TI1 INA159AIDGKTG4 Precision, gain of 0.2 level translation difference amplifier Datasheet

INA159
SBOS333B − JULY 2005 − REVISED OCTOBER 2005
Precision, Gain of 0.2 Level Translation
DIFFERENCE AMPLIFIER
FEATURES
DESCRIPTION
D GAIN OF 0.2 TO INTERFACE ±10V SIGNALS
TO SINGLE-SUPPLY ADCs
D
D
D
D
D
D
GAIN ACCURACY: ±0.024% (max)
WIDE BANDWIDTH: 1.5MHz
HIGH SLEW RATE: 15V/µs
LOW OFFSET VOLTAGE: ±100µV
LOW OFFSET DRIFT: ±1.5µV/°C
SINGLE-SUPPLY OPERATION DOWN TO 1.8V
APPLICATIONS
D INDUSTRIAL PROCESS CONTROLS
D INSTRUMENTATION
D DIFFERENTIAL TO SINGLE-ENDED
D
The INA159 is a high slew rate, G = 1/5 difference amplifier
consisting of a precision op amp with a precision resistor
network. The gain of 1/5 makes the INA159 useful to
couple ±10V signals to single-supply analog-to-digital
converters (ADCs), particularly those operating on a single
+5V supply. The on-chip resistors are laser-trimmed for
accurate gain and high common-mode rejection. Excellent
temperature coefficient of resistance (TCR) tracking of the
resistors maintains gain accuracy and common-mode
rejection over temperature. The input common-mode
voltage range extends beyond the positive and negative
supply rails. It operates on a total of +1.8V to +5.5V single
or split supplies. The INA159 reference input uses two
resistors for easy mid-supply or reference biasing.
The difference amplifier is the foundation of many
commonly-used circuits. The INA159 provides this circuit
function without using an expensive external precision
resistor network. The INA159 is available in an MSOP-8
surface-mount package and is specified for operation over
the extended industrial temperature range, −40°C to
+125°C.
CONVERSION
AUDIO LINE RECEIVERS
VREF
5V
V+
−IN
100kΩ
20kΩ
SENSE
REF
R1
100Ω
+IN
C1
1000pF
VIN
+IN
100kΩ
40kΩ
REF 2
40kΩ
−IN
V+
DOUT
ADS8325
ADC
DCLOCK
CS
GND
REF 1
INA159
Figure 1. Typical Application
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright  2005, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products
conform to specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all parameters.
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INA159
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5.5V
Signal Input Terminals (−IN and +IN), Voltage . . . . . . . . . . . . . ±30V
Reference (REF 1 and REF2) and Sense Pins
Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10mA
Voltage . . . . . . . . . . . . . . . . . . . . . . . . (V−) − 0.5V to (V+) + 0.5V
Output Short Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Operating Temperature . . . . . . . . . . . . . . . . . . . . . −40°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4000V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000V
(1)
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
PACKAGE
MARKING
INA159
MSOP-8
DGK
CJB
(1)
For the most current package and ordering information, see the
Package Option Addendum at the end of this document, or see
the TI web site at www.ti.com.
PIN CONFIGURATIONS
TOP VIEW
MSOP
INA159
2
REF 1
1
8
REF 2
−IN
2
7
V+
+IN
3
6
OUT
V−
4
5
SENSE
INA159
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005
ELECTRICAL CHARACTERISTICS: VS = +5V
Boldface limits apply over the specified temperature range, TA = −40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, REF pin 1 connected to ground, and REF pin 2 connected to VREF = 5V, unless otherwise noted.
INA159
PARAMETER
CONDITIONS
OFFSET VOLTAGE(1)
Initial (1)
VOS
vs Temperature
vs Power Supply
PSRR
Reference Divider Accuracy(2)
over Temperature
RTO
VS = ±2.5V, Reference and Input Pins Grounded
MIN
VS = ±0.9V to ±2.75V
INPUT IMPEDANCE(3)
Differential
Common-Mode
INPUT VOLTAGE RANGE
Common-Mode Voltage
Range
Positive
Negative
Common-Mode Rejection
Ratio
over Temperature
CMRR
Quiescent Current
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
MSOP-8
±100
±1.5
±20
±0.002
±0.002
±500
µV
µV/°C
µV/V
%
%
±100
±0.024
240
60
kΩ
kΩ
17.5
−12.5
V
V
VCM = −10V to +10V, RS = 0Ω
80
96
dB
94
dB
10
30
µVPP
nV/√Hz
RTO
VREF2 = 4.096V, RL Connected to GND,
(VIN+) − (VIN−) = −10V to +10V, VCM = 0V
G
OUTPUT
Voltage, Positive
Voltage, Negative
Current Limit, Continuous to Common
Capacitive Load
Open-Loop Output Impedance
RO
POWER SUPPLY
Specified Voltage Range
Operating Voltage Range
UNIT
VCM
GAIN
FREQUENCY RESPONSE
Small-Signal Bandwidth
Slew Rate
Settling Time, 0.01%
Overload Recovery Time
MAX
RTI
OUTPUT VOLTAGE NOISE(4)
f = 0.1Hz to 10Hz
f = 10kHz
Initial
Error
vs Temperature
Nonlinearity
TYP
0.2
±0.005
±1
±0.0002
VREF2 = 4.096V, RL Connected to GND
VREF2 = 4.096V, RL Connected to GND
f = 1MHz, IO = 0
(V+) − 0.1
(V−) + 0.048
(V+) − 0.02
(V−) + 0.01
±60
See Typical Characteristic
110
−3dB
SR
tS
±0.024
VS
MHz
V/µs
µs
ns
+5
+1.8
IQ
V
V
mA
pF
Ω
1.5
15
1
250
4V Output Step, CL = 100pF
50% Overdrive
IO = 0mA, VS = ±2.5V,
Reference and Input Pins Grounded
1.1
−40
−40
−65
V/V
%
ppm/°C
% of FS
+5.5
V
V
1.5
mA
+125
+150
+150
°C
°C
°C
qJA
Surface-Mount
150
°C/W
(1)
Includes effects of amplifier input bias and offset currents.
Reference divider accuracy specifies the match between the reference divider resistors using the configuration in Figure 2.
(3) Internal resistors are ratio matched but have ±20% absolute value.
(4) Includes effects of amplifier input current noise and thermal noise contribution of resistor network.
(2)
3
INA159
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005
+5V
V+
2
7
100kΩ
20kΩ
5
6
3
100kΩ
40kΩ
40kΩ
INA159
V−
The test is performed by
measuring the output
with the reference
applied to alternate
reference resistors, and
calculating a result such
that the amplifier offset is
cancelled in the final
measurement.
OUT
1
8
4
Figure 2. Test Circuit for Reference Divider Accuracy
TYPICAL CHARACTERISTICS
At TA = +25°C, RL = 10kΩ connected to VS/2, REF pin 1 connected to ground, and REF pin 2 connected to VREF = 5V, unless otherwise noted.
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION
−500
−450
−400
−350
−300
−250
−200
−150
−100
−50
0
50
100
150
200
250
300
350
400
450
500
−10
−9
−8
−7
−6
−5
−4
−3
−2
−1
0
1
2
3
4
5
6
7
8
9
10
Population
Population
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Offset Voltage Drift (µV/_C)
Offset Voltage (µV)
GAIN vs FREQUENCY
POWER−SUPPLY REJECTION RATIO vs FREQUENCY
0
PSRR (dB)
Gain (dB)
−10
−20
−30
−40
−50
10
100
1k
10k
Frequency (Hz)
4
100k
1M
10M
130
120
110
100
90
80
70
60
50
40
30
20
10
0
−10
10
100
1k
10k
Frequency (Hz)
100k
1M
10M
INA159
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10kΩ connected to VS/2, REF pin 1 connected to ground, and REF pin 2 connected to VREF = 5V, unless otherwise noted.
COMMON−MODE REJECTION RATIO vs FREQUENCY
QUIESCENT CURRENT vs TEMPERATURE
120
1.20
110
1.15
100
1.10
CMRR (dB)
90
IQ (mA)
80
70
60
VS = 5V
1.05
1.00
0.95
50
VS = 1.8V
0.90
40
0.85
30
20
VS = 5.5V
0.80
10
100
1k
10k
100k
1M
−50
10M
−25
0
Frequency (Hz)
125
2.0
60
VS = ±2.5V
40
Output Swing (V)
I SC (mA)
100
2.5
80
20
VS = ±0.9V
0
−20
VS = ±2.5V
−40
−80
−100
−50
VS = ±2.75V
−25
0
25
50
75
1.5
TA = −40_C
1.0
0.5
TA = +25_C
TA =
+125_ C
0
−0.5
TA = −40_C
TA = +125_C
−1.0
−1.5
−60
100
−2.0
VS = ±0.9V
−2.5
VS = ±2.5V
−3.0
125
0
10
20
30
40
50
60
70
80
Temperature (_C)
Output Current (mA)
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
OUTPUT VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY
90
1000
Output Voltage Noise (nV/√Hz)
THD+Noise (%)
0.01
0.25VPP
2kΩ
4VPP
0.001
75
3.0
VS = ±2.75V
100
50
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
SHORT−CIRCUIT CURRENT vs TEMPERATURE
120
25
Temperature (_C)
10
600Ω
100
1k
Frequency (Hz)
10k
100k
100
10
1
10
100
1k
10k
100k
Frequency (Hz)
5
INA159
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10kΩ connected to VS/2, REF pin 1 connected to ground, and REF pin 2 connected to VREF = 5V, unless otherwise noted.
0.1Hz TO 10Hz NOISE
SMALL−SIGNAL OVERSHOOT vs LOAD CAPACITANCE
60
5µV/div
Overshoot (%)
50
40
30
VS = 5V
20
10
0
100
Time (1s/div)
1000
Load Capacitance (pF)
LARGE−SIGNAL STEP RESPONSE
1V/div
200mV/div
SMALL−SIGNAL STEP RESPONSE
Time (500ns/div)
Time (500ns/div)
SETTLING TIME
2mV/div
VOUT = 4V Step
CL = 100pF
Time (250ns/div)
6
3000
INA159
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005
APPLICATION INFORMATION
The internal op amp of the INA159 has a rail-to-rail
common-mode voltage capability at its inputs. A rail-to-rail
op amp allows the use of ±10V inputs into a circuit biased
to 1/2 of a 5V reference (2.5V quiescent output). The inputs
to the op amp will swing from approximately 400mV to
3.75V in this application.
The unique input topology of the INA159 eliminates the
input offset transition region typical of most rail-to-rail
complementary stage operational amplifiers. This allows
the INA159 to provide superior glitch- and transition-free
performance over the entire common-mode range.
Good layout practice includes the use of a 0.1µF bypass
capacitor placed closely across the supply pins.
The common-mode range of the INA159 is a function of
supply voltage and reference. Where both pins, REF1 and
REF2, are connected together:
V CM* + (V*) * 5[V REF * (V*)]
V CM) + (V)) ) 5[(V)) * (0.5VREF)]
(3)
V CM* + (V*) * 5[(0.5V REF) * (V*)]
(4)
Some typical values are shown in Table 1.
Table 1. Common-Mode Range For Various
Supply and Reference Voltages
REF 1 and REF 2 Connected Together
V+
V−
VREF
VCM+
5
0
3
15
VCM−
−15
5
0
2.5
17.5
−12.5
5
0
1.25
23.75
−6.25
VREF
VCM+
VCM−
1/2 Reference Connection
COMMON-MODE RANGE
V CM) + (V)) ) 5[(V)) * VREF]
Where one REF pin is connected to the reference, and the
other pin grounded (1/2 reference connection):
(1)
(2)
V+
V−
5
0
5
17.5
−12.5
5
0
4.096
19.76
−10.24
5
0
2.5
23.75
−6.25
3.3
0
3.3
11.55
−8.25
3.3
0
2.5
13.55
−6.25
3.3
0
1.25
16.675
−3.125
7
INA159
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005
Table 2. Input and Output Relationships for Various Reference and Connection Combinations
VREF
(V)
REF CONNECTION
5V
5
VOUT for VIN = 0
(V)
LINEAR VIN RANGE
(V)
USEFUL VOUT SWING
(V)
2.5
+10
0
−10
4.5
(±2V swing)
0.5
2.048
+10
0
−10
4.048
(±2V swing)
0.048
1.65
+10
0
−7.885
3.65
(−1.577V, +2V swing)
0.048
1.25
+10 (also +5)
0
−6 (also −5)
3.25
(−1.2V, +2V swing)
0.048
0.9
+10
0
−4.26
2.9
(−0.852V, +2V swing)
0.048
2.5
+10
0
−10
4.5
(±2V swing)
0.5
1.8
+10
0
−8.76
3.8
(−1.752V, +2V swing)
0.048
1.2
+10
0
−5.76
3.2
(−1.15V, +2V swing)
0.048
V+
−IN
100kΩ
20kΩ
SENSE
4.096
OUT
3.3
2.5
VIN
+IN
100kΩ
40kΩ
40kΩ
INA159
REF 2
VREF
REF 1
1.8
5V
V+
2.5
−IN
100kΩ
20kΩ
SENSE
OUT
1.8
VIN
+IN
100kΩ
40kΩ
40kΩ
1.2
8
INA159
REF 2
V REF
REF 1
INA159
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005
VREF
5V
V+
−IN
100kΩ
20kΩ
SENSE
REF
R1
100Ω
+IN
C1
1000pF
VIN
+IN
100kΩ
40kΩ
40kΩ
−IN
V+
DOUT
ADS8325
ADC
DCLOCK
CS
REF 2
GND
REF 1
INA159
Figure 3. Typical Application Circuit Interfacing to Medium-Speed, Single-Supply ADCs
VREF
5V
V+
−IN
100kΩ
20kΩ
SENSE
REF
R1
100Ω
+IN
100kΩ
40kΩ
40kΩ
REF 2
DOUT
ADS8361 or
ADS7861
ADC
−IN
+IN
C1
1000pF
VIN
V+
DCLOCK
CS
GND
REF 1
INA159
Figure 4. Typical Application Circuit Interfacing to Medium-Speed, Single-Supply ADCs with
Pseudo-Differential Inputs (such as the ADS7861 and ADS8361)
9
INA159
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005
VREF
5V
V+
−IN
100kΩ
20kΩ
SENSE
REF
R1
100Ω
VIN
+IN
100kΩ
40kΩ
40kΩ
+IN
C1
1000pF
V+
ADC
−IN
REF 2
GND
REF 1
INA159
a) Unipolar, Noninverting, G = 0.2
VREF
5V
V+
−IN
100kΩ
20kΩ
SENSE
REF
R1
100Ω
VIN
+IN
100kΩ
40kΩ
40kΩ
+IN
C1
1000pF
V+
ADC
−IN
REF 2
GND
REF 1
INA159
b) Bipolar, Noninverting, G = 0.2
VREF
5V
V+
−IN
100kΩ
20kΩ
SENSE
REF
R1
100Ω
+IN
100kΩ
40kΩ
40kΩ
+IN
C1
1000pF
REF 2
REF 1
INA159
VIN
c) Unipolar, Unity Gain
Figure 5. Basic INA159 Configurations
10
V+
ADC
−IN
GND
INA159
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005
5V
V+
VIN−
−IN A
100kΩ
20kΩ
SENSE A
OUT A
100Ω
1000pF
VIN+
+IN A
100kΩ
40kΩ
40kΩ
REF 2A
REF 1A
INA159
VREF
V+
−IN B
100kΩ
20kΩ
SENSE B
OUT B
+IN
100Ω
REF
−IN
1000pF
+IN B
100kΩ
40kΩ
40kΩ
V+
5V
ADC
GND
REF 2B
REF 1B
INA159
Figure 6. Differential ADC Drive
11
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
INA159AIDGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
CJB
INA159AIDGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CJB
INA159AIDGKT
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
CJB
INA159AIDGKTG4
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CJB
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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18-Oct-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF INA159 :
• Enhanced Product: INA159-EP
NOTE: Qualified Version Definitions:
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
INA159AIDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
INA159AIDGKT
VSSOP
DGK
8
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
INA159AIDGKR
VSSOP
DGK
8
2500
367.0
367.0
35.0
INA159AIDGKT
VSSOP
DGK
8
250
210.0
185.0
35.0
Pack Materials-Page 2
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