AVAGO HSMN-A401-P4QM2 Smt led surface mount led indicator Datasheet

HSMx-A4xx-xxxxx
SMT LED Surface Mount LED Indicator
Data Sheet
Description
Avago Power PLCC-4 is an extension of our PLCC-2
SMT LEDs. The package can be driven at higher
current due to its superior package design. The
product is able to dissipate heat more efficiently
compared to the conventional PLCC-2 SMT LEDs. In
proportion to the increase in driving current, this
family of LEDs is able to produce higher light output
compared to the conventional PLCC-2 SMT LEDs.
Features
• Industry standard PLCC-4
These SMT LEDs have higher reliability and better
performance and are designed to work under a wide
range of environmental conditions. This higher
reliability makes them suitable for use under harsh
environment and conditions like automotive. In
addition, they are also suitable to be used in electronic
signs and signals.
• Available in full selection of colors
To facilitate easy pick and place assembly, the LEDs
are packed in EIA-compliant tape and reel. Every reel
will be shipped in single intensity and color bin (except
for red color), to provide close uniformity.
These LEDs are compatible with IR solder reflow
process. Due to the high reliability feature of these
products, they also can be mounted using through-thewave soldering process.
There are a variety of colors and various viewing
angles (30°, 60° and 120°) available in these SMT
LEDs. Ideally, the 30° parts are suitable for light piping
where focused intensities are required. As for the 60°
and 120°, they are most suitable for automotive interior
and exterior lighting and electronic signs applications.
• High reliability LED package
• High brightness using AlInGaP and InGaN dice
technologies
• High optical efficiency
• Higher ambient temperature at the same current possible
compared to PLCC-2
• Super wide viewing angle at 120˚
• Available in 8mm carrier tape on 7-inch reel
• Compatible with both IR and TTW soldering process
JEDEC MSL 2a
Applications
• Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Cabin backlighting
– Navigation and audio system
– Dome lighting
– Push button backlighting
• Exterior automotive
– Turn signals
– CHMSL
– Rear combination lamp
– Puddle light
• Electronic signs and signals
– Interior full color sign
– Variable message sign
• Office automation, home appliances, industrial equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
CAUTION: HSMN-, HSMK-, HSMM-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
2.8 ± 0.2
1.9 ± 0.2
2.2 ± 0.2
0.8 ± 0.1
0.1 TYP.
A
C
3.2 ± 0.2
3.5 ± 0.2
0.8 ± 0.3
C
C
0.5 ± 0.1
0.7 ± 0.1
CATHODE MARKING
NOTES:
ALL DIMENSIONS IN mm.
ELECTRICAL CONNECTION BETWEEN ALL CATHODES IS RECOMMENDED.
Device Selection Guide
Color
Red
Red Orange
Orange
Amber
Emerald Green
Green
Cyan
Blue
Part Number
HSMC-A400-S30M1
HSMC-A401-T40M1
HSMC-A401-T80M1
HSMZ-A400-U80M1
HSMJ-A401-T40M1
HSMJ-A401-U40M1
HSMV-A400-U80M1
HSML-A401-U40M1
HSMA-A400-T35M1
HSMA-A401-U45M1
HSMU-A400-U85M1
HSME-A401-P4PM1
HSMM-A401-R7YM2
HSMM-A401-S4YM2
HSMM-A401-S7YM2
HSMM-A400-T8YM2
HSMK-A401-R40M2
HSMK-A400-T80M2
HSMN-A401-P4QM2
Min. IV (mcd)
180.00
285.00
355.00
560.00
285.00
450.00
560.00
450.00
285.00
450.00
560.00
45.00
140.00
180.00
224.00
355.00
112.50
355.00
45.00
Max. IV (mcd)
355.00
715.00
900.00
1400.00
715.00
1125.00
1400.00
1125.00
560.00
1125.00
1400.00
112.50
285.00
450.00
450.00
900.00
285.00
900.00
112.50
Test Current (mA)
50
50
50
50
50
50
50
50
50
50
50
50
30
30
30
30
30
30
30
Dice Technology
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
InGaN
InGaN
InGaN
InGaN
InGaN
InGaN
InGaN
HSMN-A401-P7QM2
HSMN-A400-Q8QM2
56.00
90.00
112.50
224.00
30
30
InGaN
InGaN
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. IV tolerance = ±12 %.
2
Part Numbering System
HSM x1 – A x2 x3x4 – x5x6 x7 x8x9
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (TA = 25°C)
Parameters
HSMC/J/L/A/E
HSMZ/V/U
HSMM/K/N
DC Forward Current[1]
70 mA[3,4]
70 mA[3,4]
30 mA
Peak Forward Current [2]
200 mA
200 mA
90 mA
Power Dissipation
180 mW
240 mW
114 mW
Reverse Voltage
5V
Junction Temperature
110°C
Operating Temperature
–40°C to +100°C
Storage Temperature
–40°C to +100°C
Notes:
1. Derate linearly as shown in figure 5.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 70 mA is recommended for best long-term performance.
4. Operation at currents below 5 mA is not recommended.
3
Optical Characteristics (TA = 25°C)
Color
Red
Red Orange
Orange
Amber
Yellow Green
Emerald Green
Green
Cyan
Blue
Part
Number
HSMC
Peak
Wavelength
λPEAK (nm)
Typ.
635
Dominant
Wavelength
λD[1] (nm)
Typ.
626
Viewing Angle
2θ1/2[2] (Degrees)
Typ.
120
Luminous
Efficacy ηv[3]
(lm/W)
Typ.
150
Luminous Intensity/
Total Flux
Iv (mcd)/Φv (mlm)
Typ.
0.45
HSMZ
HSMJ
HSMV
HSML
HSMA
HSMU
HSME
HSME
HSMM
HSMK
HSMN
639
621
623
609
592
594
576
568
518
502
468
630
615
617
605
590
592
575
567
525
505
470
120
120
120
120
120
120
120
120
120
120
120
155
240
263
320
480
500
560
610
500
300
75
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
Notes:
1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is
the luminous efficacy in lumens/watt.
Electrical Characteristics (TA = 25°C)
Part Number
Forward Voltage
VF (Volts) @ IF = 50 mA
Typ.
Max.
Reverse Voltage
VR @ 100 µA
Min.
HSMC/J/L/A/E
2.2
2.5
5
HSMZ/V/U
2.8
3.4
Part Number
Forward Voltage
VF (Volts) @ IF = 30 mA
Typ.
Max.
Reverse Voltage
VR @ 10 µA
Min.
HSMM/K/N
3.8
5
5
4.6
1.0
RELATIVE INTENSITY
0.9
BLUE
EMERALD GREEN
CYAN
YELLOW GREEN
0.8
0.7
GREEN
AMBER
0.6
0.5
ORANGE
0.4
RED ORANGE
0.3
RED
0.2
0.1
0
380
430
480
530
580
630
WAVELENGTH – nm
Figure 1. Relative Intensity Vs. Wavelength.
4
680
730
780
70
1.2
60
HSMC/J/L/A/E
HSMZ/V/U
50
40
30
20
10
1.2
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 30 mA)
1.4
RELATIVE INTENSITY
(NORMALIZED AT 50 mA)
FORWARD CURRENT – mA
80
1.0
0.8
0.6
0.4
0.2
HSMM/K/N
0
0
1
2
3
4
5
80
70
50
300°C/W
40
470°C/W
30
20
10
0
0
20
40
60
80
20
30
40
50
100
120
300°C/W
350°C/W
20
470°C/W
15
10
5
0
0
20
60
40
80
RELATIVE INTENSITY
0.7
0.6
0.5
0.4
0.3
0.2
-10
100
120
Figure 5b. Maximum Forward Current Vs.
Ambient Temperature, Derated Based On
TJmax = 110°C (InGaN).
0.1
10
ANGLE – DEGREES
5
0
5
0
30
10
15
20
30
25
35
Figure 4. Relative Intensity Vs. Forward
Current (InGaN).
25
0.9
Figure 7. Radiation Pattern.
0.2
80
30
0.8
-30
0.4
540
1.0
-50
0.6
FORWARD CURRENT – mA
AMBIENT TEMPERATURE – °C
Figure 5a. Maximum Forward Current Vs.
Ambient Temperature, Derated Based On
TJmax = 110°C (AlInGaP).
-70
70
35
AMBIENT TEMPERATURE – °C
0
-90
60
Figure 3. Relative Intensity Vs. Forward
Current (AlInGaP).
MAXIMUM FORWARD CURRENT – mA
MAXIMUM FORWARD CURRENT – mA
Figure 2. Forward Current Vs. Forward Voltage.
350°C/W
10
0.8
FORWARD CURRENT – mA
FORWARD VOLTAGE – V
60
0
DOMINANT WAVELENGTH – nm
0
1.0
50
70
90
530
InGaN GREEN
520
510
500
InGaN CYAN
490
480
InGaN BLUE
470
460
0
5
10
15
20
25
30
35
CURRENT – mA
Figure 6. Dominant Wavelength Vs. Forward
Current – InGaN Devices.
X
X
2.60
(0.103)
0.40 (0.016)
1.10
(0.043)
Y
0.50
(0.020)
4.50 (0.178)
1.50 (0.059)
Y
DIMENSIONS IN mm (INCHES).
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
SOLDER RESIST
Figure 8a. Recommended Soldering Pad Pattern.
X
X
0.5 (0.020)
6.1 (0.240)
2.8 (0.110)
Y
2.0 (0.079)
6.0 (0.236)
1.0 (0.039)
2.0 (0.079)
3.0 (0.118)
Y
DIMENSIONS IN mm (INCHES).
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
Thermal Resistance
300°C/W
350°C/W
470°C/W
Solder Pad Area (xy)
>16 mm2
>12 mm2
>8 mm2
10 to 20 SEC.
Figure 8b. Recommended Soldering Pad Pattern (TTW).
TEMPERATURE
217 °C
TEMPERATURE
20 SEC. MAX.
240°C MAX.
3°C/SEC. MAX.
100-150°C
183°C
255 °C
3 °C/SEC. MAX.
125 °C ± 25 °C
MAX. 120 SEC.
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
TIME
Figure 9a. Recommended SnPb Reflow Soldering Profile.
TEMPERATURE – °C
BOTTOM SIDE
OF PC BOARD
200
TOP SIDE OF
PC BOARD
150
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
FLUXING
100
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
PREHEAT
20
30
40
50
60
70
80
TIME – SECONDS
Figure 10. Recommended Wave Soldering Profile.
6
Figure 9b. Recommended Pb-free Reflow Soldering Profile.
Note: For detailed information on reflow soldering of Avago surface
mount LEDs, refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
10
60 to 150 SEC.
TIME
120 SEC. MAX. 60-150 SEC.
0
6 °C/SEC. MAX.
–6°C/SEC.
MAX.
3°C/SEC.
MAX.
50
30
+5 °C
-0 °C
90
100
TRAILER
COMPONENT
LEADER
480 mm MIN. FOR ∅180 REEL.
960 mm MIN. FOR ∅330 REEL.
200 mm MIN. FOR ∅180 REEL.
200 mm MIN. FOR ∅330 REEL.
C
A
USER FEED DIRECTION
Figure 11. Tape Leader and Trailer Dimensions.
+0.1
∅1.5 –0
4 ± 0.1
2 ± 0.05
3.6 ± 0.1
B
1.75 ± 0.1
C
C
C
A
5.5 ± 0.05
A
A
3.8 ± 0.1
+0.3
12–0.1
∅1
+0.1
–0
B
8 ± 0.1
0.229 ± 0.01
3.45 ± 0.1
VIEW B-B
VIEW A-A
ALL DIMENSIONS IN mm.
Figure 12. Tape Dimensions.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 13. Reeling Orientation.
7
Intensity Bin Select (X5X6)
Individual reel will contain parts from
one half bin only.
Color Bin Select (X7)
Individual reel will contain parts from
one full bin only.
X5
X7
Min. Iv Bin
X6
0
Full Distribution
Z
A and B only
0
Full Distribution
Y
B and C only
3
3 half bins starting from X51
W
C and D only
4
4 half bins starting from X51
V
D and E only
5
5 half bins starting from X51
U
E and F only
7
3 half bins starting from X52
T
F and G only
8
4 half bins starting from X52
S
G and H only
9
5 half bins starting from X52
Q
A, B and C only
P
B, C and D only
N
C, D and E only
M
D, E and F only
L
E, F and G only
K
F, G and H only
1
A, B, C and D only
2
E, F, G and H only
3
B, C, D and E only
4
C, D, E and F only
5
A, B, C, D and E only
6
B, C, D, E and F only
Intensity Bin Limits
Bin ID
Min. (mcd)
Max. (mcd)
N1
28.50
35.50
N2
35.50
45.00
P1
45.00
56.00
P2
56.00
71.50
Q1
71.50
90.00
Q2
90.00
112.50
R1
112.50
140.00
R2
140.00
180.00
S1
180.00
224.00
S2
224.00
285.00
T1
285.00
355.00
T2
355.00
450.00
U1
450.00
560.00
U2
560.00
715.00
V1
715.00
900.00
V2
900.00
1125.00
W1
1125.00
1400.00
W2
1400.00
1800.00
Tolerance of each bin limit = ± 12%
8
Color Bin Limits
Blue
Min. (nm)
A
460.0
B
465.0
C
470.0
D
475.0
Max. (nm)
465.0
470.0
475.0
480.0
Cyan
A
B
C
D
Min. (nm)
490.0
495.0
500.0
505.0
Max. (nm)
495.0
500.0
505.0
510.0
Green
A
B
C
D
Min. (nm)
515.0
520.0
525.0
530.0
Max. (nm)
520.0
525.0
530.0
535.0
Color Bin Limits
Emerald
Green
Min. (nm)
A
552.5
B
555.5
C
558.5
D
561.5
Max. (nm)
555.5
558.5
561.5
564.5
Yellow
Green
E
F
G
H
Min. (nm)
564.5
567.5
570.5
573.5
Max. (nm)
567.5
570.5
573.5
576.5
Amber/
Yellow
A
B
C
D
E
F
Min. (nm)
582.0
584.5
587.0
589.5
592.0
594.5
Max. (nm)
584.5
587.0
589.5
592.0
594.5
597.0
Orange
A
B
C
D
E
Min. (nm)
597.0
600.0
603.0
606.0
609.0
Max. (nm)
600.0
603.0
606.0
609.0
612.0
Red
Orange
A
B
Min. (nm)
611.0
616.0
Max. (nm)
616.0
620.0
Red
Min. (nm)
Full Distribution
Max. (nm)
Tolerance of each bin limit = ± 1 nm
Packaging Option (X8X9)
Test
Package
Option Current Type
M1
50 mA Top Mount
M2
30 mA Top Mount
Reel
Size
7 inch
7 inch
Forward Voltage Bin Table
For HSMZ/V/U – A4xx-xxxxx only
BIN
VA
VB
VC
VD
VE
MIN.
1.9
2.2
2.5
2.8
3.1
MAX.
2.2
2.5
2.8
3.1
3.4
Tolerance of each bin limit = ± 0.05
This product is qualified as Moisture Sensitive Level 2a per JEDEC JSTD-020. Precaution when handling this moisture sensitive product is
important to ensure the reliability of the product. Refer to Avago
Application Note AN 5305 Handling of Moisture Sensitive Surface
Mount Devices for details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at <40°C/90% RH
for 12 months. If the actual shelf life has exceeded 12 months and the
HIC indicates that baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.
– It is not recommended to open the MBB prior to assembly
(e.g., for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read immediately upon
opening of MBB.
– The LEDs must be kept at <30°C/60% RH at all times and all high
temperature related processes, including soldering, curing or rework,
need to be completed within 672 hours.
C. Control of unfinished reel
– Unused LEDs need to be stored in sealed MBB with desiccant or in
desiccator at <5% RH.
D. Control of assembled boards
– If the PCB soldered with the LEDs is to be subjected to other high
temperature processes, the PCB needs to be stored in sealed MBB
with desiccant or in desiccator at <5% RH to ensure no LEDs have
exceeded their floor life of 672 hours.
E. Baking is required if:
– “10%” or “15%” HIC indicator turns pink.
– The LEDs are exposed to conditions of >30°C/60% RH at any time.
– The LEDs' floor life exceeds 672 hours.
Recommended baking conditions: 60±5°C for 20 hours.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0312EN
AV02-0479EN June 20, 2007