TI1 ADS1251 24-bit, 20khz, low-power analog-to-digital converter Datasheet

ADS1251
ADS
125
1
SBAS184D – MARCH 2001 – REVISED JUNE 2009
24-Bit, 20kHz, Low-Power
ANALOG-TO-DIGITAL CONVERTER
FEATURES
DESCRIPTION
● 24 BITS—NO MISSING CODES
● 19 BITS EFFECTIVE RESOLUTION UP TO
20kHz DATA RATE
● LOW NOISE: 1.5ppm
● DIFFERENTIAL INPUTS
● INL: 15ppm (max)
● EXTERNAL REFERENCE (0.5V to 5V)
● POWER-DOWN MODE
● SYNC MODE
● LOW POWER: 8mW at 20kHz
5mW at 10kHz
The ADS1251 is a precision, wide dynamic range, deltasigma, Analog-to-Digital (A/D) converter with 24-bit resolution operating from a single +5V supply. The delta-sigma
architecture features wide dynamic range, and 24 bits of no
missing code performance. Effective resolution of 19 bits
(1.5ppm of rms noise) is achieved at conversion rates up to
20kHz.
The ADS1251 is designed for high-resolution measurement
applications in cardiac diagnostics, smart transmitters, industrial process control, weigh scales, chromatography, and
portable instrumentation. The converter includes a flexible,
2-wire synchronous serial interface for low-cost isolation.
The ADS1251 is a single-channel converter and is offered in
an SO-8 package. It is pin-compatible with the faster ADS1252
(41.7kHz data rate).
APPLICATIONS
●
●
●
●
●
●
CARDIAC DIAGNOSTICS
DIRECT THERMOCOUPLE INTERFACES
BLOOD ANALYSIS
INFRARED PYROMETERS
LIQUID/GAS CHROMATOGRAPHY
PRECISION PROCESS CONTROL
ADS1251
VREF
CLK
+VIN
–VIN
4th-Order
∆Σ
Modulator
Digital
Filter
Serial
Interface
SCLK
DOUT/DRDY
+VDD
GND
Control
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 2001-2009, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ELECTROSTATIC
DISCHARGE SENSITIVITY
ABSOLUTE MAXIMUM RATINGS(1)
Analog Input: Current ............................................... ±100mA, Momentary
±10mA, Continuous
Voltage .................................... GND – 0.3V to VDD + 0.3V
VDD to GND ............................................................................ –0.3V to 6V
VREF Voltage to GND ............................................... –0.3V to VDD + 0.3V
Digital Input Voltage to GND ................................... –0.3V to VDD + 0.3V
Digital Output Voltage to GND ................................. –0.3V to VDD + 0.3V
Operating Temperature ...................................................... –40°C to 85°C
Power Dissipation .......................................................................... 500mW
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
SO-8
D
–40°C to +85°C
ADS1251U
ADS1251U
Rails, 100
"
"
"
"
ADS1251U/2K5
Tape and Reel, 2500
ADS1251
"
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.
PRODUCT FAMILY
PRODUCT
ADS1250
ADS1251
ADS1252
ADS1253
ADS1254
# OF INPUTS
1
1
1
4
4
MAXIMUM DATA RATE
Differential
Differential
Differential
Differential
Differential
25.0kHz
20.8kHz
41.7kHz
20.8kHz
20.8kHz
COMMENTS
Includes PGA from 1 to 8
Includes Separate Analog and Digital Supplies
ELECTRICAL CHARACTERISTICS
All specifications at TMIN to TMAX, VDD = +5V, CLK = 8MHz, and VREF = 4.096, unless otherwise specified.
ADS1251U
PARAMETER
ANALOG INPUT
Full-Scale Input Voltage
Absolute Input Voltage
Differential Input Impedance
Input Capacitance
Input Leakage
DYNAMIC CHARACTERISTICS
Data Rate
Bandwidth
Serial Clock (SCLK)
System Clock Input (CLK)
ACCURACY
Integral Nonlinearity
THD
Noise
Resolution
No Missing Codes
Common-Mode Rejection
Gain Error
Offset Error
Gain Sensitivity to VREF
Power-Supply Rejection Ratio
CONDITIONS
+VIN – (–VIN)
+VIN or –VIN to GND
CLK = 3.84kHz
CLK = 1MHz
CLK = 8MHz
TYP
MAX
±VREF
–0.3
VDD
430
1.7
210
6
5
At +25°C
At TMIN to TMAX
50
1
20.8
–3dB, CLK = 8MHz
4.24
8
8
±0.0002
105
1.5
Differential Input
1kHz Input; 0.1dB below FS
60Hz, AC
24
24
90
70
PERFORMANCE OVER TEMPERATURE
Offset Drift
Gain Drift
2
MIN
98
0.1
±30
1:1
80
0.07
0.4
±0.0015
2.5
1
±100
UNITS
V
V
MΩ
MΩ
kΩ
pF
pA
nA
kHz
kHz
MHz
MHz
% of FSR
dB
ppm of FSR, rms
Bits
Bits
dB
% of FSR
ppm of FSR
dB
ppm/°C
ppm/°C
ADS1251
www.ti.com
SBAS184D
ELECTRICAL CHARACTERISTICS (Cont.)
All specifications at TMIN to TMAX, VDD = +5V, CLK = 8MHz, and VREF = 4.096, unless otherwise specified.
ADS1251U
PARAMETER
CONDITIONS
VOLTAGE REFERENCE
VREF
Load Current
DIGITAL INPUT/OUTPUT
Logic Family
Logic Level: VIH
VIL
VOH
VOL
Input (SCLK, CLK) Hysteresis
Data Format
MIN
TYP
MAX
UNITS
0.5
4.096
32
VDD
V
µA
+VDD + 0.3
+0.8
V
V
V
V
V
CMOS
+4.0
–0.3
+4.5
IOH = –500µA
IOL = 500µA
0.4
0.6
Offset Binary Two’s Complement
POWER-SUPPLY REQUIREMENTS
Operation
Quiescent Current
Operating Power
Power-Down Current
+4.75
+5
1.5
7.5
0.4
VDD = +5VDC
TEMPERATURE RANGE
Operating
Storage
–40
–60
PIN CONFIGURATION
VDC
mA
mW
µA
+85
+100
°C
°C
PIN DESCRIPTIONS
Top View
SO
+VIN
1
8
VREF
–VIN
2
7
GND
+VDD
3
6
SCLK
CLK
4
5
DOUT/DRDY
PIN
NAME
1
+VIN
Analog Input: Positive Input of the Differential Analog Input
2
–VIN
Analog Input: Negative Input of the Differential Analog Input.
3
+VDD
Input: Power-Supply Voltage, +5V
4
CLK
Digital Input: Device System Clock. The
system clock is in the form of a CMOScompatible clock. This is a Schmitt-Trigger
input.
5
DOUT/DRDY
Digital Output: Serial Data Output/Data
Ready. This output indicates that a new
output word is available from the ADS1251
data output register. The serial data is
clocked out of the serial data output shift
register using SCLK.
6
SCLK
Digital Input: Serial Clock. The serial clock
is in the form of a CMOS-compatible clock.
The serial clock operates independently
from the system clock, therefore, it is possible to run SCLK at a higher frequency
than CLK. The normal state of SCLK is
LOW. Holding SCLK HIGH will either initiate a modulator reset for synchronizing
multiple converters or enter power-down
mode. This is a Schmitt-Trigger input.
7
GND
Input: Ground
8
VREF
Analog Input: Reference Voltage Input
ADS1251U
ADS1251
SBAS184D
+5.25
2
10
1
www.ti.com
PIN DESCRIPTION
3
TYPICAL CHARACTERISTICS
At TA = +25°C, VDD = +5V, CLK = 8MHz, and VREF = 4.096, unless otherwise specified.
RMS NOISE vs DATA RATE
EFFECTIVE RESOLUTION vs DATA OUTPUT RATE
20.0
1.6
Effective Resolution (Bits)
RMS Noise (ppm of FS)
2.0
1.2
0.8
0.4
0
19.5
19.0
18.5
18.0
10
100
1k
10k
100k
100
1k
Data Rate (Hz)
RMS NOISE vs TEMPERATURE
1.8
Effective Resolution (Bits)
RMS Noise (ppm of FS)
19.5
1.6
1.4
1.2
19.0
18.5
18.0
1.0
–40
–20
0
20
40
60
80
100
–40
–20
0
Temperature (°C)
20
40
60
80
100
Temperature (°C)
RMS NOISE vs VREF VOLTAGE
RMS NOISE vs VREF VOLTAGE
18
14
16
12
RMS Noise (ppm of FS)
14
RMS Noise (µV)
100k
EFFECTIVE RESOLUTION vs TEMPERATURE
2.0
12
10
8
6
4
10
8
6
4
2
2
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
1
2
3
4
5
VREF Voltage (V)
VREF Voltage (V)
4
10k
Data Output Rate (Hz)
ADS1251
www.ti.com
SBAS184D
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VDD = +5V, CLK = 8MHz, and VREF = 4.096, unless otherwise specified.
INTEGRAL NONLINEARITY vs TEMPERATURE
RMS NOISE vs INPUT VOLTAGE
4.0
2.0
RMS Noise (ppm of FS)
3.5
3.0
INL (ppm of FS)
1.5
1.0
2.5
2.0
1.5
1.0
0.5
0.5
0
0
–5
–4
–3
–2
–1
0
1
2
3
4
–40
5
–20
0
20
40
60
80
100
80
100
7
8
Temperature (°C)
Input Voltage (V)
OFFSET vs TEMPERATURE
INTEGRAL NONLINEARITY vs DATA OUTPUT RATE
40
5
35
Offset (ppm of FS)
INL (ppm of FS)
4
3
2
30
25
20
15
10
1
5
0
0
100
1k
10k
–40
100k
0
20
40
60
Temperature (°C)
GAIN ERROR vs TEMPERATURE
POWER-SUPPLY REJECTION RATIO
vs CLK FREQUENCY
650
–60
–65
625
–70
600
PSRR (dB)
Gain Error (ppm of FS)
–20
Data Output Rate (Hz)
575
550
–75
–80
–85
–90
525
–95
500
–100
–40
–20
0
20
40
60
80
100
1
Temperature (°C)
3
4
5
6
Clock Frequency (MHz)
ADS1251
SBAS184D
2
www.ti.com
5
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VDD = +5V, CLK = 8MHz, and VREF = 4.096, unless otherwise specified.
COMMON-MODE REJECTION RATIO
vs COMMON-MODE FREQUENCY
–60
–60
–65
–65
–70
–70
–75
–75
CMRR (dB)
CMRR at 60Hz (dB)
COMMON-MODE REJECTION RATIO
vs CLK FREQUENCY
–80
–85
–80
–85
–90
–90
–95
–95
–100
–100
–105
–105
1
2
3
4
5
6
7
8
10
100
Clock Frequency (MHz)
1k
10k
100k
Common-Mode Signal Frequency (Hz)
CURRENT vs TEMPERATURE
POWER DISSIPATION vs CLK FREQUENCY
1.65
9
8
Power Dissipation (mW)
Current (mA)
1.60
1.55
1.50
1.45
7
6
5
4
3
2
1
1.40
0
–20
0
20
40
60
80
100
0
2
3
4
5
6
7
Clock Frequency (MHz)
VREF CURRENT vs CLK FREQUENCY
TYPICAL FFT
(1kHz input at 0.1dB less than full-scale)
35
0
30
–20
25
20
15
10
5
8
–40
–60
–80
–100
–120
–140
–160
0
0.1
1
0
10
1
2
3
4
5
6
7
8
9
10
11
Frequency (kHz)
Clock Frequency (MHz)
6
1
Temperature (°C)
Relative Magnitude (dB)
VREF Current (µA)
–40
ADS1251
www.ti.com
SBAS184D
THEORY OF OPERATION
The ADS1251 is a precision, high-dynamic range, 24-bit,
delta-sigma, A/D converter capable of achieving very
high-resolution digital results at high data rates. The analog
input signal is sampled at a rate determined by the frequency
of the system clock (CLK). The sampled analog input is
modulated by the delta-sigma A/D modulator, which is followed by a digital filter. A Sinc5 digital low-pass filter processes
the output of the delta-sigma modulator and writes the result
into the data-output register. The DOUT/DRDY pin is pulled
LOW, indicating that new data are available to be read by the
external microcontroller/microprocessor. As shown in the block
diagram on the front page, the main functional blocks of the
ADS1251 are the 4th-order delta-sigma modulator, a digital
filter, control logic, and a serial interface. Each of these
functional blocks is described in the following sections.
ANALOG INPUT
The ADS1251 contains a fully differential analog input. In
order to provide low system noise, common-mode rejection
of 98dB, and excellent power-supply rejection, the design
topology is based on a fully differential switched-capacitor
architecture. The bipolar input voltage range is from –4.096
to +4.096V, when the reference input voltage equals +4.096V.
The bipolar range is with respect to –VIN, and not with respect
to GND.
clock frequency of 8MHz, the data output rate is 20.8kHz with
a –3dB frequency of 4.24kHz. The –3dB frequency scales
with the system clock frequency.
To ensure the best linearity of the ADS1251, and to maximize the elimination of even-harmonic noise errors, a fully
differential signal is recommended.
For more information about the ADS1251 input structure,
refer to application note SBAA086 found at www.ti.com.
BIPOLAR INPUT
Each of the differential inputs of the ADS1251 must stay
between –0.3V and VDD. With a reference voltage at less
than half of VDD, one input can be tied to the reference
voltage, and the other input can range from 0V to
2 • VREF. By using a three op amp circuit featuring a single
amplifier and four external resistors, the ADS1251 can be
configured to accept bipolar inputs referenced to ground. The
conventional ±2.5V, ±5V, and ±10V input ranges can be
interfaced to the ADS1251 using the resistor values shown in
Figure 1.
R1
The differential input impedance of the analog input changes
with the ADS1251 system clock frequency (CLK). The relationship is:
10kΩ
20kΩ
Impedance (Ω) = (8MHz/CLK) • 210,000
–IN
See application note Understanding the ADS1251, ADS1253,
and ADS1254 Input Circuitry (SBAA086), available for download from TI’s web site www.ti.com.
VREF
OPA4350
OPA4350
REF
2.5V
Second, the current into or out of the analog inputs must be
limited. Under no conditions should the current into or out of
the analog inputs exceed 10mA.
Third, to prevent aliasing of the input signal, the bandwidth of
the analog-input signal must be band-limited; the bandwidth
is a function of the system clock frequency. With a system
ADS1251
R2
With regard to the analog-input signal, the overall analog
performance of the device is affected by three items. First,
the input impedance can affect accuracy. If the source
impedance of the input signal is significant, or if there is
passive filtering prior to the ADS1251, a significant portion of
the signal can be lost across this external impedance. The
magnitude of the effect is dependent on the desired system
performance.
BIPOLAR INPUT
R1
R2
±10V
±5V
±2.5V
2.5kΩ
5kΩ
10kΩ
5kΩ
10kΩ
20kΩ
FIGURE 1. Level-Shift Circuit for Bipolar Input Ranges.
ADS1251
SBAS184D
+IN
OPA4350
Bipolar
Input
www.ti.com
7
DELTA-SIGMA MODULATOR
REFERENCE INPUT
The ADS1251 operates from a nominal system clock frequency of 8MHz. The modulator frequency is fixed in relation
to the system clock frequency. The system clock frequency
is divided by 6 to derive the modulator frequency (fMOD).
Therefore, with a system clock frequency of 8MHz, the
modulator frequency is 1.333MHz. Furthermore, the
oversampling ratio of the modulator is fixed in relation to the
modulator frequency. The oversampling ratio of the modulator is 64, and with the modulator frequency running at
1.333MHz, the data rate is 20.8kHz. Using a slower system
clock frequency will result in a lower data output rate, as
shown in Table I.
The reference input takes an average current of 32µA with a
8MHz system clock. This current will be proportional to the
system clock. A buffered reference is recommended for the
ADS1251. The recommended reference circuit is shown in
Figure 2.
Reference voltages higher than 4.096V will increase the fullscale range, while the absolute internal circuit noise of the
converter remains the same. This will decrease the noise in
terms of ppm of full-scale, which increases the effective
resolution (see typical characteristic RMS Noise vs VREF
Voltage).
DIGITAL FILTER
CLK (MHz)
DATA OUTPUT RATE (Hz)
8(1)
7.372800(1)
6.144000(1)
6.000000(1)
4.915200(1)
3.686400(1)
3.072000(1)
2.457600(1)
1.843200(1)
0.921600
0.460800
0.384000
0.192000
0.038400
0.023040
0.019200
0.011520
0.009600
0.007680
0.006400
0.005760
0.004800
0.003840
20,833
19,200
16,000
15,625
12,800
9600
8000
6400
4800
2400
1200
1000
500
100
60
50
30
25
20
16.67
15
12.50
10
The digital filter of the ADS1251, referred to as a Sinc5 filter,
computes the digital result based on the most recent outputs
from the delta-sigma modulator. At the most basic level, the
digital filter can be thought of as averaging the modulator
results in a weighted form and presenting this average as the
digital output. The digital output rate, or data rate, scales
directly with the system clock frequency. This allows the data
output rate to be changed over a very wide range (five orders
of magnitude) by changing the system clock frequency.
However, it is important to note that the –3dB point of the
filter is 0.2035 times the data output rate, so the data output
rate should allow for sufficient margin to prevent attenuation
of the signal of interest.
As the conversion result is essentially an average, the
data-output rate determines the location of the resulting
notches in the digital filter (see Figure 3). Note that the first
notch is located at the data output rate frequency, and
subsequent notches are located at integer multiples of the
data output rate; this allows for rejection of not only the
fundamental frequency, but also harmonic frequencies. In
this manner, the data output rate can be used to set specific
notch frequencies in the digital filter response.
NOTE: (1) Standard Clock Oscillator.
TABLE I. CLK Rate versus Data Output Rate.
For example, if the rejection of power-line frequencies is
desired, then the data output rate can simply be set to the
power-line frequency. For 50Hz rejection, the system clock
+5V
+5V
0.10µF
7
0.1µF
2
1
REF3040
2
3
OPA350
+
+
3
To VREF
Pin 8 of
the ADS1251
6
10kΩ
0.1µF
10µF
0.10µF
10µF
0.1µF
4
FIGURE 2. Recommended External Voltage Reference Circuit for Best Low-Noise Operation with the ADS1251.
8
ADS1251
www.ti.com
SBAS184D
frequency must be 19.200kHz, and this sets the data output
rate to 50Hz (see Table I and Figure 4). For 60Hz rejection, the
system CLK frequency must be 23.040kHz, and this sets the
data output rate to 60Hz (see Table I and Figure 5). If both
50Hz and 60Hz rejection is required, then the system CLK
must be 3.840kHz; this sets the data output rate to 10Hz and
rejects both 50Hz and 60Hz (see Table I and Figure 6).
There is an additional benefit in using a lower data output
rate. It provides better rejection of signals in the frequency
band of interest. For example, with a 50Hz data output rate,
a significant signal at 75Hz may alias back into the passband
at 25Hz. This is due to the fact that rejection at 75Hz may
only be 66dB in the stopband—frequencies higher than the
first notch frequency (see Figure 4). However, setting the
data output rate to 10Hz provides 135dB rejection at 75Hz
(see Figure 6). A similar benefit is gained at frequencies near
the data output rate (see Figures 7, 8, 9, and 10). For
example, with a 50Hz data output rate, rejection at 55Hz may
only be 105dB (see Figure 7). With a 10Hz data output rate,
however, rejection at 55Hz will be 122dB (see Figure 8). If a
slower data output rate does not meet the system requirements, then the analog front-end can be designed to provide
the needed attenuation to prevent aliasing. Additionally, the
data output rate may be increased and additional digital
filtering may be done in the processor or controller.
Application note SBAA103, A Spreadsheet to Calculate the
Frequency Response of the ADS1250-54, available for download from TI’s web site at www.ti.com, provides a simple tool
for calculating the ADS1250 frequency response for any CLK
frequency.
The digital filter is described by the following transfer function:
 π • f • 64 
sin 

 fMOD 
H(f) =
 π•f 
64 • sin 

 fMOD 
5
(
)




CONTROL LOGIC
The control logic is used for communications and control of
the ADS1251.
Power-Up Sequence
Prior to power-up, all digital and analog input pins must be
LOW. At the time of power-up, these signal inputs can be
biased to a voltage other than 0V; however, they should
never exceed +VDD.
Once the ADS1251 powers up, the DOUT/DRDY line will
pulse LOW on the first conversion for which the data is valid
from the analog input signal.
DOUT/DRDY
The DOUT/DRDY output signal alternates between two
modes of operation. The first mode of operation is the Data
Ready mode (DRDY) to indicate that new data have been
loaded into the data output register and are ready to be read.
The second mode of operation is the Data Output (DOUT)
mode and is used to serially shift data out of the Data Output
Register (DOR). See Figure 11 for the time domain partitioning of the DRDY and DOUT function.
See Figure 12 for the basic timing of DOUT/DRDY. During
the time defined by t2, t3, and t4, the DOUT/DRDY pin
functions in DRDY mode. The state of the DOUT/DRDY pin
or

1 – z –64
H(z) = 
 64 • 1 – z –1

The digital filter requires five conversions to fully settle. The
modulator has an oversampling ratio of 64; therefore, it
requires 5 • 64, or 320 modulator results (or clocks) to fully
settle. As the modulator clock is derived from the system
CLK (modulator clock = CLK ÷ 6), the number of system
clocks required for the digital filter to fully settle is
5 • 64 • 6, or 1920 CLKs. This means that any significant step
change at the analog input requires five full conversions to
settle. However, if the step change at the analog input occurs
asynchronously to the DOUT/DRDY pulse, six conversions
are required to ensure full settling.
5
ADS1251
SBAS184D
www.ti.com
9
DIGITAL FILTER RESPONSE
0
–20
–20
–40
–40
–60
–60
–80
Gain (dB)
Gain (dB)
NORMALIZED DIGITAL FILTER RESPONSE
0
–100
–120
–80
–100
–120
–140
–140
–160
–160
–180
–180
–200
–200
0
1
2
3
4
5
6
7
8
9
10
0
50
100
FIGURE 3. Normalized Digital Filter Response.
0
–20
–20
–40
–40
–60
–60
–80
Gain (dB)
Gain (dB)
250
300
DIGITAL FILTER RESPONSE
0
–100
–120
–80
–100
–120
–140
–140
–160
–160
–180
–180
–200
–200
0
50
100
150
200
250
0
300
10
20
30
Frequency (Hz)
40
50
60
70
80
90
100
Frequency (Hz)
FIGURE 5. Digital Filter Response (60Hz).
FIGURE 6. Digital Filter Response (10Hz Multiples).
DIGITAL FILTER RESPONSE
DIGITAL FILTER RESPONSE
0
0
–20
–20
–40
–40
–60
–60
–80
Gain (dB)
Gain (dB)
200
FIGURE 4. Digital Filter Response (50Hz).
DIGITAL FILTER RESPONSE
–100
–120
–80
–100
–120
–140
–140
–160
–160
–180
–180
–200
–200
45
46
47
48
49
50
51
52
53
54
55
45
Frequency (Hz)
46
47
48
49
50
51
52
53
54
55
Frequency (Hz)
FIGURE 7. Expanded Digital Filter Response (50Hz with a
50Hz data output rate).
10
150
Frequency (Hz)
Frequency (Hz)
FIGURE 8. Expanded Digital Filter Response (50Hz with a
10Hz data output rate).
ADS1251
www.ti.com
SBAS184D
DIGITAL FILTER RESPONSE
0
–20
–20
–40
–40
–60
–60
Gain (dB)
Gain (dB)
DIGITAL FILTER RESPONSE
0
–80
–100
–120
–80
–100
–120
–140
–140
–160
–160
–180
–180
–200
–200
55
56
57
58
59
60
61
62
63
64
55
65
56
57
58
59
60
61
62
63
64
65
Frequency (Hz)
Frequency (Hz)
FIGURE 9. Expanded Digital Filter Response (60Hz with a
60Hz data output rate).
FIGURE 10. Expanded Digital Filter Response (60Hz with a
10Hz data output rate).
is HIGH prior to the internal transfer of new data to the DOR.
The result of the A/D conversion is written to the DOR from
the Most Significant Bit (MSB) to the Least Significant Bit
(LSB) in the time defined by t1 (see Figures 11 and 12). The
DOUT/DRDY line then pulses LOW for the time defined by
t2, and then drives the line HIGH for the time defined by t3 to
indicate that new data are available to be read. At this point,
the function of the DOUT/DRDY pin changes to DOUT
mode. Data are shifted out on the pin after t7. If the MSB is
high (because of a negative result) the DOUT/DRDY signal
will stay HIGH after the end of time t3. The device communicating with the ADS1251 can provide SCLKs to the ADS1251
after the time defined by t6. The normal mode of reading data
from the ADS1251 is for the device reading the ADS1251 to
latch the data on the rising edge of SCLK (because data are
shifted out of the ADS1251 on the falling edge of SCLK). In
order to retrieve valid data, the entire DOR must be read
before the DOUT/DRDY pin reverts back to DRDY mode.
The internal data pointer for shifting data out on DOUT/DRDY
is reset on the falling edge of the time defined by t1 and t4.
This ensures that the first bit of data shifted out of the
ADS1251 after DRDY mode is always the MSB of new data.
If SCLKs are not provided to the ADS1251 during the DOUT
mode, the MSB of the DOR is present on the DOUT/DRDY
line until the beginning of the time defined by t4. If an
incomplete read of the ADS1251 takes place while in DOUT
mode (that is, less than 24 SCLKs were provided), the state
of the last bit read is present on the DOUT/DRDY line until
the beginning of the time defined by t4. If more than 24
SCLKs are provided during DOUT mode, the DOUT/DRDY
line stays LOW until the time defined by t4.
SYNCHRONIZING MULTIPLE CONVERTERS
The normal state of SCLK is LOW; however, by holding
SCLK HIGH, multiple ADS1251s can be synchronized. This
is accomplished by holding SCLK HIGH for at least four, but
less than 20, consecutive DOUT/DRDY cycles (see Figure
13). After the ADS1251 circuitry detects that SCLK has been
held HIGH for four consecutive DOUT/DRDY cycles, the
DOUT/DRDY pin pulses LOW for one CLK cycle and then is
held HIGH, and the modulator is held in a reset state. The
modulator will be released from reset and synchronization
occurs on the falling edge of SCLK. With multiple converters,
the falling edge transition of SCLK must occur simultaneously on all devices. It is important to note that prior to
synchronization, the DOUT/DRDY pulse of multiple
ADS1251s in the system could have a difference in timing up
to one DRDY period. Therefore, to ensure synchronization,
the SCLK must be held HIGH for at least five DRDY cycles.
The first DOUT/DRDY pulse after the falling edge of SCLK
occurs at t14. The first DOUT/DRDY pulse indicates valid
data.
ADS1251
SBAS184D
www.ti.com
11
POWER-DOWN MODE
SERIAL INTERFACE
The normal state of SCLK is LOW; however, by holding
SCLK HIGH, the ADS1251 will enter power-down mode. This
is accomplished by holding SCLK HIGH for at least 20
consecutive DOUT/DRDY periods (see Figure 14). After the
ADS1251 circuitry detects that SCLK has been held HIGH for
four consecutive DOUT/DRDY cycles, the DOUT/DRDY pin
pulses LOW for one CLK cycle and then is held HIGH, and
the modulator is held in a reset state. If SCLK is held HIGH
for an additional 16 DOUT/DRDY periods, the ADS1251
enters power-down mode. The part will be released from
power-down mode on the falling edge of SCLK. It is important to note that the DOUT/DRDY pin is held HIGH after four
DOUT/DRDY cycles, but power-down mode is not entered
for an additional 16 DOUT/DRDY periods. The first
DOUT/DRDY pulse after the falling edge of SCLK occurs at
t16 and indicates valid data. Subsequent DOUT/DRDY pulses
will occur normally.
The ADS1251 includes a simple serial interface which can be
connected to microcontrollers and digital signal processors in
a variety of ways. Communications with the ADS1251 can
commence on the first detection of the DOUT/DRDY pulse
after power up.
SYMBOL
tDRDY
DRDY Mode
DOUT Mode
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
t12
t13
t14
t15
t16
t17
It is important to note that the data from the ADS1251 is a
24-bit result transmitted MSB-first in Offset Binary Twos
Complement format, as shown in Table III.
The data must be clocked out before the ADS1251 enters
DRDY mode to ensure reception of valid data, as described
in the DOUT/DRDY section of this data sheet.
DIFFERENTIAL VOLTAGE INPUT
DIGITAL OUTPUT (HEX)
+Full-Scale
Zero
–Full-Scale
7FFFFFH
000000H
800000H
TABLE III. ADS1251 Data Format (Offset Binary Twos
Complement).
DESCRIPTION
MIN
Conversion Cycle
DRDY Mode
DOUT Mode
DOR Write Time
DOUT/DRDY LOW Time
DOUT/DRDY HIGH Time (Prior to Data Out)
DOUT/DRDY HIGH Time (Prior to Data Ready)
Rising Edge of CLK to Falling Edge of DOUT/DRDY
End of DRDY Mode to Rising Edge of First SCLK
End of DRDY Mode to Data Valid (Propagation Delay)
Falling Edge of SCLK to Data Valid (Hold Time)
Falling Edge of SCLK to Next Data Out Valid (Propagation Delay)
SCLK Setup Time for Synchronization or Power Down
DOUT/DRDY Pulse for Synchronization or Power Down
Rising Edge of SCLK Until Start of Synchronization
Synchronization Time
Falling Edge of CLK (After SCLK Goes LOW) Until Start of DRDY Mode
Rising Edge of SCLK Until Start of Power Down
Falling Edge of CLK (After SCLK Goes LOW) Until Start of DRDY Mode
Falling Edge of Last DOUT/DRDY to Start of Power Down
TYP
MAX
UNITS
384 • CLK
36 • CLK
348 • CLK
6 • CLK
6 • CLK
6 • CLK
24 • CLK
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
30
30
30
5
30
30
3 • CLK
1537 • CLK
0.5 • CLK
7679 • CLK
6143.5 • CLK
2042.5 • CLK
7681 • CLK
2318.5 • CLK
6144.5 • CLK
TABLE II. Digital Timing.
DOUT Mode
DRDY Mode
t2
t4
DOUT/DRDY
DOUT Mode
DATA
DRDY Mode
t3
DATA
DATA
t1
FIGURE 11. DOUT/DRDY Partitioning.
12
ADS1251
www.ti.com
SBAS184D
ADS1251
SBAS184D
www.ti.com
13
t4
t1
t10
t2
t3
t10
t2
FIGURE 14. Power-Down Mode.
DOUT/DRDY
SCLK
CLK
t3
FIGURE 13. Synchronization Mode.
DOUT/DRDY
SCLK
CLK
FIGURE 12. DOUT/DRDY Timing.
DOUT/DRDY
SCLK
CLK
tDRDY
DOUT
Mode
DATA
DOUT
Mode
DATA
tDRDY
t2
t4
t4
DRDY Mode
t5
4 tDRDY
4 tDRDY
t12
t3
t15
t11
MSB
t7
t6
DATA
DATA
t8
t9
tDRDY
t11
t11
t17
t13
t16
Power-Down Occurs Here
t14
Synchronization Begins Here
Synchronization Mode Starts Here
DOUT Mode
LSB
t2
t2
t3
t3
tDRDY
DOUT
Mode
DATA
tDRDY
DOUT
Mode
DATA
t4
t4
SYSTEM CONSIDERATIONS
ISOLATION
The serial interface of the ADS1251 provides for simple
isolation methods. The CLK signal can be local to the
ADS1251, which then only requires two signals (SCLK and
DOUT/DRDY) to be used for isolated data acquisition.
LAYOUT
The recommendations for power supplies and grounding will
change depending on the requirements and specific design
of the overall system. Achieving 24 bits of noise performance
is a great deal more difficult than achieving 12 bits of noise
performance. In general, a system can be broken up into four
different stages:
• Analog Processing
POWER SUPPLY
The power supply must be well-regulated and low-noise. For
designs requiring very high resolution from the ADS1251,
power-supply rejection will be a concern. Avoid running
digital lines under the device as they may couple noise onto
the die. High-frequency noise can capacitively couple into
the analog portion of the device and will alias back into the
passband of the digital filter, affecting the conversion result.
This clock noise will cause an offset error.
GROUNDING
The analog and digital sections of the system design should
be carefully and cleanly partitioned. Each section should
have its own ground plane with no overlap between them.
GND should be connected to the analog ground plane, as
well as all other analog grounds. Do not join the analog and
digital ground planes on the board, but instead connect the
two with a moderate signal trace. For multiple converters,
connect the two ground planes at one location as central to
all of the converters as possible. In some cases, experimentation may be required to find the best point to connect the
two planes together. The printed circuit board can be designed to provide different analog/digital ground connections
via short jumpers. The initial prototype can be used to
establish which connection works best.
• Analog Portion of the ADS1251
• Digital Portion of the ADS1251
• Digital Processing
For the simplest system consisting of minimal analog signal
processing (basic filtering and gain), a microcontroller, and
one clock source, one can achieve high resolution by powering all components from a common power supply. In addition, all components could share a common ground plane.
Thus, there would be no distinctions between analog power
and ground, and digital power and ground. The layout
should still include a power plane, a ground plane, and
careful decoupling. In a more extreme case, the design could
include:
• Multiple ADS1251s
• Extensive Analog Signal Processing
• One or More Microcontrollers, Digital Signal Processors,
or Microprocessors
• Many Different Clock Sources
• Interconnections to Various Other Systems
High resolution will be very difficult to achieve for this design.
The approach would be to break the system into as many
different parts as possible. For example, each ADS1251 may
have its own analog processing front end.
DECOUPLING
DEFINITION OF TERMS
Good decoupling practices should be used for the ADS1251
and for all components in the design. All decoupling capacitors, and specifically the 0.1µF ceramic capacitors, should be
placed as close as possible to the pin being decoupled. A
1µF to 10µF capacitor, in parallel with a 0.1µF ceramic
capacitor, should be used to decouple VDD to GND.
An attempt has been made to use consistent terminology in
this data sheet. In that regard, the definition of each term is
provided here:
14
Analog-Input Differential Voltage—for an analog signal
that is fully differential, the voltage range can be compared to
that of an instrumentation amplifier. For example, if both
analog inputs of the ADS1251 are at 2.048V, the differential
voltage is 0V. If one analog input is at 0V and the other
ADS1251
www.ti.com
SBAS184D
analog input is at 4.096V, then the differential voltage magnitude is 4.096V. This is the case regardless of which input
is at 0V and which is at 4.096V. The digital-output result,
however, is quite different. The analog-input differential voltage is given by the following equation:
The 2 • VREF figure in each calculation represents the fullscale range of the ADS1251. This means that both units are
absolute expressions of resolution—the performance in different configurations can be directly compared, regardless of
the units.
+VIN – (–VIN)
fMOD—frequency of the modulator and the frequency the
input is sampled.
A positive digital output is produced whenever the analoginput differential voltage is positive, whereas a negative
digital output is produced whenever the differential is negative. For example, a positive full-scale output is produced
when the converter is configured with a 4.096V reference,
and the analog-input differential is 4.096V. The negative fullscale output is produced when the differential voltage is
–4.096V. In each case, the actual input voltages must remain
within the –0.3V to +VDD range.
Actual Analog-Input Voltage—the voltage at any one analog input relative to GND.
Full-Scale Range (FSR)—as with most A/D converters, the
full-scale range of the ADS1251 is defined as the input which
produces the positive full-scale digital output minus the input
which produces the negative full-scale digital output. For
example, when the converter is configured with a 4.096V
reference, the differential full-scale range is:
fMOD =
CLK Frequency
6
fDATA—Data output rate.
fDATA =
fMOD CLK Frequency
=
64
384
Noise Reduction—for random noise, the ER can be improved with averaging. The result is the reduction in noise by
the factor √N, where N is the number of averages, as shown
in Table IV. This can be used to achieve true 24-bit performance at a lower data rate. To achieve 24 bits of resolution,
more than 24 bits must be accumulated. A 36-bit accumulator
is required to achieve an ER of 24 bits. The following uses
VREF = 4.096V, with the ADS1251 outputting data at 20kHz, a
4096 point average will take 204.8ms. The benefits of averaging will be degraded if the input signal drifts during that 200ms.
[4.096V (positive full-scale) – (–4.096V) (negative full-scale)] = 8.192V
Least Significant Bit (LSB) Weight—this is the theoretical
amount of voltage that the differential voltage at the analog
input would have to change in order to observe a change in
the output data of one least significant bit. It is computed as
follows:
LSB Weight =
N
(Number
of Averages)
NOISE
REDUCTION
FACTOR
ER
IN
µVrms
ER
IN
BITS rms
1
2
4
8
16
32
64
128
256
512
1024
2048
4096
1
1.414
2
2.82
4
5.66
8
11.3
16
22.6
32
45.25
64
16µV
11.3µV
8µV
5.66µV
4µV
2.83µV
2µV
1.41µV
1µV
0.71µV
0.5µV
0.35µV
0.25µV
19.26
19.75
20.26
20.76
21.26
21.76
22.26
22.76
23.26
23.76
24.26
24.76
25.26
Full−ScaleRange 2 • VREF
= N
2N – 1
2 –1
where N is the number of bits in the digital output.
Conversion Cycle—as used here, a conversion cycle refers
to the time period between DOUT/DRDY pulses.
Effective Resolution (ER)—of the ADS1251, in a particular
configuration, can be expressed in two different units:
bits rms (referenced to output) and µVrms (referenced to
input). Computed directly from the converter’s output data,
each is a statistical calculation based on a given number of
results. Noise occurs randomly; the rms value represents a
statistical measure, which is one standard deviation. The ER
in bits can be computed as follows:
TABLE IV. Averaging for Noise Reduction.
 2 • VREF 
20 • log

 Vrms noise 
ER in bits rms =
6.02
ADS1251
SBAS184D
www.ti.com
15
Revision History
DATE
REVISION
PAGE
SECTION
6/09
D
2
Product Family Table
9/07
C
12
Table II
DESCRIPTION
Changed ADS1251 maximum data rate from 26.8kHz to 20.8kHz.
Changed t11 from 1 • CLK to 3 • CLK.
.NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
16
ADS1251
www.ti.com
SBAS184D
PACKAGE OPTION ADDENDUM
www.ti.com
8-Nov-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ADS1251U
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS1251U/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS
1251U
ADS1251U/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS
1251U
ADS1251UG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1251U
ADS
1251U
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
8-Nov-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
ADS1251U/2K5
Package Package Pins
Type Drawing
SOIC
D
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
12.4
Pack Materials-Page 1
6.4
B0
(mm)
K0
(mm)
P1
(mm)
5.2
2.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS1251U/2K5
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
Similar pages