Cypress CY8C22213-24PVI Psocâ ¢ mixed signal array Datasheet

PSoC™ Mixed Signal Array
Final Data Sheet
CY8C22113 and CY8C22213
Features
■ Precision, Programmable Clocking
❐ Internal ±2.5% 24/48 MHz Oscillator
❐ High-Accuracy 24 MHz with Optional 32.768
kHz Crystal and PLL
❐ Optional External Oscillator, up to 24 MHz
❐ Internal Oscillator for Watchdog and Sleep
■ Powerful Harvard Architecture Processor
❐ M8C Processor Speeds to 24 MHz
❐ Low Power at High Speed
❐ 3.0 to 5.25 V Operating Voltage
❐ Industrial Temperature Range: -40°C to +85°C
■ Advanced Peripherals (PSoC Blocks)
❐ 3 Rail-to-Rail Analog PSoC Blocks Provide:
- Up to 14-Bit ADCs
- Up to 9-Bit DACs
- Programmable Gain Amplifiers
- Programmable Filters and Comparators
❐ 4 Digital PSoC Blocks Provide:
- 8- to 32-Bit Timers, Counters, and PWMs
- CRC and PRS Modules
- Full-Duplex UART
- SPI Masters or Slaves
- Connectable to all GPIO Pins
❐ Complex Peripherals by Combining Blocks
Port 1
■ Flexible On-Chip Memory
❐ 2K Bytes Flash Program Storage 50,000
Erase/Write Cycles
❐ 256 Bytes SRAM Data Storage
❐ In-System Serial Programming (ISSP)
❐ Partial Flash Updates
❐ Flexible Protection Modes
❐ EEPROM Emulation in Flash
■ Programmable Pin Configurations
❐ 25 mA Sink on all GPIO
❐ Pull up, Pull down, High Z, Strong, or Open
Drain Drive Modes on all GPIO
❐ Up to 8 Analog Inputs on GPIO
❐ One 30 mA Analog Outputs on GPIO
❐ Configurable Interrupt on all GPIO
Analog
Port 0 Drivers
PSoC CORE
SYSTEM BUS
Global Digital Interconnect
SRAM
256 Bytes
Global Analog Interconnect
SROM
Flash 2K
CPU Core (M8C)
Interrupt
Controller
Sleep and
Watchdog
Multiple Clock Sources
(Includes IMO, ILO, PLL, and ECO)
DIGITAL SYSTEM
ANALOG SYSTEM
Analog
Block
Array
Digital
Block Array
(1 Row,
4 Blocks)
(1 Column,
3 Blocks)
Analog
Ref
Analog
Input
Muxing
■ Additional System Resources
❐ I2C Slave, Master, and Multi-Master to
400 kHz
❐ Watchdog and Sleep Timers
❐ User-Configurable Low Voltage Detection
❐ Integrated Supervisory Circuit
❐ On-Chip Precision Voltage Reference
■ Complete Development Tools
❐ Free Development Software
(PSoC™ Designer)
❐ Full-Featured, In-Circuit Emulator and
Programmer
❐ Full Speed Emulation
❐ Complex Breakpoint Structure
❐ 128K Bytes Trace Memory
PSoC™ Functional Overview
The PSoC™ family consists of many Mixed Signal Array with
On-Chip Controller devices. These devices are designed to
replace multiple traditional MCU-based system components
with one, low cost single-chip programmable device. PSoC
devices include configurable blocks of analog and digital logic,
as well as programmable interconnects. This architecture
allows the user to create customized peripheral configurations
that match the requirements of each individual application.
Additionally, a fast CPU, Flash program memory, SRAM data
memory, and configurable IO are included in a range of convenient pinouts and packages.
The PSoC architecture, as illustrated on the left, is comprised of
four main areas: PSoC Core, Digital System, Analog System,
and System Resources. Configurable global busing allows all
the device resources to be combined into a complete custom
system. The PSoC CY8C22x13 family can have up to two IO
ports that connect to the global digital and analog interconnects,
providing access to 4 digital blocks and 3 analog blocks.
The PSoC Core
Digital
Clocks
POR and LVD
Decimator
I2C
System Resets
SYSTEM RESOURCES
June 2004
Internal
Voltage
Ref.
The PSoC Core is a powerful engine that supports a rich feature set. The core includes a CPU, memory, clocks, and configurable GPIO (General Purpose IO).
The M8C CPU core is a powerful processor with speeds up to
24 MHz, providing a four MIPS 8-bit Harvard architecture micro-
© Cypress MicroSystems, Inc. 2004 — Document No. 38-12009 Rev. *E
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CY8C22x13 Final Data Sheet
PSoC™ Overview
processor. The CPU utilizes an interrupt controller with 10 vectors, to simplify programming of real time embedded events.
Program execution is timed and protected using the included
Sleep and Watch Dog Timers (WDT).
Memory encompasses 2 KB of Flash for program storage, 256
bytes of SRAM for data storage, and up to 2 KB of EEPROM
emulated using the Flash. Program Flash utilizes four protection levels on blocks of 64 bytes, allowing customized software
IP protection.
The PSoC device incorporates flexible internal clock generators, including a 24 MHz IMO (internal main oscillator) accurate
to 2.5% over temperature and voltage. The 24 MHz IMO can
also be doubled to 48 MHz for use by the digital system. A low
power 32 kHz ILO (internal low speed oscillator) is provided for
the Sleep timer and WDT. If crystal accuracy is desired, the
ECO (32.768 kHz external crystal oscillator) is available for use
as a Real Time Clock (RTC) and can optionally generate a crystal-accurate 24 MHz system clock using a PLL. The clocks,
together with programmable clock dividers (as a System
Resource), provide the flexibility to integrate almost any timing
requirement into the PSoC device.
PSoC GPIOs provide connection to the CPU, digital and analog
resources of the device. Each pin’s drive mode may be selected
from eight options, allowing great flexibility in external interfacing. Every pin also has the capability to generate a system interrupt on high level, low level, and change from last read.
The Digital System
The Digital System is composed of 4 digital PSoC blocks. Each
block is an 8-bit resource that can be used alone or combined
with other blocks to form 8, 16, 24, and 32-bit peripherals, which
are called user module references.
Port 1
Port 0
To System Bus
Digital Clocks
From Core
To Analog
System
DIGITAL SYSTEM
Digital peripheral configurations include those listed below.
■
PWMs (8 to 32 bit)
■
PWMs with Dead band (8 to 32 bit)
■
Counters (8 to 32 bit)
■
Timers (8 to 32 bit)
■
UART 8-bit with selectable parity (up to 1)
■
SPI master and slave (up to 1)
■
I2C slave and master (1 available as a System Resource)
■
Cyclical Redundancy Checker/Generator (8 to 32 bit)
■
IrDA (up to 1)
■
Pseudo Random Sequence Generators (8 to 32 bit)
The digital blocks can be connected to any GPIO through a
series of global buses that can route any signal to any pin. The
buses also allow for signal multiplexing and for performing logic
operations. This configurability frees your designs from the constraints of a fixed peripheral controller.
Digital blocks are provided in rows of four, where the number of
blocks varies by PSoC device family. This allows you the optimum choice of system resources for your application. Family
resources are shown in the table titled “PSoC Device Characteristics” on page 3.
The Analog System
The Analog System is composed of 3 configurable blocks, each
comprised of an opamp circuit allowing the creation of complex
analog signal flows. Analog peripherals are very flexible and
can be customized to support specific application requirements.
Some of the more common PSoC analog functions (most available as user modules) are listed below.
■
Analog-to-digital converters (one with 6- to 14-bit resolution,
selectable as Incremental, Delta Sigma, and SAR)
■
Filters (two pole band-pass, low-pass, and notch)
■
Amplifiers (one with selectable gain to 48x)
■
Comparators (one with 16 selectable thresholds)
■
DACs (one with 6- to 9-bit resolution)
■
Multiplying DACs (one with 6- to 9-bit resolution)
■
High current output drivers (one with 30 mA drive as a Core
Resource)
■
1.3V reference (as a System Resource)
■
Many other topologies possible
8
Row 0
DBB00
DBB01
DCB02
4
Row Output
Configuration
8
Row Input
Configuration
Digital PSoC Block Array
DCB03
4
GIE[7:0]
GIO[7:0]
Global Digital
Interconnect
8
8
GOE[7:0]
GOO[7:0]
Digital System Block Diagram
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CY8C22x13 Final Data Sheet
PSoC™ Overview
Analog blocks are provided in columns of three, which includes
one CT (Continuous Time) and two SC (Switched Capacitor)
blocks. The number of blocks is dependant on the device family
which is detailed in the table titled “PSoC Device Characteristics” on page 3.
P0[7]
P0[6]
P0[5]
P0[4]
P0[3]
P0[2]
P0[1]
P0[0]
Array Input Configuration
ACI0[1:0]
Additional System Resources
System Resources, some of which have been previously listed,
provide additional capability useful to complete systems. Additional resources include a decimator, low voltage detection, and
power on reset. Brief statements describing the merits of each
system resource are presented below.
■
Digital clock dividers provide three customizable clock frequencies for use in applications. The clocks can be routed to
both the digital and analog systems. Additional clocks can be
generated using digital PSoC blocks as clock dividers.
■
The decimator provides a custom hardware filter for digital
signal processing applications including the creation of Delta
Sigma ADCs.
■
The I2C module provides 100 and 400 kHz communication
over two wires. Slave, master, and multi-master modes are
all supported.
■
Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR
(Power On Reset) circuit eliminates the need for a system
supervisor.
■
An internal 1.3 voltage reference provides an absolute reference for the analog system, including ADCs and DACs.
PSoC Device Characteristics
Depending on your PSoC device characteristics, the digital and
analog systems can have 16, 8, or 4 digital blocks and 12, 6, or
3 analog blocks. The following table lists the resources
available for specific PSoC device groups.
ACI1[1:0]
Block Array
PSoC Device Characteristics
ASD11
PSoC Part
Number
Digital
IO
Digital
Rows
Digital
Blocks
Analog
Inputs
Analog
Outputs
Analog
Columns
Analog
Blocks
ACB01
ASC21
CY8C29x66
up to
64
4
16
12
4
4
12
CY8C27x66
up to
44
2
8
12
4
4
12
CY8C27x43
up to
44
2
8
12
4
4
12
CY8C24x23
up to
24
1
4
12
2
2
6
CY8C22x13
up to
16
1
4
8
1
1
3
Analog Reference
Interface to
Digital System
RefHi
RefLo
AGND
Reference
Generators
AGNDIn
RefIn
Bandgap
M8C Interface (Address Bus, Data Bus, Etc.)
Analog System Block Diagram
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CY8C22x13 Final Data Sheet
PSoC™ Overview
Getting Started
Development Tools
The quickest path to understanding the PSoC silicon is by reading this data sheet and using the PSoC Designer Integrated
Development Environment (IDE). This data sheet is an overview of the PSoC integrated circuit and presents specific pin,
register, and electrical specifications. For in-depth information,
along with detailed programming information, reference the
PSoC™ Mixed Signal Array Technical Reference Manual.
The Cypress MicroSystems PSoC Designer is a Microsoft®
Windows-based, integrated development environment for the
Programmable System-on-Chip (PSoC) devices. The PSoC
Designer IDE and application runs on Windows 98, Windows
NT 4.0, Windows 2000, Windows Millennium (Me), or Windows
XP. (Reference the PSoC Designer Functional Flow diagram
below.)
For up-to-date Ordering, Packaging, and Electrical Specification
information, reference the latest PSoC device data sheets on
the web at http://www.cypress.com/psoc.
PSoC Designer helps the customer to select an operating configuration for the PSoC, write application code that uses the
PSoC, and debug the application. This system provides design
database management by project, an integrated debugger with
In-Circuit Emulator, in-system programming support, and the
CYASM macro assembler for the CPUs.
Development Kits
Development Kits are available from the following distributors:
Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store
at http://www.onfulfillment.com/cypressstore/ contains development kits, C compilers, and all accessories for PSoC development. Click on PSoC (Programmable System-on-Chip) to view
a current list of available items.
PSoC Designer also supports a high-level C language compiler
developed specifically for the devices in the family.
Consultants
Results
Free PSoC "Tele-training" is available for beginners and taught
by a live marketing or application engineer over the phone. Five
training classes are available to accelerate the learning curve
including introduction, designing, debugging, advanced design,
advanced analog, as well as application-specific classes covering topics like PSoC and the LIN bus. For days and times of the
tele-training, see http://www.cypress.com/support/training.cfm.
Context
Sensitive
Help
Graphical Designer
Interface
Commands
PSoCTM
Designer
Tele-Training
Importable
Design
Database
PSoC
Configuration
Sheet
Device
Database
Certified PSoC Consultants offer everything from technical
assistance to completed PSoC designs. To contact or become a
PSoC Consultant, go to the following Cypress support web site:
http://www.cypress.com/support/cypros.cfm.
Application
Database
PSoCTM
Designer
Core
Engine
Project
Database
Technical Support
PSoC application engineers take pride in fast and accurate
response. They can be reached with a 4-hour guaranteed
response at http://www.cypress.com/support/login.cfm.
Manufacturing
Information
File
User
Modules
Library
Application Notes
A long list of application notes will assist you in every aspect of
your design effort. To locate the PSoC application notes, go to
http://www.cypress.com/design/results.cfm.
Emulation
Pod
In-Circuit
Emulator
Device
Programmer
PSoC Designer Subsystems
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CY8C22x13 Final Data Sheet
PSoC™ Overview
PSoC Designer Software Subsystems
Device Editor
The Device Editor subsystem allows the user to select different
onboard analog and digital components called user modules
using the PSoC blocks. Examples of user modules are ADCs,
DACs, Amplifiers, and Filters.
The device editor also supports easy development of multiple
configurations and dynamic reconfiguration. Dynamic configuration allows for changing configurations at run time.
PSoC Designer sets up power-on initialization tables for
selected PSoC block configurations and creates source code
for an application framework. The framework contains software
to operate the selected components and, if the project uses
more than one operating configuration, contains routines to
switch between different sets of PSoC block configurations at
run time. PSoC Designer can print out a configuration sheet for
a given project configuration for use during application programming in conjunction with the Device Data Sheet. Once the
framework is generated, the user can add application-specific
code to flesh out the framework. It’s also possible to change the
selected components and regenerate the framework.
Design Browser
The Design Browser allows users to select and import preconfigured designs into the user’s project. Users can easily browse
a catalog of preconfigured designs to facilitate time-to-design.
Examples provided in the tools include a 300-baud modem, LIN
Bus master and slave, fan controller, and magnetic card reader.
Application Editor
Debugger
The PSoC Designer Debugger subsystem provides hardware
in-circuit emulation, allowing the designer to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow the designer to read and
program and read and write data memory, read and write IO
registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The
debugger also allows the designer to create a trace buffer of
registers and memory locations of interest.
Online Help System
The online help system displays online, context-sensitive help
for the user. Designed for procedural and quick reference, each
functional subsystem has its own context-sensitive help. This
system also provides tutorials and links to FAQs and an Online
Support Forum to aid the designer in getting started.
Hardware Tools
In-Circuit Emulator
A low cost, high functionality ICE (In-Circuit Emulator) is available for development support. This hardware has the capability
to program single devices.
The emulator consists of a base unit that connects to the PC by
way of the parallel or USB port. The base unit is universal and
will operate with all PSoC devices. Emulation pods for each
device family are available separately. The emulation pod takes
the place of the PSoC device in the target board and performs
full speed (24 MHz) operation.
In the Application Editor you can edit your C language and
Assembly language source code. You can also assemble, compile, link, and build.
Assembler. The macro assembler allows the assembly code
to be merged seamlessly with C code. The link libraries automatically use absolute addressing or can be compiled in relative
mode, and linked with other software modules to get absolute
addressing.
C Language Compiler. A C language compiler is available
that supports Cypress MicroSystems’ PSoC family devices.
Even if you have never worked in the C language before, the
product quickly allows you to create complete C programs for
the PSoC family devices.
The embedded, optimizing C compiler provides all the features
of C tailored to the PSoC architecture. It comes complete with
embedded libraries providing port and bus operations, standard
keypad and display support, and extended math functionality.
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PSoC Development Tool Kit
5
CY8C22x13 Final Data Sheet
PSoC™ Overview
User Modules and the PSoC
Development Process
the device to your specification and provides the high-level user
module API functions.
Device Editor
The development process for the PSoC device differs from that
of a traditional fixed function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture
a unique flexibility that pays dividends in managing specification
change during development and by lowering inventory costs.
These configurable resources, called PSoC Blocks, have the
ability to implement a wide variety of user-selectable functions.
Each block has several registers that determine its function and
connectivity to other blocks, multiplexers, buses, and to the IO
pins. Iterative development cycles permit you to adapt the hardware as well as the software. This substantially lowers the risk
of having to select a different part to meet the final design
requirements.
User
Module
Selection
The API functions are documented in user module data sheets
that are viewed directly in the PSoC Designer IDE. These data
sheets explain the internal operation of the user module and
provide performance specifications. Each data sheet describes
the use of each user module parameter and documents the setting of each register controlled by the user module.
The development process starts when you open a new project
and bring up the Device Editor, a pictorial environment (GUI) for
configuring the hardware. You pick the user modules you need
for your project and map them onto the PSoC blocks with pointand-click simplicity. Next, you build signal chains by interconnecting user modules to each other and the IO pins. At this
stage, you also configure the clock source connections and
enter parameter values directly or by selecting values from
drop-down menus. When you are ready to test the hardware
configuration or move on to developing code for the project, you
perform the “Generate Application” step. This causes PSoC
Designer to generate source code that automatically configures
June 3, 2004
Source
Code
Generator
Generate
Application
Application Editor
Project
Manager
To speed the development process, the PSoC Designer Integrated Development Environment (IDE) provides a library of
pre-built, pre-tested hardware peripheral functions, called “User
Modules.” User modules make selecting and implementing
peripheral devices simple, and come in analog, digital, and
mixed signal varieties. The standard User Module library contains over 50 common peripherals such as ADCs, DACs Timers, Counters, UARTs, and other not-so common peripherals
such as DTMF Generators and Bi-Quad analog filter sections.
Each user module establishes the basic register settings that
implement the selected function. It also provides parameters
that allow you to tailor its precise configuration to your particular
application. For example, a Pulse Width Modulator User Module configures one or more digital PSoC blocks, one for each 8
bits of resolution. The user module parameters permit you to
establish the pulse width and duty cycle. User modules also
provide tested software to cut your development time. The user
module application programming interface (API) provides highlevel functions to control and respond to hardware events at
run-time. The API also provides optional interrupt service routines that you can adapt as needed.
Placement
and
Parameter
-ization
Source
Code
Editor
Build
Manager
Build
All
Debugger
Interface
to ICE
Storage
Inspector
Event &
Breakpoint
Manager
User Modules and Development Process Flow Chart
The next step is to write your main program, and any sub-routines using PSoC Designer’s Application Editor subsystem.
The Application Editor includes a Project Manager that allows
you to open the project source code files (including all generated code files) from a hierarchal view. The source code editor
provides syntax coloring and advanced edit features for both C
and assembly language. File search capabilities include simple
string searches and recursive “grep-style” patterns. A single
mouse click invokes the Build Manager. It employs a professional-strength “makefile” system to automatically analyze all
file dependencies and run the compiler and assembler as necessary. Project-level options control optimization strategies
used by the compiler and linker. Syntax errors are displayed in
a console window. Double clicking the error message takes you
directly to the offending line of source code. When all is correct,
the linker builds a ROM file image suitable for programming.
The last step in the development process takes place inside the
PSoC Designer’s Debugger subsystem. The Debugger downloads the ROM image to the In-Circuit Emulator (ICE) where it
runs at full speed. Debugger capabilities rival those of systems
costing many times more. In addition to traditional single-step,
run-to-breakpoint and watch-variable features, the Debugger
provides a large trace buffer and allows you define complex
breakpoint events that include monitoring address and data bus
values, memory locations and external signals.
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CY8C22x13 Final Data Sheet
PSoC™ Overview
Document Conventions
Table of Contents
Acronyms Used
The following table lists the acronyms that are used in this document.
Acronym
Description
AC
alternating current
ADC
analog-to-digital converter
API
application programming interface
CPU
central processing unit
CT
continuous time
DAC
digital-to-analog converter
DC
direct current
EEPROM
electrically erasable programmable read-only memory
FSR
full scale range
GPIO
general purpose IO
IO
input/output
IPOR
imprecise power on reset
LSb
least-significant bit
LVD
low voltage detect
MSb
most-significant bit
PC
program counter
POR
power on reset
PPOR
precision power on reset
PSoC™
Programmable System-on-Chip
PWM
pulse width modulator
RAM
random access memory
ROM
read only memory
SC
switched capacitor
SMP
switch mode pump
For an in depth discussion and more information on your PSoC
device, obtain the PSoC Mixed Signal Array Technical Reference Manual. This document encompasses and is organized
into the following chapters and sections.
1.
Pin Information ............................................................. 8
1.1 Pinouts ................................................................... 8
1.1.1 8-Pin Part Pinout ...................................... 8
1.1.2 20-Pin Part Pinout ..................................... 8
1.1.3 32-Pin Part Pinout ..................................... 9
2.
Register Reference ..................................................... 10
2.1 Register Conventions ........................................... 10
2.1.1 Abbreviations Used .................................. 10
2.2 Register Mapping Tables ..................................... 10
3.
Electrical Specifications ............................................ 13
3.1 Absolute Maximum Ratings ............................... 14
3.2 Operating Temperature ...................................... 14
3.3 DC Electrical Characteristics ................................ 15
3.3.1 DC Chip-Level Specifications ................... 15
3.3.2 DC General Purpose IO Specifications .... 15
3.3.3 DC Operational Amplifier Specifications ... 16
3.3.4 DC Analog Output Buffer Specifications ... 18
3.3.5 DC Analog Reference Specifications ....... 19
3.3.6 DC Analog PSoC Block Specifications ..... 19
3.3.7 DC POR and LVD Specifications ............. 20
3.3.8 DC Programming Specifications ............... 21
3.4 AC Electrical Characteristics ................................ 22
3.4.1 AC Chip-Level Specifications ................... 22
3.4.2 AC General Purpose IO Specifications .... 24
3.4.3 AC Operational Amplifier Specifications ... 25
3.4.4 AC Digital Block Specifications ................. 27
3.4.5 AC Analog Output Buffer Specifications ... 28
3.4.6 AC External Clock Specifications ............. 29
3.4.7 AC Programming Specifications ............... 29
3.4.8 AC I2C Specifications ............................... 30
4.
Packaging Information ............................................... 31
4.1 Packaging Dimensions ......................................... 31
4.2 Thermal Impedances .......................................... 34
4.3 Capacitance on Crystal Pins ............................... 34
5.
Ordering Information .................................................. 35
5.1 Ordering Code Definitions ................................... 35
6.
Sales and Company Information ............................... 36
6.1 Revision History .................................................. 36
6.2 Copyrights ............................................................ 36
Units of Measure
A units of measure table is located in the Electrical Specifications section. Table 3-1 on page 13 lists all the abbreviations
used to measure the PSoC devices.
Numeric Naming
Hexidecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexidecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’).
Numbers not indicated by an ‘h’ or ‘b’ are decimal.
June 3, 2004
Document No. 38-12009 Rev. *E
7
1. Pin Information
This chapter describes, lists, and illustrates the CY8C22x13 PSoC device pins and pinout configurations.
1.1
Pinouts
The CY8C22x13 PSoC device is available in a variety of packages which are listed and illustrated in the following tables. Every port
pin (labeled with a “P”) is capable of Digital IO. However, Vss, Vdd, SMP, and XRES are not capable of Digital IO.
1.1.1
8-Pin Part Pinout
Table 1-1. 8-Pin Part Pinout (PDIP, SOIC)
Pin
No.
Type
Pin
Name
Description
Digital
Analog
1
IO
IO
P0[5]
Analog column mux input and column output.
2
3
IO
IO
I
P0[3]
P1[1]
Analog column mux input.
Crystal Input (XTALin), I2C Serial Clock (SCL)
4
5
IO
Vss
P1[0]
6
IO
I
P0[2]
Ground connection.
Crystal Output (XTALout), I2C Serial Data
(SDA)
Analog column mux input.
7
8
IO
I
P0[4]
Vdd
Analog column mux input.
Supply voltage.
Power
Power
CY8C22113 8-Pin PSoC Device
AIO, P0[5]
AI, P0[3]
I2C SCL, XTALin, P1[1]
Vss
8
1
2 PDIP 7
3SOIC6
5
4
Vdd
P0[4], AI
P0[2], AI
P1[0], XTALout, I2C SDA
LEGEND: A = Analog, I = Input, and O = Output.
1.1.2
20-Pin Part Pinout
Table 1-2. 20-Pin Part Pinout (PDIP, SSOP, SOIC)
Pin
No.
Type
Pin
Name
Description
Digital
Analog
1
2
IO
IO
I
IO
P0[7]
P0[5]
Analog column mux input.
Analog column mux input and column output.
3
4
IO
IO
I
I
P0[3]
P0[1]
Analog column mux input.
Analog column mux input.
Ground connection.
I2C Serial Clock (SCL)
5
6
Power
IO
Vss
P1[7]
7
8
IO
IO
P1[5]
P1[3]
I2C Serial Data (SDA)
9
10
IO
P1[1]
Vss
Crystal Input (XTALin), I2C Serial Clock (SCL)
Ground connection.
11
IO
P1[0]
Crystal Output (XTALout), I2C Serial Data
(SDA)
12
IO
P1[2]
13
IO
P1[4]
14
15
IO
P1[6]
XRES
16
17
IO
IO
I
I
P0[0]
P0[2]
Analog column mux input.
Analog column mux input.
18
19
IO
IO
I
I
P0[4]
P0[6]
Analog column mux input.
Analog column mux input.
Power
Input
CY8C22213 20-Pin PSoC Device
AI, P0[7]
AIO, P0[5]
AI, P0[3]
AI, P0[1]
Vss
I2C SCL, P1[7]
I2C SDA, P1[5]
P1[3]
I2C SCL, XTALin, P1[1]
Vss
1
2
3
4
5
6
7
8
9
10
PDIP
SSOP
SOIC
20
19
18
17
16
15
14
13
12
11
Vdd
P0[6], AI
P0[4], AI
P0[2], AI
P0[0], AI
XRES
P1[6]
P1[4], EXTCLK
P1[2]
P1[0], XTALout, I2C SDA
Optional External Clock Input (EXTCLK)
Active high external reset with internal pull
down.
20
Power
Vdd
Supply voltage.
LEGEND: A = Analog, I = Input, and O = Output.
June 2004
Document No. 38-12009 Rev. *E
8
CY8C22x13 Final Data Sheet
1.1.3
1. Pin Information
32-Pin Part Pinout
Table 1-3. 32-Pin Part Pinout (MLF*)
Vss
Ground connection.
6
Power
Vss
Ground connection.
7
IO
P1[7]
I2C Serial Clock (SCL)
8
IO
P1[5]
I2C Serial Data (SDA)
NC
No connection. Do not use.
IO
11
IO
12
P1[3]
Power
P1[1]
Crystal Input (XTALin), I2C Serial Clock (SCL)
Vss
Ground connection.
Crystal Output (XTALout), I2C Serial Data
(SDA)
13
IO
P1[0]
14
IO
P1[2]
15
IO
P1[4]
Optional External Clock Input (EXTCLK)
NC
No connection. Do not use.
16
17
IO
18
P1[6]
Input
XRES
Active high external reset with internal pull
down.
19
NC
No connection. Do not use.
20
NC
No connection. Do not use.
21
NC
No connection. Do not use.
22
NC
No connection. Do not use.
Analog column mux input.
23
IO
I
P0[0]
24
IO
I
P0[2]
Analog column mux input.
NC
No connection. Do not use.
Analog column mux input.
25
26
IO
I
P0[4]
27
IO
I
P0[6]
Analog column mux input.
Vdd
Supply voltage.
28
Power
1
2
3
4
5
6
7
8
MLF
(Top View)
9
10
11
12
10
NC
NC
NC
NC
Vss
Vss
I2C SCL, P1[7]
I2C SDA, P1[5]
P0[4], AI
NC
Power
26
25
No connection. Do not use.
5
29
IO
I
P0[7]
Analog column mux input.
30
IO
IO
P0[5]
Analog column mux input and column output.
31
IO
I
P0[3]
Analog column mux input.
32
IO
I
P0[1]
Analog column mux input.
24
23
22
21
20
19
18
17
16
NC
P0[2], AI
P0[0], AI
NC
NC
NC
NC
XRES
P1[6]
EXTCLK, P1[4]
NC
No connection. Do not use.
4
Vdd
P0[6], AI
NC
13
14
15
No connection. Do not use.
3
I2C SDA, XTALout, P1[0]
P1[2]
No connection. Do not use.
NC
P0[5], AIO
P0[7], AI
NC
2
30
29
28
27
1
9
CY8C22213 PSoC Device
Description
I2C SCL, XTALin, P1[1]
Vss
Pin
Name
P0[1], AI
P0[3], AI
Analog
32
31
Type
Digital
NC
P1[3]
Pin
No.
LEGEND: A = Analog, I = Input, and O = Output.
* The MLF package has a center pad that must be connected to the same ground
as the Vss pin.
June 3, 2004
Document No. 38-12009 Rev. *E
9
2. Register Reference
This chapter lists the registers of the CY8C22x13 PSoC device by way of mapping tables, in offset order. For detailed register information, reference the PSoC™ Mixed Signal Array Technical Reference Manual.
2.1
2.1.1
Register Conventions
Abbreviations Used
The register conventions specific to this section are listed in the
following table.
Convention
Description
RW
Read and write register or bit(s)
R
Read register or bit(s)
W
Write register or bit(s)
L
Logical register or bit(s)
C
Clearable register or bit(s)
#
Access is bit specific
May 2004
2.2
Register Mapping Tables
The PSoC device has a total register address space of 512
bytes. The register space is also referred to as IO space and is
broken into two parts. The XOI bit in the Flag register determines which bank the user is currently in. When the XOI bit is
set, the user is said to be in the “extended” address space or
the “configuration” registers.
Note In the following register mapping tables, blank fields are
Reserved and should not be accessed.
© Cypress MicroSystems, Inc. 2003 — Document No. 38-12009 Rev. *E
10
CY8C22x13 Final Data Sheet
2. Register Reference
Register Map Bank 0 Table: User Space
RW
RW
RW
RW
I2C_CFG
I2C_SCR
I2C_DR
I2C_MSCR
INT_CLR0
INT_CLR1
INT_CLR3
INT_MSK3
INT_MSK0
INT_MSK1
INT_VC
RES_WDT
DEC_DH
DEC_DL
DEC_CR0
DEC_CR1
RW
RW
RW
RW
RW
RW
RW
CPU_F
CPU_SCR1
CPU_SCR0
Document No. 38-12009 Rev. *E
Access
RW
RW
RW
RW
Addr
(0,Hex)
Name
80
81
82
83
ASD11CR0
84
ASD11CR1
85
ASD11CR2
86
ASD11CR3
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
ASC21CR0
94
ASC21CR1
95
ASC21CR2
96
ASC21CR3
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
RDI0RI
B0
RDI0SYN
B1
RDI0IS
B2
RDI0LT0
B3
RDIOLT1
B4
RDI0RO0
B5
RDI0RO1
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
# Access is bit specific.
Access
June 3, 2004
Addr
(0,Hex)
00
RW
40
01
RW
41
02
RW
42
03
RW
43
04
RW
44
05
RW
45
06
RW
46
07
RW
47
08
48
09
49
0A
4A
0B
4B
0C
4C
0D
4D
0E
4E
0F
4F
10
50
11
51
12
52
13
53
14
54
15
55
16
56
17
57
18
58
19
59
1A
5A
1B
5B
1C
5C
1D
5D
1E
5E
1F
5F
DBB00DR0
20
#
AMX_IN
60
RW
DBB00DR1
21
W
61
DBB00DR2
22
RW
62
DBB00CR0
23
#
ARF_CR
63
RW
DBB01DR0
24
#
CMP_CR0
64
#
DBB01DR1
25
W
ASY_CR
65
#
DBB01DR2
26
RW
CMP_CR1
66
RW
DBB01CR0
27
#
67
DCB02DR0
28
#
68
DCB02DR1
29
W
69
DCB02DR2
2A
RW
6A
DCB02CR0
2B
#
6B
DCB03DR0
2C
#
6C
DCB03DR1
2D
W
6D
DCB03DR2
2E
RW
6E
DCB03CR0
2F
#
6F
30
70
31
71
32
72
33
73
34
ACB01CR3
74
RW
35
ACB01CR0
75
RW
36
ACB01CR1
76
RW
37
ACB01CR2
77
RW
38
78
39
79
3A
7A
3B
7B
3C
7C
3D
7D
3E
7E
3F
7F
Blank fields are Reserved and should not be accessed.
Name
Access
Addr
(0,Hex)
Name
Access
Addr
(0,Hex)
Name
PRT0DR
PRT0IE
PRT0GS
PRT0DM2
PRT1DR
PRT1IE
PRT1GS
PRT1DM2
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
RW
#
RW
#
RW
RW
RW
RW
RW
RW
RC
W
RC
RC
RW
RW
RL
#
#
11
CY8C22x13 Final Data Sheet
2. Register Reference
Register Map Bank 1 Table: Configuration Space
RW
RW
RW
RW
RW
RW
RW
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
GDI_O_IN
D0
GDI_E_IN
D1
GDI_O_OU
D2
GDI_E_OU
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
OSC_GO_EN DD
OSC_CR4
DE
OSC_CR3
DF
OSC_CR0
E0
OSC_CR1
E1
OSC_CR2
E2
VLT_CR
E3
VLT_CMP
E4
E5
E6
E7
IMO_TR
E8
ILO_TR
E9
BDG_TR
EA
ECO_TR
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
CPU_F
F7
F8
F9
FA
FB
FC
FD
CPU_SCR1
FE
CPU_SCR0
FF
Document No. 38-12009 Rev. *E
Access
RW
RW
RW
RW
Addr
(1,Hex)
RW
RW
RW
RW
Name
80
81
82
83
ASD11CR0
84
ASD11CR1
85
ASD11CR2
86
ASD11CR3
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
ASC21CR0
94
ASC21CR1
95
ASC21CR2
96
ASC21CR3
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
RDI0RI
B0
RDI0SYN
B1
RDI0IS
B2
RDI0LT0
B3
RDIOLT1
B4
RDI0RO0
B5
RDI0RO1
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
# Access is bit specific.
Access
June 3, 2004
Addr
(1,Hex)
00
RW
40
01
RW
41
02
RW
42
03
RW
43
04
RW
44
05
RW
45
06
RW
46
07
RW
47
08
48
09
49
0A
4A
0B
4B
0C
4C
0D
4D
0E
4E
0F
4F
10
50
11
51
12
52
13
53
14
54
15
55
16
56
17
57
18
58
19
59
1A
5A
1B
5B
1C
5C
1D
5D
1E
5E
1F
5F
DBB00FN
20
RW
CLK_CR0
60
RW
DBB00IN
21
RW
CLK_CR1
61
RW
DBB00OU
22
RW
ABF_CR0
62
RW
23
63
DBB01FN
24
RW
64
DBB01IN
25
RW
65
DBB01OU
26
RW
AMD_CR1
66
RW
27
ALT_CR0
67
RW
DCB02FN
28
RW
68
DCB02IN
29
RW
69
DCB02OU
2A
RW
6A
2B
6B
DCB03FN
2C
RW
6C
DCB03IN
2D
RW
6D
DCB03OU
2E
RW
6E
2F
6F
30
70
31
71
32
72
33
73
34
ACB01CR3
74
RW
35
ACB01CR0
75
RW
36
ACB01CR1
76
RW
37
ACB01CR2
77
RW
38
78
39
79
3A
7A
3B
7B
3C
7C
3D
7D
3E
7E
3F
7F
Blank fields are Reserved and should not be accessed.
Name
Access
Addr
(1,Hex)
Name
Access
Addr
(1,Hex)
Name
PRT0DM0
PRT0DM1
PRT0IC0
PRT0IC1
PRT1DM0
PRT1DM1
PRT1IC0
PRT1IC1
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
R
W
W
RW
W
RL
#
#
12
3. Electrical Specifications
This chapter presents the DC and AC electrical specifications of the CY8C22x13 PSoC device. For the most up to date electrical
specifications, confirm that you have the most recent data sheet by referencing the web at http://www.cypress.com/psoc.
Specifications are valid for -40oC ≤ TA ≤ 85oC and TJ ≤ 100oC as specified, except where noted. Specifications for devices running
at greater than 12 MHz are valid for -40oC ≤ TA ≤ 70oC and TJ ≤ 82oC.
5.25
Vdd Voltage
lid n g
Va rati n
pe gio
Re
O
4.75
3.00
93 kHz
CPU Frequency
12 MHz
24 MHz
Figure 3-1. Voltage versus Operating Frequency
The following table lists the units of measure that are used in this chapter.
Table 3-1: Units of Measure
Symbol
Unit of Measure
Symbol
Unit of Measure
oC
degree Celsius
µW
micro watts
dB
decibels
mA
milli-ampere
fF
femto farad
ms
milli-second
Hz
hertz
mV
milli-volts
KB
1024 bytes
nA
nano ampere
Kbit
1024 bits
ns
nanosecond
kHz
kilohertz
nV
nanovolts
kΩ
kilohm
Ω
ohm
MHz
megahertz
pA
pico ampere
MΩ
megaohm
pF
pico farad
µA
micro ampere
pp
peak-to-peak
µF
micro farad
ppm
µH
micro henry
ps
picosecond
µs
microsecond
sps
samples per second
µV
micro volts
σ
sigma: one standard deviation
micro volts root-mean-square
V
volts
µVrms
June 2004
parts per million
Document No. 38-12009 Rev. *E
13
CY8C22x13 Final Data Sheet
3.1
3. Electrical Specifications
Absolute Maximum Ratings
Table 3-2. Absolute Maximum Ratings
Symbol
Description
Min
Typ
Max
Units
TSTG
Storage Temperature
-55
–
+100
oC
TA
Ambient Temperature with Power Applied
-40
–
+85
o
Vdd
Supply Voltage on Vdd Relative to Vss
-0.5
–
+6.0
V
VIO
DC Input Voltage
Vss - 0.5
–
Vdd + 0.5
V
–
DC Voltage Applied to Tri-state
Vss - 0.5
–
Vdd + 0.5
V
IMIO
Maximum Current into any Port Pin
-25
–
+50
mA
IMAIO
Maximum Current into any Port Pin Configured as Analog
Driver
-50
–
+50
mA
–
Static Discharge Voltage
2000
–
–
V
–
Latch-up Current
–
–
200
mA
3.2
Notes
Higher storage temperatures will reduce data
retention time.
C
Operating Temperature
Table 3-3. Operating Temperature
Symbol
Description
Min
Typ
Max
Units
TA
Ambient Temperature
-40
–
+85
oC
TJ
Junction Temperature
-40
–
+100
oC
June 3, 2004
Document No. 38-12009 Rev. *E
Notes
The temperature rise from ambient to junction is
package specific. See “Thermal Impedances”
on page 34. The user must limit the power consumption to comply with this requirement.
14
CY8C22x13 Final Data Sheet
3.3
3.3.1
3. Electrical Specifications
DC Electrical Characteristics
DC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-4. DC Chip-Level Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
Vdd
Supply Voltage
3.00
–
5.25
V
IDD
Supply Current
–
5
8
mA
Conditions are Vdd = 5.0V, 25 oC, CPU = 3
MHz, 48 MHz disabled. VC1 = 1.5 MHz, VC2 =
93.75 kHz, VC3 = 93.75 kHz.
IDD3
Supply Current
–
3.3
6.0
mA
Conditions are Vdd = 3.3V, TA = 25 oC, CPU = 3
MHz, 48 MHz = Disabled, VC1 = 1.5 MHz, VC2
= 93.75 kHz, VC3 = 93.75 kHz.
ISB
Sleep (Mode) Current with POR, LVD, Sleep Timer, and
WDT.a
–
3
6.5
µA
Conditions are with internal slow speed oscillator, Vdd = 3.3V, -40 oC <= TA <= 55 oC.
ISBH
Sleep (Mode) Current with POR, LVD, Sleep Timer, and
WDT at high temperature.a
–
4
25
µA
Conditions are with internal slow speed oscillator, Vdd = 3.3V, 55 oC < TA <= 85 oC.
ISBXTL
Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,
and external crystal.a
–
4
7.5
µA
Conditions are with properly loaded, 1 µW max,
32.768 kHz crystal. Vdd = 3.3V, -40 oC <= TA <=
55 oC.
ISBXTLH
Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,
and external crystal at high temperature.a
–
5
µA
26
Conditions are with properly loaded, 1 µW max,
32.768 kHz crystal. Vdd = 3.3V, 55 oC < TA <=
85 oC.
VREF
Reference Voltage (Bandgap)
1.275
1.3
1.325
V
Trimmed for appropriate Vdd.
a. Standby current includes all functions (POR, LVD, WDT, Sleep Time) needed for reliable system operation. This should be compared with devices that have similar functions
enabled.
3.3.2
DC General Purpose IO Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-5. DC GPIO Specifications
Symbol
Description
Min
4
Typ
5.6
Max
8
Units
Notes
kΩ
RPU
Pull up Resistor
RPD
Pull down Resistor
4
5.6
8
kΩ
VOH
High Output Level
Vdd - 1.0
–
–
V
IOH = 10 mA, Vdd = 4.75 to 5.25V (80 mA maximum combined IOH budget)
VOL
Low Output Level
–
–
0.75
V
IOL = 25 mA, Vdd = 4.75 to 5.25V (150 mA
maximum combined IOL budget)
0.8
V
Vdd = 3.0 to 5.25
V
Vdd = 3.0 to 5.25
VIL
Input Low Level
–
–
VIH
Input High Level
2.1
–
VH
Input Hysterisis
–
60
–
mV
IIL
Input Leakage (Absolute Value)
–
1
–
nA
Gross tested to 1 µA.
CIN
Capacitive Load on Pins as Input
–
3.5
10
pF
Package and pin dependent. Temp = 25oC.
COUT
Capacitive Load on Pins as Output
–
3.5
10
pF
Package and pin dependent. Temp = 25oC.
June 3, 2004
Document No. 38-12009 Rev. *E
15
CY8C22x13 Final Data Sheet
3.3.3
3. Electrical Specifications
DC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
The Operational Amplifier is a component of both the Analog Continuous Time PSoC blocks and the Analog Switched Cap PSoC
blocks. The guaranteed specifications are measured in the Analog Continuous Time PSoC block. Typical parameters apply to 5V at
25°C and are for design guidance only.
Table 3-6. 5V DC Operational Amplifier Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
Input Offset Voltage (absolute value) Low Power
–
1.6
10
mV
Input Offset Voltage (absolute value) Mid Power
–
1.3
8
mV
Input Offset Voltage (absolute value) High Power
–
1.2
7.5
mV
TCVOSOA
Average Input Offset Voltage Drift
–
7.0
35.0
µV/oC
IEBOA
Input Leakage Current (Port 0 Analog Pins)
–
20
–
pA
Gross tested to 1 µA.
CINOA
Input Capacitance (Port 0 Analog Pins)
–
4.5
9.5
pF
Package and pin dependent. Temp = 25oC.
VCMOA
Common Mode Voltage Range
0.0
–
Vdd
V
Common Mode Voltage Range (high power or high
opamp bias)
0.5
–
Vdd - 0.5
The common-mode input voltage range is measured through an analog output buffer. The
specification includes the limitations imposed
by the characteristics of the analog output
buffer.
–
–
dB
Specification is applicable at high power. For all
other bias modes (except high power, high
opamp bias), minimum is 60 dB.
VOSOA
GOLOA
VOHIGHOA
VOLOWOA
ISOA
PSRROA
Open Loop Gain
Power = Low
60
Power = Medium
60
Power = High
80
High Output Voltage Swing (worst case internal load)
Power = Low
Vdd - 0.2
–
–
V
Power = Medium
Vdd - 0.2
–
–
V
Power = High
Vdd - 0.5
–
–
V
Power = Low
–
–
0.2
V
Power = Medium
–
–
0.2
V
Power = High
–
–
0.5
V
Power = Low
–
150
200
µA
Power = Low, Opamp Bias = High
–
300
400
µA
Power = Medium
–
600
800
µA
Power = Medium, Opamp Bias = High
–
1200
1600
µA
Power = High
–
2400
3200
µA
Power = High, Opamp Bias = High
–
4600
6400
µA
Supply Voltage Rejection Ratio
60
–
–
dB
Low Output Voltage Swing (worst case internal load)
Supply Current (including associated AGND buffer)
June 3, 2004
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CY8C22x13 Final Data Sheet
3. Electrical Specifications
Table 3-7. 3.3V DC Operational Amplifier Specifications
Symbol
VOSOA
Description
Min
Typ
Max
Units
Input Offset Voltage (absolute value) Low Power
–
1.65
10
mV
Input Offset Voltage (absolute value) Mid Power
–
1.32
8
mV
–
7.0
35.0
µV/oC
Notes
High Power is 5 Volt Only
TCVOSOA
Average Input Offset Voltage Drift
IEBOA
Input Leakage Current (Port 0 Analog Pins)
–
20
–
pA
Gross tested to 1 µA.
CINOA
Input Capacitance (Port 0 Analog Pins)
–
4.5
9.5
pF
Package and pin dependent. Temp = 25oC.
VCMOA
Common Mode Voltage Range
0.2
–
Vdd - 0.2
V
The common-mode input voltage range is
measured through an analog output buffer.
The specification includes the limitations
imposed by the characteristics of the analog
output buffer.
GOLOA
Open Loop Gain
–
–
dB
Specification is applicable at high power. For
all other bias modes (except high power, high
opamp bias), minimum is 60 dB.
VOHIGHOA
VOLOWOA
ISOA
PSRROA
Power = Low
60
Power = Medium
60
Power = High
80
High Output Voltage Swing (worst case internal load)
Power = Low
Vdd - 0.2
–
–
V
Power = Medium
Vdd - 0.2
–
–
V
Power = High is 5V only
Vdd - 0.2
–
–
V
Power = Low
–
–
0.2
V
Power = Medium
–
–
0.2
V
Power = High
–
–
0.2
V
Power = Low
–
150
200
µA
Power = Low, Opamp Bias = High
–
300
400
µA
Power = Medium
–
600
800
µA
Power = Medium, Opamp Bias = High
–
1200
1600
µA
Power = High
–
2400
3200
µA
Power = High, Opamp Bias = High
–
4600
6400
µA
Supply Voltage Rejection Ratio
50
–
–
dB
Low Output Voltage Swing (worst case internal load)
Supply Current (including associated AGND buffer)
June 3, 2004
Document No. 38-12009 Rev. *E
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CY8C22x13 Final Data Sheet
3.3.4
3. Electrical Specifications
DC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-8. 5V DC Analog Output Buffer Specifications
Symbol
Description
Min
Typ
Max
Units
VOSOB
Input Offset Voltage (Absolute Value)
–
3
12
mV
TCVOSOB
Average Input Offset Voltage Drift
–
+6
–
µV/°C
VCMOB
Common-Mode Input Voltage Range
0.5
–
Vdd - 1.0
V
ROUTOB
Output Resistance
Power = Low
–
1
–
Ω
Power = High
–
1
–
Ω
High Output Voltage Swing (Load = 32 ohms to Vdd/2)
Power = Low
0.5 x Vdd + 1.1 –
–
V
0.5 x Vdd + 1.1 –
–
V
Power = Low
–
–
0.5 x Vdd - 1.3
V
Power = High
–
–
0.5 x Vdd - 1.3
V
Power = Low
–
1.1
5.1
mA
Power = High
–
2.6
8.8
mA
Supply Voltage Rejection Ratio
60
–
–
dB
VOHIGHOB
Power = High
VOLOWOB
ISOB
PSRROB
Notes
Low Output Voltage Swing (Load = 32 ohms to Vdd/2)
Supply Current Including Bias Cell (No Load)
Table 3-9. 3.3V DC Analog Output Buffer Specifications
Symbol
Description
Min
Typ
Max
Units
VOSOB
Input Offset Voltage (Absolute Value)
–
3
12
mV
TCVOSOB
Average Input Offset Voltage Drift
–
+6
–
µV/°C
VCMOB
Common-Mode Input Voltage Range
0.5
-
Vdd - 1.0
V
ROUTOB
Output Resistance
Power = Low
–
1
–
Ω
Power = High
–
1
–
Ω
Power = Low
0.5 x Vdd + 1.0 –
–
V
Power = High
0.5 x Vdd + 1.0 –
–
V
Power = Low
–
–
0.5 x Vdd - 1.0
V
Power = High
–
–
0.5 x Vdd - 1.0
V
VOHIGHOB
VOLOWOB
ISOB
High Output Voltage Swing (Load = 1K ohms to Vdd/2)
Low Output Voltage Swing (Load = 1K ohms to Vdd/2)
Supply Current Including Bias Cell (No Load)
Power = Low
PSRROB
Notes
0.8
2.0
mA
Power = High
–
2.0
4.3
mA
Supply Voltage Rejection Ratio
50
–
–
dB
June 3, 2004
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CY8C22x13 Final Data Sheet
3.3.5
3. Electrical Specifications
DC Analog Reference Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
The guaranteed specifications are measured through the Analog Continuous Time PSoC blocks. The power levels for AGND refer to
the power of the Analog Continuous Time PSoC block. The power levels for RefHi and RefLo refer to the Analog Reference Control
register. The limits stated for AGND include the offset error of the AGND buffer local to the Analog Continuous Time PSoC block.
Table 3-10. 5V DC Analog Reference Specifications
Symbol
–
Description
Min
Typ
Max
Vdd/2 - 0.043
Vdd/2 - 0.025
Vdd/2 + 0.003
Units
AGND = Vdd/2a
CT Block Power = High
V
a. AGND tolerance includes the offsets of the local buffer in the PSoC block. Bandgap voltage is 1.3V ± 2%.
Table 3-11. 3.3V DC Analog Reference Specifications
Symbol
–
Description
Min
Typ
Max
Vdd/2 - 0.037
Vdd/2 - 0.020
Vdd/2 + 0.002
Units
AGND = Vdd/2a
CT Block Power = High
V
a. AGND tolerance includes the offsets of the local buffer in the PSoC block. Bandgap voltage is 1.3V ± 2%
3.3.6
DC Analog PSoC Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-12. DC Analog PSoC Block Specifications
Symbol
Description
Min
Typ
Max
Units
RCT
Resistor Unit Value (Continuous Time)
–
12.24
–
kΩ
CSC
Capacitor Unit Value (Switch Cap)
–
80
–
fF
June 3, 2004
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Notes
19
CY8C22x13 Final Data Sheet
3.3.7
3. Electrical Specifications
DC POR and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Note The bits PORLEV and VM in the table below refer to bits in the VLT_CR register. See the PSoC Mixed Signal Array Technical
Reference Manual for more information on the VLT_CR register.
Table 3-13. DC POR and LVD Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
Vdd Value for PPOR Trip (positive ramp)
VPPOR0R
PORLEV[1:0] = 00b
VPPOR1R
PORLEV[1:0] = 01b
VPPOR2R
PORLEV[1:0] = 10b
2.908
–
4.394
V
–
4.548
V
V
Vdd Value for PPOR Trip (negative ramp)
VPPOR0
PORLEV[1:0] = 00b
VPPOR1
PORLEV[1:0] = 01b
VPPOR2
PORLEV[1:0] = 10b
2.816
–
4.394
V
–
4.548
V
V
PPOR Hysteresis
VPH0
PORLEV[1:0] = 00b
–
92
–
mV
VPH1
PORLEV[1:0] = 01b
–
0
–
mV
VPH2
PORLEV[1:0] = 10b
–
0
–
mV
Vdd Value for LVD Trip
VLVD0
VM[2:0] = 000b
2.863
2.921
2.979a
V
VLVD1
VM[2:0] = 001b
2.963
3.023
3.083
VLVD2
VM[2:0] = 010b
3.070
3.133
3.196
VLVD3
VM[2:0] = 011b
3.920
4.00
4.080
VLVD4
VM[2:0] = 100b
4.393
4.483
4.573
VLVD5
VM[2:0] = 101b
4.550
4.643
4.736b
VLVD6
VM[2:0] = 110b
4.632
4.727
4.822
VLVD7
VM[2:0] = 111b
4.718
4.814
4.910
V
V
V
V
V
V
V
V
a. Always greater than 50 mV above PPOR (PORLEV = 00) for falling supply.
b. Always greater than 50 mV above PPOR (PORLEV = 10) for falling supply.
June 3, 2004
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CY8C22x13 Final Data Sheet
3.3.8
3. Electrical Specifications
DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-14. DC Programming Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
IDDP
Supply Current During Programming or Verify
–
5
25
mA
VILP
Input Low Voltage During Programming or Verify
–
–
0.8
V
VIHP
Input High Voltage During Programming or Verify
2.2
–
–
V
IILP
Input Current when Applying Vilp to P1[0] or P1[1] During
Programming or Verify
–
–
0.2
mA
Driving internal pull-down resistor.
IIHP
Input Current when Applying Vihp to P1[0] or P1[1] During
Programming or Verify
–
–
1.5
mA
Driving internal pull-down resistor.
VOLV
Output Low Voltage During Programming or Verify
–
–
Vss + 0.75
V
VOHV
Output High Voltage During Programming or Verify
Vdd - 1.0
–
Vdd
V
FlashENPB
Flash Endurance (per block)
50,000
–
–
–
Erase/write cycles per block.
1,800,000
–
–
–
Erase/write cycles.
10
–
–
Years
FlashENT
Flash Endurance
FlashDR
Flash Data Retention
(total)a
a. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of
25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (and so forth to limit the total number of cycles to 36x50,000 and that no single block ever
sees more than 50,000 cycles).
For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to
the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
June 3, 2004
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3.4
3. Electrical Specifications
AC Electrical Characteristics
3.4.1
AC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-15. AC Chip-Level Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FIMO
Internal Main Oscillator Frequency
23.4
24
24.6a
MHz
Trimmed. Utilizing factory trim values.
FCPU1
CPU Frequency (5V Nominal)
0.93
24
24.6a,b
MHz
FCPU2
CPU Frequency (3.3V Nominal)
0.93
12
12.3b,c
MHz
F48M
Digital PSoC Block Frequency
0
48
49.2a,b,d
MHz
F24M
Digital PSoC Block Frequency
0
24
24.6b,e,d
MHz
F32K1
Internal Low Speed Oscillator Frequency
15
32
64
kHz
F32K2
External Crystal Oscillator
–
32.768
–
kHz
Accuracy is capacitor and crystal dependent.
50% duty cycle.
FPLL
PLL Frequency
–
23.986
–
MHz
Is a multiple (x732) of crystal frequency.
Jitter24M2
24 MHz Period Jitter (PLL)
–
–
600
ps
TPLLSLEW
PLL Lock Time
0.5
–
10
ms
TPLLSLEWS-
PLL Lock Time for Low Gain Setting
0.5
–
50
ms
TOS
External Crystal Oscillator Startup to 1%
–
1700
2620
ms
TOSACC
External Crystal Oscillator Startup to 100 ppm
–
2800
3800f
ms
Jitter32k
32 kHz Period Jitter
–
100
TXRST
External Reset Pulse Width
10
–
–
µs
DC24M
24 MHz Duty Cycle
40
50
60
%
Step24M
24 MHz Trim Step Size
–
50
–
kHz
Fout48M
48 MHz Output Frequency
46.8
48.0
49.2a,c
MHz
Jitter24M1
24 MHz Period Jitter (IMO)
–
600
FMAX
Maximum frequency of signal on row input or row output.
–
–
12.3
MHz
TRAMP
Supply Ramp Time
0
–
–
µs
Refer to the AC Digital Block Specifications
below.
LOW
a.
b.
c.
d.
e.
f.
ns
Trimmed. Utilizing factory trim values.
ps
4.75V < Vdd < 5.25V.
Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range.
3.0V < Vdd < 3.6V. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on trimming for operation at 3.3V.
See the individual user module data sheets for information on maximum frequencies for user modules.
3.0V < 5.25V.
The crystal oscillator frequency is within 100 ppm of its final value by the end of the Tosacc period. Correct operation assumes a properly loaded 1 uW maximum drive level
32.768 kHz crystal. 3.0V ≤ Vdd ≤ 5.5V, -40 oC ≤ TA ≤ 85 oC.
PLL
Enable
TPLLSLEW
24 MHz
FPLL
PLL
Gain
0
Figure 3-2. PLL Lock Timing Diagram
June 3, 2004
Document No. 38-12009 Rev. *E
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CY8C22x13 Final Data Sheet
3. Electrical Specifications
PLL
Enable
TPLLSLEWLOW
24 MHz
FPLL
PLL
Gain
1
Figure 3-3. PLL Lock for Low Gain Setting Timing Diagram
32K
Select
32 kHz
TOS
F32K2
Figure 3-4. External Crystal Oscillator Startup Timing Diagram
Jitter24M1
F24M
Figure 3-5. 24 MHz Period Jitter (IMO) Timing Diagram
Jitter32k
F32K2
Figure 3-6. 32 kHz Period Jitter (ECO) Timing Diagram
June 3, 2004
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CY8C22x13 Final Data Sheet
3.4.2
3. Electrical Specifications
AC General Purpose IO Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-16. AC GPIO Specifications
Symbol
FGPIO
Description
Min
Typ
Max
Units
Notes
GPIO Operating Frequency
0
–
12
MHz
TRiseF
Rise Time, Normal Strong Mode, Cload = 50 pF
3
–
18
ns
TFallF
Fall Time, Normal Strong Mode, Cload = 50 pF
2
–
18
ns
Vdd = 4.5 to 5.25V, 10% - 90%
TRiseS
Rise Time, Slow Strong Mode, Cload = 50 pF
10
27
–
ns
Vdd = 3 to 5.25V, 10% - 90%
TFallS
Fall Time, Slow Strong Mode, Cload = 50 pF
10
22
–
ns
Vdd = 3 to 5.25V, 10% - 90%
Vdd = 4.5 to 5.25V, 10% - 90%
90%
GPIO
Pin
10%
TRiseF
TRiseS
TFallF
TFallS
Figure 3-7. GPIO Timing Diagram
June 3, 2004
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24
CY8C22x13 Final Data Sheet
3.4.3
3. Electrical Specifications
AC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Note Settling times, slew rates, and gain bandwidth are based on the Analog Continuous Time PSoC block.
Table 3-17. 5V AC Operational Amplifier Specifications
Symbol
TROA
TSOA
SRROA
Description
Min
Typ
Max
Power = Low
–
Power = Low, Opamp Bias = High
–
Power = Medium
–
Power = Medium, Opamp Bias = High
–
Power = High
–
Power = High, Opamp Bias = High
–
–
3.9
µs
Power = Low
–
Power = Low, Opamp Bias = High
–
Power = Medium
–
Power = Medium, Opamp Bias = High
–
Power = High
–
Power = High, Opamp Bias = High
0.72
–
0.62
µs
µs
–
5.9
µs
µs
µs
0.92
–
–
0.72
0.15
–
µs
µs
µs
Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain)
V/µs
V/µs
Specification minimums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
V/µs
Power = Medium, Opamp Bias = High
V/µs
1.7
–
6.5
–
V/µs
0.01
–
V/µs
V/µs
Power = High
Power = High, Opamp Bias = High
Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low
V/µs
Power = Low, Opamp Bias = High
Specification minimums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
V/µs
Power = Medium
Power = Medium, Opamp Bias = High
V/µs
0.5
–
4.0
–
V/µs
0.75
–
MHz
V/µs
Power = High
Power = High, Opamp Bias = High
Gain Bandwidth Product
Power = Low
MHz
Power = Low, Opamp Bias = High
Specification minimums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
MHz
Power = Medium
3.1
–
Power = High, Opamp Bias = High
5.4
–
Noise at 1 kHz (Power = Medium, Opamp Bias = High)
–
200
Power = Medium, Opamp Bias = High
MHz
MHz
Power = High
June 3, 2004
Specification maximums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
µs
–
Power = Medium
ENOA
Notes
Specification maximums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
µs
–
Power = Low, Opamp Bias = High
BWOA
µs
Falling Settling Time from 20% of ∆V to 0.1% of ∆V (10 pF
load, Unity Gain)
Power = Low
SRFOA
Units
Rising Settling Time from 80% of ∆V to 0.1% of ∆V (10 pF
load, Unity Gain)
MHz
–
Document No. 38-12009 Rev. *E
nV/rt-Hz
25
CY8C22x13 Final Data Sheet
3. Electrical Specifications
Table 3-18. 3.3V AC Operational Amplifier Specifications
Symbol
TROA
TSOA
SRROA
Description
Min
Typ
Max
–
Power = Low, Opamp Bias = High
–
Power = Medium
–
Power = Medium, Opamp Bias = High
–
–
0.72
µs
Power = High (3.3 Volt High Bias Operation not supported)
–
–
–
µs
Power = High, Opamp Bias = High (3.3 Volt High Power,
High Opamp Bias not supported)
–
–
–
µs
–
3.92
µs
Falling Settling Time from 20% of ∆V to 0.1% of ∆V (10 pF
load, Unity Gain)
–
5.41
µs
Power = Low
–
Power = Low, Opamp Bias = High
–
Power = Medium
–
Power = Medium, Opamp Bias = High
–
–
0.72
µs
Power = High (3.3 Volt High Bias Operation not supported)
–
–
–
µs
Power = High, Opamp Bias = High (3.3 Volt High Power,
High Opamp Bias not supported)
–
–
–
µs
0.31
–
µs
Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain)
V/µs
V/µs
Specification minimums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
V/µs
V/µs
Power = Medium, Opamp Bias = High
2.7
–
Power = High (3.3 Volt High Bias Operation not supported)
–
–
–
V/µs
Power = High, Opamp Bias = High (3.3 Volt High Power,
High Opamp Bias not supported)
–
–
–
V/µs
0.24
–
Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low
V/µs
V/µs
Power = Low, Opamp Bias = High
Specification minimums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
V/µs
Power = Medium
V/µs
Power = Medium, Opamp Bias = High
1.8
–
Power = High (3.3 Volt High Bias Operation not supported)
–
–
–
V/µs
Power = High, Opamp Bias = High (3.3 Volt High Power,
High Opamp Bias not supported)
–
–
–
V/µs
0.67
–
Gain Bandwidth Product
Power = Low
MHz
Power = Low, Opamp Bias = High
MHz
Power = Medium
Specification minimums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
MHz
Power = Medium, Opamp Bias = High
2.8
–
Power = High (3.3 Volt High Bias Operation not supported)
–
–
–
MHz
Power = High, Opamp Bias = High (3.3 Volt High Power,
High Opamp Bias not supported)
–
–
–
MHz
Noise at 1 kHz (Power = Medium, Opamp Bias = High)
–
200
–
nV/rt-Hz
June 3, 2004
Specification maximums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
µs
Power = Medium
ENOA
Notes
Specification maximums for low power and
high opamp bias, medium power, and
medium power and high opamp bias levels
are between low and high power levels.
µs
Power = Low, Opamp Bias = High
BWOA
µs
Power = Low
Power = Low
SRFOA
Units
Rising Settling Time from 80% of ∆V to 0.1% of ∆V (10 pF
load, Unity Gain)
MHz
Document No. 38-12009 Rev. *E
26
CY8C22x13 Final Data Sheet
3.4.4
3. Electrical Specifications
AC Digital Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-19. AC Digital Block Specifications
Function
Timer
Counter
Dead Band
Description
Min
Typ
Max
Units
Capture Pulse Width
50a
–
–
ns
Maximum Frequency, No Capture
–
–
49.2
MHz
Maximum Frequency, With Capture
–
–
24.6
MHz
Enable Pulse Width
50a
–
–
ns
Maximum Frequency, No Enable Input
–
–
49.2
MHz
Maximum Frequency, Enable Input
–
–
24.6
MHz
Asynchronous Restart Mode
20
–
–
ns
Synchronous Restart Mode
50a
–
–
ns
a
–
–
ns
Notes
4.75V < Vdd < 5.25V.
4.75V < Vdd < 5.25V.
Kill Pulse Width:
Disable Mode
50
–
–
49.2
MHz
4.75V < Vdd < 5.25V.
CRCPRS
Maximum Input Clock Frequency
(PRS Mode)
Maximum Frequency
–
–
49.2
MHz
4.75V < Vdd < 5.25V.
CRCPRS
Maximum Input Clock Frequency
(CRC Mode)
–
–
24.6
MHz
SPIM
Maximum Input Clock Frequency
–
–
8.2
MHz
SPIS
Maximum Input Clock Frequency
–
–
4.1
ns
Width of SS_ Negated Between Transmissions
50a
–
–
ns
Transmitter
Maximum Input Clock Frequency
–
–
16.4
MHz
Receiver
Maximum Input Clock Frequency
–
16
49.2
MHz
4.75V < Vdd < 5.25V.
a. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).
June 3, 2004
Document No. 38-12009 Rev. *E
27
CY8C22x13 Final Data Sheet
3.4.5
3. Electrical Specifications
AC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-20. 5V AC Analog Output Buffer Specifications
Symbol
TROB
TSOB
SRROB
SRFOB
BWOB
BWOB
Description
Min
Typ
Max
Units
Notes
Rising Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
–
–
2.5
µs
Power = High
–
–
2.5
µs
Power = Low
–
–
2.2
µs
Power = High
–
–
2.2
µs
Power = Low
0.65
–
–
V/µs
Power = High
0.65
–
–
V/µs
Power = Low
0.65
–
–
V/µs
Power = High
0.65
–
–
V/µs
Power = Low
0.8
–
–
MHz
Power = High
0.8
–
–
MHz
Power = Low
300
–
–
kHz
Power = High
300
–
–
kHz
Falling Settling Time to 0.1%, 1V Step, 100pF Load
Rising Slew Rate (20% to 80%), 1V Step, 100pF Load
Falling Slew Rate (80% to 20%), 1V Step, 100pF Load
Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load
Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load
Table 3-21. 3.3V AC Analog Output Buffer Specifications
Symbol
TROB
TSOB
SRROB
SRFOB
BWOB
BWOB
Description
Min
Typ
Max
Units
Notes
Rising Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
–
–
3.8
µs
Power = High
–
–
3.8
µs
Power = Low
–
–
2.6
µs
Power = High
–
–
2.6
µs
Power = Low
0.5
–
–
V/µs
Power = High
0.5
–
–
V/µs
Power = Low
0.5
–
–
V/µs
Power = High
0.5
–
–
V/µs
Power = Low
0.7
–
–
MHz
Power = High
0.7
–
–
MHz
Power = Low
200
–
–
kHz
Power = High
200
–
–
kHz
Falling Settling Time to 0.1%, 1V Step, 100pF Load
Rising Slew Rate (20% to 80%), 1V Step, 100pF Load
Falling Slew Rate (80% to 20%), 1V Step, 100pF Load
Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load
Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load
June 3, 2004
Document No. 38-12009 Rev. *E
28
CY8C22x13 Final Data Sheet
3.4.6
3. Electrical Specifications
AC External Clock Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-22. 5V AC External Clock Specifications
Symbol
Description
Min
Typ
Max
Units
FOSCEXT
Frequency
0
–
24.24
MHz
–
High Period
20.6
–
–
ns
–
Low Period
20.6
–
–
ns
–
Power Up IMO to Switch
150
–
–
µs
Notes
Table 3-23. 3.3V AC External Clock Specifications
Symbol
FOSCEXT
Description
Min
a
Frequency with CPU Clock divide by 1
Typ
Max
Units
0
–
12.12
MHz
FOSCEXT
Frequency with CPU Clock divide by 2 or greaterb
0
–
24.24
MHz
–
High Period with CPU Clock divide by 1
41.7
–
–
ns
–
Low Period with CPU Clock divide by 1
41.7
–
–
ns
–
Power Up IMO to Switch
150
–
–
µs
Notes
a. Maximum CPU frequency is 12 MHz at 3.3V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements.
b. If the frequency of the external clock is greater than 12 MHz, the CPU clock divider must be set to 2 or greater. In this case, the CPU clock divider will ensure that the fifty percent duty cycle requirement is met.
3.4.7
AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-24. AC Programming Specifications
Symbol
Description
Min
Typ
Max
Units
TRSCLK
Rise Time of SCLK
1
–
20
ns
TFSCLK
Fall Time of SCLK
1
–
20
ns
TSSCLK
Data Set up Time to Falling Edge of SCLK
40
–
–
ns
THSCLK
Data Hold Time from Falling Edge of SCLK
40
–
–
ns
FSCLK
Frequency of SCLK
0
–
8
MHz
TERASEB
Flash Erase Time (Block)
–
15
–
ms
TWRITE
Flash Block Write Time
–
30
–
ms
TDSCLK
Data Out Delay from Falling Edge of SCLK
–
–
45
ns
June 3, 2004
Document No. 38-12009 Rev. *E
Notes
29
CY8C22x13 Final Data Sheet
3.4.8
3. Electrical Specifications
AC I2C Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only or unless otherwise specified.
Table 3-25. AC Characteristics of the I2C SDA and SCL Pins
Standard Mode
Symbol
Description
Min
Fast Mode
Max
Min
Max
Units
FSCLI2C
SCL Clock Frequency
0
100
0
400
kHz
THDSTAI2C
Hold Time (repeated) START Condition. After this
period, the first clock pulse is generated.
4.0
–
0.6
–
µs
TLOWI2C
LOW Period of the SCL Clock
4.7
–
1.3
–
µs
THIGHI2C
HIGH Period of the SCL Clock
4.0
–
0.6
–
µs
TSUSTAI2C
Set-up Time for a Repeated START Condition
4.7
–
0.6
–
µs
THDDATI2C
Data Hold Time
0
–
0
–
µs
TSUDATI2C
Data Set-up Time
250
–
100
–
ns
TSUSTOI2C
Set-up Time for STOP Condition
4.0
–
0.6
–
µs
TBUFI2C
Bus Free Time Between a STOP and START Condition 4.7
–
1.3
–
µs
TSPI2C
Pulse Width of spikes are suppressed by the input filter.
–
0
50
ns
–
a
Notes
a. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT ≥ 250 ns must then be met. This will automatically be
the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data
bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
SDA
TLOWI2C
TSUDATI2C
THDSTAI2C
TSPI2C
TBUFI2C
SCL
S THDSTAI2C THDDATI2C THIGHI2C
TSUSTAI2C
Sr
TSUSTOI2C
P
S
Figure 3-8. Definition for Timing for Fast/Standard Mode on the I2C Bus
June 3, 2004
Document No. 38-12009 Rev. *E
30
4. Packaging Information
This chapter illustrates the packaging specifications for the CY8C22x13 PSoC device, along with the thermal impedances for each
package and the typical package capacitance on crystal pins.
4.1
Packaging Dimensions
51-85075 - *A
Figure 4-1. 8-Lead (300-Mil) PDIP
May 2004
© Cypress MicroSystems, Inc. 2003 — Document No. 38-12009 Rev. *E
31
CY8C22x13 Final Data Sheet
4. Packaging Information
51-85066
*B
51-85066
- *C
Figure 4-2. 8-Lead (150-Mil) SOIC
51-85011-A
51-85011
- *A
Figure 4-3. 20-Lead (300-Mil) Molded DIP
June 3, 2004
Document No. 38-12009 Rev. *E
32
CY8C22x13 Final Data Sheet
4. Packaging Information
51-85077 - *C
Figure 4-4. 20-Lead (210-Mil) SSOP
51-85024 - *B
Figure 4-5. 20-Lead (300-Mil) Molded SOIC
June 3, 2004
Document No. 38-12009 Rev. *E
33
CY8C22x13 Final Data Sheet
4. Packaging Information
X = 138 MIL
Y = 138 MIL
32
51-85188 - **
Figure 4-6. 32-Lead (5x5 mm) MLF
4.2
Thermal Impedances
Table 4-1. Thermal Impedances per Package
Package
Typical θJA *
8 PDIP
123 oC/W
8 SOIC
185 oC/W
20 PDIP
109 oC/W
20 SSOP
117 oC/W
20 SOIC
81 oC/W
32 MLF
22 oC/W
* TJ = TA + POWER x θJA
4.3
Capacitance on Crystal Pins
Table 4-2: Typical Package Capacitance on Crystal Pins
Package
Package Capacitance
8 PDIP
2.8 pF
8 SOIC
2.0 pF
20 PDIP
3.0 pF
20 SSOP
2.6 pF
20 SOIC
2.5 pF
32 MLF
2.0 pF
June 3, 2004
Document No. 38-12009 Rev. *E
34
5. Ordering Information
The following table lists the CY8C22x13 PSoC Device family’s key package features and ordering codes.
Digital IO Pins
Analog Inputs
Analog Outputs
XRES Pin
-40C to +85C
4
3
6
4
1
No
No
-40C to +85C
4
3
6
4
1
No
8 Pin (150 Mil) SOIC
(Tape and Reel)
CY8C22113-24SIT
2
256
No
-40C to +85C
4
3
6
4
1
No
20 Pin (300 Mil) DIP
CY8C22213-24PI
2
256
No
-40C to +85C
4
3
16
8
1
Yes
20 Pin (210 Mil) SSOP
CY8C22213-24PVI
2
256
No
-40C to +85C
4
3
16
8
1
Yes
20 Pin (210 Mil) SSOP
(Tape and Reel)
CY8C22213-24PVIT
2
256
No
-40C to +85C
4
3
16
8
1
Yes
20 Pin (300 Mil) SOIC
CY8C22213-24SI
2
256
No
-40C to +85C
4
3
16
8
1
Yes
20 Pin (300 Mil) SOIC
(Tape and Reel)
CY8C22213-24SIT
2
256
No
-40C to +85C
4
3
16
8
1
Yes
32 Pin (5x5 mm) MLF
CY8C22213-24LFI
2
256
No
-40C to +85C
4
3
16
8
1
Yes
5.1
(Columns of 3)
No
256
Analog Blocks
Temperature
Range
256
2
(Rows of 4)
Switch Mode
Pump
2
CY8C22113-24SI
Digital Blocks
RAM (Bytes)
CY8C22113-24PI
8 Pin (150 Mil) SOIC
Ordering
Code
8 Pin (300 Mil) DIP
Package
Flash (Kbytes)
Table 5-1. CY8C22x13 PSoC Device Family Key Features and Ordering Information
Ordering Code Definitions
CY 8 C 22 xxx-SPxx
Package Type:
P = PDIP
S = SOIC
PV = SSOP
LF = MLF
A = TQFP
Thermal Rating:
C = Commercial
I = Industrial
E = Extended
Speed: 24 MHz
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = Cypress MicroSystems
Company ID: CY = Cypress
June 3, 2004
Document No. 38-12009 Rev. *E
35
6. Sales and Company Information
To obtain information about Cypress MicroSystems or PSoC sales and technical support, reference the following information or go to
the section titled “Getting Started” on page 4 in this document.
Cypress MicroSystems
2700 162nd Street SW
Building D
Lynnwood, WA 98037
Phone:
Facsimile:
800.669.0557
425.787.4641
Web Sites:
Company Information – http://www.cypress.com
Sales – http://www.cypress.com/aboutus/sales_locations.cfm
Technical Support – http://www.cypress.com/support/login.cfm
6.1
Revision History
Table 6-1. CY8C22x13 Data Sheet Revision History
Document Title:
CY8C22113 and CY8C22213 PSoC Mixed Signal Array Final Data Sheet
Document Number:
Revision
38-12009
ECN #
Issue Date
Origin of Change
Description of Change
**
128180
06/30/2003
New Silicon.
New document – Advanced Data Sheet (two page product brief).
*A
129202
09/16/2003
NWJ
New document – Preliminary Data Sheet (300 page product detail).
*B
130127
10/15/2003
NWJ
Revised document for Silicon Revision A.
*C
131679
12/05/2003
NWJ
Changes to Electrical Specifications section, Miscellaneous changes to I2C, GDI, RDI,
Registers, and Digital Block chapters.
*D
131803
12/22/2003
NWJ
Changes to Electrical Specifications and miscellaneous small changes throughout the
data sheet.
*E
229421
06/03/2004
SFV
New data sheet format and organization. Reference the PSoC Mixed Signal Array Technical Reference Manual for additional information. Title change.
Distribution: External/Public
6.2
Posting: None
Copyrights
© Cypress MicroSystems, Inc. 2004. All rights reserved. PSoC™ (Programmable System-on-Chip™) are trademarks of Cypress MicroSystems, Inc. All other trademarks
or registered trademarks referenced herein are property of the respective corporations.
The information contained herein is subject to change without notice. Cypress MicroSystems assumes no responsibility for the use of any circuitry other than circuitry
embodied in a Cypress MicroSystems product. Nor does it convey or imply any license under patent or other rights. Cypress MicroSystems does not authorize its products
for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of
Cypress MicroSystems products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress MicroSystems against all charges. Cypress MicroSystems products are not warranted nor intended to be used for medical, life-support, life-saving, critical control or safety
applications, unless pursuant to an express written agreement with Cypress MicroSystems.
June 2004
© Cypress MicroSystems, Inc. 2004 — Document No. 38-12009 Rev. *E
36