LIGITEK LG-150SRF-9UG-CT Led smd Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-150SRF/9UG-CT
DATA SHEET
DOC. NO :
QW0905-LG-150SRF/9UG-CT
REV.
:
A
DATE
:
03 - Aug - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/11
PART NO. LG-150SRF/9UG-CT
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel.
2. Compatible with automatic placement equipment.
3. Compatible with infrared and vapor phase reflow solder process.
Descriptions:
1. The LG-150SRF/9UG SMD Taping is much smaller than
lead frame type components, thus enable smaller
board size, higher packing density, reduced storage
space and finally smaller equipment to be obtained.
2. Besides, lightweight makes them ideal for miniature
applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch.
2. Telecommunication : indicator and backlighting in telephone and fax.
3. Flat backlight for LCD, switch and symbol
4. General use.
Device Selection Guide:
COLOR
PART NO
LG-150SRF/9UG-CT
MATERIAL
Emitted
AlGaInP
Red
AlGaInP
Green
Lens
Water Clear
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PART NO. LG-150SRF/9UG-CT
Page 2/11
Package Dimensions
Cathode Mark
1.1
0.5
2
1
Resin
3.2
0.6
2.0
DIE2
Soldering
Terminal
DIE1
0.6
3
4
PCB
0.4
0.6
1.6
2
1
9UG
SRF
4
3
Note : 1.All dimension are in millimeter tolerance is ± 0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
0.7
0.4
0.7
0.8
1.8
0.8
Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm.
0.6
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PART NO. LG-150SRF/9UG-CT
Page 3/11
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Parameter
Symbol
UNIT
SRF
9UG
Power Dissipation
PD
72
78
mW
Peak Forward Current
Duty 1/10@10KHz
IFP
90
60
mA
Forward Current
IF
30
30
mA
Reverse Current @5V
Ir
10
10
μA
Electrostatic Discharge
ESD
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Items
Luminous Intensity
Peak Wavelength
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Typ.
SRF
20
40
----
9UG
20
40
----
SRF ----
642
----
9UG ----
575
----
SRF ----
630
----
9UG ----
574
----
SRF ----
20
----
9UG ----
20
----
SRF 1.5
----
2.4
9UG 1.7
----
2.6
SRF ----
140
----
9UG ----
140
----
Max. UNIT
Iv
λP
λD
△λ
VF
2θ 1/2
Viewing Angle
Min.
Symbol
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
CONDITION
mcd
IF=20mA
nm
IF=20mA
nm
IF=20mA
nm
IF=20mA
V
IF=20mA
deg
IF=20mA
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PART NO. LG-150SRF/9UG-CT
Typical Electro-Optical Characteristics Curve
SRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA
Normalize @25 ℃
1.2
Forward Voltage@20mA
Normalize @25 ℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
100
80
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
Wavelength (nm)
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature(℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
100
700
Fig.6 Directive Radiation
100
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PART NO. LG-150SRF/9UG-CT
Typical Electro-Optical Characteristics Curve
9UG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0
2.0
1.0
3.0
4.0
5.0
1.0
10
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
500
550
600
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature(℃)
Ambient Temperature( ℃)
Relative Intensity @20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity @20mA
Normalize @25 ℃
Forward Voltage@20mA
Normaliz @25 ℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
650
Fig.6 Directive Radiation
100
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PART NO. LG-150SRF/9UG-CT
Page 6/11
Carrier Tape Dimensions
4.0±0.2
2.0
0.23
1.5
1.75
3.5±0.2
8.0±0.3
5.3
3.38
Polarity
4.0±0.2
1.36
1.76
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
• Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No.
Description
Quantity/Reel
LG-150SRF/9UG-CT
8.0mm tape,7"reel
3000 devices
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Property of Ligitek Only
PART NO. LG-150SRF/9UG-CT
Page 7/11
Label Explanation
立碁電子工業股份有限公司
LIGITEK LED
LIGITEK ELECTRONICS CO., LTD.
BIN Q : Red Chip Luminous Intensity
Pb
BIN N : Green Chip Luminous Intensity
PART NO. : LG-150SRF/9UG-CT
HUE 29 : Red Chip Dominant Wavelength
LOT NO. : GSI-670107
Q'TY(PCS) : 3000 PCS
BIN/HUE : Q/29-N/9
HUE 9 : Green Chip Dominant Wavelength
VF:1.6 - 2.4
VF:1.8 - 2.6
1.8 - 2.6 : Forward Voltage
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.2
0.4
0.6
2.0± 0.5
178±1.5
6.0±1.0
9.0±1.0
ψ13.5±1.0
12.0±1.0
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PART NO. LG-150SRF/9UG-CT
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm
L
W
H
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PART NO. LG-150SRF/9UG-CT
Page 9/11
Recommended Soldering Conditions
1.
Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245±5℃ within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp.
(℃)
240
Rising
+5℃/sec
Cooling
-5 ℃/sec
Preheat
150
120
60 ~ 120 sec
Time
5sec
3-2 PB-Free Reflow Solder
1~5° C/sec
Preheat
180~200 ° C
1~5° C/sec
260° C MaX.
10sec.Max
Above 220 ° C
60 sec.Max.
120 sec.Max.
Reflow Soldering should not be done more than two times.
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PART NO. LG-150SRF/9UG-CT
Reliability Test:
Classification
Test Item
Test Condition
Reference
Standard
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=1000hrs ±2hrs
Endurance
Test
Thermal Shock Test
Solderability Test
Environmental
Test
Temperature
Cycling
IR Reflow
1.Ta=105 ℃±5℃ &-40 ℃±5 ℃
(10min)
(10min)
2.total 10 cycles
1.T.Sol=235 ℃±5℃
2.Immersion time 2 ±0.5sec
3.Coverage ≧95% of the dipped surface
1.105 ℃ ~ 25℃ ~ - 55℃ ~ 25℃
30mins 5mins 30mins 5mins
2.10 Cyeles
1.T=260 ° C Max. 10sec.Max.
2. 6 Min
MIL-STD-202F:103B
JIS C 7021: B-11
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
JIS C 7021: A-2
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
MIL-STD-750D:2031.2
J-STD-020
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