OPA369 OPA2369 www.ti.com ............................................................................................................................................ SBOS414B – AUGUST 2007 – REVISED DECEMBER 2008 1.8V, 700nA, Zerø-Crossover RAIL-TO-RAIL I/O OPERATIONAL AMPLIFIER FEATURES DESCRIPTION 1 • nanoPOWER: – OPA369: 800nA – OPA2369: 700nA/ch. • LOW OFFSET VOLTAGE: 250µV – ZERO-CROSSOVER • LOW OFFSET DRIFT: 0.4µV/°C • DC PRECISION: – CMRR: 114dB – PSRR:106dB – AOL: 134dB • GAIN-BANDWIDTH PRODUCT: 12kHz • SUPPLY VOLTAGE: 1.8V to 5.5V • microSIZE PACKAGES: – SC70-5, SOT23-5, MSOP-8 The OPA369 and OPA2369 are ultra-low-power, low-voltage operational amplifiers from Texas Instruments designed especially for battery-powered applications. 2 The OPAx369 operates on a supply voltage as low as 1.8V and has true rail-to-rail operation that makes it useful for a wide range of applications. The zerø-crossover feature resolves the problem of input crossover distortion that becomes very prominent in low voltage (< 3V), rail-to-rail input applications. In addition to microsize packages and very low quiescent current, the OPAx369 features 12kHz bandwidth, low offset drift (1.75µV/°C, max), and low noise 3.6µVPP (0.1Hz to 10Hz). The OPA369 (single version) is offered in an SC70-5 package. The OPA2369 (dual version) comes in both MSOP-8 and SOT23-8 packages. APPLICATIONS • • • • • hi laurie BATTERY-POWERED INSTRUMENTS PORTABLE DEVICES MEDICAL INSTRUMENTS TEST EQUIPMENT LOW-POWER SENSOR SIGNAL CONDITIONING OFFSET VOLTAGE vs COMMON-MODE VOLTAGE (VS = 1.8V) Offset Voltage OPA369 Competition 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Common-Mode Voltage (V) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007–2008, Texas Instruments Incorporated OPA369 OPA2369 SBOS414B – AUGUST 2007 – REVISED DECEMBER 2008 ............................................................................................................................................ www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). Supply Voltage Single Input Terminals VS = (V+) – (V–) VALUE UNIT +7 V Voltage (2) (V–) –0.5 to (V+) + 0.5 V Current (2) ±10 mA Output Short-Circuit (3) Continuous Ambient Operating Temperature –55 to +125 °C Ambient Storage Temperature –65 to +150 °C TJ +150 °C Human Body Model (HBM) 4000 V Charged Device Model (CDM) 1000 V (MM) 200 V Junction Temperature ESD Ratings Machine Model (1) (2) (3) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. Short-circuit to VS/2, one amplifier per package. PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR OPA369 SC70-5 DCK CJS MSOP-8 DGK OCCQ SOT23-8 DCN OCBQ OPA2369 (1) PACKAGE MARKING For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. PIN CONFIGURATIONS OPA369 SC70-5 (TOP VIEW) 2 +IN 1 V- 2 -IN 3 OPA2369 MSOP-8, SOT23-8 (TOP VIEW) 5 V+ 4 OUT Submit Documentation Feedback Out A 1 8 V+ -In A 2 7 Out B +In A 3 6 -In B V- 4 5 +In B Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): OPA369 OPA2369 OPA369 OPA2369 www.ti.com ............................................................................................................................................ SBOS414B – AUGUST 2007 – REVISED DECEMBER 2008 ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V BOLDFACE limits apply over the specified temperature range, TA = –40°C to +85°C. At TA = +25°C, and RL = 100kΩ connected to VS/2, unless otherwise noted. OPA369, OPA2369 PARAMETER CONDITIONS MIN TYP MAX UNIT VOS 250 750 µV 1 mV dVOS/dT 0.4 1.75 µV/°C VS = 1.8V to 5.5V 5 20 µV/V dc 140 dB f = 1kHz 120 dB OFFSET VOLTAGE Input Offset Voltage over Temperature Drift vs Power Supply PSRR Channel Separation INPUT VOLTAGE RANGE Common-Mode Voltage Range VCM Common-Mode Rejection Ratio CMRR (V–) over Temperature (V–) ≤ VCM ≤ (V+) 100 (V–) ≤ VCM ≤ (V+) 90 (V+) V 114 dB dB INPUT BIAS CURRENT Input Bias Current IB 10 over Temperature Input Offset Current 50 pA See Figure 16 IOS 10 pA 50 pA INPUT IMPEDANCE Differential Common-Mode 1013|| 3 Ω || pF 13 Ω || pF 10 || 6 NOISE Input Voltage Noise Input Voltage Noise Density Current Noise Density f = 0.1Hz to 10Hz 3.6 µVPP f = 100Hz 220 nV/√Hz f = 1kHz 290 nV/√Hz f = 1kHz 1 fA/√Hz 134 dB OPEN-LOOP GAIN Open-Loop Voltage Gain AOL Over Temperature Over Temperature 100mV ≤ VO ≤ (V+)–100mV, RL = 100kΩ 114 100mV ≤ VO ≤ (V+)–100mV, RL = 100kΩ 100 500mV ≤ VO ≤ (V+)–500mV, RL = 10kΩ 114 500mV ≤ VO ≤ (V+)–500mV, RL = 10kΩ 90 dB 134 dB dB OUTPUT Voltage Output Swing from Rail Short-Circuit Current Capacitive Load Drive RL = 100kΩ 10 mV RL = 10kΩ 25 mV ISC CLOAD 10 mA See Figure 20 pF FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate GBW SR Overload Recovery Time 12 kHz G = +1 0.005 V/µs VIN × Gain > VS 250 µs Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): OPA369 OPA2369 Submit Documentation Feedback 3 OPA369 OPA2369 SBOS414B – AUGUST 2007 – REVISED DECEMBER 2008 ............................................................................................................................................ www.ti.com ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V (continued) BOLDFACE limits apply over the specified temperature range, TA = –40°C to +85°C. At TA = +25°C, and RL = 100kΩ connected to VS/2, unless otherwise noted. OPA369, OPA2369 PARAMETER CONDITIONS MIN TYP MAX UNIT 5.5 V POWER SUPPLY Specified Voltage VS Quiescent Current IQ 1.8 IOUT = 0A OPA369 0.8 1.2 µA OPA2369 (per channel) 0.7 1 µA OPA369 1.45 µA OPA2369 (per channel) 1.25 µA Over Temperature TEMPERATURE RANGE Specified Range TA –40 +85 °C Operating Range TA –55 +125 °C Thermal Resistance 4 θ JA SC70 250 °C/W SOT23 223 °C/W MSOP 252 °C/W Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): OPA369 OPA2369 OPA369 OPA2369 www.ti.com ............................................................................................................................................ SBOS414B – AUGUST 2007 – REVISED DECEMBER 2008 TYPICAL CHARACTERISTICS At TA = +25°C, VS = 5V, and RL = 100kΩ connected to VS/2, unless otherwise noted. OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION -1.2 -1.1 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 750 600 675 450 525 300 375 150 225 0 75 -75 -150 -225 -300 -450 -375 -525 -600 -675 -750 Population Population OFFSET VOLTAGE PRODUCTION DISTRIBUTION Offset Voltage (mV) Offset Voltage Drift (mV/°C) Figure 1. Figure 2. OFFSET VOLTAGE vs TEMPERATURE NORMALIZED OFFSET VOLTAGE vs COMMON-MODE VOLTAGE 100 900 80 Normalized Offset Voltage (mV) 1000 700 600 500 400 300 200 100 60 40 20 0 -20 -40 -60 -80 0 -100 -75 -50 -25 0 25 50 75 100 125 -0.2 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 |Offset Voltage| (mV) 800 VS = 5V 10 Typical Units Shown Temperature (°C) Common-Mode Voltage (V) Figure 3. Figure 4. 0.1Hz to 10Hz NOISE INPUT-REFERRED VOLTAGE NOISE vs FREQUENCY 1mV/div Voltage Noise, RTI (nV/ÖHz) 10000 1000 100 10 0.1 Time (500ms/div) 1 10 100 1k Frequency (Hz) Figure 5. Figure 6. Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): OPA369 OPA2369 Submit Documentation Feedback 5 OPA369 OPA2369 SBOS414B – AUGUST 2007 – REVISED DECEMBER 2008 ............................................................................................................................................ www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = 5V, and RL = 100kΩ connected to VS/2, unless otherwise noted. OPEN-LOOP GAIN AND PHASE vs FREQUENCY OPEN-LOOP GAIN vs TEMPERATURE 140 120 RL = 10kW RL = 100kW 2.5 GAIN 80 60 90 40 AOL (mV/V) 135 Phase (°) 100 Gain (dB) 3.0 180 2.0 1.5 1.0 PHASE 20 45 0.5 0 -20 0.001 0.01 0.1 1 10 100 1k 0 0 10k 20k -75 -50 -25 75 100 COMMON-MODE REJECTION RATIO vs FREQUENCY COMMON-MODE REJECTION RATIO vs TEMPERATURE 125 10 8 80 CMRR (mV/V) CMRR (dB) 50 Figure 8. 100 60 40 6 4 2 20 0 0 10 100 1k 10k 20k -75 -50 -25 0 25 50 75 100 Frequency (Hz) Temperature (°C) Figure 9. Figure 10. POWER-SUPPLY REJECTION RATIO vs FREQUENCY POWER-SUPPLY REJECTION RATIO vs TEMPERATURE 125 20 110 10 Typical Units Shown 100 15 90 +PSRR 10 PSRR (mV/V) 80 PSRR (dB) 25 Figure 7. 120 70 60 50 40 30 5 0 -5 -10 -PSRR 20 -15 10 -20 0 1 6 0 Temperature (°C) Frequency (Hz) 10 100 1k 10k 20k -75 -50 -25 0 25 50 Frequency (Hz) Temperature (°C) Figure 11. Figure 12. Submit Documentation Feedback 75 100 125 Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): OPA369 OPA2369 OPA369 OPA2369 www.ti.com ............................................................................................................................................ SBOS414B – AUGUST 2007 – REVISED DECEMBER 2008 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = 5V, and RL = 100kΩ connected to VS/2, unless otherwise noted. OUTPUT VOLTAGE vs OUTPUT CURRENT 2.75 OUTPUT VOLTAGE SWING-FROM-RAIL vs TEMPERATURE 25 Output Voltage Swing-from-Rail (mV) VS = ±2.75V 2.25 Output Voltage (V) 1.75 1.25 +25°C +85°C 0.75 -40°C +115°C 0.25 -0.25 -0.75 -1.25 -1.75 -2.25 RL = 10kW 15 10 5 RL = 100kW 0 RL = 100kW -5 -10 RL = 10kW -15 -20 -25 -2.75 0 5 10 15 20 25 30 35 40 -75 45 -50 0 -25 25 50 75 Output Current (mA) Temperature (°C) Figure 13. Figure 14. MAXIMUM OUTPUT VOLTAGE vs FREQUENCY INPUT BIAS CURRENT vs TEMPERATURE 3.0 10k 2.5 1k Input Bias Current (pA) Maximum VOUT (V) 20 2.0 1.5 1.0 100 125 100 125 100 10 1 0.1 0.5 0.01 0 100 1k 2k -50 -25 0 25 50 75 Frequency (Hz) Temperature (°C) Figure 15. Figure 16. QUIESCENT CURRENT vs TEMPERATURE OPEN-LOOP OUTPUT IMPEDANCE vs FREQUENCY 2.5 10M 100k ZO (W) Quiescent Current (mA) 1M 2.0 1.5 Single 10k 1k 1.0 Dual 0.5 100 10 -75 -50 -25 0 25 50 75 100 125 0 10 100 1k Temperature (°C) Frequency (Hz) Figure 17. Figure 18. Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): OPA369 OPA2369 10k 100k Submit Documentation Feedback 1M 7 OPA369 OPA2369 SBOS414B – AUGUST 2007 – REVISED DECEMBER 2008 ............................................................................................................................................ www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = 5V, and RL = 100kΩ connected to VS/2, unless otherwise noted. SMALL-SIGNAL OVERSHOOT vs CAPACITIVE LOAD 160 20 140 18 16 120 Overshoot (%) Channel Separation (dB) CHANNEL SEPARATION vs FREQUENCY 100 80 60 14 12 G = -1 10 G = +1 8 6 40 4 20 2 0 0 100 1k 10k 100k 10 100 Frequency (Hz) Capacitive Load (pF) Figure 19. Figure 20. SMALL-SIGNAL STEP RESPONSE LARGE-SIGNAL STEP RESPONSE 20mV/div 500mV/div CL = 20pF Time (100ms/div) Time (250ms/div) Figure 21. Figure 22. OVERLOAD RECOVERY 1V/div Input Output Time (500ms/div) Figure 23. 8 Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): OPA369 OPA2369 OPA369 OPA2369 www.ti.com ............................................................................................................................................ SBOS414B – AUGUST 2007 – REVISED DECEMBER 2008 APPLICATION INFORMATION The OPA369 family of operational amplifiers minimizes power consumption and operates on supply voltages as low as 1.8V. Power-supply rejection ratio (PSRR), common-mode rejection ratio (CMRR), and open-loop gain (AOL) typical values are in the range of 100dB or better. When designing for ultralow power, choose system components carefully. To minimize current consumption, select large-value resistors. Any resistors will react with stray capacitance in the circuit and the input capacitance of the operational amplifier. These parasitic RC combinations can affect the stability of the overall system. A feedback capacitor may be required to assure stability and limit overshoot or gain peaking. Good layout practice mandates the use of a 0.1µF bypass capacitor placed closely across the supply pins. OPERATING VOLTAGE OPA369 series op amps are fully specified and tested from +1.8V to +5.5V (±0.9V to ±2.75V). Parameters that vary significantly with supply voltage are shown in the Typical Characteristic curves. The input common-mode voltage range of the OPA369 family typically extends to each supply rail. CMRR is specified from the negative rail to the positive rail. See Figure 4, Normalized Offset Voltage vs Common-Mode Voltage. PROTECTING INPUTS FROM OVER-VOLTAGE Input currents are typically 10pA. However, large inputs (greater than 500mV beyond the supply rails) can cause excessive current to flow in or out of the input pins. Therefore, in addition to keeping the input voltage between the supply rails, it is also important to limit the input current to less than 10mA. This limiting is easily accomplished with an input resistor, as shown in Figure 24. Current-limiting resistor required if input voltage exceeds supply rails by ³ 0.5V. VS IOVERLOAD 10mA max OPA369 VOUT VIN 5kW INPUT COMMON-MODE VOLTAGE RANGE The OPA369 family is designed to eliminate the input offset transition region typically present in most rail-to-rail complementary stage operational amplifiers, which allows the OPA369 family of amplifiers to provide superior common-mode performance over the entire input range. Figure 24. Input Current Protection for Voltages Exceeding the Supply Voltage Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): OPA369 OPA2369 Submit Documentation Feedback 9 OPA369 OPA2369 SBOS414B – AUGUST 2007 – REVISED DECEMBER 2008 ............................................................................................................................................ www.ti.com BATTERY MONITORING The low operating voltage and quiescent current of the OPA369 series make it an excellent choice for battery monitoring applications, as shown in Figure 25. In this circuit, VSTATUS is high as long as the battery voltage remains above 2V. A low-power reference is used to set the trip point. Resistor values are selected as follows: 1. Selecting RF: Select RF such that the current through RF is approximately 1000x larger than the maximum bias current over temperature: VREF RF = 1000(IBMAX) 1.2V 1000(50pA) = 24MW » 20MW 2. Choose the hysteresis voltage, battery-monitoring applications, adequate. 3. Calculate R1 as follows: = (1) VHYST. For 50mV is R 1 = RF VHYST VBATT = 20MW 50mV = 420kW 2.4V (2) 4. Select a threshold voltage for VIN rising (VTHRS) = 2.0V 5. Calculate R2 as follows: 1 R2 = VTHRS - 1 - 1 VREF ´ R1 R1 RF ( ) 1 = ( ) 2V - 1 - 1 1.2V ´ 420kW 420kW 20MW = 650kW (3) 6. Calculate RBIAS: The minimum supply voltage for this circuit is 1.8V. The REF1112 has a current requirement of 1.2µA (max). Providing the REF1112 with 2µA of supply current assures proper operation. Therefore: (V - VREF) (1.8V - 1.2V) RBIAS = BATTMIN = = 0.3MW IBIAS 2 mA (4) RF R1 +IN + IBIAS VBATT OPA369 RBIAS OUT VSTATUS -IN VREF R2 REF1112 Figure 25. Battery Monitor 10 Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): OPA369 OPA2369 OPA369 OPA2369 www.ti.com ............................................................................................................................................ SBOS414B – AUGUST 2007 – REVISED DECEMBER 2008 WINDOW COMPARATOR If VIN falls below VL, the output of A2 is high, current flows through D2, and VOUT is low. Likewise, if VIN rises above VH, the output of A1 is high, current flows through D1, and VOUT is low. The window comparator threshold voltages are set as follows: R2 VH = ´ VS R 1 + R2 (5) Figure 26 shows the OPA2369 used as a window comparator. The threshold limits are set by VH and VL, with VH > VL. When VIN < VH, the output of A1 is low. When VIN > VL, the output of A2 is low. Therefore, both op amp outputs are at 0V as long as VIN is between VH and VL. This architecture results in no current flowing through either diode, Q1 in cutoff, with the base voltage at 0V, and VOUT forced high. VL = R4 R 3 + R4 ´V S (6) VS VS R1 VH A1 1/2 OPA2369 R2 D1 (2) VS R7 5.1kW RIN (1) 2kW VOUT R5 10kW VIN Q1 R6 5.1kW VS VS A2 R3 VL (3) 1/2 OPA2369 D2 (2) R4 NOTES: (1) RIN protects A1 and A2 from possible excess current flow. (2) IN4446 or equivalent diodes. (3) 2N2222 or equivalent NPN transistor. Figure 26. OPA2369 as a Window Comparator Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): OPA369 OPA2369 Submit Documentation Feedback 11 OPA369 OPA2369 SBOS414B – AUGUST 2007 – REVISED DECEMBER 2008 ............................................................................................................................................ www.ti.com ADDITIONAL APPLICATION EXAMPLES Figure 27 through Figure 29 illustrate additional application examples. VEX R1 +5V R R R R VOUT OPA369 R1 VREF Figure 27. Single Op Amp Bridge Amplifier RG zener RSHUNT (1) V+ (2) R1 10kW MOSFET rated to stand-off supply voltage such as BSS84 for up to 50V. OPA369 V+5V Two zener biasing methods (3) are shown. Output Load RBIAS RL NOTES: (1) Zener rated for op amp supply capability (that is, 5.1V for OPA369). (2) Current-limiting resistor. (3) Choose zener biasing resistor or dual NMOSFETs (FDG6301N, NTJD4001N, or Si1034) Figure 28. High-Side Current Monitor RG VREF V2 R1 R2 R2 1/2 OPA2369 R1 VOUT 1/2 OPA2369 V1 VOUT = (V1 - V2) 1 + R1 2R1 + + VREF R2 RG Figure 29. Two Op Amp Instrumentation Amplifier 12 Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): OPA369 OPA2369 PACKAGE OPTION ADDENDUM www.ti.com 15-Dec-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty OPA2369AIDCNR ACTIVE SOT-23 DCN 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2369AIDCNRG4 ACTIVE SOT-23 DCN 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2369AIDCNT ACTIVE SOT-23 DCN 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2369AIDCNTG4 ACTIVE SOT-23 DCN 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2369AIDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2369AIDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2369AIDGKT ACTIVE MSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2369AIDGKTG4 ACTIVE MSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA369AIDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA369AIDCKT ACTIVE SC70 DCK 5 250 CU NIPDAU Level-2-260C-1 YEAR Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Dec-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ OPA2369AIDCNR SOT-23 3000 179.0 DCN 8 Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) 8.4 3.2 3.2 1.4 4.0 W Pin1 (mm) Quadrant 8.0 Q3 OPA2369AIDCNT SOT-23 DCN 8 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 OPA2369AIDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2369AIDGKT MSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA369AIDCKR SC70 DCK 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 OPA369AIDCKT SC70 DCK 5 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Dec-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2369AIDCNR SOT-23 DCN 8 3000 195.0 200.0 45.0 OPA2369AIDCNT SOT-23 DCN 8 250 195.0 200.0 45.0 OPA2369AIDGKR MSOP DGK 8 2500 346.0 346.0 29.0 OPA2369AIDGKT MSOP DGK 8 250 190.5 212.7 31.8 OPA369AIDCKR SC70 DCK 5 3000 195.0 200.0 45.0 OPA369AIDCKT SC70 DCK 5 250 195.0 200.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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