Through Hole Lamp Product Data Sheet LTL1CHTBK5H198P Spec No. :DS20-2017-0016 Effective Date: 02/16/2017 Revision: - LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto Through Hole Lamp LTL1CHTBK5H198P Through Hole Lamp LTL1CHTBK5H198P Rev P001 Description Preliminary Specification (RDR-20160859-01) By Date Javy H. 07/26/2016 Above data for PD and Customer tracking only - New Specification Javy H. 1/9 02/02/2017 Part No. : LTL1CHTBK5H198P BNS-OD-FC002/A4 Through Hole Lamp LTL1CHTBK5H198P 1. Description CBI (Circuit Board Indicator) is a black plastic right angle Holder (Housing) which mates with Lite-On LED lamps. Lite-On CBI is available in a wide variety of packages, including top-view (Spacer) or right angle and horizontal or vertical arrays which is stackable and easy to assembly. 1. 1. Features Designed for ease in circuit board assembly Solid state light source Low power consumption & High efficiency Lead free product & RoHS Compliant T-1 lamp, LED emitted color is InGaN blue with water clear Lens 1.2. Applications Communication Computer Consumer Industrial 2. Outline Dimensions Notes : 1. 2. 3. 4. All dimensions are in millimeters (inches). Tolerance is ±0.25mm (.010") unless otherwise noted. The Holder material is nylon plastic, black color. The LED lamp is blue color. 5. Specifications are subject to change without notice. 2/9 Part No. : LTL1CHTBK5H198P BNS-OD-FC002/A4 Through Hole Lamp LTL1CHTBK5H198P 3. Absolute Maximum Ratings at TA=25℃ ℃ Parameter Maximum Rating Unit 76 mW (Duty Cycle≦1/10, Pulse Width≦10ms) 60 mA DC Forward Current 20 mA 0.27 mA/℃ Power Dissipation Peak Forward Current Derating Linear From 30℃ Operating Temperature Range -30°C to + 85°C Storage Temperature Range -40°C to + 100°C Lead Soldering Temperature [2.0mm (.079") From Body] 260°C for 5 Seconds Max. 4. Electrical / Optical Characteristics at TA=25℃ ℃ Parameter Symbol Min. Typ. Max. Unit IV 310 880 1500 mcd Test Condition IF = 20mA Luminous Intensity Note 1,5 Viewing Angle 2θ1/2 - 30 - deg λP - 468 - nm Note 2 (Fig.6) Measurement Peak Emission Wavelength @Peak (Fig.1) Dominant Wavelength λd - 470 - nm Spectral Line Half-Width Δλ - 25 - nm Forward Voltage VF - 3.2 3.8 V IF = 20mA Reverse Current IR - - 100 μA VR = 5V Note 3 NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Iv classification code is marked on each packing bag. 4. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 5. Iv guarantee must be included with ±15% testing tolerance. 6. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for reverse operation. 3/9 Part No. : LTL1CHTBK5H198P BNS-OD-FC002/A4 Through Hole Lamp LTL1CHTBK5H198P 5. Typical Electrical / Optical Characteristics Curves (25℃ Ambient Temperature Unless Otherwise Noted) 4/9 Part No. : LTL1CHTBK5H198P BNS-OD-FC002/A4 Through Hole Lamp LTL1CHTBK5H198P 6. Packing Specification 180 pcs per tray 8 packing trays per inner carton Total 1,440 pcs per inner carton 8 Inner cartons per outer carton Total 11,520 pcs per outer carton In every shipping lot, only the last pack will be non-full packing 5/9 Part No. : LTL1CHTBK5H198P BNS-OD-FC002/A4 Through Hole Lamp LTL1CHTBK5H198P 7. Bin Table Specification 7.1. Optical/Electrical Bin Table for Reference Luminous Intensity, Unit: mcd @20mA Iv Bin Code Min. Max. K 310 400 L 400 520 M 520 680 N 680 880 P 880 1150 Q 1150 1500 Note: Tolerance of each bin limit is ±15% Dominant Wavelength, Unit : nm @20mA Iv Bin Code Min. Max. B08 465.0 470.0 B09 470.0 475.0 Note: Tolerance of each bin limit is ± 1nm 6/9 Part No. : LTL1CHTBK5H198P BNS-OD-FC002/A4 Through Hole Lamp LTL1CHTBK5H198P 8. CAUTIONS 8.1. Application This LED lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment. 8.2. Storage The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is re commended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 8.3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary. 8.4. Lead Forming & Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress. 8.5. Soldering When soldering, leave a minimum of 2mm clearance from the base of the lens/Spacer to the soldering point. Dipping the lens/Spacer into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions: Soldering iron Temperature Soldering time Position 350°C Max. 3 seconds Max. (one time only) No closer than 2mm from the base of the epoxy bulb Wave soldering Pre-heat Pre-heat time Solder wave Soldering time Dipping Position 120°C Max. 100 seconds Max. 260°C Max. 5 seconds Max. No lower than 2mm from the base of the epoxy bulb Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED. IR reflow is not suitable process for through-hole type LED lamp product. Max temperature of wave soldering is not means that Holder’s HDT/Melting temperature. 8.6. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model (A) LED Circuit model (B) LED (A) Recommended circuit (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. 7/9 Part No. : LTL1CHTBK5H198P BNS-OD-FC002/A4 Through Hole Lamp LTL1CHTBK5H198P 8.7. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: Use a conductive wrist band or anti- electrostatic glove when handling these LEDs All devices, equipment, and machinery must be properly grounded Work tables, storage racks, etc. should be properly grounded Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing Suggested checking list: Training and Certification 8.7.1.1. Everyone working in a static-safe area is ESD-certified? 8.7.1.2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 8.7.2.1. Static-safe workstation or work-areas have ESD signs? 8.7.2.2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 8.7.2.3. All ionizer activated, positioned towards the units? 8.7.2.4. Each work surface mats grounding is good? Personnel Grounding 8.7.3.1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 8.7.3.1. If conductive footwear used, conductive flooring also present where operator stand or walk? 8.7.3.2. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 8.7.3.3. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 8.7.3.4. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 8.7.4.1. Every ESDS items identified by EIA-471 labels on item or packaging? 8.7.4.2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 8.7.4.3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 8.7.4.4. All flexible conductive and dissipative package materials inspected before reuse or recycle? Others 8.7.5.1. Audit result reported to entity ESD control coordinator? 8.7.5.2. Corrective action from previous audits completed? 8.7.5.3. Are audit records complete and on file? 8/9 Part No. : LTL1CHTBK5H198P BNS-OD-FC002/A4 Through Hole Lamp LTL1CHTBK5H198P 9. Reliability Test Classification Endurance Test Item Test Condition Sample Size Reference Standard Operation Life Ta = Under room temperature IF = per datasheet maximum drive current Test Time= 1000hrs 22 PCS (CL=90%; LTPD=10%) High Temperature High Humidity storage Ta = 60°C RH = 90% Test Time= 240hrs 22 PCS (CL=90%; LTPD=10%) High Temperature Storage Ta= 105 ± 5°C Test Time= 1000hrs 22 PCS (CL=90%; LTPD=10%) MIL-STD-750D:1031 (1995) MIL-STD-883G:1008 (2006) JEITA ED-4701:200 201 (2001) Low Temperature Storage Ta= -55 ± 5°C Test Time= 1000hrs 22 PCS (CL=90%; LTPD=10%) JEITA ED-4701:200 202 (2001) Temperature Cycling 100°C ～ 25°C ～ -40°C ～ 25°C 30mins 5mins 30mins 5mins 30 Cycles 22 PCS (CL=90%; LTPD=10%) MIL-STD-750D:1051 (1995) MIL-STD-883G:1010 (2006) JEITA ED-4701:100 105 (2001) JESD22-A104C (2005) Thermal Shock 100 ± 5°C ～ -30°C ± 5°C 15mins 15mins 30 Cycles (<20 secs transfer) 22 PCS (CL=90%; LTPD=10%) MIL-STD-750D:1056 (1995) MIL-STD-883G:1011 (2006) MIL-STD-202G:107G (2002) JESD22-A106B (2004) Solder Resistance T.sol = 260 ± 5°C Dwell Time= 10±1 seconds 3mm from the base of the epoxy bulb 11 PCS (CL=90%; LTPD=18.9%) MIL-STD-750D:2031(1995) JEITA ED-4701: 300 302 (2001) Solderability T. sol = 245 ± 5°C Dwell Time= 5 ± 0.5 seconds (Lead Free Solder, Coverage ≧95% of the dipped surface) 11 PCS (CL=90%; LTPD=18.9%) MIL-STD-750D:2026 (1995) MIL-STD-883G:2003 (2006) MIL-STD-202G:208H (2002) IPC/EIA J-STD-002 (2004) Soldering Iron T. sol = 350 ± 5°C Dwell Time= 3.5 ± 0.5 seconds 11 PCS (CL=90%; LTPD=18.9%) MIL-STD-202G:208H (2002) JEITA ED-4701:300 302 (2001) MIL-STD-750D:1026 (1995) MIL-STD-883G:1005 (2006) MIL-STD-202G:103B (2002) JEITA ED-4701:100 103 (2001) Test Environmental Test 10. Others The appearance and specifications of the product may be modified for improvement, without prior notice. 9/9 Part No. : LTL1CHTBK5H198P BNS-OD-FC002/A4