Pb Free Product BLM138K N-Channel Enhancement Mode Power MOSFET GENERAL FEATURES ● VDS = 50V,ID = 0.22A RDS(ON) < 3Ω @ VGS=5V RDS(ON) < 2Ω @ VGS=10V ESD Rating：HBM 2300V Schematic diagram ● High Power and current handing capability ● Lead free product is acquired ● Surface Mount Package Application Marking and pin Assignment ●Direct Logic-Level Interface: TTL/CMOS ●Drivers: Relays, Solenoids, Lamps, Hammers,Display, Memories, Transistors, etc. ●Battery Operated Systems ●Solid-State Relays SOT-23 top view Package Marking And Ordering Information Device Marking Device Device Package Reel Size Tape width Quantity 138K BLM138K SOT-23 Ø180mm 8 mm 3000 units Absolute Maximum Ratings (TA=25℃unless otherwise noted) Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage VGS Drain Current-Continuous ID Drain Current-Pulsed (Note 1) IDM Maximum Power Dissipation PD Operating Junction and Storage Temperature Range TJ,TSTG Limit Unit 50 V ±20 V 0.22 A 0.88 A 0.35 W -55 To 150 ℃ 350 ℃/W Thermal Characteristic Thermal Resistance,Junction-to-Ambient (Note 2) RθJA Electrical Characteristics (TA=25℃unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit Off Characteristics Drain-Source Breakdown Voltage BVDSS VGS=0V ID=250μA 50 65 - V Zero Gate Voltage Drain Current IDSS VDS=50V,VGS=0V - - 1 μA www.belling.com.cn Page 1 V2.0 Pb Free Product BLM138K Gate-Body Leakage Current IGSS VGS=±10V,VDS=0V - ±110 ±500 nA VGS=±12V,VDS=0V - ±0.3 ±10 uA VDS=VGS,ID=250μA 0.6 1.1 1.6 V VGS=5V, ID=0.2A - 1.3 3 Ω VGS=10V, ID=0.22A - 1 2 Ω VDS=10V,ID=0.2A 0.2 - - S - 30 - PF - 15 - PF - 6 - PF - - 5 nS On Characteristics (Note 3) Gate Threshold Voltage VGS(th) Drain-Source On-State Resistance RDS(ON) Forward Transconductance gFS Dynamic Characteristics (Note4) Input Capacitance Clss Output Capacitance Coss Reverse Transfer Capacitance Crss VDS=25V,VGS=0V, F=1.0MHz Switching Characteristics (Note 4) Turn-on Delay Time td(on) Turn-on Rise Time tr VDD=30V,ID=0.22A - - 5 nS td(off) VGS=10V,RGEN=6Ω - - 60 nS - - 35 nS - - 2.4 nC - - 1.3 V - - 0.22 A Turn-Off Delay Time Turn-Off Fall Time tf Total Gate Charge Qg VDS=25V,ID=0.2A, VGS=10V Drain-Source Diode Characteristics Diode Forward Voltage (Note 3) VSD Diode Forward Current (Note 2) IS VGS=0V,IS=0.22A Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production www.belling.com.cn Page 2 V2.0 Pb Free Product BLM138K TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS Vdd Vgs Rgen td(on) Rl Vin D ton tr td(off) Vout 90% VOUT G toff tf 90% INVERTED 10% 10% 90% S VIN 50% 50% 10% PULSE WIDTH Figure 2:Switching Waveforms ID- Drain Current (A) ID- Drain Current (A) Figure 1:Switching Test Circuit Vds Drain-Source Voltage (V) Vgs Gate-Source Voltage (V) Figure 4 Transfer Characteristics Rdson On-Resistance(Ω) Rdson On-Resistance(Ω) Figure 3 Output CHARACTERISTICS Vgs Gate-Source Voltage (V) ID- Drain Current (A) Figure 5 Drain-Source On-Resistance www.belling.com.cn Page 3 Figure 6 Rdson vs Vgs V2.0 Pb Free Product Vgs Gate-Source Voltage (V) Is- Reverse Drain Current (mA) BLM138K Qg Gate Charge (nC) Vds Source-Drain Voltage (V) Figure 8 Source-DrainDiode Forward ID- Drain Current (A) Normalized On-Resistance Figure 7 Gate Charge TJ-Junction Temperature(℃) Vds Drain-Source Voltage (V) Figure 10 Safe Operation Area C Capacitance (pF) Figure 9 Drain-Source On-Resistance Vds Drain-Source Voltage (V) Figure 11 Capacitance vs Vds www.belling.com.cn Page 4 V2.0 Pb Free Product r(t),Normalized Effective Transient Thermal Impedance BLM138K Square Wave Pluse Duration(sec) Figure 12 Normalized Maximum Transient Thermal Impedance www.belling.com.cn Page 5 V2.0 Pb Free Product BLM138K SOT-23 PACKAGE INFORMATION Dimensions in Millimeters (UNIT:mm) Symbol A A1 A2 b c D E E1 e e1 L L1 θ Dimensions in Millimeters MIN. MAX. 0.900 1.150 0.000 0.100 0.900 1.050 0.300 0.500 0.080 0.150 2.800 3.000 1.200 1.400 2.250 2.550 0.950TYP 1.800 2.000 0.550REF 0.300 0.500 0° 8° NOTES 1. All dimensions are in millimeters. 2. Tolerance ±0.10mm (4 mil) unless otherwise specified 3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils. 4. Dimension L is measured in gauge plane. 5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. www.belling.com.cn Page 6 V2.0