal resistance (θJC) for device.
θJB (C/W)
Junction-to-board thermal resistance (θJB) for specific board being used.
Table 2 provides θ JA (junction-to-ambient thermal resistance) values and
θJC (junction-to-case thermal resistance) values for Cyclone III devices on
a board meeting JEDEC specifications for thermal resistance calculation.
Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 1 of 2)
Device
EP3C5
EP3C10
2
Package
θJA (°C/W)
Still Air
θJA (°C/W)
100 ft./min.
θ JA (°C/W)
200 ft./min.
θ JA (°C/W)
400 ft./min.
θJC (°C/W)
E144
20
17.5
15.4
14
8.4
F256
32.4
28.9
27
25.5
11.7
U256
32.5
29.1
27.2
25.6
12.2
M164
38.2
31.5
29.6
27.9
11.6
E144
20
17.5
15.4
14
8.4
F256
32.4
28.9
27
25.5
11.7
U256
32.5
29.1
27.2
25.6
12.2
M164
38.2
31.5
29.6
27.9
11.6
DS-CYTHRML-3.0
Altera Corporation
Altera Device Package Information Data Sheet
Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 2 of 2)
Device
Package
EP3C16
EP3C25
EP3C40
EP3C55
EP3C80
EP3C120
θJA (°C/W)
Still Air
θJA (°C/W)
100 ft./min.
θ JA (°C/W)
200 ft./min.
θ JA (°C/W)
400 ft./min.
θJC (°C/W)
E144
20
17.5
15.4
14
8
Q240
27.2
24.7
22.1
17.8
4.3
F256
28.5
25.1
23.2
21.7
9.1
U256
28.8
25.4
23.5
22
9.7
U484
26.9
23.5
21.6
20.1
8.5
F484
22.9
19.4
17.7
16.2
6.9
M164
34.7
28
26.1
24.4
9.2
E144
20
17.5
15.4
14
7.8
Q240
27
24.5
21.8
17.6
4.2
F256
27.5
24.1
22.2
20.7
8.5
U256
27.9
24.5
22.6
21.1
9.1
F324
26.6
23.1
21.3
19.8
8
Q240
25.8
23.2
20.6
17
4
F324
23.2
19.7
18
16.5
5.9
U484
22.8
19.3
17.6
16.1
5.9
F484
19.8
16.3
14.6
13.2
4.8
F780
18.7
15.2
13.5
12.2
4.5
F484
21.6
18.2
16.4
15
5.1
U484
18.9
15.4
13.8
12.2
4.2
F780
17.8
14.4
12.7
11.4
3.9
U484
20.4
16.9
15.2
13.8
4.4
F484
18
14.5
12.9
11.5
3.6
F780
16.9
13.5
11.8
10.5
3.3
F484
17.1
13.7
12
10.7
3.1
F780
16
12.6
11
9.7
2.8
Table 3 provides board dimension information for each package.
Table 3. PCB Dimensions Notes (1), (2)
2.5 mm Thick Signal Layers
Altera Corporation
(Part 1 of 2)
Power/Ground
Layers
Package
Dimensions
(mm)
Board
Dimensions
(mm)
F780
9
9
29
89
F484
7
7
23
83
DS-CYTHRML-3.0
3
Altera Device Package Information Data Sheet
Table 3. PCB Dimensions Notes (1), (2)
2.5 mm Thick Signal Layers
(Part 2 of 2)
Power/Ground
Layers
Package
Dimensions
(mm)
Board
Dimensions
(mm)
U484
7
7
19
79
F324
6
6
19
79
F256
6
6
17
77
U256
6
6
14
74
Notes to Table 3:
(1)
(2)
Power layer Cu thickness 35 um, Cu 90%
Signal layer Cu thickness 17 um, Cu 15%
Table 4 provides θ JA values and θ JB (junction-to-board thermal resistance)
values for Cyclone III devices on a typical board.
Table 4. Thermal Resistance of Cyclone III Devices for Typical Board (Part 1 of 2)
Device
EP3C5
EP3C10
EP3C16
EP3C25
EP3C40
EP3C55
4
Package
θJA (°C/W)
Still Air
θJA (°C/W)
100 ft./min.
θ JA (°C/W)
200 ft./min.
θJA (°C/W)
400 ft./min.
θJB (°C/W)
F256
32.2
27.9
25.5
23.6
17.3
U256
32.7
28.2
25.7
23.7
16.3
F256
32.2
27.9
25.5
23.6
17.3
U256
32.7
28.2
25.7
23.7
16.3
F256
28.4
24.2
21.8
20
13.5
U256
29
24.6
22.2
20.2
12.7
U484
26.3
22.1
19.9
18.1
12.4
F484
22.5
18.5
16.4
14.8
9.8
F256
27.5
23.2
20.9
19.1
12.6
U256
28.1
23.7
21.3
19.4
11.8
F324
26.4
22.3
20.1
18.3
12.4
F324
23.1
19
16.9
15.1
9.2
F484
22.3
18.2
16
14.3
8.5
U484
19.4
15.4
13.5
11.9
6.8
F780
17.6
13.9
12.1
10.7
6.7
U484
21.2
17.1
15
13.3
7.5
F484
18.6
14.6
12.6
11.1
6
F780
16.8
13.1
11.3
9.9
5.9
DS-CYTHRML-3.0
Altera Corporation
Altera Device Package Information Data Sheet
Table 4. Thermal Resistance of Cyclone III Devices for Typical Board (Part 2 of 2)
Device
EP3C80
EP3C120
Cyclone II
Devices
θJA (°C/W)
Still Air
θJA (°C/W)
100 ft./min.
θ JA (°C/W)
200 ft./min.
θJA (°C/W)
400 ft./min.
θJB (°C/W)
U484
20
15.9
13.8
12.1
6.3
F484
17.7
13.7
11.8
10.3
5.2
Package
F780
15.9
12.2
10.5
9.1
5.1
F484
16.8
12.9
11
9.4
4.4
F780
15.1
11.4
9.6
8.3
4.2
Table 5 provides θ JA (junction-to-ambient thermal resistance) and θ JC
(junction-to-case thermal resistance) values for Cyclone II devices.
Table 5. Thermal Resistance of Cyclone II Devices
Device
EP2C5
EP2C8
EP2C20
EP2C35
EP2C50
EP2C70
Altera Corporation
Package
F256
0 ft./min.
θ JA (°C/W)
100 ft./min.
θJA (°C/W)
200 ft./min.
θJA (°C/W)
400 ft./min.
θ JC (°C/W)
30.2
26.1
23.6
21.7
8.7
θJA (°C/W)
T144
31
29.3
27.9
25.5
10
Q208
30.4
29.2
27.3
22.3
5.5
F256
27.0
23.0
20.5
18.5
7.1
T144
29.8
28.3
26.9
24.9
9.9
Q208
30.2
28.2
26.9
21.7
5.4
Q240
26.6
24.0
21.4
17.4
4.2
F256
24.2
20.0
17.8
16.0
5.5
F484
21.0
17.0
14.8
13.1
4.2
T144
27.6
26.4
25.4
23.8
9.6
F484
19.4
15.4
13.3
11.7
3.3
U484
20.6
16.6
14.5
12.8
5.0
F672
18.6
14.6
12.6
11.1
3.1
F484
18.4
14.4
12.4
10.9
2.8
U484
19.6
15.6
13.6
11.9
4.4
F672
17.7
13.7
11.8
10.2
2.6
F672
16.9
13.0
11.1
9.7
2.2
F896
16.3
11.9
10.5
9.1
2.1
DS-CYTHRML-3.0
5
Altera Device Package Information Data Sheet
Table 6 provides θ JA and θ JB (junction-to-board thermal resistance) values
for Cyclone II devices on a typical board.
Table 6. Thermal Resistance of Cyclone II Devices
Package
θJA (° C/W)
Still Air
θ JA (° C/W)
100 ft./min.
θ JA (° C/W)
200 ft./min.
θ JA (° C/W)
400 ft./min.
θJB (°C/W)
EP2C5
F256
30.2
25.8
22.9
20.6
14.8
EP2C8
F256
27.9
23.2
20.5
18.4
12.3
EP2C20
F256
24.7
20.1
17.5
15.3
9.1
F484
20.5
16.2
13.9
12.2
7.2
Device
EP2C35
EP2C50
F484
18.8
14.5
12.3
10.6
5.7
U484
20.0
15.5
13.2
11.3
5.3
F484
17.7
13.5
11.4
9.8
4.5
U484
19.0
14.6
12.3
10.6
4.4
EP2C35
F672
17.4
13.3
11.3
9.8
5.5
EP2C50
F672
16.5
12.4
10.5
9.0
4.6
F672
15.7
11.7
9.8
8.3
3.8
F896
14.6
10.7
8.9
7.6
3.7
EP2C70
Table 7 provides θ JA (junction-to-ambient thermal resistance) and θ JC
(junction-to-case thermal resistance) values for Cyclone devices.
Cyclone
Devices
Table 7. Thermal Resistance of Cyclone Devices (Part 1 of 2)
Device
EP1C3
EP1C6
EP1C12
6
θ JA (°C/W) θJA (°C/W) θJA (°C/W) θJA (°C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
Pin Count
Package
θJC (°C/W)
100
TQFP
11.0
37.5
35.4
33.4
29.8
144
TQFP
10.0
31.1
29.4
27.9
25.5
144
TQFP
9.8
29.4
28.0
26.7
24.7
240
PQFP
4.3
27.2
24.7
22.1
17.8
256
FBGA
8.8
28.7
24.5
22.3
20.5
240
PQFP
4.0
26.0
23.4
20.8
17.1
256
FBGA
6.6
24.3
20.2
18.1
16.4
324
FBGA
6.1
23.0
19.8
17.7
16.1
DS-CYTHRML-3.0
Altera Corporation
Altera Device Package Information Data Sheet
Table 7. Thermal Resistance of Cyclone Devices (Part 2 of 2)
Device
θ JA (°C/W) θJA (°C/W) θJA (°C/W) θJA (°C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
Pin Count
Package
θJC (°C/W)
324
FBGA
5.0
21.0
17.7
15.6
14.1
400
FBGA
4.7
20.7
17.5
15.5
13.9
EP1C20
101 Innovation Drive
San Jose, CA 95134
www.altera.com
Altera Corporation
Copyright © 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the
stylized Altera logo, specific device designations, and all other words and logos that are identified as
trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera
Corporation in the U.S. and other countries. All other product or service names are the property of their
respective holders. Altera products are protected under numerous U.S. and foreign patents and pending
applications, mask work rights, and copyrights. Altera warrants performance of its
semiconductor products to current specifications in accordance with Altera’s standard
warranty, but reserves the right to make changes to any products and services at any time
without notice. Altera assumes no responsibility or liability arising out of the application
or use of any information, product, or service described herein except as expressly agreed
to in writing by Altera Corporation. Altera customers are advised to obtain the latest
version of device specifications before relying on any published information and before
placing orders for products or services.
DS-CYTHRML-3.0
7
Similar pages