CM1441 4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array Features Product Description • The CM1441 is a multichannel EMI/ESD array consisting of four low-pass filter + ESD channels to reduce EMI emissions on data ports and lines and four dedicated ESD-only channels. Each EMI filter channel integrates a high quality pi-style filter (30pF-100Ω-30pF) which provides greater than 30dB of attenuation in the 800MHz to 2.7GHz frequency range. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). All ESD protection diodes safely dissipate ESD strikes of ±30kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • • • Four channels of EMI filtering with integrated ESD protection Four channels of ESD-only protection 0.4mm pitch, 15-bump, 2.360mm X 1.053mm footprint Chip Scale Package (CSP) Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network ±30kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Greater than 35dB attenuation (typical) at 1 GHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance OptiGuard™ coated for improved reliability at assembly Lead-free version available Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CM1441 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1441 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1441 is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space saving vs. competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball. Electrical Schematic 100Ω FILTER+ESDn* (Pins A2-A5) 30pF FILTER+ESDn* (Pins C2-C5) 30pF ESDn* (Pins A1, A6, C1, C6) 30pF GND (Pins B1-B3) 1 of 4 ESD-only Channels 1 of 4 EMI/RFI + ESD Channels. * See Package/Pinout Diagram for expanded pin information. © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1441 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 5 6 A FILTER1 FILTER2 FILTER3 FILTER4 ESD4 C1 C2 C3 C4 C5 C6 GND N417 B ESD3 GND B1 Orientation Marking C GND B2 B3 ESD1 FILTER1 FILTER2 FILTER3 FILTER4 ESD2 A1 A2 A3 A4 A5 A6 A1 CM1441-07CS/CP Notes: 15 Bump CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION A1 ESD1 ESD Channel 1 A2 FILTER1 Filter + ESD Channel 1 A3 FILTER2 Filter + ESD Channel 2 A4 FILTER3 Filter + ESD Channel 3 A5 FILTER4 Filter + ESD Channel 4 A6 ESD2 ESD Channel 2 B1-B3 GND Device Ground C1 ESD3 ESD Channel 3 C2 FILTER1 Filter + ESD Channel 1 C3 FILTER2 Filter + ESD Channel 2 C4 FILTER3 Filter + ESD Channel 3 C5 FILTER4 Filter + ESD Channel 4 C6 ESD4 ESD Channel 4 Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 15 CSP CM1441-07CS N417 CM1441-07CP N417 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/08/05 CM1441 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R PARAMETER CONDITIONS Resistance MIN TYP MAX UNITS 80 100 120 Ω Total Channel Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC 48 60 72 pF C Capacitance C1 At 2.5VDC Reverse Bias, 1MHz, 30mVAC 24 30 36 pF VDIODE Standoff Voltage IDIODE=10μA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE=+3.3V 0.1 1 μA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -0.8 9.0 -0.4 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 CTOTAL RDYN fC 5.6 -1.5 Notes 2, 3 and 4 ±30 kV ±30 kV Dynamic Resistance Positive Negative 2.3 0.9 Ω Ω 60 MHz R=100Ω, C=30pF Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω Note 1: Note 2: Note 3: Note 4: V TA=25°C unless otherwise specified. ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1441 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A2-C2 to GND B1) Figure 2. Insertion Loss vs. Frequency (A3-C3 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/08/05 CM1441 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A4-C4 to GND B2) Figure 4. Insertion Loss vs. Frequency (A5-C5 to GND B3) © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1441 Performance Information (cont’d) Capacitance (Normalized) Typical Diode Capacitance vs. Input Voltage DC Voltage Figure 5. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5VDC and 25°C) © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/08/05 CM1441 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste 240°C Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste 260°C Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 6. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 7. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 8. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 CM1441 Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams CM1441 devices are supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW C1 C B Bumps 15 A Inches Nom Max Min A1 2.315 2.360 2.405 0.911 A2 1.008 1.053 1.098 0.0397 0.0415 0.0432 B1 0.395 0.4000 0.405 0.0156 0.0157 0.0159 B2 0.195 0.2000 0.205 0.0076 0.0078 0.0080 B3 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 B4 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 C1 0.130 0.1800 0.230 0.0051 0.0071 0.0091 C2 0.130 0.1800 0.230 0.0051 0.0071 0.0091 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Nom 1 Min Max 2 3 4 5 6 D1 D2 0.25 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS 0.0929 0.0947 A2 Custom CSP C2 Package Millimeters B2 B1 B4 B3 PACKAGE DIMENSIONS Dim OptiGuardTM Coating A1 SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1441 Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1441 2.36 x 1.053 x 0.644 2.62 x 1.12 x 0.76 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 9. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/08/05