DS8921, DS8921A, DS8921AT www.ti.com SNLS374C – MAY 1998 – REVISED APRIL 2013 DS8921/DS8921A/DS8921AT Differential Line Driver and Receiver Pair Check for Samples: DS8921, DS8921A, DS8921AT FEATURES DESCRIPTION • • • The DS8921, DS8921A are Differential Line Driver and Receiver pairs designed specifically for applications meeting the ST506, ST412 and ESDI Disk Drive Standards. In addition, these devices meet the requirements of the EIA Standard RS-422. 1 2 • • • • • 12 ns Typical Propagation Delay Output Skew - 0.5 ns Typical Meet the Requirements of EIA Standard RS422 Complementary Driver Outputs High Differential or Common-Mode Input Voltage Ranges of ±7V ±0.2V Receiver Sensitivity over the Input Voltage Range Receiver Input Hysteresis-70 mV Typical DS8921AT Industrial Temperature Operation: (−40°C to +85°C) The DS8921, DS8921A receivers offer an input sensitivity of 200 mV over a ±7V common mode operating range. Hysteresis is incorporated (typically 70 mV) to improve noise margin for slowly changing input waveforms. The DS8921, DS8921A drivers are designed to provide unipolar differential drive to twisted pair or parallel wire transmission lines. Complementary outputs are logically ANDed and provide an output skew of 0.5 ns (typ.) with propagation delays of 12 ns. The DS8921, DS8921A are compatible with TTL and CMOS. designed to be Connection Diagram DS8921/DS8921A/DS8921AT See Package Number D (R-PDSO-G8) or P (R-PDIP-T8) Truth Table Receiver Input Driver VOUT Input VOUT VOUT VID ≥ VTH (MAX) 1 1 1 0 VID ≤ VTH (MIN) 0 0 0 1 Open 1 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated DS8921, DS8921A, DS8921AT SNLS374C – MAY 1998 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 7V −0.5V to +7V Driver Input Voltage Output Voltage 5.5V Receiver Output Sink Current 50 mA Receiver Input Voltage ±10V Differential Input Voltage ±12V Maximum Package Power Dissipation @ +25°C D Package 730 mW P Package 1160 mW Derate D Package 9.3 mW/°C above +25°C Derate P Package 5.8 mW/°C above +25°C −65°C to +165°C Storage Temperature Range Lead Temperature +260°C (Soldering, 4 sec.) +260°C Maximum Junction Temperature (1) (2) +150°C “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the device should be operated at these limits. The Table of Electrical Characteristics provides conditions for actual device operation. If Military/Aerospace specified devices are required, please contact the Texas Instrument Sales Office/ Distributors for availability and specifications. Recommended Operating Conditions Supply Voltage Min Max Units 4.5 5.5 V 0 70 °C −40 +85 °C Temperature (TA) DS8921/DS8921A DS8921AT 2 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8921 DS8921A DS8921AT DS8921, DS8921A, DS8921AT www.ti.com SNLS374C – MAY 1998 – REVISED APRIL 2013 DS8921/DS8921A Electrical Characteristics Symbol (1) (2) (3) Conditions Min Typ Max Units +200 mV RECEIVER VTH −7V ≤ VCM ≤ +7V −200 ±35 VHYST −7V ≤ VCM ≤ +7V 15 70 mV RIN VIN = −7V, +7V 4.0 6.0 kΩ (Other Input = GND) IIN VIN = 10V VIN = −10V VOH IOH = −400 μA VOL IOL = 8 mA ISC VCC = MAX, VOUT = 0V 3.25 mA −3.25 mA 2.5 V −15 0.5 V −100 mA DRIVER VIH 2.0 V VIL −40 0.8 V IIL VCC = MAX, VIN = 0.4V −200 μA IIH VCC = MAX, VIN = 2.7V 20 μA II VCC = MAX, VIN = 7.0V 100 μA VCL VCC = MIN, IIN = −18 mA −1.5 V VOH VCC = MIN, IOH = −20 mA VOL VCC = MIN, IOL = +20 mA 0.5 V IOFF VCC = 0V, V OUT = 5.5V 100 μA 0.4 V 2.5 V |VT| – |VT | VT 2.0 V |VOS – VOS | ISC −30 VCC = MAX, VOUT = 0V 0.4 V −150 mA 35 mA DRIVER and RECEIVER ICC (1) (2) (3) VCC = MAX, VOUT = Logic 0 All currents into device pins are shown as positive values; all currents out of the device are shown as negative; all voltages are referenced to ground unless otherwise specified. All values shown as max or min are classified on absolute value basis. All typical values are VCC = 5V, TA = 25°C. Only one output at a time should be shorted. Receiver Switching Characteristics Symbol TpLH Conditions Min CL = 30 pF Typ Max Units 8921 8921A 8921AT 14 22.5 20 20 ns 14 22.5 20 20 ns 0.5 5 3.5 5 ns (Figure 1 and Figure 2 ) TpHL CL = 30 pF (Figure 1 and Figure 2) |TpLH–T pHL| CL = 30 pF (Figure 1 and Figure 2 ) Driver Switching Characteristics SINGLE ENDED CHARACTERISTICS Symbol TpLH Conditions Min CL = 30 pF Typ Max Units 8921 8921A 8921AT 10 15 15 15 ns 10 15 15 15 ns (Figure 3 and Figure 4) TpHL CL = 30 pF Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8921 DS8921A DS8921AT Submit Documentation Feedback 3 DS8921, DS8921A, DS8921AT SNLS374C – MAY 1998 – REVISED APRIL 2013 www.ti.com Driver Switching Characteristics (continued) SINGLE ENDED CHARACTERISTICS Symbol Conditions Min Typ Max Units 8921 8921A 8921AT 5 8 8 9.5 ns 5 8 8 9.5 ns 1 5 3.5 3.5 ns (Figure 3 and Figure 4) TTLH CL = 30 pF (Figure 7 and Figure 8) TTHL CL = 30 pF (Figure 7 and Figure 8) CL = 30 pF (1) Skew (Figure 3 and Figure 4) (1) Difference between complementary outputs at the 50% point. Driver Switching Characteristics (1) DIFFERENTIAL CHARACTERISTICS Symbol TpLH Conditions Min CL = 30 pF Typ Max Units 8921 8921A 8921AT 10 15 15 15 ns 10 15 15 15 ns 0.5 6 2.75 2.75 ns (Figure 3, Figure 5, and Figure 6) TpHL CL = 30 pF (Figure 3, Figure 5, and Figure 6) |TpLH–T pHL| CL = 30 pF (Figure 3, Figure 5, and Figure 6) (1) Differential Delays are defined as calculated results from single ended rise and fall time measurements. This approach in establishing AC performance specifications has been taken due to limitations of available Automatic Test Equipment (ATE). The calculated ATE results assume a linear transition between measurement points and are a result of the following equations: Tcr = Crossing Point Tra, Trb, Tfa and T fb are time measurements with respect to the input. See Figure 6. Where: AC Test Circuits and Switching Diagrams Figure 1. 4 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8921 DS8921A DS8921AT DS8921, DS8921A, DS8921AT www.ti.com SNLS374C – MAY 1998 – REVISED APRIL 2013 Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8921 DS8921A DS8921AT Submit Documentation Feedback 5 DS8921, DS8921A, DS8921AT SNLS374C – MAY 1998 – REVISED APRIL 2013 www.ti.com Figure 8. TYPICAL APPLICATIONS Figure 9. ST506 and ST412 Application 6 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8921 DS8921A DS8921AT DS8921, DS8921A, DS8921AT www.ti.com SNLS374C – MAY 1998 – REVISED APRIL 2013 Figure 10. Figure 11. ESDI Application Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8921 DS8921A DS8921AT Submit Documentation Feedback 7 DS8921, DS8921A, DS8921AT SNLS374C – MAY 1998 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision B (April 2013) to Revision C • 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS8921 DS8921A DS8921AT PACKAGE OPTION ADDENDUM www.ti.com 18-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) DS8921AM ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 DS89 21AM DS8921AM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS89 21AM DS8921AMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 DS89 21AM DS8921AMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS89 21AM DS8921ATM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 DS892 1ATM DS8921ATM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS892 1ATM DS8921M ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 DS892 1M DS8921M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS892 1M DS8921MX ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 DS892 1M DS8921MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS892 1M DS8921N ACTIVE PDIP P 8 40 TBD Call TI Call TI 0 to 70 DS8921N DS8921N/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM 0 to 70 DS8921N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Apr-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS8921AMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS8921AMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS8921MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS8921MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS8921AMX SOIC D 8 2500 349.0 337.0 45.0 DS8921AMX/NOPB SOIC D 8 2500 349.0 337.0 45.0 DS8921MX SOIC D 8 2500 349.0 337.0 45.0 DS8921MX/NOPB SOIC D 8 2500 349.0 337.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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