Cypress CY8C42423 Power psocâ ¢ device Datasheet

CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
Power PSoC™ Devices
1.0 Features
1.1
• Configurable Analog Mux, 10:1 or 5:2 Differential
• Configurable Digital Blocks
— 8- to 16-Bit Timers, Counters, and PWMs
— Connectable to All GPIO Pins
— Connectable to All High Voltage Output Pins
— Single Block Deadband PWM with Kill
— Digital Blocks can Drive Outputs to 36V
— Complex Peripherals by Combining Blocks
Key Features
• Extended Operating Voltage of 2.5V to 36V
• 2 HV Linear Opamp Control Loops for Driving Power PFETs
• 2 HV Switching Control Loops for Driving External PFETs
•
•
•
•
2 High Voltage CMOS or Open Drain Outputs
2 High Voltage Analog Sense Inputs
4KB of Flash
256 Bytes of SRAM
1.2
•
•
•
•
•
1.3
•
•
•
•
•
•
•
Improved Features
Very Low Current Mode for 100 nA Sleep (Deep Sleep)
Analog Absolute Accuracy (0.75%)
Additional Flexibility for Sleep Modes
2 Comparators with DAC References
6- to 12-Bit ADC (20 Ksps at 8 Bits)
Applications
Battery Chargers (Linear, Switched, or Fly Back)
DC-DC Buck and Boost Converters
Fan Controllers (Tachometer, Temp. Sense, Current Limit)
Motor Drivers (H-Bridge, Hall-Effect Sensors)
White LED Drivers
Temperature Sensor (Thermistor, Thermocouple)
General-Purpose High Voltage Microcontroller
2.0 Block Diagram
HVdd
LowDrop-Out
Regulator
ANALOG and HIGH VOLTAGE
SECTIONS
InternalVdd
ODAC0
VDAC0
ODAC1
VBG
VDAC1
VDAC1 IBIAS
DBC01
GDO1
VDAC0
DBC00
GDO0
VS1
HVO[1]
VS0
Analog to
Digital
Convertor
HVDriver
P0[7]
HVDriver
HVO[0]
P0[6]
P0[3]
P0[2]
P0[1]
Atten1
Vss
Vref
Vbg
P0[4]
Temp
P0[5]
P0[0]
Atten0
P1[0]
P1[1]
IDAC1
AMuxBus3
AMuxBus2
AMuxBus1
AMuxBus0
IDAC0
SYSTEM RESOURCES
PSoC CORE
SleepandWatchdog
COMP0
ODAC1
ACLK
ACLK
POR andLVD
COMP1
ODAC0
LowSpeed
Oscillator
Internal
Voltage
Reference
M8C CPU
PSoC
CORE
Internal
Main
Oscillator
4KBFlash
Global Digital InterconnectBus
System Bus
256BSRAM
I2C
DBC00
DBC01
DBD02
DBD03
SystemResets
DigitalPSoC BlockArray
InterruptController
1 DigitalRow
Digital
Clocks
DIGITAL SYSTEM
Figure 2-1. Block Diagram
Cypress Semiconductor Corporation
Document 38-12034 Rev. *C
•
198 Champion Court
•
San Jose, CA 95134
•
408.943.2600
Revised November 17, 2005
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
3.0
Complete Feature List
• Extended Operating Voltage of 2.5V to 36V
• Powerful Harvard Architecture Processor
— M8C Processor Speeds to 24 MHz
— Low Power at High Speed
— Industrial Temperature Range: -40°C to +85°C
• Additional Flexibility for Sleep Modes
— Select when System Resources are Shut Down
— Very Low Current Mode for 100 nA Sleep (Deep Sleep)
• 2 Advanced Power PSoC Blocks
— 2 High Voltage Analog Sense Inputs
— 2 High Voltage Linear Opamp Control Loops for Driving
Power PFETs
— 2 High Voltage Switching Control Loops for Driving External PFETs
— 2 High Voltage CMOS or Open Drain Outputs
• Advanced Analog Blocks
— Analog Absolute Accuracy (0.75%)
— 2 Comparators with DAC References
— 6- to 12-Bit ADC (20 Ksps at 8 Bits)
— Configurable Analog Mux, 10:1 or 5:2 Differential
• 4 Advanced Digital Blocks (2 with Integrated Deadband)
— 8- to 16-Bit Timers, Counters, and PWMs
— Connectable to All GPIO Pins
— Connectable to All High Voltage Output (HVO) Pins
— Single Block Deadband PWM with Kill
— Digital Blocks can Drive Outputs to 36V
— Complex Peripherals by Combining Blocks
• Flexible On-Chip Memory
— 4KB Flash Program Storage 50,000 Erase/Write Cycles
— 256 Bytes SRAM
— In-System Serial Programming (ISSP™)
— Partial Flash Updates (64-Byte Blocks)
— Flexible Protection Modes
— EEPROM Emulation in Flash
• Precision, Programmable Clocking
• Development Tools
— Free Development Software
(PSoC™ Designer)
— Full-Featured, In-Circuit Emulator and
Programmer
— Full Speed Emulation
— Complex Breakpoint Structure
— 128KB Trace Memory
— Free Application Generation Software
(PSoC Express™)
• Additional System Resources
— I2C™ Master, Slave, and Multi-Master to 400 kHz
— Watchdog and Sleep Timers
— User-Configurable Low Voltage Detection
— Integrated Supervisory Circuit
— On-Chip Precision Voltage Reference
— 4-Bit Current References
Document 38-12034 Rev. *C
4.0
PSoC Functional Overview
The key feature set of the Power PSoC family is the ability to
be powered from and connect to voltages above the standard
5V logic voltage used by most microcontrollers. The Power
PSoC's HVdd pin can connect to a supply voltage of up to 36V.
Internally, an LDO regulator converts the supply voltage to 5V
for powering the analog system, digital system, the core, and
the GPIO.
High voltage signals can be connected to the analog circuitry
through one of two selectable attenuators, each having three
ranges. These precision dividers reduce the external analog
voltage by a factor of 4, 8, or 16. This allows single-ended or
differential signals with up to 36V common mode to be
measured with the ADC. The GPIO pins are not high-voltage
tolerant. Signals with voltages exceeding VGPIO (as shown in
the Absolute Maximum Ratings table, Table 8.2) cannot be
connected to the GPIO pins (P0 [7:0] and P1 [1:0]). Doing so
will damage the device.
The Power PSoC family consists of several Mixed-Signal
Array with On-Chip Controller devices. These devices are
designed to replace multiple traditional MCU-based system
components with one, low-cost single-chip programmable
component. A Power PSoC device includes configurable
analog, digital, and power blocks, as well as programmable
interconnects. This architecture allows the user to create
customized peripheral configurations, to match the requirements of each individual application. Additionally, a fast CPU,
Flash program memory, SRAM data memory, and configurable IO are included in a range of convenient pinouts.
The PSoC architecture, as illustrated in Figure 2-1, is
comprised of five main areas: the Core, the System
Resources, the Digital System, the Analog System, and the
Power Control System. Configurable global bus resources
allow all the device resources to be combined into a complete
custom system. Each PSoC device includes 4 digital blocks,
up to 2 digital high voltage outputs, and up to 10 general
purpose IO (GPIO). The GPIO provide access to the global
digital and analog interconnects.
4.1
Power PSoC Core
The Power PSoC Core is a powerful engine that supports a
rich instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and IMO
(internal main oscillator) and ILO (internal low-speed oscillator). The CPU core, called the M8C, is a powerful processor
with speeds up to 24 MHz. The M8C is a four MIPS 8-bit
Harvard architecture microprocessor.
System Resources provide additional capability, such as
digital clocks for increased flexibility of the PSoC mixed-signal
arrays; I2C functionality for implementing master, slave, and
multi-master; an internal voltage reference of 1.3V for a
number of analog PSoC subsystems; and various system
resets supported by the M8C.
Page 2 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
Digital System
The digital blocks can be connected to any GPIO (or digital
high voltage output) through a set of global buses that can
route any signal to any pin. The buses also allow signal multiplexing and the combining of signals through logic operations.
This configurability frees designs from the constraints of a
fixed peripheral controller.
4.3
• Analog-to-digital converters (up to 12-bit resolution with
single-ended or differential inputs).
• Adjustable input gain of 1/4, 1, 4, or 16 for the ADC.
• Pin-to-pin comparator with low power mode for operation
during sleep.
• Single-ended or differential comparators (up to 2) with
absolute (1.3V) reference or internal DAC reference.
• 1.3V reference (as a System Resource).
ANALOG and HIGH VOLTAGE SECTIONS
DBC01
GDO1
ODAC1
VDAC1
VBG
IBIAS
VDAC1
ODAC0
VDAC0
VDAC0
GDO0
HVO[1]
VS0
Analog to
Digital
Convertor
HV Driver
P0[7]
HV Driver
HVO[0]
P0[6]
P0[5]
P0[4]
P0[3]
P0[2]
P0[1]
Atten1
P1[1]
AMuxBus3
AMuxBus1
IDAC1
P0[0]
Atten0
P1[0]
AMuxBus2
AMuxBus0
IDAC0
Multiple Sleep Modes
COMP1
The CY8C42x23 devices have solid analog performance, low
(100 µV) offsets, reduced temperature sensitivity, and are
capable of measuring 0.75% absolute voltage accuracy.
The Analog System is composed of configurable blocks to
allow creation of complex analog signal flows. Analog peripherals are very flexible and can be customized to support
specific application requirements. Following are some of the
more common PSoC analog functions (most available as user
modules).
Document 38-12034 Rev. *C
COMP0
ODAC1
ACLK
Analog System
ACLK
The CY8C42x23 devices can have some of the system
resources (the SleepTimer/Watchdog Timer, the Voltage
Regulator or the Power Supply Supervisor) powered down in
order to achieve the desired level of sleep current. Sleep
modes with current levels from 750 µA in idle to 0.1 µA in deep
sleep, and wakeup times from instantaneous to 400 µsec are
available. Deeper sleep modes have longer wakeup times and
sleep modes with more resource power typically have shorter
wakeup times.
4.4
DBC00
VS1
Vss
Vref
Vbg
The Digital System is composed of 4 digital PSoC blocks, 2
Enhanced Basic (Type D) and 2 Basic (Type C) to provide
unique power control pulse width modulator (PWM) features.
The power control features include integrated deadband,
latched kill, and synchronous or asynchronous kill. The kill
feature can be combined with a comparator to implement a
fast over-current protection circuit. Each block is an 8-bit
resource that can be used alone or combined with other blocks
to form 8-, 16-, 24-, and 32-bit peripherals, which are called
user module references. A sampling of digital block configurations is listed below.
• PWMs (8 to 32 bit)
• PWMs with Deadband (8 to 16 bit)
• Counters (8 to 32 bit)
• Timers (8 to 32 bit)
Temp
4.2
ODAC0
Figure 4-1. Analog Block Diagram
4.5
High Voltage Interface
Two types of high voltage outputs are available. HVO[0] and
HVO[1] are digital outputs that can each be configured as a
CMOS output connected between HVdd and Vss, or
configured as an open-drain drive that can be externally pulled
up to HVdd or down to Vss.
The second type, Gate Drive Outputs (GDO0 and GDO1), can
each be used to drive the gate of a high-side PFET in a linear
or switched regulator. The GDO0 and GDO1 outputs will drive
between HVdd-5V and HVdd, the signal level required for a
"logic level" PFET. The Gate Drive Outputs can be driven by
an amplifier and used to control a PFET in a linear mode. A
sense voltage can be fed back to the amplifier through an HV
attenuator to implement a constant voltage or constant current
driver. The output of the VDAC can be used to set the target
voltage of the regulator. Alternately, the Gate Drive Outputs
can be connected to the output gated PWM and used to drive
a PFET as a high-side switch in a boost or buck convertor.
Page 3 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
4.6
Analog Multiplexer System
The Analog Mux Bus can connect to every GPIO pin in ports
P0 and P1. Pins can be connected to the bus individually or
in any combination. The bus also connects to the analog system for analysis with comparators and analog-to-digital converters. This bus is split into four sections, AMux Bus 0 and
AMux Bus 2, which connect to the even port pins and AMux
Bus 1 and AMux Bus 3, which connect to the odd port pins.
The four sections can be combined to support dual-channel
single-end processing, single-channel differential processing,
or dual-channel differential processing. They can also be
connected as one bus that can route to all GPIO pins.
Other multiplexer applications include:
• Chip-wide mux that allows analog input from up to 10 GPIO
pins.
• Crosspoint connection between any GPIO pin combinations.
4.7
4.8
Development Tools
• Standard Cypress PSoC IDE tools are available for
debugging the CY8C42x23 family of parts. However, the
additional trace length and a minimal ground plane in the
Flex-Pod can create noise problems that make it difficult to
debug a Power PSoC design. A custom bonded On-Chip
Debug (OCD) device is available in an 32-pin QFN package.
The OCD device is recommended for debugging designs
that have high current and/or high analog accuracy requirements. The QFN package is compact and can be connected
to the ICE through a high density connector.
• In-System Serial Programming (ISSP) is available.
However, ISSP for Power PSoC differs from ISSP for
standard PSoC devices. With Power PSoC devices, the
power pin (HVdd) should not be connected directly to the
Vdd pin of the ISSP connector. Doing so can damage the
programming device.
Additional System Resources
System Resources, some of which have been previously
listed, provide additional capability useful to complete systems
implemented in a single power block. Additional resources
include an I2C master and slave, low voltage detection, and
power on reset. Brief statements describing the merits of each
system resource are presented below.
• Digital clock dividers provide three customizable clock
frequencies for use in applications. The clocks can be
routed to both the digital and analog systems. Additional
clocks can be generated using digital PSoC blocks as clock
dividers.
• The I2C module provides 50-, 100-, and 400-kHz communication over two wires. Slave, master, and multi-master
modes are all supported.
• Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR
(Power On Reset) circuit eliminates the need for a system
supervisor.
• An internal 1.3 voltage reference provides an absolute
reference for the analog system, including ADCs and DACs.
Document 38-12034 Rev. *C
Page 4 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
5.0
Typical Power PSoC Applications
5.1
Boost Converter White LED Driver
A white LED driver is a constant current power supply. By driving the same current through a set of LEDs in series, the intensity
of the LEDs can be closely matched. The CY8C42x23 Power PSoC can be configured as a constant voltage or constant current
boost supply. In this configuration, the HVdd voltage is lower than required to drive the LEDs in series and a higher voltage must
be generated. White LEDs typically have a forward voltage of around 4V, so in the five LED configuration shown in Figure 5-1
the LED drive voltage would have to be around 20V (plus allowance for the voltage losses in the FET and the current sense
resistor, RISENSE).
Figure 5-1 shows an inductor, an NFET, a diode, and a capacitor configured as a boost converter with the CY8C42x23 as the
controller. The voltage on the capacitor is fed back through a voltage sense pin, VS0, and an attenuator, Atten0, to the comparator,
COMP0. The VS0 pin can be connected directly to a voltage higher than HVdd, so no external signal level conversion is needed.
The output of the comparator controls a single PSoC digital block configured as a PWM. The reference for the comparator is the
output of VDAC0. When the attenuator output exceeds the reference, the comparator will stop the PWM using the "Kill" input.
This creates a feedback loop that maintains the VS0 node at a voltage proportional to the VDAC0 setting. The Atten0 output is
also connected to the ADC so the control software can monitor the output voltage.
To maintain constant current, the voltage across the RISENSE resistor is routed through pin P0[4] and AMuxBus0 to the ADC
where it is monitored. The control software adjusts the VDAC0 setting, based on current sense measurements, to achieve the
desired current through the load.
5.1.1
Resources
This application could connect the RISENSE resistor to any of the GPIO pins (P0[7:0] and P1[1:0]). The Power PSoC still has three
digital blocks, half of the high voltage resources, one VDAC, two IDACs, seven of the analog multiplexer channels to the ADC,
and over 90% of the CPU available for other tasks.
HVdd
HVdd
HVdd
Low Drop-Out
Reg ulator
DBC01
ANALOG and HIGH V OLTAGE
SECTIONS
Internal Vdd
ODAC1
VDAC1
GDO1
ODAC0
VDAC0
VDAC0
VBG
VDAC1
IBIAS
Q1
DBC00
GDO0
VS0
VS1
HVO[1]
Analog to
Dig ital
Convertor
HV Driver
P0[7]
HV Driver
HVO[0]
P0[6]
Vbg
Atten1
Vss
P0[2]
P0[1]
Vref
P0[4]
P0[3]
Temp
P0[5]
P0[0]
Atten0
P1[1]
R ISEN SE
P1[0]
IDAC1
AM uxBus3
AMuxBus2
AM uxBus1
AMuxBus0
COMP 1
COMP 0
ODAC1
ODAC0
ACLK
ACLK
Kill
IDAC0
PWM primary
PWM DB
DCB00
DCB01
DBD02
DCD03
DIGITAL SECTION
Figure 5-1. Boost Converter White LED Driver
Document 38-12034 Rev. *C
Page 5 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
5.2
Buck Converter Battery Charger with Current Limit
A battery charger is constant current and constant voltage power supply. At different points in a charging cycle a Lithium Ion
battery requires a constant current or a constant voltage to be applied. The CY8C42x23 Power PSoC can be configured as a
constant voltage or constant current linear supply. In this configuration, the HVdd voltage is high enough to drive one or more
battery in series and a lower voltage must be generated efficiently. Lithium Ion batteries have a fully charged voltage of 4.2V. With
the two-cell configuration in Figure 5-2, HVdd would have to be at least 8.4V (plus allowance for voltage losses in the FET and
the current sense resistor, RISENSE). The HVdd voltage is converted to 5V by the internal Low Drop-Out Regulator for use by the
Power PSoC Core.
Figure 5-2 shows an inductor, two FETs, and a capacitor configured as a buck converter with the CY8C42x23 as the controller.
The voltage on the capacitor is fed back through a voltage sense pin, VS1, and an attenuator, Atten1, to the comparator, COMP1.
The output of the comparator controls a single PSoC digital block configured as a pulse width modulator (PWM). The reference
for the comparator is the output of VDAC1. When the attenuator output exceeds the reference, the comparator will stop the PWM
using the "Kill" input. This creates a feedback loop that maintains the VS1 node at a voltage proportional to the VDAC1 setting.
The Atten1 output is also connected to the ADC so the control software can monitor the output voltage. The accuracy of the ADC
and the control loop are better than 0.75%. Meeting high accuracy is critical to Lithium Ion batteries.
To maintain constant current, the voltage across the RISENSE resistor is routed through pin P1[0] and AMuxBus0 to the ADC
where it is monitored. The control software adjusts the VDAC1 setting, based on current sense measurements, to achieve the
desired current through the load. The current sense voltage is also connected to the positive input of COMP0. The negative input
of COMP0 is controlled by the output of ODAC0. If the current sense voltage exceeds the ODAC0 setting, the output of the
comparator will be latched high. This acts as an over-current detection circuit that can be cleared by the control software. The
output of the comparator, COMP0, can be combined with the output of COMP1 and connected to the Kill input of the PWM. This
configures the Power PSoC so that an over-current condition will shut off the External PFET.
For a lower cost, but lower efficiency, converter, Q2 can be replaced with a diode.
5.2.1
Resources
This application could connect the RISENSE resistor to any of the GPIO pins (P0[7:0] and P1[1:0]). The Power PSoC still has three
digital blocks, half of the high voltage resources, one VDAC, two IDACs, seven of the analog multiplexer channels to the ADC,
and over 90% of the CPU available to implement the battery charging algorithm and other tasks.
HVdd
HVdd
Q1
HVdd
LowDrop-Out
Regulator
DBC01
GDO1
ANALOG and HIGH VOLTAGE
SECTIONS
InternalVdd
ODAC1
VDAC1
VDAC1
VBG
IBIAS
ODAC0
VDAC0
VDAC0
DBC00
GDO0
VS1
VS0
HVO[1]
Analog to
Digital
Convertor
HVDriver
P0[7]
HVDriver
HVO[0]
P0[6]
P0[5]
Q2
P0[4]
P0[3]
Atten1
Vss
Vref
Vbg
Temp
P0[2]
P0[1]
P0[0]
Atten0
P1[1]
RISENSE
P1[0]
IDAC1
AMuxBus3
AMuxBus2
AMuxBus1
AMuxBus0
COMP1
COMP0
ODAC1
ODAC0
ACLK
ACLK
Kill
IDAC0
PWM
PWM
primary secondary
PWM DB
DCB00
DCB01
DBD02
DCD03
DIGITAL SECTION
Figure 5-2. Buck Converter Battery Charger with Current Limit
Document 38-12034 Rev. *C
Page 6 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
5.3
Brushless DC Fan Motor
The CY8C42x23 PSoC can be configured as a one- or two-phase brushless DC motor controller suitable for use in small brushless
fans. In this configuration, the HVdd voltage is high enough to drive a one- or two-phase brushless motor coil, typically 12V. The
HVdd voltage is converted to 5V by the internal Low Drop-Out Regulator for use by the Power PSoC Core. Additionally, several
milliamperes of 5V from the internal regulator is made available to bias a hall sensor and thermistor. The high side PFETs of the
H-bridge are driven by the GDO0 and GDO1 pins controlled by the processor. The low side NFETs of the H-bridge are driven by
the HVO[0] and HVO[1] pins controlled by a combination of the processor and the pulse width modulator (PWM) for speed control.
A differential comparator is used to determine rotor position from either an analog or digital hall sensor to facilitate rotor commutation. A second comparator and 8-bit DAC, VDAC0, are available to provide an optional hardware current limit. The 10-bit ADC
is available to measure optional parameters such as ambient temperature or motor coil current. The M8C processor handles coil
commutation, user customizable speed, and control algorithms as well as an optional communications interface. The PSoC digital
resources provide an 8-bit PWM output to drive the motor coil as well as two timer configurations. Using dynamic reconfiguration,
two digital blocks are used to create a 16-bit timer to measure the tachometer period while the same two blocks are also used to
create two 8-bit timers to measure the input PWM duty cycle.
5.3.1
Resources
This application leaves 3 GPIO pins, 1 digital block, I2C and ample memory unused for further application customization.
HVdd
1 or 2 Phase
Brushless Motor
(1 Phase
Depicted)
RISENSE
HVdd
Optional
HVdd
LowDrop-Out
Regulator
InternalVdd
ODAC1
VDAC1
VDAC1
DBC01
GDO1
ANALOG and HIGH VOLTAGE
SECTIONS
VBG
IBIAS
VDAC0
ODAC0
VDAC0
DBC00
GDO0
VS1,HVO[1]
VS0, HVO[0]
P0[7]
HVDriver
AVdd
Analog to
Digital
Convertor
HVDriver
P0[6]
P0[4]
P0[5]
P0[2]
P0[1]
`
ATTEN1
P1[1]
Tach Out
IDAC1
TEMP
Vss
Vref
Vbg
P0[3]
ATTEN0
AMuxBus3
AMuxBus2
AMuxBus1
AMuxBus0
P0[0]
5V Out
P1[0]
InputPWM
IDAC0
5V
COMP1
5V
COMP0
ODAC0
ACLK
ACLK
Analog
Hall
Sensor
ODAC1
T
DIGITAL SECTION
Kill
PWM Out
PWM DB
Capture
Optional
16-bit Timer (Tachometer)
2x8-bit Timer (Input PWM)
Figure 5-3. Brushless DC Fan Motor
Document 38-12034 Rev. *C
Page 7 of 42
PRELIMINARY
6.0
CY8C42123/CY8C42223
CY8C42323/CY8C42423
Pin Assignment
This section lists, describes, and illustrates all Power PSoC device pins and pinout configurations. For up-to-date ordering, pinout,
and packaging information, refer to the individual PSoC device’s data sheet or go to http://www.cypress.com/psoc.
6.1
Pinouts
The PSoC devices are available in a variety of packages. Refer to the following information for details on individual devices. Every
port pin (labeled with a “P”) in the following tables and illustrations is capable of digital IO.
6.1.1
8-Pin SOIC Part Pinouts
The 8-pin SOIC part is for the CY8C42123 PSoC device.
Pin
No.
Digital
Analog
8-Pin Part Pinout (SOIC)
Name
1
HVO
HVO
GD1
2
IO
I
P0[1]
3
IO
I
P1[1]
I
P1[0]
4
5
Power
IO
CY8C42123 PSoC Device
Vss
Description
High Side Gate Driver 1
I2C Clock*
Ground Connection
IO
I
P0[0]
7
HVO
HVI
VS0
High Voltage Sense 0, High Voltage Output 0
HVdd
Supply Voltage
Power
1
8
2 SOIC 7
3
6
4
5
HV dd
HVO[0],VS0
P0[0]
P1[0] I2C*
I2C Data*
6
8
GD1
P0[1]
I2C* P1[1]
Vss
LEGEND I = Input 5V Only, O = Output 5V Only, HV = High Voltage.
* These are the ISSP pins, which are not HighZ at POR (Power On Reset). See the Power PSoC Mixed-Signal Array Technical Reference Manual for details.
Document 38-12034 Rev. *C
Page 8 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
6.1.2
16-Pin SOIC Part Pinouts
The 16-pin SOIC part is for the CY8C42223 PSoC device.
1
HVO
2
Analog
Pin
No.
Digital
16-Pin Part Pinout (SOIC)
Name
HVO
GD1
High Side Gate Driver 1
VS1
High Voltage Sense 1
HVI
CY8C42223 PSoC Device
Description
3
HVO
4
IO
I
P0[7]
I2C Clock
5
IO
I
P0[5]
I2C Data
6
IO
I
P0[3]
7
IO
I
P1[1]
8
HVO[1] High Voltage Output 1
Power
Vss
I
P1[0]
I2C Data*
10
IO
I
P0[2]
Optional External CLK Input (EXTCLK)
IO
I
P0[4]
IO
I
P0[6]
13
HVO
14
15
16
HVO
SOIC
16
15
14
13
12
11
10
9
HVdd
GD0
VS0
HVO[0]
P0[6], EXTREF
P0[4]
P0[2], EXTCLK
P1[0] I2C*
Ground Connection
IO
11
1
2
3
4
5
6
7
8
I2C Clock*
9
12
GD1
VS1
HVO[1]
SCL, P0[7]
SDA, P0[5]
P0[3]
I2C* P1[1]
Vss
Optional External Voltage Reference
(EXTREF)
HVO[0] High Voltage Output 0
HVI
VS0
HVO
GD0
High Side Gate Driver 0
HVdd
Supply Voltage
Power
High Voltage Sense 0
LEGEND I = Input 5V Only, O = Output 5V Only, HV = High Voltage.
* These are the ISSP pins, which are not HighZ at POR (Power On Reset). See the Power PSoC Mixed-Signal Array Technical Reference Manual for details.
Document 38-12034 Rev. *C
Page 9 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
6.1.3
16-Pin TSSOP Part Pinouts
The 16-pin TSSOP part is for the CY8C42323 PSoC device.
Pin
No.
Digital
Analog
16-Pin Part Pinout (TSSOP)
Name
1
HVO
HVO
GD1
High Side Gate Driver 1
2
HVO
HVI
VS1
High Voltage Sense 1, High Voltage Output 1
3
IO
I
P0[7]
I2C Clock
4
IO
I
P0[5]
I2C Data
5
IO
I
P0[3]
6
IO
I
P0[1]
7
IO
I
P1[1]
8
Power
CY8C42323 PSoC Device
Vss
9
IO
I
P1[0]
10
IO
I
P0[0]
Description
16
15
14
TSSOP 13
12
11
10
9
HVdd
GD0
VS0, HVO[0]
P0[6], EXTREF
P0[4]
P0[2], EXTCLK
P0[0]
P1[0] I2C*
I2C Clock*
I2C Data*
11
IO
I
P0[2]
IO
I
P0[4]
13
IO
I
P0[6]
Optional External Voltage Reference
(EXTREF)
14
HVO
HVI
VS0
High Voltage Sense 0, High Voltage Output 0
15
HVO
HVO
Power
1
2
3
4
5
6
7
8
Ground Connection
12
16
GD1
HVO[1], VS1
SCL, P0[7]
SDA, P0[5]
P0[3]
P0[1]
I2C* P1[1]
Vss
Optional External CLK Input (EXTCLK)
GD0
High Side Gate Driver 0
HVdd
Supply Voltage
LEGEND I = Input 5V Only, O = Output 5V Only, HV = High Voltage.
* These are the ISSP pins, which are not HighZ at POR (Power On Reset). See the Power PSoC Mixed-Signal Array Technical Reference Manual for details.
Document 38-12034 Rev. *C
Page 10 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
6.1.4
32-Pin QFN Part Pinouts
The 32-pin QFN part is for the CY8C42423 PSoC device.
NC
No Connection
4
NC
No Connection
5
IO
I
P0[7]
I2C Clock
6
IO
I
P0[5]
I2C Data
7
IO
I
P0[3]
8
IO
I
P0[1]
9
NC
No Connection
10
NC
No Connection
IO
12
13
I
Power
IO
P1[1]
I2C Clock*
Vss
I
P1[0]
I2C Data*
14
NC
No Connection
15
NC
No Connection
16
NC
No Connection
17
IO
I
P0[0]
18
IO
I
P0[2]
19
IO
I
P0[4]
20
IO
I
P0[6]
21
I
No Connection
NC
No Connection
HVO
DNU
26
30
Do Not Use
HVI
VS0
High Voltage Sense 0
HVO
GD0
High Side Gate Driver 0
Power
HVdd
Supply Voltage
Power
HVO
HVO
HVdd
Supply Voltage
HVO
GD1
High Side Gate Driver 1
HVI
VS1
High Voltage Sense 1
NC
No Connection
Vss
Center Pad Must be Connected to Ground
31
32
CP
HV O[0]
NC
NC
XRES
P0[6]
P0[4]
P0[2]
P0[0]
HVO[0] High Voltage Output 0
25
29
QFN
(Top View )
(CP)
24
23
22
21
20
19
18
17
XRES External Reset
NC
28
1
2
3
4
5
6
7
8
Optional External Voltage Reference
(EXTREF)
23
27
NC
HV O[1]
NC
NC
P0[7]
P0[5]
P0[3]
P0[1]
Optional External CLK Input (EXTCLK)
22
24
VS0
DNU
HVO[1] High Voltage Output 1
3
11
26
25
No Connection
9
10
11
12
13
14
15
16
HVO
Description
GD1
HVdd
HVdd
GD0
NC
NC
NC
I2C*, P1[1]
Vss
I2C*, P1[0]
NC
NC
NC
2
Name
NC
VS1
1
CY8C42423 PSoC Device
32
31
30
29
28
27
Digital
Pin
No.
Analog
32-Pin Part Pinout (QFN**)
Power
LEGEND I = Input 5V Only, O = Output 5V Only, HV = High Voltage, NC = No Connection.
* These are the ISSP pins, which are not HighZ at POR (Power On Reset). See the Power PSoC Mixed-Signal Array Technical Reference Manual for details.
**The QFN package has a center pad (CP) that must be connected to ground (Vss).
Important Note For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
Document 38-12034 Rev. *C
Page 11 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
The 32-pin QFN part is for the CY8C42000 On-Chip Debug (OCD) PSoC device.
Note This part is only used for in-circuit debugging. It is NOT available for production.
HVO[1] High Voltage Output 1
OCD
HCLK On-Chip Debug Clock
4
OCD
CCLK On-Chip Debug Clock
5
IO
I
P0[7]
I2C Clock
6
IO
I
P0[5]
I2C Data
7
IO
I
P0[3]
8
IO
I
P0[1]
9
NC
No Connection
10
NC
No Connection
11
IO
12
13
I
Power
IO
P1[1]
I2C Clock*
Vss
I
P1[0]
I2C Data*
14
NC
No Connection
15
NC
No Connection
16
NC
No Connection
17
IO
I
P0[0]
18
IO
I
P0[2]
19
IO
I
P0[4]
20
IO
I
P0[6]
21
I
No Connection
NC
No Connection
HVO
HV O[0]
OCDE
OCDO
XRES
P0[6]
P0[4]
P0[2]
P0[0]
Not for Production
HVO[0] High Voltage Output 0
25
DNU
26
HVO
Do Not Use
HVI
VS0
High Voltage Sense 0
HVO
GD0
High Side Gate Driver 0
28
Power
HVdd
Supply Voltage
29
Power
HVdd
Supply Voltage
HVO
GD1
High Side Gate Driver 1
HVI
VS1
High Voltage Sense 1
NC
No Connection
Vss
Center Pad Must be Connected to Ground
HVO
31
32
CP
QFN
(Top View )
(CP)
24
23
22
21
20
19
18
17
XRES External Reset
NC
30
1
2
3
4
5
6
7
8
Optional External Voltage Reference
(EXTREF)
23
27
NC
HV O[1]
HCLK
CCLK
P0[7]
P0[5]
P0[3]
P0[1]
Optional External CLK Input (EXTCLK)
22
24
VS0
DNU
HVO
3
26
25
No Connection
2
GD1
HVdd
HVdd
GD0
Description
NC
VS1
NC
32
31
30
29
28
27
Name
9
10
11
12
13
14
15
16
1
CY8C42000 OCD PSoC Device
NC
NC
I2C*, P1[1]
Vss
I2C*, P1[0]
NC
NC
NC
Digital
Pin
No.
Analog
32-Pin OCD Part Pinout (QFN**)
Power
LEGEND I = Input 5V Only, O = Output 5V Only, HV = High Voltage, NC = No Connection, OCD = On-Chip Debug.
* These are the ISSP pins, which are not HighZ at POR (Power On Reset). See the Power PSoC Mixed-Signal Array Technical Reference Manual for details.
**The QFN package has a center pad (CP) that must be connected to ground (Vss).
Document 38-12034 Rev. *C
Page 12 of 42
PRELIMINARY
7.0
CY8C42123/CY8C42223
CY8C42323/CY8C42423
Registers
This section discusses the registers of the Power PSoC device. It lists all the registers in mapping tables, in address order.
7.1
Register Conventions
The register conventions specific to this section are listed in the following table.
Convention
Description
R
Read register or bit(s)
W
Write register or bit(s)
L
Logical register or bit(s)
C
Clearable register or bit(s)
#
Access is bit specific
Document 38-12034 Rev. *C
Page 13 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
7.2
Register Map Bank 0 Table: User Space
Name
Addr
(0,Hex)
Access
Addr
(0,Hex)
Name
Access
Addr
(0,Hex)
Name
Access
Addr
(0,Hex)
Name
Access
PRT0DR
00
RW
40
80
C0
PRT0IE
01
RW
41
81
C1
PRT0GS
02
RW
42
82
C2
PRT0DM2
03
RW
43
83
PRT1DR
04
RW
44
ASC00CR0
84
RW
C4
PRT1IE
05
RW
45
ASC00CR1
85
RW
C5
PRT1GS
06
RW
46
ASC00CR2
86
RW
PRT1DM2
07
RW
47
ASC00CR3
87
RW
IDAC_D
C7
RW
HVP2_DR
08
RW
48
ASC01CR0
88
RW
P0_MUX
C8
RW
09
49
ASC01CR1
89
RW
P1_MUX
C9
RW
0A
4A
ASC01CR2
8A
RW
CA
0B
4B
ASC01CR3
8B
RW
CB
0C
4C
8C
CC
0D
4D
8D
CD
0E
4E
8E
CE
0F
4F
8F
CF
10
50
90
D0
11
51
91
D1
12
52
92
D2
13
53
93
D3
14
54
94
D4
15
55
95
16
56
96
I2C_CFG
D6
RW
17
57
97
I2C_SCR
D7
#
18
58
98
I2C_DR
D8
RW
19
59
99
I2C_MSCR
D9
#
1A
5A
9A
INT_CLR0
DA
RW
1B
5B
9B
INT_CLR1
DB
RW
1C
5C
9C
INT_CLR2
DC
RW
1D
5D
9D
INT_CLR3
DD
RW
1E
5E
9E
INT_MSK3
DE
RW
1F
5F
9F
INT_MSK2
DF
RW
C3
C6
D5
DBC00DR0
20
R
AC0_MUX
60
RW
PWR0_CR
A0
RW
INT_MSK0
E0
RW
DBC00DR1
21
W
AC0_CR0
61
RW
PWR1_CR
A1
RW
INT_MSK1
E1
RW
DBC00DR2
22
RW
AC0_CR1
62
RW
A2
INT_VC
E2
RC
DBC00CR0
23
RW
AC0_CR2
63
RW
A3
RES_WDT
E3
W
DBC01DR0
24
R
AC0_MSP
64
RW
DBC01DR1
25
W
AC0_LSP
65
RW
A5
DBC01DR2
26
RW
AC0_MSR
66
RW
A6
DBC01CR0
27
RW
AC0_LSR
67
RW
VDAC_CR
A7
RW
E7
DBD02DR0
28
R
AC0_CC
68
#
VDAC_DR0
A8
RW
E8
DBD02DR1
29
W
69
VDAC_DR1
A9
RW
E9
DBD02DR2
2A
RW
6A
AA
EA
DBD02CR0
2B
RW
6B
AB
EB
DBD03DR0
2C
R
TMP_DR0
6C
RW
AC
EC
DBD03DR1
2D
W
TMP_DR1
6D
RW
AD
ED
DBD03DR2
2E
RW
TMP_DR2
6E
RW
AE
EE
DBD03CR0
2F
RW
TMP_DR3
6F
RW
AF
30
CMP_SYN
70
RW
RDI0RI
B0
31
CMP_LFN0
71
RW
RDI0SYN
B1
RW
F1
RDI0IS
B2
RW
F2
32
72
AA_REF
A4
RW
E4
E5
E6
EF
RW
F0
33
CMP_LMD
73
RW
RDI0LT0
B3
RW
F3
34
CMP_CDS
74
RW
RDI0LT1
B4
RW
F4
35
CMP_CIS
75
RW
RDI0RO0
B5
RW
F5
36
CMP_RDC
76
RW
RDI0RO1
B6
RW
F6
37
CMP_GOEN0
77
RW
RDI0GF
B7
RW
38
78
CPU_F
F7
B8
F8
39
CMP_CLK
79
RW
B9
F9
3A
CMP_CR
7A
RW
BA
FA
3B
CMP_SRC
7B
RW
BB
FB
3C
CMP_MUX0
7C
RW
BC
3D
CMP_MUX1
7D
RW
BD
CPU_SCR2
RL
FC
FD
RSW
3E
7E
BE
CPU_SCR1
FE
#
3F
7F
BF
CPU_SCR0
FF
#
Blank fields are Reserved and should not be accessed.
Document 38-12034 Rev. *C
Page 14 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
7.3
Register Map Bank 1 Table: Configuration Space
Name
Addr
(1,Hex)
Access
Name
Addr
(1,Hex)
Access
Addr
(1,Hex)
Name
Access
Name
Addr
(1,Hex)
Access
PRT0DM0
00
RW
40
80
C0
PRT0DM1
01
RW
41
81
C1
PRT0IC0
02
RW
42
82
C2
PRT0IC1
03
RW
43
83
C3
PRT1DM0
04
RW
44
84
C4
PRT1DM1
05
RW
45
85
C5
PRT1IC0
06
RW
46
86
PRT1IC1
07
RW
47
87
HVP2_DM0
08
RW
48
88
HVP2_DM1
09
RW
49
89
C9
HVP2_DS0
0A
RW
4A
8A
CA
0B
4B
8B
CB
0C
4C
8C
CC
0D
4D
8D
CD
0E
4E
8E
CE
0F
4F
8F
10
50
90
GDI_O_IN
D0
11
51
91
GDI_E_IN
D1
RW
12
52
92
GDI_O_OU
D2
RW
13
53
93
GDI_E_OU
D3
RW
14
54
94
AC0_GOEN
D4
RW
15
55
95
D5
16
56
96
D6
17
57
97
18
58
98
19
59
99
D9
1A
5A
9A
DA
1B
5B
9B
DB
1C
5C
9C
DC
1D
5D
9D
OSC_GO_EN
DD
RW
1E
5E
9E
OSC_CR4
DE
RW
1F
5F
C6
IDAC_CR
C7
RW
C8
CF
RW
D7
AC0_CLK
RW
OSC_CR3
DF
RW
DBC00FN
20
RW
60
SLP_CR0
A0
RW
OSC_CR0
E0
RW
DBC00IN
21
RW
61
SLP_CR1
A1
RW
OSC_CR1
E1
RW
DBC00OU
22
RW
62
SLP_CR2
A2
RW
OSC_CR2
E2
RW
VLT_CR
E3
RW
VLT_CMP
E4
R
23
9F
D8
63
A3
DBC01FN
24
RW
64
DBC01IN
25
RW
65
A5
E5
DBC01OU
26
RW
66
A6
E6
67
A7
27
BUS_TOP
A4
RW
E7
DBD02FN
28
RW
68
VDAC_TR
A8
RW
IMO_TR
E8
DBD02IN
29
RW
69
VDAC_ITRIP0
A9
RW
LSO_TR
E9
RW
DBD02OU
2A
RW
6A
BDG_TR
EA
RW
2B
AA
6B
AB
DBD03FN
2C
RW
TMP_DR0
6C
RW
DBD03IN
2D
RW
TMP_DR1
6D
RW
AD
DBD03OU
2E
RW
TMP_DR2
6E
RW
AE
TMP_DR3
6F
RW
2F
RDIV0
AC
W
EB
RW
EC
AA_TR
ED
RW
EE
AF
EF
30
70
RDI0RI
B0
RW
F0
31
71
RDI0SYN
B1
RW
F1
32
72
RDI0IS
B2
RW
F2
33
73
RDI0LT0
B3
RW
F3
34
74
RDI0LT1
B4
RW
F4
35
75
RDI0RO0
B5
RW
F5
36
76
RDI0RO1
B6
RW
F6
37
77
RDI0GF
B7
RW
38
78
B8
F8
39
79
B9
F9
3A
7A
BA
FA
3B
7B
BB
FB
3C
7C
BC
3D
7D
BD
CPU_SCR2
FD
RSW
3E
7E
BE
CPU_SCR1
FE
#
3F
7F
BF
CPU_SCR0
FF
#
CPU_F
F7
RL
FC
Blank fields are Reserved and should not be accessed.
Document 38-12034 Rev. *C
Page 15 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
8.0
Electrical Specifications
Specifications are valid for -40oC ≤ TA ≤ 85oC and TJ ≤ 100oC, except where noted.
8.1
Frequencies
36
SLIMO Mode = 0
Refer to Table 8.4 for the electrical specifications on the internal main oscillator (IMO) using slow IMO (SLIMO) mode, which can
be set using the CPU_SCR1 register.
36
~
~
~
~
HVdd Voltage
HVdd Voltage
l i d ng
Va a t i n
r
pe io
O Re g
4.75
~
~
3.00
3.00
2.40
2.40
3 MHz
12 MHz
24 MHz
SLIMO ~
Mode=0~
SLIMO
Mode=1
SLIMO
Mode=1
SLIMO
Mode=0
4.75
3.60
93 kHz
SLIMO
Mode=1
93 kHz
12 MHz
6 MHz
24 MHz
CPU Fre que ncy
IM O Fre que ncy
Figure 8-1a. Supply Voltage versus CPU Frequency
Figure 8-1b. IMO Frequency Trim Options
8.2
Absolute Maximum Ratingsa
Parameter
Description
TSTG
Storage Temperature
TA
HVdd
VGPIO
VGPIO36
VGD
VVS
VHVO
IMIO
IMIOHV
Conditions
Higher storage temperatures will
reduce data retention time.
Ambient Temperature with
Power Applied
Supply Voltage on HVdd Relative
to Vss
DC Input to any Low Voltage
HVdd ≤ 5.0V.
Input Pin
DC Input to any Low Voltage
HVdd > 5.0V.
Input Pin
DC Input to any Gate Drive Pin
DC Input to High Voltage Sense
Pin
DC Applied to High Voltage
Outputs in High-Z State
Maximum Current into any Low
Voltage Port Pin
Maximum Current into any High
Voltage Port Pin
Document 38-12034 Rev. *C
Min.
-50
Typ.
–
Max.
+100
Units
oC
-40
–
+85
oC
-0.5
–
+40
V
-0.5
–
V
-0.5
–
HVdd +
0.5
5.5
HVdd 5.5
-0.5
–
V
-0.5
–
-25
–
HVdd +
0.5
HVdd +
0.5
HVdd +
0.5
+50
mA
-50
–
+50
mA
–
V
Page 16 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
Absolute Maximum Ratingsa (continued)
8.2
IMIOGDb
ESD
ESDHV
LU
Maximum Current into any Gate
Drive Pin
Electro Static Discharge Voltage Human Body Model ESD.
Electro Static Discharge to High Human Body Model ESD.
Voltage Port Pin
Latch-up Current
-10
–
10
mA
2000
2000
–
–
–
–
V
V
–
–
200
mA
Max.
+85
+100
Units
oC
oC
a. Operation at these conditions degrades reliability.
b. Cannot result in pin voltage exceeding VGD limits or thermal specifications being exceeded.
8.3
Operating Temperature
Parameter
Description
TA
Ambient Temperature
TJ
Junction Temperature
Conditions
The temperature rise from ambient
to junction is package specific. See
Table 9.1, “Thermal Impedances per
Package,” on page 38. The system
designer must limit the power
consumption to comply with this
requirement.
Min.
-40
-40
Typ.
–
–
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.4
DC Chip-Level Specifications
Parameter
Description
HVdd
Supply Voltage
IDD
Supply Current, IMO = 24 MHz
IDD36
Supply Current, IMO = 24 MHz
IDD3
Supply Current, IMO = 6 MHz
Document 38-12034 Rev. *C
Conditions
See Table 8.18, “DC POR and LVD
Specifications,” on page 25.
Conditions are HVdd = 5.0V, TA = 25
oC, CPU = 3 MHz, SYSCLK doubler
disabled, VC1 = 1.5 MHz, VC2 =
93.75 kHz, VC3 = 93.75 kHz, analog
power = off. SLIMO mode = 0. IMO
= 24 MHz.
Conditions are HVdd = 36V, TA = 25
oC, CPU = 3 MHz, SYSCLK doubler
disabled, VC1 = 1.5 MHz, VC2 =
93.75 kHz, VC3 = 93.75 kHz, analog
power = off. SLIMO mode = 0. IMO
= 24 MHz.
Conditions are HVdd = 3.3V, TA = 25
oC, CPU = 3 MHz, SYSCLK doubler
disabled, VC1 = 1.5 MHz, VC2 =
93.75 kHz, VC3 = 93.75 kHz, analog
power = off. SLIMO mode = 0. IMO
= 24 MHz.
Min.
2.5
Typ.
–
Max.
36
Units
V
–
3
4
mA
–
3
4
mA
–
1.2
2
mA
Page 17 of 42
PRELIMINARY
8.4
CY8C42123/CY8C42223
CY8C42323/CY8C42423
DC Chip-Level Specifications (continued)
IDD27
Supply Current, IMO = 6 MHz
IRESET
Supply Current in Reset
ISBI
Supply Current in Idle Mode
ISB
Supervised Sleep Current
(POR, LVD, SleepTimer, WDT,
and Voltage Regulation)
Regulated Sleep Current
(No POR, No LVD, but with
SleepTimer, WDT, and Voltage
Regulation)
Watchdog Sleep Current
(No POR, No LVD, No SleepTimer, No Voltage Regulation
but with WDT)
Deep Sleep Current
(No POR, No LVD, No SleepTimer, No Voltage Regulation
and No WDT
Deep Sleep Current at HV
(No POR, No LVD, No SleepTimer, No Voltage Regulation
and No WDT
Reference Voltage (Bandgap)
Reference Voltage (Bandgap)
ISBR
ISBW
ISBD
ISBDHV
VREF
VREF27
Document 38-12034 Rev. *C
Conditions are HVdd = 2.7V, TA = 25
oC, CPU = 0.75 MHz, SYSCLK
doubler disabled, VC1 = 0.375 MHz,
VC2 = 23.44 kHz, VC3 = 0.09 kHz,
analog power = off. SLIMO mode =
1. IMO = 6 MHz.
Conditions are HVdd = 5.0V, -40 oC ≤
TA ≤ 85 oC.
Conditions are with internal slow
speed oscillator, HVdd = 3.3V, -40 oC
≤ TA ≤ 85 oC, analog power = off.
Conditions are with internal slow
speed oscillator, HVdd = 3.3V, -40 oC
≤ TA ≤ 85 oC, analog power = off.
Conditions are with internal slow
speed oscillator, HVdd = 3.3V, -40 oC
≤ TA ≤ 85 oC, analog power = off.
–
1.1
1.5
mA
–
–
250
µA
–
–
750
µA
–
2.8
3
µA
–
–
1
µA
Conditions are with internal slow
speed oscillator, HVdd = 3.3V, TA =
25 oC, analog power = off.
–
0.5
–
µA
Conditions are bypass mode on,
deep sleep enabled, HVdd = 3.3V, TA
= 25 oC, analog power = off.
–
0.1
–
µA
Conditions are analog power off,
deep sleep enabled, HVdd = 6V, TA =
25 oC.
–
((HVdd - 6)
/ 2) + 0.1
–
µA
1.291
1.16
1.30
1.30
1.309
1.33
V
V
Trimmed for HVdd > 3.0V.
Trimmed for HVdd = 2.5V to 3.0V.
Page 18 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.5
4.75V to 36V DC GPIO Specifications
Parameter
Description
RPU
Pull-up Resistor
RPD
Pull-down Resistor
VOHa
High Output Level
Conditions
IOH = 10 mA, HVdd = 4.75V to 36V
maximum 40 mA on even port pins
(for example, P0[2], P1[0]),
maximum 40 mA on odd port pins
(for example, P0[3], P1[1]).
IOL = 25 mA, HVdd = 4.75V to 36V
maximum 90 mA on even port pins
(for example, P0[2], P1[0]),
maximum 90 mA on odd port pins
(for example, P0[3], P1[1]).
4.5V ≤ VOH ≤ 5.5V,
HVdd = 4.75V to 36V.
HVdd = 4.75V to 36V.
HVdd = 4.75V to 36V.
VOLa
Low Output Level
IOHb
Current Supplied while
Maintaining 10% Regulation
Input Low Level
Input High Level
Input Hysteresis
Input Leakage (Absolute Value) Gross tested to 1 µA.
Capacitive Load on Pins as Input Package and pin dependent. Temp =
25oC.
Capacitive Load on Pins as
Package and pin dependent. Temp =
Output
25oC.
VIL
VIH
VH
IIL
CIN
COUT
Min.
4
4
3.6
Typ.
5.6
5.6
–
Max.
8
8
5.4
Units
kΩ
kΩ
V
–
–
0.75
V
5.5
–
–
mA
–
2.1
–
–
–
–
–
60
1
3.5
0.8
–
–
–
10
V
V
mV
nA
pF
–
3.5
10
pF
a. IOH and IOL are also limited by the die temperature. See “Thermal Considerations” on page 37.
b. Odd and even port pins are regulated separately, therefore the current limit total applies separately to all odd port
pins and to all even port pins.
8.6
3.0V to 5.0V DC GPIO Specifications
Parameter
Description
RPU
Pull-up Resistor
RPD
Pull-down Resistor
VOHa
High Output Level
VOLa
Low Output Level
VIL
VIH
Input Low Level
Input High Level
Document 38-12034 Rev. *C
Conditions
IOH = 8 mA, HVdd = 3.0V to 3.6V
maximum 30 mA on even port pins
(for example, P0[2], P1[0]),
maximum 30 mA on odd port pins
(for example, P0[3], P1[1]).
IOL = 16 mA, HVdd = 3.0V to 3.6V
maximum 60 mA on even port pins
(for example, P0[2], P1[0]),
maximum 60 mA on odd port pins
(for example, P0[3], P1[1]).
HVdd = 3.0V to 3.6V.
HVdd = 3.0V to 3.6V.
Min.
4
4
HVdd 1.0
Typ.
5.6
5.6
–
Max.
8
8
HVdd
Units
kΩ
kΩ
V
–
–
0.75
V
–
2.1
–
–
0.8
–
V
V
Page 19 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
8.6
3.0V to 5.0V DC GPIO Specifications (continued)
VH
IIL
CIN
COUT
Input Hysteresis
Input Leakage (Absolute Value) Gross tested to 1 µA.
Capacitive Load on Pins as Input Package and pin dependent. Temp =
25oC.
Capacitive Load on Pins as
Package and pin dependent. Temp =
Output
25oC.
–
–
–
60
1
3.5
–
–
10
mV
nA
pF
–
3.5
10
pF
a. IOH and IOL are also limited by the die temperature. See “Thermal Considerations” on page 37.
8.7
2.5V to 3.0V DC GPIO Specifications
Parameter
Description
RPU
Pull-up Resistor
RPD
Pull-down Resistor
a
VOH
High Output Level
Conditions
IOH = 2 mA, HVdd = 2.5V to 3.0V
maximum 16 mA on even port pins
(for example, P0[2], P1[0]),
maximum 16 mA on odd port pins
(for example, P0[3], P1[1]).
IOL = 8 mA, HVdd = 2.5V to 3.0V
maximum 40 mA on even port pins
(for example, P0[2], P1[0]),
maximum 40 mA on odd port pins
(for example, P0[3], P1[1]).
HVdd = 2.5V to 3.0V.
HVdd = 2.5V to 3.0V.
VOLa
Low Output Level
VIL
VIH
VH
IIL
CIN
Input Low Level
Input High Level
Input Hysteresis
Input Leakage (Absolute Value) Gross tested to 1 µA.
Capacitive Load on Pins as Input Package and pin dependent. Temp =
25oC.
Capacitive Load on Pins as
Package and pin dependent. Temp =
Output
25oC.
COUT
Min.
4
4
HVdd 1.0
Typ.
5.6
5.6
–
Max.
8
8
HVdd
Units
kΩ
kΩ
V
–
–
0.75
V
–
2.0
–
–
–
–
–
60
1
3.5
0.8
–
–
–
10
V
V
mV
nA
pF
–
3.5
10
pF
a. IOH and IOL are also limited by the die temperature. See “Thermal Considerations” on page 37.
Document 38-12034 Rev. *C
Page 20 of 42
PRELIMINARY
CY8C42123/CY8C42223
CY8C42323/CY8C42423
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.8
4.75V to 36V DC High Voltage Output Specifications
Parameter
Description
High Output Level
VOHHVa
Conditions
IOH = 50 mA, HVdd = 4.75V to 36V.
VOLHVa
IIL
COUT
IOL = 50 mA, HVdd = 4.75V to 36V.
Gross tested to 1 µA.
Package and pin dependent. Temp =
25oC.
Low Output Level
Input Leakage (Absolute Value)
Capacitive Load on Pins as
Output
Min.
HVdd 2.0
–
–
–
Typ.
–
Max.
–
Units
V
–
1
–
2.0
–
100
V
nA
pF
Typ.
–
Max.
–
Units
V
–
1
–
0.75
–
100
V
nA
pF
a. IOH and IOL are also limited by the die temperature. See “Thermal Considerations” on page 37.
8.9
2.5V to 5V DC High Voltage Output Specifications
Parameter
Description
VOHHVa
High Output Level
Conditions
IOH = 10 mA, HVdd = 2.5V to 5V.
VOLHVa
IIL
COUT
IOL = 10 mA, HVdd = 2.5V to 5V.
Gross tested to 1 µA.
Package and pin dependent. Temp =
25oC.
Low Output Level
Input Leakage (Absolute Value)
Capacitive Load on Pins as
Output
Min.
HVdd 0.7
–
–
–
a. IOH and IOL are also limited by the die temperature. See “Thermal Considerations” on page 37.
Document 38-12034 Rev. *C
Page 21 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.10 DC Comparator Specifications
Parameter
Description
VOSSYN
Input Offset Voltage in
Synchronous Mode (Absolute
Value)
VOS
Input Offset Voltage in NonSynchronous Mode (Absolute
Value)
ICOMPSYN
Current Consumption in
Synchronous Mode
Current Consumption of
ICOMP
Comparator
ICOMPLP
Current Consumption in Low
Power Mode
VIN27
Input Voltage Range
VIN36
Input Voltage Range
VINLP27
Input Voltage Range in Low
Power Mode
VINLP36
Input Voltage Range in Low
Power Mode
Conditions
Min.
–
Typ.
–
Max.
100
Units
µV
–
2.5
15
mV
–
100
200
µA
HVdd = 2.5V to 36V.
–
10
30
µA
HVdd = 2.5V to 36V.
–
3
10
µA
HVdd = 2.5V to 5V.
HVdd = 5V to 36V.
HVdd = 2.5V to 5V.
0
0
0
–
–
–
HVdd
5.0
HVdd -1.1
V
V
V
HVdd = 5V to 36V.
0
–
3.9
V
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.11
DC Analog-to-Digital Converter Specifications
Parameter
VOS
VIN
HVIN
RIN
INL
DNL
Description
Conditions
Input Offset Voltage
Input Voltage Range
Voltage on Analog Mux Bus.
High Voltage Sense Input Range Voltage on Analog Mux Bus.
Input Impedance
Resolution
INL Error
DNL Error
Absolute System Errora
Factory trimmed at ADC gains of 1/4,
1, 4, 16.
Min.
–
0
0
–
6
–
–
–
Typ.
–
–
–
100K
–
–
–
–
Max.
100
3
HVdd
–
12
1
1/2
0.75%
Units
µV
V
V
Ω
bits
LSb
LSb
a. Maximum error is 11% for HVdd = 2.5V to 3.0V; consistent with VREF27 specifications.
Document 38-12034 Rev. *C
Page 22 of 42
PRELIMINARY
CY8C42123/CY8C42223
CY8C42323/CY8C42423
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.12 DC Linear Control Specifications
Parameter
VOS
RATIO1
RATIO2
RATIO3
RATTEN
VDAC
VOC1
VOC2
VOC3
VOC4
Description
Conditions
Comparator Input Offset Voltage
Attenuation Resistor Ratioa
Attenuation Resistor Ratioa
Attenuation Resistor Ratioa
Attenuator Resistance
Control Loop Reference
Full range is 0V to VREF.
Resolution
Loop Control Reference Settinga
Pre-Programmed Over-Current
Set Point
Pre-Programmed Over-Current
Set Point
Pre-Programmed Over-Current With VDAC_CR Mode = 1.
Set Point
Pre-Programmed Over-Current With VDAC_CR Mode = 1.
Set Point
Min.
–
–
–
–
–
–
Typ.
–
4
8
16
400K
8
Max.
100
–
–
–
–
–
Units
µV
0
120
–
150
VREF
180
V
mV
240
300
360
mV
360
450
540
mV
720
900
1080
mV
Ω
bits
a. Error in this parameter is included in the Absolute System Error.
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.13 4.75V to 36V DC Gate Drive, Linear Output Specificationsa
Parameter
Description
VOHGD
High Output Voltage
Conditions
HVdd = 5V to 36V.
VOLGD
HVdd = 5V to 36V.
Low Output Voltage
Min.
HVdd 0.1
–
Typ.
–
Max.
–
Units
V
HVdd - 5
–
V
a. To maintain the Absolute System Error per table DC Analog-to-Digital Converter Specifications, the current into
or out of the Gate Drive Output must be less than 100 nA.
8.14 2.5V to 5V DC Gate Drive, Linear Output Specifications
Parameter
Description
VOHGD
High Output Voltage
Conditions
IOH = 100 nA, HVdd = 2.5V to 5V.
VOLGD
IOL = 100 nA, HVdd = 2.5V to 5V.
Low Output Voltage
Document 38-12034 Rev. *C
Min.
HVdd 0.1
–
Typ.
–
Max.
–
Units
V
–
1.0
V
Page 23 of 42
PRELIMINARY
CY8C42123/CY8C42223
CY8C42323/CY8C42423
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.15 4.75V to 36V DC Gate Drive, PWM Output Specifications
Parameter
Description
VOHGD
High Output Voltage
Conditions
IOH = 1 µA, HVdd = 4.75V to 36V.
VOLGD
IOL = 1 µA, HVdd = 4.75V to 36V.
Low Output Voltage
Min.
HVdd 0.1
–
Typ.
–
Max.
–
Units
V
HVdd - 5
–
V
Typ.
–
Max.
–
Units
V
–
1.0
V
8.16 2.5V to 5 V DC Gate Drive, PWM Output Specifications
Parameter
Description
VOHGD
High Output Voltage
Conditions
IOH = 1 µA, HVdd = 2.5V to 5V.
VOLGD
IOL = 1 µA, HVdd = 2.5V to 5V.
Low Output Voltage
Min.
HVdd 0.1
–
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.17 DC Analog Mux Bus Specifications
Parameter
Description
RSW
Switch Resistance to Common
Analog Bus
Document 38-12034 Rev. *C
Conditions
HVdd ≥ 5V.
HVdd = 3.3V.
HVdd = 2.7V.
Min.
–
–
–
Typ.
1000
1500
2000
Max.
–
–
–
Units
Ω
Ω
Ω
Page 24 of 42
PRELIMINARY
CY8C42123/CY8C42223
CY8C42323/CY8C42423
The following table lists guaranteed maximum and minimum specifications for the temperature range: -40°C ≤ TA ≤ 85°C. Typical
parameters apply at 25°C and are for design guidance only.
Note The bits PORLEV and VM in the table below refer to bits in the VLT_CR register. See the Power PSoC Mixed-Signal Array
Technical Reference Manual for more information on the VLT_CR register.
8.18 DC POR and LVD Specifications
Parameter
VPPOR0
VPPOR1
VPPOR2
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
Description
Vdd Value for PPOR Trip
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
Vdd Value for LVD Trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
Conditions
Vdd must be greater than or equal to
2.6V during startup, reset from the
XRES pin, or reset from Watchdog.
Min.
Typ.
Max.
Units
–
–
–
2.46
2.82
4.55
2.50
2.95
4.70
V
V
V
2.50
2.85
2.95
3.06
4.37
4.50
4.62
4.71
2.550
2.920
3.02
3.13
4.48
4.64
4.73
4.81
2.61a
2.99b
3.09
3.20
4.55
4.75
4.83
4.95
V
V
V
V
V
V
V
V
a. Always greater than 50 mV above VPPOR (PORLEV=00) for falling supply.
b. Always greater than 50 mV above VPPOR (PORLEV=01) for falling supply.
Document 38-12034 Rev. *C
Page 25 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.19 DC Programming Specifications
Parameter
Description
VddIWRITE
Supply Voltage for Flash Write
Operations
IDDP
Supply Current During
Programming or Verify
VILP
Input Low Level During
Programming or Verify
VIHP
Input High Level During
Programming or Verify
IILP
Input Current when Applying Vilp
to P1[0] or P1[1] During
Programming or Verify
IIHP
Input Current when Applying
Vihp to P1[0] or P1[1] During
Programming or Verify
VOLV
Output Low Level During
Programming or Verify
VOHV
Output High Level During
Programming or Verify
VOHV36
Output High Level During
Programming or Verify
FlashENPB
Flash Endurance (per block)
FlashENT
Flash Endurance (total)a
FlashDR
Flash Data Retention
Conditions
Min.
2.80
Typ.
–
Max.
–
Units
V
–
5
25
mA
–
–
0.8
V
2.1
–
–
V
Driving internal pull-down resistor.
–
–
0.2
mA
Driving internal pull-down resistor.
–
–
1.5
mA
–
–
0.75
V
HVdd 1.0
3.6
–
HVdd
V
5.0
–
V
50
1,800
10
–
–
–
–
–
–
KCycles
KCycles
Years
HVdd = 2.5V to 5V.
HVdd = 5V to 36V.
Erase/write cycles per block.
Erase/write cycles.
a. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1
blocks of 50,000 maximum cycles each, 36x2 blocks of 25,000 maximum cycles each, or 36x4 blocks of 12,500
maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block ever sees more
than 50,000 cycles).
For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the
result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 at
http://www.cypress.com under Application Notes for more information.
Document 38-12034 Rev. *C
Page 26 of 42
PRELIMINARY
CY8C42123/CY8C42223
CY8C42323/CY8C42423
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.20 3.0V to 36V AC Chip-Level Specifications
Parameter
Description
FIMO24
Internal Main Oscillator
Frequency for 24 MHz
Conditions
Trimmed for 5V or 3.3V operation
using factory trim values. See Figure
8-1b on page 16. SLIMO mode = 0.
Trimmed for 5V or 3.3V operation
using factory trim values. See Figure
8-1b on page 16. SLIMO mode = 1.
Min.
23.4
Typ.
24
Max.
24.6a,b,c
Units
MHz
5.85
6
6.15a,b,c
MHz
CPU Frequency (5V Nominal)
CPU Frequency (3.3V Nominal)
Digital PSoC Block Frequency Refer to the AC Digital Block Specifications.
F24M
Digital PSoC Block Frequency
F1K
Internal Low Speed Oscillator
Frequency
DC24M
24 MHz Duty Cycle
Step24M
24 MHz Trim Step Size
Fout48M
48 MHz Output Frequency
Trimmed. Utilizing factory trim
values.
Jitter24M1P 24 MHz Period Jitter (IMO)
Peak-to-Peak
Jitter24M1R 24 MHz Period Jitter (IMO) Root
Mean Squared
FMAX
Maximum Frequency of Signal
on Row Input or Row Output
TRAMP
Supply Ramp Time
TSBI
Wakeup Time from Idle Mode
TSB
Wakeup Time from Supervised
Sleep
TSBR
Wakeup Time from Regulated
Sleep
TSBW
Wakeup Time from Watchdog
Sleep
TSBD
Wakeup Time from Deep Sleep
0.91
0.91
0
24
12
48
24.6a,b
12.3b,c
49.2a,b,d
MHz
MHz
MHz
0
0.6
24
1
24.6b,d
1.5
MHz
kHz
40
–
46.8
50
50
48.0
60
–
49.2a,c
%
kHz
MHz
–
300
–
ps
–
–
600
ps
–
–
12.3
MHz
0
–
–
–
–
–
–
0
30
µs
µs
µs
–
–
30
µs
–
–
400
µs
–
–
3
ms
FIMO6
Internal Main Oscillator
Frequency for 6 MHz
FCPU1
FCPU2
F48M
a.
b.
c.
d.
4.75V < HVdd < 36V, -40°C ≤ TA ≤ 70°C.
Accuracy derived from Internal Main Oscillator with appropriate trim for HVdd range.
3.0V < HVdd < 3.6V, -40°C ≤ TA ≤ 70°C.
See the individual user module data sheets for information on maximum frequencies for user modules.
Document 38-12034 Rev. *C
Page 27 of 42
PRELIMINARY
CY8C42123/CY8C42223
CY8C42323/CY8C42423
8.21 2.5V to 3.0V AC Chip-Level Specifications
Parameter
Description
FIMO12
Internal Main Oscillator
Frequency for 12 MHz
Conditions
Trimmed for 2.7V operation using
factory trim values. See Figure 8-1b
on page 16. SLIMO mode = 0.
Trimmed for 2.7V operation using
factory trim values. See Figure 8-1b
on page 16. SLIMO mode = 1.
Min.
11.5
Typ.
12
Max.
12.5a,b
Units
MHz
5.76
6
6.24a,b
MHz
CPU Frequency (2.7V Nominal)
Digital PSoC Block Frequency Refer to the AC Digital Block Speci(2.7V Nominal)
fications.
F1K
Internal Low Speed Oscillator
Frequency
DC12M
12 MHz Duty Cycle
Jitter12M1P 12 MHz Period Jitter (IMO)
Peak-to-Peak
Jitter12M1R 12 MHz Period Jitter (IMO) Root
Mean Squared
FMAX
Maximum Frequency of Signal
on Row Input or Row Output
TRAMP
Supply Ramp Time
0.90
0
3
12
3.12a
12.5a,b
MHz
MHz
0.6
1
1.5
kHz
40
–
50
340
60
–
%
ps
–
–
600
ps
–
–
12.5
MHz
0
–
–
µs
FIMO6
Internal Main Oscillator
Frequency for 6 MHz
FCPU1
FBLK27
a. Accuracy derived from Internal Main Oscillator with appropriate trim for HVdd range.
b. See the individual user module data sheets for information on maximum frequencies for user modules.
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.22 3.0V and 36V AC GPIO Specifications
Parameter
Description
FGPIO
GPIO Operating Frequency
TRiseF
Rise Time, Normal Strong Mode,
Cload = 50 pF
TFallF
Fall Time, Normal Strong Mode,
Cload = 50 pF
TRiseS
Rise Time, Slow Strong Mode,
Cload = 50 pF
TFallS
Fall Time, Slow Strong Mode,
Cload = 50 pF
Document 38-12034 Rev. *C
Conditions
Normal Strong Mode.
HVdd = 4.5 to 5.25V, 10% - 90%.
Min.
0
3
Typ.
–
–
Max.
12.5
18
Units
MHz
ns
HVdd = 4.5 to 5.25V, 10% - 90%.
2
–
18
ns
HVdd = 3 to 5.25V, 10% - 90%.
10
27
–
ns
HVdd = 3 to 5.25V, 10% - 90%.
10
22
–
ns
Page 28 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
8.23 2.5V to 3.0V AC GPIO Specifications
Parameter
Description
FGPIO
GPIO Operating Frequency
TRiseF
Rise Time, Normal Strong Mode,
Cload = 50 pF
TFallF
Fall Time, Normal Strong Mode,
Cload = 50 pF
TRiseS
Rise Time, Slow Strong Mode,
Cload = 50 pF
TFallS
Fall Time, Slow Strong Mode,
Cload = 50 pF
Conditions
Normal Strong Mode.
HVdd = 2.5 to 3.0V, 10% - 90%.
Min.
0
6
Typ.
–
–
Max.
3.12
50
Units
MHz
ns
HVdd = 2.5 to 3.0V, 10% - 90%.
6
–
50
ns
HVdd = 2.5 to 3.0V, 10% - 90%.
18
40
120
ns
HVdd = 2.5 to 3.0V, 10% - 90%.
18
40
120
ns
90%
GPIO
Pin
Output
Voltage
10%
TRiseF
TRiseS
TFallF
TFallS
Figure 8-2. GPIO Timing Diagram
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.24 AC High Voltage Output Specifications
Parameter
Description
FHVO
High Voltage Output Operating
Frequency
TRISE
TFALL
Document 38-12034 Rev. *C
Conditions
Min.
–
Typ.
–
Max.
1.04
Units
MHz
–
–
–
–
200
200
ns
ns
Page 29 of 42
PRELIMINARY
CY8C42123/CY8C42223
CY8C42323/CY8C42423
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.25 AC Comparator Specifications
Parameter
Description
TRSYNC27
Response Time in Synchronous
Mode (50 mV Overdrive)
TRSYNC36
Response Time in Synchronous
Mode (50 mV Overdrive)
TR27
Response Time (50 mV
Overdrive)
TR36
Response Time (50 mV
Overdrive)
Response Time in Low Power
TRLP27
TRLP36
Response Time in Low Power
Conditions
HVdd = 2.5V to 3.0V.
Output clocked at 12 MHz.
HVdd = 3.0V to 36V.
Output clocked at 24 MHz.
HVdd = 2.5V to 3.0V.
Min.
–
Typ.
84
Max.
–
Units
ns
–
42
–
ns
–
–
200
ns
HVdd = 3.0V to 36V.
–
–
100
ns
HVdd = 2.5V to 3.0V
HVdd = 3.0V to 36V
–
–
–
–
400
200
ns
ns
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.26 AC Analog-to-Digital Converter Specifications
Parameter
Description
Sample Ratea, b
8-Bit Sample Rateb
Conditions
12 bits to 6 bits at 6 MHz.
Min.
1.46
–
Typ.
–
23.4
Max.
93.75
–
Units
Ksps
Ksps
a. Dependent on clock frequency and bit resolution. See individual user module data sheets.
b. For HVdd = 2.5V to 3.0V, sample rates are halved. Bit BPEN in the AC0_CLK register must be set to 1.
Document 38-12034 Rev. *C
Page 30 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.27 3.0V to 36V AC Digital Block Specifications
Parameter
Description
Timer
Capture Pulse Width
Maximum Frequency (Capture
Not Used)
Maximum Frequency (With or
Without Capture)
Counter
Enable Pulse Width
Maximum Frequency (Enable
Not Used)
Maximum Frequency (With or
Without Enable Input)
PWM
Maximum Frequency (Enable
Not Used)
Maximum Frequency (With or
Without Enable Input)
Deadband
Kill Pulse Width:
Asynchronous Restart Mode
Synchronous Restart Mode
Disable Mode
Maximum Frequency
Conditions
4.75V < HVdd < 36V.
Min.
50a
–
Typ.
–
–
Max.
–
49.9
Units
ns
MHz
3.0V < HVdd < 36V.
–
–
25.0
MHz
4.75V < HVdd < 36V.
50a
–
–
–
–
49.9
ns
MHz
3.0V < HVdd < 36V.
–
–
25.0
MHz
4.75V < HVdd < 36V.
–
–
49.9
MHz
3.0V < HVdd < 36V.
–
–
25.0
MHz
4.75V < HVdd < 36V.
3.0V < HVdd < 36V.
20
50a
50a
–
–
–
–
–
–
–
–
–
–
49.9
25.0
ns
ns
ns
MHz
MHz
a. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).
8.28 2.5V to 3.0V AC Digital Block Specifications
Parameter
Description
Timer
Capture Pulse Width
Maximum Frequency
Counter
Enable Pulse Width
Maximum Frequency
PWM
Maximum Frequency
Deadband
Kill Pulse Width:
Asynchronous Restart Mode
Synchronous Restart Mode
Disable Mode
Maximum Frequency
Conditions
Min.
100a
–
100a
–
–
Typ.
–
–
–
–
–
Max.
–
12.5
–
12.5
12.5
Units
ns
MHz
ns
MHz
MHz
20
100a
100a
–
–
–
–
–
–
–
–
12.5
ns
ns
ns
MHz
a. 50 ns minimum input pulse width is based on the input synchronizers running at 12 MHz (84 ns nominal period).
Document 38-12034 Rev. *C
Page 31 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.29 4.75V to 36V AC Gate Drive, Linear Output Specifications
Parameter
Description
BWOB
Small Signal Bandwidth,
20mVpp, 3dB BW, 100pF Load
Conditions
Min.
0.8
Typ.
–
Max.
–
Units
MHz
Min.
0.7
Typ.
–
Max.
–
Units
MHz
200
–
–
kHz
Min.
0.6
Typ.
–
Max.
–
Units
MHz
180
–
–
kHz
8.30 3.0V to 5.0V AC Gate Drive, Linear Output Specifications
Parameter
Description
BWOB
Small Signal Bandwidth,
20mVpp, 3dB BW, 100pF Load
BWOB
Large Signal Bandwidth, 1Vpp,
3dB BW, 100pF Load
Conditions
8.31 2.5V to 3.0V AC Gate Drive, Linear Output Specifications
Parameter
Description
BWOB
Small Signal Bandwidth,
20mVpp, 3dB BW, 100pF Load
BWOB
Large Signal Bandwidth, 1Vpp,
3dB BW, 100pF Load
Conditions
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.32 4.75V to 36V AC Gate Drive, PWM Output Specifications
Parameter
Description
FMAX
TROB
Rise Time 10% to 90%, 5V Step,
100pF Load
TFOB
Fall Time 10% to 90%, 5V Step,
100pF Load
Document 38-12034 Rev. *C
Conditions
Min.
–
–
Typ.
–
–
Max.
2
50
Units
MHz
ns
–
–
50
ns
Page 32 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
8.33 3.0V to 5.0V AC Gate Drive, PWM Output Specifications
Parameter
Description
FMAX
TROB
Rise Time 10% to 90%, 5V Step,
100pF Load
TFOB
Fall Time 10% to 90%, 5V Step,
100pF Load
Conditions
Min.
–
–
Typ.
–
–
Max.
1
130
Units
MHz
ns
–
–
60
ns
Min.
–
–
Typ.
–
–
Max.
0.5
360
Units
MHz
ns
–
–
60
ns
8.34 2.5V to 3.0V AC Gate Drive, PWM Output Specifications
Parameter
Description
FMAX
TROB
Rise Time 10% to 90%, 5V Step,
100pF Load
TFOB
Fall Time 10% to 90%, 5V Step,
100pF Load
Conditions
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.35 4.75V to 36V AC External Clock Specifications
Parameter
FOSCEXT
–
–
–
Description
Frequency
High Period
Low Period
Power Up IMO to Switch
Conditions
Min.
0.090
20.6
20.6
150
Typ.
–
–
–
–
Max.
25.0
5300
–
–
Units
MHz
ns
ns
µs
Min.
0.090
Typ.
–
Max.
12.5
Units
MHz
0.180
–
25.0
MHz
41.7
–
5300
ns
41.7
–
–
ns
150
–
–
µs
8.36 3.0V to 5.0V AC External Clock Specifications
Parameter
Description
FOSCEXT
Frequency with CPU Clock
divide by 1a
Frequency with CPU Clock
FOSCEXT
divide by 2 or greaterb
–
High Period with CPU Clock
divide by 1
–
Low Period with CPU Clock
divide by 1
–
Power Up IMO to Switch
Conditions
a. Maximum CPU frequency is 12 MHz at 3.3V. With the CPU clock divider set to 1, the external clock must adhere
to the maximum frequency and duty cycle requirements.
b. If the frequency of the external clock is greater than 12 MHz, the CPU clock divider must be set to 2 or greater. In
this case, the CPU clock divider will ensure that the fifty percent duty cycle requirement is met.
Document 38-12034 Rev. *C
Page 33 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
8.37 2.5V to 3.0V AC External Clock Specifications
Parameter
Description
FOSCEXT
Frequency with CPU Clock
divide by 1a
Frequency with CPU Clock
FOSCEXT
divide by 4 or greaterb
–
High Period with CPU Clock
divide by 1
–
Low Period with CPU Clock
divide by 1
–
Power Up IMO to Switch
Conditions
Min.
0.090
Typ.
–
Max.
3.12
Units
MHz
0.180
–
12.5
MHz
41.7
–
5300
ns
41.7
–
–
ns
150
–
–
µs
a. Maximum CPU frequency is 3 MHz at 2.7V. With the CPU clock divider set to 1, the external clock must adhere to
the maximum frequency and duty cycle requirements.
b. If the frequency of the external clock is greater than 12 MHz, the CPU clock divider must be set to 4 or greater. In
this case, the CPU clock divider will ensure that the fifty percent duty cycle requirement is met.
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.38 AC Programming Specifications
Parameter
Description
Conditions
TRSCLK
Rise Time of SCLK
TFSCLK
Fall Time of SCLK
TSSCLK
Data Set up Time to Falling Edge
of SCLK
THSCLK
Data Hold Time from Falling
Edge of SCLK
FSCLK
Frequency of SCLK
TERASEB
Flash Erase Time (Block)
TWRITE
Flash Block Write Time
TDSCLK
Data Out Delay from Falling
HVdd > 3.6.
Edge of SCLK
TDSCLK3
Data Out Delay from Falling
3.0 ≤ HVdd ≤ 3.6.
Edge of SCLK
TDSCLK2
Data Out Delay from Falling
2.5 ≤ HVdd ≤ 3.0.
Edge of SCLK
Document 38-12034 Rev. *C
Min.
1
1
40
Typ.
–
–
–
Max.
20
20
–
Units
ns
ns
ns
40
–
–
ns
0
–
–
–
–
20
20
–
8
–
–
45
MHz
ms
ms
ns
–
–
50
ns
–
–
70
ns
Page 34 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.39 3.0V to 36V AC Characteristics of I2C SDA and SCL Pins
Parameter
Description
FSCLI2C
SCL Clock Frequency
Hold Time (repeated) START
THDSTAI2C
Condition. After this period, the
first clock pulse is generated.
TLOWI2C
LOW Period of the SCL Clock
THIGHI2C
HIGH Period of the SCL Clock
Set-up Time for a Repeated
TSUSTAI2C
START Condition
THDDATI2C
Data Hold Time
Data Set-up Time
TSUDATI2C
Set-up Time for STOP Condition
TSUSTOI2C
TBUFI2C
Bus Free Time Between a STOP
and START Condition
Pulse Width of spikes are
TSPI2C
suppressed by the input filter.
Conditions
Standard Mode
Min.
Max.
0
100
4.0
–
Fast Mode
Min.
Max.
0
400
0.6
–
Units
kHz
µs
4.7
4.0
4.7
–
–
–
1.3
0.6
0.6
–
–
–
µs
µs
µs
0
250
4.0
4.7
–
–
–
–
0
100a
0.6
1.3
–
–
–
–
µs
ns
µs
µs
–
–
0
50
ns
a. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT ≥ 250
ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL
signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA
line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the
SCL line is released.
Document 38-12034 Rev. *C
Page 35 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 36V
and -40°C ≤ TA ≤ 85°C (referred to as 5V operation), 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C (referred to as 3.3V operation), or 2.5V
to 3.0V and -40°C ≤ TA ≤ 85°C (referred to as 2.7V operation), respectively. Typical parameters apply to 5V, 3.3V, and 2.7V at
25°C and are for design guidance only.
8.40 2.5V to 3.0V AC Characteristics of I2C SDA and SCL Pins (Fast Mode not Supported)
Parameter
Description
FSCLI2C
SCL Clock Frequency
Hold Time (repeated) START
THDSTAI2C
Condition. After this period, the
first clock pulse is generated.
TLOWI2C
LOW Period of the SCL Clock
THIGHI2C
HIGH Period of the SCL Clock
Set-up Time for a Repeated
TSUSTAI2C
START Condition
THDDATI2C
Data Hold Time
Data Set-up Time
TSUDATI2C
Set-up Time for STOP Condition
TSUSTOI2C
TBUFI2C
Bus Free Time Between a STOP
and START Condition
Standard Mode
Min.
Max.
0
100
4.0
–
Conditions
SDA
TLOWI2C
TSUDATI2C
THDSTAI2C
Units
kHz
µs
4.7
4.0
4.7
–
–
–
µs
µs
µs
0
250
4.0
4.7
–
–
–
–
µs
ns
µs
µs
TSPI2C
TBUFI2C
SCL
S THDSTAI2C THDDATI2C THIGHI2C
TSUSTAI2C
Sr
TSUSTOI2C
P
S
Figure 8-3. Definition for Timing for Fast/Standard Mode on the I2C Bus
Document 38-12034 Rev. *C
Page 36 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
9.0
Thermal Considerations
The Power PSoC device can support a supply voltage up to
36V. An internal linear regulator provides the nominal 5 volts
used to power the M8C processor and other internal
resources. Because regulating to a lower voltage generates
excess heat, care must be taken to not exceed the maximum
junction temperature of the PSoC device when using higher
supply voltages.
The junction temperature depends on the ambient temperature, the amount of power being dissipated in the device and
the thermal resistance (θJA) of the package. In Linear Power
PSoC devices, dissipated power can be broken into four
sources: the PSoC core (CPU, PSoC blocks and system
resources), the General Purpose Inputs/Outputs (GPIO), and
the Gate Drive outputs (GD). The equation for junction temperature is shown in Equation 1, where θJA is the thermal resistance of the device package.
TJ = TA + θJA * (PCore + PGPIO + PGD)
However, HVdd - VOH can be quite large and current sourced
by GPIO must be looked at carefully when using HVdd voltages
greater than 5V. The equation for GPIO power dissipation is
shown in Equation 3, where ISink is the total current being sunk
by GPIO pins, and ISource is the total current being sourced by
GPIO pins.
PGPIO = VOL * ISink + (HVdd - VOH) * ISource
Equation 3
The power dissipated by the high voltage Gate Drives (GD0
and GD1) is divided into a current sink and current source
element. With the GD pins, the (HVdd - VOHGD) component is
relatively small and the VOLGD component can be large
(approximately HVdd - 5V). Therefore, with the GD pins, care
must be taken to consider the effects of sinking currents. The
equation for GD power dissipation is shown in Equation 4,
where ISinkGD is the total current sunk by the GD pins, and
ISourceGD is the total current sourced by the GD pins.
Equation 1
PGD = VOLGD * ISinkGD + (HVdd - VOHGD) * ISourceGD
The core power dissipated in the PSoC is the supply voltage
(HVdd) times the combined current of: the CPU, digital blocks,
analog blocks and system resources (Idd). The equation for the
PSoC core power dissipation is:
PCore = HVdd * Idd
Equation 2
The power dissipated in the PSoC due to the GPIO can be
divided into two elements: current being sourced and current
being sunk. Because VOL is a relatively small value (less than
1V), the sinking current will not be a major contributor to heat
in the Power PSoC.
Equation 4
The following figures show the effects of supply voltage and
current on the temperature of the PSoC. Figure 9-1a shows
the maximum current with a varied supply voltage at an
ambient temperature of 70°C and Figure 9-1b shows the
maximum current with a varied supply voltage at an ambient
temperature of 85°C. The PSoC model used assumes Idd =
5mA and all other current is sourced by GPIO.
Each curve in the figures shows the maximum ISource that can
be tolerated (TJ remains below the maximum limit) at various
supply voltages between 2.5V and 36V, for a specific package.
The maximum current is clipped at 85 mA due to drive limitations on the GPIO pins. The four package types available with
Linear Power PSoC devices are shown. Thermal resistance
(θJA) for the packages can be found in Section 9.1 on page 38.
90
90
80
80
32-pin MLF
70
Idd + IGPIO
Idd + IGPIO
70
60
50
16-pin SOIC
40
32-pin MLF
60
50
40
16-pin SOIC
16-pin TSSOP
30
30
20
20
16-pin TSSOP
8-pin SOIC
8-pin SOIC
10
10
0
0
0
10
20
HVdd
30
Figure 9-1a. Maximum Current vs. Supply Voltage
by Package (70o Ambient)
Document 38-12034 Rev. *C
0
10
20
HVdd
30
Figure 9-1b. Maximum Current vs. Supply Voltage
by Package (85o Ambient)
Page 37 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
9.1
Thermal Impedances per Package
Typical θJA *
186 oC/W
124 oC/W
122 oC/W
22 oC/W
Package
8 SOIC
16 SOIC
16 TSSOP
32 QFN
* Thermal resistance from silicon junction to ambient (TJ = TA + POWER x θJA).
9.2
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Package
Minimum Peak
Temperature*
Maximum Peak
Temperature
8 SOIC
240oC
260oC
16 SOIC
240oC
260oC
16 TSSOP
240oC
260oC
32 QFN
240oC
260oC
* Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220+/-5oC with
Sn-Pb or 245+/-5oC with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
10.0 CY8C42x23 PSoC Device Key Features and Ordering Information
SRAM
(Bytes)
Temperature
Range
Power
Blocks
Digital
Blocks
Analog
Channel
Digital IO
Pins
HV GPO
XRES Pin
CY8C42123-24SXI
4K
256
-40°C to +85°C
2
4
2
4
0
No
8-Pin SOIC Tape and Reel
CY8C42123-24SXIT
4K
256
-40°C to +85°C
2
4
2
4
0
No
16-Pin SOIC
CY8C42223-24SXI
4K
256
-40°C to +85°C
2
4
2
8
2
No
16-Pin SOIC Tape and Reel
CY8C42223-24SXIT
4K
256
-40°C to +85°C
2
4
2
8
2
No
No
Ordering
Code
8-Pin SOIC
Package
Flash
(Bytes)
The following table lists the CY8C42x23 Power PSoC device’s key package features and ordering codes .
16-Pin TSSOP
CY8C42323-24ZXI
4K
256
-40°C to +85°C
2
4
2
10
2
16-Pin TSSOP Tape and Reel
CY8C42323-24ZXIT
4K
256
-40°C to +85°C
2
4
2
10
2
No
32-Pin QFN
CY8C42423-24LFXI
4K
256
-40°C to +85°C
2
4
2
10
2
Yes
32-Pin QFN Tape and Reel
CY8C42423-24LFXIT
4K
256
-40°C to +85°C
2
4
2
10
2
Yes
32-Pin OCD QFN*
CY8C42000-24LFXI*
4K
256
-40°C to +85°C
2
4
2
10
2
Yes
* This part may be used for in-circuit debugging. It is NOT available for production.
Document 38-12034 Rev. *C
Page 38 of 42
CY8C42123/CY8C42223
CY8C42323/CY8C42423
PRELIMINARY
11.0 Package Diagrams
51-85066-*C
Figure 11-1. 8-Lead (150) SOIC
PIN 1 ID
8
1
DIMENSIONS IN INCHES[MM] MIN.
MAX.
REFERENCE JEDEC MS-012
PACKAGE WEIGHT 0.15gms
0.150[3.810]
0.157[3.987]
0.230[5.842]
0.244[6.197]
PART #
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
9
16
0.386[9.804]
0.393[9.982]
0.010[0.254]
0.016[0.406]
SEATING PLANE
X 45°
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.050[1.270]
BSC
0°~8°
0.0138[0.350]
0.0192[0.487]
0.004[0.102]
0.0098[0.249]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
51-85068-*B
Figure 11-2. 16-Lead (150) SOIC
Document 38-12034 Rev. *C
Page 39 of 42
PRELIMINARY
CY8C42123/CY8C42223
CY8C42323/CY8C42423
51-85091-*A
Figure 11-3. 16-Lead (4x4 mm) TSSOP
E-PAD X, Y for this product is 3.71 mm, 3.71 mm (+/-0.08 mm)
51-85188 *A
Figure 11-4. 32-Lead (5x5 mm) QFN
Important Note For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
Document 38-12034 Rev. *C
Page 40 of 42
PRELIMINARY
CY8C42123/CY8C42223
CY8C42323/CY8C42423
To obtain information about Cypress Semiconductor or PSoC sales and technical support, reference the following information.
Cypress Semiconductor Corporation
198 Champion Court
San Jose, CA 95134
Phone: 408.943.2600
Web Sites:
Company Information – http://www.cypress.com
Sales – http://www.cypress.com/aboutus/sales_locations.cfm
Technical Support – http://www.cypress.com/support/login.cfm
Cypress and the Cypress logo are registered trademarks of Cypress Semiconductor Corporation and “Programmable Systemon-Chip,” PSoC, PSoC Designer, and PSoC Express are trademarks of Cypress Semiconductor Corporation.
All products and company names mentioned in this document may be the trademarks of their respective holders.
Flash Code Protection Note the following details of the Flash code protection features on Cypress Semiconductor PSoC devices.
Cypress Semiconductor products meet the specifications contained in their particular data sheets. Cypress Semiconductor believes that its PSoC
family of products is one of the most secure families of its kind on the market today, regardless of how they are used. There may be methods,
unknown to Cypress Semiconductor, that can breach the code protection features. Any of these methods, to our knowledge, would be dishonest
and possibly illegal. Neither Cypress Semiconductor nor any other semiconductor manufacturer can guarantee the security of their code. Code
protection does not mean that we are guaranteeing the product as "unbreakable."
Cypress Semiconductor is willing to work with the customer who is concerned about the integrity of their code. Code protection is constantly
evolving. We at Cypress Semiconductor are committed to continuously improving the code protection features of our products.
Document 38-12034 Rev. *C
Page 41 of 42
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
PRELIMINARY
CY8C42123/CY8C42223
CY8C42323/CY8C42423
Document History Page
Description Title: CY8C42123, CY8C42223, CY8C42323, and CY8C42423 Power PSoC™ Devices
Document Number: 38-12034
REV.
ECN NO.
Issue Date
Orig. of
Change
Description of Change
**
339515
See ECN
ARI
New data sheet.
*A
391130
See ECN
HMT
Update for PR3 Cypress “Preliminary” requirements. (Parts, pinouts,
diagrams, specs., etc.)
*B
394530
See ECN
HMT
Change pin 13 to P1[0]I2C*. Change pin 14 to NC. Change pin 25 to DNU.
*C
406740
See ECN
HMT
Update White LED application diagram. Add RATTEN to the DC Linear Control
Specifications table. Add CY corporate address on Information page.
Implement CY standard QFN package terminology.
Document 38-12034 Rev. *C
Page 42 of 42
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