Renesas HD74HC423A Dual retriggerable monostable multivibrator Datasheet

HD74HC423A
Dual Retriggerable Monostable Multivibrators
REJ03D0626-0200
(Previous ADE-205-505)
Rev.2.00
Mar 30, 2006
Description
This multivibrator features output-pulse-duration control by two methods. The basic pulse duration is programmed by
selection of external resistance and capacitance values. Once triggered, the basic pulse duration may be extended by
retriggering the gated low-level-active (A) or high-level-active (B) inputs, or be reduced by use of the overriding clear.
The B input is a Schmitt trigger enabling jitter-free triggering from input signals with slow transition rates.
Features
• High Speed Operation
• High Output Current: Fanout of 10 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current
• Ordering Information
Part Name
HD74HC423AP
Package Type
DILP-16 pin
Package Code
(Previous Code)
PRDP0016AE-B
(DP-16FV)
Package
Abbreviation
P
—
PRSP0016DH-B
FP
(FP-16DAV)
Note: Please consult the sales office for the above package availability.
HD74HC423AFPEL
Taping Abbreviation
(Quantity)
EL (2,000 pcs/reel)
SOP-16 pin (JEITA)
Function Table
Note:
Clear
Inputs
A
B
Q
Q
L
X
X
H
X
X
L
L
H
H
X
H
X
L
L
L
H
H
1. H; High level, L; Low level, X; Irrelevant
Rev.2.00 Mar 30, 2006 page 1 of 8
Outputs
H
HD74HC423A
Pin Arrangement
1A
1
16
VCC
1B
2
15
1Rext/Cext
1CLR
3
14
1Cext
1Q
4
13
1Q
2Q
5
12
2Q
2Cext
6
11
2CLR
2Rext/Cect
7
10
2B
GND
8
9
2A
CLR
CLR
(Top view)
Logic Diagram (1/2)
Rext Cext
VCC
VH
VL
OUT
A
Q
CK
CK
CLR
B
CLR
Q
To Another
Transceiver
Absolute Maximum Ratings
Item
Symbol
Ratings
Unit
Supply voltage range
Input / Output voltage
VCC
VIN, VOUT
–0.5 to 7.0
–0.5 to VCC +0.5
V
V
IIK, IOK
IOUT
±20
±25
mA
mA
ICC or IGND
PT
±50
500
mA
mW
Input / Output diode current
Output current
VCC, GND current
Power dissipation
Storage temperature
Tstg
–65 to +150
°C
Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of
which may be realized at the same time.
Rev.2.00 Mar 30, 2006 page 2 of 8
HD74HC423A
Recommended Operating Conditions
Item
Symbol
Ratings
Unit
Supply voltage
Input / Output voltage
VCC
VIN, VOUT
2 to 6
0 to VCC
V
V
Operating temperature
Ta
–40 to 85
0 to 1000
°C
tr , tf
0 to 500
0 to 400
ns
Input rise / fall time
Note:
*1
Conditions
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
1. This item guarantees maximum limit when one input switches.
Waveform: Refer to test circuit of switching characteristics.
Electrical Characteristics
Ta = 25°C
Item
Input voltage
Symbol VCC (V)
VIH
VIL
Output voltage
VOH
VOL
Input current
Quiescent Standby
Supply
state
current
Active
state
Iin
ICC
Ta = –40 to+85°C
2.0
Min
1.5
Typ
—
Max
—
Min
1.5
Max
—
4.5
6.0
3.15
4.2
—
—
—
—
3.15
4.2
—
—
2.0
4.5
—
—
—
—
0.5
1.35
—
—
0.5
1.35
6.0
2.0
—
1.9
—
2.0
1.8
—
—
1.9
1.8
—
4.5
6.0
4.4
5.9
4.5
6.0
—
—
4.4
5.9
—
—
Unit
Test Conditions
V
V
V
Vin = VIH or VIL IOH = –20 µA
4.5
4.18
—
—
4.13
—
IOH = –4 mA
6.0
5.68
—
—
5.63
—
IOH = –5.2 mA
2.0
—
0.0
0.1
—
0.1
4.5
6.0
—
—
0.0
0.0
0.1
0.1
—
—
0.1
0.1
4.5
6.0
—
—
—
—
0.26
0.26
—
—
0.33
0.33
6.0
6.0
—
—
—
—
±0.1
130
—
—
±1.0
220
—
—
130
—
220
Rev.2.00 Mar 30, 2006 page 3 of 8
V
Vin = VIH or VIL IOL = 20 µA
IOH = 4 mA
IOH = 5.2 mA
µA
µA
Vin = VCC or GND
Vin = VCC or
IOUT = 0 µA
GND
Rext / Cext =
0.5 VCC
HD74HC423A
Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25°C
Item
Propagation delay
time
Symbol VCC (V)
tPLH
tPHL
tPHL
tPLH
Pulse width
Removal time
Minimum output
pulse width
tw
trem
tWQ (min)
Ta = –40 to +85°C
Unit
Test Conditions
2.0
Min
—
Typ
—
Max
210
Min
—
Max
265
4.5
6.0
—
—
20
—
42
36
—
—
53
45
2.0
4.5
—
—
—
21
240
48
—
—
300
60
6.0
2.0
—
—
—
—
41
170
—
—
51
215
4.5
6.0
—
—
17
—
34
29
—
—
43
37
2.0
4.5
—
—
—
15
180
36
—
—
225
45
6.0
2.0
—
150
—
—
31
—
—
190
38
—
4.5
6.0
30
26
6
—
—
—
38
33
—
—
2.0
4.5
0
0
—
–3
—
—
5
5
—
—
6.0
2.0
0
—
—
1.5
—
—
5
—
—
—
4.5
6.0
—
—
450
380
—
—
—
—
—
—
ns
Rext = 2 kΩ
ms
ns
Cext = 0.1 µF, Rext = 10 kΩ
pF
Pins 7 & 15
Other pins
Output pulse width
Output rise/fall
time
tWQ
tTLH
tTHL
4.5
2.0
—
—
1.0
—
—
75
—
—
—
95
4.5
6.0
—
—
5
—
15
13
—
—
19
16
Input capacitance
Cin
—
—
—
—
—
5
20
10
—
—
20
10
ns
A or B to Q
ns
A or B to Q
ns
Clear to Q
ns
Clear to Q
ns
A, B, Clear
ns
Clear
µs
Cext = 28 pF
Rext = 6 kΩ
Caution in use: In order to prevent any malfunctions due to noise, connect a highfrequency performance capacitor
between VCC and GND, and keep the wiring between the external components and Cext, Rext/Cext pins
as short as possible.
Test Circuit
Measurement point
CL*
Note: CL includes the probe and fig capacitance.
Rev.2.00 Mar 30, 2006 page 4 of 8
HD74HC423A
Application Data
Vcc = 2.5 V
Output Pulse Width twQ (µs)
10000.0
1000.0
100.0
10.0
Rext
1 kΩ
10 kΩ
100 kΩ
1 MΩ
1.0
0.1
102
103
104
105
106
107
Timing Capacitance Cext (pF)
Vcc = 3.3 V
Output Pulse Width
twQ (µs)
10000.0
1000.0
100.0
10.0
Rext
1 kΩ
10 kΩ
100 kΩ
1 MΩ
1.0
0.1
10
2
10
3
10
4
10
5
10
6
Timing Capacitance Cext (pF)
Rev.2.00 Mar 30, 2006 page 5 of 8
10
7
HD74HC423A
Vcc = 5.0 V
Output Pulse Width twQ (µs)
10000.0
1000.0
100.0
10.0
Rext
1 kΩ
10 kΩ
100 kΩ
1 MΩ
1.0
0.1
102
103
104
105
106
Timing Capacitance Cext (pF)
Rev.2.00 Mar 30, 2006 page 6 of 8
107
HD74HC423A
Rext = 2 kΩ
Coefficient of Output Pulse Width K
1.8
Cext
1000 pF
10000 pF
100000 pF
1000000 pF
1.7
1.6
1.5
1.4
1.3
1.2
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage Vcc (V)
Rext = 10 kΩ
Coefficient of Output Pulse Width K
1.6
Cext
1000 pF
10000 pF
100000 pF
1000000 pF
1.5
1.4
1.3
1.2
1.1
1.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Supply Voltage Vcc (V)
Rev.2.00 Mar 30, 2006 page 7 of 8
5.5
6.0
HD74HC423A
Package Dimensions
JEITA Package Code
P-DIP16-6.3x19.2-2.54
RENESAS Code
PRDP0016AE-B
Previous Code
DP-16FV
MASS[Typ.]
1.05g
D
9
E
16
1
8
b3
0.89
A1
A
Z
L
Reference
Symbol
θ
bp
e
e1
D
E
A
A1
bp
b3
c
θ
e
Z
L
c
e1
( Ni/Pd/Au plating )
JEITA Package Code
P-SOP16-5.5x10.06-1.27
RENESAS Code
PRSP0016DH-B
*1
Previous Code
FP-16DAV
Dimension in Millimeters
Min
Nom Max
7.62
19.2 20.32
6.3 7.4
5.06
0.51
0.40 0.48 0.56
1.30
0.19 0.25 0.31
0°
15°
2.29 2.54 2.79
1.12
2.54
MASS[Typ.]
0.24g
D
F
16
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
9
c
HE
*2
E
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
1
Z
8
e
*3
bp
x
Reference
Symbol
M
A
L1
A1
θ
y
L
Detail F
Rev.2.00 Mar 30, 2006 page 8 of 8
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Dimension in Millimeters
Min Nom Max
10.06 10.5
5.50
0.00 0.10 0.20
2.20
0.34 0.40 0.46
0.15 0.20 0.25
0°
8°
7.50 7.80 8.00
1.27
0.12
0.15
0.80
0.50 0.70 0.90
1.15
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0
Similar pages