Freescale MPX2202DP 200 kpa on-chip temperature compensated silicon pressure sensor Datasheet

Pressure
Document Number: MPX2202
Rev 8, 10/2012
Freescale Semiconductor
Data Sheet: Technical Data
200 kPa On-Chip Temperature
Compensated Silicon
Pressure Sensors
MPX2202
Series
0 to 200 kPa (0 to 29 psi)
40 mV Full Scale
(Typical)
The MPX2202 devices series are silicon piezoresistive pressure sensor
providing a highly accurate and linear voltage output directly proportional to
the applied pressure. The sensor is a single monolithic silicon diaphragm with
the strain gauge and a thin-film resistor network integrated on chip. The chip
is laser trimmed for precise span and offset calibration and temperature
compensation. They are designed for use in applications such as pump/
motor controllers, robotics, level indicators, medical diagnostics, pressure
switching, barometers, altimeters, etc.
Application Examples
•
•
•
•
•
•
•
Features
•
•
•
•
•
Temperature Compensated Over 0C to +85C
Easy-to-Use Chip Carrier Package Options
Available in Absolute, Differential and Gauge Configurations
Ratiometric to Supply Voltage
Available in Easy-to-Use Tape and Reel
Pump/Motor Controllers
Robotics
Level Indicators
Medical Diagnostics
Pressure Switching
Barometers
Altimeters
ORDERING INFORMATION
Case
Device Name
No.
None
Unibody Package (MPX2202 Series)
MPX2202A
344
•
MPX2202DP
344C
MPX2202AP
344B
MPX2202GP
344B
MPX2202ASX
344F
Small Outline Package (MPXV2202 Series)
MPXV2202GP
1369
MPXV2202DP
1320
1320A
MPXM2202GST1
1320A
MPXM2202AS
1320A
Gauge
•
Pressure Type
Differential
Absolute
•
•
•
•
•
•
•
•
MPXV2202G
MPXM2202D
MPXM2202D
•
© 2005-2008, 2012 Freescale Semiconductor, Inc. All rights reserved.
MPX2202A
MPXV2202DP
•
•
•
•
•
MPX2202AP
MPXV2202GP
•
•
MPX2202A
MPX2202GP
•
•
Device Marking
MPX2202DP
•
•
482A
MPAK Package (MPXM2202 Series)
MPXM2202D
1320
•
MPXM2202DT1
1320
•
MPXM2202GS
Dual
•
1351
MPXV2202GC6TI
MPXM2202A
# of Ports
Single
•
•
MPXM2202A
MPXM2202GS
MPXM2202GS
•
MPXM2202AS
Pressure
UNIBODY PACKAGES
MPX2202A
CASE 344-15
MPX2202AP/GP
CASE 344B-01
MPX2202DP
CASE 344C-01
MPX2202ASX
CASE 344F-01
MPAK
SMALL OUTLINE PACKAGES
MPXV2202DP
CASE 1351-01
MPXV2202GP
CASE 1369-01
MPXV2202GC6T1
CASE 482A-01
MPXM2202A
CASE 1320-02
MPXM2202GS/AS
CASE 1320A-02
MPX2202
2
Sensors
Freescale Semiconductor, Inc.
Pressure
Operating Characteristics
Table 1. Operating Characteristics
(VS = 10 Vdc, TA = 25C unless otherwise noted, P1 > P2)
Characteristics
Symbol
Min
Typ
Max
Unit
POP
POP
20
0
—
—
200
200
kPa
kPa
Supply Voltage(2)
VS
—
10
16
Vdc
Supply Current
Io
—
6.0
—
mAdc
VFSS
38.5
40
41.5
mV
Voff
-1.0
-2.0
—
—
1.0
2.0
mV
V/P
—
0.2
—
mV/kPa
—
-0.6
-1.0
—
—
0.4
1.0
%VFSS
Pressure Hysteresis(5) (0 to 200 kPa)
—
—
 0.1
—
%VFSS
Temperature Hysteresis(5) (-40C to +125C)
—
—
 0.5
—
%VFSS
TCVFSS
-2.0
—
2.0
%VFSS
TCVoff
-1.0
—
1.0
mV
Input Impedance
Zin
1000
—
2500

Output Impedance
Zout
1400
—
3000

Response Time(6) (10% to 90%)
tR
—
1.0
—
ms
Warm-Up
—
—
20
—
ms
Offset Stability(7)
—
—
0.5
—
%VFSS
Pressure Range(1)
Absolute Pressure Range MPX2202A
Differential Pressure Range MPX2202D
Full Scale Span(3)
Offset(4)
MPX2202D, MPXM2202D/G Series
MPX2202A, MPXM2202A Series
Sensitivity
(5)
Linearity
MPXM2202D/G, MPX2202D Series
MPXM2202A, MPX2202A Series
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure, at 25C.
TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C.
TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2202
Sensors
Freescale Semiconductor, Inc.
3
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Max Value
Unit
400
kPa
Storage Temperature
-40 to 125
C
Operating Temperature
-40 to 125
C
Maximum Pressure (P1 > P2)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Voltage Output versus Applied Differential
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The absolute sensor has a built-in reference vacuum. The
output voltage will decrease as vacuum, relative to ambient,
is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
(P1) side relative to the vacuum (P2) side. Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a block diagram of the internal circuitry
on the stand-alone pressure sensor chip.
VS
3
Thin Film
Temperature
Compensation
and Calibration
Circuitry
Sensing
Element
2
4
+VOUT
–VOUT
1
GND
Figure 1. Temperature Compensated and Calibrated
Pressure Sensor Schematic
MPX2202
4
Sensors
Freescale Semiconductor, Inc.
Pressure
On-Chip Temperature Compensation and Calibration
VS = 10 VDC
TA = 25C
P1 > P2
40
35
30
TYP
Span
Range
(TYP)
Output (mVDC)
25
MAX
20
15
MIN
10
5
0
kPa
PSI
-5
0
25
50
7.25
75
100 125
14.5
Pressure
150
21.75
175
Offset
(TYP)
200
29
Figure 2. Output vs. Pressure Differential
Figure 2 shows the output characteristics of the MPX2202
series at 25C. The output is directly proportional to the
differential pressure and is essentially a straight line.
Silicone Gel
Die Coat
Differential/Gauge
Die
P1
Epoxy
Case
Differential/Gauge Element
P2
Absolute
Die
Silicone Gel
Die Coat
Stainless Steel
Metal Cover
Wire Bond
Lead Frame
The effects of temperature on full scale span and offset are
very small and are shown under Operating Characteristics.
Bond
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Wire Bond
Lead Frame
Die
Bond
Absolute Element
P2
Figure 3. Cross Sectional Diagram (not to scale)
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 4) or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Least
Square
Deviation
Least Squares Fit
Relative Voltage Output
Figure 3 illustrates the differential/gauge die in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2202 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Exaggerated
Performance
Curve
Straight Line
Deviation
End Point Straight
Line Fit
Offset
0
50
Pressure (% Full Scale)
100
Figure 4. Linearity Specification Comparison
MPX2202
Sensors
Freescale Semiconductor, Inc.
5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Table 3. Pressure (P1) Side Delineation
Part Number
MPX2202A
Case Type
344
Pressure (P1) Side Identifier
Stainless Steel Cap
MPX2202DP
344C
Side with Part Marking
MPX2202GP/AP
344B
Side with Port Attached
MPX2202ASX
344F
Side with Port Attached
MPX2202GP
1369
Side with Port Attached
MPX2202DP
1351
Side with Part Marking
MPXV2202GP
1369
Side with Port Attached
MPXV2202DP
1351
Side with Part Marking
MPXV2202GC6TI
482A
Side with Port Attached
MPXM2202A/ATI/DT/DTI
1320
Side with Part Marking
1320A
Side with Port Attached
MPXM2202GS/GSTI/AS/ASTI
MPX2202
6
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
–A–
D 8 PL
4
0.25 (0.010)
5
M
T B
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
S
N –B–
G
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
W
V
C
H
J
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.038
0.042
0.100 BSC
0.002
0.010
0.009
0.011
0.061
0.071
0
7
0.444
0.448
0.709
0.725
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0
7
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
–T–
K
M
PIN 1 IDENTIFIER
SEATING
PLANE
CASE 482A–01
ISSUE A
DATE 05/13/98
MPX2202
Sensors
Freescale Semiconductor, Inc.
7
Pressure
PACKAGE DIMENSIONS
C
R
M
1
B
2
-A-
Z
4
3
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
D 4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
Y
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
- SUPPLY
+ SUPPLY
GROUND
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
GND
-VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2202
8
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
N
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
0.25 (0.010)
-T-
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
T S
M
S
Q
S
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
-AU
SEATING
PLANE
-T-
L
H
PORT #2
VACUUM
(P2)
R
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
POSITIVE
PRESSURE
(P1)
N
-Q-
B
1 2 3 4
K
PIN 1
S
C
J
F
-P0.25 (0.010)
M
T Q
S
G
D
4 PL
0.13 (0.005)
M
T S
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
1.145
1.175 29.08
29.85
0.685
0.715 17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725 17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440 10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.158
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344D-01
ISSUE B
UNIBODY PACKAGE
MPX2202
Sensors
Freescale Semiconductor, Inc.
9
Pressure
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
PAGE 1 OF 2
MPX2202
10
Sensors
Freescale Semiconductor, Inc.
Pressure
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2202
Sensors
Freescale Semiconductor, Inc.
11
Pressure
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2202
12
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2202
Sensors
Freescale Semiconductor, Inc.
13
Pressure
PACKAGE DIMENSIONS
CASE 1320-02
ISSUE B
MPAK
MPX2202
14
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
CASE 1320-02
ISSUE B
MPAK
MPX2202
Sensors
Freescale Semiconductor, Inc.
15
Pressure
PACKAGE DIMENSIONS
PIN 4
PIN 1
CASE 1320A-02
ISSUE A
MPAK
MPX2202
16
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
CASE 1320A-02
ISSUE A
MPAK
MPX2202
Sensors
Freescale Semiconductor, Inc.
17
Pressure
REVISION HISTORY
Revision
number
Revision
date
7
01/2012
• In Table 1. Operating Characteristics, in the Characteristic column under Pressure Range, added
rows for Absolute Pressure Range MPX2202A and Differential Pressure Range MPX2202D
devices
8
10/2012
• Deleted references to device number MPXV2022GC6U throughout the document
Description of changes
MPX2202
Sensors
Freescale Semiconductor, Inc.
18
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MPX2202
Rev. 8
10/2012