LM185-ADJ, LM285-ADJ, LM385-ADJ www.ti.com SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 LM185/LM285/LM385 Adjustable Micropower Voltage References Check for Samples: LM185-ADJ, LM285-ADJ, LM385-ADJ FEATURES 1 • • • • • 2 Adjustable from 1.24V to 5.30V Operating Current of 10μA to 20mA 1% and 2% Initial Tolerance 1Ω Dynamic Impedance Low Temperature Coefficient DESCRIPTION The LM185/LM285/LM385 are micropower 3-terminal adjustable band-gap voltage reference diodes. Operating from 1.24 to 5.3V and over a 10μA to 20mA current range, they feature exceptionally low dynamic impedance and good temperature stability. On-chip trimming is used to provide tight voltage tolerance. Since the LM185 band-gap reference uses only transistors and resistors, low noise and good long-term stability result. Careful design of the LM185 has made the device tolerant of capacitive loading, making it easy to use in almost any reference application. The wide dynamic operating range allows its use with widely varying supplies with excellent regulation. The extremely low power drain of the LM185 makes it useful for micropower circuitry. This voltage reference can be used to make portable meters, regulators or general purpose analog circuitry with battery life approaching shelf life. Further, the wide operating current allows it to replace older references with a tighter tolerance part. The LM185 is rated for operation over a −55°C to 125°C temperature range, while the LM285 is rated −40°C to 85°C and the LM385 0°C to 70°C. The LM185 is available in a hermetic TO package and a LCCC package, while the LM285/LM385 are available in a low-cost TO-92 package, as well as SOIC. Connection Diagram Figure 1. TO-92 Package Bottom View Figure 2. TO Package Bottom View Figure 3. SOIC Package Top View Figure 4. 20-LCCC Top View 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM185-ADJ, LM285-ADJ, LM385-ADJ SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 www.ti.com Block Diagram Typical Applications Figure 5. 1.2V Reference Figure 6. 5.0V Reference These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ LM185-ADJ, LM285-ADJ, LM385-ADJ www.ti.com SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) (3) Reverse Current 30mA Forward Current 10mA Operating Temperature Range (4) LM185 Series −55°C to 125°C LM285 Series −40°C to 85°C LM385 Series 0°C to 70°C (5) 2kV Storage Temperature −55°C to 150°C ESD Susceptibility Soldering Information TO-92 Package (10 sec.) 260°C TO Package (10 sec.) 300°C SOIC Package Vapor Phase (60 sec.) 215°C Infrared (15 sec.) 220°C See An-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. (1) (2) (3) (4) (5) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The specifications apply only for the test conditions listed. Refer to RETS185H for military specifications. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. For elevated temperature operation, see Table 1 and Thermal Characteristics. The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. Table 1. TJ(max) for Elevated Temperature Operation DEVICE TJ(max) (°C) LM185 150 LM285 125 LM385 100 Thermal Characteristics Over operating free-air temperature range (unless otherwise noted) Thermal Resistance TO-92 180°C/W (0.4″ leads) θJA (Junction to Ambient) 170°C/W (0.125″ leads) θJC (Junction to Case) N/A Copyright © 2000–2013, Texas Instruments Incorporated TO-46 SOIC 440°C/W 165°C/W 80°C/W N/A Submit Documentation Feedback Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ 3 LM185-ADJ, LM285-ADJ, LM385-ADJ SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 www.ti.com Electrical Characteristics (1) LM185, LM285 Parameter Conditions Typ LM385 LM185BX, LM185BY LM185B, LM285BX, LM285BY LM285 LM385 LM385BX, LM385BY Tested Design Tested Design Limit Limit Limit Limit (2) Reference Voltage IR = 100μA 1.240 (3) 1.252 Units (Limit) Typ (2) (3) 1.265 1.270 1.215 1.205 Tested Design Tested Design Limit Limit Limit Limit 1.240 (2) (3) (2) (3) 1.252 1.255 1.265 1.270 V (max) 1.228 1.215 1.215 1.205 V (min) mV (max) 1.255 1.228 1.215 Reference Voltage Change with Current IMIN< IR < 1mA Dynamic Output Impedance IR = 100μA, f = 100Hz Reference Voltage Change with Output Voltage 1mA < IR < 20mA IAC = 0.1 IR 0.2 1 1.5 1 1.5 0.2 1 1.5 1 1.5 4 10 20 10 20 5 15 25 15 25 VOUT = VREF 0.3 0.4 VOUT = 5.3V 0.7 1 Ω IR = 100μA Feedback Current 1 3 6 3 6 2 5 10 5 10 mV (max) 13 20 25 20 25 16 30 35 30 35 nA (max) μA (max) Minimum Operating Current (see curve) VOUT = VREF 6 9 10 9 10 7 11 13 11 13 VOUT = 5.3V 30 45 50 45 50 35 55 60 55 60 Output Wideband Noise IR = 100μA, 10Hz < f < 10kHz VOUT = VREF 50 VOUT = 5.3V Average IR = 100μA Temperature Coefficient (4) μVrms 170 170 X Suffix 30 30 Y Suffix 50 50 All Others Long Term Stability 50 IR = 100μA, T = 1000 Hr, 150 20 150 150 20 150 ppm/°c (max) ppm TA = 25°C ± 0.1°C (1) (2) (3) (4) 4 Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA = TJ = 25°C. Unless otherwise specified, all parameters apply for VREF < VOUT < 5.3V. Production tested. Not production tested. These limits are not to be used to calculate average outgoing quality levels. The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures from TMIN to TMAX, divided by TMAX − TMIN. The measured temperatures are −55, −40, 0, 25, 70, 85, 125°C. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ LM185-ADJ, LM285-ADJ, LM385-ADJ www.ti.com SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 Typical Performance Characteristics Temperature Drift of 3 Representative Units Feedback Current Figure 7. Figure 8. Minimum Operating Current Reverse Characteristics Figure 9. Figure 10. Reverse Characteristics Forward Characteristics Figure 11. Figure 12. Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ 5 LM185-ADJ, LM285-ADJ, LM385-ADJ SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Output Noise Voltage Dynamic Output Impedance Figure 13. Figure 14. Response Time Figure 15. Temperature Coefficient Typical LM185 (left), LM285 (center), LM385 (right) Figure 16. 6 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ LM185-ADJ, LM285-ADJ, LM385-ADJ www.ti.com SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 TYPICAL APPLICATIONS Figure 17. Precision 10V Reference Figure 18. Low AC Noise Reference Figure 19. 25V Low Current Shunt Regulator Figure 20. 200 mA Shunt Regulator Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ 7 LM185-ADJ, LM285-ADJ, LM385-ADJ SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 8 www.ti.com Figure 21. Series-Shunt 20 mA Regulator Figure 22. High Efficiency Low Power Regulator Figure 23. Voltage Level Detector Figure 24. Voltage Level Detector Figure 25. Fast Positive Clamp 2.4V + ΔVD1 Figure 26. Bidirectional Clamp ±2.4V Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ LM185-ADJ, LM285-ADJ, LM385-ADJ www.ti.com SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 Figure 27. Bidirectional Adjustable Clamp ±1.8V to ±2.4V Figure 28. Bidirectional Adjustable Clamp ±2.4V to ±6V Figure 29. Simple Floating Current Detector Figure 30. Current Source Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ 9 LM185-ADJ, LM285-ADJ, LM385-ADJ SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 www.ti.com *D1 can be any LED, VF=1.5V to 2.2V at 3 mA. D1 may act as an indicator. D1 will be on if ITHRESHOLD falls below the threshold current, except with I=O. Figure 31. Precision Floating Current Detector Figure 32. Centigrade Thermometer, 10mV/°C Figure 33. Freezer Alarm 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ LM185-ADJ, LM285-ADJ, LM385-ADJ www.ti.com SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 Schematic Diagram Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ 11 LM185-ADJ, LM285-ADJ, LM385-ADJ SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision E (April 2013) to Revision F • 12 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 11 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM185BH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -55 to 125 LM185BH LM185BH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM185BH LM185H-2.5 ACTIVE TO NDU 2 1000 TBD Call TI Call TI -55 to 125 LM185H2.5 LM185H-2.5/NOPB ACTIVE TO NDU 2 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM185H2.5 LM285BXZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 85 LM285 BXZ LM285BYM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285 BYM LM285BYMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM285 BYM LM285BYZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 85 LM285 BYZ LM285M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM285 M LM285MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM285 M LM285Z/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 85 LM285 Z LM385BM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385 BM LM385BM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385 BM LM385BMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385 BM LM385BXZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385 BXZ LM385BYZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385 BYZ LM385BZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385 BZ LM385M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) M LM385M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385 M LM385MX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM385 M LM385MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385 M LM385Z/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385 Z (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM285BYMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM285MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM285BYMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385MX SOIC D 8 2500 367.0 367.0 35.0 LM385MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NDU0002A H02A (Rev F) www.ti.com MECHANICAL DATA NDV0003H H03H (Rev F) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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