HSMC H34063A Dc-to-dc converter integrate circuit device Datasheet

HI-SINCERITY
Spec. No. : IC200407
Issued Date : 2003.04.01
Revised Date : 2005.03.25
Page No. : 1/7
MICROELECTRONICS CORP.
H34063AP / H34063AS
DC-TO-DC CONVERTER INTEGRATE CIRCUIT DEVICES
8-Lead Plastic DIP-8
Package Code: P
Description
The H34063A Series is a monolithic control circuit containing the primary functions
required for DC-to-DC converters. These devices consist of an internal temperature
compensated reference, comparator, controlled duty cycle oscillator with an active
current limit circuit, driver and high current output switch. This series was
specifically by Hi-Sincerity Microelectronics Corp.
•
8-Lead Plastic SO-8
Package Code: S
Features
• 3V to 40V Input Voltage Operation
• Internal 1.6A Peak Current Switch
• Internal ±1.8% Reference
• Low Quiescent Current at 1.6mA
• Frequency Operation from 100Hz~100KHz
• Output Voltage Adjustable
• Active Current Limiting
• Step-Up, Step-Down or Inverting Switching Regulators
Pin Connections
8
1
7
2
6
3
5
4
Pin1: Switch Collector (SWC)
Pin5: Comparator Inverting Input (FB)
Pin2: Switch Emitter (SWE)
Pin6: Voltage Supply (Vcc)
Pin3: Timing Capacitor (TC)
Pin7: Ipk Sense (Ipk)
Pin4: Ground (GND)
Pin8: Voltage Driver Collector (DRC)
Absolute Maxium Rating
Parameter
Symbol
Value
Unit
Power Supply Voltage
VCC
40
V
Comparator Input Voltage Range
Vir
-0.3~+40
V
Switch Collector Voltage
VC(SW)
40
V
Switch Emitter Voltage
VSWE
40
V
Switch Emitter to Collector Voltage
VCE
40
V
VC(DR)
40
V
Switch Current
ISW
1.5
A
Power Dissipation at TJ=20oC
PD
Operating Ambient Temperature Range
Topr
Driver Collector Voltage
Storage Temperature Range
Tstg
Operating Junction Temperature
Topj
Thermal Resistance Junction-ambient
θJA
H34063AP, H34063AS
DIP-8
1.25
SO-8
0.625
W
0~+70
o
C
-65~+150
o
C
120
o
C
125
o
C/W
HSMC Product Specification
HI-SINCERITY
Spec. No. : IC200407
Issued Date : 2003.04.01
Revised Date : 2005.03.25
Page No. : 2/7
MICROELECTRONICS CORP.
Electrical Characteristics (VCC=5V,TA=0~70°C, unless otherwise specified)
Parameter
Symbol
Test Condition
Min.
Typ.
Max.
Unit
10
25
40
uA
140
190
240
uA
28
33
40
KHz
5.2
6
7.5
250
300
350
mV
Oscillator
Charging Current
VCC=5~40V, Ta=25oC
Ichg
Discharge Current
o
Idischg
Frequency
VCC=5~40V, Ta=25 C
o
fOSC
Discharge to Charge Current Ratio
Current Limit Sense Voltage
VPIN5=0, CT=1nF, Ta=25 C
Idischg/Ichg
o
VPIN7=VCC, Ta=25 C
o
VIPK
Idischg=Ichg, Ta=25 C
Output Switch
Saturation Voltage,
Darlington Connection
Saturation Voltage
DC Current Gain
VCE(sat) 1
ISW =1A, VC(SW)=VC(DR)
-
1
1.3
V
VCE(sat) 2
ISW =1A, IC(DR)=50mA
-
0.4
0.7
V
35
120
-
-
10
100
uA
1.23
1.25
1.27
V
VCC=5~40V
-
1.5
6
mV
IIB
VIN=0V
-
40
400
nA
ICC
VCC=5~40V, VPIN7=VCC, VPin5>VFB,
CT=0.001uF, Pin7=GND,
Remaining pins open
-
1.6
3
mA
hFE
Collector Off-State Current
ICC(off)
ISW =1A, VCE=5V
o
VCE=40V, Ta=25 C
Comparator
Threshold Voltage
VFB
Threshold Voltage Line Regulation
Input Bias Current
∆VFB
Total Device
Supply Current
Block Diagram
DRI
SC
Pin8: Driver Collector
Pin1: 1.6A Switch Collector
Q
Q2
Q1
S
R
80Ω
IPK
SE
Pin2: Darlington Switch Emitter
IPK
CT
Pin7: Highside Current Sense
Input, VCC-VIPK=300mV
Oscillator
VCC
TC
Comparator
Pin3: Oscilletor Timing Capacitor
1.25V
Reference Voltage
GND
Pin4: Power GND
H34063AP, H34063AS
Pin6: Power Supply Input
+
FB
Pin5: Feedback Comparator
Inverting Input
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200407
Issued Date : 2003.04.01
Revised Date : 2005.03.25
Page No. : 3/7
Application Information
Design Formula Table
Calculation
Step-Down
Step-Up
Voltage-Inverting
ton/toff
(Vout+VF)/(Vin(min) -Vsat-Vout)
(Vout+VF-Vin(min))/(Vin(min)-Vsat)
(|Vout|+VF)/(Vin(max)-Vsat)
(ton+toff) max
1/Fmin
1/Fmin
1/Fmin
-5
-5
CT
4*10 ton
4*10 ton
4*10-5ton
IC(sw)
2*Iout(max)
2*Iout(max)(ton+toff/toff)
2*Iout(max)(ton+toff/toff)
RS
0.3/IC(sw)
0.3/IC(sw)
0.3/IC(sw)
L(min)
(Vin(min)-Vsat/Ipk(sw))*ton(max)
(Vin(min)-Vsat/Ipk(sw))*ton(max)
(Vin(min)-Vsat/Ipk(sw))*ton(max)
CO
(Ipk(sw)*(ton+toff))/(8*Vripple(P-P))
Iout*ton/Vripple(P-P)
Iout*ton/Vripple(P-P)
Vsat: Saturation voltage of the output switch.
VF: Forward voltage drop of the ringback rectifier.
The following power supply characteristics must be chosen:
Vin: Nominal input voltage.
Vout: Desired output voltage. |Vout|=1.25*(1+RB/RA)
Iout: Desired output current
Fmin: Minimum desired output switching frequency at the selected values for Vin and Iout.
Vripple(P-P): Desired peak to peak output ripple voltage in practice, the calculated value will need to be increased due to
the capacitor equivalent series resistance and board layout. The ripple voltage should be kept to a low value since it
will directly effect the line and load regulation.
H34063AP, H34063AS
HSMC Product Specification
HI-SINCERITY
Spec. No. : IC200407
Issued Date : 2003.04.01
Revised Date : 2005.03.25
Page No. : 4/7
MICROELECTRONICS CORP.
Application Information (Continuos)
Fig.2 Step-Up Converter
D1
L1
200uH
R1
150Ω
H1N5819
H34063A
RSC
0.22
Vin
C1
100uF
8
1
7
2
6
3
5
4
Vout
28V / 200mA
Cout
220uF
CT
680pF
RB
47kΩ
RA
2.2kΩ
Line Regulation: 100mV (Vin=8V~16V, @Io=200mA)
Load Regulation: 5mV (Vin=12V, @Io=80mA~200mA)
Fig.3 Step-Up Converter With External NPN Switch
L1
R1
Vout
D1
H34063A
RSC
Vin
C1
8
1
7
2
6
3
5
4
Q1
CT
Cout
R2
RB
RA
Fig.4 Step-Down Converter
L1
200uH
H34063A
RSC
0.25
Vin
8
1
7
2
6
3
5
4
D1
Vout
5V / 500mA
Cout
470uF
H1N5819
CT
470pF
RB
C1
100uF
RA
3.6kΩ
1.2kΩ
Line Regulation: 40mV (Vin=10V~20V, @Io=500mA)
Load Regulation: 5mV (Vin=15V, @Io=10mA~500mA)
Short Circuit Current: 1.3A (Vin=15V, @RL=0.1Ω
H34063AP, H34063AS
HSMC Product Specification
HI-SINCERITY
Spec. No. : IC200407
Issued Date : 2003.04.01
Revised Date : 2005.03.25
Page No. : 5/7
MICROELECTRONICS CORP.
Fig.5 Step-Down Converter With External PNP Saturation Switch
R1
H34063A
RSC
Vin
8
1
7
2
6
3
5
4
R2
Q1
L1
Vout
CT
D1
Cout
RB
C1
RA
Fig.6 Voltage Inverting Converter
D1
H34063A
RSC
0.25
Vin
4.5V-6V
H1N5819
Vout
-12V / 100mA
8
1
7
2
L1
Cout
6
3
100uH
470uF
4
5
C1
CT
680pF
RA
100uF
953Ω
RB
8.2kΩ
Line Regulation: 20mV (Vin=4.5V~6V, @Io=100mA)
Load Regulation: 100mV (Vin=5V, @Io=10mA~100mA)
Fig.7 Voltage Inverting Converter With External PNP Saturation Switch
H34063A
RSC
Vin
8
1
7
2
6
3
5
4
R2
R1
Q1
L1
D1
CT
RA
Vout
C1
RB
H34063AP, H34063AS
Cout
HSMC Product Specification
HI-SINCERITY
Spec. No. : IC200407
Issued Date : 2003.04.01
Revised Date : 2005.03.25
Page No. : 6/7
MICROELECTRONICS CORP.
DIP-8 Dimension
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
α1
Marking:
8
6
7
5
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
A
1
2
3
4
H
3 4 0 6 3 A
P
Control Code
Date Code
B
J
Note: Green label is used for pb-free packing
Pin Style: 1.SWC 2.SWE 3.TC 4.GND
5.FB 6.VCC 7.Ipk 8.DRC
F
E
C
α1 K
G
Max.
6.40
9.32
*1.52
*1.27
*0.99
3.35
3.55
0.53
2.79
7.74
*3.00
8.81
0.381
97o
*: Typical, Unit: mm
M
H
D
I
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
Min.
6.29
9.22
3.25
3.17
0.38
2.28
7.49
8.56
0.229
94o
L
8-Lead DIP-8
Plastic Package
HSMC Package Code: P
SO-8 Dimension
A
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
Marking:
G
Pb Free Mark
8
7
B
6
5
C
Pin1 Index
2
3
Pb-Free: " . " (Note) H
Normal: None
I
Pin 1 Index
Date Code
H
Pin Style: 1.SWC 2.SWE 3.TC 4.GND
5.FB 6.VCC 7.Ipk 8.DRC
K
E
Part A
Part A
Control Code
Note: Green label is used for pb-free packing
4
J
D
S
3 4 0 6 3 A
M
L
N
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
Min.
4.85
3.85
5.80
1.22
0.37
3.74
1.45
4.80
0.05
0.30
0.19
0.37
0.23
0.08
0.00
Max.
5.10
3.95
6.20
1.32
0.47
3.88
1.65
5.10
0.20
0.70
0.25
0.52
0.28
0.13
0.15
*: Typical, Unit: mm
O
F
8-Lead SO-8 Plastic
Surface Mounted Package
HSMC Package Code: S
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H34063AP, H34063AS
HSMC Product Specification
HI-SINCERITY
Spec. No. : IC200407
Issued Date : 2003.04.01
Revised Date : 2005.03.25
Page No. : 7/7
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
tP
Critical Zone
TL to TP
TP
Ramp-up
TL
tL
Temperature
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
<3 C/sec
<3oC/sec
- Temperature Min (Tsmin)
100oC
150oC
- Temperature Max (Tsmax)
150oC
200oC
60~120 sec
60~180 sec
<3oC/sec
<3oC/sec
183oC
217oC
60~150 sec
60~150 sec
240oC +0/-5oC
260oC +0/-5oC
10~30 sec
20~40 sec
<6oC/sec
<6oC/sec
<6 minutes
<8 minutes
Peak temperature
Dipping time
245 C ±5 C
5sec ±1sec
Average ramp-up rate (TL to TP)
o
Preheat
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Time within 5oC of actual Peak
Temperature (tP)
Ramp-down Rate
Time 25oC to Peak Temperature
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
H34063AP, H34063AS
o
o
o
o
260 C +0/-5 C
5sec ±1sec
HSMC Product Specification
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